Electronic component and electronic equipment

Abstract

This application discloses an electronic assembly and electronic device. The electronic assembly includes: a PCB, a first-type circuit element, and a second-type circuit element. The first-type circuit element and at least a portion of the second-type circuit element are disposed on the same side surface of the PCB. The first-type circuit element is provided with a sensitive signal pin. The second-type circuit element is a source of interference for the sensitive signal pin, and the sensitive signal pin is located on a side of the first-type circuit element away from the second-type circuit element. In this manner, the sensitive interference of the second-type circuit element on the first-type circuit element can be reduced, thereby improving the sensitivity of the first-type circuit element and the electronic device.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and more particularly to an electronic component and an electronic device. Background Art

[0002] With the continuous development of electronic technology, electronic devices are gradually developing in the direction of miniaturization and multi-functionality. In order to achieve both miniaturization and multi-functionality of electronic devices, multiple circuit components are usually placed on a PCB board of limited size.

[0003] However, during the long-term research and development process, the inventors of this application discovered that since multiple circuit components share a PCB board of limited size, the interference between the circuit components increases, especially the RF components. Their RF signals are extremely susceptible to interference from the signals of other circuit components around them, resulting in a decrease in the RF performance of the RF components and electronic equipment, or even failure to work normally. Summary of the Invention

[0004] The main technical problem solved by the present application is to provide an electronic component and an electronic device to reduce sensitive interference between circuit elements and improve the sensitive performance of circuit elements and electronic devices.

[0005] To solve the above technical problems, the present application provides an electronic assembly. The electronic assembly includes: a PCB; a first-type circuit element; and a second-type circuit element, wherein the first-type circuit element and at least a portion of the second-type circuit element are disposed on the same side surface of the PCB, and the first-type circuit element is provided with a sensitive signal pin; wherein the second-type circuit element is a source of interference for the sensitive signal pin, and the sensitive signal pin is located on a side of the first-type circuit element away from the second-type circuit element.

[0006] In a specific embodiment, the first type of circuit element is further provided with a non-sensitive signal pin, and the non-sensitive signal pin is located on a side of the first type of circuit element adjacent to the second type of circuit element.

[0007] In a specific embodiment, the electronic component further includes a third type of circuit element, which is a source of interference for sensitive signal pins, and the signal interference level of the third type of circuit element is weaker than that of the second type of circuit element; wherein the sensitive signal pin is located on a side of the first type of circuit element adjacent to the third type of circuit element.

[0008] In a specific embodiment, the first type of circuit element is a radio frequency module, the second type of circuit element includes a first step-down switching power supply circuit and a second step-down switching power supply circuit, and the third type of circuit element is an AC power supply component, the AC power supply component is connected to the input end of the first step-down switching power supply circuit, the output end of the first step-down switching power supply circuit is connected to one end of the second step-down switching power supply circuit, and the other end of the second step-down switching power supply circuit is connected to the radio frequency module.

[0009] In a specific embodiment, the electronic component also includes a power cord connected to a first step-down switching power supply, a first ground layer is provided between the power cord and the RF module, and a gap is provided between the first ground layer and the ground layer of the RF module, wherein the power cord, the RF module and the first ground layer are located on the top layer or the bottom layer of the PCB board.

[0010] In a specific embodiment, a second ground layer is provided between the power line and the AC power component, and a gap is provided between the first ground layer and the AC power component, wherein the first ground layer is located on the top layer of the PCB board.

[0011] In a specific embodiment, the electronic component also includes a power line connected to the second type of circuit elements. The power line and the RF module are arranged on the top layer of the PCB board or the bottom layer of the PCB board. The power line is arranged close to the non-sensitive signal pin, and the projection of the power line on the plane where the PCB board is located does not overlap with the projection of the RF module on the plane.

[0012] In a specific embodiment, the second type of circuit element also includes an LED connector and an LED driver power supply, one end of the LED driver power supply is connected to the output end of the first step-down switching power supply circuit, and the other end of the LED driver power supply is connected to the LED connector through a power cord, the power cord is arranged close to the non-sensitive signal pin, and the projection of the power cord on the plane where the PCB board is located does not overlap with the projection of the RF module on the plane; or, the second type of circuit element also includes a third step-down switching power supply circuit, one end of the third step-down power supply circuit is connected to the output end of the first step-down power supply circuit, the other end of the third step-down power supply circuit is connected to the LED connector through a power cord, the power cord is placed close to the non-sensitive signal pin, and the projection of the power cord on the plane where the PCB board is located does not overlap with the projection of the RF module on the plane.

[0013] In a specific embodiment, the non-sensitive signal pin includes a USB signal pin, and the second type of circuit elements also includes an audio power amplifier, a CPU crystal oscillator and a fourth step-down switching power supply. The audio power amplifier and the fourth step-down switching power supply are arranged near the first side of the RF module, and the CPU crystal oscillator and the first step-down switching power supply are arranged near the second side of the RF module. The first side and the second side are arranged opposite to each other, and the first side is perpendicular to the side where the USB signal pin is arranged.

[0014] In a specific embodiment, the AC power supply component is protruded from the PCB board by a pin; or, the AC power supply component is protruded from the PCB board by a spring.

[0015] In a specific embodiment, the sensitive signal pin is any one of a radio frequency signal pin, a microphone signal pin, an audio signal pin, and a phase-locked loop pin.

[0016] To solve the above technical problems, the present application provides an electronic device comprising the above electronic components.

