Transfer device, transfer system and method

Abstract

The embodiment of the present invention discloses a transfer device, a transfer system and a method, including a transfer substrate, an excitation part and a flexible film, wherein the excitation part is located between the transfer substrate and the flexible film, and the excitation part is used to generate gas under the excitation of an excitation source to generate a thrust at least in the thickness direction of the transfer substrate, so that the flexible film is deformed at the position where the thrust is applied, so that the contact area between the chips to be transferred in the chip array to be transferred and the flexible film is reduced, and finally the chip array to be transferred is separated from the transfer device, so as to realize the mass transfer of the chips to be transferred. The setting of the flexible film can play a role of buffering and uniform stress, so that at least part of the chips to be transferred in the chip array to be transferred can be separated to the position of the target substrate that needs to be aligned under the action of uniform stress, thereby improving the transfer accuracy. The setting of the flexible film can also prevent the gas generated by the excitation part from corroding the chips to be transferred and other damages.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a transfer device, a transfer system and a transfer method. Background Art

[0002] At present, Micro Light Emitting Diode (Micro LED) is known as the future display technology due to its high response speed, high color gamut, high brightness, and long life. Liquid Crystal Display (LCD) combined with Mini Light Emitting Diode (MINI LED) backlight technology, quantum technology or high color rendering technology is also a means to maintain the life and brightness advantages of Organic light-emitting diode (OLED) while reducing its relative disadvantages in contrast and color gamut.

[0003] At present, one of the bottlenecks of mass transfer of the above technologies is that the technologies currently used are mechanical punching, stamping, electrostatic, fluid assembly, etc. Due to the problems of transfer efficiency, yield and precision, it is difficult to support the mass production and popularization of Micro LED and MINILED technologies.

[0004] Therefore, providing a device to achieve mass transfer of small-sized devices such as Micro LED and MINI LED has become an urgent problem to be solved. Summary of the invention

[0005] The invention provides a transfer device, a transfer system and a transfer method to realize the mass transfer of small-size chips.

[0006] In a first aspect, an embodiment of the present invention provides a transfer device, comprising: a transfer substrate, an excitation portion and a flexible film, wherein the excitation portion is located between the transfer substrate and the flexible film, and the excitation portion is used to generate gas under the excitation of an excitation source to generate a thrust at least in the thickness direction of the transfer substrate, so as to deform at least a portion of the flexible film.

[0007] Optionally, the transfer substrate has a plurality of grooves;

[0008] The excitation part is located in the groove.

[0009] The flexible film is located on the surface of the transfer substrate having the grooves.

[0010] Optionally, the cross-section of the groove is rectangular, trapezoidal or arc-shaped; preferably, the cross-section of the groove is parabolic.

[0011] Optionally, the flexible film is a non-adhesive material, and the transfer device further comprises a first adhesive layer and a second adhesive layer, the first adhesive layer is located between the flexible film and the transfer substrate, and the second adhesive layer is located on a side of the flexible film away from the transfer substrate;

[0012] Alternatively, the material of the flexible film is an adhesive material.

[0013] Optionally, the excitation source is an electromagnetic wave energy source, a heat source or a chemical source, wherein the chemical source includes chemical substances.

[0014] Optionally, the excitation source is an electromagnetic wave energy source, and at least one side of the excitation portion is transparent to electromagnetic waves of a set wavelength emitted by the electromagnetic wave energy source, and the electromagnetic waves of the set wavelength are used to excite the excitation portion.

[0015] Optionally, at least one of the flexible film and the transfer substrate is transparent to electromagnetic waves of a set wavelength;

[0016] Optionally, an electromagnetic wave energy absorption film is provided on a side of the structure capable of transmitting electromagnetic waves of a set wavelength away from the excitation part, and the electromagnetic wave energy absorption film is used to absorb at least electromagnetic waves of a set wavelength, wherein the structure capable of transmitting electromagnetic waves of a set wavelength is a flexible film or a transfer substrate;

[0017] Optionally, the transfer substrate is transparent to electromagnetic waves of a set wavelength;

[0018] Optionally, the flexible film is permeable to electromagnetic waves of a set wavelength, or the flexible film is not permeable to electromagnetic waves of a set wavelength.

[0019] Optionally, the excitation part includes a main material and an absorption material for absorbing the excitation energy of the excitation source.

[0020] In a second aspect, an embodiment of the present invention further provides a transfer system, comprising the transfer device provided in the first aspect; and also comprising a chip array to be transferred, a target substrate and an excitation source;

[0021] The chip array to be transferred is located on a side of the transfer substrate of the transfer device where the excitation unit is provided, and the chip array to be transferred is located on a side of the excitation unit away from the transfer substrate;

[0022] The target substrate is located at a side of the chip array to be transferred away from the transfer device and is separated from the chip array to be transferred;

[0023] The excitation source is used to excite the excitation part to generate gas to generate thrust at least in the thickness direction of the transfer substrate, so as to deform at least part of the flexible film and separate at least part of the chips to be transferred in the chip array from the flexible film of the transfer device to the target substrate.

