Energy storage device

By forming grooves of different depths on the stack of energy storage devices and depositing electrical insulating materials, the problems of complexity and short-circuit risks in the prior art are solved, and an efficient and direct manufacturing process is achieved.

CN112449730BActive Publication Date: 2024-12-24DYSON TECH LTD
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Patent Information

Application Number
CN201980048236.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2018-07-20
Filing Date
2019-07-19
Publication Date
2024-12-24
Estimated Expiration
2039-07-19

AI Technical Summary

Technical Problem

The existing methods of manufacturing energy storage devices are complex and inefficient, making it difficult to directly form multiple batteries from a single direction, and easily lead to short circuit risk.

Method used

The first, second and third grooves on one side are formed on the stack of the energy storage device, each having different depths, and an electrically insulating material is deposited in the grooves to isolate the electrode layer, and then connected to the external circuit by the conductive material , avoid short circuits and form grooves by laser ablation to improve efficiency.

Benefits of technology

It realizes efficient manufacturing of multiple batteries from a single direction, reduces the risk of short circuits, improves manufacturing efficiency, and simplifies the complexity and operation process of equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

A method for manufacturing an energy storage device is disclosed. A stack is provided on a substrate. The stack includes a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer. The method includes forming a first groove, a second groove, and a third groove in a first side of the stack opposite to a second side of the stack on the substrate. The first groove has a first depth and a first surface including a first exposed surface of the second electrode layer. The second groove has a second depth different from the first depth and a second surface including an exposed surface of the first electrode layer. The third groove has a third depth substantially the same as the first depth and a third surface including the second exposed surface of the second electrode layer.
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Description

Technical Field

[0001] The invention relates to a method for producing an energy storage device, an energy storage device and an intermediate structure for producing an energy storage device. Background Art

[0002] Energy storage devices such as solid-state thin-film batteries can be produced by forming a stack of layers on a substrate. The stack of layers typically includes a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer. The combination of the stack and substrate can then be cut into individual parts to form individual batteries.

[0003] It would be desirable to provide a method of manufacturing an energy storage device that is simpler or more efficient than known manufacturing methods. Summary of the invention

[0004] According to a first aspect of the present invention, there is provided a method for manufacturing an energy storage device, the method comprising:

[0005] providing a stack on a surface of a substrate, the stack comprising a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer, the first electrode layer being closer to the surface of the substrate than the second electrode layer;

[0006] forming a first recess in a first side of the stack, the first side of the stack opposite a second side of the stack on the surface of the substrate, the first recess having a first depth and a first surface including a first exposed surface of the second electrode layer;

[0007] forming a second recess in the first side of the stack, the second recess having a second depth different from the first depth and a second surface including an exposed surface of the first electrode layer; and

[0008] forming a third recess in the first side of the stack, the third recess having a third depth substantially the same as the first depth and a third surface including the second exposed surface of the second electrode layer,

[0009] Wherein, the second groove is located between the first groove and the third groove.

[0010] The formation of the first, second and third grooves provides an area in which an electrically insulating material can be deposited. A conductive material can then be deposited to contact the exposed surfaces of the first and second electrode layers. The stack can then be separated into a plurality of cells, for example, along axes corresponding to the first, second and third grooves. The conductive material can then be used to connect the first and second electrode layers of a given cell to an external circuit.

[0011] Thus, the method according to the first aspect allows a plurality of batteries to be formed from a stack. The method is therefore scalable and can, for example, be performed as part of an efficient continuous manufacturing process (e.g., a roll-to-roll process). Moreover, by forming the first, second and third grooves in the same side (the first side) of the stack, the method can be more direct than other methods in which the grooves are formed from different sides of the stack. For example, the stack can be processed from a single direction rather than from multiple directions to form the first, second and third grooves. The equipment for forming the grooves can also be less complex than other situations in which the grooves are formed from different sides of the stack.

[0012] At least one of the first groove, the second groove or the third groove is formed without cutting the substrate. Compared with the method involving cutting the substrate at least partially during the formation of the groove in the stack, this can improve the efficiency of the method. For example, a smaller amount of material can be removed during the formation of the first, second and third grooves. Therefore, compared with other situations where a large amount of material (such as a part of the substrate) is removed, the first, second and third grooves can be formed faster and more effectively. In addition, the formation of the first, second or third groove can be more direct than other methods involving cutting through the substrate. For example, there may be a difference in thickness between the substrate and the stacked layer. In some cases, the substrate can be as thick as the stacked layer of the combination. It may be difficult to control the depth of the groove formed through this substrate. However, by forming the first, second and / or third grooves without cutting the substrate, the first, second and third depths of the first, second and third grooves can be more easily controlled.

[0013] In an example, the first groove is spaced apart from and substantially parallel to the second groove, and the second groove is spaced apart from and substantially parallel to the third groove. This can simplify the formation of the first, second, and third grooves. For example, providing a series of substantially parallel grooves is more straightforward than providing a series of grooves at different corresponding angles. For example, between the formation of the first groove and the second groove, or between the formation of the second groove and the third groove, the angular orientation of the device that removes material to form the grooves does not need to be changed.

[0014] In an example, at least one of the first depth of the first groove, the second depth of the second groove, or the third depth of the third groove is substantially perpendicular to the plane of the surface of the substrate. By forming the first, second, or third groove in this manner, subsequent deposition of electrically insulating material within the first, second, or third groove can be simplified compared to examples in which the first, second, or third groove is at an angle relative to the plane of the surface of the substrate. For example, such an arrangement of the first, second, or third groove can facilitate or otherwise help the electrically insulating material move into the corresponding groove and improve contact between the electrically insulating material and an exposed surface within the corresponding groove (e.g., an exposed surface of the first or second electrode layer).

[0015] In an example, forming the first groove, forming the second groove, and forming the third groove use at least one laser beam directed to the first side of the substrate. This allows the first, second, and third grooves to be formed using a laser ablation process. Laser ablation can be performed quickly and relatively easily controlled, so that the depth of the first, second, and third grooves can be precisely controlled. In addition, by arranging at least one laser beam to be directed to the first side of the substrate, the laser ablation system can be simpler than other situations in which there are different laser beams directed to different sides of the substrate.

[0016] In an example, a first groove is formed through the second electrode layer and the electrolyte layer, and exposes a first exposed surface of the second electrode layer; a second groove is formed through the second electrode layer, the electrolyte layer and the first electrode layer, and exposes the surface of the first electrode layer; a third groove is formed through the second electrode layer and the electrolyte layer, and exposes a second exposed surface of the second electrode layer. This allows multiple batteries to be manufactured from the same stack. In each of these batteries, the first electrode layer and the second electrode layer can be exposed on opposite sides of the battery during subsequent processing, thereby reducing the risk of short circuits.

[0017] In an example, the first groove is formed without cutting the first electrode layer and without cutting the substrate; the second groove is formed without cutting the substrate; the third groove is formed without cutting the first electrode layer and without cutting the substrate. Therefore, a smaller amount of material can be removed than in other cases. Therefore, this can improve the efficiency of the method.

[0018] In an example, the electrically insulating material is disposed in at least one of: a first groove to insulate a first exposed surface of the second electrode layer from the first electrode layer; a second groove to insulate an exposed surface of the first electrode layer from the second electrode layer; or a third groove to insulate a second exposed surface of the second electrode layer from the first electrode layer. For example, the electrically insulating material reduces the risk of a short circuit that might otherwise occur if the first and second electrode layers were in electrical contact with each other.

[0019] In an example, after the electrically insulating material is disposed in the second groove, a portion of the electrically insulating material is removed to expose the third exposed surface of the second electrode layer. This allows the third exposed surface of the second electrode layer to be subsequently connected to the conductive material to be connected to an external circuit. It may be more direct to deposit the electrically insulating material in the second groove and then remove a portion of the electrically insulating material, rather than depositing a small amount of electrically insulating material in the second groove. For example, it may be difficult to more accurately control the amount of electrically insulating material deposited in the second groove. If too little electrically insulating material is deposited, other layers of the stack (e.g., electrolyte layer or first electrode layer) other than the second electrode layer may be exposed, which may cause a short circuit. On the contrary, if too much electrically insulating material is deposited, an insufficient amount of the second electrode layer may be exposed, which may reduce the electrical contact between the second electrode layer and the conductive material during subsequent processing. This may reduce the effectiveness of the energy storage device. However, by depositing the electrically insulating material in the second groove and then removing a portion of the electrically insulating material, the amount of electrically insulating material remaining in the group can be more accurately controlled.

[0020] In an example, the method includes forming a first precursor groove, a second precursor groove, and a third precursor groove in a first side of the stack; and providing an electrically insulating material in the first precursor groove, the second precursor groove, and the third precursor groove. In such an example, the first groove is formed through the electrically insulating material in the first precursor groove; the second groove is formed through the electrically insulating material in the second precursor groove; and the third groove is formed through the electrically insulating material in the third precursor groove. The formation of the first, second, and third precursor grooves provides flexibility for subsequent processing, for example.

