A method and device for preparing a flexible electronic device

Abstract

The present invention provides a method for preparing a flexible electronic device and a preparation device thereof, the preparation method comprising the following steps: uniformly stretching the flexible substrate along the outer contour direction; after the flexible substrate is stretched into place, in the stretched state of the flexible substrate, coating the surface of the flexible substrate with a sensitive unit material in an array; after the sensitive unit material on the flexible substrate is solidified, releasing the flexible substrate to make it shrink to its initial size. This preparation method uniformly stretches the flexible substrate along the outer contour direction, so that the flexible substrate is uniformly deformed outward along the outer contour direction, and after shrinking, the four sides shrink uniformly, and the sensitive units coated on the surface shrink with it, the sensitive units shrink uniformly, and the strain in all directions of the sensitive units is uniform, and the sensitive units will not produce cracks or wrinkles after shrinking.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible electronic devices, and in particular to a method for preparing a flexible electronic device and a preparation device thereof. Background Art

[0002] Flexible electronics refers to emerging electronic technologies that manufacture electronic devices made of organic / inorganic materials on flexible / stretchable substrates. The development of flexible electronic devices prepared by flexible electronic technology will subvert traditional human-computer interaction methods and promote revolutionary development in artificial intelligence, smart manufacturing, health care, sports and entertainment and other fields.

[0003] The existing method for manufacturing flexible electronic devices generally involves first unidirectionally stretching the flexible substrate, then coating the sensitive unit on the substrate, and finally releasing the substrate, causing the substrate and the coated sensitive unit to shrink. In the above manufacturing method, the substrate is unidirectionally stretched, and during stretching, the substrate mainly deforms and extends along the stretching direction. After the substrate is released, the substrate and the coated sensitive unit shrink unevenly around, and cracks or wrinkles are easily generated in all directions of the sensitive unit on the substrate due to uneven strain. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect in the prior art that uniaxial stretching of the substrate during the preparation of flexible electronic devices easily leads to cracks or wrinkles after the sensitive unit shrinks.

[0005] To this end, the present invention provides a method for preparing a flexible electronic device, comprising the following steps:

[0006] Uniformly stretching the flexible substrate along its outer contour direction;

[0007] After the flexible substrate is stretched into place, the sensitive unit material is coated in an array on the surface of the flexible substrate in the stretched state of the flexible substrate;

[0008] After the sensitive unit material on the flexible substrate is solidified, the flexible substrate is released to shrink to its original size.

[0009] Optionally, in the method for preparing the above-mentioned flexible electronic device, after the flexible substrate is stretched into place, a screen is placed above the flexible substrate, the screen is provided with an array of small holes, and the sensitive unit material is sprayed onto the flexible substrate from the screen upward.

[0010] Optionally, in the above-mentioned method for preparing the flexible electronic device, the sensitive unit material is sprayed onto the flexible substrate through a nozzle, and the nozzle is fixed on a three-dimensional driving mechanism, and the three-dimensional driving mechanism drives the nozzle to perform three-dimensional movement relative to the flexible substrate.

[0011] Optionally, in the method for preparing the above-mentioned flexible electronic device, after the flexible substrate is stretched into place, the flexible substrate is heated; after the flexible substrate shrinks to an initial size, the heating of the flexible substrate is stopped.

[0012] The present invention provides a manufacturing device for a flexible electronic device, comprising

[0013] The base has an inwardly recessed area at the upper portion thereof; the flexible substrate is suitable for being placed in the recessed area;

[0014] At least three groups of stretching components, arranged on the base and evenly distributed along the contour direction of the recessed area, the stretching components are suitable for clamping the flexible substrate in at least three directions and evenly stretching or releasing it;

[0015] The spraying assembly is arranged on the top of the base; the spraying assembly comprises a spray head, and the spray head is suitable for coating the sensitive unit material in an array on the surface of the flexible substrate.

[0016] Optionally, in the above-mentioned flexible electronic device preparation device, the top contour of the recessed area is circular; the stretching components have multiple groups, and the multiple groups of stretching components are evenly distributed along the circumference of the recessed area; the connecting line of the clamping ends of the multiple groups of stretching components for clamping the flexible substrate is nearly circular, so as to uniformly stretch the flexible substrate in the circumferential direction.

[0017] Optionally, in the above-mentioned flexible electronic device preparation device, the spraying assembly includes a three-dimensional driving mechanism, and the three-dimensional driving mechanism is arranged on the base; the nozzle is fixed on the three-dimensional driving mechanism, and the three-dimensional driving mechanism drives the nozzle to perform three-dimensional movement relative to the flexible substrate.

