Heat dissipation box and multimedia projector including the same

Abstract

The present invention discloses a heat sink and a multimedia projector including the same. The heat sink of the present invention comprises a box body. The heat sink of the present invention can cool down an object in the box body. A cold air inlet and a hot air outlet that can be connected to each other are arranged on the box body. The heat sink of the present invention also comprises a cooling block that connects the hot air outlet and the cold air inlet. A plurality of air outlet channels are arranged on the cooling block. The air discharged through the hot air outlet can enter the cold air inlet through the air outlet channels. The cold air inlet and the hot air outlet are both located on the same side of the box body. A cooling part is arranged at least at one of the cold air inlet and the hot air outlet. The first cooling part comprises a first semiconductor cooling sheet and a first cooling plate. The cooling end of the first semiconductor cooling sheet can contact the hot air in the inner cavity of the box body. The multimedia projector of the present invention has high cooling efficiency while ensuring the sealing of the box body. The internal structure of the box body is compactly arranged and the overall space occupied is small.

Description

Technical Field

[0001] The present invention relates to the technical field of projection optical machines, and in particular to a heat dissipation box and a multimedia projector comprising the same. Background Art

[0002] Multimedia projectors integrate multiple forms of expression such as video, image and sound, and therefore play an important role in teaching and commercial demonstration activities. Therefore, the application scope of multimedia projectors is becoming increasingly wide.

[0003] In order to reduce the impact of dust on the working performance, multimedia projectors need to ensure the sealing of the cabinet. However, since most optical components are integrated in the multimedia cabinet, the heat dissipation effect is an important factor affecting the working stability of multimedia projectors. In particular, other display screens such as LCD or LED currently used in multimedia projectors are important sources of heat generation. Therefore, how to achieve effective cooling of multimedia projectors is a problem that needs to be solved in the industry.

[0004] Currently, there are multimedia projectors that achieve cooling by setting heat dissipation channels along the circumferential direction of the box, but the heat dissipation effect is still not ideal; if cooling is achieved by simply adding cooling channels or setting multiple cooling units, the space utilization rate in the box will be low and the overall volume of the multimedia heat dissipation box will be larger. Summary of the invention

[0005] To overcome the above disadvantages, the present invention aims to provide a heat dissipation box and a multimedia projector including the same. The heat dissipation box of the present invention has high cooling efficiency while ensuring sealing, a compact internal structure of the box body, and a small overall space occupied by the heat dissipation box.

[0006] The heat dissipation box of the present invention comprises a box body, which is used to cool down an object in the box body, and the box body is provided with a cold air inlet and a hot air outlet which can be connected to each other, and a cooling part is provided at least at one of the cold air inlet and the hot air outlet. Therefore, by using the heat dissipation box of the present invention, when hot air flows from the hot air outlet to the cold air inlet, efficient cooling is achieved under the action of the cooling part, and the cooling efficiency is high.

[0007] Furthermore, the cold air inlet and the hot air outlet are both located on the same side of the box, so that the hot air can quickly flow back into the box from the cold air inlet, and the hot air can be cooled quickly.

[0008] Furthermore, the cooling part arranged at the hot air outlet is a first cooling part, and the first cooling part includes a first semiconductor cooling sheet, and one side of the first semiconductor cooling sheet can contact the hot air in the inner cavity of the box. Therefore, under the action of the first semiconductor cooling sheet, the hot air in the hot air outlet area can be cooled.

[0009] Furthermore, an air guide fan is provided at the hot air outlet for discharging the hot air in the box toward the hot air outlet, thereby ensuring that the hot air in the box is quickly discharged outward through the hot air outlet.

[0010] Furthermore, it also includes a cooling block connecting the cold air inlet and the hot air outlet, and a plurality of air outlet channels are arranged on the cooling block, and the air flow passes through the air guide fan and enters the air outlet channel in the cooling block.

[0011] Furthermore, the first cooling unit further includes a heat sink connected to the first semiconductor cooling plate. Therefore, the heat sink can cool the first semiconductor cooling plate, ensuring the cooling effect of the first semiconductor cooling plate on the hot air in the box.

[0012] Furthermore, the cooling part arranged at the cold air inlet is a second cooling part, and the second cooling part includes a second semiconductor cooling sheet, and the second semiconductor cooling sheet is used to dissipate heat for the air flowing toward the cold air inlet.

[0013] The present invention also provides a multimedia projector, which includes the heat dissipation box described above, an optical component is arranged in the box, the optical component includes a display screen, a cold air inlet is arranged in the area of ​​the box close to the display screen, a hot air outlet is also arranged on the box, a first cooling unit is arranged at the hot air outlet, and an air duct connecting the hot air outlet and the cold air inlet is also included. The multimedia projector of the present invention arranges the cold air inlet corresponding to the area of ​​the display screen that generates more heat, so that the display screen can be quickly cooled.

