A measuring device and a measuring method for small and micro electronic components

Abstract

The present invention discloses a measuring device for microelectronic components and a measuring method thereof, comprising a carrier board, a needle bed assembly and a signal conversion assembly, wherein the needle bed assembly is located between the carrier board and the signal conversion assembly and acts as an intermediate layer, the carrier board is provided with acupuncture points, the number of which is selected according to the positioning size of the microelectronic component to be measured, the needle bed assembly comprises a probe and a probe positioning tool, the probe positioning tool is provided with a probe positioning hole and a needle bed positioning hole, the probe positioning hole is used for axial and radial positioning of the probe, the present invention can be generally used in high temperature, low temperature, high pressure, vacuum and other environments according to the process requirements of microelectronic components, and can be generally used in all scenarios requiring small spacing and multi-channel online electrical connection.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to a measuring device and a measuring method for small and micro electronic components. Background Art

[0002] At present, due to the small size and spacing of the pins of small and microelectronic components, when making electrical connections, they need to be installed in a test socket, and then the test socket is installed on a printed circuit board, and finally the electrical connection is made through the pads on the printed circuit board. There are two ways of electrical connection: one is to manually solder wires on the pads of the printed circuit board, and the other is to contact the pads on the printed circuit board with a probe. Since the probe and the pad cannot be repeatedly contacted, the above two methods cannot realize online testing of small and microelectronic components, resulting in low efficiency and high dependence on personnel. In order to improve the testing efficiency of small and microelectronic components and realize full automation of testing, a method for online electrical connection of small and microelectronic components is required. The small and microelectronic components are positioned on a carrier. When testing, the carrier is transferred to a testing station, and the relative position relationship between the needle bed assembly 20 and the carrier 10 is changed. The probe 21 directly contacts the pins of the small and microelectronic components on the carrier 10 to realize online electrical connection. According to the test requirements, each small and microelectronic component only needs to contact the probe in the needle bed assembly a limited number of times to complete the online test. This online electrical connection method does not require a test socket, and the probe does not need to repeatedly contact the pads on the test socket mounting plate. It greatly simplifies the way of online electrical connection of small and microelectronic components, has high versatility, high connection accuracy, high reliability, improves the efficiency of testing, and reduces the degree of dependence of testing on manual labor and testing costs.

[0003] Based on the above series of problems, the following technical solutions are proposed. Summary of the invention

[0004] The technical problem solved by the present invention is to provide a measuring device for small and micro electronic components, so as to realize online testing of small and micro electronic components and thus improve testing efficiency.

[0005] To achieve the above object, the technical solution adopted by the present invention is:

[0006] A measuring device for small and microelectronic components comprises a carrier board, a needle bed assembly and a signal conversion assembly, wherein the needle bed assembly is located between the carrier board and the signal adapter assembly and acts as an intermediate layer, the carrier board is provided with acupuncture points, the number of which is selected according to the positioning size of the small and microelectronic components to be measured, the needle bed assembly comprises a probe and a probe positioning tool, the probe positioning tool is provided with a probe positioning hole and a needle bed positioning hole, the probe positioning hole is used for axial and radial positioning of the probe, the position of the probe positioning hole corresponds one-to-one with the pin position of the small and microelectronic components on the carrier board, the needle bed positioning hole is used for positioning the needle bed assembly, and the signal adapter assembly comprises a printed circuit board, the printed circuit board is provided with a soldering pad, the position of the soldering pad corresponds one-to-one with the position of the probe on the needle bed assembly.

[0007] Furthermore, the carrier plate is externally provided with a lifting device, and the lifting device drives the carrier plate to move up and down, thereby changing the relative position of the carrier plate and the needle bed assembly.

[0008] Furthermore, the printed circuit board is also provided with positioning holes, and the signal adapter assembly and the needle bed assembly are combined and positioned through the positioning holes and the needle bed positioning holes, and combined and fixed by screws to ensure that the pads on the printed circuit board correspond to the probes of the needle bed assembly one by one and are reliably connected.

[0009] Furthermore, the signal transfer component also includes an electrical connector, which is used to transfer and transmit the electrical signal on the printed circuit board.

[0010] Furthermore, the needle bed assembly and the carrier board change their relative position relationship to achieve electrical connection between the probe and the test pins of the small microelectronic components on the carrier board.

[0011] Furthermore, the change in the relative position relationship between the needle bed assembly and the carrier includes when the needle bed assembly is fixed and the carrier reaches the test station, the lifting device drives the carrier to rise, and the probe contacts the pins of the small and microelectronic components to achieve online electrical connection.

