Display device

Abstract

The present invention relates to a display device, comprising: a display panel, including a display area and a non-display area defined therein, and including a plurality of signal pads overlapping the non-display area; an electronic component, including a base layer having an upper surface and a lower surface, a plurality of driving pads arranged on the lower surface of the base layer, and a plurality of driving bumps respectively arranged on the plurality of driving pads, the plurality of driving bumps being respectively connected to the plurality of signal pads; and a filler, arranged between the display panel and the electronic component. A first hole is defined in the upper surface of the base layer, and the first hole does not overlap with the plurality of driving bumps in a plan view.

Description

[0001] This application claims the priority of Korean Patent Application No. 10-2019-0095930 filed in the Korean Intellectual Property Office on August 7, 2019 and all rights arising therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] Exemplary embodiments of the present invention relate to a display device and more particularly to a display device and a method of manufacturing the display device. Background Art

[0003] Various display devices applied to multimedia devices such as televisions, mobile phones, tablet computers, navigation units, and game units are being developed.

[0004] The display device includes a display panel that displays an image. The display panel includes gate lines, data lines, and pixels connected to the gate lines and data lines. The display panel is connected to an electronic component that provides an electrical signal required to display an image to the gate lines or the data lines.

[0005] The electronic components are mounted on the display panel using anisotropic conductive film or ultrasonic scanning method. Compared with anisotropic conductive film, the connection between the display panel and the electronic components using ultrasonic scanning method further improves the conductivity and reduces many processes. Summary of the invention

[0006] Exemplary embodiments of the present invention provide a display device that electrically connects an electronic component to a display panel using an ultrasonic bonding method.

[0007] Exemplary embodiments of the present invention provide a method of manufacturing the display device.

[0008] Exemplary embodiments of the present invention provide a display device that improves curing efficiency of a filler filled between the electronic component and the display panel.

[0009] An exemplary embodiment of the present invention provides a display device, the display device comprising: a display panel including a display area and a non-display area defined therein, and including a plurality of signal pads overlapping the non-display area; an electronic component including a base layer having an upper surface and a lower surface, a plurality of driving pads disposed on the lower surface of the base layer, and a plurality of driving bumps respectively disposed on the plurality of driving pads, the plurality of driving bumps being respectively connected to the plurality of signal pads; and a filler disposed between the display panel and the electronic component. A first hole is defined in the upper surface of the base layer, and the first hole does not overlap with the plurality of driving bumps in a plan view.

[0010] In an exemplary embodiment, the first hole passes through the upper surface and the lower surface, and the filler is exposed to the outside through the first hole.

[0011] In an exemplary embodiment, the filler includes a first filling portion disposed between the display panel and the electronic component and a second filling portion disposed in the first hole.

[0012] In an exemplary embodiment, an upper surface of the second filling portion provides a flat surface together with an upper surface of the electronic component.

[0013] In an exemplary embodiment, the first filling part has a height smaller than a height of the second filling part in a thickness direction of the base layer.

[0014] In an exemplary embodiment, the first hole has a shape recessed from the upper surface of the base layer.

[0015] In an exemplary embodiment, in a thickness direction of the base layer, the first hole has a height equal to or greater than about fifty percent (50%) of the thickness of the base layer and less than about 100% of the thickness of the base layer.

[0016] In an exemplary embodiment, the electronic component further includes: a pad insulation layer disposed on the base layer to expose a portion of each of the plurality of drive pads; and a plurality of drive lines respectively connected to the plurality of drive pads, and the filler is disposed between the pad insulation layer and the display panel, and the first hole does not overlap with the plurality of drive lines in the plan view.

[0017] In an exemplary embodiment, a second hole is further defined in the upper surface of the base layer, the second hole is spaced apart from the first hole in the plan view and is recessed from the upper surface of the base layer, and the second hole overlaps at least one of the plurality of driving lines.

[0018] In an exemplary embodiment, a plurality of the first holes are provided, and the plurality of the first holes are defined in the base layer to be spaced apart from each other in the plan view.

[0019] In an exemplary embodiment, the display panel also includes: a substrate; a circuit element layer disposed on the substrate; a plurality of first pads overlapping the non-display area, disposed on the substrate, and electrically connected to the circuit element layer; an insulating layer disposed on the substrate to expose a portion of each of the plurality of first pads; and a plurality of second pads, respectively disposed on the plurality of first pads exposed by the insulating layer, and the plurality of second pads are the plurality of signal pads.

[0020] In an exemplary embodiment, the electronic component further includes a plurality of driving lines electrically connected to the plurality of driving pads, respectively, and the first hole does not overlap the plurality of driving lines in the plan view.

[0021] In an exemplary embodiment, in the plan view, the filler surrounds the plurality of driving bumps.

[0022] An exemplary embodiment of the present invention provides a method for manufacturing a display device, the method comprising: providing a display panel including a signal pad overlapping a non-display area; providing an electronic component including a lower surface and an upper surface, a driving bump being arranged on the lower surface, and a hole being defined in the upper surface so as not to overlap with the driving bump in a plan view; aligning the signal pad of the display panel with the driving bump of the electronic component; causing the driving bump to contact the signal pad; applying ultrasonic vibration to the driving bump and the signal pad; disposing a filler between the display panel and the electronic component; and irradiating ultraviolet light to the filler through the hole.

[0023] In an exemplary embodiment, the hole has an opening shape passing through the upper surface and the lower surface of the electronic component.

[0024] In an exemplary embodiment, the filler includes a first filling portion and a second filling portion, the first filling portion is disposed between the display panel and the electronic component, and the second filling portion is disposed in the hole.

[0025] In an exemplary embodiment, the hole has a shape recessed from the upper surface of the electronic component, and has a height equal to or greater than about 50% and less than about 100% of the thickness of the electronic component.