[0018] Optionally, in the above-mentioned flexible electronic device preparation device, the spraying assembly also includes a supporting assembly and a screen, the supporting assembly is located above the flexible substrate and is movably disposed on the base up and down relative to the flexible substrate, and the screen is detachably disposed on the supporting assembly.

[0019] Optionally, the above-mentioned flexible electronic device manufacturing apparatus further includes a first driver, wherein the first driver is disposed on the base, and the supporting assembly is disposed at a driving end of the first driver.

[0020] Optionally, the above-mentioned flexible electronic device manufacturing device further includes a lifting seat, which is disposed on the base so as to be liftable relative to the stretching assembly, and the flexible substrate is suitable for being carried on the lifting seat.

[0021] The technical solution of the present invention has the following advantages:

[0022] 1. The method for preparing a flexible electronic device provided by the present invention is to uniformly stretch the flexible substrate along the outer contour direction so that the flexible substrate is uniformly deformed and extended outward in the contour direction; in the stretched state of the flexible substrate, the sensitive unit material is coated on the surface of the flexible substrate in an array, and after the sensitive unit material coated on the surface of the flexible substrate is solidified, the flexible substrate is released to shrink to its initial size. Since the flexible substrate is uniformly deformed outward along the outer contour direction, it shrinks uniformly around after shrinking, and the sensitive units coated on its surface shrink with it, and the sensitive units shrink uniformly, and the strain in all directions of the sensitive units is uniform, and the sensitive units will not produce cracks or wrinkles after shrinking.

[0023] During the release process, due to the different stresses exerted on the sensitive unit material and the flexible substrate, the stress mismatch between the two will cause the sensitive unit material layer to produce a buckled or wavy structure. The sensitive unit layer with a buckled or wavy structure has good tensile resistance and can effectively improve the ductility of flexible electronic devices.

[0024] In addition, after the flexible substrate is released, the area of ​​each array point of the sensitive unit material and the distance between adjacent array points shrink as the flexible substrate shrinks, effectively improving the integration and resolution of flexible electronic devices.

[0025] 2. The preparation device of the flexible electronic device provided by the present invention places the flexible substrate in the middle of the recessed area, and the clamping ends of at least three groups of stretching components clamp the flexible substrate from three different directions and stretch it. At least three groups of stretching components are evenly distributed along the contour direction of the recessed area, that is, the stretching components are evenly distributed along the circumference of the flexible substrate, and the flexible substrate can be evenly stretched from at least three directions. Compared with the existing uniaxial stretching method, after the flexible substrate is released, the sensitive unit material shrinks evenly in all directions, the strain is evenly strained, and no cracks or wrinkles will occur. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of a method for preparing a flexible electronic device provided in Example 1 of the present invention;

[0028] Figure 2 This is a schematic diagram of the overall structure of a device for preparing a flexible electronic device provided in Example 2 of the present invention;

[0029] Figure 3 for Figure 2Schematic diagram of the spray assembly;

[0030] Figure 4 is a schematic diagram of a three-axis robotic arm;

[0031] Figure 5 is a schematic diagram of the support assembly;

[0032] Figure 6 Schematic diagram of the coordination between the stretching component, the flexible substrate and the mesh.

[0033] Description of reference numerals:

[0034] 1-base; 2-stretching assembly; 3-spraying assembly; 31-spray head; 32-three-dimensional driving mechanism; 321-X-axis motion assembly; 322-Y-axis motion assembly; 323-Z-axis motion assembly; 331-support plate; 332-fixed plate; 333-telescopic guide rail; 334-bracket; 34-screen; 35-first drive; 4-support; 5-flexible substrate; 6-sensitive unit. DETAILED DESCRIPTION

[0035] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0039] Example 1

[0040] This embodiment provides a method for preparing a flexible electronic device, comprising the following steps:

[0041] Uniformly stretching the flexible substrate 5 along its outer contour direction;

[0042] After the flexible substrate 5 is stretched into place, the sensitive unit 6 material is coated in an array on the surface of the flexible substrate 5 in the stretched state of the flexible substrate 5;

[0043] After the material of the sensitive unit 6 on the flexible substrate 5 is solidified, the flexible substrate 5 is released to shrink to its original size.