[0017] Compared to the prior art, the electronic assembly of the embodiment of the present application includes: a PCB board, a first-class circuit element, and a second-class circuit element, wherein the first-class circuit element and at least part of the second-class circuit element are respectively arranged on the same side surface of the PCB board, and the first-class circuit element is provided with a sensitive signal pin; wherein the second-class circuit element is a source of interference for the sensitive signal pin, and the sensitive signal pin is located on a side of the first-class circuit element away from the second-class circuit element. In this way, the sensitive signal pin of the first-class circuit element of the embodiment of the present application is arranged away from the second-class circuit element, which is its interference source, so that the interference of the second-class circuit element on the ground layer is mostly absorbed and weakened by the ground layer before reaching the sensitive signal pin, thereby reducing the interference of the second-class circuit element on the sensitive signal pin of the first-class circuit element, thereby improving the sensitive interference of the second-class circuit element on the first-class circuit element, and improving the sensitive performance of the first-class circuit element and the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of an electronic component;

[0019] Figure 2 yes Figure 1 Schematic diagram of the cross-section structure of some structures in an electronic component;

[0020] Figure 3 This is a schematic structural diagram of an embodiment of the electronic component of the present application;

[0021] Figure 4 yes Figure 3 A schematic cross-sectional view of a first type of circuit element and a second type of circuit element in an electronic assembly according to an embodiment;

[0022] Figure 5 yes Figure 3 Schematic diagram of a portion of the circuit assembly in the embodiment

[0023] Figure 6 yes Figure 3 A schematic diagram of the circuit structure of the AC power supply assembly in the embodiment;

[0024] Figure 7 yes Figure 3 A schematic diagram of the circuit structure of a fourth step-down switching power supply circuit in the embodiment;

[0025] Figure 8 yes Figure 3 A schematic diagram of the circuit structure of the LED driving power supply in the embodiment;

[0026] Figure 9 yes Figure 3 A schematic diagram of the circuit structure of the second step-down switching power supply circuit in the embodiment;

[0027] Figure 10 yes Figure 3 A schematic diagram of the circuit structure of an audio power amplifier in an embodiment;

[0028] Figure 11 yes Figure 10 A pulse waveform diagram of an output pin of an audio power amplifier according to an embodiment;

[0029] Figure 12 yes Figure 3 A schematic cross-sectional view of a first type of circuit element and a second type of circuit element in an electronic assembly according to an embodiment;

[0030] Figure 13 It is a structural diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0031] The present application will be further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only intended to illustrate the present application and are not intended to limit the scope of the present application. Similarly, the following examples are only some examples of the present application and not all examples. All other examples obtained by those of ordinary skill in the art without creative work are intended to fall within the scope of protection of this application.

[0032] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the numbers used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0033] like Figure 1 and Figure 2 As shown, Figure 1 It is a schematic diagram of the structure of an electronic component; Figure 2 yes Figure 1Schematic diagram of a cross-sectional structure of a portion of an electronic assembly. Electronic assembly 10 includes a PCB 101, a Wi-Fi module 102, an LED socket 103, an LED socket 113, an LED driver 104, a first switching power supply 105, an audio power amplifier 106, and a second switching power supply 107 and a third switching power supply 115. The LED driver 104, the first switching power supply 105, and the like are arranged on the bottom layer of PCB 101, while the Wi-Fi module 102, the LED socket 103, the LED socket 113, the third switching power supply 115, the audio power amplifier 106, the second switching power supply 107, and the audio power amplifier 106 are arranged on the top layer of PCB 101. LED sockets 103 and 113 are connected to the LED driver 104 via power cables 108 arranged on the top layer of PCB 101.

[0034] Wi-Fi module 102 is located between LED socket 103 and LED driver power supply 104, with power line 108 passing directly underneath Wi-Fi module 102. Wi-Fi module 102 typically uses a two-layer board, resulting in only a ground layer 110 (the ground layer of Wi-Fi module 102) separating Wi-Fi chip 109 and RF traces (not shown) in Wi-Fi module 102 from power line 108 on the top layer of PCB 101. For Wi-Fi chip 109 and RF traces, power line 108 of LED driver power supply 104 is a high-dynamic interference source. This high-dynamic interference source is also mixed with high-switching-frequency ripple and other noise. These interference sources significantly impact the isolation between Wi-Fi chip 109 and RF traces, for example, causing degradation of the RF signal's Error Vector Magnitude (EVM) indicator.

[0035] Furthermore, the Wi-Fi module 102 is located in the middle of the entire PCB board 101 , and the surrounding interference sources may cause interference to the Wi-Fi module 102 through the grounding copper foil conduction of the PCB board 101 .

[0036] Specifically, the LED driver power supply 104 is located in the upper left corner of the Wi-Fi module 102. The ground pin 9 (power ground pin) of the LED driver power supply chip of the LED driver power supply 104 contains rich harmonic noise. This harmonic noise is transmitted to the RF ground pin 118 of the Wi-Fi module 102 through the ground copper foil of the PCB board 101. The RF pin 119 of the Wi-Fi module 102 is coupled to the RF trace and the Wi-Fi chip 109 through the Wi-Fi module 102, resulting in poor isolation between the RF trace and the Wi-Fi chip 109.

[0037] Furthermore, the first switching power supply 105 is located in the upper left corner of the Wi-Fi module 102, the second switching power supply 107 is located to the left of the Wi-Fi module 102, and the third switching power supply 115 is located to the right of the Wi-Fi module 102. Ground pin 6 (power ground pin) of the step-down switching power supply chip in the first switching power supply 105, ground pin 8 (power ground pin) of the step-down switching power supply chip in the second switching power supply 107, and ground pin 7 (power ground pin) of the step-down switching power supply chip in the third switching power supply 115 all have abundant harmonic noise. This harmonic noise is transmitted through the ground copper foil of the PCB board 101 to the RF ground pin 118 and RF pin 119 of the Wi-Fi module 102, and is coupled to the RF trace 123 and Wi-Fi chip 109 on the Wi-Fi module 102, resulting in poor isolation between the RF trace and the Wi-Fi chip 109.

[0038] Furthermore, audio power amplifier 106 (with a built-in Class D power amplifier chip) operates similarly to the aforementioned switching power supply. The Class D power amplifier chip's ground pin 10 is subject to significant harmonic noise. The RF signal from the Wi-Fi module 102's RF signal pin is extremely sensitive to noise. Improper handling can negatively impact RF EVM and antenna wall penetration.

