Integrated packaging structure

Abstract

The present invention relates to an integrated packaging structure, which includes a main substrate, a first module, a second module, a cavity element and a large-size device. The main substrate includes a first surface of the main substrate and a second surface of the main substrate that are arranged opposite to each other. The first module and the second module are stacked. The stacked first module and the second module, the cavity element and the large-size device are horizontally arranged on the first surface of the main substrate and are electrically connected to the main substrate respectively. Through the above arrangement, the current integrated packaging structure needs to be further designed with high density, miniaturization, multi-dimensionality and multiple requirements.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to an integrated packaging structure. Background Art

[0002] With the development of semiconductor technology, especially the advent of the 5G communication era, not only is the demand for electronic devices becoming increasingly miniaturized and thinner, but the demand for heterogeneous integration of different components is also increasing. Therefore, semiconductor heterogeneous integration packaging is gradually becoming a packaging trend.

[0003] In order to meet the needs of multi-frequency and multi-bandwidth applications, heterogeneous integrated packaging structures need to be further high-density, miniaturized, and multi-dimensional. There are large-size packaging devices with high heights in the packaging structure, such as large-value inductance devices, QFN, LGA or BGA, etc., and there are also cavity components such as filters that are more sensitive to stress; in addition, the module components containing various chips are generally large in area and volume, so the integrated packaging structure needs to be arranged reasonably to meet the needs of various devices and improve the overall integration. Summary of the invention

[0004] The object of the present invention is to provide an integrated packaging structure to solve the current demand for integrated packaging structures to be further designed with high density, miniaturization, multi-dimensionality and multiple requirements.

[0005] In order to achieve one of the above-mentioned purposes of the invention, one embodiment of the present invention provides an integrated packaging structure, including a main substrate, a first module, a second module, a cavity element and a large-size device, the main substrate including a first surface of the main substrate and a second surface of the main substrate arranged opposite to each other, the first module and the second module are stacked, and the stacked first module and the second module and the cavity element and the large-size device are horizontally arranged on the first surface of the main substrate and are electrically connected to the main substrate respectively.

[0006] As a further improvement of one embodiment of the present invention, the integrated packaging structure also includes a plastic encapsulation layer covering the first surface of the main substrate and encapsulating the first module, the second module, the cavity element and the large-size device, the plastic encapsulation layer including a first surface of the plastic encapsulation layer away from the main substrate and a second surface of the plastic encapsulation layer close to the main substrate, the first surface of the plastic encapsulation layer is provided with an open groove extending toward the cavity element, and at least a portion of the open groove is positioned opposite to the cavity element.

[0007] As a further improvement of an embodiment of the present invention, the opening grooves are inverted trapezoidal opening grooves, and the inverted trapezoidal opening grooves are symmetrically distributed along the central axis of the cavity element.

[0008] As a further improvement of an embodiment of the present invention, the opening groove is a step-shaped opening groove located at a convex corner of the plastic packaging layer.

[0009] As a further improvement of one embodiment of the present invention, the integrated packaging structure also includes a first shielding layer and a second shielding layer, the first shielding layer covers the first module, and the second shielding layer covers the first module, the second module, the cavity element, the large-size device and the main substrate; the first shielding layer and the second shielding layer are made of different materials, or the first shielding layer and the second shielding layer are made of different structures, or both the first shielding layer and the second shielding layer are made of different materials and structures.

[0010] As a further improvement of one embodiment of the present invention, the integrated packaging structure also includes a hollow adapter plate, which is stacked between the first module and the main substrate and electrically connects the first module to the main substrate, and the second module is located in the hollow part of the adapter plate.

[0011] As a further improvement of an embodiment of the present invention, one end of the adapter plate is electrically connected to the first shielding layer and the other end is electrically connected to the ground end of the main substrate.

[0012] As a further improvement of an embodiment of the present invention, the adapter board is an organic substrate type adapter board, an encapsulation type adapter board, or a stacked and re-wiring heterogeneous laminate type adapter board.

[0013] As a further improvement of an embodiment of the present invention, the integrated packaging structure further includes a third module disposed on the second surface of the main substrate, and at least a portion of the third module is located opposite to the second module.

[0014] As a further improvement of one embodiment of the present invention, the second module is a SOC chip, the third module is a storage module, and the integrated packaging structure further includes a third shielding layer covering the SOC chip and a fourth shielding layer covering the storage module.

