Electronic component and electronic equipment

Abstract

This application discloses an electronic assembly and electronic device. The electronic assembly includes: a PCB, a first-type circuit element, and a second-type circuit element. The PCB is provided with a ground layer. The first-type circuit element is a sensitive element, and the ground pin of the first-type circuit element is connected to the ground layer via a ground wire or a separate copper foil connection to the distal end of the ground pin of the second-type circuit element. The ground pin of the second-type circuit element is connected to the ground layer. This method reduces signal interference from the second-type circuit element to the sensitive element, thereby improving the performance of the sensitive element and the electronic device.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and more particularly to an electronic component and an electronic device. Background Art

[0002] With the continuous development of electronic technology, electronic devices are gradually developing in the direction of miniaturization and multi-functionality. In order to achieve both miniaturization and multi-functionality of electronic devices, multiple circuit components are usually placed on a PCB board of limited size.

[0003] However, during the long-term research and development process, the inventors of this application discovered that since multiple circuit components share a PCB board of limited size, signal interference between circuit components increases. Sensitive components, in particular, are extremely susceptible to interference from signals of other circuit components around them, resulting in performance degradation of electronic equipment and even malfunction. Summary of the Invention

[0004] The main technical problem solved by the present application is to provide an electronic component and an electronic device to reduce signal interference to sensitive components and improve the performance of the sensitive components and the electronic device.

[0005] To solve the above technical problems, the present application provides an electronic assembly. The electronic assembly includes: a PCB board provided with a ground layer; a first type of circuit element and a second type of circuit element, disposed on the PCB board; the first type of circuit element is a sensitive element; the ground pin of the first type of circuit element is connected to the distal end of the ground pin of the second type of circuit element via a ground wire or a separate copper foil and connected to the ground layer; and the ground pin of the second type of circuit element is connected to the ground layer nearby.

[0006] In a specific embodiment, the ground pins of the second type of circuit elements are connected to the ground layer nearby.

[0007] In a specific embodiment, the PCB board further includes a top layer and a bottom layer, the ground pin of the second type of circuit element is connected to the ground layer through the first ground copper foil of the top layer or the first ground copper foil of the bottom layer, the ground pin of the first type of circuit element is connected to the ground wire or one end of the separate ground copper foil through the second ground copper foil of the top layer or the second ground copper foil of the bottom layer, and the other end of the ground wire or the separate copper foil is connected to the ground layer through a ground via located at the far end of the first ground copper foil.

[0008] In a specific embodiment, the second type of circuit element includes a switching power supply, the first type of circuit element includes a microphone connector, and the PCB board further includes an S3 layer, wherein the ground pin of the switching power supply is connected to the first ground copper foil of the top layer of the PCB board, the entire ground copper foil of the ground layer, the ground copper foil of the S3 layer, and the ground copper foil of the bottom layer, or the ground pin of the switching power supply is connected to the first ground copper foil of the bottom layer of the PCB board, the entire ground copper foil of the ground layer, the ground copper foil of the S3 layer, and the ground copper foil of the top layer; the ground pin of the microphone connector is connected to the ground via through the ground wire or the ground copper foil located on the top layer of the PCB board, or the ground pin of the microphone connector is connected to the ground via through the ground wire or the ground copper foil located on the bottom layer of the PCB board.

[0009] In a specific embodiment, the second type of circuit elements include a network port connector, a matching resistor and a matching capacitor, and the first type of circuit elements include a microphone connector, wherein the ground pin of the matching capacitor and the ground pin of the matching resistor are connected to the first ground copper foil of the bottom layer of the PCB board, the ground copper foil of the S3 layer, the entire ground copper foil of the ground layer, and the ground copper foil of the top layer, or the ground pin of the matching capacitor and the ground pin of the matching resistor are connected to the first ground copper foil of the top layer of the PCB board, the ground copper foil of the S3 layer, the entire ground copper foil of the ground layer, and the ground copper foil of the bottom layer; the ground pin of the microphone connector is connected to the ground via through the ground wire or the separate ground copper foil located on the top layer, or the ground pin of the microphone connector is connected to the ground via through the ground wire or the separate copper foil located on the bottom layer.

[0010] In a specific embodiment, the second type of circuit element is a through-hole element, the grounding pin of the through-hole element is a through-hole pin, and the distance between the through-hole pin and the ground via is ≧0.8 mm; the distance between the grounding pin of the first type of circuit element and the ground via is ≧0.8 mm.

[0011] In a specific embodiment, the electronic component is provided with a second ground via, and the ground pin of the second type of circuit element is connected to the ground layer nearby through the second ground via; the second type of circuit element is a patch element, and the ground pin of the second type of circuit element is connected to the second ground via, and the distance between the second ground via and the ground via is ≧0.8 mm; the distance between the ground pin of the first type of circuit element and the ground via is ≧0.8 mm.

[0012] In a specific embodiment, the second type of circuit elements are crystal oscillators, crystals, switching power supply chips, LED driver power supply chips, OLED driver power supply chips, audio amplifier chips, motor driver chips, antennas, radio frequency devices, LCD backlight driver chips, clock driver chips, inductors, transformers, power switch tubes or power chips.

[0013] In a specific embodiment, the first type of circuit element is a microphone, a microphone connector, a radio frequency module, a radio frequency device, a phase-locked loop element, an audio element, an image sensor, a pyroelectric infrared sensing element, a thermistor, a photosensor, a gas sensor, a force sensor, a magnetic sensor, a humidity sensor, an acoustic sensor, a radiation sensor, a photoelectric converter element, a color sensor, a taste sensor, a pyroelectric infrared sensing element connector, a phase-locked loop element connector, an audio element connector, a pyroelectric infrared sensing element connector, a thermistor connector, a photosensor connector, a gas sensor connector, a force sensor connector, a magnetic sensor connector, a humidity sensor connector, an acoustic sensor connector, a radiation sensor connector, a color sensor connector or a taste sensor connector.