[0039] It's important to note that the interference from these sources on RF signals isn't necessarily in the same frequency band. For example, a mobile phone motherboard's 19MHz clock signal and fingerprint signal are on adjacent layers. Long motherboard traces lack a ground plane. This causes the 19MHz clock signal to be transmitted through the motherboard fingerprint signal via the FPC board to the RF signal on the main antenna board, causing the antenna to malfunction. GSM mobile phones operate in 800MHz and 900MHz frequency bands, which are different from the 19MHz clock signal, but they can still cause interference.

[0040] To solve the above problems, the present application proposes an electronic component, such as Figure 3 and Figure 4 As shown, Figure 3 This is a schematic structural diagram of an embodiment of the electronic component of the present application; Figure 4 yes Figure 3 Schematic diagram of the cross-sectional structure of the first and second type circuit elements in an electronic assembly according to an embodiment. Electronic assembly 40 according to this embodiment includes a PCB 410, a first type circuit element 420, and a second type circuit element (not shown). The first type circuit element 420 and at least some of the second type circuit elements are arranged on the same side surface of PCB 410. The first type circuit element 420 is provided with a sensitive signal pin (not shown). The second type circuit element is a source of interference for the sensitive signal pin 421, and the sensitive signal pin 421 is located on the side of the first type circuit element 420 away from the second type circuit element.

[0041] At least part of the second type of circuit elements are disposed on the other side surface of the PCB board 410 .

[0042] The sensitive signal pins of this embodiment include a radio frequency signal pin 421 and a radio frequency ground pin 437 . The second type of circuit elements are interference sources of the radio frequency signal pin 421 and the radio frequency ground pin 437 .

[0043] Specifically, the first-type circuit element 420 is disposed on the top layer TOP of the PCB board 410, and the second-type circuit element is disposed on the top layer TOP or the bottom layer BOTTOM of the PCB board 410. The RF ground pin 437 of the first-type circuit element 420 and the ground pins (e.g., ground pin 2, ground pin 3, ground pin 4, and ground pin 5) of the second-type circuit element are all connected to the ground layer G2 of the PCB board 410. Although the first-type circuit element 420 and the second-type circuit element share a common ground, the RF signal pin 421 and RF ground pin 437 of the first-type circuit element 420 are located away from the second-type circuit element. This ensures that most of the interference from the second-type circuit element to the ground layer G2 is absorbed and weakened by the ground layer G2 before reaching the RF signal pin 421 and RF ground pin 437.

[0044] Different from the prior art, this embodiment can improve the common ground interference of the second type of circuit elements on the first type of circuit elements 420 , thereby improving the first type of circuit elements and electronic equipment, such as radio frequency performance and other sensitive performance.

[0045] Optionally, the first-type circuit element 420 of this embodiment is further provided with a non-sensitive signal pin 422 , and the non-sensitive signal pin 422 is located on a side of the first-type circuit element 420 adjacent to the second-type circuit element.

[0046] The non-sensitive signal pin 422 of this embodiment is a USB signal pin 422 .

[0047] The RF signal pin 421 and the USB signal pin 422 of the first-type circuit element 420 are located on opposite sides of the first-type circuit element 420. In other embodiments, the RF signal pin 421, the RF ground pin 437, and the USB signal pin 422 of the first-type circuit element can also be located on adjacent sides of the first-type circuit element, and the number of RF signal pins and USB signal pins is not limited. The first-type circuit element can also be provided with other pins, such as sensitive signal pins such as microphone signal pins, headphone signal pins, and phase-locked loop signal pins, digital ground pin 221, and power pin 220.

[0048] Specifically, the first type of circuit element 420 in this embodiment is a radio frequency module 420 , and the radio frequency module 420 may be a Wi-Fi module 420 .

[0049] Wi-Fi module 420 is internally divided into two parts: A. The RF part, which mainly consists of the RF part inside the Wi-Fi chip (an extremely sensitive device) and the RF traces (extremely sensitive traces) on Wi-Fi module 420. The RF part is connected to the RF ground pin 437 and RF signal pin 421 of Wi-Fi module 420; B. The digital part and power supply part inside the Wi-Fi chip. The digital part inside the Wi-Fi chip is connected to the USB interface pin 422 of the Wi-Fi module, and the power supply part inside the Wi-Fi chip is connected to the power pin 220 of the Wi-Fi module 420 and the power supply ground pin.

[0050] The second type of circuit elements in this embodiment include a switching power supply 32. The second type of circuit elements are described by taking the fourth step-down switching power supply 32 as an example (this is just an example, not a limitation), the first type of circuit elements 420 are described by taking the Wifi module 420 as an example (this is just an example, not a limitation), and the PCB board 410 is a 4-layer board (taking a 4-layer board as an example, not a limitation): TOP (top layer), G2 (ground layer, copper foil of the entire board), S3 (third layer), BOTTOM (bottom layer). Figure 4 As shown, the Wifi module 420 has a built-in Wifi chip 87. The left side of the Wifi chip 87 is a USB pin 422. The right side of the Wifi chip 87 is connected to the Wifi module RF pin 421 through the RF trace 83. The Wifi module RF pin 421 is soldered to the Wifi module RF pad 93. The fourth step-down switching power supply 32 is far away from the Wifi module 420. Figure 4The ground pin 2 of the Wi-Fi module 420 (not shown) is soldered to the ground pad 15, and the ground pad 15 is connected to the TOP (top layer) ground copper foil 85, the G2 whole board ground copper foil 33, the S3 ground copper foil 81, and the BOTTOM (bottom layer) ground copper foil 80 of the PCB board 410 through a ground via 82. The RF ground pin 437 of the Wi-Fi module 420 is soldered to the RF ground pad 438, and the RF ground pad 438 is connected to the TOP (top layer) ground copper foil 84 and the G2 whole board ground copper foil 33 of the PCB board 410 through a ground via 89. The ground via 89 is not directly connected to the S3 ground copper foil 41 and the BOTTOM (bottom layer) ground copper foil (that is, the sensitive signal ground pin and ground pad of the first type of circuit element 420 are not directly connected to the ground copper foil of other layers except for being connected to a complete ground copper foil in the PCB board 410). Since the ground pin 2 of the buck switching power supply chip in the fourth buck switching power supply 32 is far away from the RF ground pin 437 of the Wi-Fi module 420, the ground pin 2, ground pad 15, and TOP ground copper foil 85 of the buck switching power supply chip in the fourth buck switching power supply 32 are connected to the RF ground pin 437, RF ground pad 438, and TOP ground copper foil 84 of the Wi-Fi module 420 only through their respective ground vias on the G2 whole-board ground copper foil 87, while no connection is made to the ground copper foils on other layers. This ensures that the interference of harmonic noise generated by the ground pin of the fourth buck switching power supply 32 on the ground layer (G2 whole-board ground copper foil 87) is mostly absorbed and weakened by the ground layer (G2 whole-board ground copper foil 87) before reaching the RF ground pin 437 and the RF pin 421 of the Wi-Fi module 420. The distance between the ground via 438 (or RF ground pin 437) of the RF ground pad 438 and the ground via 82 of the ground pin 2 of the step-down switching power supply chip is L2 ≧ 1mm, preferably L2 ≧ 3mm. The distance between the RF pad 93 (or RF pin 421) and the ground via 82 of the ground pin 2 of the step-down switching power supply chip is L1 ≧ 1mm, preferably L1 ≧ 3mm. The first type of circuit element 420 also includes a sensitive element 87 (only the Wifi chip 87 is used as an example, not limited here), a sensitive trace 83 (only the RF trace 83 is used as an example, not limited here), and an IPEX seat 90.