[0015] As a further improvement of an embodiment of the present invention, the main substrate is an organic substrate, or a homogeneous or heterogeneous stack of wafers and board-level stacking and rewiring using a film or glue coating.

[0016] Compared with the prior art, the beneficial effect of the present invention lies in that on the main substrate of the integrated packaging structure, the module components are stacked and then horizontally arranged with large-size devices, cavity components, etc. The overall reasonable layout can further miniaturize and densify the integrated packaging structure and meet the packaging requirements of various types of packaging devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1is a schematic diagram of the integrated packaging structure in Embodiment 1 of the present invention;

[0018] Figure 2 is a schematic structural diagram of the first module and the first shielding layer in Embodiment 1 of the present invention;

[0019] Figure 3 is a schematic structural diagram of the second module and the third shielding layer in Embodiment 1 of the present invention;

[0020] Figure 4 is a schematic structural diagram of a cavity element in Example 1 of the present invention;

[0021] Figure 5 is a schematic diagram of the structure of a large-size device in Example 1 of the present invention;

[0022] Figure 6 is a schematic structural diagram of the adapter board in Embodiment 1 of the present invention;

[0023] Figure 7 is a schematic diagram of an integrated packaging structure in Embodiment 2 of the present invention;

[0024] Figure 8 is a schematic diagram of an integrated packaging structure in Embodiment 3 of the present invention;

[0025] Fig. 9 is a schematic structural diagram of the third module and the fourth shielding layer in Embodiment 3 of the present invention;

[0026] Fig.10 It is a schematic diagram of the integrated packaging structure in Example 4 of the present invention. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in combination with the specific implementation methods of this application and the corresponding drawings. Obviously, the described implementation methods are only part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0028] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptors used herein shall be interpreted accordingly. For example, in the present invention, for the convenience of description, in the packaging structure, the side of the substrate close to the chip is the front side of the substrate, and the side away from the chip is the back side of the substrate; the direction of the plane where the substrate is located is the horizontal direction, and the thickness direction of the substrate is the vertical direction or perpendicular direction.

[0030] like Figures 1 to 8 As shown, an embodiment of the present invention provides an integrated packaging structure, including a main substrate 2, a first module 11, a second module 12, a cavity component 14 and a large-size device 15, the main substrate 2 includes a main substrate first surface 21 and a main substrate second surface 22 arranged opposite to each other, the first module 11 and the second module 12 are stacked, and the stacked first module 11 and the second module 12 and the cavity component 14 and the large-size device 15 are horizontally arranged on the main substrate first surface 21 and are electrically connected to the main substrate 2 respectively.

[0031] Specifically, in the integrated packaging structure, the main substrate 2 includes a main substrate first surface 21 and an oppositely arranged main substrate second surface 22, the main substrate first surface 21 is mainly used to set various packaging components, and the opposite main substrate first surface 21 is mainly used to connect devices such as PCB boards below the integrated packaging structure; on the main substrate first surface 21, the first module 11 and the second module 12 are stacked and arranged to form a stacked module combination, the cavity component 14 and the large-size device 15 are horizontally arranged with the stacked module combination, and the cavity component 14 and the large-size device 15 are electrically connected to the main substrate 2 with the stacked module combination respectively; thus, by stacking at least once, the area and space occupied by two or more modules in the integrated packaging structure are reduced, and at the same time, the large-size device 15 with a higher height and the stress-sensitive cavity component 14 are horizontally arranged with the stacked module combination, which can reasonably reduce the overall height of the integrated packaging structure after the internal packaging components are combined, so that the overall space of the integrated packaging structure is more compact and the internal structure is more integrated.

[0032] Optionally, the stacking form of the first module 11 and the second module 12 is not limited, and the first module 11 can be arranged on the first surface 21 of the main substrate, and the second module 12 is stacked above the first module 11; or the second module 12 is arranged on the first surface 21 of the main substrate, and the first module 11 is stacked above the second module 12. At the same time, the horizontal arrangement form of the cavity element 14 and the large-size device 15 and the stacked module combination is not limited, and the cavity element 14 and the large-size device 15 can be horizontally arranged on both sides of the stacked module combination respectively or simultaneously arranged horizontally on one side of the stacked module combination.

[0033] Optionally, the large-size device 15 can be one or more of a large-value inductor device, a QFN, LGA, BGA or other large-size packaged device with a relatively high height, without limitation; the cavity component 14 can be a packaged device such as a filter.

