Electromagnetic film

Abstract

The present invention relates to an electromagnetic film, which includes a substrate and a conductive structure. The substrate allows electromagnetic waves to transmit therethrough. A plurality of opening portions are spaced apart on the substrate, and the conductive structure is disposed in the internal space defined by the opening portions. The maximum value among the distances S between all adjacent opening portions is less than the wavelength λ of the electromagnetic wave. By forming gap holes with a pore size smaller than the wavelength of the electromagnetic wave between the plurality of opening portions, the electromagnetic wave diffracts and propagates disorderly when passing through the gap holes, thereby expanding the propagation range.

Description

Technical Field

[0001] The present invention relates to the field of communication technologies, and in particular, to an electromagnetic film. Background Art

[0002] In radio communication, due to the physical property that electromagnetic waves propagate in a straight line, in order to make the propagation range of electromagnetic waves larger, small holes with dimensions smaller than the wavelength of electromagnetic waves are usually processed on a metal layer to scatter the electromagnetic waves, thereby expanding the propagation range. However, the common wavelength of electromagnetic waves is in the micrometer range, and it is difficult to process a number of micrometer-sized holes on the metal layer.

[0003] Therefore, there is an urgent need for an electromagnetic film that can scatter electromagnetic waves to expand the propagation range, simplify the process, and is easy to process. Summary of the Invention

[0004] The purpose of the present invention is to provide an electromagnetic film that can cause diffraction and disordered propagation of electromagnetic waves when passing through the gaps between the opening parts, thereby expanding the propagation range.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] An electromagnetic film provided includes a substrate and a conductive structure. The substrate is transmissive to electromagnetic waves. A plurality of opening parts are arranged at intervals on the substrate. The conductive structure is disposed in the internal space defined by the opening parts. The maximum value of the spacing S between all adjacent opening parts is less than the wavelength λ of the electromagnetic waves.

[0007] Further, the opening parts are formed by stamping the substrate.

[0008] Further, in terms of unit area, the area ratio of the opening parts provided on the substrate is 1%-99%. Preferably, in terms of unit area, the area ratio of the opening parts provided on the substrate is 25%-65%.

[0009] Further, the opening parts are arranged on the substrate along a first direction and a second direction respectively, wherein the first direction and the second direction are arranged at an angle.

[0010] Further, the first direction and the second direction are perpendicular to each other. Along the first direction or the second direction, adjacent rows of the opening parts are arranged in a staggered manner.

[0011] Further, along at least one direction of the substrate, the spacing S between adjacent opening parts shows a trend of being larger in the middle and smaller on both sides, and the direction is any direction in the plane of the substrate.

[0012] Further, a conductive layer is provided on one side of the substrate, the bottom of the opening penetrates through the side of the substrate close to the conductive layer, and the conductive structure provided in the opening is connected to the conductive layer.

[0013] Further, the conductive layer and the conductive structure are integrally formed.

[0014] Further, an insulating layer is provided on one side of the substrate.

[0015] Further, an adhesive layer is provided on one side of the substrate, and the adhesive layer and the insulating layer are respectively provided on opposite sides of the substrate.

[0016] Advantages of the present invention compared with the prior art:

[0017] For the electromagnetic film of the present invention, gaps smaller than the wavelength of electromagnetic waves can be formed between multiple openings, and a conductive structure is provided in the openings. When electromagnetic waves pass through the gaps, diffraction occurs and the waves propagate disorderly, thereby expanding the propagation range. Description of the drawings

[0018] Figure 1 is a cross-sectional view of the electromagnetic film according to an embodiment of the present invention.

[0019] Figure 2 is a top view of the electromagnetic film according to an embodiment of the present invention.

[0020] Figure 3 is a top view of the substrate according to an embodiment of the present invention.

[0021] Figure 4 is a top view of the substrate according to another embodiment of the present invention.

[0022] Figure 5 is a cross-sectional view of the electromagnetic dissipation according to another embodiment of the present invention.

[0023] Figure 6 is a cross-sectional view of the electromagnetic film according to still another embodiment of the present invention.

[0024] Figure 7 is a cross-sectional view of the electromagnetic film according to yet another embodiment of the present invention.

[0025] In the figure:

[0026] 1. Substrate; 11. Opening; 2. Conductive structure; 3. Insulating layer; 4. Conductive layer; 5. Adhesive layer. Detailed implementation manners

[0027] To make the technical problems solved by the present invention, the technical solutions adopted, and the achieved technical effects clearer, the technical solutions of the present invention will be further described below with reference to the drawings and through specific implementation manners.

