Chemical substance supply unit, substrate processing device and substrate processing method

Abstract

An apparatus for processing a substrate includes: a housing having a processing space for processing the substrate; a support unit supporting the substrate in the processing space; a nozzle dispensing chemicals onto the substrate; a chemical supply unit supplying chemicals to the nozzle; and a controller controlling the chemical supply unit. The chemical supply unit includes: a tank having an internal space for storing chemicals; a sensor detecting a remaining amount of the chemicals stored in the tank; an inlet line supplying the chemicals from a chemical supply source to the tank; an outlet line supplying the chemicals from the tank to the nozzle; and a discharge line discharging the chemicals in the tank. In a state where the chemicals remain in the tank, when the remaining amount detected by the sensor reaches a first preset amount or less, the controller controls the chemical supply unit to supply new chemicals from the chemical supply source to the tank.

Description

Technical Field

[0001] Embodiments of the inventive concepts described herein relate to a chemical supply unit for supplying chemicals to a nozzle to dispense the chemicals onto a substrate, a substrate processing apparatus including the chemical supply unit, and a substrate processing method using the substrate processing apparatus to process a substrate. Background Art

[0002] The contaminants (e.g., particles, organic contaminants, or metal contaminants, etc.) remaining on the surface of the substrate greatly affect the characteristics and yield of the semiconductor element. Therefore, the cleaning process of removing various types of contaminants adhering to the surface of the substrate is becoming a major problem in the semiconductor manufacturing process. The cleaning process is performed before and after each unit process of manufacturing semiconductor elements. Generally, the cleaning process includes a chemical treatment process using chemicals to remove metal foreign matter, organic matter or particles, etc. remaining on the substrate, a rinsing process using deionized water to remove chemicals remaining on the substrate, and a drying process using nitrogen to dry the substrate, etc.

[0003] During the chemical treatment process, the chemical supply unit supplies chemicals to the nozzle unit. Generally, the chemical supply unit includes: a tank that stores chemicals; a supply line through which chemicals are supplied from the inner space of the tank to the nozzle unit; a recovery line through which chemicals used to process the substrate are recovered to the inner space of the tank; and the like. In order to prevent the supply of chemicals from being stopped, two or more tanks are provided, and the chemicals stored in each of the tanks are discharged through a discharge line connected to the tank.

[0004] However, when the liquid level of the chemical stored in the tank does not reach a predetermined liquid level, the chemical in the tank cannot be circulated and completely emptied, so a large amount of the chemical may be wasted unnecessarily. Summary of the invention

[0005] Embodiments of the inventive concept provide a chemical supply unit for reducing the amount of chemicals unnecessarily exhausted from the chemical supply unit, a substrate treating apparatus, and a substrate treating method using the same.

[0006] The technical problems to be solved by the inventive concept are not limited to the problems mentioned above, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the inventive concept belongs based on the present content and the accompanying drawings.

[0007] According to an embodiment, an apparatus for processing a substrate includes: a housing having a processing space in which the substrate is processed; a support unit supporting the substrate in the processing space; a nozzle dispensing chemicals onto the substrate placed on the support unit; a chemical supply unit supplying chemicals to the nozzle; and a controller controlling the chemical supply unit. The chemical supply unit includes: a tank having an internal space in which chemicals are stored; a sensor detecting a residual amount of the chemical stored in the internal space of the tank; an inlet line through which chemicals are supplied from a chemical supply source to the internal space of the tank, and an inlet valve installed in the inlet line; an outlet line through which chemicals are supplied from the internal space of the tank to the nozzle, and an outlet valve installed in the outlet line; and a discharge line through which chemicals in the internal space of the tank are discharged, and a discharge valve installed in the discharge line. In a state where chemicals remain in the internal space of the tank, when the remaining amount detected by the sensor reaches a first preset amount or less, the controller controls the chemical supply unit to supply new chemicals from the chemical supply source to the tank.

[0008] According to an embodiment, the controller can determine whether the number of times the remaining chemicals in the tank and the new chemicals supplied to the tank are mixed with each other exceeds a preset number, and can control the chemical supply unit to discharge the remaining chemicals in the internal space of the tank through the discharge pipeline when the number of times the remaining chemicals in the tank and the new chemicals supplied to the tank are mixed with each other exceeds the preset number and the residual amount detected by the sensor reaches a second preset amount or less.

[0009] According to an embodiment, the first preset amount may be equal to the second preset amount.

[0010] According to an embodiment, the first preset amount may be set to 5% to 15% of the amount of the chemical that the tank can store.

[0011] According to an embodiment, the tank may include a first tank and a second tank, and the chemical supply unit may further include a circulation line which circulates the chemical stored in the other tank of the first tank and the second tank when one of the first tank and the second tank receives the chemical from the chemical supply source through the inlet line, supplies the chemical to the nozzle through the outlet line, or discharges the chemical through the discharge line.

[0012] According to an embodiment, the circulation line may include a heater heating the chemical flowing through the circulation line, and a decompression member transferring the chemical stored in the first tank or the second tank to the heater.