[0026] In an exemplary embodiment, the method further includes irradiating a laser beam to a cutting area defined in the upper surface of the electronic component, and the cutting area corresponds to a shape of the hole.

[0027] In an exemplary embodiment, the signal pad provides an electrical signal to a display element arranged in a display area of ​​the display panel.

[0028] In an exemplary embodiment, the holes are provided in plurality, and are defined in the upper surface of the electronic component to be spaced apart from each other in the plan view.

[0029] According to the above embodiment, the external ultraviolet light is transmitted to the filler through the hole defined in the upper surface of the electronic component. Therefore, the curing efficiency of the filler can be improved. In particular, when a plurality of holes defined in the upper surface of the electronic component are provided, the curing efficiency of the filler can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other advantages of the present invention will become readily apparent by referring to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0031] Figure 1A is a perspective view showing an exemplary embodiment of a display device according to the present invention;

[0032] Figure 1B is an exploded perspective view showing an exemplary embodiment of a display device according to the present invention;

[0033] Figure 2 is a cross-sectional view showing an exemplary embodiment of a display module according to the present invention;

[0034] Figure 3 is a plan view showing an exemplary embodiment of a display panel according to the present invention;

[0035] Figure 4A It shows Figure 3 An equivalent circuit diagram of a pixel shown in FIG.

[0036] Figure 4B is an enlarged cross-sectional view showing an exemplary embodiment of a display panel according to the present invention;

[0037] Figure 5A It shows Figure 3 An enlarged view of the area AA shown in FIG.

[0038] Figure 5B It is along Figure 5A A cross-sectional view taken along line II' shown in FIG.

[0039] Figure 6 is an exploded perspective view showing an exemplary embodiment of a portion of a display device according to the present invention;

[0040] Figure 7 is a plan view showing an exemplary embodiment of an electronic component according to the present invention;

[0041] Fig. 8A It is along Figure 7 A cross-sectional view taken along line II-II' shown in FIG.

[0042] Figure 8B It is along Figure 7 A cross-sectional view taken along line III-III' shown in FIG.

[0043] 9A to 9E is a view showing an exemplary embodiment of a method for manufacturing a display device according to the present invention;

[0044] FIG. 10A to FIG. 10C is a view showing another exemplary embodiment of a method for manufacturing a display device according to the present invention; and

[0045] Fig.11 is a plan view showing another exemplary embodiment of an electronic component according to the present invention. DETAILED DESCRIPTION

[0046] It will be understood that when an element (or region, portion) or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, directly connected to or directly coupled to the other element or layer, or intervening elements or layers may be present.

[0047] The same reference numerals always represent the same elements. In the drawings, the thickness, proportion and size of components are exaggerated in order to effectively describe the technical contents.

[0048] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0049] It will be understood that, although the terms first, second, etc. can be used here to describe different elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or section from another element, component, region, layer or section. Therefore, without departing from the teaching of the present invention, the first element, component, region, layer or section discussed below can be named as the second element, component, region, layer or section. As used herein, unless the context clearly indicates otherwise, the singular "one", "a kind of" and "the (the)" are also intended to include plural forms.

[0050] For ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "on" may be used herein to describe the relationship of one element or feature to other (multiple) elements or (multiple) features as shown in the drawings.

[0051] It will also be understood that when the terms “comprises” and / or “includes” are used in this specification, these terms indicate the presence of listed features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0052] As used herein, "about" or "approximately" includes the recited values ​​and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the recited value.

[0053] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. It will be further understood that, unless so explicitly defined herein, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present invention, and will not be interpreted as an ideal or overly formal meaning.

[0054] Exemplary embodiments are described herein with reference to cross-sectional views as schematic diagrams of ideal embodiments. Thus, it is expected that the shapes of these figures will vary due to, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the regions shown herein, but rather should include shape deviations, for example, caused by manufacturing. In exemplary embodiments, regions shown or described as flat may typically have rough and / or nonlinear features. In addition, the sharp angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0055] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0056] Figure 1A is a perspective view showing an exemplary embodiment of a display device DD according to the present invention.

[0057] Figure 1B is an exploded perspective view showing an exemplary embodiment of a display device DD according to the present invention.

[0058] Figure 2 is a cross-sectional view showing an exemplary embodiment of a display module DM according to the present invention.

[0059] In an exemplary embodiment, the display device DD can be applied to a mobile phone terminal. Although not shown in the drawings, the electronic module, the camera module, and the power module arranged (e.g., mounted) on the mainboard can be accommodated in a bracket and a housing together with the display device DD, and thus, a mobile phone terminal can be provided. The display device DD in an exemplary embodiment according to the present invention can be applied to large electronic products such as televisions and monitors, and small and medium-sized electronic products such as tablet computers, car navigation units, game units, and smart watches.

[0060] Reference Figure 1A , the display device DD displays the image IM through the display surface DD-IS. Figure 1A An exemplary embodiment of an icon image as an image IM is shown. The display surface DD-IS is substantially parallel to a plane defined by the first direction DR1 and the second direction DR2. The third direction DR3 indicates the normal direction of the display surface DD-IS, that is, the thickness direction of the display device DD. In the following description, the expression "when viewed in a plan view" or "in a plan view" may refer to the case of viewing in the third direction DR3. Hereinafter, the front (or upper) surface and the rear (or lower) surface of each layer or each unit of the display device DD are distinguished from each other by the third direction DR3. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative to each other, and therefore, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be changed to other directions, for example, opposite directions.

[0061] In addition, the display surface DD-IS includes a display area DD-DA through which the image IM is displayed and a non-display area DD-NDA disposed adjacent to the display area DD-DA. The image IM is not displayed through the non-display area DD-NDA, however, it should not be limited to or restricted thereto. The non-display area DD-NDA may be adjacent to one side of the display area DD-DA, or the non-display area DD-NDA may be omitted.

[0062] Reference Figure 1B , the display device DD may include a window WM, a display module DM, an electronic component DC, and a receiving member BC. The receiving member BC may receive the display module DM and may be coupled to the window WM.