[0044] This preparation method stretches the flexible substrate 5 uniformly along its outer contour direction, so that the flexible substrate 5 uniformly deforms and extends outward in the contour direction; after the material of the sensitive unit 6 coated on the surface of the flexible substrate 5 is solidified, the flexible substrate 5 is released to shrink to its initial size. Since the flexible substrate 5 uniformly deforms outward along its outer contour direction, it shrinks uniformly around it after shrinking, and the sensitive unit 6 coated on its surface shrinks with it, and the sensitive unit 6 shrinks uniformly, and the strain in all directions of the sensitive unit 6 is uniform, and the sensitive unit 6 will not produce cracks or wrinkles after shrinking. Figure 1 Schematic diagram of the method for preparing flexible electronic devices.

[0045] During the release process, since the stresses on the sensitive unit 6 material and the flexible substrate 5 are different, the stress mismatch between the two will cause the sensitive unit 6 material layer to produce a buckled or wavy structure. The buckled or wavy structure of the sensitive unit 6 layer has good tensile resistance and can effectively improve the ductility of flexible electronic devices.

[0046] In addition, after the flexible substrate 5 is released, the area of ​​each matrix point of the sensitive unit 6 material and the distance between adjacent matrix points are reduced as the flexible substrate 5 is retracted, which effectively improves the integration and resolution of the flexible electronic device.

[0047] After the flexible substrate 5 is stretched into place, a screen 34 is placed above the flexible substrate 5. The screen 34 is spaced a certain distance from the flexible substrate 5 in height. The screen 34 is provided with array-type small holes. The sensitive unit 6 material is sprayed by a nozzle 31. The nozzle 31 is located above the screen 34. The sensitive unit 6 material is sprayed from the screen 34 to the flexible substrate 5 to achieve array-type coating in the stretched state of the flexible substrate 5. Alternatively, to achieve array-type coating, a film with array-type small holes may be attached to the flexible substrate 5 after the flexible substrate 5 is stretched into place. The sensitive unit 6 material is sprayed by the nozzle 31. After the spraying is completed, the film can be peeled off. Alternatively, array-type coating may be achieved by manual dot coating.

[0048] The inlet of the nozzle 31 is connected to the sensitive unit 6 reservoir through a connecting pipe, and the liquid sensitive unit 6 material is stored in the reservoir, and the sensitive unit 6 material is transported to the nozzle 31 through the connecting pipe. Optimally, the nozzle 31 is fixed on the three-dimensional driving mechanism 32, and the three-dimensional driving mechanism 32 drives the nozzle 31 to move three-dimensionally relative to the flexible substrate 5 to achieve uniform coating, so that the thickness of the coated sensitive unit 6 material layer is uniform. When the flexible substrate 5 itself has a large area or a large area after stretching, it is convenient to achieve uniform spraying by adjusting the position of the nozzle 31 relative to the flexible substrate 5.

[0049] After the flexible substrate 5 is stretched into place, the flexible substrate 5 is heated; and then the sensitive unit 6 material is sprayed thereon. After the flexible substrate 5 is heated, the drying and curing of the sensitive unit 6 material on the flexible substrate 5 can be accelerated, and the preparation cycle of the flexible electronic device can be shortened. After the flexible substrate 5 shrinks to the initial size, the heating of the flexible substrate 5 is stopped.

[0050] Example 2

[0051] This embodiment provides a manufacturing device for a flexible electronic device, such as Figure 2 As shown, it includes a base 1, at least three groups of stretching components 2 and a spraying component 3.

[0052] Among them, a recessed area recessed inward is provided on the upper part of the base 1; the flexible substrate 5 is suitable for being placed in the recessed area; at least three groups of stretching components 2 are arranged on the base 1 and are evenly distributed along the contour direction of the recessed area, and the stretching components 2 are suitable for clamping the flexible substrate 5 in at least three directions and stretching or releasing it evenly; the spraying component 3 is arranged on the top of the base 1; the spraying component 3 includes a nozzle 31, and the nozzle 31 is suitable for coating the sensitive unit 6 material in an array on the surface of the flexible substrate 5.

[0053] The preparation device of this flexible electronic device places the flexible substrate 5 in the middle of the recessed area, and the clamping ends of at least three groups of stretching components 2 clamp the flexible substrate 5 from three different directions and stretch it. At least three groups of stretching components 2 are evenly distributed along the contour direction of the recessed area, that is, the stretching components 2 are evenly distributed along the circumference of the flexible substrate 5, and the flexible substrate 5 can be evenly stretched from at least three directions. Compared with the existing uniaxial stretching method, after the flexible substrate 5 is released, the material of the sensitive unit 6 shrinks evenly in all directions, the strain is evenly strained, and no cracks or wrinkles will occur.

[0054] After the flexible substrate 5 is stretched, the sensitive unit 6 material is sprayed onto the flexible substrate 5 through the nozzle 31. After the sensitive unit 6 material is solidified, the stretching assembly retracts to release the flexible substrate 5, and the substrate retracts to its initial size.