[0012] Furthermore, the change in the relative position relationship between the needle bed assembly and the carrier includes that when the carrier reaches the test station, the lifting device drives the needle bed to descend, and the probe contacts the pins of the small microelectronic components to achieve online electrical connection.

[0013] The present invention also provides a method for measuring small and micro electronic components, characterized in that the method comprises:

[0014] S1. Before testing, the microelectronic components to be tested are first positioned in the holes of the carrier board. According to the process requirements, the carrier board is automatically transferred to the online electrical connection station;

[0015] S2, by means of a lifting device, the relative position relationship between the needle bed assembly and the carrier is changed, the probe of the needle bed assembly directly contacts the pins of the microelectronic components on the carrier, and an online electrical connection is made after power is turned on, the electrical signal is transmitted to the pad of the printed circuit board through the probe, and then the electrical signal of the printed circuit board is transferred and transmitted out through the electrical connector;

[0016] S3. According to the test requirements, the carrier board is transferred to multiple electrical connection stations for testing. After the test is completed, the carrier board is transferred out for unloading.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The probe of the needle bed assembly directly contacts the pins of the microelectronic components. According to the test requirements, each microelectronic component only needs to contact the probe a limited number of times, without the need for conversion through the test socket, which greatly simplifies the online electrical connection method of the microelectronic components, with high versatility, high connection accuracy, high reliability, and reduced test costs;

[0019] 2. The microelectronic components are positioned on the carrier, which can be freely transferred on the production line. The online electrical connection between the needle bed assembly and the microelectronic components can realize the online testing of the microelectronic components, and the full automation of the test can be realized, which greatly improves the efficiency of the test and reduces the dependence of the test on manual labor;

[0020] 3. It can be used in high temperature, low temperature, high pressure, vacuum and other environments according to the process requirements of small and micro electronic components. It can be used in all scenarios that require small spacing and multi-channel online electrical connections. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application, but do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 It is a cross-sectional view of the overall structure of the present invention;

[0023] Figure 2 It is a partial enlarged cross-sectional view of the present invention; DETAILED DESCRIPTION

[0024] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0025] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, wherein the illustrative embodiments and descriptions are only used to explain the present invention but are not intended to limit the present invention.

[0026] like Figure 1 , Figure 2 As shown, a measuring device for small and micro electronic components includes a carrier board 10, a needle bed assembly 20, and a signal adapter assembly 30. The carrier board 10 is used to position the small and micro electronic components to be measured. The needle bed assembly 20 serves as an intermediate layer of electrical connection to achieve connection between the small and micro electronic components and the signal adapter assembly 30. The signal adapter assembly 30 is used to transfer electrical signals to match system requirements.

[0027] Among them, the carrier 10 can be processed with acupuncture points according to the positioning size of the small and microelectronic components, the number of acupuncture points on the carrier 10 is determined according to the demand, the carrier 10 can be transmitted online, the needle bed assembly 20 includes a probe 21 and a probe positioning tool 22, the probe 21 is a double-headed probe, and the probe positioning tool 22 is provided with a plurality of probe positioning holes 221 and a needle bed positioning hole 222, the probe positioning hole 221 is used for axial and radial positioning of the probe 21, and the position of the probe positioning hole 221 is consistent with the small and microelectronic components on the carrier 10. The pin positions of the components correspond one to one. The needle bed positioning hole 222 is used to position the needle bed assembly 20. The signal adapter assembly 30 includes a printed circuit board 31 and an electrical connector 32. The printed circuit board 31 has a plurality of pads and positioning holes 311. The positions of the pads correspond one to one with the positions of the probes on the needle bed assembly 20. The printed circuit board 31 is designed with circuits as required. The signal adapter assembly 30 and the needle bed assembly 20 are combined and positioned through the positioning holes 311 and the needle bed positioning holes 222, and are combined and fixed by screws. Ensure that the pads of the adapter board 31 correspond to the probes 21 of the needle bed assembly 20 and are reliably connected. The electrical connector 32 is used to transfer the electrical signals on the printed circuit board 31. The needle bed assembly 20 and the carrier 10 change the relative position relationship to achieve electrical connection between the probes 21 and the test pins of the small and micro electronic components on the carrier 10. According to different structural requirements, there are two methods for changing the relative position relationship between the needle bed assembly 20 and the carrier 10: (1) the needle bed 20 is fixed and the carrier 10 reaches the test station. The lifting device drives the carrier 10 to move. The board 10 rises, and the probe contacts the pins of the microelectronic components to achieve online electrical connection; (2) After the carrier board 10 reaches the test station, the lifting device drives the needle bed 20 to descend, and the probe contacts the pins of the microelectronic components to achieve online electrical connection. The carrier board 10, the needle bed assembly 20, and the signal conversion assembly 30 can be used in high temperature, low temperature, high pressure, vacuum and other environments according to the process requirements of the microelectronic components. The carrier board 10, the needle bed assembly 20, and the signal adapter assembly 30 can be used in all scenarios with small pitch and requiring multi-channel online electrical connection.