[0028] As Figure 1 and Figure 2 shown, an electromagnetic film provided by the present invention includes a substrate 1 and a conductive structure 2. The substrate 1 allows electromagnetic waves to transmit through. A plurality of opening portions 11 are spaced on the substrate 1. The conductive structure 2 is disposed in the internal space defined by the opening portions 11. The maximum value of the spacing S between all adjacent opening portions 11 is less than the wavelength λ of the electromagnetic wave. It can be understood that the wavelength λ of the electromagnetic wave used for communication is generally between 0.1 millimeter and 1 meter. The electromagnetic wave has the characteristic of straight-line propagation, resulting in a relatively narrow propagation range of the signal. When the electromagnetic wave passes through a small hole or slit smaller than the wavelength λ, a diffraction phenomenon will occur, and the electromagnetic wave propagates disorderly around the small hole or slit. In this embodiment, a plurality of opening portions 11 are spaced on the substrate 1, and the conductive structure 2 is provided in the opening portions 11. The electromagnetic wave can transmit through the substrate 1 but cannot transmit through the conductive structure 2. The spacing S between adjacent opening portions 11 is the size of the gap hole between the corresponding adjacent conductive structures 2. The maximum value of the spacing S between all adjacent opening portions 11 is less than the wavelength λ of the electromagnetic wave, that is, the maximum value of the size S of the gap hole between all adjacent conductive structures 2 is less than the wavelength λ of the electromagnetic wave. Therefore, when the electromagnetic wave is incident on the electromagnetic film, after the electromagnetic wave transmits through the substrate 1, it diffracts along the gap holes between the conductive structures 2 and propagates disorderly around the gap holes.

[0029] It should be noted that, as shown in Figure 2 , the spacing S between adjacent opening portions 11 is the straight-line distance from a point on the contour line of one opening portion 11 to a point on the contour line of the adjacent opening portion 11 on the adjacent side along the surface of the substrate 1. The maximum value of the spacing S between adjacent opening portions 11 is the maximum value of the straight-line distance S between two points on the adjacent sides of two adjacent opening portions 11 along the surface of the substrate 1. It can be understood that when the maximum value of the straight-line distance S between two points on the adjacent sides of two adjacent opening portions 11 is less than the electromagnetic wave wavelength λ, the spacing between other points on the adjacent sides of the two adjacent opening portions 11 is also less than the electromagnetic wave wavelength λ. Furthermore, a gap with a size less than the electromagnetic wave wavelength λ is formed between adjacent conductive structures 2, so that the electromagnetic wave diffracts when passing through this gap.

[0030] Specifically, the opening portion 11 can be a square hole, a circular hole, a spherical hole or a hole of other shapes, and can also be a long groove-shaped recess extending in one direction of the substrate 1. The function of the opening portion 11 is to accommodate the conductive structure 2. Therefore, the shape of the opening portion 11 can be a regular geometric shape or an irregular shape. For example, the opening portion 11 is in the shape of a square hole or a tree shape. Of course, in other embodiments, the opening portion 11 can also be a combination of one or more of a square hole-shaped hole, a circular hole-shaped hole, a spherical hole-shaped hole or holes of other shapes.

[0031] Specifically, the material of the conductive structure 2 needs to have electrical conductivity and electromagnetic shielding properties. The material of the conductive structure 2 is one or a combination of copper, nickel, silver, gold, tin, zinc, lead, chromium, molybdenum, or is a conductive rubber material, or other conductive materials. In this embodiment, the conductive structure 2 is a metal, preferably metal copper.

[0032] In one embodiment, referring to Figure 2 As shown, a plurality of openings 11 are provided on the substrate 1. The openings 11 are square holes. The maximum value of the spacing S between all adjacent openings 11 is less than the electromagnetic wave wavelength λ. A conductive structure 2 is provided in the internal space of the openings 11, and a gap hole is formed between the conductive structures 2. The size of the gap hole is less than the electromagnetic wave wavelength λ. The size of the gap hole is the straight-line distance between any two points on the cross-sectional contour line of the hole. In this embodiment, the conductive structure 2 is metal copper. When an electromagnetic wave is incident on the surface of the substrate 1, the electromagnetic wave cannot penetrate the conductive structure 2 and passes through the gap holes between the conductive structures 2 and diffracts.

[0033] Specifically, the openings 11 are formed by stamping the substrate 1.

[0034] Specifically, in terms of unit area, the area ratio of the openings 11 provided on the substrate 1 is 1% - 99%. Preferably, in terms of unit area, the area ratio of the openings 11 provided on the substrate 1 is 25% - 65%. It can be understood that the area ratio of the openings 11 per unit area on the substrate 1 is the ratio of the total area of the cross-sections of the plurality of openings 11 to the unit area. To achieve the multi-directional propagation of electromagnetic waves, it is necessary to ensure that a large number of electromagnetic waves pass through the gap holes between the conductive structures 2 and diffract. If the ratio of the openings 11 per unit area is too small, then an insufficient number of gap holes cannot be formed on the substrate 1, and thus the diffraction intensity of the electromagnetic wave is not sufficient to achieve multi-directional coverage. If the ratio of the openings 11 is too large, then the openings 11 provided on the substrate 1 are too dense, and the substrate 1 is prone to cracking or deformation during the stamping process. Therefore, in actual applications, the ratio of the openings 11 per unit area can be reasonably designed according to the application scenario of the electromagnetic film. In this embodiment, the preferred area ratio of the openings 11 is 25% - 65%.