[0055] During the release process, since the stresses on the sensitive unit 6 material and the flexible substrate 5 are different, the stress mismatch between the two will cause the sensitive unit 6 material layer to produce a buckled or wavy structure. The buckled or wavy structure of the sensitive unit 6 layer has good tensile resistance and can effectively improve the ductility of flexible electronic devices.

[0056] In addition, after the flexible substrate 5 is released, the area of ​​each matrix point of the sensitive unit 6 material and the distance between adjacent matrix points are reduced as the flexible substrate 5 is retracted, which effectively improves the integration and resolution of the flexible electronic device.

[0057] Specifically, see Figure 2 The top contour of the recessed area is circular; there are multiple groups of stretching components 2, and the multiple groups of stretching components 2 are evenly spaced along the circumference of the recessed area. The connecting line of the clamping ends of the multiple groups of stretching components 2 for clamping the flexible substrate 5 is nearly circular, so as to uniformly stretch the flexible substrate 5 in the circumferential direction.

[0058] Each group of stretching components 2 includes a telescopic driver and a clamping claw, the clamping claw is fixed to the driving end of the telescopic driver, and the telescopic driver is fixed to the base 1. After the clamping claw clamps the flexible substrate 5, the driving ends of the multiple groups of telescopic drivers retract to stretch the flexible substrate 5 outward, the coating of the sensitive unit 6 material is completed, and the driving end of the telescopic driver extends to release the substrate. When the clamping claw releases the substrate, the stretching and coating of the flexible substrate 5 are completed.

[0059] See also Figures 3 to 6, the spraying assembly 3 also includes a three-dimensional driving mechanism 32, a supporting assembly, a screen 34 and a first driver 35. For example, the three-dimensional driving mechanism 32 is a three-axis robot arm, and a support 4 is respectively provided on the top of the base 1 on both sides of the recessed area, and the three-axis robot arm includes an X-axis motion assembly 321, a Y-axis motion assembly 322 and a Z-axis motion assembly 323. Among them, the X-axis motion assemblies 321 on both sides are mounted on the supports 4 on both sides, and the nozzle 31 is fixed on the Z-axis motion assembly 323. The three-axis robot arm drives the nozzle 31 to perform three-dimensional motion relative to the flexible substrate 5, and changes the distance and height of the nozzle 31 relative to the flexible substrate 5 as needed, so as to evenly spray the liquid sensitive unit 6 material onto the entire flexible substrate 5.

[0060] The first driver 35 is fixed on one of the supports 4, and the first driver 35 is a linear driver, such as a cylinder. The support assembly includes a support plate 331 and a fixed plate 332. The support plate 331 is connected to the driving end of the first driver 35, and the two sides of the support plate 331 are slidably arranged on the support 4 through guide rails. A "U"-shaped fixed plate 332 is fixed on the support plate 331, and telescopic guide rails 333 are provided on both sides below the fixed plate 332. The telescopic guide rails 333 are provided with grooves that are recessed toward the outside (not shown in the figure). The mesh plate 34 is placed in the middle of the bracket 334. When the mesh plate 34 is installed, the two sides of the bracket 334 are inserted into the groove to push the mesh plate 34 inward to the predetermined position. The mesh plate 34 is provided with small holes arranged in an array, and arrayed and patterned coating can be achieved by spraying the sensitive unit 6 material on the mesh plate 34. A heating device such as an electric heating wire is arranged under the bracket 334. After the flexible substrate 5 is stretched into place, the bracket 334 is heated, and the heat is transferred to the flexible substrate 5 to quickly dry the liquid sensitive unit 6 material on the substrate, thereby shortening the preparation cycle.

[0061] The preparation device of the flexible electronic device also includes a lifting seat (not shown in the figure), which can be lifted and lowered on the base 1 relative to the stretching assembly, and the flexible substrate 5 is suitable for being carried on the lifting seat. The lifting seat is located directly below the fixed plate 332. An ultrasonic transducer is arranged in the nozzle 31, and a control box is arranged on the top of one of the supports 4. An ultrasonic controller electrically connected to the ultrasonic transducer is arranged inside the control box. The ultrasonic controller can control the spray volume of the nozzle 31 as needed, and the three-axis mechanical arm drives the nozzle 31 to move to achieve uniform and efficient spraying.