[0021] In an example, the first precursor groove, the second precursor groove, and the third precursor groove are formed to have approximately the same depth as each other. This may be more straightforward than forming the first, second, and third precursor grooves with different depths from each other. For example, the same process may be applied to the stack to form each of the first, second, and third precursor grooves. This may be easier to control than applying different processes to the stack to form each of the first, second, and third precursor grooves, such as forming the first, second, and third precursor grooves with different respective depths.

[0022] In an example, the stack includes another first electrode layer, another second electrode layer, and another electrolyte layer between the another first electrode layer and the another second electrode layer, the another first electrode layer being located between the second electrode layer and the another electrolyte layer. In this way, the stack includes multiple groups of first electrode layer-electrolyte layer-second electrode layer sub-stacks. Compared to a stack including a single first electrode layer, electrolyte layer, and second electrode layer, such a stack can have a greater ratio of active material to substrate and can therefore exhibit an increased energy density.

[0023] In such examples, at least one of the following:

[0024] Forming the first groove includes:

[0025] forming a first groove through the electrically insulating material in the first precursor groove to form a first groove having a first surface including a first exposed surface of a second electrode layer, and insulating a first exposed surface of another second electrode layer from the first groove by the electrically insulating material; and

[0026] widening the first groove so that the first surface further includes a first exposed surface of another second electrode layer;

[0027] Forming the second groove includes:

[0028] forming a second groove through the electrically insulating material in the second precursor groove to form a second groove having a second surface including an exposed surface of the first electrode layer, and insulating an exposed surface of another first electrode layer from the second groove by the electrically insulating material; and

[0029] widening the second groove so that the second surface further includes an exposed surface of another first electrode layer; or

[0030] Forming the third groove includes:

[0031] forming a third groove through the electrically insulating material in the third precursor groove to form a third groove having a third surface including a second exposed surface of the second electrode layer, and insulating the second exposed surface of the other second electrode layer from the third groove by the electrically insulating material; and

[0032] The third groove is widened so that the third surface further includes a second exposed surface of another second electrode layer.

[0033] In these examples, the formation of the first, second or third grooves can be a multi-step process. For example, for a first groove, a first exposed surface of a second electrode layer can be exposed before subsequently exposing a first exposed surface of another second electrode layer. In this way, exposed surfaces of electrode layers for multiple different sub-stacks can be formed. This allows a stack including multiple sub-stacks to be formed in an efficient manner. In addition, the exposed surfaces of the first electrode layers of different sub-stacks can be connected in parallel in a simple manner. Similarly, the exposed surfaces of the second electrode layers of different sub-stacks can also be connected in parallel. This allows efficient manufacture of multi-battery energy storage devices.

[0034] In the example, at least one of the following:

[0035] After widening the first groove, the first portion of the first groove is narrower than the second portion of the first groove, and the first portion of the first groove is closer to the first side of the substrate than the second portion of the first groove;

[0036] After widening the second groove, the first portion of the second groove is narrower than the second portion of the second groove, and the first portion of the second groove is closer to the first side of the substrate than the second portion of the second groove; and

[0037] After widening the third groove, the first portion of the third groove is narrower than the second portion of the third groove, and the first portion of the third groove is closer to the first side of the substrate than the second portion of the third groove.

[0038] For example, this provides a series of shelf portions within the first, second or third recesses on which conductive material can be deposited. Thus, this facilitates the connection of exposed surfaces within the first, second or third recesses with conductive material to allow the stacked electrode layers to be connected to an external circuit.

[0039] In an example, the stack includes another first electrode layer, another second electrode layer, and another electrolyte layer between the other first electrode layer and the other second electrode layer, and the other first electrode layer is located between the second electrode layer and the other electrolyte layer. In such an example, the first precursor groove, the second precursor groove, and the third precursor groove are all formed through another second electrode layer, another electrolyte, another first electrode layer, the second electrode layer, the electrolyte layer, and the first electrode layer. Therefore, the stack can include two sub-stacks, so that the method can be easily expanded. This can further improve the efficiency of the method for manufacturing an energy storage device. In addition, the energy storage device can have a greater energy density than other energy storage devices, while other energy storage devices have a lower ratio of active material to substrate (e.g., inert material that does not contribute to energy storage).

[0040] In such an example, at least one: the first surface includes a first exposed surface of another second electrode layer; the second surface includes an exposed surface of another first electrode layer; or the third surface includes a second exposed surface of another second electrode layer. In this way, the first surface of the first groove may include the exposed surfaces of the second electrode layer and the other second electrode layer, each of which may be a cathode. Similarly, the second surface of the second groove may include the exposed surfaces of the first electrode layer and the other first electrode layer, each of which may be an anode. The first groove and the second groove may be separated from each other by a portion of the stack. Therefore, by a portion of the stack, the conductive material connected to the second and other second electrode layers (in the first groove) can be separated from the conductive material connected to the first and other first electrode layers (in the second groove). For example, this reduces the risk of a short circuit. In a similar manner, another portion of the stack may separate the second groove and the third groove, thereby further reducing the possibility of a short circuit.

[0041] In an example, a first distance between the first groove and the second groove in a direction parallel to the plane of the substrate is substantially the same as a second distance between the second groove and the third groove in a direction parallel to the plane of the substrate. With this arrangement, the method can be performed more efficiently (e.g., using a standardized, predetermined, or fixed distance between adjacent grooves) than in other cases where the distance between adjacent grooves can vary. Each of the first, second, and third grooves can correspond to a boundary between adjacent batteries of a multi-battery energy storage device. In this case, the constant or regular distance between adjacent grooves facilitates the creation of a z-folded structure (by folding the intermediate structure including the stack and the substrate back onto itself), from which a single battery can be created by cutting through the intermediate structure along an axis corresponding to one of the grooves. For example, the regular distance between adjacent grooves can make it easier to align the batteries with each other (e.g., in a vertical direction) during the creation of a z-folded arrangement.

[0042] According to a second aspect of the present invention, there is provided an energy storage device, comprising:

[0043] A stack on a surface of a substrate, the stack comprising:

[0044] a first electrode;

[0045] a second electrode; and

[0046] an electrolyte between a first electrode and a second electrode, the first electrode being closer to the surface of the substrate than the second electrode;

[0047] a first electrical insulator in contact with the first exposed surface of the first electrode and the first exposed surface of the electrolyte without contacting at least a portion of the first exposed surface of the second electrode; and

[0048] A second electrical insulator contacts the second exposed surface of the second electrode and the second exposed surface of the electrolyte and does not contact at least a portion of the second exposed surface of the first electrode.

[0049] Such an energy storage device may be manufactured in an efficient manner, for example using the method according to the first aspect of the invention.The first exposed surface of the second electrode and the second exposed surface of the first electrode may be connected to an external circuit via a conductive material.

[0050] In an example, the first electrical insulator is arranged on a first side of the stack, and the second electrical insulator is arranged on a second side of the stack opposite to the first side. In these examples, the first exposed surface of the second electrode can be on the first side of the stack, and the second exposed surface of the first electrode can be on the second side of the stack. In this way, the stack itself can separate the first exposed surface of the second electrode from the second exposed surface of the first electrode. On the first side of the stack, the first electrical insulator can insulate the first exposed surface of the first electrode (which can also be on the first side of the stack) from the first exposed surface of the second electrode. Similarly, on the second side of the stack, the second electrical insulator can insulate the second exposed surface of the second electrode (which can also be on the second side of the stack) from the second exposed surface of the first electrode. In this way, short circuits can be effectively prevented or reduced.

[0051] In an example, the first side of the stack and the second side of the stack are both substantially perpendicular to the plane of the surface of the substrate. This can simplify the formation of the stack compared to examples in which the first side and the second side of the stack are angled relative to the plane of the surface of the substrate.

[0052] In an example, the thickness of the substrate in a direction perpendicular to a plane of the surface of the substrate is substantially equal to or greater than the thickness of the stack in a direction perpendicular to a plane of the surface of the substrate. In this case, the energy storage device can be directly manufactured, for example using the method according to the first aspect of the invention. For example, the depth of the first, second and third grooves (which can subsequently be at least partially filled with an electrically insulating material, for example to form a first and a second electrical insulator) can be more easily controlled.

[0053] In an example, the stack includes another first electrode, another second electrode and another electrolyte between the other first electrode and the other second electrode, the other first electrode being located between the second electrode and the other electrolyte. In such an example, the energy storage device includes: another first electrical insulator, which contacts the first exposed surface of the other first electrode and the first exposed surface of the other electrolyte, but not in contact with at least a portion of the first exposed surface of the other second electrode; and another second electrical insulator, which contacts the second exposed surface of the other second electrode and the second exposed surface of the other electrolyte, but not in contact with at least a portion of the second exposed surface of the other first electrode. Therefore, the stack in such an example can be considered to include a plurality of sub-stacks. For example, such a stack has a greater energy density than other stacks having only a single sub-stack. The exposed surfaces of the first electrode layers of different sub-stacks can be connected in parallel in a simple manner, for example, using a conductive material. Similarly, the exposed surfaces of the second electrode layers of different sub-stacks can also be connected in parallel, for example, using a conductive material. This allows for efficient manufacture of multi-battery energy storage devices. The first, another first, second and another second electrical insulators are, for example, sufficient to insulate various components of energy storage from each other to avoid or reduce the risk of short circuits. However, sufficient exposed surface is provided to enable the stack to be effectively connected to external circuitry.

