The application discloses a kind of
semiconductor vacuum coating device of
wafer automatic feeding and discharging, belong to
vacuum coating equipment technical field, by pushing sliding seat up, rotating shaft drives dial, swing rod and
wafer up, upper dial
contact slide after being pressed and rotated, rotating shaft and
wafer are rotated, dial passes through the clearance between slide after, swing rod is positioned by the elastic force of tension spring, wafer completes one hundred and eighty degrees turnover and makes the surface to be coated upward, multi-stage electric push rod is retracted, sliding seat is lowered and reset, after completing one side
coating, multi-stage electric push rod is elongated again, and similarly, wafer is turned over one hundred and eighty degrees and makes the
coating surface downward, then multi-stage electric push rod is retracted, wafer is lowered and contacted with the sealing ring of supporting plate, wafer
coating surface is isolated by upper sealing ring, lower sealing ring and supporting plate, supporting plate, to ensure protection and fixation, prevent the tiny particles generated in the process of
film material gasification and the heat generated act on wafer on other stations, ensure the uniformity of film thickness when subsequent coating.