[0014] To solve the above technical problems, the present application further provides an electronic device comprising the above electronic components.

[0015] Compared to the prior art, the electronic assembly of the present invention includes: a PCB, a first-class circuit element, and a second-class circuit element, wherein the PCB is provided with a ground layer; wherein the first-class circuit element is a sensitive element, and the ground pin of the first-class circuit element is connected to the ground layer via a ground wire or a separate copper foil around the distal end of the ground pin of the second-class circuit element, and the ground pin is connected to the ground layer, and the pin end of the second-class circuit element is connected to the ground layer. In this way, the second-class circuit element of the present invention is grounded nearby, and the sensitive element is connected to the ground layer via a ground wire or a separate copper foil around the distal end of the ground pin of the second-class circuit element. This can keep the ground point of the sensitive element away from the ground point of the second-class circuit element, so that interference from the second-class circuit element cannot be directly transmitted to the ground point of the sensitive element. In addition, the ground wire (or the separate copper foil) has a certain inductance (the characteristic of inductance is that it always blocks sudden changes in current), which can absorb and weaken most of the interference from the second-class circuit element before it is transmitted to the ground point of the sensitive element. Therefore, the present invention can reduce the signal interference of the second-class circuit element on the sensitive element, and can improve the performance of the sensitive element and the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of an electronic component;

[0017] Figure 2 This is a schematic structural diagram of an embodiment of the electronic component of the present application;

[0018] Figure 3 yes Figure 2 A schematic cross-sectional view of a PCB board, a first type of circuit element, and a second type of circuit element in an electronic assembly of an embodiment;

[0019] Figure 4 1 is a schematic diagram of the cross-sectional structure of a PCB board, a first type of circuit element, and a second type of circuit element in one embodiment of the electronic assembly of the present application;

[0020] Figure 5 yes Figure 2 Schematic diagram of the circuit structure of the network port transformer internal structure and primary-side matching resistor-capacitor connection in the first embodiment of the electronic component;

[0021] Figure 6 yes Figure 2 A schematic diagram of the circuit structure of a switching power supply in an electronic assembly of an embodiment;

[0022] Figure 7 yes Figure 2 A schematic diagram of the circuit structure of an LED driving power supply in an electronic assembly of an embodiment;

[0023] Figure 8 1 is a schematic diagram of the cross-sectional structure of a PCB board, a first type of circuit element, and a second type of circuit element in one embodiment of the electronic assembly of the present application;

[0024] Figure 9 It is a structural diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0025] The present application will be further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only intended to illustrate the present application and are not intended to limit the scope of the present application. Similarly, the following examples are only some examples of the present application and not all examples. All other examples obtained by those of ordinary skill in the art without creative work are intended to fall within the scope of protection of this application.

[0026] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the numbers used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] like Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of an electronic component. Electronic component 10 includes a PCB board 101, a microphone 102, a microphone cable 111, a Wi-Fi module 103, an antenna cable 110, a microphone socket 104, an FPC (Flexible Printed Circuit) antenna 105, a speaker 112, a speaker connector 116, a speaker cabel 117, an Ethernet transformer 114, an image sensor 115, a CPU (central processing unit) 113, a housing 106, an Ethernet connector 107, a switching power supply 108 (12V to 5V), and an LED driver connector 109. Among them, the WIFI module 103, the network port transformer 114, the CPU (central processing unit) 113, the LED driver connector 109, the speaker connector 116, the microphone socket 104 and the network port connector 107 are arranged on the top layer of the PCB board 101, the switching power supply 108 and the image sensor 115 are arranged on the bottom layer of the PCB board 101, and the microphone 102 is connected to the microphone socket 104 on the PCB board 101 through the cable 111; the FPC antenna 105 is arranged on the housing 106, and the FPC antenna 105 is connected to the WIFI module 103 through the antenna cable 110; the speaker 112 is connected to the speaker connector 116 through the speaker cable 117.

[0028] from Figure 1 It can be seen from the figure that the WIFI module 103 is located between the microphone 102 and the microphone socket 104 . Specifically, the projection of the WIFI module 103 on the plane where the PCB board 101 is located is located between the projection of the microphone 102 on the plane and the microphone socket 104 .

[0029] The microphone cable 111 is connected between the microphone 102 and the microphone socket 104. In this layout, the microphone cable 111 passes directly above the WiFi module 103, causing the microphone cable 111 to be adjacent to the WiFi module 103. This in turn causes the microphone 102 to be interfered with by the WiFi module 103 signal, resulting in performance degradation.

[0030] Furthermore, in this layout, the WiFi module 103 is adjacent to the antenna cable 110 and the microphone cable 111 , causing the microphone 102 to be interfered with by the signal of the FPC antenna 105 , resulting in performance degradation.

[0031] To solve Figure 1 To solve the interference problem caused by the microphone cable 111 passing through the WIFI module 103 and the antenna cable 110, the microphone socket 104 can be moved to the position of the microphone 102 on the PCB board 101 (as shown by the dotted arrow and dotted circle in the figure), and the microphone socket 104 is set on the bottom layer of the PCB board 101. In this way, the microphone cable 111 is shorter and away from the WIFI module 103 and the antenna cable 110.

[0032] However, this stacking setting will cause strong interference sources around the microphone socket 104: A. On the left side of the microphone socket 104, there are a switching power supply 108, an LED driver power supply 801, and an LED driver connector 109; B. On the right side of the microphone socket 104, there are an Ethernet connector 107 (with a 12V power supply and Ethernet signal inside), an Ethernet transformer 114, and a primary-end matching resistor (not shown), a matching capacitor (not shown), etc.

[0033] Furthermore, the ground terminal of the microphone socket 104, the ground terminal of the switching power supply 108, the ground terminal of the LED driving power supply 801, the primary matching resistor and the ground terminal of the matching capacitor of the network port transformer 114 are all connected to the ground layer of the PCB board 101 (not shown in the figure), that is, the ground terminals of these components are concentrated in the upper component area of ​​the PCB board 101.