[0054] Other features will become apparent from the following description, given by way of example only, which refers to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 is a schematic diagram of a stack for an energy storage device according to an example;

[0056] Figure 2 It is used for processing according to the example Figure 1 A schematic diagram of an example of stacking to manufacture an energy storage device;

[0057] Figures 3a to 3e is a schematic diagram illustrating a method of manufacturing an energy storage device according to an example; and

[0058] Figures 4a to 4f is a schematic diagram illustrating a method of manufacturing energy storage according to another example. DETAILED DESCRIPTION

[0059] Details of the methods, structures and devices according to the examples will become apparent with reference to the accompanying drawings, according to the examples. In this specification, many specific details of certain examples are set forth for the purpose of explanation. Reference to "example" or similar language in the specification means that a particular feature, structure or characteristic described in conjunction with the example is included in at least one example, but not necessarily in other examples. It should also be noted that certain examples are schematically described, in which certain features are omitted and / or must be simplified in order to facilitate explanation and understanding of the concepts underlying the examples.

[0060] Figure 1 A stack 100 of layers for an energy storage device is shown. For example, Figure 1 The stack 100 may be used as part of a thin film energy storage device having a solid electrolyte.

[0061] exist Figure 1 In the embodiment, stack 100 is on substrate 102. Substrate 102 is, for example, glass or polymer and can be rigid or flexible. Substrate 102 is generally planar. Figure 1 The stack 100 is shown as being in direct contact with the substrate 102, but in other examples, there may be one or more additional layers between the stack 100 and the substrate 102. Therefore, unless otherwise specified, references herein to an element being "on" another element should be understood to include direct or indirect contact. In other words, an element on another element may be contacting the other element, or not contacting the other element, but rather typically supported by one or more intermediate elements, but still located above or overlapping the other element.

[0062] Figure 1 The stack 100 includes a first electrode layer 104, an electrolyte layer 106, and a second electrode layer 108. Figure 1 In the example of FIG. 1 , the second electrode layer 108 is farther from the substrate 102 than the first electrode layer 104 , and the electrolyte layer 106 is located between the first electrode layer 104 and the second electrode layer 108 .

[0063] The first electrode layer 104 may serve as a positive current collecting layer. In such an example, the first electrode layer 104 may form a positive electrode layer (i.e., may correspond to a cathode during discharge of a battery of an energy storage device including the stack 100). The first electrode layer 104 may include a material suitable for storing lithium ions through a stable chemical reaction, such as lithium cobalt oxide, lithium iron phosphate, or an alkali metal polysulfide salt.

[0064] In alternative examples, there may be a separate positive current collecting layer that may be located between the first electrode layer 104 and the substrate 102. In these examples, the separate positive current collecting layer may include nickel foil; however, it will be appreciated that any suitable metal may be used, such as aluminum, copper, or steel, or metallized materials including metallized plastics, such as aluminum on polyethylene terephthalate (PET).

[0065] The second electrode layer 108 can be used as a negative current collector layer. In this case, the second electrode layer 108 can form a negative electrode layer (which can correspond to the anode during discharge of a battery of an energy storage device including the stack 100). The second electrode layer 108 may include lithium metal, graphite, silicon, or indium tin oxide (ITO). For the first electrode layer 104, in other examples, the stack 100 may include a separate negative current collector layer, which may be on the second electrode layer 108, and the second electrode layer 108 is between the negative current collector layer and the substrate 102. In examples where the negative current collector layer is a separate layer, the negative current collector layer may include nickel foil. However, it should be understood that any suitable metal can be used for the negative current collector layer, such as aluminum, copper or steel, or a metallized material including a metallized plastic, such as aluminum on polyethylene terephthalate (PET).

[0066] The first and second electrode layers 104, 108 are generally conductive. Therefore, current can flow through the first electrode layer 104 and the second electrode layer 108 due to the flow of ions or electrons through the first electrode layer 104 and the second electrode layer 108.

[0067] The electrolyte layer 106 may include any suitable material that is ionically conductive but is also an electrical insulator, such as lithium phosphorus oxynitride (LiPON). As described above, the electrolyte layer 106 is, for example, a solid layer and may be referred to as a fast ion conductor. The solid electrolyte layer may have a structure between a liquid electrolyte and a crystalline solid, where the liquid electrolyte, for example, lacks a regular structure and contains ions that can move freely. Crystalline materials, for example, have a regular structure with an ordered arrangement of atoms that may be arranged in a two-dimensional or three-dimensional lattice. The ions of a crystalline material are generally immobile and therefore may not be able to move freely throughout the material.

[0068] For example, stack 100 may be fabricated by depositing first electrode layer 104 on substrate 102. Electrolyte layer 106 is subsequently deposited on first electrode layer 104, and second electrode layer 108 is then deposited on electrolyte layer 106. Each layer of stack 100 may be deposited by flooding, which provides a simple and efficient way to produce highly uniform layers, although other deposition methods are possible.

[0069] Figure 1 The stack 100 can also be processed to make an energy storage device. Figure 2The schematic diagram shows the Figure 1 An example of processing of a stack 100 is shown.

[0070] exist Figure 2 , stack 100 and substrate 102 together form an intermediate structure 110 for manufacturing an energy storage device. In this example, intermediate structure 110 is flexible, allowing it to be wound around a roll 112 as part of a roll-to-roll manufacturing process (sometimes referred to as a reel-to-reel manufacturing process). Intermediate structure 110 can be gradually unwound from roll 112 and further processed.

[0071] exist Figure 2 In an example of , a groove may be formed through the intermediate structure 110 (e.g., through the stack 100) using a first laser 114. The first laser 114 is arranged to apply a laser beam 116 to the intermediate structure 110 to remove a portion of the intermediate structure 100, thereby forming the groove in the stack 100. This process may be referred to as laser ablation.

[0072] After forming the grooves, electrically insulating materials can be deposited in at least some of the grooves using a material deposition system 118. The material deposition system 118 fills at least some of the grooves with a liquid 120 such as an organic suspension liquid material, for example. The liquid 120 can then be solidified in the groove to form an electrically insulating plug in the groove. Electrically insulating materials can be considered non-conductive and can therefore conduct a relatively small amount of current when subjected to an electric field. Typically, electrically insulating materials (sometimes referred to as insulators) conduct less current than semiconductor materials or conductive materials. However, there is still a small amount of current flowing through the electrically insulating material under the influence of an electric field, because even insulators may include a small amount of charge carriers that carry current. In the examples herein, such a material can be considered electrically insulating, where the material is electrically insulating enough to perform the function of an insulator. For example, this function can be performed in the case where the material fully insulates one element from another element to avoid a short circuit.

[0073] Reference Figure 2 After depositing the electrically insulating material, the intermediate structure 110 is cut along at least some of the grooves to form individual cells for an energy storage device. Figure 2 In the example shown, hundreds or potentially thousands of cells may be cut from a roll of intermediate structure 110, thereby allowing for the manufacture of multiple batteries in an efficient manner.

[0074] exist Figure 2In the embodiment of the present invention, a cutting operation is performed using a second laser 122, which is arranged to apply a laser beam 124 to the intermediate structure 110. Each cut may, for example, pass through the center of the insulating plug, so that the plug is divided into two parts, each part forming a protective covering on the exposed surface including the edge to which it has been attached. Cutting through the entire stack in this way forms the exposed surfaces of the first and second electrode layers 104, 108.

[0075] Although not in Figure 2 1 and 2 (illustratively only), but it should be understood that after depositing the electrically insulating material, the intermediate structure 110 can be folded back on itself to form a z-folded structure having at least ten layers, possibly hundreds of layers, and possibly even thousands of layers, with each insulating plug aligned. The laser cutting process performed by the second laser 122 can then be used to cut the z-folded structure for each of the aligned plug groups in a single cutting operation.

[0076] After cutting the battery, electrical connectors can be arranged along opposite sides of the battery so that a first electrical connector on one side of the battery contacts the first electrode layer 104 (which can be considered to form the first electrode after the battery has been separated from the rest of the intermediate structure 110), but is prevented from contacting other layers by an electrically insulating material. Similarly, a second electrical connector on the opposite side of the battery can be arranged to contact the second electrode layer 108 (which can be considered to form the second electrode after the battery has been separated from the rest of the intermediate structure 110), but is prevented from contacting other layers by an insulating material. Thus, the insulating material can reduce the risk of short circuits between the first and second electrode layers 104, 108 and other layers in each battery. The first and second electrical connectors can be, for example, metal materials applied to the edge of the stack 110 (or to the edge of the intermediate structure 110) by sputtering. Thus, the batteries can be effectively and easily connected in parallel.