[0034] Furthermore, the integrated packaging structure also includes a plastic encapsulation layer 4 covering the first surface 21 of the main substrate and encapsulating the first module 11, the second module 12, the cavity element 14 and the large-size device 15, the plastic encapsulation layer 4 includes a first plastic encapsulation layer surface 41 away from the main substrate 2 and a second plastic encapsulation layer surface 42 close to the main substrate 2, the first plastic encapsulation layer surface 41 is provided with an open groove 6 extending toward the cavity element 14, and at least a portion of the open groove 6 is located opposite to the cavity element 14.

[0035] Furthermore, the opening grooves 6 are inverted trapezoidal opening grooves 6 , and the inverted trapezoidal opening grooves 6 are symmetrically distributed along the central axis of the cavity element 14 .

[0036] Specifically, the plastic encapsulation layer 4 covers the first surface 21 of the main substrate, and at the same time encapsulates all the packaging components on the first surface 21 of the main substrate, including the first module 11, the second module 12, the cavity component 14 and the large-size device 15; the upper surface of the plastic encapsulation layer 4 away from the main substrate 2 is the first surface 41 of the plastic encapsulation layer, and the lower surface close to the main substrate 2 is the first surface 41 of the plastic encapsulation layer.

[0037] The cavity of the cavity element 14 is generally arranged upward. In order to prevent the plastic sealing layer 4 from causing greater stress damage to the cavity element 14 due to thermal expansion and contraction, an open groove 6 is opened at the position of the first surface 41 of the plastic sealing layer corresponding to the cavity element 14, and at least part of the open groove 6 is directly above the cavity element 14, so that the plastic sealing layer 4 above the cavity element 14 is hollowed out, thereby reducing the stress of the plastic sealing layer 4 on the cavity in the cavity element 14 due to thermal expansion and contraction, and avoiding the cavity element 14 from being damaged by adverse stress.

[0038] In the present embodiment, the opening groove 6 is completely located above the cavity element 14 and corresponds to the position of the cavity, that is, the opening groove 6 is symmetrically distributed along the central axis of the cavity element 14, thereby evenly reducing the stress on the cavity element 14, and achieving the best stress relief effect; at the same time, the shape of the opening groove 6 is an inverted trapezoid, and after the plastic sealing layer 4 is formed, the inverted trapezoidal opening groove 6 makes the demolding process quick and convenient.

[0039] Optionally, the shape of the opening groove 6 is not limited, as long as it is set to facilitate the demoulding operation, and the opening groove 6 can also be formed by laser grooving after the plastic sealing layer 4 is formed. Alternatively, the opening groove 6 can also be set in the form of a multi-hole array.

[0040] Furthermore, the opening groove 6 is a step-shaped opening groove 6 located at a convex corner of the plastic sealing layer 4 .

[0041] Specifically, the convex corners of the plastic packaging layer 4 can also be cut to form a step-shaped opening groove 6; wherein, the step surface height of the step-shaped opening groove 6 is not limited, and the step-shaped opening groove 6 can be located above the cavity element 14, so that the step surface height is higher than the height of the primary packaging surface in the cavity element 14; the step-shaped opening groove 6 can also be arranged on the outside of the cavity element 14 in an avoidance form, so that the step surface height is lower than the height of the primary packaging surface in the cavity element 14.

[0042] Furthermore, the integrated packaging structure also includes a first shielding layer 81 and a second shielding layer 82, the first shielding layer 81 covers the first module 11, and the second shielding layer 82 covers the first module 11, the second module 12, the cavity element 14, the large-size device 15 and the main substrate 2; the first shielding layer 81 and the second shielding layer 82 are made of different materials, or the first shielding layer 81 and the second shielding layer 82 are made of different structures, or both the first shielding layer 81 and the second shielding layer 82 are made of different materials and structures.

[0043] Furthermore, the integrated packaging structure also includes a hollow adapter plate 16 , which is stacked between the first module 11 and the main substrate 2 and electrically connects the first module 11 to the main substrate 2 , and the second module 12 is located in the hollow portion of the adapter plate 16 .