[0028] On this basis, the present invention also proposes a method for measuring small and micro electronic components, and the measuring process specifically includes the following specific contents:

[0029] 1. Before testing, the microelectronic components to be tested are first positioned in the holes of the carrier board 10. According to the process requirements, the carrier board is automatically transferred to the online electrical connection station.

[0030] 2. By means of the lifting device, the relative position relationship between the needle bed assembly 20 and the carrier 10 is changed. The probe 21 of the needle bed assembly 20 directly contacts the pins of the small and microelectronic components on the carrier 10. After power is turned on, an online electrical connection is performed. The electrical signal is transmitted to the pad of the printed circuit board 31 through the probe 21, and then the electrical signal of the printed circuit board 31 is transferred and transmitted through the electrical connector 32.

[0031] 3. According to the test requirements, the carrier board 10 is transferred to a plurality of electrical connection stations for testing. After the test is completed, the carrier board is transferred out for unloading.

[0032] The above description is only a preferred embodiment of the present invention, so all equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the scope of the patent application of the present invention.

Claims

1. A measuring device for small and micro electronic components, comprising a carrier board, a needle bed assembly and a signal conversion assembly, characterized in that: The needle bed assembly is located between the carrier board and the signal adapter assembly and acts as an intermediate layer. The carrier board is provided with acupuncture points, and the number of the acupuncture points is selected according to the positioning size of the small microelectronic components to be measured. The needle bed assembly includes a probe and a probe positioning tool. The probe positioning tool is provided with a probe positioning hole and a needle bed positioning hole. The probe positioning hole is used for axial and radial positioning of the probe. The position of the probe positioning hole corresponds to the pin position of the small microelectronic components on the carrier board. The needle bed positioning hole is used for positioning the needle bed assembly. The signal adapter assembly includes a printed circuit board. The printed circuit board is provided with a soldering pad. The position of the soldering pad corresponds to the position of the probe on the needle bed assembly. The carrier plate is externally provided with a lifting device, which drives the carrier plate to move up and down to change the relative position of the carrier plate and the needle bed assembly; The printed circuit board is also provided with a positioning hole, and the signal adapter assembly and the needle bed assembly are combined and positioned through the positioning hole and the needle bed positioning hole, and combined and fixed by screws to ensure that the pads on the printed circuit board correspond to the probes of the needle bed assembly one by one and are reliably connected; The signal transfer assembly further comprises an electrical connector, which is used to transfer and transmit the electrical signal on the printed circuit board; The needle bed assembly and the carrier board change the relative position relationship to achieve electrical connection between the probe and the test pins of the small microelectronic components on the carrier board.

2. The measuring device for small and micro electronic components as claimed in claim 1, characterized in that: The change in the relative position relationship between the needle bed assembly and the carrier includes when the needle bed assembly is fixed and the carrier reaches the test station, the lifting device drives the carrier to rise, and the probe contacts the pins of the small microelectronic components to achieve online electrical connection.

3. The measuring device for small and micro electronic components as claimed in claim 1, characterized in that: The change in the relative position relationship between the needle bed assembly and the carrier includes that when the carrier reaches the test station, the lifting device drives the needle bed to descend, and the probe contacts the pins of the small microelectronic components to achieve online electrical connection.

4. A method for measuring small and micro electronic components is implemented by the measuring device according to claim 1, characterized in that: The method comprises: S1. Before testing, the microelectronic components to be tested are first positioned in the holes of the carrier board. According to the process requirements, the carrier board is automatically transferred to the online electrical connection station; S2, by means of a lifting device, the relative position relationship between the needle bed assembly and the carrier is changed, the probe of the needle bed assembly directly contacts the pins of the microelectronic components on the carrier, and an online electrical connection is made after power is turned on, the electrical signal is transmitted to the pad of the printed circuit board through the probe, and then the electrical signal of the printed circuit board is transferred and transmitted out through the electrical connector; S3. According to the test requirements, the carrier board is transferred to multiple electrical connection stations for testing. After the test is completed, the carrier board is transferred out for unloading.

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