[0063] The window WM may be disposed on the display module DM and may transmit an image provided from the display module DM. The window WM may include a transmission area TA and a non-transmission area NTA. The transmission area TA may overlap with the display area DD-DA and may have a shape corresponding to the display area DD-DA. The image IM displayed by the display area DD-DA of the display device DD may be perceived from the outside through the transmission area TA of the window WM.

[0064] The non-transmission area NTA may overlap the non-display area DD-NDA and may have a shape corresponding to the non-display area DD-NDA. The non-transmission area NTA may have a relatively low transmittance compared to the transmittance of the transmission area TA. However, the present invention should not be limited to or by this, and the non-transmission area NTA may be omitted.

[0065] In an exemplary embodiment, the window WM may include, for example, glass, sapphire, or a plastic material. The window WM is shown as having a single-layer structure, however, the window WM may include a plurality of layers. The window WM may include a base layer and at least one printed layer overlapping the non-transmission area NTA and disposed on the rear surface of the base layer. The printed layer may have a predetermined color. As an example, the printed layer may have black, or may have other colors other than black.

[0066] The display module DM is disposed between the window WM and the receiving member BC. The display module DM includes a display panel DP and an input sensing unit ISU. The display panel DP generates an image and provides the generated image to the window WM.

[0067] The display panel DP in the exemplary embodiment of the present invention may be a light-emitting display panel, however, it should not be particularly limited. In the exemplary embodiment, the display panel DP may be, for example, an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots and quantum rods.

[0068] Hereinafter, an organic light emitting display panel will be described as an exemplary embodiment of the display panel DP However, the present invention should not be limited to the organic light emitting display panel, and various display panels may be applied to the present invention.

[0069] Reference Figure 2 The display module DM includes a display panel DP and an input sensing unit ISU. The display panel DP includes a substrate SUB, a circuit element layer CL disposed on the substrate SUB, a display element layer DEL, and an insulating layer TFL.

[0070] The display panel DP includes a display area DP-DA and a non-display area DP-NDA. The display area DP-DA of the display panel DP corresponds to Figure 1A The display area DD-DA shown in FIG. 1 and the non-display area DP-NDA of the display panel DP correspond to Figure 1A The non-display area DD-NDA is shown in FIG.

[0071] The substrate SUB may include at least one plastic film. As an example, the substrate SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate as a flexible substrate.

[0072] The circuit element layer CL includes at least one insulating intermediate layer and circuit elements. The insulating intermediate layer includes at least one intermediate inorganic layer and at least one intermediate organic layer. The circuit elements include signal lines and pixel driving circuits.

[0073] The display element layer DEL includes a plurality of organic light emitting diodes. The display element layer DEL also includes an organic layer such as a pixel defining layer. In another exemplary embodiment, when a liquid crystal display panel is provided as the display panel, the display element layer may be a liquid crystal layer.

[0074] The insulating layer TFL encapsulates the display element layer DEL. As an example, the insulating layer TFL may be a thin film encapsulation layer. The insulating layer TFL protects the display element layer DEL from moisture, oxygen, and foreign substances such as dust particles, however, it should not be limited thereto or thereby. An encapsulation substrate may be used instead of the insulating layer TFL. In this case, the encapsulation substrate may face the substrate SUB, and the circuit element layer CL and the display element layer DEL may be disposed between the encapsulation substrate and the base substrate.

[0075] The input sensing unit ISU may be disposed between the window WM and the display panel DP. The input sensing unit ISU may sense an input applied from the outside. The input applied from the outside may be provided in various forms. In an exemplary embodiment, for example, the external input may include various forms, such as a part of the user's body, a stylus, light, heat, or pressure. In addition, in addition to input by contacting a part of the user's body (such as the user's hand), a proximity or near-space touch (e.g., hovering) may be a form of external input.

[0076] The input sensing unit ISU may be directly disposed on the display panel DP. In the present invention, the statement “component ‘A’ is directly disposed on component ‘B’” means that there is no intermediate element such as an adhesive layer between component ‘A’ and component ‘B’. The input sensing unit ISU may be provided together with the display panel DP through a continuous process. However, the present invention should not be limited to or thereby. The input sensing unit ISU may be bonded to the display panel DP through an adhesive layer after being provided as a separate panel. As another example, the input sensing unit ISU may be omitted.

[0077] Return to reference Figure 1B, the electronic component DC may overlap the non-display area DP-NDA and may be disposed on the display panel DP. According to the present invention, the electronic component DC may be, but is not limited to, a driving chip that transmits a driving signal to the display panel DP. In an exemplary embodiment, the electronic component DC may generate a driving signal required for the operation of the display panel DP based on, for example, a control signal provided from the outside. The electronic component DC may transmit the generated driving signal to the circuit element layer CL of the display panel DP.

[0078] In an exemplary embodiment of the present invention, the electronic component DC may be electrically connected to the display panel DP by an ultrasonic bonding method. In an exemplary embodiment, for example, a driving bump disposed on the electronic component DC and a signal pad disposed on the display panel DP may contact each other by an ultrasonic bonding method. After the driving bump contacts the signal pad, a filler may be filled between the electronic component DC and the display panel DP. The filler may be cured by being irradiated with external ultraviolet light.

[0079] In an exemplary embodiment of the present invention, at least one hole may be defined in the upper surface of the electronic component DC. External ultraviolet light may be irradiated to the filler through the hole defined in the electronic component. The hole defined in the electronic component DC will be described in detail later.

[0080] Figure 3 is a plan view showing an exemplary embodiment of a display panel according to the present invention. Figure 4A It shows Figure 3 An equivalent circuit diagram of a pixel is shown in FIG. Figure 4B is an enlarged cross-sectional view showing an exemplary embodiment of a display panel according to the present invention.