[0044] Specifically, a first shielding layer 81 is provided on the periphery of the first module 11, and the first shielding layer 81 covers the first module 11 to prevent it from being interfered; a second shielding layer 82 is provided on the periphery of the integrated packaging structure as a whole, and the second shielding layer 82 covers all the packaging components on the main substrate 2. At the same time, the second shielding layer 82 is electrically connected to the ground terminal of the main substrate 2 to achieve electromagnetic shielding and protection of the packaging components on the main substrate 2. According to the specific multi-frequency application, the structure of the shielding layer is not limited, and can be a single layer of metal, a multi-layer metal layer, a conductive glue or a metal cover, etc.; the material of the two shielding layers is also not limited, and can be one or more combinations of aluminum, copper, chromium, tin, gold, silver, nickel or stainless steel. The structural type and material type of the first shielding layer 81 and the second shielding layer 82 are not limited, and the materials of the two can be different, the structures of the two can be different, or the materials and structures of the two can be different, so as to achieve the best EMI shielding effect and the best cost.

[0045] like Figure 6As shown, the integrated packaging structure also includes an adapter board 16, which is a hollow structure; the first module 11 and the adapter board 16 are stacked on the main substrate 2, and the second module 12 is arranged at the hollow part of the adapter board 16, that is, on the first surface 21 of the main substrate, the adapter board 16 is nested in the second module 12, and the first module 11 is stacked on this nested structure; at the same time, the adapter board 16 is provided with a conductive structure, which can electrically connect the first module 11 and the main substrate 2.

[0046] Therefore, the hollow structure adapter plate 16 can not only nest the second module 12 and support the first module 11, but also electrically connect the first module 11 to the main substrate 2, and be arranged as a whole on the first surface 21 of the main substrate, so that the packaging structure is compactly integrated and the electrical functions are complete.

[0047] Optionally, the adapter plate 16 is not limited in form, and may be a frame-shaped adapter plate, a U-shaped adapter plate, or an I-shaped adapter plate; when the adapter plate 16 is an I-shaped adapter plate, the number is not limited, and may be two or more.

[0048] Furthermore, one end of the adapter 16 is electrically connected to the first shielding layer 81 and the other end is electrically connected to the ground end of the main substrate 2 .

[0049] Specifically, the adapter board 16 can also become a component of the EMI shielding protection functional structure; when the adapter board 16 is stacked with the first module 11 and the first module 11 is electrically connected to the main substrate 2, the adapter board 16 can be electrically connected to the first shielding layer 81, and at the same time, the adapter board 16 is electrically connected to the ground terminal on the main substrate 2; thus, the first shielding layer 81 can be electrically connected to the ground terminal on the main substrate 2, so that the first shielding layer 81 can effectively perform EMI electromagnetic shielding on the first module 11 to achieve a protection function.

[0050] Furthermore, the adapter board 16 is an organic substrate adapter board, an encapsulation adapter board, or a stacked and rewired heterogeneous laminate adapter board.

[0051] Specifically, the type of the adapter plate 16 is not limited, and can be one of the above three types. Among them, the encapsulation material used in the encapsulation type adapter plate can be a composite material containing fillers such as epoxy resin or phenolic resin.

[0052] Optionally, when the number of the adapter plates 16 is two or more, the type thereof may be one or more or a combination of more of the above three types.

[0053] Optionally, the three-dimensional transfer structure in the transfer board can be designed according to actual conditions, and can be I-shaped or T-shaped; the transfer board can be designed to have only electrical transfer wiring, or it can have embedded devices.

[0054] Furthermore, the integrated packaging structure further includes a third module 13 disposed on the second surface 22 of the main substrate, and at least a portion of the third module 13 is located opposite to the second module 12 .

[0055] Furthermore, the second module 12 is a SOC chip, the third module 13 is a storage module, and the integrated packaging structure further includes a third shielding layer 83 covering the SOC chip and a fourth shielding layer 84 covering the storage module.

[0056] like Figures 7 and 8 As shown, a third module 13 is also provided on the second surface 22 of the main substrate, and the position of the third module 13 at least partially corresponds to the position of the second module 12. Thus, multiple packaged chips can be arranged on both sides of the main substrate 2, not just limited to one side, and the area and size of the integrated packaging structure can be further reduced.

[0057] In the embodiment of the present invention, the second module 12 and the third module 13 are respectively a SOC chip 12 and a storage module 13. The SOC chip stacked on the first surface 21 of the main substrate is also covered with a third shielding layer 83, and the storage module disposed on the second surface 22 of the main substrate is also covered with a fourth shielding layer 84.