[0051] The above embodiment is described only by taking a 4-layer PCB board as an example. In other embodiments, the PCB board may also be a multi-layer PCB board of any layer, such as a 2-layer PCB board, a 3-layer board (e.g., a 3-layer flexible board), a 6-layer PCB board, an 8-layer PCB board, a 10-layer PCB board, a 12-layer PCB board, a 14-layer PCB board, a 16-layer PCB board, a 20-layer PCB board, a 22-layer PCB board, a 24-layer PCB board, a 26-layer PCB board, a 28-layer PCB board, a 30-layer PCB board, a 32-layer PCB board, a 34-layer PCB board, a 36-layer PCB board, a 38-layer board, etc.

[0052] The following is a description using a 2-layer PCB board as an example:

[0053] like Figure 12 As shown, Figure 12 yes Figure 3 Schematic diagram of the cross-sectional structure of the first type of circuit element and the second type of circuit element in the electronic assembly of the embodiment. Figure 4 Compare, Figure 12 The PCB shown is a 2-layer PCB, lacking two inner layers (G2, S3) of the 4-layer PCB. The copper foil 888 of the entire board is set on the bottom layer (BOTTOM). The fourth step-down switching power supply 32 is far away from the Wi-Fi module 420, and the step-down switching power supply chip ( Figure 12 The ground pin 2 of the Wi-Fi module 420 is soldered to the ground pad 15, and the ground pad 15 is connected to the TOP (top layer) ground copper foil 85 and the BOTTOM (bottom layer) whole-board ground copper foil 888 of the PCB board 410 through the ground via 82. The RF ground pin 437 of the Wi-Fi module 420 is soldered to the RF ground pad 438, and the RF ground pad 438 is connected to the TOP (top layer) ground copper foil 84 and the BOTTOM (bottom layer) whole-board ground copper foil 888 of the PCB board 410 through the ground via 89. The ground via 89 is not directly connected to the TOP (top layer) ground copper foil 85 (that is, the sensitive signal ground pin and ground pad of the first type circuit element 420 are connected to a complete ground copper foil in the PCB board 410, and the sensitive signal ground pin of the first type circuit element 420 is not directly connected to other layers of ground copper foil). Since the fourth step-down switching power supply 32 Ground pin 2 of the step-down switching power supply chip is located away from the RF ground pin 437 of the Wi-Fi module 420. Ground pin 2, ground pad 15, and top ground copper foil 85 of the step-down switching power supply chip in the fourth step-down switching power supply 32 are connected to the RF ground pin 437, RF ground pad 438, and top ground copper foil 84 of the Wi-Fi module 420 only through their respective ground vias on the bottom (bottom) board ground copper foil 888. No connection is made to the ground copper foils on other layers. This ensures that any harmonic noise generated by the ground pin of the fourth step-down switching power supply 32 and the interference on the ground layer (bottom board ground copper foil 888) is mostly absorbed and weakened by the ground layer (bottom, i.e., bottom board ground copper foil 888) before reaching the RF ground pin 437 and RF pin 421 of the Wi-Fi module 420.

[0054] The distance between the ground via 438 (or RF ground pin 437) of the RF ground pad 438 and the ground via 82 of the ground pin 2 of the step-down switching power supply chip is L2 ≥ 1 mm, preferably L2 ≥ 3 mm. The distance between the RF pad 93 (or RF pin 421) and the ground via 82 of the ground pin 2 of the step-down switching power supply chip is L1 ≥ 1 mm, preferably L1 ≥ 3 mm.

[0055] Optionally, the circuit component 40 of this embodiment further includes a third-type circuit element 434, which is a source of interference for the sensitive signal pin of the first-type circuit element 420, and the signal interference level of the third-type circuit element 434 is weaker than the signal interference level of the second-type circuit element; wherein the sensitive signal pin is located on the side of the first-type circuit element 420 adjacent to the third-type circuit element 434.

[0056] Specifically, the third type of circuit element 434 is an interference source for the RF module 420. The high-voltage electric field generated by the third type of circuit element 434 can interfere with the RF module 420. However, since the third type of circuit element 434 and the RF module 420 are not directly connected to the common ground, the third type of circuit element 434 cannot interfere with the RF module 420 through the common ground. Therefore, the RF signal pin 421 and the RF ground pin 437 of the RF module 420 can be placed adjacent to one side of the third type of circuit element 430, and a certain distance can be maintained between the RF module 420 and the third type of circuit element 430. This can prevent the third type of circuit element 430 from interfering with the RF module 420 through spatial radiation.

[0057] Through this layout, the second type of circuit elements with a stronger signal interference level can be placed close to the non-sensitive signal pins of the RF module 420, such as the USB signal pin 422, that is, away from the RF signal pin 421, and the third type of circuit elements 434 with a weaker signal interference level can be placed close to the sensitive signal pins of the RF module 420, such as the RF signal pin 421, thereby reducing the interference of interference sources on the RF signal pin 421 through common ground conduction.