[0077] Figures 3a to 3e (collectively, FIG. 3 ) is a schematic diagram illustrating features of an example method of manufacturing an energy storage device. Figure 1 The features of FIG. 3 that are identical to the corresponding features are marked with the same reference numerals. The corresponding description shall apply. Figures 3a to 3e In each of the , the same reference numerals are used to denote the same elements. However, for clarity, Figures 3a to 3e Not all components are labeled in each of the Figures 3a to 3e The processing is applied sequentially to the same stack, so there can be Figures 3a to 3e One of but not in Figures 3a to 3e Another element marked in .

[0078] exist Figure 3a3 includes providing a stack 100 on a surface 126 of a substrate 102. In this example, the stack 100 and the surface 102 are Figure 1 However, in other examples, the method according to FIG. 3 can be applied to Figure 1 Other stacks with different structures or layers shown.

[0079] The layers of stack 100 (in this case, first electrode layer 104, electrolyte layer 106, and second electrode layer 108) can be arranged sequentially. However, in other examples, a partially assembled substrate can be provided. For example, the stack including the first electrode layer, the electrolyte layer, and the second electrode layer can be arranged on the substrate before providing the substrate.

[0080] exist Figure 3a 1, a first groove 128a, a second groove 128b, and a third groove 128c are formed in a first side 130 of the stack 100. The first, second, and third grooves 128a-128c may be collectively referred to using reference numeral 128. The first side 130 of the stack 100 is opposite to the second side of the stack 100, which is on the surface 126 of the substrate 102. Thus, the first side 130 of the stack 100 is, for example, an exposed surface of the stack 100 that is not in contact with or covered by another component. In this example, the first side 130 of the stack 100 is an upper surface of the stack 100, although this need not be the case in other examples.

[0081] The groove is, for example, a channel, groove or trench that may be continuous or discontinuous. In some examples, the groove may be elongated. The groove may extend partially through the layers of stack 100, or extend through all layers of stack 100 to expose a portion of substrate 102. The groove provides, for example, a channel for subsequent deposition of other materials such as liquids or other fluids.

[0082] exist Figure 3a The first groove 128a has a first depth d 1 The second groove 128b has a second depth d 2 , and the third groove 128c has a third depth d 3 The first depth d 1 With the third depth d 3 is basically the same, and the first depth d 1 With the second depth d 2 Different. Along the line basically perpendicular to Figure 3a Each depth d of the groove 128 is intercepted in the direction of the plane of the surface 126 of the substrate 102 1 , d 2 , d 3A direction may be considered substantially perpendicular to a plane, wherein the direction is completely perpendicular to the plane or approximately perpendicular to the plane, such as within measurement tolerance or within plus or minus 5, 10, or 20 degrees of the perpendicular direction. In such cases, the groove 128 may be considered to extend or otherwise elongate in the direction. In such cases, the groove 128 may additionally be elongated in a different direction, such as in a direction perpendicular to the direction (e.g., see FIG. 1 ). Figure 3a For example, the central axis of the groove extending from the mouth or opening of the groove toward the base of the groove can be in a direction substantially perpendicular to the plane of the surface 126 of the substrate 102.

[0083] However, in other examples, some or all of the grooves 128 may extend along axes that are at an angle different from substantially perpendicular to the plane of the surface 126 of the substrate 102. For example, some or all of the grooves 128 may have inner surfaces that are at an acute angle (e.g., less than 90 degrees) relative to the plane of the surface 126 of the substrate 102. However, in contrast to examples such as Figure 3a This may make it more difficult to subsequently deposit material within recess 128, as compared to the example of Figure 3a In the embodiment of the present invention, the inner surface of the groove 128 is substantially perpendicular to the plane of the surface 126 of the substrate 102 .

[0084] The first, second and third grooves 128a, 128b, 128c divide the layers of the stack 100 into different parts. Figure 3a , the first groove 128a separates the first electrode layer 108 into a first portion 108a and a second portion 108b. The first groove 128a also separates the electrolyte layer 106 into a first portion 106a and a second portion 106b. The second groove 128b separates the second portion 108b of the first electrode layer 108 from a third portion 108c of the first electrode layer 108. The second groove 128b also separates the second portion 106b of the electrolyte layer 106 from the third portion 106c of the electrolyte layer 106. In addition, the second groove 128b separates the second electrode layer 104 into a first portion 104a and a second portion 104b. Figure 3a , the third groove 128c separates the third portion 108c of the first electrode layer 108 from the fourth portion 108d of the first electrode layer 108, and separates the third portion 106c of the electrolyte layer 106 from the fourth portion 106d of the electrolyte layer 106. Unlike the second groove 128b, neither the first groove 128a nor the third groove 128c separates a portion of the second electrode layer 104.

[0085] exist Figure 3a, the first groove 128a has a first surface that includes the first exposed surface 132a of the second electrode layer 108. In this example, the first exposed surface 132a of the second electrode layer 108 is the surface of the first portion 108a of the second electrode layer 108. However, the first surface of the first groove 128a also includes the exposed surface of the second portion 108b of the second electrode layer 108 and the exposed surfaces of the first and second portions 106a, 106b of the electrolyte layer 106. The first surface of the first groove 128a additionally includes the exposed surface of the first portion 104a of the first electrode layer 104, which in this example is the upper surface of the first portion 104a of the first electrode layer 104. Therefore, in this example, the first groove 128a is formed through the second electrode layer 108 and the electrolyte layer 106. Therefore, the exposed surfaces of the second electrode layer 108 and the electrolyte layer 106 form the sides of the first groove 128a, while the exposed surface of the first electrode layer 104 forms the base or bottom area of ​​the first groove 128a. The first groove 128 a does not extend through the first electrode layer 104 or the substrate 102 .

[0086] The exposed surface of the groove is, for example, a surface that is not covered or otherwise in contact with another layer after the groove is formed. Thus, for example, after the groove is formed, the exposed surface is, for example, not covered, exposed, or otherwise displayed. The exposed surface can, for example, correspond to a wall, side, sidewall, or side of the groove. Thus, the exposed surface can be or include any surface within the groove that is not covered. For example, the exposed surface can be or include a vertical wall of the groove or a generally upwardly extending inner surface of the groove that extends in an upward direction relative to the substrate 102. Figure 3a This is the case in , where the first surface of the first groove 128a (e.g., the exposed surface of the first groove 128a) includes the sides of the first and second portions 108a, 108b of the first electrode layer 108 and the sides of the first and second portions 106a, 106b of the electrolyte layer 106. Alternatively, the exposed surface can be or include a horizontal wall of the groove or a wall or other surface of the groove that extends in a plane that is generally parallel to the horizontal plane or the plane of the surface 126 of the substrate 102. For example, the exposed surface can be or include a horizontal bottom surface of the groove, which is, for example, the deepest surface of the groove, which can be closest to the substrate 102. In other examples, the groove can include one or more shelf or ledge portions, which can extend in a plane that is generally parallel to the horizontal plane or the plane of the substrate.

[0087] The second groove 128b has a second surface that includes an exposed surface 134 of the first electrode layer 104. In this example, the exposed surface 134 of the first electrode layer 104 is a surface of the first portion 104a of the first electrode layer 104 (in this example, a surface of a side of the first portion 104a of the first electrode layer 104 that extends away from the plane of the surface 126 of the substrate 102). However, the second surface of the second groove 128b also includes exposed surfaces of the second and third portions 106b, 106c of the electrolyte layer 106 and exposed surfaces of the second and third portions 108b, 108c of the second electrode layer 108. Therefore, in this example, the second groove 128b is formed through the second electrode layer 108, the electrolyte layer 106, and the first electrode layer 104, which, for example, form the side of the second groove 128b. Although Figure 3a The surface 126 of the substrate 102 corresponds to the base of the second groove 128b, but the second groove 128b does not extend through the substrate 102. The second groove 128b is located between the first groove 128a and the third groove 128c.

[0088] The third groove 128c has a third surface, which includes the second exposed surface 132b of the second electrode layer 108. In this example, the second exposed surface 132b of the second electrode layer 108 is the surface of the third portion 108c of the second electrode layer 108. However, the third surface of the third groove 128c also includes the exposed surface of the third portion 106c of the electrolyte layer 106 and the exposed surfaces of the fourth portions 108d, 106d of the second electrode layer 108 and the electrolyte layer 106. The third surface of the third groove 128c also includes the exposed surface of the second portion 104b of the first electrode layer 104, which corresponds to the base of the third groove 128c, for example. Therefore, in this example, the third groove 128c is formed through the second electrode layer 108 and the electrolyte layer 106, which, for example, form the side of the third groove 128c. However, the third groove 128c does not extend through the first electrode layer 104 and the substrate 102.

[0089] Since the first depth d of the first groove 128a 1 and a third depth d of the third groove 128c 3 Different from the second depth d of the second groove 128b 2, so the second groove 128b extends through the first electrode layer 104, while the depth of the first groove 128a and the third groove 128c is not enough to extend through the first electrode layer 104. This exposes the side surface of the second electrode layer 108 in the first groove 128a and the third groove 128c (which can be considered as the inner surface or sidewall of the first groove 128a and the third groove 128c). The side surface of the first electrode layer 104 is not exposed in the first groove 128a and the third groove 128c. On the contrary, the upper surface of the first electrode layer 104 forms the base of the first groove 128a and the third groove 128c. However, the side surface of the first electrode layer 104 is exposed in the second groove 128b that is deeper than the first groove 128a and the third groove 128c. However, in other examples, the side surface of the same layer can be exposed in each groove, and the side surface of different parts of the same layer can be exposed in different grooves. However, in this case, the first groove and the third groove may have substantially the same depth as each other, but different from the depth of the second groove.