[0058] In order to meet the multi-frequency and multi-bandwidth applications of the integrated packaging structure, the materials and structures of the first shielding layer 81, the second shielding layer 82, the third shielding layer 83 and the fourth shielding layer 84 covering the first module, the main module, the SOC chip and the storage module are not limited. Specific selection can be made according to the multi-frequency application and actual conditions, so as to adopt the same or different materials or structures or various combinations to achieve the best EMI effect and cost of the overall integrated packaging structure.

[0059] In addition, the arrangement positions of the SOC chip 12 and the storage module 13 can also be swapped and adjusted according to factors such as their own sizes, the actual space size inside the integrated packaging structure, specific processes, and optimal costs. Similarly, the arrangement positions of the first module 11 and the storage module 13 can also be swapped and adjusted according to factors such as their own sizes, the actual space size inside the integrated packaging structure, specific processes, and optimal costs.

[0060] Optionally, the second surface 22 of the main substrate may also be provided with a connection portion 9 for connecting to the PCB below, and the connection portion 9 may be a solder ball 9A or an adapter plate 9B to electrically connect the main substrate 2 to the PCB; the connection portion 9 may be horizontally arranged on both sides of the third module 13 to support the main substrate 2 and all packaged components above the main substrate 2. At the same time, the second surface 22 of the main substrate may also be provided with a main substrate second surface plastic layer, and this plastic layer may at least encapsulate all sides of the third module 13 and all sides of the connection portion 9.

[0061] Furthermore, the main substrate 2 is an organic substrate, or a homogeneous or heterogeneous laminate of wafers and board-level stacking and rewiring using a film or glue-coated wafer.

[0062] Specifically, the type of the main substrate 2 is not limited, and it can be an organic substrate, which is formed by pressing multiple layers of copper layers and resin, and then the required circuit pattern can be obtained through drilling, chemical copper plating, electroplating copper, etching and other processing; the main substrate 2 can also be a homogeneous or heterogeneous laminate, which is composed of homogeneous or heterogeneous organic dielectric materials and metal circuits, and the circuit pattern can be realized by rewiring the circuits layer by layer.

[0063] For easier understanding, the following example is described in detail:

[0064] Example 1

[0065] like Figures 1 to 6 As shown, in the integrated packaging structure in this embodiment, the main substrate 2 includes a main substrate first surface 21 and a main substrate second surface 22 arranged opposite thereto.

[0066] The frame-shaped adapter plate 16 is nested in the second module 12 and then stacked with the first module 11 . The cavity element 14 and the large-size device 15 are horizontally arranged on both sides of the stacked first module 11 and the second module 12 .

[0067] The first shielding layer 81 covers the first module 11 , and the second shielding layer 82 covers the main substrate 2 and all packaged components on the main substrate 2 ; at the same time, the second shielding layer 82 is electrically connected to the ground terminal of the main substrate 2 , and the first shielding layer 81 is also electrically connected to the ground terminal on the main substrate 2 through the adapter plate 16 .

[0068] The plastic encapsulation layer 4 covers the first surface 21 of the main substrate and encapsulates all the packaged components on the first surface 21 of the main substrate. An opening groove 6 is formed on the first surface 41 of the plastic encapsulation layer, at least a portion of which is directly opposite to the cavity component 14.

[0069] The large-size device 15 is a large-value inductor device, the cavity component 14 is a filter component, the second module 12 is a SOC chip, and the first module 11 is provided with two or more packaged components.

[0070] Example 2

[0071] like Figure 7 As shown, the integrated packaging structure in this embodiment is different from that in Embodiment 1 in that the opening groove 6 is a stepped opening groove, and the stepped opening groove 6 is located at two convex corners of the plastic packaging layer 4, that is, the two stepped opening grooves 6 can be formed by cutting the two convex corners of the plastic packaging layer 4.

[0072] Among them, the upper surface of the cavity element 14 is a primary packaging surface, and the stepped opening groove 6 arranged close to the cavity element 14 is located above the primary packaging surface. The height of the step surface is higher than the height of the upper surface of the cavity element 14, so as to reduce the plastic packaging material above the primary packaging surface in the cavity element 14, and reduce the stress influence of the plastic packaging layer on the cavity element 14 under the action of thermal expansion and contraction.

[0073] In addition, a step-shaped opening groove 6 is also provided near the large-size device 15. The step-shaped opening groove 6 is located on the outside of the large-size device 15, and the height of the step surface is lower than the height of the upper surface of the large-size device 15, thereby reducing the plastic packaging material on the outside of the large-size device 15 and reducing the impact of stress.