[0013] According to an embodiment, a chemical supply unit for supplying chemicals includes: a tank having an inner space in which chemicals are stored; a sensor detecting a residual amount of chemicals stored in the inner space of the tank; an inlet line through which chemicals are supplied from a chemical supply source to the inner space of the tank, and an inlet valve installed in the inlet line; an outlet line through which chemicals are supplied from the inner space of the tank to an object to be processed, and an outlet valve installed in the outlet line; a discharge line through which chemicals in the inner space of the tank are discharged, and a discharge valve installed in the discharge line; and a controller controlling the chemical supply unit. In a state where chemicals remain in the inner space of the tank, when the remaining amount detected by the sensor reaches a first preset amount or less, the controller controls the chemical supply unit to supply new chemicals from the chemical supply source to the tank.

[0014] According to an embodiment, the controller can determine whether the number of times the remaining chemicals in the tank and the new chemicals supplied to the tank are mixed with each other exceeds a preset number, and can control the chemical supply unit to discharge the remaining chemicals in the internal space of the tank through the discharge pipeline when the number of times the remaining chemicals in the tank and the new chemicals supplied to the tank are mixed with each other exceeds the preset number and the residual amount detected by the sensor reaches a second preset amount or less.

[0015] According to an embodiment, the first preset amount may be equal to the second preset amount.

[0016] According to an embodiment, the first preset amount may be set to 5% to 15% of the amount of the chemical that the tank can store.

[0017] According to an embodiment, the tank may include a first tank and a second tank, and the chemical supply unit may further include a circulation line, which circulates the chemicals stored in the other tank of the first tank and the second tank when one of the first tank and the second tank receives the chemicals from the chemical supply source through the inlet line, supplies the chemicals to the object to be treated through the outlet line, or discharges the chemicals through the discharge line.

[0018] According to an embodiment, the circulation line may include a heater heating the chemical flowing through the circulation line, and a decompression member transferring the chemical stored in the first tank or the second tank to the heater.

[0019] According to an embodiment, a method for processing a substrate includes processing a substrate by dispensing chemicals stored in a tank onto the substrate, wherein when a residual amount of the chemicals in the tank reaches a preset chemical amount or less, new chemicals are supplied into the tank and mixed with the remaining chemicals in the tank, and the mixture of the new chemicals and the remaining chemicals is dispensed onto the substrate.

[0020] According to an embodiment, when the remaining chemicals in the tank and the new chemicals are mixed with each other more than a preset number of times and the residual amount of the chemicals in the tank reaches a preset chemical amount or less, all the chemicals in the tank may be discharged.

[0021] According to an embodiment, a method for processing a substrate includes processing a substrate by dispensing chemicals stored in a tank onto the substrate, wherein when a residual amount of the chemicals in the tank reaches a preset chemical amount or less, new chemicals are supplied into the tank and mixed with the remaining chemicals in the tank, and the mixture of the new chemicals and the remaining chemicals is dispensed onto the substrate.

[0022] According to an embodiment, when the remaining chemicals in the tank and the new chemicals are mixed with each other more than a preset number of times and the residual amount of the chemicals in the tank reaches a preset chemical amount or less, all the chemicals in the tank may be discharged.

[0023] According to an embodiment, the preset chemical amount may be set to 5% to 15% of the amount of chemicals that the tank can store.

[0024] According to an embodiment, the tank may include a first tank and a second tank.

[0025] According to an embodiment, the chemical supply unit may further include a circulation line which circulates the chemicals stored in the other tank of the first tank and the second tank when one tank of the first tank and the second tank receives the chemicals from the chemical supply source through the inlet line, supplies the chemicals to the substrate through the outlet line, or discharges the chemicals through the exhaust line.

[0026] According to an embodiment, the circulation line may include a heater heating the chemical flowing through the circulation line, and a decompression member transferring the chemical stored in the first tank or the second tank to the heater. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, in which like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and in which:

[0028] Figure 1 is a schematic plan view illustrating one example of a substrate processing apparatus equipped with a process chamber according to an embodiment of the inventive concept;

[0029] Figure 2 It shows that the setting Figure 1 A cross-sectional view of an example of a substrate processing apparatus in a processing chamber;

[0030] Figure 3 is a view illustrating a chemical supply unit according to an embodiment of the inventive concept; and

[0031] Figures 4 to 10 are views sequentially illustrating a method of treating a substrate using a chemical supply unit according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0032] Hereinafter, embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. However, the inventive concept may be implemented in different forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided so that the inventive concept will be thorough and complete, and the scope of the inventive concept will be fully conveyed to those skilled in the art. In the drawings, the size of the components is exaggerated for clarity of illustration.

[0033] In the following, reference will be made to Figures 1 to 10 Embodiments of the inventive concept are described in detail.

[0034] Figure 1 is a schematic plan view illustrating a substrate processing apparatus 1 according to the present inventive concept.