[0024] Optionally, the excitation source is located on a side of the transfer device away from the chip array to be transferred.

[0025] Optionally, the transfer substrate has a plurality of grooves, and the excitation part is located in the grooves;

[0026] The chip array to be transferred includes a plurality of chips to be transferred, and in the thickness direction of the transfer substrate, the vertical projection of each chip to be transferred on the substrate to be transferred covers at least one groove;

[0027] Optionally, a vertical projection of each chip to be transferred on the substrate to be transferred covers at least two grooves.

[0028] In a third aspect, an embodiment of the present invention further provides a transfer method, including:

[0029] An excitation source is used to excite the excitation part on the transfer substrate, so that the excitation part generates gas to generate a thrust at least along the thickness direction of the transfer substrate, so that at least part of the position of the flexible membrane is deformed, so that at least part of the chips to be transferred in the chip array to be transferred are separated from the flexible membrane of the transfer device to the target substrate.

[0030] Optionally, exciting the exciting part in the groove of the transfer substrate by an exciting source so that the exciting part generates gas to generate a thrust at least in the thickness direction of the transfer substrate, so that at least a part of the position of the flexible film is deformed, so that at least part of the chips to be transferred in the chip array are separated from the flexible film of the transfer device to the target substrate, including:

[0031] The transfer device is placed with a surface having a flexible membrane facing the ground, and an excitation source is used to excite an excitation portion in the groove of the transfer substrate so that the excitation portion generates gas to generate a thrust at least in a direction perpendicular to the thickness of the transfer substrate, so that at least part of the chips to be transferred in the chip array are separated from the flexible membrane of the transfer device to the target substrate under the action of the thrust and gravity.

[0032] The transfer device, transfer system and method provided by the embodiment of the present invention include a transfer substrate, an excitation part and a flexible film, wherein the excitation part is located between the transfer substrate and the flexible film, and the excitation part is used to generate gas under the excitation of an excitation source to generate a thrust at least in the thickness direction of the transfer substrate, so that the flexible film is deformed at the position where the thrust is applied, thereby reducing the contact area between the chips to be transferred in the chip array and the flexible film, and finally separating the chip array from the transfer device, thereby realizing the mass transfer of the chips to be transferred in the chip array. The setting of the flexible film can play a role in buffering and uniform stress, thereby making the force applied to each position of the chip array to be transferred more uniform, so that at least part of the chips to be transferred in the chip array to be transferred can be separated to the position of the target substrate that needs to be aligned under the action of uniform stress, thereby improving the transfer accuracy. In addition, the setting of the flexible film can reduce the contact between the gas generated by the excitation part and the chip to be transferred, thereby avoiding the corrosion and other damages to the chip to be transferred by the gas generated by the excitation part. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic structural diagram of a transfer device provided by an embodiment of the present invention;

[0034] Figure 2 is a schematic structural diagram of another transfer device provided by an embodiment of the present invention;

[0035] Figure 3 is a schematic structural diagram of another transfer device provided by an embodiment of the present invention;

[0036] Figure 4 is a schematic structural diagram of another transfer device provided by an embodiment of the present invention;

[0037] Figure 5 is a schematic structural diagram of another transfer device provided by an embodiment of the present invention;

[0038] Figure 6 is a schematic structural diagram of another transfer device provided by an embodiment of the present invention;

[0039] Figure 7 is a schematic structural diagram of another transfer device provided by an embodiment of the present invention;

[0040] Figure 8 is a structural schematic diagram of a transfer system provided by an embodiment of the present invention;

[0041] Fig. 9 is a schematic diagram of the chip to be transferred being separated from the transfer device after the excitation source excites the excitation part in an embodiment of the present invention;

[0042] Fig.10 is a structural schematic diagram of a transfer system provided by an embodiment of the present invention;

[0043] Fig.11 is a flow chart of a transfer method provided by an embodiment of the present invention;

[0044] Fig.12 It is a schematic diagram of transferring a chip array to be transferred provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0045] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0046] An embodiment of the present invention provides a transfer device, Figure 1 is a schematic diagram of a transfer device provided by an embodiment of the present invention, with reference to Figure 1 The transfer device includes: a transfer substrate 110, an excitation portion 120 and a flexible film 130, wherein the excitation portion 120 is located between the transfer substrate 110 and the flexible film 130, and the excitation portion 120 is used to generate gas under the excitation of an excitation source to generate a thrust at least in the thickness direction y of the transfer substrate 110, so as to deform at least a part of the flexible film 130.