[0081] Reference Figure 3 , the display panel DP may include a driving circuit GDC, a plurality of signal lines SGL, a plurality of signal pads DP-PD, a plurality of first connection pads DPS-PD, and a plurality of pixels PX. The pixels PX are arranged in the display area DP-DA. Each pixel PX includes an organic light emitting diode and a pixel driving circuit. The driving circuit GDC, the signal lines SGL, the signal pads DP-PD, the first connection pads DPS-PD, and the pixel driving circuit may be included in Figure 2 The circuit element layer CL is shown in FIG.

[0082] The driving circuit GDC may include a scan driving circuit. The scan driving circuit generates a plurality of scan signals and sequentially outputs the scan signals to the scan lines GL described later. The scan driving circuit also outputs another control signal to the pixel driving circuit of the pixel PX.

[0083] In an exemplary embodiment, the scan driving circuit may include a plurality of thin film transistors provided by the same process (eg, a low temperature polysilicon (“LTPS”) process or a low temperature polycrystalline oxide (“LTPO”) process) as the pixel driving circuit of the pixel PX.

[0084] The signal lines SGL include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. Each scan line GL is connected to a corresponding pixel PX among the pixels PX, and each data line DL is connected to a corresponding pixel PX among the pixels PX. The power lines PL are connected to the pixels PX. The control signal lines CSL provide control signals to the scan drive circuit.

[0085] The signal line SGL overlaps the display area DP-DA and the non-display area DP-NDA. Each signal line SGL includes a pad portion and a line portion. The line portion overlaps the display area DP-DA and the non-display area DP-NDA. The pad portion is connected to the end of the line portion. The pad portion is arranged in the non-display area DP-NDA and overlaps with a corresponding signal pad DP-PD among the signal pads DP-PD.

[0086] Hereinafter, the area in which the signal pad DP-PD in the non-display area DP-NDA is arranged may be referred to as a "chip area NDA-DC", and the area in which the first connection pad DPS-PD in the non-display area DP-NDA is arranged may be referred to as a "first pad area NDA-PC".

[0087] In an exemplary embodiment, Figure 1B The electronic component DC shown in FIG. 1 may be disposed (eg, mounted) on the chip area NDA-DC. The signal pads DP-PD may be electrically connected to the electronic component DC to transmit an electrical signal provided from the electronic component DC to the signal line SGL.

[0088] In detail, the signal pads DP-PD include first signal pads DP-PD1 arranged in a first row along the first direction DR1 and second signal pads DP-PD2 arranged in a second row along the first direction DR1, however, they should not be limited thereto or thereby. That is, the signal pads DP-PD may be arranged in a row along the first direction DR1.

[0089] A portion of the circuit board PCB may be disposed in the first pad area NDA-PC. The first connection pad DPS-PD is electrically connected to the circuit board PCB and transmits an electrical signal from the circuit board PCB to the signal pad DP-PD. The circuit board PCB may be rigid or flexible. In an exemplary embodiment, for example, when the circuit board PCB is flexible, a flexible printed circuit board may be provided as the circuit board PCB.

[0090] The circuit board PCB may include a timing control circuit for controlling the operation of the display panel DP. The timing control circuit may be provided (e.g., mounted) on the circuit board PCB in the form of an integrated chip. In addition, although not shown in the drawings, the circuit board PCB may include an input sensing circuit for controlling the input sensing unit ISU.

[0091] The circuit board PCB may include a second connection pad DPS-PDz electrically connected to the display panel DP. The second connection pad DPS-PDz may be arranged in a second pad area defined in the circuit board PCB. The second connection pad DPS-PDz is electrically bonded to the first connection pad DPS-PD. As an example, the first connection pad DPS-PD and the second connection pad DPS-PDz may be electrically connected to each other using an anisotropic conductive film, or may be in direct contact with each other using an ultrasonic bonding method.

[0092] Figure 4A FIG. 1 shows a pixel PX connected to one scan line GL, one data line DL, and a power line PL as an exemplary embodiment. However, the present invention should not be limited to Figure 4A The circuit configuration of the pixel PX may be changed in various ways.

[0093] The pixel PX includes an organic light emitting diode LD and a pixel driving circuit PXC. The organic light emitting diode LD is included in Figure 2 In the display element layer DEL shown in FIG. 1 , the organic light emitting diode LD may be a front surface light emitting diode or a rear surface light emitting diode.

[0094] The pixel driving circuit PXC is a circuit for driving the organic light emitting diode LD, and includes a first transistor T1 (or referred to as a "switching transistor"), a second transistor T2 (or referred to as a "driving transistor"), and a capacitor Cap. The pixel driving circuit PXC is included in Figure 2 In the circuit element layer CL shown in FIG. In the illustrated exemplary embodiment, the pixel driving circuit PXC includes two transistors, however, the structure of the pixel driving circuit PXC may be changed in various ways according to the embodiment.

[0095] The organic light emitting diode LD generates light in response to an electrical signal applied thereto from the first transistor T1 and the second transistor T2 .

[0096] The first transistor T1 outputs a data signal applied to the data line DL in response to a scan signal applied to the scan line GL. The capacitor Cap is charged with a voltage corresponding to the data signal supplied from the first transistor T1. The first power supply voltage ELVDD is applied to the first electrode AE ​​through the second transistor T2 (see Figure 4B), and the second power voltage ELVSS is applied to the second electrode CE (see Figure 4B ). The second power voltage ELVSS may be lower than the first power voltage ELVDD.

[0097] The second transistor T2 is electrically connected to the organic light emitting diode LD through the first electrode AE. The second transistor T2 controls the driving current ID flowing through the organic light emitting diode LD according to the amount of charges charged in the capacitor Cap. The organic light emitting diode LD emits light during the on period of the second transistor T2.

[0098] Figure 4B shows the display panel DP and Figure 4A 1 and 2. The circuit element layer CL, the display element layer DEL and the insulating layer TFL are sequentially disposed on the substrate SUB.