[0034] Since the grounding layer size of the PCB board 101 is limited, for example, the grounding layer size of the PCB board 101 of the camera box is usually 38mm*38mm; and the switching power supply 108 has a very high power-on surge interference when it is turned on (the external 12V input surge is as high as 20V), the power-on surge of the switching power supply 108 is injected into the 38mm*38mm grounding layer, and the microphone socket 104 is close to the switching power supply 108. The grounding end of the microphone 102 will be seriously interfered, causing the microphone 102 to malfunction; in addition, in China's 3C or EU CE certification, the network cable is required to undergo 3.5KV~6KV lightning common mode interference or 500V~1000V differential mode test, CS anti-conduction interference test, EFT electrical fast pulse group test, etc. These interference tests are usually The interference is injected into the network port connector 107 and the network port transformer 114 through an external cable (not shown). Due to the limited size of the ground layer of the PCB board 101, the lightning, CS, and EFT interference from the network port connector 107 are injected into the ground layer, and the ground terminal of the microphone socket 104 will be seriously interfered with, causing the microphone 102 to malfunction. The switching power supply 108 and the LED driver power supply 801 are strong interference sources. The ground terminal of the switching power supply 108 (a strong interference source) and the ground terminal of the LED driver power supply 801 (a strong interference source) contain rich harmonic noise. These harmonic noises are transmitted to the ground pin of the microphone socket 104 through the ground copper foil of the PCB board 101, resulting in obvious noise on the microphone socket 104, which does not meet the design requirements.

[0035] To solve the above problems, the present application proposes an electronic component, such as Figure 2 and Figure 3 、 Figure 4 、 Figure 8 As shown, Figure 2 This is a schematic structural diagram of an embodiment of the electronic component of the present application. Figure 3 yes Figure 2 A schematic cross-sectional view of a PCB board, a first type of circuit element, and a second type of circuit element in an electronic assembly of an embodiment, Figure 3 The first type of circuit components in CMOS are surface mount components. Figure 8 1 is a schematic diagram of the cross-sectional structure of a PCB board, a first type of circuit element, and a second type of circuit element in another embodiment of the electronic assembly of the present application. Figure 8 The first type of circuit element in is the through-hole element.

[0036] Figure 2 and Figure 3As shown, the electronic component 20 of this embodiment includes a PCB board 210, a first type of circuit element 220 (such as a microphone connector 240, etc., connected to the microphone 220) and a second type of circuit element (not shown in the figure), and the PCB board 210 is provided with a ground layer G2; wherein, the first type of circuit element 220 is a sensitive element, and the ground pin 34 of the first type of circuit element 220 is wound around to the far end of the ground pin 3 of the second type of circuit element (such as the switching power supply 108, etc.) through the ground wire 223 (which can also be a separate copper foil) and connected to the ground layer G2; the ground pin 3 of the second type of circuit element is connected to the ground layer G2.

[0037] Figure 2 and Figure 8 As shown, the electronic component 20 of this embodiment includes a PCB board 210, a first type of circuit element 220 (such as a microphone connector 240, etc., connected to the microphone 220) and a second type of circuit element (not shown in the figure), and the PCB board 210 is provided with a ground layer G2; wherein, the first type of circuit element 220 is a sensitive element, and the ground pin 34 of the first type of circuit element 220 is wound around to the far end of the ground pin 67 of the second type of circuit element (such as the switching power supply 108, etc.) through the ground wire 223 (which can also be a separate copper foil) and connected to the ground layer G2; the ground pin 67 of the second type of circuit element is connected to the ground layer G2.

[0038] The ground pin 3 or the ground pin 67 of the second type of circuit element is connected to the nearest ground layer G2.

[0039] The ground pin is connected to the ground layer G2 nearby, which means that when the second type of circuit element is a patch element, the ground pin 3 is directly connected to the ground layer G2 through the ground pad 31, the ground copper foil 33 and the second ground via 32 within the setting range of the ground pin 3 (such as Figure 3 When the second type of circuit element is a through-hole element, the ground pin 67 of the second type of circuit element is a through-hole pin, and the ground pin 67 is directly connected to the ground layer G2 within the setting range of the ground pin 67 through the through-hole pad 66 (as shown in FIG. Figure 8 shown).

[0040] Here, the separate copper foil 223 refers to the ground copper foil that is directly connected only to the ground pin of the first type of circuit element (or the pad of the ground pin of the first type of circuit element) and the via 38, and is not directly connected to the ground copper foil or ground wire in other areas of other layers (such as the top layer T1 and the bottom layer B4). The ground wire 223 refers to the ground wire that is electrically connected only to the ground pin of the first type of circuit element (or the pad of the ground pin of the first type of circuit element) and the via 38, and is not directly connected to the ground copper foil or ground wire in other areas of other layers (such as the top layer T1 and the bottom layer B4). The separate copper foil 223 and the ground wire 223 have the same function, except that the width of the separate copper foil 223 is larger than that of the ground wire 223: the width of the separate copper foil 223 is ≥1mm, while the width of the ground wire 223 is <1mm.

[0041] Unlike the prior art, the second-class circuit element of this embodiment is grounded nearby, while the sensitive element is connected to the ground layer via a ground wire or a separate copper foil wrapped around the distal end of the second-class circuit element's ground pin. This allows the grounding point of the sensitive element to be kept away from the second-class circuit element, preventing interference from the second-class circuit element from being directly transmitted to the grounding point of the sensitive element. Furthermore, the ground wire (or separate copper foil) has a certain inductance, which can absorb and reduce most of the interference from the second-class circuit element before it is transmitted to the grounding point of the sensitive element. Therefore, the embodiments of the present application can reduce signal interference from the second-class circuit element on the sensitive element, thereby improving the performance of the sensitive element and electronic equipment.