[0014] Furthermore, the air duct is located outside the box.

[0015] Furthermore, the cold air inlet is arranged along the length direction of the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the first embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the locations of the cold air inlet and the hot air outlet according to the first embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the configuration structure of the cooling unit according to the first embodiment of the present invention;

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the first cooling unit in the first embodiment of the present invention when no air guide fan is provided;

[0020] Figure 5 A schematic diagram of the configuration structure of the heat dissipation fins of the first heat sink of the first embodiment of the present invention;

[0021] Figure 6 This is a schematic diagram of the connection relationship between the second semiconductor refrigeration sheet and the second thermal insulation cotton in Example 1 of the present invention.

[0022] In the figure:

[0023] 1. Box body; 11. Cold air inlet; 12. Hot air outlet; 2. Cooling block; 3. First cooling unit; 31. First semiconductor cooling sheet; 32. First cooling plate; 33. Air guiding fan; 34. First thermal insulation cotton; 35. First radiator; 351. First heat sink; 352. Heat dissipation rod; 353. Heat dissipation fins; 36. First cooling fan; 4. Second cooling unit; 41. Second semiconductor cooling sheet; 42. Second thermal insulation cotton; 43. Second radiator; 5. Projection lens. DETAILED DESCRIPTION

[0024] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0025] Embodiment 1:

[0026] See also Figure 1 and Figure 2 As shown, this embodiment is a heat dissipation box, which includes a box body 1. The heat dissipation box of the present invention can cool down an object located in the box body 1. A cold air inlet 11 and a hot air outlet 12 that can communicate with each other are arranged on the box body 1. The heat dissipation box of this embodiment also includes a cooling block 2 that communicates with the hot air outlet 12 and the cold air inlet 11. A plurality of air outlet channels are arranged on the cooling block 2. The air discharged through the hot air outlet 12 can enter the cold air inlet 11 through the air outlet channels. The cold air inlet 11 and the hot air outlet 12 of this embodiment are both located on the same side of the box body 1.

[0027] A cooling unit is provided at at least one of the cold air inlet 11 and the hot air outlet 12, so that the hot air passing through the hot air outlet 12 can be cooled in the process of flowing from the cold air inlet 11 to the hot air outlet 12, thereby ensuring that the air entering the box body 1 is at a lower temperature. The cooling unit of this embodiment includes a first cooling unit 3 provided at the hot air outlet 12 and a second cooling unit 4 provided at the cold air inlet 11. Obviously, the number of cooling units provided can also be adjusted to one or more as needed, and the location of the cooling unit can also be adjusted to an area other than the location exemplified in this embodiment as needed.

[0028] The first cooling unit 3 includes a first semiconductor cooling sheet 31 and a first cold conducting plate 32. The cooling end of the first semiconductor cooling sheet 31 can contact the hot air in the inner cavity of the box body 1. The first cold conducting plate 32 is used to transfer the heat in the box body 1 to the first semiconductor cooling sheet 31. A wind guide fan 33 is also provided at the hot air outlet 12 for discharging the hot air in the box body 1 to the hot air outlet 12. A fan cover is also provided outside the wind guide fan 33, and the fan cover is connected to the first thermal insulation cotton 34. The first semiconductor cooling sheet 31 is embedded in the middle area of ​​the first cold conducting plate 32. The area of ​​the first semiconductor cooling sheet 31 is smaller than that of the first cold conducting plate 32. The wind guide fan 33 is located on one side of the first cold conducting plate 32. The wind guide fan 33 is coaxially arranged with the hot air outlet 12. The airflow passes through the wind guide fan 33 and enters the air outlet channel in the wind guide block. The first thermal insulation cotton 34 is provided on the side of the first semiconductor cooling sheet 31 away from the inner cavity of the box body 1. A notch for setting the first semiconductor refrigeration plate 31 is provided in the middle of the first thermal insulation cotton 34 . The first thermal insulation cotton 34 of the present invention is in the shape of a cover as a whole. The first cold conduction plate 32 is arranged adjacent to the first thermal insulation cotton 34 , and the first thermal insulation cotton 34 can cover the first cold conduction plate 32 .