[0047] The transfer device of this embodiment can be used for mass transfer of small-sized devices such as Micro LED and MINI LED.

[0048] Specifically, the transfer substrate 110 may be a hard substrate or a flexible substrate. When the transfer substrate 110 is a hard substrate, the material of the transfer substrate 110 may be a hard material such as glass or quartz glass; when the transfer substrate 110 is a flexible substrate, the material of the transfer substrate 110 may be a flexible material such as polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), etc.

[0049] The excitation portion 120 may include a material that can generate gas under the excitation of an excitation source, wherein the excitation portion 120 may be in a solid, liquid or molten state when not excited. Optionally, after the excitation portion 120 is excited, the excitation portion 120 itself undergoes a physical reaction, and / or a chemical reaction to generate gas and expand in volume. The excitation portion 120 may be disposed at least partially on the surface of the transfer substrate 110, wherein the position of the excitation portion 120 may be set according to the object to be transferred by the transfer device. Optionally, each excitation portion 120 may correspond to an object to be transferred, or multiple excitation portions 120 may correspond to an object to be transferred, wherein the object to be transferred may be a small-sized device, such as a Micro LED or a MINI LED.

[0050] The flexible film 130 may be a material with a high tensile fracture ratio. Optionally, the tensile fracture ratio of the flexible film 130 is different from that of the transfer substrate 110. Further, the tensile fracture ratio of the flexible film 130 is greater than that of the transfer substrate 110. When the object to be transferred is transferred, the object to be transferred is disposed on a side of the flexible film 130 away from the transfer substrate 110, and the tensile fracture ratio of the flexible film 130 is greater than that of the transfer substrate 110, so that after the excitation portion 120 is excited to generate gas, the deformation of the flexible film 130 is greater than that of the transfer substrate 110, thereby allowing the object to be transferred to be separated from the flexible film 130.

[0051] The object to be transferred may be a chip array to be transferred, and the chip array to be transferred includes a plurality of chips to be transferred, and the chips to be transferred may include a plurality of small-sized devices such as Micro LEDs and MINI LEDs. The process of transferring the chip array to be transferred using the transfer device of this embodiment may be that the chip array to be transferred is arranged on a side of the flexible film 130 of the transfer device away from the transfer substrate 110, and an excitation source is used to excite the excitation part 120 of the transfer device, and the excitation part 120 is excited to generate gas and expand in volume and generate a thrust at least in the thickness direction y of the transfer substrate 110, so that the flexible film 130 is deformed at the position where the thrust is received, thereby reducing the contact area between the chips to be transferred in the chip array to be transferred and the flexible film 130, and finally separating the chip array to be transferred from the transfer device, thereby realizing the transfer of the chip array to be transferred.

[0052] The setting of the flexible film 130 can make the excitation part 120 generate gas when excited, and the thrust generated by the volume expansion will not directly act on the chip to be transferred, but act on the chip to be transferred through the flexible film 130, so that the flexible film 130 can play a role of buffering and uniform stress, thereby making the force on each position of the chip to be transferred more uniform, so that the chips to be transferred in the chip array to be transferred can be separated to the position that needs to be aligned on the target substrate under the action of uniform stress, thereby improving the transfer accuracy. In addition, the setting of the flexible film 130 can reduce the contact between the gas generated by the excitation part 120 and the chip to be transferred, thereby avoiding the corrosion and other damages to the chip to be transferred by the gas generated by the excitation part 120.

[0053] It should be noted that a hard substrate is less likely to deform than a flexible substrate. Therefore, when the transfer substrate 110 is a hard substrate, after using the transfer device of this embodiment to transfer the chip array to be transferred, the deformation of the transfer substrate 110 is small, so it can be used again to transfer the chip array to be transferred, with a higher reuse rate.

[0054] The transfer device provided in this embodiment includes a transfer substrate, an excitation part and a flexible film. The excitation part is located between the transfer substrate and the flexible film. The excitation part is used to generate gas under the excitation of an excitation source to generate a thrust at least in the thickness direction of the transfer substrate, so that the flexible film is deformed at the position where the thrust is applied, thereby reducing the contact area between the chip to be transferred in the chip array and the flexible film, and finally separating the chip array to be transferred from the transfer device, thereby realizing the mass transfer of the chip array to be transferred. The setting of the flexible film can play a role in buffering and uniform stress, thereby making the force applied to each position of the chip array to be transferred more uniform, so that at least part of the chips to be transferred in the chip array to be transferred can be separated to the position of the target substrate that needs to be aligned under the action of uniform stress, thereby improving the transfer accuracy. In addition, the setting of the flexible film can reduce the contact between the gas generated by the excitation part and the chip to be transferred, thereby avoiding the corrosion and other damages to the chip to be transferred by the gas generated by the excitation part.