[0099] The circuit element layer CL includes at least one insulating layer and circuit elements. The circuit elements include signal lines, pixel driving circuits, and pads. The circuit element layer CL can be provided by a coating and deposition process for forming an insulating layer, a semiconductor layer, and a conductive layer, and a photolithography process for patterning the insulating layer, the semiconductor layer, and the conductive layer.

[0100] The circuit element layer CL includes a buffer layer BFL, a first intermediate inorganic layer 10, and a second intermediate inorganic layer 20, each of which is an inorganic layer, and includes a third insulating layer 30 as an organic layer. The buffer layer BFL includes a plurality of inorganic layers stacked on each other. As an exemplary example, Figure 4B The arrangement relationship between the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, the first control electrode GE1, the second control electrode GE2, the first input electrode DE1, the first output electrode SE1, the second input electrode DE2, and the second output electrode SE2 forming the switching transistor T1 and the driving transistor T2 is shown. The first through hole CH1, the second through hole CH2, the third through hole CH3, and the fourth through hole CH4 are also shown by way of example.

[0101] The display element layer DEL includes an organic light emitting diode LD and a pixel defining layer PDL. The organic light emitting diode LD includes a first electrode AE, a hole control layer HCL, a light emitting layer EML, an electron control layer TCL, and a second electrode CE. The pixel defining layer PDL is an organic layer and is provided with a light emitting opening OM defined therethrough. At least a portion of the first electrode AE ​​is exposed through the light emitting opening OM of the pixel defining layer PDL.

[0102] In detail, the first electrode AE ​​is disposed on the third insulating layer 30. The first electrode AE ​​is connected to the second output electrode SE2 through a fifth through hole CH5 defined through the third insulating layer 30.

[0103] The display area DP-DA of the display panel DP includes a pixel area PXA and a light blocking area NPXA defined adjacent to the pixel area PXA. The pixel area PXA indicates an area where an image is actually output to the outside. As an example, the light blocking area NPXA surrounds the pixel area PXA.

[0104] The hole control layer HCL may be commonly disposed on the pixel area PXA and the light blocking area NPXA. The hole control layer HCL may include a hole transport layer and may further include a hole injection layer. The light emitting layer EML may be disposed on the hole control layer HCL. The light emitting layer EML may be disposed in a region corresponding to the light emitting opening OM. That is, the light emitting layer EML may be disposed in each pixel PX after being divided into a plurality of parts. The light emitting layer EML may include an organic material and / or an inorganic material. The light emitting layer EML may generate light of a predetermined color.

[0105] The electron control layer TCL may be disposed on the light emitting layer EML. The electron control layer TCL may include an electron transport layer and may further include an electron injection layer. The hole control layer HCL and the electron control layer TCL may be commonly disposed in a plurality of pixels PX using an open mask. The second electrode CE may be disposed on the electron control layer TCL. The second electrode CE may have an integral shape and may be commonly disposed on the electron control layer TCL included in each pixel PX.

[0106] According to the present invention, the light emitting layer EML may be defined by the light emitting opening OM, and light generated from the light emitting layer EML is transmitted to the pixel area PXA.

[0107] The insulating layer TFL may be disposed on the second electrode CE. The insulating layer TFL may be provided by a single encapsulation layer or by a plurality of thin films.

[0108] Figure 5A It shows Figure 3 An enlarged view of area AA is shown in FIG. Figure 5B It is along Figure 5A A cross-sectional view taken along line II' shown in FIG.

[0109] Figure 5A Shows Figure 3 The line portion DL-L and the pad portion DL-P of each of the two data lines DL in the data lines DL shown in FIG. Figure 3 Each signal line SGL described in the embodiment includes a line portion DL-L and a pad portion DL-P, however, the line portion DL-L and the pad portion DL-P may be separate components. Figure 5AAs shown in , under the same length condition, the pad portion DL-P may have an area greater than that of the line portion DL-L. In addition, the pad portion DL-P has a quadrilateral shape, however, the shape of the pad portion DL-P may be changed in a manufacturing process.

[0110] Reference Figure 5B , the pad portion DL-P of the data line DL may be disposed on the second intermediate inorganic layer 20 (also referred to as the "second insulating layer") of the circuit element layer CL. The contact hole CNT may be defined through the third insulating layer 30 disposed on the second insulating layer 20 to expose the pad portion DL-P. The signal pad DP-PD contacts the pad portion DL-P through the contact hole CNT and is disposed on the third insulating layer 30.

[0111] According to the present invention, the signal pad DP-PD may be a pad that contacts one of the components included in the electronic component DC. That is, as described above, the signal pad DP-PD included in the display panel DP and the pad included in the electronic component DC may be bonded to each other by an ultrasonic bonding method. Therefore, the driving signal from the electronic component DC may be transmitted to the data line DL via the signal pad DP-PD.

[0112] Figure 6 is an exploded perspective view showing an exemplary embodiment of a portion of a display device according to the present invention. Figure 7 is a plan view showing an exemplary embodiment of an electronic component DC according to the present invention. Fig. 8A It is along Figure 7 A cross-sectional view taken along line II-II' is shown in FIG. Figure 8B It is along Figure 7 A cross-sectional view taken along line III-III' is shown in FIG.

[0113] Reference Figure 6 , the electronic component DC includes an upper surface DC-US and a lower surface DC-DS. In the illustrated exemplary embodiment, the lower surface DC-DS of the electronic component DC may be a surface facing the display panel DP.

[0114] Electronic components DC include and are provided in reference Figure 5B The driving bumps DC-BP are respectively and directly contacted by the signal pads DP-PD on the described substrate SUB. The driving bumps DC-BP include first driving bumps DC-BP1 arranged in a first row along a first direction DR1 and second driving bumps DC-BP2 arranged in a second row along the first direction DR1. The first driving bumps DC-BP1 and the second driving bumps DC-BP2 may be exposed to the outside in the lower surface of the electronic component DC.