[0042] Alternatively, as Figure 3 As shown, the PCB board 210 of this embodiment further includes a top layer T1 and a bottom layer. The ground pin 34 of the second type of circuit element is connected to the ground layer G2 through the first ground copper foil 33 of the top layer T1. The ground pin 3 of the first type of circuit element 240 is connected to one end of the ground wire 223 (or a separate ground copper foil 223) through the second ground copper foil (not shown) of the top layer T1. The other end of the ground wire 223 (or a separate copper foil 223) is connected to the ground layer G2 through a ground via 32 located at the far end of the first ground copper foil 33.

[0043] In other embodiments, the ground pins of the second type of circuit elements may also be connected to the ground layer through the first ground copper foil of the bottom layer, the ground pins of the first type of circuit elements may be connected to one end of the ground wire (or separate ground copper foil) through the second ground copper foil of the top layer, and the other end of the ground wire (or separate ground copper foil) may be connected to the ground layer through a ground via located at the far end of the first ground copper foil; or the ground pins of the second type of circuit elements may also be connected to the ground layer through the first ground copper foil of the bottom layer, the ground pins of the first type of circuit elements may be connected to one end of the ground wire (or separate ground copper foil) through the second ground copper foil of the bottom layer, and the other end of the ground wire (or separate ground copper foil) may be connected to the ground layer through a ground via located at the far end of the first ground copper foil; or the ground pins of the second type of circuit elements may also be connected to the ground layer through the first ground copper foil of the top layer, the ground pins of the first type of circuit elements may be connected to one end of the ground wire (or separate ground copper foil) through the second ground copper foil of the top layer, and the other end of the ground wire (or separate ground copper foil) may be connected to the ground layer through a ground via located at the far end of the first ground copper foil.

[0044] Specifically, if Figure 3 As shown, the second type of circuit element in this embodiment is the switching power supply 108, and the first type of circuit element is the microphone connector 240. The switching power supply 108 is arranged near the microphone connector 240; the ground pin 3 in the switching power supply 108 is soldered to the ground pad 31, and the ground pad 31 is connected to the ground copper foil 33 of the top layer T1 of the PCB board 210, the entire ground copper foil 39 of the ground layer G2, the ground copper foil 81 of the S3 layer, and the ground copper foil 80 of the bottom layer B4 through the second ground via 32; the ground pin 34 of the microphone connector 240 is soldered to the ground pad 35, and the ground pad 35 is connected to the ground line 223 of the top layer T1 of the PCB board 210 through the ground via 32. The ground via 38 (or the ground copper foil 223 alone) is connected to the remote ground via 38. There are no strong interference sources around ground via 38. Neither the ground pad 35 nor the ground wire 223 (or the ground copper foil 223 alone) has direct contact with the first ground copper foil 33 of the top layer T1, the entire board ground copper foil 39 of ground layer G2, the ground copper foil 81 of layer S3, or the ground copper foil 80 of the bottom layer B4. The ground pad 35 and the ground wire 223 (or the ground copper foil 223 alone) are connected only to the ground via 38. Ground via 38, in turn, is connected only to the entire board ground copper foil 39 of ground layer G2. Ground via 38 has no direct connection to the first ground copper foil 33 of the top layer T1, the ground copper foil 81 of layer S3, or the ground copper foil 80 of the bottom layer B4.

[0045] like Figure 3As shown, that is, the ground pin 34 and the ground pad of the sensitive signal of the first type circuit element 220 are connected to a complete ground copper foil in the PCB board 210 through the ground wire 223 (or a separate ground copper foil 223), and the ground pin 34 of the sensitive signal of the first type circuit element 220 is not directly connected to the ground copper foil of other layers or the ground wire of other layers. Since the ground pin 3 of the switching power supply 108 is far away from the ground via 38 of the ground pin 34 of the microphone connector 240, it is only connected to the ground copper foil 39 of the entire board of the ground layer G2 through its own ground via, and the ground copper foils of other layers are not connected. Therefore, the interference of the harmonic noise generated by the ground pin 31 of the switching power supply 108 (a strong interference source) on the ground copper foil 39 of the entire board of the ground layer G2 is mostly absorbed and weakened by the ground copper foil 39 of the entire board of the ground layer G2 before reaching the ground via 38 and the ground pin 34 of the microphone connector 240. Therefore, the harmonic noise of the ground pin of the switching power supply 108 (a strong interference source) and the 20V overshoot generated when the power is turned on have very little interference effect on the microphone connector 240.

[0046] like Figure 3 As shown, optionally, the distance L1 between the ground pin 34 of microphone connector 240 and ground via 38 is ≥ 0.8 mm, preferably ≥ 3 mm. The distance L2 between the ground pin 3 (or ground pad 31) of switching power supply 108 and ground via 38 is ≥ 0.8 mm, preferably ≥ 3 mm. Furthermore, strong interference sources must be avoided at a location with a diameter R ≥ 0.8 mm (preferably L ≥ 3 mm) centered on ground via 38 to prevent interference with the ground pin of microphone connector 240 at ground via 38.

[0047] The switching power supply 108 in this embodiment may be a 12V to 5V switching power supply.

[0048] In other implementations, the switching power supply's ground pin is connected to the first ground copper foil on the bottom layer of the PCB, the entire ground copper foil on the ground layer, the ground copper foil on the S3 layer, and the ground copper foil on the top layer. The microphone connector's ground pin is connected to a ground via via a ground wire or ground copper foil on the bottom layer of the PCB. This arrangement also reduces the interference from the switching power supply to the microphone connector. The principles are similar to those in the previous embodiment and are not detailed here.