[0055] Figure 2 is a schematic structural diagram of another transfer device provided by an embodiment of the present invention, Figure 3 is a schematic structural diagram of another transfer device provided by an embodiment of the present invention, Figure 4 is a schematic diagram of the structure of another transfer device provided by an embodiment of the present invention, referring to Figure 2-Figure 4 Optionally, the transfer substrate 110 has a plurality of grooves 111 ; the excitation unit 120 is located in the grooves 111 , and the flexible film 130 is located on the surface of the transfer substrate 110 having the grooves 111 .

[0056] Specifically, the groove 111 may be a structure of the transfer substrate 110 itself. Optionally, at least one surface of the transfer substrate 110 has a plurality of grooves 111. The groove 111 may also be a structure of other film layers on the transfer substrate 110. Exemplarily, the transfer substrate 110 includes a set film layer structure fixed to the transfer substrate 110, and the surface of the set film layer structure away from the transfer substrate 110 has a plurality of grooves 111. In this embodiment, the transfer substrate 110 has a plurality of grooves 111. When making the grooves 111, the size of the grooves 111 can be designed according to the size of the chip to be transferred in the chip array to be transferred, thereby making a precise groove 111 structure. Optionally, one groove 111 corresponds to one chip to be transferred or at least one groove 111 corresponds to one chip to be transferred.

[0057] When the transfer substrate 110 is a hard substrate, the groove 111 can be formed by etching the surface of the hard substrate. When the transfer substrate 110 is a flexible substrate, the groove 111 can be formed by heat pressing or UV transfer.

[0058] The excitation portion 120 is located in the groove 111. Since the structure of the groove 111 is precise, after the excitation portion 120 in the groove 111 is excited to generate gas expansion, the spray direction of the expanded airflow can be precisely controlled, so that when the chip to be transferred is separated from the transfer device, the direction in which it falls off from the transfer device can be precisely controlled, thereby ensuring that when the chip array to be transferred is transferred from the transfer device to the target substrate, the chip to be transferred can be precisely fallen off at the corresponding position of the target substrate, thereby ensuring the accuracy of the transfer of the chip to be transferred.

[0059] Based on the above embodiment, optionally, the cross section of the groove 111 is a rectangle ( Figure 2 Structure shown), trapezoidal ( Figure 3 Structure shown) or arc ( Figure 4 The cross section of the groove 111 is the cross section of the groove 111 obtained when the transfer device is cut along the thickness direction y of the transfer substrate 110.

[0060] Furthermore, the size of the groove 111 gradually increases from the bottom of the groove 111 to the opening of the groove 111; optionally, the cross-sectional shape of the groove 111 is parabolic, so that after the excitation portion 120 is excited to generate gas, it is easier to form a jet pointing from the bottom of the groove 111 to the direction of the flexible membrane 130, so that the direction in which the chip to be transferred falls off from the transfer device can be parallel to the thickness direction y of the transfer substrate 110, that is, when the chip to be transferred is separated from the transfer device, the direction in which it falls off from the transfer device can be precisely controlled.

[0061] Continue to refer Figure 1-Figure 4 Optionally, the material of the flexible film 130 is a viscous material. Exemplarily, the material of the flexible film 130 may be a colloid such as a pressure-sensitive adhesive and an optical adhesive. When the material of the flexible film 130 is a viscous material, the flexible film 130 itself has viscous properties, so that the flexible film 130 can be bonded to the transfer substrate 110 without providing an additional adhesive layer; and when the transfer device is used to transfer the chip array to be transferred, the flexible film 130 can be bonded to the chip array to be transferred, thereby making the structure of the transfer device relatively light and thin.

[0062] Figure 5 is a schematic diagram of another transfer device provided by an embodiment of the present invention, referring to Figure 5 In another optional embodiment of the present invention, the flexible film 130 is a non-adhesive material, and the transfer device further includes a first adhesive layer 141 and a second adhesive layer 142, the first adhesive layer 141 is located between the flexible film 130 and the transfer substrate 110, and the second adhesive layer 142 is located on a side of the flexible film 130 away from the transfer substrate 110.

[0063] Specifically, the first adhesive layer 141 can be used to adhere the flexible film 130 and the transfer substrate 110 to fix the flexible film 130 and the transfer substrate 110. The second adhesive layer 142 can be used to adhere the chip array to be transferred when the chip array to be transferred is transferred.

[0064] On the basis of the above technical solutions, optionally, the excitation source is an electromagnetic wave energy source, a heat source or a chemical source, wherein the chemical source includes chemical substances.