[0062] When the preparation device is used, the flexible substrate 5 is first placed on the lifting seat, and the lifting seat rises to be flush with the clamping claws of the stretching assembly. The clamping claws clamp the substrate from the edge of the flexible substrate 5, and then the lifting seat descends to disengage from the flexible substrate 5. The driving ends of the multiple sets of telescopic actuators retract to stretch the flexible substrate 5 outward. The bracket 334 is inserted into the grooves on both sides of the telescopic guide rail 333 and pushed to the top of the flexible substrate 5. The first actuator 35 drives the mesh plate 34 to move up and down to adjust the upper and lower distance of the mesh plate 34 relative to the flexible substrate 5. After the distance is adjusted, the three-axis robot arm drives the nozzle 31 to move for spraying. After the spraying of the sensitive unit 6 material is completed, the driving end of the telescopic actuator extends to release the substrate. The stretching and coating of the flexible substrate 5 is completed when the clamping claw releases the substrate.

[0063] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A method for preparing a flexible electronic device, characterized in that: The steps include: Uniformly stretching the flexible substrate (5) along its outer contour direction; After the flexible substrate (5) is stretched into place, the sensitive unit (6) material is coated in an array on the surface of the flexible substrate (5) in the stretched state of the flexible substrate (5); After the material of the sensitive unit (6) on the flexible substrate (5) is solidified, the flexible substrate (5) is released to shrink it back to its original size; After the flexible substrate (5) is stretched into place, a screen (34) is placed above the flexible substrate (5), and an array of small holes is opened on the screen (34). The sensitive unit (6) material is sprayed onto the flexible substrate (5) from above the screen (34).

2. The method for preparing a flexible electronic device according to claim 1, characterized in that: The sensitive unit (6) material is sprayed onto the flexible substrate (5) via a spray head (31), the spray head (31) being fixed on a three-dimensional driving mechanism (32), and the three-dimensional driving mechanism (32) driving the spray head (31) to perform three-dimensional movement relative to the flexible substrate (5).

3. The method for preparing a flexible electronic device according to claim 1 or 2, characterized in that: After the flexible substrate (5) is stretched into place, the flexible substrate (5) is heated; after the flexible substrate (5) is retracted to an initial size, the heating of the flexible substrate (5) is stopped.

4. A manufacturing device for a flexible electronic device, characterized in that: include A base (1) having an inwardly recessed area at its upper portion; a flexible substrate (5) adapted to be placed in the recessed area; At least three groups of stretching components (2) are arranged on the base (1) and are evenly distributed along the contour direction of the recessed area, the stretching components (2) being suitable for clamping the flexible substrate (5) in at least three directions and evenly stretching or releasing it; each group of the stretching components (2) comprises a telescopic drive and a clamping claw, the clamping claw is fixed to the driving end of the telescopic drive, and the telescopic drive is fixed on the base (1); A spraying assembly (3) is arranged on the top of the base (1); the spraying assembly (3) comprises a spray head (31), and the spray head (31) is suitable for coating the sensitive unit (6) material in an array on the surface of the flexible substrate (5).

5. The manufacturing device of the flexible electronic device according to claim 4, characterized in that: The top contour of the recessed area is circular; the stretching components (2) have a plurality of groups, and the plurality of groups of stretching components (2) are distributed at equal intervals along the circumference of the recessed area; and the connecting line of the clamping ends of the plurality of groups of stretching components (2) for clamping the flexible substrate (5) is nearly circular, so as to uniformly stretch the flexible substrate (5) in the circumferential direction thereof.

6. The manufacturing device of the flexible electronic device according to claim 4 or 5, characterized in that: The spraying assembly (3) comprises a three-dimensional driving mechanism (32), wherein the three-dimensional driving mechanism (32) is arranged on the base (1); the spray head (31) is fixed on the three-dimensional driving mechanism (32), and the three-dimensional driving mechanism (32) drives the spray head (31) to perform three-dimensional movement relative to the flexible substrate (5).

7. The manufacturing device for a flexible electronic device according to claim 4 or 5, characterized in that: The spraying assembly (3) further comprises a supporting assembly and a screen (34); the supporting assembly is located above the flexible substrate (5) and is arranged on the base (1) so as to be movable up and down relative to the flexible substrate (5); and the screen (34) is detachably arranged on the supporting assembly.

8. The manufacturing device of the flexible electronic device according to claim 7, characterized in that: It also comprises a first driver (35), wherein the first driver (35) is arranged on the base (1), and the support assembly is arranged at the driving end of the first driver (35).

9. The manufacturing device of the flexible electronic device according to claim 4 or 5, characterized in that: It also comprises a lifting seat, which is arranged on the base (1) so as to be liftable relative to the stretching component, and the flexible substrate (5) is suitable for being carried on the lifting seat.

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