[0035] refer to Figure 1 , the substrate processing apparatus 1 includes an index module 10 and a processing module 20. The index module 10 includes a loading port 120 and a transfer frame 140. The loading port 120, the transfer frame 140, and the processing module 20 are arranged in a row in sequence. Hereinafter, a direction in which the loading port 120, the transfer frame 140, and the processing module 20 are arranged is referred to as a first direction 12. A direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and a direction perpendicular to a plane containing the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0036] The carriers 130 , each of which has a substrate W received therein, are seated on the load ports 120 . The load ports 120 are arranged in a row along the second direction 14 . Figure 1 An example in which the index module 10 includes four load ports 120 is described. However, the number of the load ports 120 may be increased or decreased according to conditions such as the processing efficiency and the occupied area of ​​the process module 20. Each of the carriers 130 has a slot (not shown) that supports an edge of the substrate W. The slots are arranged in the third direction 16, and the substrates W are stacked in the carrier 130 one above the other along the third direction 16 with a spacing gap between the substrates. A front-opening unified wafer box (FOUP) may be used as the carrier 130.

[0037] The processing module 20 includes a buffer unit 220, a transfer chamber 240, and a processing chamber 260. The transfer chamber 240 is arranged so that its length direction is parallel to the first direction 12. The processing chamber 260 is arranged on one side and the opposite side of the transfer chamber 240 along the second direction 14. The processing chamber 260 positioned on one side of the transfer chamber 240 and the processing chamber 260 positioned on the opposite side of the transfer chamber 240 are symmetrical to each other relative to the transfer chamber 240. Some of the processing chambers 260 are arranged along the length direction of the transfer chamber 240. In addition, other processing chambers 260 are stacked one on top of another. That is, the processing chamber 260 can be arranged in an A×B array (A and B are natural numbers of 1 or greater) on one side of the transfer chamber 240. Here, "A" represents the number of processing chambers 260 arranged in rows along the first direction 12, and "B" represents the number of processing chambers 260 arranged in columns along the third direction 16. In the case where four or six process chambers 260 are disposed on one side of the transfer chamber 240, the process chambers 260 may be arranged in a 2×2 or 3×2 array. The number of process chambers 260 may be increased or decreased. Alternatively, the process chambers 260 may be disposed only on one side of the transfer chamber 240. In another case, the process chambers 260 may be arranged in a single layer on opposite sides of the transfer chamber 240.

[0038] The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space in which the substrate W stays before being transferred between the transfer chamber 240 and the transfer frame 140. The buffer unit 220 has a slot (not shown) in which the substrate W is placed. The slots (not shown) are spaced apart from each other along the third direction 16. The buffer unit 220 is open at one side facing the transfer frame 140 and at the opposite side facing the transfer chamber 240.

[0039] The conveying frame 140 conveys the substrate W between the carrier 130 disposed on the loading port 120 and the buffer unit 220. An indexing track 142 and an indexing robot 144 are provided in the conveying frame 140. The indexing track 142 is provided so that its length direction is parallel to the second direction 14. The indexing robot 144 is mounted on the indexing track 142 and moves linearly in the second direction 14 along the indexing track 142. The indexing robot 144 includes a base 144a, a main body 144b, and an indexing arm 144c. The base 144a is movable along the indexing track 142. The main body 144b is coupled to the base 144a. The main body 144b is movable on the base 144a along the third direction 16. In addition, the main body 144b is rotatable on the base 144a. The indexing arm 144c is coupled to the main body 144b and is movable forward and backward relative to the main body 144b. The indexing arm 144c is driven separately. The index arms 144c are stacked one on top of another with a spacing gap therebetween along the third direction 16. Some of the index arms 144c may be used to transfer the substrate W from the process module 20 to the carrier 130, and other index arms 144c may be used to transfer the substrate W from the carrier 130 to the process module 20. Therefore, in the process in which the index robot 144 transfers the substrate W between the carrier 130 and the process module 20, particles generated from the substrate W to be processed may be prevented from adhering to the substrate W being processed.

[0040] The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the processing chamber 260, and between the processing chambers 260. A guide rail 242 and a main robot 244 are provided in the transfer chamber 240. The guide rail 242 is provided so that its length direction is parallel to the first direction 12. The main robot 244 is mounted on the guide rail 242, and moves linearly on the guide rail 242 along the first direction 12. The main robot 244 includes a base 244a, a main body 244b, and a main arm 244c. The base 244a can move along the guide rail 242. The main body 244b is coupled to the base 244a. The main body 244b can move on the base 244a along the third direction 16. In addition, the main body 244b can rotate on the base 244a. The main arm 244c is coupled to the main body 244b, and can move forward and backward relative to the main body 244b. The main arm 244c is driven separately. The main arms 244c are stacked one on top of another with a spacing gap therebetween along the third direction 16. The main arm 244c for transferring the substrate W from the buffer unit 220 to the process chamber 260 may be different from the main arm 244c for transferring the substrate W from the process chamber 260 to the buffer unit 220.