[0065] Optionally, the electromagnetic wave energy source may be a light source, and the light source may be a visible light source, a non-visible light source, or a laser light source. Specifically, an excitation portion that can be excited by the excitation source may be set according to the excitation source, and the excitation source may be selected according to the excitation condition of the excitation portion. Specifically, when a transfer device is used to transfer the chip array to be transferred, it is necessary to ensure that the energy provided by the excitation source (when the excitation source is an electromagnetic wave energy source, the energy provided by the excitation source is electromagnetic wave energy; when the excitation source is a heat source, the energy provided by the excitation source is heat energy) or the substance (when the excitation source is a chemical source, the substance provided by the excitation source is a chemical substance) can reach the excitation portion so that the excitation portion can be excited.

[0066] Optionally, the excitation source is an electromagnetic wave energy source, and at least one side of the excitation portion 120 is transparent to electromagnetic waves of a set wavelength emitted by the electromagnetic wave energy source, and the electromagnetic waves of the set wavelength are used to excite the excitation portion 120 .

[0067] At least one side of the excitation part 120 can transmit the electromagnetic wave of the set wavelength emitted by the electromagnetic wave energy source, which can refer to the structure of at least one side of the excitation part 120 in the transfer device that can transmit the electromagnetic wave of the set wavelength emitted by the electromagnetic wave energy source, thereby ensuring that the electromagnetic wave of the set wavelength used to excite the excitation part 120 can reach the excitation part 120, thereby ensuring that the excitation part 120 can separate at least part of the chips to be transferred in the chip array to be transferred from the transfer device under the excitation of the excitation source.

[0068] The structure on one side of the excitation unit 120 is the flexible film 130, and the structure on the other side of the excitation unit 120 is the transfer substrate 110. Figure 2 Taking the structure shown as an example, the upper side of the excitation part 120 is a flexible film 130, and the lower side of the excitation part 120 is a transfer substrate 110. Optionally, the left and right sides of the excitation part 120 may also include a membrane layer structure (not shown in the figure). In this embodiment, any side structure of the excitation part 120 can be transparent to electromagnetic waves of a set wavelength emitted by the electromagnetic wave energy source.

[0069] On the basis of the above technical solution, optionally, at least one of the flexible film 130 and the transfer substrate 110 can transmit electromagnetic waves of a set wavelength.

[0070] Optionally, the transfer substrate 110 can transmit electromagnetic waves of a set wavelength, and when transferring the chip array to be transferred, the excitation source can be placed on a side of the transfer substrate 110 away from the flexible film 130 .

[0071] Optionally, the flexible film 130 can transmit electromagnetic waves of a set wavelength, and when transferring the chip array to be transferred, the excitation source can be placed on a side of the flexible film 130 away from the transfer substrate 110 .

[0072] Optionally, an electromagnetic wave energy absorption film is provided on the side of the structure that can transmit electromagnetic waves of a set wavelength away from the excitation part, and the electromagnetic wave energy absorption film is used to at least absorb electromagnetic waves of a set wavelength, wherein the structure that can transmit electromagnetic waves of a set wavelength is a flexible film or a transfer substrate.

[0073] The electromagnetic wave energy absorption film is used to absorb at least electromagnetic waves of a set wavelength so that the electromagnetic waves of the set wavelength will not reach the excitation part. By providing an electromagnetic wave energy absorption film on the side of the structure that can transmit electromagnetic waves of a set wavelength away from the excitation part, it is possible to prevent the excitation part of the transfer device from being excited during transportation, thereby improving the stability of the transfer device during transportation. When the transfer device of this embodiment is used to transfer the chip array to be transferred, the electromagnetic wave energy absorption film can be removed, and then the chip array to be transferred is fixed on a flexible film for transfer. When the electromagnetic wave energy source is a light source, the electromagnetic wave energy absorption film can be a shading film, which can absorb light and prevent light from irradiating the excitation part.

[0074] Figure 6 is a schematic diagram of the structure of another transfer device provided by an embodiment of the present invention, referring to Figure 6 Optionally, the transfer substrate 110 can transmit electromagnetic waves of a set wavelength, and the transfer device further includes a first electromagnetic wave energy absorption film 150 located on a side of the transfer substrate 110 away from the flexible film 130 .

[0075] Figure 7 is a schematic diagram of the structure of another transfer device provided by an embodiment of the present invention, referring to Figure 7 Optionally, the flexible film 130 can transmit electromagnetic waves of a set wavelength, and the transfer device further includes a second electromagnetic wave energy absorption film 160 located on a side of the flexible film 130 away from the transfer substrate 110 .

[0076] In another optional embodiment of the present invention, the flexible film is not transparent to electromagnetic waves of a set wavelength; the flexible film itself can be used as an electromagnetic wave energy absorption film, thereby preventing electromagnetic waves of a set wavelength from passing through the flexible film to reach the excitation part during the transportation of the transfer device, thereby improving the stability of the transfer device during the transportation. It should be noted that when the flexible film is not transparent to electromagnetic waves of a set wavelength, the transfer substrate can transmit electromagnetic waves of a set wavelength.