[0090] exist Figure 3a In the embodiment, the first groove 128a is spaced apart from the second groove 128b and is substantially parallel to the second groove 128b, and the second groove 128b is spaced apart from the third groove 128c and is substantially parallel to the third groove 128c. When the two grooves are completely parallel to each other or within the manufacturing tolerance range, or are parallel to each other within a range of less than 20 degrees, 15 degrees, 10 degrees or 5 degrees, the two grooves can be considered to be substantially parallel to each other. In other words, the first, second and third grooves 128 extend in substantially the same direction as each other. This can simplify the formation of the first, second and third grooves 128.

[0091] exist Figure 3a In the embodiment, the groove 128 has a substantially constant cross-section or a uniform cross-section. The cross-section of the groove is, for example, taken in a direction perpendicular to the depth of the groove and can therefore correspond to the width of the groove. Figure 3a In the embodiment of the present invention, the groove 128 is cylindrical. However, in other examples, the groove may have a different shape. For example, the cross-section of the groove may increase or decrease in size away from the base of the groove, or the size may be uneven. Some or all of the grooves 128 may have substantially the same width as each other, such as exactly the same width or the same width within a manufacturing tolerance, or have a deviation of less than 20%, 15%, 10% or 5%. It may be more direct to manufacture grooves 128 with the same width as each other rather than different widths. For example, this can eliminate the need to adjust the manufacturing equipment between the formation of adjacent grooves, otherwise it may be necessary to form grooves of different widths. The width of the groove can be intercepted in a direction parallel to the plane of the surface 126 of the substrate 102, which direction can be perpendicular to the depth of the groove. However, in other examples, one or more grooves may have a width and / or shape different from another groove.

[0092] In e.g. Figure 3a In the example of FIG. 1 , a first distance D between the first groove 128 a and the second groove 128 b in a direction parallel to the plane of the surface 126 of the substrate 102 is 1 The second distance D between the second groove 128b and the third groove 128c in the same direction 2 Substantially the same. For example, two distances that are exactly the same, within measurement uncertainty, or within 20%, 15%, 10%, or 5% of each other can be considered to be substantially the same. With this arrangement, the grooves 128 can be made more directly than in other situations where the grooves 128 are formed at irregular intervals. In addition, this can make it easier to align the grooves with each other in a z-fold arrangement.

[0093] Some or all of the grooves may be formed using laser ablation. "Laser ablation" may refer to the removal of material from the stack 100 using a laser-based process. The removal of material may include any of a number of physical processes. For example, the removal of material may include (but is not limited to) melting, melt expulsion, vaporization (or sublimation), photon decomposition (single photon), photon decomposition (multi-photon), mechanical shock, thermomechanical shock, other shock-based treatments, surface plasma processing, and removal by evaporation (ablation). Laser ablation, for example, involves irradiating the surface of one or more layers to be removed with a laser beam. For example, this results in a portion of one or more layers being removed. The amount of layer removed by laser ablation can be controlled by controlling the properties of the laser beam, such as the wavelength of the laser beam or the pulse length of a pulsed laser beam. Laser ablation generally allows the formation of grooves to be controlled in a direct and rapid manner. However, in other examples, alternative methods may be used to form some or all of the grooves, such as photolithography.

[0094] In an example using laser ablation, the groove 128 may be formed using at least one laser beam directed to a first side of the substrate 102, which corresponds to, for example, a surface 126 of the substrate 102 on which the stack 100 is arranged. For example, the at least one laser beam may be directed toward the first side 130 of the stack 100. By directing the at least one laser beam toward the first side 130 of the stack 100, the at least one laser beam may thus be directed toward the first side of the substrate 102. In order to direct the at least one laser beam toward the first side of the substrate 102, the laser arranged to generate the at least one laser beam may itself be located at the first side of the substrate 102 (e.g., facing the first side 130 of the stack 100). Alternatively, although the at least one laser beam may be located at a different location, it may still be directed to the first side of the substrate 102 using a suitable optical device. For example, the at least one laser beam may be generated using a laser ablation system that includes a laser and an optical element, such as a mirror or other reflector, to deflect the at least one laser beam generated by the laser toward the first side of the substrate 102.

[0095] As such, the groove 128 may be formed by applying at least one laser beam from a single side of the stack 100. This may simplify the formation of the groove 128 compared to a case where the laser beam is applied from different respective sides of the stack 100.

[0096] from Figure 3a As can be seen, the first groove 128a, the second groove 128b, and / or the third groove 128c can be formed without cutting the substrate 102. In an example, the substrate 102 can be relatively thick compared to the stack 100. For example, the thickness of the substrate 102 in a direction perpendicular to the plane of the surface 126 of the substrate 102 is substantially the same as or greater than the thickness of the stack 100 in the same direction, where substantially the same, for example, means that the thickness is exactly the same, the same within a manufacturing tolerance range, or is substantially similar, such as within 20%, 15%, 10%, or 5% of each other. In this case, it may be more direct to control the depth of the groove by cutting the groove from the first side 130 of the stack 100 without cutting the substrate 102 than cutting the groove through the substrate 102 into the stack 100.

[0097] exist Figure 3a In the embodiment, the first groove 128a and the third groove 128c are formed without cutting the first electrode layer 108 and the substrate 102. The second groove 128b is formed without cutting the substrate 102. This improves the formation efficiency of the groove 128, for example, while still producing a groove 128 having a shape or size suitable for forming an energy storage device, compared to other examples in which additional material is removed.

[0098] exist Figure 3bIn the embodiment of the present invention, the electrically insulating material 136 is deposited in the first, second and third grooves 128 (although in some cases, the electrically insulating material may not be deposited in one or more grooves 128). The electrically insulating material 136 can be provided as a first liquid, for example using an inkjet material deposition process (such as an inkjet printing process). This involves, for example, ejecting or otherwise propelling droplets of the electrically insulating material 136 from a nozzle into the grooves 128. The electrically insulating material 136 can be an ink, such as a dielectric ink. A suitable dielectric ink is DM-INI-7003, available from Dycotec Materials Ltd., Unit 12 Star West, Westmead Industrial Estate, Westlea, Swindon, SN5 7SW, UK. In general, the electrically insulating material 126 can be any suitable dielectric material. The dielectric material is, for example, an electrical insulator, which can be polarized when an electric field is applied. Such dielectric materials also typically have a low electrical conductivity. Although in Figure 3b In the embodiment shown in FIG. 1 , the same electrically insulating material 136 is deposited in each recess 128 , but it should be understood that in other examples, different electrically insulating materials may be deposited in one or more recesses 128 .

[0099] An electrically insulating material 136 is deposited in the first groove 128a to insulate the first exposed surface 132a of the second electrode layer 108 from the first electrode layer 104. Similarly, an electrically insulating material 136 is deposited in the second groove 128b to insulate the exposed surface 134 of the first electrode layer 104 from the second electrode layer 108. An electrically insulating material 136 is deposited in the third groove 128c to insulate the second exposed surface 132b of the second electrode layer 108 from the first electrode layer 104. In this way, the risk of a short circuit between the first electrode layer 104 and the second electrode layer 108 can be reduced.

[0100] After providing the electrically insulating material 136 in the second groove 128b, a portion of the electrically insulating material 136 may be removed. Figure 3c 128, or a different device or system that still applies the same process as that used to form recess 128, to remove the portion of electrically insulating material 136. For example, laser ablation may be used to remove the portion of electrically insulating material 136. However, other methods are also possible. For example, as will be appreciated by a skilled person, different methods may be used to create recess 128 and remove a portion of electrically insulating material 136.

[0101] By removing a portion of the electrically insulating material 136, a third exposed surface 138 of the second electrode layer 108 is exposed. Figure 3cIn FIG. 1 , the third exposed surface 138 of the second electrode layer 108 is a surface of the third portion 108 b of the second electrode layer 108 , but this is only an example. Figure 3c In the example of FIG. 1 , in addition to exposing the surface of the second portion 108 b of the second electrode layer 108, the surface of the third portion 108 c of the second electrode layer 108 is also exposed (although this need not be the case). A conductive material may then be deposited to contact the third exposed surface 138 of the second electrode layer 108 to connect the second electrode layer 108 to an external circuit.

[0102] After deposition of the electrically insulating material 136, a cutting process may be applied, such as Figure 3d As shown. Figure 3d In the example, the intermediate structure of the stack 100 and the substrate 126 is cut along a first axis 140a aligned with the first groove 128a, a second axis 140b aligned with the second groove 128b, and a third axis 140c aligned with the third groove 128c. These axes are collectively represented by the reference numeral 140. In this example, each of the axes 140 is aligned with the center of the corresponding groove 128, but in other cases, such axes may not be aligned in this manner. As shown in reference Figure 2 It is noted that the cutting operation can be performed using a laser, but this is merely an example. By cutting the intermediate structure in this way, the intermediate structure can be separated into individual cells.