[0049] and Figure 3 Compare, Figure 8In another embodiment, the second type of circuit element 108 is a through-hole element, and the ground pin 67 of the second type of circuit element 108 is a through-hole pin. The ground pin 67 of the second type of circuit element 108 (here, the switching power supply 108 is used as an example, but this is not limited here. For example, the second type of circuit element 108 can also be a motor driver, LED driver, etc.) does not need to be connected to the ground layer G2 through a ground via. Instead, the ground pin 67 (which is a strong interference source) is directly connected to the ground layer G2 through a ground pad 66. Optionally, the distance L1 between the ground pin 34 of the microphone connector 240 and the ground via 38 is ≥ 0.8 mm, preferably L1 ≥ 3 mm. The distance L2 between the ground pin 67 of the switching power supply 108 (which is a strong interference source) and the ground via 38 is ≥ 0.8 mm, preferably L2 ≥ 3 mm. In addition, with the ground via 38 as the center, there should be no strong interference source at a position with a diameter R≧0.8 mm (preferably R≧3 mm) to prevent the ground pin of the microphone connector 240 from being interfered with at the ground via 38 .

[0050] In another embodiment, Figure 4 As shown, the ground pin 54 of the second type of circuit element 234 is connected to the ground layer G2 through the first ground copper foil 57 of the bottom layer B4 of the PCB board 210, and the ground pin 34 of the second type of circuit element 240 is connected to one end of the ground wire 223 (or a separate ground copper foil 223) through the second ground copper foil (not marked in the figure) of the top layer T1, and the other end of the ground wire 223 (or a separate copper foil 223) is connected to the ground layer G2 through a ground via 38 located at the far end of the first ground copper foil 57.

[0051] The second type of circuit element in this embodiment may also be the network port transformer 234, matching resistors R3 / R4, and matching capacitor C6, and the first type of circuit element is the microphone connector 240. The network port transformer 234, matching resistors R3 / R4, and matching capacitor C6 are disposed close to the microphone connector 240. The ground pin 54 (a strong interference source) of the matching capacitor C6 of the network port transformer 234 is soldered to the ground pad 56 (a strong interference source). The ground pad 56 is connected to the first ground copper foil 57 of the bottom layer B4 of the PCB board 210, the ground copper foil 58 of the S3 layer, the entire ground copper foil 39 of the ground layer G2, and the ground copper foil 59 of the top layer T1 through the ground via 55 (a strong interference source). The ground pin 34 of the microphone connector 240 is soldered to the ground pad 35. The ground pad 35 is connected to the remote ground via 38 through the ground wire 223 (or a separate copper foil 223) of the top layer T1 of the PCB board 210. There are no strong interference sources around the ground via 38. The ground pad 35, the ground wire 223 (or the separate copper foil 223) are not directly connected to the ground copper foil 55 of the top layer T1, the entire board ground copper foil 39 of the ground layer G2, the ground copper foil 58 of the S3 layer, and the first ground copper foil 57 of the bottom layer B4; the ground pad 35, the ground wire 223 (or the separate copper foil 223) are only directly connected to the ground via 38; and the ground via 38 is only connected to the entire board ground copper foil 39 of the ground layer G2, and the ground via 38 is not directly connected to the ground copper foil 55 of the top layer T1, the entire board ground copper foil 39 of the ground layer G2, the ground copper foil 58 of the S3 layer, and the first ground copper foil 57 of the bottom layer B4.

[0052] That is to say, in addition to being connected to a complete ground copper foil in the PCB board 210 through the ground wire 223 (or a separate ground copper foil 223), the ground pin 34 of the sensitive signal of the first type of circuit element 220 is not directly connected to other layers of ground copper foil or other layers of ground wire. Since the matching capacitor C6 ground pin 54, C6 ground pad 56, and ground via 57 (that is, the second ground via) of the network port transformer 234 are far away from the ground via 38 of the ground pin 34 of the microphone connector 240, they are directly connected only through their respective ground vias on the G2 whole board ground copper foil 39, while other layers of ground copper foil and other layers of ground wires are not directly connected. When the network port transformer 234 of the camera gun is injected with strong interference sources such as lightning, CS, and EFT, the harmonic noise generated by the matching capacitor C6 ground pin 54 of the network port transformer 234 interferes with the whole board ground copper foil 58 of the ground layer G2 before reaching the ground via 38 and the ground pin 34 of the microphone connector 240. Most of the interference is absorbed and weakened by the whole board ground copper foil 58 of the ground layer G2, and the interference effect on the microphone connector 240 is very low.

[0053] The distance L1 between the ground pin 34 of microphone connector 240 and ground via 38 should be ≥ 0.8 mm, preferably ≥ 3 mm. The distance L3 between the ground pin 54 (or ground pad 56) of matching capacitor C6 and ground via 55 of network port transformer 234 and ground via 38 should be ≥ 0.8 mm, preferably ≥ 3 mm. Furthermore, strong interference sources should be avoided at a location with a diameter R ≥ 0.8 mm (preferably R ≥ 3 mm) centered on ground via 38 to prevent interference with the ground pin 34 of microphone connector 240 at ground via 38.

[0054] The return ground wire 223 of the microphone signal line (which can also be a separate copper foil 223), the ground via 38, the microphone signal line 88, and the return ground wire 223 of the microphone signal line (which can also be a separate copper foil 223) cannot be close to the ground end of the strong interference source (such as the switching power supply 108, the LED driver power supply 801, the LED connector 235, the network port connector 107, and the network port transformer 234). Otherwise, the return ground wire 223 of the microphone signal line (which can also be a separate copper foil 223) will be affected by the common ground interference of the ground end of the strong interference source.

[0055] In other implementations, the ground pins of the matching capacitor and the matching resistor are connected to the first ground copper foil on the top layer of the PCB, the ground copper foil on the S3 layer, the entire ground copper foil on the ground layer, and the ground copper foil on the bottom layer. The ground pin of the microphone connector is connected to a ground via via the ground wire or separate ground copper foil on the bottom layer. This arrangement can also reduce the interference of the network port transformer, matching resistor, and matching capacitor on the microphone connector. The principle is similar to that of the above embodiment and is not repeated here.