[0029] The first cooling unit 3 of the present embodiment also includes a first radiator 35 for cooling the first semiconductor refrigeration sheet 31. The first radiator 35 includes a first heat sink 351 that is arranged in close contact with the first semiconductor refrigeration sheet 31. The first radiator 35 also includes a heat sink rod 352 connected to the first heat sink 351, and the heat sink rod 352 passes through a plurality of heat sink fins 353. The first radiator 35 also includes a first heat sink fan 36 for cooling the first radiator 35. The first heat sink fan 36 is arranged directly opposite to the heat sink fins 353, and the plate body of the heat sink fins 353 of the present embodiment is arranged in a direction parallel to the air outlet direction of the first heat sink fan 36. Therefore, the first heat sink fan 36 can cool the heat sink rod 352 that passes through the heat sink fins 353, and then cool the first heat sink 351 under the action of the first heat sink fan 36. In this embodiment, there are four heat dissipation rods 352, which are arranged in groups of two through each heat dissipation fin 353. The heat dissipation rods 352 and the first heat dissipation plate 351 are both made of materials with good thermal conductivity. The width of the first heat dissipation plate 351 in this embodiment is smaller than the width of each heat dissipation fin 353. The heat dissipation rods 353 are arranged in an "eight" shape between the first heat dissipation plate 351 and each heat dissipation fin 353. Therefore, the cooling efficiency of the first semiconductor cooling plate 31 can be ensured, and the overall structure is compact, and the space utilization rate is high.

[0030] The second cooling unit 4 includes a second semiconductor refrigeration sheet 41, which is used to dissipate heat from the air flowing toward the cold air inlet 11. The second semiconductor refrigeration sheet 41 is located in the area of ​​the cold conduction block 2 close to the cold air inlet 11. A second thermal insulation cotton 42 is also provided around the second semiconductor refrigeration sheet 41. The second cooling unit 4 includes a second radiator 43 for cooling the second semiconductor refrigeration sheet 41. The structure of the second radiator 43 is similar to that of the aforementioned first radiator 35, and will not be described in detail here.

[0031] In this embodiment, each heat dissipation fin 353 of the first heat sink 35 and the second heat sink 43 is arranged close to the top wall of the box, and can also be arranged close to the bottom wall of the box, or close to the side wall of the box. Accordingly, the first heat dissipation fan 36 can be synchronously arranged close to the top wall, bottom wall or side wall along with the heat dissipation fin 353.

[0032] Embodiment 2:

[0033] This embodiment is a multimedia projector, which includes the heat dissipation box of the first embodiment and an optical assembly, wherein the optical assembly includes a display screen and a reflector arranged in a box body 1, and a projection lens 5 is also arranged on the box body 1. A cold air inlet 11 is arranged on the cover plate of the box body 1 in a region close to the display screen with the highest heat generation, and a hot air outlet 12 is also arranged on the cover plate of the box body 1 on the same side as the cold air inlet 11.

[0034] The cold air inlet 11 of the multimedia heat dissipation box of this embodiment is arranged along the length direction of the display screen, so that it can ensure rapid cooling of the display screen and improve the cooling effect. The multimedia heat dissipation box of this embodiment not only avoids the cooling unit from occupying a large space by arranging the hot air outlet 12 and the cold air inlet 11 that are interconnected on the same side of the box body 1, but also greatly improves the cooling effect of the optical elements in the multimedia by arranging the first cooling part 3 and the second cooling part 4 in the area of ​​the hot air outlet 12 and the cold air inlet 11, and the noise when the multimedia projector is working is small.

[0035] The above implementation modes are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation box, comprising a box body, used to cool an object located in the box body, characterized in that: The box body is provided with a cold air inlet and a hot air outlet which can be communicated with each other, both the cold air inlet and the hot air outlet are provided with cooling parts, and the cold air inlet and the hot air outlet are both located on the same side of the box body. The cooling part arranged at the hot air outlet is a first cooling part, and the first cooling part includes a first semiconductor cooling sheet, and one side of the first semiconductor cooling sheet can contact with the hot air in the inner cavity of the box. It also includes a cooling block connected to the cold air inlet and the hot air outlet, and a plurality of air outlet channels are arranged on the cooling block. The cooling part arranged at the cold air inlet is the second cooling part, which includes a second semiconductor refrigeration sheet, which is used to cool the air flowing to the cold air inlet. The second semiconductor refrigeration sheet is located in the area of ​​the cooling block close to the cold air inlet.

2. The heat dissipation box according to claim 1, characterized in that: An air guide fan is also provided at the hot air outlet for discharging the hot air in the box toward the hot air outlet.

3. The heat dissipation box according to claim 2, characterized in that: The airflow passes through the air guide fan and enters the air outlet channel in the cooling block.

4. The heat dissipation box according to claim 1, characterized in that: The first cooling unit further includes a first heat sink for cooling the first semiconductor refrigeration plate.

5. A multimedia projector, characterized in that: A heat dissipation box comprising the heat dissipation box according to any one of claims 1 to 4, wherein an optical component is arranged in the box body, the optical component includes a display screen, a cold air inlet is arranged in a region of the box body close to the display screen, a hot air outlet is also arranged on the box body, a first cooling unit is arranged at the hot air outlet, and also includes an air duct connecting the hot air outlet and the cold air inlet.

6. The multimedia projector according to claim 5, characterized in that: The air duct is located outside the box.

7. The multimedia projector according to claim 6, characterized in that: The cold air inlet is arranged along the length direction of the display screen.

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