[0041] Substrate processing devices 300 for performing a cleaning process on a substrate W are provided in the processing chambers 260, respectively. Depending on the type of the cleaning process performed by the substrate processing device 300, the substrate processing devices 300 disposed in the corresponding processing chambers 260 may have different structures. Alternatively, the substrate processing devices 300 in the corresponding processing chambers 260 may have the same structure. Selectively, the processing chambers 260 may be divided into a plurality of groups. The substrate processing devices 300 disposed in the processing chambers 260 belonging to the same group may have the same structure, and the substrate processing devices 300 disposed in the processing chambers 260 belonging to different groups may have different structures. For example, in the case where the processing chambers 260 are divided into two groups, the first group of processing chambers 260 may be disposed on one side of the transfer chamber 240, and the second group of processing chambers 260 may be disposed on the opposite side of the transfer chamber 240. Selectively, on the opposite side of the transfer chamber 240, the first group of processing chambers 260 may be disposed in the lower layer, and the second group of processing chambers 260 may be disposed in the upper layer. The first group of process chambers 260 and the second group of process chambers 260 may be distinguished from each other according to the type of chemical substance used and the type of cleaning method.

[0042] Hereinafter, one example of the substrate processing apparatus 300 for cleaning the substrate W with the processing liquid will be described. Figure 2 is a cross-sectional view showing an example of the substrate processing apparatus 300. Figure 2 , the substrate processing apparatus 300 includes a housing 320 , a supporting unit 340 , an elevating unit 360 , a nozzle unit 380 , and a chemical supply unit 400 .

[0043] The housing 320 provides a space in which substrate processing is performed. The housing 320 is open at its top. The housing 320 has an inner recovery bowl 322, an intermediate recovery bowl 324, and an outer recovery bowl 326. The recovery bowls 322, 324, and 326 recover different processing liquids for substrate processing. The inner recovery bowl 322 has an annular ring shape around the support unit 340. The intermediate recovery bowl 324 has an annular ring shape around the inner recovery bowl 322. The outer recovery bowl 326 has an annular ring shape around the intermediate recovery bowl 324. The inner space 322a of the inner recovery bowl 322, the space 324a between the inner recovery bowl 322 and the intermediate recovery bowl 324, and the space 326a between the intermediate recovery bowl 324 and the outer recovery bowl 326 are used as inlets, wherein the processing liquid flows into the inner recovery bowl 322, the intermediate recovery bowl 324, and the outer recovery bowl 326 through the inlet. The recovery bowls 322, 324, and 326 have recovery lines 322b, 324b, and 326b connected thereto, respectively. The recovery lines 322b, 324b, and 326b extend vertically downward from the bottoms of the recovery bowls 322, 324, and 326. The recovery lines 322b, 324b, and 326b discharge the treatment liquid introduced into the recovery bowls 322, 324, and 326, respectively. The discharged treatment liquid can be reused by an external treatment liquid regeneration system (not shown).

[0044] The support unit 340 is disposed in the housing 320. During substrate processing, the support unit 340 supports and rotates the substrate W. The support unit 340 includes a main body 342, a support pin 344, a chuck pin 346, and a support shaft 348. When viewed from above, the main body 342 has an upper surface of a substantially circular shape. The support shaft 348 is fixedly coupled to the bottom surface of the main body 342 and can be rotated by a motor 349. The support pins 344 are disposed on an edge portion of the upper surface of the main body 342 and are circumferentially spaced apart from each other at a predetermined interval. The support pins 344 protrude upward from the main body 342. The support pins 344 are arranged by their combination to form an annular ring shape as a whole. The support pins 344 support the edge portion of the rear surface of the substrate W so that the substrate W is spaced apart from the upper surface of the main body 342 by a predetermined distance. The chuck pin 346 is disposed farther away from the center of the main body 342 than the support pins 344. The chuck pin 346 protrudes upward from the main body 342. The chuck pin 346 supports the side portion of the substrate W to prevent the substrate W from being deflected to the side from the correct position when the support unit 340 rotates. The chuck pin 346 can move linearly between the standby position and the support position along the radial direction of the main body 342. The standby position is a position farther from the center of the main body 342 than the support position. When the substrate W is loaded onto or unloaded from the support unit 340, the chuck pin 346 is located in the standby position. When substrate processing is performed, the chuck pin 346 is located at the support position. At the support position, the chuck pin 346 makes contact with the side portion of the substrate W.

[0045] The lifting unit 360 moves the housing 320 linearly in the vertical direction. When the housing 320 moves in the vertical direction, the height of the housing 320 relative to the support unit 340 changes. The lifting unit 360 includes a bracket 362, a movable shaft 364, and an actuator 366. The bracket 362 is fixedly attached to the outer wall of the housing 320, and the movable shaft 364 is fixedly coupled to the bracket 362 and moves in the vertical direction by the actuator 366. When the substrate W is placed on or lifted from the support unit 340, the housing 320 is lowered so that the support unit 340 protrudes above the housing 320. In addition, when performing substrate processing, the height of the housing 320 is adjusted according to the type of processing liquid dispensed on the substrate W so that the processing liquid flows into the preset recovery bowls 322, 324, and 326. For example, when the substrate W is processed with the first processing fluid, the substrate W is located at a height corresponding to the inner space 322a of the inner recovery bowl 322. In addition, when the substrate W is processed with the second processing fluid, the substrate W may be located at a height corresponding to the space 324a between the inner recovery bowl 322 and the middle recovery bowl 324, and when the substrate W is processed with the third processing fluid, the substrate W may be located at a height corresponding to the space 326a between the middle recovery bowl 324 and the outer recovery bowl 326. Different from the above, the lifting unit 360 may move the supporting unit 340 instead of the housing 320 in the vertical direction.