[0115] In an exemplary embodiment of the present invention, the first driving bump DC-BP1 electrically contacts the first signal pad DP-PD1 by an ultrasonic bonding method. The second driving bump DC-BP2 electrically contacts the second signal pad DP-PD2 by an ultrasonic bonding method. Although not shown in the drawings, the electronic component DC may include a circuit element that applies an electrical signal to the first driving bump DC-BP1 and the second driving bump DC-BP2.

[0116] In an exemplary embodiment of the present invention, after the electronic component DC is disposed (e.g., mounted) on the display panel DP by an ultrasonic bonding method, a filler RS ​​may be filled between the electronic component DC and the display panel DP. The filler RS ​​may be disposed between the electronic component DC and the display panel DP to isolate the driving bump DC-BP and the signal pad DP-PD from the external air. Therefore, the driving bump DC-BP and the signal pad DP-PD may be prevented from being oxidized. As an example, the filler RS ​​may include a resin.

[0117] The filler material RS may surround outer surfaces of the driving bump DC-BP and the signal pad DP-PD bonded to each other by an ultrasonic bonding method and may be disposed between the electronic component DC and the display panel DP. In a plan view, the filler material RS may surround the driving bump DC-BP.

[0118] After the filler RS ​​is disposed between the electronic component DC and the display panel DP, an operation of irradiating external ultraviolet light to the filler RS ​​is desired to cure the filler RS. The external ultraviolet light may irradiate the filler RS ​​through the upper surface DC-US of the electronic component DC. As the thickness of the electronic component DC increases, the intensity of the external ultraviolet light transmitted to the filler RS ​​is weakened.

[0119] In an exemplary embodiment of the present invention, at least one hole HO that does not overlap with the driving bump DC-BP in a plan view may be defined through the upper surface DC-US of the electronic component DC. Since external ultraviolet light is transmitted to the filler RS ​​through the hole HO defined through the upper surface DC-US of the electronic component DC, the curing efficiency of the filler RS ​​may be improved. Specifically, when a plurality of holes HO defined through the upper surface DC-US of the electronic component DC are provided, the curing efficiency of the filler RS ​​may be improved.

[0120] Figure 7 A hole HO defined through the upper surface DC-US of the electronic component DC is shown. Specifically, the hole HO in the exemplary embodiment may have an opening shape defined through the upper surface DC-US and the lower surface DC-DS of the electronic component DC. Therefore, the filler RS ​​may be exposed to the outside through the hole HO.

[0121] In addition, the electronic component DC may include a driving pad portion DC-P, a driving line portion DC-L and a circuit element (not shown) having the above-mentioned driving bump DC-BP. In this case, the driving pad portion DC-P may overlap with the pad area PA of the electronic component DC. The hole HO may overlap with the non-pad area NPA of the electronic component DC. The driving line portion DC-L may electrically connect the driving pad portion DC-P to the circuit element. The driving pad portion DC-P, the driving line portion DC-L and the circuit element may all include a metal material having electrical properties. Therefore, when external ultraviolet light is transmitted to the driving pad portion DC-P, the driving line portion DC-L and the circuit element, the external ultraviolet light may be reflected.

[0122] In an exemplary embodiment of the present invention, the hole HO may not overlap the driving pad portion DC-P, the driving line portion DC-L, and the circuit element in a plan view. In particular, when the filler RS ​​is exposed to the outside through the hole HO, the external ultraviolet light incident through the hole HO may be directly transmitted to the filler RS. Therefore, the curing characteristics of the filler RS ​​may be improved.

[0123] In detail, refer to Fig. 8A The electronic component DC also includes a base layer DC-BS, a driving pad part DC-P (see Figure 7 ) and a pad insulating layer DC-IL. The driving pad portion DC-P includes a driving pad DC-PD and a driving bump DC-BP.

[0124] The upper surface of the base layer DC-BS may correspond to the upper surface DC-US of the electronic component DC. The lower surface of the pad insulating layer DC-IL facing the display panel DP may correspond to the lower surface DC-DS of the electronic component DC. As an example, the base layer DC-BS may include a silicon material. The base layer DC-BS may have a predetermined thickness in the third direction DR3.

[0125] The driving pad DC-PD may be disposed on the lower surface of the base layer DC-BS. The driving pad DC-PD may be electrically connected to a circuit element (not shown) of the electronic component DC. The pad insulating layer DC-IL is disposed on the lower surface of the base layer DC-BS to expose a portion of the driving pad DC-PD. In this case, a through hole exposing the portion of the driving pad DC-PD may be defined by the pad insulating layer DC-IL. The driving bump DC-BP may be disposed directly on the driving pad DC-PD.

[0126] In an exemplary embodiment of the present invention, the driving bump DC-BP can be bonded to the signal pad DP-PD by an ultrasonic bonding method. In detail, when ultrasonic vibration is applied to the interface between the driving bump DC-BP and the signal pad DP-PD, friction heat is generated at the interface. In addition, because pressure is applied to the driving bump DC-BP and the signal pad DP-PD from the upper surface of the base layer DC-BS, the driving bump DC-BP and the signal pad DP-PD can be bonded (or welded) at the interface due to friction heat.

[0127] The filler material RS may be disposed between the pad insulating layer DC-IL and the third insulating layer 30. In a plan view, the filler material RS may surround the driving bump DC-BP.

[0128] Reference Figure 8B , a reference can be defined through the upper surface DC-US of the electronic component DC and the upper surface of the base layer DC-BS Figure 7 The hole HO described above may be formed through the base layer DC-BS and the pad insulating layer DC-IL, and may have a thickness corresponding to the thickness of the electronic component DC. In addition, a plurality of holes HO may be provided, and the holes HO may be spaced apart from each other in a plan view. The hole HO may not overlap with the driving bump DC-BP, and may expose the filler RS ​​to the outside.