[0056] In other embodiments, the first type of circuit element may also be other sensitive elements such as a fingerprint module or an image sensor.

[0057] Optionally, the second type of circuit element in this embodiment further includes a communication module 231, and the microphone connector 240 is located between the microphone 220 and the communication module 231. Specifically, the projection of the microphone connector 240 on the side of the PCB board 210 close to the microphone connector 240 is located between the projection of the communication module 231 on that side and the projection of the microphone 220 on that side. In other embodiments, the layout of the connector, the component connected to the connector, and the communication module can also be other layouts, as long as the projection of the first connection line between the component and the connector on the plane of the PCB board does not overlap with the projection of the communication module on that plane. For example, the projection of the connector on the side of the PCB board close to the first type of circuit element is located between the projection of the communication module on that side and the projection of the component on that side.

[0058] Through this layout, the first connecting line 302 between the microphone 220 and the microphone connector 240 can bypass the communication module 231, thereby reducing the interference of the communication module 231 on the first connecting line 302, thereby reducing the interference of the communication module 231 on the microphone 220, and improving the performance of the microphone 220 and the electronic component 20.

[0059] Optionally, the electronic assembly 20 of this embodiment further includes a housing 250, which includes side walls 251 and a bottom wall 252. The side walls 251 and the bottom wall 252 form a receiving cavity (not shown). The PCB board 210 and the first type of circuit elements 220 are disposed on the bottom wall 252, and the second type of circuit elements 230 are disposed on the PCB board 210. The PCB board 210, the first type of circuit elements 220, and the second type of circuit elements 230 are located within the receiving cavity. Of course, in other embodiments, the first type of circuit elements may be disposed on the PCB board, or the second type of circuit elements may be disposed on the PCB board, or some of the first type of circuit elements may be disposed on the PCB board, or some of the second type of circuit elements may be disposed on the PCB board, without limitation.

[0060] The bottom wall 252 of the housing 250 of this embodiment is circular, and the side walls 251 are disposed around the bottom wall 252. Furthermore, a retaining wall (not shown) is further disposed on the bottom wall 252. The retaining wall is disposed around the outer periphery of the bottom wall 252, and a waterproof ring (not shown) is disposed on the side facing away from the bottom wall 252. When the electronic component 20 is assembled with other components of the electronic device, the side of the retaining wall facing away from the bottom wall 252 is engaged with the other components.

[0061] Optionally, the electronic component 20 of this embodiment further includes an antenna 260 , which is disposed on a side of the sidewall 251 of the housing 250 close to the communication module 231 , and is connected to the communication module 231 via a second connection line 300 .

[0062] The antenna 260 may be an FPC antenna and is disposed on the side wall 251 in a patch form.

[0063] Among them, the second connecting line 300 is a cable line. This embodiment uses an FPC antenna and an antenna cable line as the radio frequency front-end structure of the communication module 231, which can reduce the risks brought by the existing antenna stacking structure.

[0064] in, Figure 5A circuit diagram shows the internal structure of the network port transformer and the connections between the primary-side matching resistors and capacitors. The primary side A of the network port transformer 234 is connected to the network port connector 232. The matching resistors R3 and R4 and the matching capacitor C6 of the network port transformer 234 are connected to the ground layer of the PCB board 101. The primary side B of the network port transformer 234 is connected to the CPU 301 (the built-in port physical layer).

[0065] Among them, Figure 6 As shown, Figure 6 yes Figure 2 Schematic diagram of the circuit structure of a switching power supply in an electronic assembly according to an embodiment. The switching power supply 108 includes a power chip U1, capacitors C1, C2, C3, inductor L1, resistors R1, and R2. The input pin IN of the power chip A is connected to one end of the capacitor C1 and receives a first voltage V1. The other end of the capacitor C1 is connected to the ground layer 211 of the PCB board 210. The output pin LX of the power chip A is connected to one end of the inductor L1, one end of the resistor R1, one end of the capacitor C2, and one end of the capacitor C3, and outputs a second voltage V2. The other end of the capacitor C3 is connected to the ground layer 211 of the PCB board 210. The feedback pin FB of the power chip A is connected to the other end of the resistor R1, the other end of the capacitor C2, and one end of the resistor R2. The other end of the resistor R2 and the ground pin GND of the power chip U1 are connected to the ground layer of the PCB board 210.

[0066] Among them, the model of the power chip U1 is SY8121, its switching frequency is 1.2MHz, the capacitor C1 is 10μF / 6.3V, the capacitor C2 is 22pF, the capacitor C3 is 10μF / 6.3V, the inductor L is 2.2μH, the resistor R1 is 100kΩ, the resistor R2 is 49.9kΩ, the first voltage V1 is 12V, and the second voltage V2 is 5V.

[0067] The ground pin of the switching power supply 108 has a high overshoot. This overshoot can be injected into the ground layer of the PCB board 210, generating pulse interference. This can significantly interfere with sensitive components and affect their performance. Therefore, in this embodiment, the ground portion of the sensitive component is routed around the ground portion of the switching power supply 108 via a ground wire 223 (which can also be a separate copper foil 223), thereby reducing interference from the switching power supply 108 on the sensitive component.

[0068] Alternatively, as Figure 7 As shown, Figure 7 yes Figure 2Schematic diagram of the circuit structure of an LED driver power supply in an electronic component embodiment. The LED driver power supply 801 includes a driver chip U2, capacitors C4 and C5, an inductor L2, and a resistor R3. The input pin VIN of the driver chip U2 is connected to one end of the capacitor C4 and receives the input voltage VIN, while the other end of the capacitor C4 is connected to the ground layer of the PCB board 210. The output pin LX of the driver chip U2 is connected to one end of the inductor L2, while the other end of the inductor L2 is connected to one end of the capacitor C5 and the positive electrode of the LED. The other end of the capacitor C5 is connected to the ground layer of the PCB board 210. The feedback pin FB of the LED driver chip U2 is connected to the negative electrode of the LED and one end of the resistor R3. The other end of the resistor R3 and the ground pin GND of the LED driver chip U2 are both connected to the ground layer of the PCB board 210.