[0103] like Figure 3d As shown, cutting the intermediate structure allows the formation of cells 142 for energy storage devices, such as Figure 3e As shown. Figure 3e 142a-142e, four cells 142a-142e are formed, but generally a large number of cells may be formed from the stack 100. The first cell 142a includes a first portion 108a of the second electrode layer 108 (considered to correspond to the second electrode), a first portion 106a of the electrolyte layer 106 (which may be considered to correspond to the electrolyte), a first portion 104a of the first electrode layer 104 (which may be considered to correspond to the first electrode), and a first portion 102a of the first substrate 102. The second, third, and fourth cells 142b, 142c, 142d include similar layers to the first cell 142a. Components of the second, third, and fourth cells 142b, 142c, 142d that are similar to corresponding components of the first cell 142a are indicated with the same reference numerals, but are respectively appended with "b", "c", or "d" instead of "a".

[0104] exist Figure 3e In the embodiment, the first electrical insulator is in contact with an exposed surface of a portion of the first electrode layer 104 and an exposed surface of a portion of the electrolyte layer 106, but is not in contact with at least a portion of an exposed surface of a portion of the second electrode layer 108. Figure 3eThe second electrical insulator is denoted by reference numeral 144 and appended with "a", "b", "c" or "d" depending on whether it is associated with the first, second, third or fourth battery 142a-142d, respectively. The second electrical insulator is in contact with an exposed surface of a portion of the second electrode layer 108 and an exposed surface of a portion of the electrolyte layer 106, but not in contact with at least a portion of the exposed surface of the first electrode layer 104. The second electrical insulator is Figure 3e denoted by reference numeral 146 and appended with an "a", "b", "c" or "d" depending on whether it is associated with the first, second, third or fourth battery 142a-142d, respectively.

[0105] exist Figure 3e , the first cell 142a and the fourth cell 142d include the second electrical insulator 146a, 146d, but lack the first electrical insulator. However, the first cell 142a and the fourth cell 142d may be further processed to add the first electrical insulator, which may be similar to the first electrical insulator 144b, 144c of the second and third cells 142b, 142c.

[0106] The functions of the first electrical insulator 144b and the second electrical insulator 146b will now be explained with reference to the second battery 142b. Figure 3e , the first electrical insulator 144b of the second battery 142b contacts the exposed surface of the second portion 104b of the first electrode layer 104b and the exposed surface of the second portion 106b of the electrolyte layer 106. Thus, the first electrical insulator 144b insulates the second portion 104b of the first electrode layer 104b from the second portion 108b of the second electrode layer 108b. The second electrical insulator 146b of the second battery 142b also insulates the second portion 104b of the first electrode layer 104b from the second portion 108b of the second electrode layer 108b. However, the second electrical insulator 146b of the second battery 142b achieves this by contacting the exposed surface of the second portion 106b of the electrolyte layer 106 with the exposed surface of the second portion 108b of the second electrode layer 108.

[0107] In this example, the first electrical insulator 144b is arranged on a first side of the second battery 142b, and the second electrical insulator 146b is arranged on a second side of the second battery 142b opposite the first side. The side of the battery corresponds to the side of a stack of batteries, for example. It can be considered that the electrical insulator is arranged on the side of the battery or stack, wherein the electrical insulator contacts at least a portion of the exposed surface of the side of the battery or stack. For example, the electrical insulator can extend along the side of the battery or stack (although it is not required). In, for example Figure 3eIn an example of , the first side of the battery or stack and the second side of the battery or stack may each be substantially perpendicular to the plane of the surface 126 of the substrate 102. In this case, the first side or the second side of the battery or stack itself need not be planar, but may have a non-planar surface. However, the first or second side may be substantially or approximately perpendicular to the plane of the surface 126, such that the center plane of the first or second side is precisely, within manufacturing tolerances, or within 20 degrees, 15 degrees, 10 degrees, or 5 degrees perpendicular to the plane of the surface. In this case, the first or second electrical insulator 144b, 146b may extend substantially away from the surface 126 of the substrate 102. For example, the first or second electrical insulator 144b, 146b may extend approximately vertically to cover a portion of the side of the stack of second batteries 142b.

[0108] By this arrangement, the exposed surface of the second portion 104b of the first electrode layer 104 of the second battery 142b remains uncovered by the second electrical insulator 146b. The exposed surface of the second portion 108b of the second electrode layer 108 of the second battery 142b is also not covered by the first electrical insulator 144b. In this way, the exposed portions of the first electrode layer 104 and the second electrode layer 108 are on the opposite side of the second battery 142b. This allows the first electrode layer 104 and the second electrode layer 108 to be connected to an external circuit by arranging a conductive material on the opposite side of the second battery 142b and contacting the exposed portions of the first electrode layer 104 and the second electrode layer 108. Therefore, this reduces the risk of a short circuit between the first electrode layer 104 and the second electrode layer 108.

[0109] Figure 3e The third battery 142c is a mirror image of the second battery 142b. In this way, Figure 3c The second groove 128b may be filled with an electrically insulating material 136, which after being cut and separated into two parts forms a first electrical insulator 144b, 144c of the second and third batteries 142b, 142c. The third battery 142c may be connected to an external circuit similarly to the second battery 142b.

[0110] Similar to Figure 3e Multiple cells of battery 142 can be connected in parallel to form a multi-battery energy storage device. For example, a first electrical connector can be used to connect each of the multiple first electrode layers to each other, and a second electrical connector can be used to connect each of the multiple second electrode layers to each other. Thus, the first electrical connector and the second electrical connector can provide contact points for terminals of the energy storage device. For example, the first electrical connector and the second electrical connector can provide contact points for the negative terminal and the positive terminal of the energy storage device, respectively. The negative terminal and the positive terminal can be electrically connected across a load to power the load, thereby providing a multi-battery energy storage device.

[0111] Figures 4a to 4f (collectively referred to as FIG. 4 ) is a schematic diagram illustrating a method of manufacturing an energy storage device according to another example. Figures 3a to 3e Similar features of FIG. 4 are labeled with the same reference numerals increased by 100. The corresponding description shall apply. Figures 4a to 4f In each of the , the same reference numerals are used to denote the same elements. However, for clarity, Figures 4a to 4f Not all components are labeled in each of the Figures 4a to 4f The processing is applied sequentially to the same stack, so there can be Figures 4a to 4f One of but not in Figures 4a to 4f Another element marked in .

[0112] exist Figure 4a In the embodiment of the present invention, a stack 200 is provided on a substrate 202. The stack 200 includes a first electrode layer 204, an electrolyte layer 206, and a second electrode layer 208. However, the stack 200 also includes another series of layers on top of the second electrode layer 208. In this example, the another series of layers includes two further electrolyte layers 206', 206", another first electrode layer 204' and another second electrode layer 208'. The first further electrolyte layer 206' separates the another first electrode layer 204' from the second electrode layer 208. The second further electrolyte layer 206" separates the another second electrode layer 208' from the first electrode layer 204'. Elements having the same reference numerals but with an apostrophe ' or double apostrophe ' attached may be the same as corresponding elements without such attachment. The corresponding description should be adopted.

[0113] exist Figure 4b 3, first, second and third precursor grooves 148a, 148b, 148c are formed on a first side of the stack 200. The first, second and third precursor grooves 148a, 148b, 148c may be collectively referred to as precursor grooves 148. Similar to FIG. 3, the first side of the stack 200 is, for example, opposite to the second side of the stack 200, which contacts the surface 226 of the substrate 202. Precursor grooves are grooves that are, for example, formed and subsequently subjected to further processing (e.g., widening or partially filling with other elements) to form subsequent grooves. Precursor grooves may be formed using the same or similar methods as those used to form the grooves 128 of FIG. 3. For example, laser ablation or an alternative process such as photolithography may be used to form the precursor grooves.

[0114] Figure 4b The precursor grooves 148 are formed to have substantially the same depth as each other. This can simplify the formation of the precursor grooves 148. However, in other examples, one or more precursor grooves can be formed to have a different depth than the other precursor grooves. Figure 4c4 , each precursor groove 148 is formed to pass through another second electrode layer 208', a second another electrolyte 206", another first electrode layer 204', a first another electrolyte layer 206', a second electrode layer 208, an electrolyte layer 206 and a first electrode layer 204. However, in other examples, the precursor groove 148 can be formed to pass through a different layer. In addition, in some cases, the stack 200 can include different layers from the stack 200 of FIG. 4. For example, the first another electrolyte layer 206' between the second electrode layer 208 and the another first electrode layer 206' can be omitted. Instead, a different layer (such as an insulating layer) can separate the second electrode layer 208 from the another first electrode layer 206'.

[0115] In such Figure 4b In an example of , the cross-section of the precursor groove 148 may have a stepped shape, wherein the width of the precursor groove increases toward the mouth of the precursor groove (eg, in a direction away from the substrate 202). Figure 4d As shown, this allows certain layers to be uncovered or otherwise exposed, for example for subsequent connection to conductive materials. Figure 4b The shape of the precursor groove 148 is only an example. In other examples, the precursor groove 148 can have different shapes and / or sizes. For example, similar to Figure 3a In contrast to the grooves 128 , some or all of the precursor grooves 148 may alternatively have a constant cross-section.