[0074] Example 3

[0075] like Figures 8 to 9 As shown, the integrated packaging structure in this embodiment is different from that in Embodiment 1 in that the second surface 22 of the main substrate is further provided with a third module 13 corresponding to at least part of the position of the second module 12, and connecting portions 9 for connecting to the PCB board below are horizontally arranged on both sides of the third module 13. At the same time, the first surface 41 of the plastic sealing layer is not provided with an opening groove 6.

[0076] The connecting portion 9 is a solder ball 9A, and the third module 13 is a memory chip.

[0077] Meanwhile, a main substrate second surface plastic layer (not shown) may be provided on the main substrate second surface 22 , and the plastic layer may at least cover all side surfaces of the third module 13 and all side surfaces of the connecting portion 9 .

[0078] Example 4

[0079] like Fig.10 As shown, the integrated packaging structure in this embodiment is different from that in Embodiment 3 in that the connecting portion 9 is a transfer board 9B.

[0080] In summary, in the integrated packaging structure provided by the present invention, the main substrate 2 includes a main substrate first surface 21 and an oppositely arranged main substrate second surface 22. The first module 11 and the second module 12 are stacked and then horizontally arranged on the first surface 21 of the main substrate with the cavity element 14 and the large-size device 15. Therefore, through reasonable stacking and horizontal arrangement, the overall space of the integrated packaging structure can be made more compact and the internal structure more integrated.

[0081] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0082] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention and are not intended to limit the scope of protection of the present invention. All equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. An integrated packaging structure, comprising a main substrate, a first module, a second module, a cavity element and a large-size device, wherein the main substrate comprises a first surface of the main substrate and a second surface of the main substrate arranged opposite to each other, characterized in that: The first module and the second module are stacked, and the stacked first module and the second module, the cavity element, and the large-size device are horizontally arranged on the first surface of the main substrate and are electrically connected to the main substrate respectively; It also includes a first shielding layer and a second shielding layer, wherein the first shielding layer covers the first module, and the second shielding layer covers the first module, the second module, the cavity element, the large-size device and the main substrate; It also includes a hollow adapter plate, which is stacked between the first module and the main substrate and electrically connects the first module to the main substrate, and the second module is located in the hollow part of the adapter plate; one end of the adapter plate is electrically connected to the first shielding layer and the other end is electrically connected to the ground end of the main substrate, and the integrated packaging structure also includes a plastic packaging layer covering the first surface of the main substrate and encapsulating the first module, the second module, the cavity element and the large-size device, the first shielding layer is located between the plastic packaging layer and the first module, and the second shielding layer is connected to the outer surface of the plastic packaging layer and electrically connected to the ground end of the main substrate.

2. The integrated packaging structure according to claim 1, characterized in that: The plastic encapsulation layer includes a first surface of the plastic encapsulation layer away from the main substrate and a second surface of the plastic encapsulation layer close to the main substrate. The first surface of the plastic encapsulation layer is provided with an open groove extending toward the cavity element, and at least part of the open groove is located opposite to the cavity element.

3. The integrated packaging structure according to claim 2, characterized in that: The opening grooves are inverted trapezoidal opening grooves, and the inverted trapezoidal opening grooves are symmetrically distributed along the central axis of the cavity element.

4. The integrated packaging structure according to claim 2, characterized in that: The opening groove is a step-shaped opening groove located at the convex corner of the plastic sealing layer.

5. The integrated packaging structure according to claim 1, characterized in that: The first shielding layer and the second shielding layer are made of different materials, or the first shielding layer and the second shielding layer are made of different structures, or both the first shielding layer and the second shielding layer are made of different materials and structures.

6. The integrated packaging structure according to claim 1, characterized in that: The adapter board is an organic substrate adapter board, an encapsulation adapter board, or a stacked and rewired heterogeneous laminate adapter board.

7. The integrated packaging structure according to claim 1, characterized in that: The integrated packaging structure further includes a third module disposed on the second surface of the main substrate, and at least a portion of the third module is located opposite to the second module.

8. The integrated packaging structure according to claim 7, characterized in that: The second module is a SOC chip, the third module is a storage module, and the integrated packaging structure further includes a third shielding layer covering the SOC chip and a fourth shielding layer covering the storage module.

9. The integrated packaging structure according to claim 1, characterized in that: The main substrate is an organic substrate, or a homogeneous or heterogeneous laminate of wafers and board-level stacking and rewiring using film-attached or glue-coated wafers.

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