[0069] LED driver chip U2 is LN2401 and has a switching frequency of 1.4 MHz. The ground pin of LED driver 801 has a high overshoot. This overshoot, when injected into ground layer 211 of PCB board 210, generates pulse interference, significantly interfering with sensitive components and affecting their performance. Therefore, in this embodiment, the ground portion of the sensitive component is routed away from the ground portion of LED driver 801 via ground wire 223 (which can also be a separate copper foil 223). This reduces the common ground interference of switching power supply 233 on the sensitive component.

[0070] In this embodiment, the first-type circuit element 220 is arranged near the first side of the PCB board 210, the microphone connector 240 is located on the first side of the PCB board 210, the speaker 236 is arranged on the third side of the PCB board 210, the network port transformer 234 is arranged on the fourth side of the PCB board 210, the LED connector 235 and the power supply 233 are arranged at the intersection of the first side and the second side of the PCB board 210, the speaker socket 237 is arranged at the intersection of the second side and the third side of the PCB board 210, and the network port connector 232 is arranged at the intersection of the first side and the side of the PCB board 210, with the first side and the third side arranged opposite to each other, and the second side and the fourth side arranged opposite to each other; and the connector 240 and the power supply 233 are arranged on the bottom layer of the PCB board 210, and the speaker 236, the network port transformer 234, the LED connector 235, the speaker socket 237 and the network port connector 232 are arranged on the top layer of the PCB board 210.

[0071] The electronic component 20 of this embodiment can be used in a camera box. The first type of circuit element 220 is a microphone, such as a microphone or a microphone head. In other embodiments, the first type of circuit element can also be a speaker, a fingerprint module, or an image sensor.

[0072] The communication module 231 is a WIFI module. In other embodiments, the communication module may also be a Bluetooth module, an NFC module, a ZEEGBI module, a UWB module, a Zigbee module, a Z-wave module, a NB-IOT module, a Lora module, a Sub-GHz module, an LTE Cat1e module, an eMTC module, a GPRS module, etc.

[0073] The PCB board 210 of this embodiment can be a double-sided board or a single-sided board, a double-layer board or a multi-layer board, etc.; the above-mentioned connecting wires in this embodiment can be cable wires, which can be set on the front or back of the PCB board 210, or the above-mentioned connecting wires can be metal wires, which can be set on the top signal routing layer or the bottom signal routing layer of the PCB board 210, etc.

[0074] Among them, the first category of circuit elements of the present application is a microphone, a microphone connector, a radio frequency module, a radio frequency device, a phase-locked loop element, an audio element, an image sensor, a pyroelectric infrared sensing element, a thermistor, a photosensitive element, a gas sensor, a force sensitive element, a magnetic sensitive element, a humidity sensitive element, a sound sensitive element, a radiation sensitive element, a photoelectric converter element, a color sensitive element, a taste sensitive element, a pyroelectric infrared sensing element connector, a phase-locked loop element connector, an audio element connector, a pyroelectric infrared sensing element connector, a thermistor connector, a photosensitive element connector, a gas sensor connector, a force sensitive element connector, a magnetic sensitive element connector, a humidity sensitive element connector, a sound sensitive element connector, a radiation sensitive element connector, a color sensitive element connector or a taste sensitive element connector.

[0075] The second category of circuit elements in this application are crystal oscillators, crystals, switching power supply chips, LED driver power supply chips, OLED driver power supply chips, audio amplifier chips, motor driver chips, antennas, radio frequency devices, LCD backlight driver chips, clock driver chips, inductors, transformers, power switch tubes or power chips.

[0076] The above example is only described using a 4-layer PCB board as an example, and can also be a multi-layer PCB board with any layers, such as a 2-layer PCB board, a 3-layer board (for example, a 3-layer flexible board), a 6-layer PCB board, an 8-layer PCB board, a 10-layer PCB board, a 12-layer PCB board, a 14-layer PCB board, a 16-layer PCB board, a 20-layer PCB board, a 22-layer PCB board, a 24-layer PCB board, a 26-layer PCB board, a 28-layer PCB board, a 30-layer PCB board, a 32-layer PCB board, a 34-layer PCB board, a 36-layer PCB board, a 38-layer PCB board, a 40-layer board, a 42-layer board, a 44-layer board, a 46-layer board, a 48-layer board, a 50-layer board, a 52-layer board, a 54-layer board, a 56-layer board, a 58-layer board, a 60-layer board, a 68-layer board, a 70-layer board, etc.

[0077] In other embodiments, the second type of circuit elements may also be other electronic elements, which may be specifically configured according to the performance requirements of the electronic components and electronic equipment.

[0078] In other embodiments, the first type of circuit elements and the second type of circuit elements may also have other layout methods or other grounding methods. As long as the layout method or grounding method separates the grounded part of the sensitive element from the grounded part of the element that interferes with the sensitive element, it belongs to the technical solution to be protected by this application.

[0079] This application further proposes an electronic device, such as Figure 9 As shown, Figure 9 The electronic device 60 of this embodiment includes an electronic component 61, which is similar to the electronic component of the above embodiment and will not be described in detail here.

[0080] The electronic device of this embodiment is a camera gun, which can be used in the field of monitoring technology. In other embodiments, the electronic device of this application can also be an electronic device such as a mobile phone, a walkie-talkie or other mobile terminal.