[0058] Furthermore, the USB signal of the RF module 420 is a digital signal with strong anti-interference capability. Therefore, the USB signal pin 422 is not easily interfered by the third type circuit element 434 .

[0059] Optionally, see also Figures 3 to 7 , Figure 5 yes Figure 3 A schematic diagram of a portion of the circuit assembly in the embodiment, Figure 6 yes Figure 3 The circuit structure diagram of the AC power supply component in the embodiment, Figure 7 yes Figure 3Schematic diagram of the circuit structure of the fourth step-down switching power supply circuit in the embodiment. The third type of circuit element 434 in this embodiment is an AC power supply assembly 434. The second type of circuit elements includes a first step-down switching power supply circuit 92 and a second step-down switching power supply circuit 49. The AC power supply assembly 434 is connected to the input of the first step-down switching power supply circuit 92. The output of the first step-down switching power supply circuit 92 is connected to one end of the second step-down switching power supply circuit 49. The other end of the second step-down switching power supply circuit 49 is connected to the RF module 420. The AC power supply assembly 434 supplies power to the second step-down switching power supply 49, which in turn supplies power to the RF module 420.

[0060] From the above Figure 4 and Figure 5 Analysis shows that a small piece of ground copper foil 84 is placed around the RF ground pad 438 of Wi-Fi module 420 (to which the RF ground pin 437 of Wi-Fi module 420 is soldered). Ground vias 89 are drilled around the ground copper foil 84 around the RF ground pad 438, connecting the RF ground pin 437 of Wi-Fi module 420 to the ground copper foil 87 of G2 on the entire PCB 410. Ground vias 89 are not connected to the ground copper foil on other layers. Ground vias 89 should be placed as evenly as possible around the RF ground pad 438, and the edge spacing between ground vias 89 and RF ground pad 438 should be ≥4 mil (preferably ≥5 mil). This prevents solder from leaking through the ground vias 89 in a high-temperature reflow oven, which could result in insufficient solder on the RF ground pad 438. On the top layer (TOP) of the PCB 410, the ground copper foil 84 is connected only to the RF ground pad 438 and ground via 89 of the Wi-Fi module 420 (herein, one or more ground vias connected to the pad 438 and ground copper foil 84 on the top layer (TOP) are all ground vias 89). The RF ground pad 438 is connected to the RF ground pin 437 of the Wi-Fi module 420 via solder. In other words, the RF ground pin 437 of the Wi-Fi module 420 is connected only to the G2 board ground copper foil 87 and has no direct connection to the ground copper foil on other layers, thereby preventing noise interference from the ground copper foil on other layers (such as the TOP, S3, and BOTTOM).

[0061] In this embodiment, the AC power supply assembly 434 protrudes from the PCB board 410 via ejector pins 443 (or springs). The AC power supply assembly 434 below the Wi-Fi module 420 is connected to the Wi-Fi module 420 via ejector pins 443 (or springs) and ejector pins 444 (or springs). The AC power supply assembly 434 also includes a rectifier element D1, which is used to rectify the AC power into pulsed DC power. After rectification and filtering by the AC power supply assembly 434, the power is provided to the first step-down switching power supply 92 (a second-class circuit element), which generates the Vout2 power supply. The Vout2 power supply trace 91 is derived from the output capacitor (not shown) of the first step-down switching power supply 92 and sent to the doorbell mainboard for input to the various step-down switching power supplies. A Vout2 power trace 91 is installed on the top layer (TOP) between the Wi-Fi module 420 and the AC power supply assembly 434. A ground copper foil 96 is installed between the Vout2 power trace 91 and the Wi-Fi module 420 to provide a return path for the Vout2 power trace 91 on the top layer (TOP). A narrow gap 94 is created between the ground copper foil 96 between the Vout2 power trace 91 and the Wi-Fi module 420 and the ground copper foil underneath the Wi-Fi module 420. This prevents the return path of the Vout2 power trace 91 on the top layer (TOP) from passing under the Wi-Fi module 420, which could degrade the isolation of the Wi-Fi module 420 and the performance of the Wi-Fi module 420. A ground copper foil 97 (top layer) is also provided between Vout2 power trace 91 and AC power assembly 434. A gap separates ground copper foil 97 and AC power assembly 434. This means that all layers between ground copper foil 97 (top layer) and AC power assembly 434 are not covered with ground copper foil. This allows noise from the external AC power supply to be introduced through ejector pins 443 (or springs) and ejector pins 444 (or springs). This noise is filtered by the EMI filter in AC power assembly 434 before being input into first step-down switching power supply 92, ultimately producing a clean Vout2 power supply. If ground copper foil 97 were provided directly below AC power assembly 434, the noise introduced from the external AC power supply would be directly coupled to ground copper foil 97, resulting in an unclean ground plane on the entire doorbell PCB.

[0062] Alternatively, as Figure 6As shown, pin 443 (or spring clip) is connected to fuse F1, one end of rectifier element D1 is connected to the AC pin, while pin 444 (or spring clip) is connected to the other end of rectifier element D1. A protector TVS1 is connected in parallel across rectifier element D1. The positive and negative electrodes of rectifier element D1 are connected to common-mode inductor L3, respectively. The other two pins of common-mode inductor L3 are connected to capacitors C10, C11, and C12, respectively. AC power is injected from ejector pin 443 (or spring clip) and ejector pin 444 (or spring clip), and after being protected by protector TVS1, it is sent to rectifier element D1. After being rectified by rectifier element D1, filtered by common-mode inductor L3 (filtering common-mode noise), and filtered by capacitors C10, C11, and C12, it is sent to the first step-down switching power supply 92 (belonging to the second category of circuit components). After being stepped down by the first step-down switching power supply 92, the output power supply Vout2 is used to power the entire doorbell board.