[0077] On the basis of the above embodiments, optionally, the excitation part includes a main body material and an absorption material for absorbing the excitation energy of the excitation source.

[0078] Specifically, the absorption material is used to absorb the energy of the excitation source, so that the main material of the excitation part of the excitation source can undergo at least one of a physical reaction and a chemical reaction to produce gas, or the main material of the excitation part of the excitation source and the absorption material can undergo at least one of a physical reaction and a chemical reaction to produce gas.

[0079] Optionally, the excitation part produces at least a chemical reaction under the stimulation of the excitation source, the main material may be ether, and the absorption material may be carbon powder; the excitation part also includes an oxidant, which may make the reaction of the excitation part more intense, thereby generating a greater thrust, thereby ensuring that the chip array to be transferred can be separated from the transfer device.

[0080] Optionally, when making a transfer device, the material of the excitation part can be in liquid or molten state, and the liquid or molten material of the excitation part can be coated on the transfer substrate by coating. When there is a groove on the transfer substrate, the material of the excitation part can be coated in the groove, and the coating method can be doctor blade coating or micro-gravure coating.

[0081] The embodiment of the present invention also provides a transfer system. Figure 8 is a schematic diagram of the structure of a transfer system provided by an embodiment of the present invention, Fig. 9 Schematic diagram of the separation of the chip to be transferred from the transfer device after the excitation source excites the excitation part in the embodiment of the present invention. Figure 8 and Fig. 9 , the transfer system includes the transfer device 100 provided in any of the above embodiments, and also includes a chip array 200 to be transferred, a target substrate 300 and an excitation source 400;

[0082] The chip array 200 to be transferred is located on a side of the transfer substrate 110 of the transfer device 100 where the excitation unit 120 is provided, and the chip array 200 to be transferred is located on a side of the excitation unit 120 away from the transfer substrate 110;

[0083] The target substrate 300 is located at a side of the chip array 200 to be transferred away from the transfer device 100 and is separated from the chip array 200 to be transferred;

[0084] The excitation source 400 is used to excite the excitation part 120 to generate gas to generate a thrust at least in the thickness direction y of the transfer substrate 110, so that at least part of the flexible film 130 is deformed, so that at least part of the chips to be transferred in the chip array 200 are separated from the flexible film 130 of the transfer device 100 to the target substrate 300.

[0085] Optionally, the chip array 200 to be transferred may include a chip 210 to be transferred, and the chip to be transferred may be a MicroLED or a MINI LED.

[0086] Optionally, the target substrate 300 is a driving backplane, and the driving backplane includes a plurality of driving circuits, wherein each driving circuit may correspond to at least one light-emitting device. When transferring the chip array 200 to be transferred from the transfer device 100 to the target substrate 300, each light-emitting device may be aligned with the corresponding driving circuit first, and then the excitation source 400 may be used to excite the excitation part 120 in the transfer device 100, so that the excitation part 120 is excited to generate gas and generate thrust at least in the thickness direction y of the transfer substrate 110, thereby causing the flexible film to deform, for example, to deform into a protruding structure protruding toward the direction of the chip to be transferred (see Fig. 9 ), so that the contact area between the flexible film 130 and the chips to be transferred in the chip array 200 is reduced, thereby separating the chips to be transferred from the transfer device 100 to the target substrate 300.

[0087] In other optional embodiments of the present invention, the target substrate 300 may also be an intermediate carrier. After the transferred chips are separated to the intermediate carrier, they may be transferred from the intermediate carrier to other locations, which is not specifically limited in this embodiment.

[0088] The transfer system provided by the embodiment of the present invention includes a transfer device, the transfer device includes a transfer substrate, an excitation part and a flexible film, the excitation part is located between the transfer substrate and the flexible film, the excitation part is used to generate gas under the excitation of the excitation source 4, so as to generate a thrust at least in the thickness direction of the transfer substrate, so that the flexible film is deformed at the position where the thrust is applied, thereby reducing the contact area between the chip to be transferred in the chip array and the flexible film, and finally separating the chip array to be transferred from the transfer device, thereby realizing the transfer of the chip array to be transferred. The setting of the flexible film can play a role in buffering and uniform stress, thereby making the force applied to each position of the chip array to be transferred more uniform, so that at least part of the chips to be transferred in the chip array to be transferred can be separated to the position of the target substrate that needs to be aligned under the action of uniform stress, thereby improving the transfer accuracy. In addition, the setting of the flexible film can reduce the contact between the gas generated by the excitation part and the chip to be transferred, thereby avoiding the corrosion and other damages to the chip to be transferred by the gas generated by the excitation part.