[0081] Different from the prior art, the electronic assembly of the present invention includes: a PCB board, a first type of circuit element, and a second type of circuit element, wherein the PCB board is provided with a ground layer; wherein the first type of circuit element is a sensitive element, and the ground pin of the first type of circuit element is connected to the ground layer by a ground wire (which can also be a separate copper foil) around the distal end of the ground pin of the second type of circuit element; and the ground pin of the second type of circuit element is connected to the ground layer. In this way, the second type of circuit element in the present invention is grounded nearby, and the sensitive element is connected to the ground layer after being connected to the distal end of the ground pin of the second type of circuit element by a ground wire (which can also be a separate copper foil). This can make the ground point of the sensitive element away from the second type of circuit element, so that the interference of the second type of circuit element cannot be directly transmitted to the ground point of the sensitive element. In addition, the ground wire (which can also be a separate copper foil) has a certain inductance (the characteristic of inductance is that it always blocks sudden changes in current), which can absorb and weaken most of the interference of the second type of circuit element before it is transmitted to the ground point of the sensitive element. Therefore, the embodiments of the present application can reduce the signal interference of the second type of circuit elements on the sensitive elements, and can improve the performance of the sensitive elements and electronic equipment.

[0082] The protection circuit and control system provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An electronic component, characterized in that The electronic components include: A PCB board is provided with a ground layer; A first-type circuit element and a second-type circuit element are arranged on the PCB board, the first-type circuit element is a sensitive element, a ground pin of the first-type circuit element is wound to a distal end of a ground pin of the second-type circuit element via a ground wire or a separate copper foil and connected to the ground layer, and a ground pin of the second-type circuit element is connected to the ground layer; The separate copper foil is directly connected only to the ground pin of the first type of circuit element or the pad or via of the ground pin of the first type of circuit element; the ground wire is electrically connected only to the ground pin of the first type of circuit element or the pad or via of the ground pin of the first type of circuit element; the width of the separate copper foil is greater than the width of the ground wire, the width of the separate copper foil is ≥1 mm, and the width of the ground wire is <1 mm; Wherein, the ground pin of the second type of circuit element is connected to the ground layer nearby; The PCB board further includes a top layer and a bottom layer, the ground pin of the second type of circuit element is connected to the ground layer through the first ground copper foil of the top layer or the first ground copper foil of the bottom layer, the ground pin of the first type of circuit element is connected to one end of the ground wire or the separate ground copper foil through the second ground copper foil of the top layer or the second ground copper foil of the bottom layer, the other end of the ground wire or the separate copper foil is connected to the ground layer through a ground via located at the far end of the first ground copper foil, and the distance between the ground pin of the first type of circuit element and the ground via is ≥0.8 mm.

2. The electronic component according to claim 1, wherein: The second-category circuit element includes a switching power supply, the first-category circuit element includes a microphone connector, and the PCB board further includes an S3 layer, wherein the ground pin of the switching power supply is connected to the first ground copper foil of the top layer of the PCB board, the entire ground copper foil of the ground layer, the ground copper foil of the S3 layer, and the ground copper foil of the bottom layer, or the ground pin of the switching power supply is connected to the first ground copper foil of the bottom layer of the PCB board, the entire ground copper foil of the ground layer, the ground copper foil of the S3 layer, and the ground copper foil of the top layer; The ground pin of the microphone connector is connected to the ground via through the ground wire or the separate copper foil located on the top layer of the PCB board, or the ground pin of the microphone connector is connected to the ground via through the ground wire or the separate copper foil located on the bottom layer of the PCB board.

3. The electronic component according to claim 2, wherein: The second type of circuit elements includes a network port connector, a matching resistor, and a matching capacitor, and the first type of circuit elements includes a microphone connector, wherein the ground pin of the matching capacitor and the ground pin of the matching resistor are connected to the first ground copper foil of the bottom layer of the PCB board, the ground copper foil of the S3 layer, the entire ground copper foil of the ground layer, and the ground copper foil of the top layer, or the ground pin of the matching capacitor and the ground pin of the matching resistor are connected to the first ground copper foil of the top layer of the PCB board, the ground copper foil of the S3 layer, the entire ground copper foil of the ground layer, and the ground copper foil of the bottom layer; The ground pin of the microphone connector is connected to the ground via through the ground wire or the separate copper foil located on the top layer, or the ground pin of the microphone connector is connected to the ground via through the ground wire or the separate copper foil located on the bottom layer.

4. The electronic component according to any one of claims 1, 2 or 3, characterized in that: The second type of circuit element is a through-hole element, the grounding pin of the through-hole element is a through-hole pin, and the distance between the through-hole pin and the ground via is ≧0.8 mm.

5. The electronic component according to any one of claims 1, 2 or 3, characterized in that: The electronic component is provided with a second grounding via, and the grounding pin of the second type of circuit element is connected to the grounding layer nearby through the second grounding via; The second type of circuit element is a patch element, a ground pin of the second type of circuit element is connected to the second ground via, and a distance between the second ground via and the ground via is ≥0.8 mm.

6. The electronic component according to claim 1, wherein: The second type of circuit elements are crystal oscillators, crystals, switching power supply chips, LED driver power supply chips, OLED driver power supply chips, audio amplifier chips, motor driver chips, antennas, radio frequency devices, LCD backlight driver chips, clock driver chips, inductors, transformers, power switch tubes or power chips.

7. The electronic component according to claim 1, wherein: The first category of circuit elements is a microphone, a microphone connector, a radio frequency module, a radio frequency device, a phase-locked loop element, an audio element, an image sensor, a pyroelectric infrared sensing element, a thermistor, a photosensor, a gas sensor, a force sensor, a magnetic sensor, a humidity sensor, a sound sensor, a radiation sensor, a photoelectric converter element, a color sensor, a taste sensor, a pyroelectric infrared sensing element connector, a phase-locked loop element connector, an audio element connector, a pyroelectric infrared sensing element connector, a thermistor connector, a photosensor connector, a gas sensor connector, a force sensor connector, a magnetic sensor connector, a humidity sensor connector, a sound sensor connector, a radiation sensor connector, a color sensor connector or a taste sensor connector.

8. An electronic device, characterized in that: The electronic device comprises the electronic component according to any one of claims 1 to 7.

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