[0046] During substrate processing, the nozzle unit 380 distributes the processing liquid onto the substrate W. The nozzle unit 380 includes a nozzle support rod 382, ​​a nozzle 384, a support shaft 386, and an actuator 388. The support shaft 386 is arranged so that its length direction is parallel to the third direction 16, and the actuator 388 is connected to the lower end of the support shaft 386. The actuator 388 rotates, raises and lowers the support shaft 386. The nozzle support rod 382 is connected to the upper end of the support shaft 386 at a right angle, and the upper end of the support shaft is opposite to the lower end of the support shaft 386 to which the actuator 388 is connected. The nozzle 384 is mounted on the bottom surface of the far end of the nozzle support rod 382. The nozzle 384 is moved between the process position and the standby position by the actuator 388. The process position is a position in which the nozzle 384 is located directly above the housing 320, and the standby position is a position in which the nozzle 384 deviates from the housing 320 directly above.

[0047] One or more nozzle units 380 may be provided. In the case where a plurality of nozzle units 380 are provided, the chemical substances, the rinsing solution, and the organic solvent may be dispensed through different nozzle units 380. The rinsing solution may be deionized water, and the organic solvent may be a mixture of isopropyl alcohol vapor and an inert gas, or an isopropyl alcohol solution.

[0048] The chemical supply unit 400 supplies chemicals to the nozzle unit 380. For example, the chemical may be an acidic solution such as hydrofluoric acid, sulfuric acid, nitric acid, or phosphoric acid, etc. Alternatively, the chemical may be an alkaline solution containing potassium hydroxide, sodium hydroxide, or ammonium, etc. In another case, the chemical may be deionized water.

[0049] refer to Figure 3 The chemical supply unit 4100 includes a chemical supply source 4110, a first tank 4120, a second tank 4130, inlet pipelines 4131 and 4135, an integrated outlet pipeline 4150, discharge pipelines 4181 and 4182, an integrated recovery pipeline 4170, a circulation pipeline 4160, and supply pipelines 4210, 4220 and 4230.

[0050] The chemical supply source 4110 stores chemicals used in the process. The chemical supply source 4110 supplies chemicals to the first tank 4120 or the second tank 4130. In an embodiment, the chemical supply source 4110 may include a first chemical supply source 4112 storing a first chemical, and a second chemical supply source 4114 storing a second chemical.

[0051] The first tank 4120 and the second tank 4130 have substantially the same structure. The first tank 4120 and the second tank 4130 store chemicals. When the chemicals are supplied from one of the first tank 4120 and the second tank 4130 to the object to be processed, the chemical exchange is performed in the other tank. In an embodiment, the object to be processed is a substrate processed in a plurality of processing chambers. For example, one of the objects to be processed is Figure 2 The substrate W is shown. In an embodiment, sensors (not shown) are installed in the first tank 4120 and the second tank 4130, respectively. The sensors (not shown) detect the remaining amount of the chemical substances stored in the inner spaces of the tanks 4120 and 4130.

[0052] The first chemical and the second chemical supplied from the first chemical supply source 4112 and the second chemical supply source 4114 may be mixed and stored in the first tank 4120 and the second tank 4130. Alternatively, the first tank 4120 may store one of the first chemical and the second chemical, and the second tank 4130 may store the other chemical. In another case, both the first tank 4120 and the second tank 4130 may store only the first chemical, or may store only the second chemical.

[0053] The inlet lines 4131 and 4135 may include a first inlet line 4131 and a second inlet line 4135. The first inlet line 4131 includes an inlet line 1-1 4132 and an inlet line 1-2 4133. The second inlet line 4135 includes an inlet line 2-1 4136 and an inlet line 2-2 4137.

[0054] The inlet line 1-1 4132 connects the first chemical supply source 4112 and the first tank 4120. The first inlet valve 4121 is installed in the inlet line 1-1 4132, and adjusts the flow rate of the first chemical supplied from the first chemical supply source 4112 to the first tank 4120. The inlet line 1-2 4133 connects the first chemical supply source 4112 and the second tank 4130. The second inlet valve 4139 is installed in the inlet line 1-2 4133, and adjusts the flow rate of the first chemical supplied from the first chemical supply source 4112 to the second tank 4130. The inlet line 2-1 4136 connects the second chemical supply source 4114 and the first tank 4120. The third inlet valve 4122 is installed in the inlet line 2-1 4136, and adjusts the flow rate of the second chemical supplied from the second chemical supply source 4114 to the first tank 4120. The inlet line 2-2 4137 connects the second chemical supply source 4114 and the second tank 4130. The fourth inlet valve 4141 is installed in the inlet line 2-2 4137 and adjusts the flow rate of the second chemical supplied from the second chemical supply source 4114 to the second tank 4130.