[0035] It should be noted that the unit area is intended to represent the density of the distribution of the openings 11 on the substrate 1.

[0036] Specifically, the openings 11 are provided on the substrate 1 along the first direction and the second direction respectively, wherein the first direction and the second direction are arranged at an angle. It can be understood that the openings 11 are arranged along two directions at an angle, and gap holes for electromagnetic wave diffraction can be formed in both directions, improving the distribution density of the gap holes per unit area on the substrate 1, which is beneficial to improving the diffraction intensity of the electromagnetic wave.

[0037] Specifically, the first direction is perpendicular to the second direction. Along the first direction or the second direction, the opening portions 11 of adjacent rows are staggeredly distributed. It can be understood that when the two directions are perpendicularly arranged, it is beneficial to reduce the spacing size between the opening portions 11, and the electromagnetic wave diffraction intensity can be further enhanced.

[0038] In one embodiment, as Figure 3 shown, along the X and Y directions, a plurality of opening portions 11 are spaced on the substrate 1. The opening portions 11 are square, and a conductive structure 2 is provided in the opening portions 11. The conductive structure 2 is made of metallic copper. Along the X direction or the Y direction, the conductive structures 2 of adjacent rows are staggeredly distributed, so that gap holes are formed between the plurality of conductive structures 2 in the two directions. The gap holes are square, and the size of the gap holes is smaller than the wavelength λ of the electromagnetic wave. When the electromagnetic wave is incident on the surface of the substrate 1, the electromagnetic wave cannot penetrate through the conductive structure 2 but passes through the gap holes between the conductive structures 2 and diffracts. The diffracted electromagnetic wave propagates disorderly around the gap holes, thereby expanding the propagation range of the electromagnetic wave.

[0039] Specifically, along at least one direction of the substrate 1 and along any direction in the plane of the substrate 1, the spacing S between adjacent opening portions 11 shows a trend of being larger in the middle and smaller on both sides. It can be understood that if the spacing S between adjacent opening portions 11 shows a trend of being larger in the middle and smaller on both sides, then the size of the gap holes between adjacent conductive structures 2 on the substrate 1 shows a trend of being larger in the middle and smaller on both sides. The sizes of the gap holes are different, so that the intensity of the incident electromagnetic wave diffracting at the gap holes at different positions on the substrate 1 is different.

[0040] In one embodiment, as Figure 4 shown, along the X and Y directions, a plurality of opening portions 11 are spaced on the substrate 1. The opening portions 11 are square, and a conductive structure 2 is provided in the opening portions 11. The conductive structure 2 is made of metallic copper. Along the X and Y directions respectively, the sizes of the gap holes between the conductive structures 2 show a trend of being larger in the middle and smaller on both sides. When the electromagnetic wave is incident on the surface of the substrate 1, the electromagnetic wave cannot penetrate through the conductive structure 2 but passes through the gap holes between the conductive structures 2 and diffracts. At the same time, since the size of the gap holes gradually decreases from the middle to both sides, the intensity of the electromagnetic wave diffraction gradually increases from the middle to both sides. In this embodiment, the distribution of the strength of the electromagnetic wave diffraction is similar to a circle. The electromagnetic wave diffraction in the middle region of the substrate 1 is weaker, and the electromagnetic wave diffraction in the surrounding region of the substrate 1 is stronger. It is beneficial for the electromagnetic wave to propagate disorderly to the surrounding region of the substrate 1 to expand the propagation range of the electromagnetic wave.

[0041] In another embodiment, as Figure 5As shown, a conductive layer 4 is provided on one side of the substrate 1. The bottom of the opening 11 penetrates through the side of the substrate 1 close to the conductive layer 4, and the conductive structure 2 provided in the opening 11 is connected to the conductive layer 4. It can be understood that the conductive layer 4 can be used for grounding to conduct the interfering charges accumulated in the conductive structure 2, thereby avoiding the accumulation of interfering charges to form an interference source. At the same time, electromagnetic waves cannot penetrate the conductive layer 4. When electromagnetic waves are incident on the substrate 1, after passing through the substrate 1, they cannot penetrate the conductive layer 4 and are reflected, and propagate to the side of the electromagnetic film away from the conductive layer 4.