[0116] Figure 4c An electrically insulating material 236 is shown provided in the precursor recess 148. Figure 3b Electrically insulating material 236 is provided as described.

[0117] After providing the electrically insulating material 236, a groove 228 similar to the groove 128 of FIG. 3 may be provided. Figure 4d Schematically illustrated in FIG. 2 , which shows the formation of a first groove 228 a and a second groove 228 b (although it should be understood that the third groove can be formed similarly to the formation of the first groove 228 a ).

[0118] exist Figure 4d In the embodiment, first groove 228a is formed through the electrically insulating material 236 in first precursor groove 148a. Second groove 228b is formed through the electrically insulating material in second precursor groove 148b. Figure 4d , but it should be understood that the third groove can be formed through the electrically insulating material 236 in the third precursor groove 148c in a manner similar to the formation of the first groove 228a.

[0119] The electrically insulating material 236 may be removed to form the first and second recesses 128a, 128b of FIG. 3 in a manner similar to the removal of the electrically insulating material 136 to form the first and second recesses 128a, 128b of FIG. Figure 4d For example, the first groove 228a and the second groove 228b may be formed by laser ablation of a portion of the electrically insulating material 236 or by removing a portion of the electrically insulating material 236 using a different technique.

[0120] By first removing the first region R of the first precursor groove 148a, 1 The first recess 228a is formed by removing the first portion of the electrically insulating material 236 in the electrolyte layer 206a, 206b. After removing the first portion of the electrically insulating material 236, the electrically insulating material can be separated into first electrical insulators 244a, 244b, which contact the surfaces of the first and second portions of the electrolyte layer 206a, 206b and the surfaces of the first and second portions of the first electrode layer 204a, 204b. In this way, the first electrical insulators 244a, 244b electrically insulate the first and second electrode layers 204, 208 from each other.

[0121] Subsequently, the second region R of the first precursor groove 148a may be removed. 2 The second region R 2 For example, in a direction parallel to the plane of the surface 226 of the substrate 202, the first region R 1 Width.

[0122] exist Figure 4d In the example, the second region R 2 is wide enough so that the second region R 2 The removal of the second portion of the electrically insulating material 236 in the first recess 228a exposes the surfaces of the first and second portions 208a, 208b of the second electrode layer 208 within the first recess 228a. In this way, the first surface of the first recess 228a includes the first exposed surface of the second electrode layer 208, which in this case is the exposed surface of the first portion 208a of the second electrode layer 208.

[0123] In this way, the widening of the first groove 228a causes the second electrical insulators 246a, 246b to contact the surfaces of the first and second parts 206a', 206b' of the first further electrolyte layer 206, respectively, within the first groove 228a. The second electrical insulators 246a, 246b also contact the surfaces of the first and second parts 204a', 204b' of the further first electrode layer 204, respectively, within the first groove 228a. The second electrical insulators 246a, 246b also remain in contact with the surfaces of the first and second parts 206a", 206b" of the second further electrolyte layer 206", respectively, within the first groove 228a. This electrically insulates the first and second parts 204a', 204b' of the further first electrode layer 204' from the first and second parts 208a, 208b of the second electrode layer 208. In this way, the surfaces of the first and second parts 204a', 204b' of the further first electrode layer 204 (e.g., the surfaces of the further first electrode layer 204 facing the first groove) The first portion 208a of the second electrode layer 208 is insulated from the first groove 228a by the electrically insulating material 236. Similarly, the surfaces of the first and second portions 208a', 208b' of the other second electrode layer 208 (e.g. corresponding to the side or side of the other first electrode layer 204 facing the first groove 228a) are insulated from the first groove 228a by the electrically insulating material 236. This surface of the first portion 208a' of the other second electrode layer 208 may be referred to as a first exposed surface of the other second electrode layer 208 because it may be exposed later.

[0124] After removing the second portion of the electrically insulating material 236, the third region R 3 A third portion of the electrically insulating material 236 is removed from the third region R 3 For example, in a direction parallel to the plane of the surface 226 of the substrate 202, the first and second regions R 1 , R 2 By removing the third portion of the electrically insulating material 236, the surfaces of the first and second portions 208a', 208b' of the further second electrode layer 208' are exposed within the first recess 228a. For example, this exposes the first exposed surface of the further second electrode layer 208. This allows the further second electrode layer 208' to be connected to an external circuit, for example, by a conductive material deposited in contact with the first exposed surface of the further second electrode layer 208'.

[0125] from Figure 4dIt can be seen that after widening the first groove 228a, the first portion of the first groove 228a (e.g., between the first and second portions 204a, 204b of the first electrode layer 204) is narrower than the second portion of the first groove 228a (e.g., between the first and second portions 204a', 204b' of the other first electrode layer 204'). The first portion of the first groove 228a is, for example, closer to the substrate 202 than the second portion of the first groove 228a. Therefore, the cross-section of the first groove 228a may, for example, be widened away from the substrate 202 (or toward the mouth of the first groove 228a). This may facilitate further processing of the stack 200, such as depositing other components such as conductive materials. However, Figure 4d The shape of the first groove 148 is only an example.

[0126] Similar treatment as the first groove 228a may be applied to the second groove 228b. Figure 4d As shown, the first portion of the electrically insulating material 236 removed during the first widening of the second groove 228b can be larger than the first portion of the electrically insulating material 236 removed during the first widening of the first groove 228a. In this way, the exposed surfaces of the second portion 204b and the third portion 204c of the first electrode layer 204 can be formed within the second groove 228b by removing the first portion of the electrically insulating material 236. For example, the formation of the second groove 228b can include forming the second groove 228b through the electrically insulating material 236 in the second precursor groove 148b to form the second groove 228b having a second surface that includes an exposed surface of the first electrode layer 204 (e.g., an exposed surface of the second portion 204b of the first electrode layer 204). In contrast, during the formation of the second groove 228b, the faces or sides of the second and third portions 208b, 208c of the second electrode layer 208 can remain covered by the electrically insulating material 236 or otherwise insulated. Similarly, the faces or sides of the second and third portions 204a', 204b' of the further first electrode layer 204a' may be kept insulated by the electrically insulating material 236. In this way, an exposed surface referred to as the further first electrode layer 204a', such as the surface of the second portion 204a' of the further first electrode layer 204a', may be kept insulated from the second recess 228b by the electrically insulating material 236. However, a second widening of the second recess 228b, for example by removing a second portion of the electrically insulating material 236, may expose the exposed surfaces of the second and third portions 204b', 204c' of the further first electrode layer 204' within the second recess 228b. In this way, the second surface of the second recess 228b may include the exposed surface of the further first electrode layer 204a'. The faces or sides of the second and third portions 208b', 208c' of the further second electrode layer 208 may remain covered by the electrically insulating material 236 or otherwise insulated.

[0127] The third groove may be formed through the third precursor groove 228c in a similar manner as the first groove 228a is formed through the first precursor groove 228a. Thus, after forming the first, second, and third grooves in a stack 200 such as the stack 200 of FIG. 4 , the first surface of the first groove 228a may include the first exposed surface of the other second electrode layer 208′ and the first exposed surface of the second electrode layer 208. Similarly, the second surface of the second groove 228b may include the exposed surface of the other first electrode layer 204′ and the exposed surface of the first electrode layer 204. The third surface of the third groove may include the second exposed surface of the other second electrode layer 208′ and the exposed surface of the second electrode layer 208.

[0128] After forming the first, second, and third grooves in the stack 200, the Figure 4e The intermediate structure of the substrate 202 of the stack 200 is shown cut. Figure 4e The cleavage of the intermediate structure in Figure 3d For example, the intermediate structure may be cut along a first axis 240a and a second axis 240b (collectively indicated by reference numeral 240) aligned with the first groove 228a and the second groove 228b, respectively. The intermediate structure may also be cut along a third axis aligned with the third groove.

[0129] Cutting of intermediate structures Figure 4f The three batteries 242a-242c are collectively represented by reference numeral 242. The battery 242 may be similar to Figure 3e The batteries 142 are connected together to form a multi-battery energy storage device.

[0130] The above examples should be understood as illustrative examples. Further examples are contemplated. For example, a method similar to that of FIG. 4 may be used to form a Figure 3e A cell similar to cell 142 of the type shown in FIG. 1 , wherein a precursor recess at least partially filled with an electrically insulating material is formed prior to subsequent selective ablation of the electrically insulating material.

[0131] For ease of explanation, Figure 3d and Figure 4e A cut of the intermediate structure without the z-folding process is shown. However, it should be understood that in some cases, similar to Figure 3d and Figure 4e The intermediate structure can be subjected to a z-folding process to form a Figure 2The z-folded structure described is then subsequently cut to separate the intermediate structure into a battery. In this case, the electrically insulating materials 136, 236 in the grooves 128, 228 can be aligned in a z-folded arrangement. The intermediate structure can then be cut along an axis aligned with the electrically insulating materials 136, 236 (e.g., which corresponds to the axes 140, 240 aligned with the grooves 128, 228). Compared to examples where such a z-folded arrangement is not formed, this can further improve the efficiency of the method by reducing the number of cutting operations.