[0055] The integrated outlet pipeline 4150 connects the first tank 4120 and the second tank 4130 to the supply pipelines 4210, 4220, and 4230. The supply pipelines 4210, 4220, and 4230 supply chemicals to the object to be treated. The integrated outlet pipeline 4150 includes a first outlet pipeline 4151 and a second outlet pipeline 4152. The first outlet pipeline 4151 connects the first tank 4120 to the supply pipelines 4210, 4220, and 4230. The first outlet valve 4126 is installed in the first outlet pipeline 4151 and adjusts the flow rate of the chemicals supplied from the first tank 4120 to the supply pipelines 4210, 4220, and 4230. The second outlet pipeline 4152 connects the second tank 4130 to the supply pipelines 4210, 4220, and 4230. The second outlet valve 4136 is installed in the second outlet line 4152 , and adjusts the flow rate of the chemical supplied from the second tank 4130 to the supply lines 4210 , 4220 , and 4230 .

[0056] The discharge lines 4181 and 4182 include a first discharge line 4181 and a second discharge line 4182. The first discharge line 4181 discharges the chemicals in the first tank 4120. A first discharge valve 4185 is installed in the first discharge line 4181 and adjusts the flow rate of the chemicals discharged from the first tank 4120. The second discharge line 4182 discharges the chemicals in the second tank 4130. A second discharge valve 4187 is installed in the second discharge line 4182 and adjusts the flow rate of the chemicals discharged from the second tank 4130.

[0057] The integrated recovery line 4170 recovers the chemicals left after the object treatment from the supply lines 4210, 4220, and 4230 to the inner space of the first tank 4120 or the second tank 4130. The integrated recovery line 4170 includes a first recovery line 4171 and a second recovery line 4172. The first recovery line 4171 recovers the chemicals to the first tank 4120. The first recovery valve 4123 is installed in the first recovery line 4171 and adjusts the flow rate of the chemicals recovered from the supply lines 4210, 4220, and 4230 to the first tank 4120. The second recovery line 4172 recovers the chemicals to the second tank 4130. The second recovery valve 4138 is installed in the second recovery line 4172 and adjusts the flow rate of the chemicals recovered from the supply lines 4210, 4220, and 4230 to the second tank 4130.

[0058] The circulation line 4160 includes a first line 4161, a second line 4162, a third line 4163, a fourth line 4164, and a common line 4165. The circulation line 4160 circulates chemicals stored in the inner spaces of the first tank 4120 and the second tank 4130.

[0059] The first pipeline 4161 is connected to the upper surface of the first tank 4120. Chemical substances passing through the heater 4174 and the decompression member 4166 are introduced into the first tank 4120 through the first pipeline 4161. The first valve 4124 is installed in the first pipeline 4161, and adjusts the flow rate of the chemical substances introduced into the first tank 4120 from the common pipeline 4165. The second pipeline 4162 is connected to the upper surface of the second tank 4130. Chemical substances passing through the heater 4174 and the decompression member 4166 are introduced into the second tank 4130 through the second pipeline 4162. The second valve 4134 is installed in the second pipeline 4162, and adjusts the flow rate of the chemical substances introduced into the second tank 4130 from the common pipeline 4165. The third pipeline 4163 is connected to the bottom surface of the first tank 4120. The chemical substances in the first tank 4120 are released through the third pipeline 4163. The third valve 4125 is installed in the third pipeline 4163, and adjusts the flow rate of the chemical supplied from the first tank 4120 to the heater 4174. The fourth pipeline 4164 is connected to the bottom surface of the second tank 4130. The chemical stored in the inner space of the second tank 4130 is released through the fourth pipeline 4164. The fourth valve 4135 is installed in the fourth pipeline 4164, and adjusts the flow rate of the chemical supplied from the second tank 4130 to the heater 4174.

[0060] The common pipeline 4165 connects the first pipeline 4161, the second pipeline 4162, the third pipeline 4163, and the fourth pipeline 4164. The chemical substances passing through the common pipeline 4165 flow back to the first tank 4120 through the first pipeline 4161, or flow back to the second tank 4130 through the second pipeline 4162.

[0061] Likewise, the chemicals stored in the inner space of the first tank 4120 circulate through the first line 4161, the common line 4165, and the third line 4163. The chemicals in the second tank 4130 circulate through the second line 4162, the common line 4165, and the fourth line 4164.

[0062] The circulation line 4160 includes a decompression member 4166 and a heater 4174. The decompression member 4166 adjusts the supply flow rate of the chemical by controlling the strokes per minute. The heater 4174 adjusts the temperature of the chemical.

[0063] Supply lines 4210, 4220, and 4230 supply chemicals to a plurality of chambers. The chambers include nozzles 5010, 5020, and 5030, respectively. The nozzles 5010, 5020, and 5030 dispense chemicals onto an object to be treated. For example, chemicals are dispensed onto an object to be treated through the nozzle 5020. A dispenser 4280 is installed on the supply lines 4210, 4220, and 4230. The supply lines 4210, 4220, and 4230 include a first supply line 4210, a second supply line 4220, and a third supply line 4230 connected to the corresponding chambers. Valves 4212, 4222, and 4232 are installed in the corresponding supply lines 4210, 4220, and 4230, and adjust the flow rate of the chemicals supplied to the chambers.