[0089] Continue to refer Figure 8 and Fig. 9Optionally, the excitation source 400 is located on a side of the transfer device 100 away from the chip array 200 to be transferred; relative to the excitation source 400 being located between the transfer device 100 and the target substrate 300, when the chips to be transferred in the chip array 200 to be transferred are separated from the transfer device 100 to the target substrate 300, the excitation source 400 will not block the chips to be transferred, so that the chips to be transferred can directly reach the target substrate 300 after falling off from the transfer device 100, that is, the separation path of the chips to be transferred from the transfer device 100 to the target substrate 300 will not change, thereby ensuring that after the chip array 200 to be transferred is aligned with the target substrate 300, the chips to be transferred can be separated to the position of the corresponding driving circuit of the target substrate 300, thereby ensuring the accuracy of the transfer.

[0090] In other optional embodiments of the present invention, the excitation source 400 may also be located on a side of the flexible film 130 away from the transfer substrate 110 or at other locations, which is not specifically limited in this embodiment.

[0091] Fig.10 is a schematic diagram of a transfer system provided by an embodiment of the present invention, with reference to Fig.10 Optionally, the transfer substrate 110 has multiple grooves 111, and the excitation unit 120 is located in the grooves 111; the chip array 200 to be transferred includes multiple chips to be transferred, and in the thickness direction y of the transfer substrate 110, the vertical projection of each chip to be transferred on the substrate 110 to be transferred covers at least one groove 111.

[0092] Specifically, the excitation unit 120 is located in the groove 111 of the transfer substrate 110. After the excitation unit 120 is excited, the position of the flexible film 130 corresponding to the groove 111 will be deformed. In the thickness direction y of the transfer substrate 110, the vertical projection of each chip to be transferred on the substrate 110 to be transferred covers at least one groove 111, that is, in the thickness direction y of the transfer substrate 110, each chip to be transferred corresponds to at least one groove 111, so that after the flexible film 130 corresponding to the position of the groove 111 is deformed, the chip to be transferred corresponding to the position of the groove 111 can be separated from the transfer device 100.

[0093] Optionally, the vertical projection of each chip to be transferred on the substrate to be transferred 110 covers at least two grooves 111, so that the thrust exerted on the chip to be transferred can be more uniform, which is conducive to more accurate control of the separation direction of the chip to be transferred from the device to be transferred 100, so that the chip to be transferred can be separated to the position of the driving circuit corresponding to the chip to be transferred on the target substrate 300, thereby improving the transfer accuracy.

[0094] The embodiment of the present invention also provides a transfer method. Fig.11 is a flow chart of a transfer method provided by an embodiment of the present invention, refer to Fig.11 , the transfer method includes:

[0095] Step 510, exciting the excitation part on the transfer substrate by an excitation source, so that the excitation part generates gas to generate a thrust at least along the thickness direction of the transfer substrate, so that at least a part of the position of the flexible membrane is deformed, so that at least part of the chips to be transferred in the chip array to be transferred are separated from the flexible membrane of the transfer device to the target substrate.

[0096] The transfer method provided in this embodiment is executed by the transfer system of any of the above embodiments of the present invention, and has the technical effect of the transfer system response, which will not be repeated here.

[0097] Fig.12 is a schematic diagram of transferring a chip array to be transferred provided by an embodiment of the present invention, with reference to Fig.12 Optionally, step 510 may include:

[0098] The transfer device is placed with a surface having a flexible membrane facing the ground, and an excitation source is used to excite an excitation portion in the groove of the transfer substrate so that the excitation portion generates gas to generate a thrust at least in a direction perpendicular to the thickness of the transfer substrate, so that at least part of the chips to be transferred in the chip array are separated from the flexible membrane of the transfer device to the target substrate under the action of the thrust and gravity.

[0099] Specifically, due to the gravity of the chip to be transferred itself, when the transfer device 100 is placed with the surface of the flexible membrane 130 facing the ground 600, the thrust generated by the excitation of the excitation part 120 does not need to be too large, so as to ensure that at least part of the chips to be transferred in the chip array 200 are separated from the flexible membrane 130 of the transfer device 100 to the target substrate 300, making it easier to separate the chips to be transferred from the transfer device 100.

[0100] In other optional embodiments of the present invention, the surface of the transfer device 100 provided with the flexible membrane 130 may be arranged away from the ground surface 600, which is not specifically limited in the present invention.

[0101] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A transfer device, characterized in that: include: A transfer substrate, an excitation portion and a flexible film, wherein the excitation portion is located between the transfer substrate and the flexible film, and is used to generate gas under the excitation of an excitation source to generate a thrust at least in the thickness direction of the transfer substrate, so as to deform at least a part of the flexible film; and the transfer substrate has a plurality of grooves; The excitation portion is located in the groove, The flexible film is located on the surface of the transfer substrate having the groove; The stretch-to-break ratio of the flexible film is different from the stretch-to-break ratio of the transfer substrate.