[0129] In an exemplary embodiment of the present invention, the filler RS ​​includes a first filling portion RSa and a second filling portion RSb. The first filling portion RSa may be disposed between the pad insulating layer DC-IL of the electronic component DC and the third insulating layer 30 of the display panel DP. The height of the first filling portion RSa in the third direction DR3 will be referred to as a "first length HT1". The second filling portion RSb may be disposed in the hole HO. The height of the second filling portion RSb corresponds to the height of the hole HO in the third direction DR3 and will be referred to as a "second length HT2", which is longer than the first length HT1.

[0130] Specifically, the upper surface of the second filling portion RSb exposed to the outside may provide a flat surface together with the upper surface of the base layer DC-BS. That is, the second filling portion RSb may completely fill the space of the hole HO.

[0131] In addition, according to Figure 8B , external ultraviolet light can be transmitted through the second filling portion RSb to the first filling portion RSa. Although the base layer DC-BS absorbs ultraviolet light, the filler RS ​​still easily transmits ultraviolet light, and therefore, external ultraviolet light can be more efficiently transmitted to the first filling portion RSa.

[0132] 9A to 9Eis a view showing an exemplary embodiment of a method of manufacturing a display device DD according to the present invention.

[0133] Reference Fig. 9A , an electronic component DC-M in which the hole HO is not defined is provided. In this case, the base layer DC-BSm and the pad insulating layer DC-ILm of the electronic component DC-M may be provided as layers in which the hole HO is not defined.

[0134] In addition, a pad area PA overlapping the driving bump DC-BP and a non-pad area NPA not overlapping the driving bump DC-BP are defined in the base layer DC-BSm. A cutting area CA through which the definition hole HO passes may overlap the non-pad area NPA.

[0135] Fig. 9B It is shown that a hole is defined in the electronic component DC using the laser module LR. Portions of the base layer DC-BS and the pad insulating layer DC-IL overlapping the cutting area CA can be removed by the laser beam irradiated from the laser module LR. Therefore, a hole HO can be defined through the electronic component DC.

[0136] As an exemplary embodiment, a method of defining the hole HO using the laser module LR has been described, however, the present invention should not be limited thereto or thereby.For example, the hole HO overlapping the cutting area CA may be provided in various ways.

[0137] Reference Fig. 9C A display panel DP including a signal pad DP-PD overlapping a non-display area DP-NDA is provided. Then, a process of aligning the display panel DP and the electronic component DC is performed so that the signal pad DP-PD of the display panel DP faces the driving bump DC-BP of the electronic component DC.

[0138] After that, a connection is performed between the signal pad DP-PD and the driving bump DC-BP. Fig. 8A The signal pads DP-PD and the driving bumps DC-BP may be electrically contacted with each other by the ultrasonic bonding method described in .

[0139] In this case, an inner space may be defined between the electronic component DC and the third insulating layer 30 of the display panel DP. The inner space may be divided into a first inner space between the pad insulating layer DC-IL and the third insulating layer 30 and a second inner space corresponding to the hole HO.

[0140] Reference Fig.9D, when the signal pad DP-PD and the driving bump DC-BP are bonded to each other by an ultrasonic bonding method, the filler RS ​​may be filled between the electronic component DC and the third insulating layer 30 of the display panel DP. In this case, the filler RS ​​may be completely filled in the first internal space and the second internal space. According to the present invention, the filler RS ​​filled in the second internal space may be filled upward to the upper surface DC-US of the electronic component DC.

[0141] Then, ultraviolet light UV may be irradiated to the upper surface DC-US of the electronic component DC. According to the present invention, since the ultraviolet light UV is transmitted through the hole HO to the filler RS ​​filled in the first internal space and the second internal space, the curing efficiency of the filler RS ​​may be improved. This is because, due to the base layer DC-BS absorbing a portion of the ultraviolet light UV, the ultraviolet light UV transmitted to the second internal space has a relatively strong intensity compared to the intensity of the ultraviolet light UV transmitted through the base layer DC-BS to the filler RS.

[0142] Reference Fig.9E When the curing of the filler RS ​​is completed, a display device DD including the electronic component DC disposed (eg, mounted) on the display panel DP may be provided.

[0143] FIG. 10A to FIG. 10C is a view showing another exemplary embodiment of a method of manufacturing a display device DD-1 according to the present invention. FIG. 10A to FIG. 10C is with Figure 7 A cross-sectional view of another exemplary embodiment is taken along a line corresponding to line III-III' shown in FIG.

[0144] In the following, reference will be made to FIG. 10A to FIG. 10C An exemplary embodiment of an electronic component DC-1 according to the present invention is described.

[0145] Reference Fig. 10A , a laser beam may be irradiated to a cutting area CA defined in the upper surface DC-US of the electronic component DC-1 using a laser module LR. According to the exemplary embodiment shown, the hole HOa defined using the laser module LR may have a shape recessed from the upper surface DC-US of the electronic component DC-1.

[0146] In detail, the hole HOa defined by the laser beam irradiated on the upper surface of the base layer DC-BSa may have a shape that is recessed by a predetermined height HTa from the upper surface of the base layer DC-BSa in the third direction DR3, rather than an open shape. According to the present invention, the height HTa of the hole HOa may have a length that is equal to or greater than about fifty percent (50%) of the thickness DH of the base layer DC-BSa and less than about 100% of the thickness DH of the base layer DC-BSa. Therefore, the pad insulating layer DC-ILa may not be exposed to the outside by the base layer DC-BSa. That is, a separate hole is not defined in the pad insulating layer DC-ILa.

[0147] Reference Fig. 10B , when the signal pad DP-PD and the driving bump DC-BP are bonded to each other by an ultrasonic bonding method, the filler RS-1 may be filled between the pad insulating layer DC-ILa of the electronic component DC and the third insulating layer 30 of the display panel DP. In this case, since the filler RS-1 is not filled in the hole HOa, the hole HOa may be provided as an empty space.