[0063] Alternatively, as Figure 7 As shown, the VIN pin of the step-down switching power supply chip U4 is connected to the capacitor C14, capacitor C15, and capacitor C16 pins. The other pin of capacitor C15 and the other pin of capacitor C16 are grounded. The GND pin of the step-down switching power supply chip U4 is grounded (connected to the doorbell ground plane). One end of the LX pin of the step-down switching power supply chip U4 is connected to the inductor L4 pin, the cathode pin of the freewheeling diode D2, and capacitor C17. The other pin of capacitor C17 is connected to the BS pin of the step-down switching power supply chip U4. The other pin of inductor L4 is connected to capacitors C18 and C19. The other pins of capacitor C18 and C19 are grounded. The connection point between inductor L4 and capacitor C18 pin and capacitor C19 pin is connected to resistor R5 pin, the other pin of resistor R5 is connected to resistor R6, the other pin of resistor R5 is grounded, and the connection point between resistor R5 and resistor R6 is connected to FB pin (for voltage sampling) of step-down switching power supply chip U4. Capacitor C14, capacitor C15, and capacitor C16 are input capacitors of step-down switching power supply chip U4, capacitor C18 and capacitor C19 are output capacitors of step-down switching power supply chip U4, and C17 is a bootstrap capacitor. Resistors R5 and R6 are sampling resistors. Step-down switching power supply 92 converts the voltage Vout3 (such as Vout2) output from AC power supply component 434 into a voltage Vout3. Figure 4 As shown in Vout3, Figure 5 In the figure, Vout3 = Vin2 is converted to Vout2, which is used to power the entire doorbell board.

[0064] The AC power voltage injected into the AC power component 434 may be 6V to 110V.

[0065] The radio frequency module 420 of this embodiment is a Wi-Fi module 420. In other embodiments, the first type of circuit element may also be a radio frequency module such as a Z-wave module, an NB-IOT module, a Zigbee module, a Bluetooth module, a Lora module, a Sub-GHz module, an LTE Cat1e module, an eMTC module, or a GPRS module, which is not limited here.

[0066] Optionally, the second type of circuit elements in this embodiment also include an LED connector 47 and an LED driver power supply 11. One end of the LED driver power supply 11 is connected to the output end of the first step-down switching power supply circuit 92, and the other end of the LED driver power supply 11 is connected to the LED connector 47 through a power line 433. The power line 433 is arranged close to the non-sensitive signal pin, and the projection of the power line 433 on the plane where the PCB board 410 is located does not overlap with the projection of the RF module on the plane.

[0067] Specifically, one end of the LED driving power supply 11 is connected to the LED connector 47 through the power cord 433, and then connected in series with the power cord 433 through the LED connector 47 and then connected to the LED connector 411, so that the LED driving power supply 11 can supply power to the LED (not shown) set on the LED connector 47 and the LED connector 411; the power cord 433 is set close to non-sensitive signal pins, such as the USB signal pin 422, and the projection of the power cord 422 on the G2 whole board grounding copper foil where the PCB board 410 is located does not overlap with the projection of the RF module 420 on the G2 whole board grounding copper foil, that is, the power cord 422 bypasses the RF module 420 and does not pass under the RF module 420. The LED power cord 433 avoids affecting the isolation of the RF module 420.

[0068] Alternatively, as Figure 8 As shown, Figure 8 yes Figure 3 Schematic diagram of the circuit structure of an LED driver power supply in an embodiment. The LED driver power supply 11 includes a driver chip U1, capacitors C1 and C2, an inductor L1, and a resistor R1. The input pin VIN of the driver chip U1 is connected to one end of the capacitor C1 and receives the input voltage VIN, while the other end of the capacitor C1 is connected to the ground layer of the PCB board 40. The output pin LX of the driver chip U1 is connected to one end of the inductor L1, while the other end of the inductor L1 is connected to one end of the capacitor C2 and the positive electrode of the LED. The other end of the capacitor C2 is connected to the ground layer of the PCB board 40. The feedback pin FB of the driver chip U1 is connected to the negative electrode of the LED and one end of the resistor R1. The other end of the resistor R1 and the ground pin GND of the driver chip U1 are both connected to the ground layer of the PCB board 40.

[0069] The GND pin of U1 is the power ground pin of the LED driver power supply. Under the control of PWM (pulse width modulation) signal, the upper MOSFET (not shown) and lower MOSFET (not shown) inside U1 realize the charging and discharging of inductor L1 and capacitor C2 to maintain the constant current drive of LED (not shown) in the LED light board. At the same time, noise is generated at the GND pin of U1 (connected to the ground pin of the lower MOSFET). Figure 6 As shown, through the layout method of this embodiment, the RF pin 421 and the RF ground pin 437 of the RF module 420 are kept away from strong interference sources such as the inductor L1, the driver chip U1, and the GND pin of U1 in the LED driver power supply 11 (the interference sources are also mixed with ripples of higher switching frequencies and other noise interference sources, which have a great impact on the isolation of the RF signal of the RF module), thereby avoiding interference of the LED driver power supply 11 with the RF pin 421 and the RF ground pin 437 of the RF module 420. In addition, there is a large dynamic signal in the power line 433 of the LED driver power supply 11, which will generate noise when it flows back and pass under the RF module 420, which will affect the isolation of the RF module. Through the layout and wiring method of this embodiment, the power line 422 bypasses the RF module and does not pass under the RF module, which can reduce the impact of the source line 422 on the isolation of the RF module.

[0070] Optionally, the second type of circuit element also includes a third step-down switching power supply circuit 432, one end of the third step-down power supply circuit 432 is connected to the output end of the first step-down power supply circuit 92, and the other end of the third step-down power supply circuit 432 is connected to the LED connector 47 through a power line 433. The power line 433 is placed close to the non-sensitive signal pin, and the projection of the power line 433 on the plane where the PCB board 410 is located does not overlap with the projection of the RF module 420 on the plane.