2. The transfer device according to claim 1, characterized in that The cross section of the groove is rectangular, trapezoidal or arc-shaped.

3. The transfer device according to claim 2, characterized in that The cross-sectional shape of the groove is parabolic.

4. The transfer device according to claim 1, characterized in that: The flexible film is a non-adhesive material, and the transfer device further comprises a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located between the flexible film and the transfer substrate, and the second adhesive layer is located on a side of the flexible film away from the transfer substrate; Alternatively, the material of the flexible film is an adhesive material.

5. The transfer device according to claim 1, characterized in that: The excitation source is an electromagnetic wave energy source, a heat source or a chemical source, wherein the chemical source includes chemical substances.

6. The transfer device according to claim 5, characterized in that The excitation source is an electromagnetic wave energy source, and at least one side of the excitation portion is permeable to electromagnetic waves of a set wavelength emitted by the electromagnetic wave energy source, and the electromagnetic waves of the set wavelength are used to excite the excitation portion.

7. The transfer device according to claim 6, characterized in that At least one of the flexible film and the transfer substrate is transmissive to electromagnetic waves of the set wavelength.

8. The transfer device according to claim 7, characterized in that An electromagnetic wave energy absorption film is arranged on the side of the structure that is permeable to electromagnetic waves of the set wavelength away from the excitation part, and the electromagnetic wave energy absorption film is used to at least absorb the electromagnetic waves of the set wavelength, wherein the structure that is permeable to electromagnetic waves of the set wavelength is the flexible film or the transfer substrate.

9. The transfer device according to claim 7, characterized in that: The transfer substrate is transparent to electromagnetic waves of the set wavelength.

10. The transfer device according to claim 7, characterized in that The flexible film is transparent to electromagnetic waves of the set wavelength, or the flexible film is not transparent to electromagnetic waves of the set wavelength.

11. The transfer device according to claim 1, characterized in that The excitation part includes a main body material and an absorption material for absorbing the excitation energy of an excitation source.

12. A transfer system, characterized in that: A transfer device comprising any one of claims 1 to 11; Also included are a chip array to be transferred, a target substrate and an excitation source; The chip array to be transferred is located on a side of the transfer substrate of the transfer device where an excitation unit is provided, and the chip array to be transferred is located on a side of the excitation unit away from the transfer substrate; The target substrate is located at a side of the chip array to be transferred away from the transfer device and is separated from the chip array to be transferred; The excitation source is used to excite the excitation part to generate gas to generate a thrust at least in the thickness direction of the transfer substrate, so that at least part of the flexible film is deformed, so that at least part of the chips to be transferred in the chip array are separated from the flexible film of the transfer device to the target substrate.

13. The transfer system according to claim 12, characterized in that The excitation source is located at a side of the transfer device away from the chip array to be transferred.

14. The transfer system according to claim 12, characterized in that The transfer substrate is provided with a plurality of grooves, and the excitation part is located in the grooves; The chip array to be transferred includes a plurality of chips to be transferred, and in the thickness direction of the transfer substrate, a vertical projection of each chip to be transferred on the transfer substrate covers at least one of the grooves.

15. The transfer system according to claim 14, characterized in that The vertical projection of each chip to be transferred on the substrate to be transferred covers at least two of the grooves.

16. A transfer method, characterized in that: include: Exciting the excitation part on the transfer substrate by an excitation source, so that the excitation part generates gas to generate a thrust at least along the thickness direction of the transfer substrate, so that at least a part of the flexible film is deformed, so that at least part of the chips to be transferred in the chip array to be transferred are separated from the flexible film of the transfer device to the target substrate; The transfer substrate has a plurality of grooves; The excitation portion is located in the groove, The flexible film is located on the surface of the transfer substrate having the groove; The stretch-to-break ratio of the flexible film is different from the stretch-to-break ratio of the transfer substrate.

17. The transfer method according to claim 16, characterized in that: The method comprises: exciting the exciting part in the groove of the transfer substrate by an exciting source, so that the exciting part generates gas to generate a thrust at least in the thickness direction of the transfer substrate, so that at least a part of the position of the flexible film is deformed, so that at least part of the chips to be transferred in the chip array to be transferred are separated from the flexible film of the transfer device to the target substrate, including: The transfer device is placed with a surface having a flexible membrane facing the ground, and an excitation source is used to excite an excitation portion in the groove of the transfer substrate, so that the excitation portion generates gas to generate a thrust at least in a direction perpendicular to the thickness of the transfer substrate, so that at least part of the chips to be transferred in the chip array are separated from the flexible membrane of the transfer device to the target substrate under the action of the thrust and gravity.

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