[0042] In yet another embodiment, as Figure 6 shown, a conductive layer 4 is provided on one side of the substrate 1, and the conductive structure 2 provided in the opening 11 is integrally formed with the conductive layer 4. It can be understood that the conductive layer 4 can be used for grounding to conduct the interfering charges accumulated in the conductive structure 2, thereby avoiding the accumulation of interfering charges to form an interference source. At the same time, electromagnetic waves cannot penetrate the conductive layer 4. When electromagnetic waves are incident on the substrate 1, after passing through the substrate 1, they cannot penetrate the conductive layer 4 and are reflected, and propagate to the side of the electromagnetic film away from the conductive layer 4.

[0043] Specifically, the material of the conductive layer 4 needs to have electrical conductivity and electromagnetic shielding properties. The material of the conductive layer 4 is one or a combination of copper, nickel, silver, gold, tin, zinc, lead, chromium, molybdenum, or a conductive rubber material, or other conductive materials. In this embodiment, the conductive layer 4 is a metal layer, preferably a copper foil.

[0044] Specifically, referring to Figure 1 shown, an insulating layer 3 is provided on one side of the substrate 1. The insulating layer 3 serves to protect the conductive structure 2 on the substrate 1 and is also used for connection with other components.

[0045] Specifically, an adhesive layer 5 is provided on one side of the substrate 1, and the adhesive layer 5 and the insulating layer 3 are respectively provided on opposite sides of the substrate 1. It can be understood that the adhesive layer 5 is used for connection with the surface of other components.

[0046] Specifically, as Figure 7 shown, an adhesive layer 5 is provided on the side of the substrate 1 away from the conductive structure 2. The adhesive layer 5 is used for connection with the surface of other components.

[0047] Specifically, as Figure 6 shown, an insulating layer 3 is provided on the side of the substrate 1 close to the conductive structure 2, and an adhesive layer 5 is provided on the side of the substrate 1 close to the conductive layer 4. The conductive layer 4 is embedded in the adhesive layer 5, and one end of the conductive layer 4 is flush with the adhesive layer 5 so that the conductive layer 4 can be electrically connected to other components.

[0048] Specifically, in this embodiment, the material of the substrate 1 includes but is not limited to a PI board.

[0049] The remarkable effect of this embodiment is that: by providing a plurality of opening portions 11 on the substrate 1 and arranging a conductive structure 2 in the internal space of the opening portions 11, a gap hole with a size smaller than the wavelength of the electromagnetic wave is formed between the plurality of conductive structures 2, and when the electromagnetic wave passes through the gap hole, diffraction occurs and the wave propagates disorderly, thereby expanding the propagation range.

[0050] The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. An electromagnetic film, characterized in that, it includes a substrate (1) and a conductive structure (2). The substrate (1) allows electromagnetic waves to transmit through. A plurality of opening parts (11) are arranged on the substrate (1) at intervals. The conductive structure (2) is arranged in the internal space defined by the opening parts (11). The maximum value of the distance S between all adjacent opening parts (11) is less than the wavelength λ of the electromagnetic wave; the electromagnetic wave cannot transmit through the conductive structure (2).

2. The electromagnetic film according to claim 1, characterized in that, the opening part (11) is formed by stamping the substrate (1).

3. The electromagnetic film according to claim 1, characterized in that, in terms of unit area, the area ratio of the opening parts (11) arranged on the substrate (1) is 1% - 99%, and in terms of unit area, the area ratio of the opening parts (11) arranged on the substrate (1) is 25% - 65%.

4. The electromagnetic film according to claim 1, characterized in that, the opening parts (11) are arranged on the substrate (1) along a first direction and a second direction respectively, wherein the first direction and the second direction are arranged at an angle.

5. The electromagnetic film according to claim 4, characterized in that, the first direction and the second direction are perpendicular to each other. Along the first direction or the second direction, adjacent two rows of the opening parts (11) are staggeredly distributed.

6. The electromagnetic film according to claim 1, characterized in that, along at least one direction of the substrate (1), the distance S between adjacent opening parts (11) shows a trend of being larger in the middle and smaller on both sides, and the direction is any direction in the plane of the substrate (1).

7. The electromagnetic film according to claim 1, characterized in that, a conductive layer (4) is arranged on one side of the substrate (1). The bottom of the opening part (11) penetrates through the side of the substrate (1) close to the conductive layer (4), and the conductive structure (2) arranged in the opening part (11) is connected to the conductive layer (4).

8. The electromagnetic film according to claim 7, characterized in that, the conductive layer (4) and the conductive structure (2) are integrally formed.

9. The electromagnetic film according to claim 1, characterized in that, an insulating layer (3) is arranged on one side of the substrate (1).

10. The electromagnetic film according to claim 9, characterized in that, an adhesive layer (5) is arranged on one side of the substrate (1), and the adhesive layer (5) and the insulating layer (3) are respectively arranged on opposite sides of the substrate (1).

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