[0071] Optionally, the second type of circuit elements further include a fourth step-down switching power supply 32, an audio power amplifier 436 and a CPU 442, an image sensor 441, a CPU crystal oscillator 48, and a DDR power supply circuit (not marked in the figure), wherein the other end of the third step-down switching power supply circuit 432 is connected to the CPU 442, the DDR power supply circuit and the image sensor 441, one end of the fourth step-down switching power supply 32 is connected to the output end of the first step-down switching power supply 92, and the other end is connected to the audio power amplifier 436 and the CPU crystal oscillator 48; the audio power amplifier 436 and the fourth step-down switching power supply 32 are located on the first side of the RF module, and the CPU crystal oscillator 48 and the second step-down switching power supply 49 are located on the second side of the RF module, the first side and the second side are arranged opposite to each other, and the first side is perpendicular to the side where the USB signal pin 422 is provided.

[0072] Specifically, the RF module 420 is located in the middle position of the PCB board 410. The RF module 420 includes a first side and a second side arranged opposite to each other, and a third side and a fourth side arranged opposite to each other. The USB signal pin 422 is set on the third side, and the RF signal pin 421 is set on the fourth side. The LED connector 47, the LED driver power supply 11 and the power cord 433 are set close to the third side, and the LED connector 47 is close to the connection between the second side and the third side; the LED driver power supply 11, the fourth step-down switching power supply 32 and the audio power amplifier 436 are set close to the first side, and the fourth step-down switching power supply 32 is located between the LED driver power supply 11 and the audio power amplifier 436; the AC power supply component 434 is set close to the fourth side.

[0073] Alternatively, as Figure 9 As shown, Figure 9 yes Figure 3 Schematic diagram of the circuit structure of the second step-down switching power supply circuit in the embodiment. The second step-down switching power supply circuit 49 includes a power supply chip U2, capacitors C3, C4, C5, inductor L2, resistors R2, and R3. The input pin VIN of the power supply chip U2 is connected to one end of the capacitor C3 and is connected to the first voltage V1. The other end of the capacitor C3 is connected to the ground layer of the PCB board 410. The output pin LX of the power supply chip U2 is connected to one end of the inductor L2, one end of the resistor R2, one end of the capacitor C4, and one end of the capacitor C5, and outputs the second voltage V2. The other end of the capacitor C5 is connected to the ground layer of the PCB board 40. The feedback pin FB of the power supply chip U2 is connected to the other end of the resistor R2, the other end of the capacitor C4, and one end of the resistor R3. The other end of the resistor R3 and the GND pin of the driver chip U2 are connected to the ground copper foil layers of the PCB board 410. The GND pin of the power chip U2 has a high overshoot (the overshoot contains rich harmonic noise). The overshoot injected into the various layers of ground copper foil of the PCB board 410 will produce pulse interference, which will interfere with the RF signal pin 421 of the RF module 420 and the RF ground pin 437 of the RF module 420.

[0074] The above analysis shows that the ground pin of the second step-down switching power supply circuit 49 has a high overshoot. This overshoot is injected into the ground layer of the PCB board 410, generating pulse interference, which interferes with the RF signal pin 421 of the RF module 420 and affects the RF performance of the RF module 420. Therefore, in this embodiment, the RF signal pin 421 of the RF module is arranged away from the second step-down switching power supply circuit 49, which can reduce the interference of the second step-down switching power supply circuit 49 on the RF module 420.

[0075] The circuit structures and operating principles of the first step-down switching power supply circuit 92 , the third step-down switching power supply circuit 432 and the fourth step-down switching power supply circuit 32 of this embodiment are similar to those of the second step-down switching power supply circuit 49 and are not described in detail here.

[0076] Alternatively, as Figure 10 As shown, Figure 10 yes Figure 3 Schematic diagram of the circuit structure of the audio power amplifier in the embodiment. The audio power amplifier 436 includes an audio power amplifier chip U3, capacitors C6, C7, C8, C9, resistors R4, and R5. The input pin IN- of the audio power amplifier chip U3 is connected to one end of the resistor R4, the other end of the resistor R4 is connected to one end of the capacitor C6, and the other end of the capacitor C6 is connected to a signal collector, such as a CPU audio processing part; the input pin IN+ of the audio power amplifier chip U3 is connected to one end of the resistor R5, the other end of the resistor R5 is connected to one end of the capacitor C7, and the other end of the capacitor C6 is connected to a signal collector, such as a CPU audio processing part; Connected to the ground layer of PCB board 40; the input pin SHUTDOWN of the audio power amplifier chip U3 is connected to the pulse signal; the output pin VO- and output pin VO+ of the audio power amplifier chip U3 are connected to the signal output device, such as a speaker, etc.; the power pin VDD of the audio power amplifier chip U3 is connected to the power supply voltage and is grounded through capacitor C8; the power pin PVDD of the audio power amplifier chip U3 is connected to the power supply voltage and is grounded through capacitor C9; the ground pin GND of the audio power amplifier chip U3 is connected to the ground layer of PCB board 40.

[0077] Among them, the model of the audio power amplifier chip U3 is CS8302M.

[0078] From the above analysis, it can be seen that the audio power amplifier 436 (with a built-in Class D power amplifier chip) has a working principle similar to that of the above-mentioned step-down switching power supply. The ground pin of the Class D power amplifier chip has a higher overshoot and rich harmonic noise. The overshoot injected into the ground layer of the PCB board 410 will produce pulse interference, which will interfere with the RF signal pin 421 and the RF ground pin 437 of the RF module 420, and will affect the RF indicators of the RF module 420. Figure 11 The waveform diagram of the output of the Class D power amplifier composed of the CS8302 chip is given. Figure 11 The peak-to-peak value at the output of the Class D power amplifier can reach up to 8V. There is also a significant spike overshoot on the rising edge of the square wave and a significant back-tracking on the falling edge of the square wave, generating a strong pulsed electric field. Therefore, in this embodiment, the RF module's RF pin 421 and RF ground pin 437 are located away from the audio power amplifier 436, which can reduce interference from the audio power amplifier 436 on the RF module.

[0079] The electronic component 40 of this embodiment further includes an antenna, which is disposed on a side of the housing close to the RF module and connected to the RF module via a cable. The antenna may be an FPC antenna, which is disposed on the housing in the form of a patch.