[0148] Then, ultraviolet light UV can be irradiated to the upper surface DC-US of the electronic component DC to cure the filler RS-1. According to the present invention, the ultraviolet light UV is transmitted to the filler RS-1 through the hole HOa defined by removing a portion of the base layer DC-BSa, thereby improving the curing efficiency of the filler RS-1.

[0149] Reference Fig. 10C , the curing of the filler RS-1 is completed, and a display device DD-1 including an electronic component DC-1 disposed (eg, mounted) on a display panel DP can be provided. Fig. 10C In another exemplary embodiment of the present invention shown in FIG. 1 , the hole HOa defined in the electronic component DC- 1 may be finally provided as an empty space.

[0150] Fig.11 2 is a plan view showing another exemplary embodiment of an electronic component DC-2 according to the present invention. Fig.11 ,and Figure 7 Unlike the shape of the hole HO (first hole) in the exemplary embodiment shown in FIG, the hole HOb (second hole) defined through the upper surface DC-US of the electronic component DC-2 may overlap at least a portion of the driving pad portion DC-P or the driving line portion DC-L. As an example, Fig.11 A structure in which the hole HOb overlaps the driving line portion DC-L is shown.

[0151] In another exemplary embodiment of the present invention, Fig.11 The drive line section DC-L described in the Fig. 10ATherefore, although the hole HOb is defined to overlap with the driving line portion DC-L, the driving line portion DC-L is not damaged. Fig.11 The hole HOb shown in FIG. 1 may overlap with the driving line portion DC-L. In this case, an area of ​​the hole HOb overlapping with the driving line portion DC-L may be smaller than an area of ​​the hole HOb.

[0152] Furthermore, in another exemplary embodiment of the present invention, a structure as follows may be provided in the upper surface DC-US of the base layer DC-BSa: FIG. 10A to FIG. 10C The hole HOa (first hole) shown in Fig.11 The hole HOa has a shape that is recessed from the upper surface DC-US of the base layer DC-BSa, and the hole HOa does not overlap with the plurality of drive line portions DC-L (a plurality of drive lines) in a plan view. The hole HOb is separated from the hole HOa in a plan view and is recessed from the upper surface DC-US of the base layer DC-BSa, and the hole HOb overlaps with at least one drive line portion DC-L (at least one drive line) among the plurality of drive line portions DC-L (a plurality of drive lines).

[0153] Although exemplary embodiments of the present invention have been described, it should be understood that the present invention should not be limited to these exemplary embodiments, but various changes and modifications may be made by one of ordinary skill in the art within the spirit and scope of the present invention as hereinafter claimed.

[0154] Therefore, the disclosed subject matter should not be limited to any single exemplary embodiment described herein, and the scope of the present invention should be determined based on the following claims.

Claims

1. A display device, wherein: The display device comprises: A display panel including a display area and a non-display area defined therein, and including a plurality of signal pads overlapping the non-display area; An electronic component comprising a base layer having an upper surface and a lower surface, a plurality of driving pads disposed on the lower surface of the base layer, and a plurality of driving bumps respectively disposed on the plurality of driving pads, the plurality of driving bumps respectively connected to the plurality of signal pads; and A filler is disposed between the display panel and the electronic component, wherein external light is transmitted to the filler through a first hole defined in the upper surface of the base layer, and the first hole does not overlap with the plurality of driving bumps in a plan view.

2. The display device according to claim 1, wherein: The first hole passes through the upper surface and the lower surface, and the filler is exposed to the outside through the first hole.

3. The display device according to claim 2, wherein: The filler includes a first filling portion disposed between the display panel and the electronic component and a second filling portion disposed in the first hole.

4. The display device according to claim 3, wherein: An upper surface of the second filling portion provides a flat surface together with an upper surface of the electronic component.

5. The display device according to claim 3, wherein: The first filling portion has a height smaller than a height of the second filling portion in a thickness direction of the base layer.

6. The display device according to claim 1, wherein: The first hole has a shape recessed from the upper surface of the base layer.

7. The display device according to claim 6, wherein: In a thickness direction of the base layer, the first hole has a height that is equal to or greater than 50 percent of the thickness of the base layer and less than 100 percent of the thickness of the base layer.

8. The display device according to claim 6, wherein: The electronic component also includes: a pad insulating layer, which is arranged on the base layer to expose a portion of each of the multiple driving pads; and a plurality of driving lines, which are respectively connected to the multiple driving pads, and the filler is arranged between the pad insulating layer and the display panel, and the first hole does not overlap with the multiple driving lines in the plan view.

9. The display device according to claim 8, wherein: A second hole is also defined in the upper surface of the base layer, the second hole being spaced apart from the first hole and recessed from the upper surface of the base layer in the plan view, and overlapping at least one driving line of the plurality of driving lines.

10. The display device according to any one of claims 1 to 9, wherein: A plurality of the first holes are provided and defined in the base layer to be spaced apart from each other in the plan view.

11. The display device according to any one of claims 1 to 9, wherein: The display panel further includes: substrate; A circuit element layer is disposed on the substrate; a plurality of first pads overlapping the non-display area, disposed on the substrate, and electrically connected to the circuit element layer; an insulating layer disposed on the substrate to expose a portion of each of the plurality of first pads; and A plurality of second pads are respectively disposed on the plurality of first pads exposed by the insulating layer, and the plurality of second pads are the plurality of signal pads.

12. The display device according to any one of claims 1 to 7, wherein: The electronic component further includes a plurality of driving lines electrically connected to the plurality of driving pads, respectively, and the first hole does not overlap the plurality of driving lines in the plan view.

13. The display device according to any one of claims 1 to 9, wherein: In the plan view, the filler surrounds the plurality of driving bumps.

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