[0132] It should be understood that any feature described with respect to any one example can be used alone or in combination with other features described, and can also be used in combination with one or more features of any combination of any other examples or other examples. In addition, equivalents and modifications not described above may also be adopted without departing from the scope of the appended claims.

Claims

1. A method for manufacturing an energy storage device, the method comprising: providing a stack on a surface of a substrate, the stack comprising a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer, the first electrode layer being closer to the surface of the substrate than the second electrode layer; forming a first recess in a first side of the stack, the first side of the stack opposite a second side of the stack on the surface of the substrate, the first recess having a first depth and a first surface, the first surface including a first exposed surface of the second electrode layer, a first exposed surface of the first electrode layer, and a first exposed surface of the electrolyte layer; forming a second recess in the first side of the stack, the second recess having a second depth different from the first depth and a second surface, the second surface including a third exposed surface of the second electrode layer, a third exposed surface of the first electrode layer, and a third exposed surface of the electrolyte layer; and forming a third recess in the first side of the stack, the third recess having a third depth substantially the same as the first depth and a third surface including a second exposed surface of the second electrode layer, a second exposed surface of the first electrode layer, and a second exposed surface of the electrolyte layer, Wherein, the second groove is located between the first groove and the third groove, providing a first electrical insulator in the second groove, the first electrical insulator contacting the third exposed surface of the first electrode layer and the third exposed surface of the electrolyte layer without contacting at least a portion of the third exposed surface of the second electrode layer, the third exposed surface of the second electrode layer corresponding to a sidewall of the second groove; and A second electrical insulator is provided in the first and third grooves, wherein in the third groove the second electrical insulator contacts the second exposed surface of the second electrode layer and the second exposed surface of the electrolyte layer without contacting at least a portion of the second exposed surface of the first electrode layer.

2. The method according to claim 1, wherein: At least one of the first groove, the second groove, or the third groove is formed without cutting the substrate.

3. The method according to claim 1, wherein: The first groove is spaced apart from and substantially parallel to the second groove; and The second groove is spaced apart from and substantially parallel to the third groove.

4. The method according to any one of claims 1 to 3, wherein: At least one of the first depth of the first groove, the second depth of the second groove, or the third depth of the third groove is substantially perpendicular to a plane of a surface of the substrate.

5. The method according to any one of claims 1 to 3, wherein: Forming the first groove, forming the second groove, and forming the third groove use at least one laser beam directed to the first side of the substrate.

6. The method according to any one of claims 1 to 3, wherein: A first groove is formed through the second electrode layer and the electrolyte layer and exposes a first exposed surface of the second electrode layer; A second groove is formed through the second electrode layer, the electrolyte layer, and the first electrode layer, and exposes a third exposed surface of the first electrode layer; and The third groove is formed through the second electrode layer and the electrolyte layer and exposes a second exposed surface of the second electrode layer.

7. The method according to claim 6, wherein: forming a first groove without cutting the first electrode layer and without cutting the substrate; forming a second groove without cutting the substrate; and The third groove is formed without cutting the first electrode layer and without cutting the substrate.

8. The method according to any one of claims 1 to 3, comprising providing an electrically insulating material in at least one of the following: a first groove to insulate the first exposed surface of the second electrode layer from the first electrode layer; a second groove to insulate the third exposed surface of the first electrode layer from the second electrode layer; or The third groove is used to insulate the second exposed surface of the second electrode layer from the first electrode layer.

9. The method according to claim 8, comprising: After disposing the electrically insulating material in the second recess, a portion of the electrically insulating material is removed to expose a third exposed surface of the second electrode layer.

10. The method according to any one of claims 1 to 3, comprising: forming a first precursor groove, a second precursor groove, and a third precursor groove in a first side of the stack; and An electrically insulating material is disposed in the first precursor groove, the second precursor groove, and the third precursor groove, wherein: a first groove formed through the electrically insulating material in the first precursor groove; a second groove is formed through the electrically insulating material in the second precursor groove; and A third groove is formed through the electrically insulating material in the third precursor groove.

11. The method according to claim 10, wherein: The first precursor groove, the second precursor groove, and the third precursor groove are formed to have substantially the same depth as each other.

12. The method according to claim 10, wherein: the stack comprising a further first electrode layer, a further second electrode layer and a further electrolyte layer between the further first electrode layer and the further second electrode layer, the further first electrode layer being located between the second electrode layer and the further electrolyte layer; And at least one of the following: Forming the first groove includes: forming a first groove through the electrically insulating material in the first precursor groove to form a first groove having a first surface including a first exposed surface of a second electrode layer, and insulating a first exposed surface of another second electrode layer from the first groove by the electrically insulating material; and widening the first groove so that the first surface also includes a first exposed surface of another second electrode layer; Forming the second groove includes: forming a second groove through the electrically insulating material in the second precursor groove to form a second groove having a second surface including a third exposed surface of the first electrode layer, and insulating an exposed surface of another first electrode layer from the second groove by the electrically insulating material; and widening the second groove so that the second surface also includes an exposed surface of another first electrode layer; or Forming the third groove includes: forming a third groove through the electrically insulating material in the third precursor groove to form a third groove having a third surface including a second exposed surface of the second electrode layer, and insulating the second exposed surface of the other second electrode layer from the third groove by the electrically insulating material; and The third groove is widened so that the third surface further includes a second exposed surface of another second electrode layer.

13. The method according to claim 12, wherein: At least one of the following: After widening the first groove, the first portion of the first groove is narrower than the second portion of the first groove, and the first portion of the first groove is closer to the first side of the substrate than the second portion of the first groove; After widening the second groove, the first portion of the second groove is narrower than the second portion of the second groove, and the first portion of the second groove is closer to the first side of the substrate than the second portion of the second groove; and After widening the third groove, the first portion of the third groove is narrower than the second portion of the third groove, and the first portion of the third groove is closer to the first side of the substrate than the second portion of the third groove.

14. The method of claim 12, wherein: the stack comprising a further first electrode layer, a further second electrode layer and a further electrolyte layer between the further first electrode layer and the further second electrode layer, the further first electrode layer being located between the second electrode layer and the further electrolyte layer; The first precursor groove, the second precursor groove, and the third precursor groove are each formed through another second electrode layer, another electrolyte layer, another first electrode layer, the second electrode layer, the electrolyte layer, and the first electrode layer.

15. The method according to any one of claims 1 to 3, wherein: The stack comprises a further first electrode layer, a further second electrode layer and a further electrolyte layer between the further first electrode layer and the further second electrode layer, the further first electrode layer being located between the second electrode layer and the further electrolyte layer; and at least one of: The first surface comprises a first exposed surface of another second electrode layer; The second surface comprises an exposed surface of another first electrode layer; or The third surface includes a second exposed surface of another second electrode layer.

16. The method according to any one of claims 1 to 3, wherein: A first distance between the first groove and the second groove in a direction parallel to the plane of the substrate is substantially the same as a second distance between the second groove and the third groove in a direction parallel to the plane of the substrate.

17. An energy storage device manufactured according to the method of any one of claims 1 to 16, comprising: A stack on a surface of a substrate, the stack comprising: a first electrode layer; a second electrode layer; and an electrolyte layer between the first electrode layer and the second electrode layer, the first electrode layer being closer to the surface of the substrate than the second electrode layer; a first electrical insulator in contact with a third exposed surface of the first electrode layer and a third exposed surface of the electrolyte layer without contacting at least a portion of a third exposed surface of the second electrode layer, the third exposed surface of the second electrode layer corresponding to a sidewall of the second recess; and A second electrical insulator contacts the second exposed surface of the second electrode layer and the second exposed surface of the electrolyte layer and does not contact at least a portion of the second exposed surface of the first electrode layer.

18. The energy storage device according to claim 17, wherein: The first electrical insulator is arranged on a first side of the stack, and the second electrical insulator is arranged on a second side of the stack opposite the first side.

19. The energy storage device according to claim 18, wherein: The first side of the stack and the second side of the stack are both substantially perpendicular to the plane of the surface of the substrate.

20. An energy storage device according to any one of claims 17 to 19, wherein: The thickness of the substrate in a direction perpendicular to a plane of a surface of the substrate is substantially equal to or greater than the thickness of the stack in a direction perpendicular to a plane of the surface of the substrate.

21. An energy storage device according to any one of claims 17 to 19, wherein: The stack comprises: another first electrode layer; another second electrode layer; and a further electrolyte layer between the further first electrode layer and the further second electrode layer, the further first electrode layer being located between the second electrode layer and the further electrolyte layer, Wherein, the energy storage device comprises: another first electrical insulator in contact with the second exposed surface of the another second electrode layer and the second exposed surface of the another electrolyte layer and not in contact with at least a portion of the second exposed surface of the another first electrode layer; and Another second electrical insulator contacts the first exposed surface of the other first electrode layer and the first exposed surface of the other electrolyte layer without contacting at least a portion of the first exposed surface of the other second electrode layer.