[0064] Return lines 4242, 4244, and 4246 are respectively connected to supply lines 4210, 4220, and 4230. Return lines 4242, 4244, and 4246 are connected to the integrated return line 4240, and return the remaining chemicals in the supply lines 4210, 4220, and 4230 to the integrated recovery line 4170. Valves 4243, 4245, and 4247 are installed in the corresponding return lines 4242, 4244, and 4246, and adjust the flow rate of the chemicals returned to the integrated recovery line 4170.

[0065] In the following, reference will be made to Figures 4 to 10 A substrate processing method of the present inventive concept is described. The controller controls the chemical supply unit 4100 to perform the substrate processing method of the present inventive concept. Figures 4 to 10 1 is a view sequentially illustrating a substrate processing method using a chemical supply unit according to the present invention. Arrows indicate the flow of chemicals. As used herein, a shaded valve indicates that the valve is in a closed position, while a valve without a shade indicates that the valve is in an open position.

[0066] First, if Figure 4 As shown, the chemicals are supplied from the inner space of the first tank 4120 to the nozzle 5020. Alternatively, the chemicals may be recycled into the inner space of the first tank 4120. In this process, the chemicals stored in the second tank 4130 are circulated through the circulation line 4160.

[0067] When the chemical is supplied from the first tank 4120 to the nozzle 5020, the liquid level of the chemical in the first tank 4120 gradually decreases, as shown in FIG. Figure 5 When the remaining amount of the chemical in the inner space of the first tank 4120 reaches a preset chemical amount or less, new chemical is supplied to the first tank 4120 and mixed with the remaining chemical in the first tank 4120, as shown. Figure 6In an embodiment, the preset chemical quantity may be set to 5% to 15% of the chemical quantity that the first tank 4120 can store.

[0068] In the process of mixing the new chemical with the remaining chemical in the first tank 4120, the chemical in the inner space of the second tank 4130 is supplied to the nozzle 5020. Optionally, the chemical is recycled to the inner space of the second tank 4130. Therefore, the chemical continues to be dispensed to the object to be treated without interruption. In this process, the chemical stored in the first tank 4120 is circulated through the circulation line 4160.

[0069] When the chemical is supplied from the second tank 4130 to the nozzle 5020, the liquid level of the chemical in the second tank 4130 gradually decreases, as shown in FIG. Figure 7 Similarly, when the remaining amount of the chemical in the inner space of the second tank 4130 reaches a preset chemical amount or less, new chemical is supplied to the second tank 4130 and mixed with the remaining chemical in the second tank 4130, as shown. Figure 8 shown.

[0070] In the process of mixing the new chemical with the remaining chemical in the second tank 4130, the chemical in the inner space of the first tank 4120 is supplied to the nozzle 5020. Optionally, the chemical is recycled to the inner space of the first tank 4120. Therefore, the chemical continues to be uninterruptedly supplied to the nozzle 5020. In this process, the chemical stored in the second tank 4130 is circulated through the circulation line 4160.

[0071] The above process is repeatedly performed. For example, the mixing of the remaining chemical in each tank and the new chemical supplied to the tank is performed N times.

[0072] Thereafter, the chemical in the first tank 4120 is supplied to the nozzle 5020, and thus, the liquid level of the chemical in the first tank 4120 is gradually reduced, as shown in FIG. Fig. 9 In this case, if the mixing of the remaining chemical in the first tank 4120 and the new chemical supplied to the first tank 4120 has been performed N times, the first tank 4120 is completely emptied, as shown in FIG. Fig.10 shown.

[0073] According to the inventive concept, when a substrate is treated with chemicals stored in a tank, waste of chemicals can be reduced by mixing new chemicals with chemicals maintained at a preset level or lower in the tank without completely discharging the remaining chemicals.

[0074] According to the inventive concept, contamination of chemicals can be prevented by limiting the number of times the remaining chemicals in each tank and the new chemicals supplied into the tank are mixed.

[0075] According to an embodiment of the inventive concept, the amount of chemicals unnecessarily discharged from a chemical supply unit may be reduced.

[0076] The effects of the present inventive concept are not limited to the above-mentioned effects, and any other effects not mentioned herein can be clearly understood by those skilled in the art to which the present inventive concept belongs from the present specification and the accompanying drawings.

[0077] The above description illustrates the inventive concept. In addition, the above-mentioned contents describe embodiments of the inventive concept, and the inventive concept can be used in various other combinations, changes and environments. That is, the inventive concept can be changed or modified without departing from the scope of the inventive concept disclosed in the specification, the equivalent scope of the written disclosure, and / or the technology or knowledge scope of those skilled in the art. The written embodiment describes the best state of the technical spirit for implementing the inventive concept, and various changes required for the specific application and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept in the disclosed embodiment state. In addition, it should be understood that the attached claims include other embodiments.