[0080] The power line, RF module and first ground layer of the embodiment of the present application can be set on the top or bottom layer of the PCB board, without specific limitation.

[0081] This application further proposes an electronic device, such as Figure 13 As shown, Figure 13 The electronic device 60 of this embodiment includes an electronic component 61, which is similar to the electronic component of the above embodiment and will not be described in detail here.

[0082] The electronic device of this embodiment is a doorbell device, which can be used in the field of monitoring technology. In other embodiments, the electronic device of this application can also be an electronic device such as a mobile phone, an intercom or other mobile terminal.

[0083] Different from the prior art, the electronic assembly of the embodiment of the present application includes: a PCB board, a first-class circuit element, and a second-class circuit element, wherein the first-class circuit element and at least part of the second-class circuit element are respectively arranged on the same side surface of the PCB board, and the first-class circuit element is provided with a sensitive signal pin; wherein the second-class circuit element is a source of interference for the sensitive signal pin, and the sensitive signal pin is located on a side of the first-class circuit element away from the second-class circuit element. In this way, the sensitive signal pin of the first-class circuit element of the embodiment of the present application is arranged away from the second-class circuit element, which is its interference source, so that the interference of the second-class circuit element on the ground layer is mostly absorbed and weakened by the ground layer before reaching the sensitive signal pin, thereby reducing the interference of the second-class circuit element on the sensitive signal pin of the first-class circuit element, thereby improving the sensitive interference of the second-class circuit element on the first-class circuit element, and improving the sensitive performance of the first-class circuit element and the electronic device.

[0084] The protection circuit and control system provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An electronic component, characterized in that The electronic components include: PCB board; A first type of circuit element and a second type of circuit element, wherein the first type of circuit element and at least part of the second type of circuit element are arranged on the same side surface of the PCB board, and the first type of circuit element is provided with a sensitive signal pin; The second type of circuit element is an interference source of the sensitive signal pin, and the sensitive signal pin is located on a side of the first type of circuit element away from the second type of circuit element; Wherein, the first type of circuit element is further provided with a non-sensitive signal pin, and the non-sensitive signal pin is located on a side of the first type of circuit element adjacent to the second type of circuit element; Wherein, the first type of circuit element is a radio frequency module, and the second type of circuit element includes a first step-down switching power supply circuit and a second step-down switching power supply circuit; Among them, the second type of circuit element also includes an LED connector and an LED driver power supply, one end of the LED driver power supply is connected to the output end of the first step-down switching power supply circuit, and the other end of the LED driver power supply is connected to the LED connector through the power line of the LED driver power supply, the power line of the LED driver power supply is arranged close to the non-sensitive signal pin, and the projection of the power line of the LED driver power supply on the plane where the PCB board is located does not overlap with the projection of the RF module on the plane; or, the second type of circuit element also includes a third step-down switching power supply circuit, one end of the third step-down switching power supply circuit is connected to the output end of the first step-down switching power supply circuit, the other end of the third step-down switching power supply circuit is connected to the LED connector through the power line of the LED driver power supply, and the power line of the LED driver power supply It is placed close to the non-sensitive signal pin, and the projection of the power line of the LED driver power supply on the plane where the PCB board is located does not overlap with the projection of the RF module on the plane; or, the non-sensitive signal pin includes a USB signal pin, and the second type of circuit elements also includes an audio power amplifier, a CPU crystal oscillator and a fourth step-down switching power supply, one end of the fourth step-down switching power supply is connected to the output end of the first step-down switching power supply circuit, and the other end is connected to the audio power amplifier and the CPU crystal oscillator; the audio power amplifier and the fourth step-down switching power supply are arranged close to the first side of the RF module, the CPU crystal oscillator and the second step-down switching power supply circuit are arranged close to the second side of the RF module, the first side is arranged opposite to the second side, and the first side is perpendicular to the side where the USB signal pin is arranged.

2. The electronic component according to claim 1, wherein: The electronic component further includes a third type of circuit element, the third type of circuit element is an interference source for the sensitive signal pin, and the signal interference degree of the third type of circuit element is weaker than the signal interference degree of the second type of circuit element; The sensitive signal pin is located on a side of the first type circuit element adjacent to the third type circuit element.

3. The electronic component according to claim 2, wherein: The third type of circuit element is an AC power supply component, which is connected to the input end of the first step-down switching power supply circuit, the output end of the first step-down switching power supply circuit is connected to one end of the second step-down switching power supply circuit, and the other end of the second step-down switching power supply circuit is connected to the RF module.

4. The electronic component according to claim 3, wherein: The electronic component also includes a power line connected to the first step-down switching power supply circuit, a first ground layer is provided between the power line connected to the first step-down switching power supply circuit and the RF module, and a gap is provided between the first ground layer and the ground layer of the RF module, wherein the power line connected to the first step-down switching power supply circuit, the RF module and the first ground layer are located on the top layer of the PCB board or the bottom layer of the PCB board.

5. The electronic component according to claim 4, wherein: A second grounding layer is provided between the power line connected to the first step-down switching power supply circuit and the AC power supply component, and a gap is provided between the first grounding layer and the AC power supply component, wherein the first grounding layer is located on the top layer of the PCB board.

6. The electronic component according to claim 3, wherein: The electronic component also includes a power line connected to the second type of circuit elements. The power line connecting the second type of circuit elements and the radio frequency module are arranged on the top layer of the PCB board or the bottom layer of the PCB board. The power line connecting the second type of circuit elements is arranged close to the non-sensitive signal pin, and the projection of the power line connecting the second type of circuit elements on the plane where the PCB board is located does not overlap with the projection of the radio frequency module on the plane.

7. The electronic component according to claim 3, wherein: The AC power supply assembly is protrudingly arranged on the PCB board through an ejector pin; Alternatively, the AC power supply component is protrudingly arranged on the PCB board through a spring.

8. The electronic component according to claim 1, wherein: The sensitive signal pin is any one of a radio frequency signal pin, a microphone signal pin, an audio signal pin, and a phase-locked loop pin.

9. An electronic device, characterized in that: The electronic device comprises the electronic component according to any one of claims 1 to 8.

Images