[0078] Although the inventive concept has been described with reference to the embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a housing having a processing space in which the substrate is processed; a supporting unit configured to support the substrate in the processing space; a nozzle configured to dispense a chemical onto the substrate placed on the support unit; a chemical supply unit configured to supply the chemical to the nozzle; as well as a controller configured to control the chemical supply unit, The chemical substance supply unit comprises: a tank having an internal space in which the chemical substance is stored, wherein the tank includes a first tank and a second tank; a sensor configured to detect a remaining amount of the chemical stored in the interior space of the tank; an inlet line through which the chemical is supplied from a chemical supply source to the inner space of the tank and in which an inlet valve is installed; an outlet line through which the chemical is supplied from the inner space of the tank to the nozzle and in which an outlet valve is installed; and a discharge line through which the chemical substances in the inner space of the tank are discharged and in which a discharge valve is installed, wherein the chemical supply unit further includes a circulation line configured to circulate the chemical stored in the other tank of the first tank and the second tank when one of the first tank and the second tank receives the chemical from the chemical supply source through the inlet line, supplies the chemical to the nozzle through the outlet line, or discharges the chemical through the discharge line, and wherein in a state where the chemicals remain in the inner space of the tank, when the remaining amount detected by the sensor reaches a first preset amount or less, the controller controls the chemical supply unit to supply new chemicals from the chemical supply source to the tank.

2. The apparatus according to claim 1, wherein the controller: determining whether the number of times the chemical substance remaining in the tank and the new chemical substance supplied into the tank are mixed with each other exceeds a preset number of times; and When the number of times the chemicals remaining in the tank and the new chemicals supplied into the tank are mixed with each other exceeds the preset number of times and the remaining amount detected by the sensor reaches a second preset amount or less, the chemical supply unit is controlled to discharge the remaining chemicals in the inner space of the tank through the discharge line. The device according to claim 2 , wherein the first preset amount is equal to the second preset amount. 4 . The device according to claim 3 , wherein the first preset amount is set to 5% to 15% of the amount of the chemical substance that the tank can store.

5. The device according to claim 1, wherein the circulation line comprises: a heater configured to heat the chemical flowing through the circulation line; as well as A decompression member is configured to deliver the chemical stored in the first tank or the second tank to the heater.

6. A chemical supply unit for supplying chemical substances, the chemical supply unit comprising: a tank having an interior space in which the chemical substance is stored; a sensor configured to detect a remaining amount of the chemical stored in the interior space of the tank; an inlet line through which the chemical is supplied from a chemical supply source into the inner space of the tank, and in which an inlet valve is installed; an outlet line through which the chemical is supplied from the internal space of the tank to an object to be treated and in which an outlet valve is installed; a discharge line through which the chemical substances in the inner space of the tank are discharged and in which a discharge valve is installed; as well as a controller configured to control the chemical supply unit, The tank comprises a first tank and a second tank, wherein the chemical supply unit further includes a circulation line configured to circulate the chemical stored in the other tank of the first tank and the second tank when one of the first tank and the second tank receives the chemical from the chemical supply source through the inlet line, supplies the chemical to the nozzle through the outlet line, or discharges the chemical through the discharge line, and wherein in a state where the chemicals remain in the inner space of the tank, when the remaining amount detected by the sensor reaches a first preset amount or less, the controller controls the chemical supply unit to supply new chemicals from the chemical supply source to the tank.

7. The chemical supply unit according to claim 6, wherein the controller: determining whether the number of times the chemical substance remaining in the tank and the new chemical substance supplied into the tank are mixed with each other exceeds a preset number of times; and When the number of times the chemicals remaining in the tank and the new chemicals supplied into the tank are mixed with each other exceeds the preset number of times and the remaining amount detected by the sensor reaches a second preset amount or less, the chemical supply unit is controlled to discharge the remaining chemicals in the inner space of the tank through the discharge line. 8 . The chemical supply unit of claim 7 , wherein the first preset amount is equal to the second preset amount. 9 . The chemical supply unit according to claim 8 , wherein the first preset amount is set to 5% to 15% of an amount of chemicals that the tank can store.

10. The chemical supply unit according to claim 6, wherein the circulation line comprises: a heater configured to heat the chemical flowing through the circulation line; as well as A decompression member is configured to deliver the chemical stored in the first tank or the second tank to the heater.

11. A method for processing a substrate using the chemical supply unit according to claim 6, the method comprising: treating the substrate by dispensing a chemical stored in a tank onto the substrate, wherein when the remaining amount of the chemical in the tank reaches a preset chemical amount or less, new chemical is supplied into the tank and mixed with the chemical remaining in the tank, and The mixture of the new chemical and the retained chemical is dispensed onto the substrate.

12. The method according to claim 11, wherein when the number of times the remaining chemicals and the new chemicals in the tank are mixed with each other exceeds a preset number and the remaining amount of the chemicals in the tank reaches the preset chemical amount or less, all the chemicals in the tank are discharged. 13 . The method according to claim 11 , wherein the preset chemical amount is set to 5% to 15% of an amount of the chemical that the tank can store.

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