Stacked structure of printed circuit boards using interposers and electronic equipment including the stacked structure

Abstract

An electronic device is disclosed, the electronic device comprising: a first supporting member including at least one screw fastening portion; a first printed circuit board (PCB) stacked on the first supporting member and including at least one screw fixing portion facing the at least one screw fastening portion; a second PCB spaced apart from the first PCB and including a first screw guide groove; an interposer disposed between the first PCB and the second PCB, electrically connecting the first PCB and the second PCB and including a second screw guide groove facing the first screw guide groove; and a second supporting member stacked on the second PCB and including a screw entrance portion facing the first screw guide groove. The second supporting member, the first PCB, and the first supporting member are fixed to each other via screws inserted through the screw entrance portion.

Description

Technical Field

[0001] Certain embodiments relate to a multi-layer printed circuit board structure using an interposer and an electronic device including the multi-layer printed circuit board structure. Background Art

[0002] As the functional gap between electronic devices of various manufacturers is significantly reduced, electronic devices are becoming thinner in order to meet the purchasing expectations of consumers. In order to increase the rigidity of electronic devices, improve the design aesthetics, and make electronic devices thin and light, development is underway. In particular, for electronic devices, it is important to promote effective electrical connection between electronic components provided in the electronic devices and include a strong structure capable of maintaining the electrical connection between the electronic components even if an external impact occurs. Summary of the invention

[0003] Technical issues

[0004] An electronic device may include one or more electronic components disposed in the internal space of the electronic device. These electronic components may be electrically connected to each other so as to perform the corresponding functions of the electronic device. Such electronic components may include at least two printed circuit boards disposed in the internal space of the electronic device. The corresponding printed circuit boards may be disposed in the device in various ways (including stacking each other to ensure an effective installation space), and may be electrically connected to each other by inserters disposed between the printed circuit boards. In addition, the printed circuit board may be fixed to at least one supporting member (e.g., housing) disposed in the electronic device via a separate fastening member (e.g., screw). For example, a pair of printed circuit boards may be fixed to each other in a stacked configuration using fastening members penetrating the supporting member and inserters disposed between the pair of printed circuit boards, which may result in the assembly having a significant height.

[0005] However, since the stacked configuration of the printed circuit boards has a relatively high configuration relative to the entire thickness of the electronic device (and is fastened via a single screw), the printed circuit boards may be displaced relative to one another due to an external impact. As a result, the solder provided in the interposer for electrically connecting the two printed circuit boards may be damaged, resulting in electrical disconnection of the two printed circuit boards and causing a malfunction of the electronic device.

[0006] Technical Solution

[0007] Certain embodiments provide a stack structure of printed circuit boards using an interposer and an electronic device including the stack structure.

[0008] Certain embodiments provide a stack structure of a printed circuit board using an interposer having a solid structure, wherein the interposer is not deformed even if an external impact is applied to the interposer, and an electronic device including the stack structure.

[0009] According to a specific embodiment, the electronic device may include: a first supporting member, which is arranged in an internal space defined within the electronic device and includes at least one screw fastening portion; a first printed circuit board, which is stacked on the first supporting member and includes at least one screw fixing portion arranged facing the at least one screw fastening portion; a second printed circuit board, which is spaced apart from the first printed circuit board and includes at least one first screw guide groove facing the at least one screw fixing portion; an inner plug-in, which is arranged between the first printed circuit board and the second printed circuit board to electrically connect the first printed circuit board and the second printed circuit board, and the inner plug-in includes at least one second screw guide groove facing the at least one first screw guide groove; and a second supporting member, which is stacked on the second printed circuit board and includes a screw entry portion facing the at least one first screw guide groove, wherein the second supporting member, the first printed circuit board and the first supporting member are fixed to each other via screws inserted through the screw entry portion in the second supporting member.

[0010] According to a specific embodiment, an electronic device may include: a housing including a first plate, a second plate facing away from the first plate, and a side frame structure surrounding a space defined between the first plate and the second plate; a first support member, arranged in the space to be substantially parallel to the first plate and including at least one screw fastening portion; a first printed circuit board, arranged between the first support member and the second plate, including at least one screw fixing portion facing the at least one screw fastening portion; a second printed circuit board, arranged between the first printed circuit board and the second plate, including at least one first screw guide groove facing the at least one screw fixing portion; an insert, arranged between the first printed circuit board and the second printed circuit board, electrically connecting the first printed circuit board with the second printed circuit board, and including at least one second screw guide groove facing the at least one first screw guide groove; and a second support member, arranged between the second printed circuit board and the second plate, including a screw entry portion facing the at least one first screw guide groove, wherein the second support member, the first printed circuit board and the first support member are fixed to each other via screws applied through the screw entry portion in the second support member.

[0011] Beneficial Effects

[0012] According to certain embodiments, even when two printed circuit boards are stacked using an interposer, only the support member and one printed circuit board can be fixed via the fastening member. Therefore, the reliability of the electronic device can be ensured by preventing the interposer from being damaged by external impact. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] For a more complete understanding of the present disclosure and its advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, wherein like reference numerals represent like parts throughout the accompanying drawings:

[0014] Figure 1 is a perspective view showing the front side of a mobile electronic device according to certain embodiments;

[0015] Figure 2 It is shown Figure 1 a perspective view of a rear side of an electronic device;

[0016] Figure 3 It is shown Figure 1 An exploded perspective view of an electronic device;

[0017] Figure 4A is a perspective view of an electronic device showing a stacked structure of printed circuit boards according to a specific embodiment, and Figure 4B is a perspective view of an electronic device showing a printed circuit board stack structure according to certain embodiments;

[0018] Figure 5A is a perspective view partially showing a state in which two printed circuit boards according to various embodiments are stacked via an interposer, and Figure 5B is a perspective view partially showing a state in which two printed circuit boards are stacked via an interposer according to various embodiments;

[0019] Fig. 6A is a perspective view partially showing a state in which a second supporting member is provided via a washer member according to a specific embodiment, and Figure 6B is a perspective view partially showing a state in which a second supporting member is provided via a washer member according to a specific embodiment;

[0020] Figure 7 is a perspective view partially showing a state in which a first printed circuit board is fixed to a first supporting member via a second supporting member according to a specific embodiment;

[0021] Fig. 8A is a plan view showing the configuration of an interposer according to a specific embodiment;

[0022] Figure 8B is shown along Fig. 8A A cross-sectional view of a portion of the inner plug-in unit taken along line BB' in FIG.

[0023] Fig. 9A is a plan view showing the configuration of an interposer according to a specific embodiment;

[0024] Fig. 9B is shown along Fig. 9A A cross-sectional view of a portion of the inner plug-in unit taken along line CC' in FIG.

[0025] Fig. 9C It is shown Fig. 9B A cross-sectional view of a portion of an improved inner insert in FIG. DETAILED DESCRIPTION

[0026] Discussed below Figures 1 to 9C The specific embodiments used to describe the principles of the present disclosure in this patent document are illustrative only and should not be construed in any way to limit the present disclosure. Those skilled in the art will appreciate that the principles of the present disclosure can be implemented in any suitably arranged system or device.

[0027] Hereinafter, embodiments of the present disclosure are described in detail with reference to the accompanying drawings.

[0028] Figure 1 is a perspective view showing a front surface of a mobile electronic device according to an embodiment of the present disclosure. Figure 2 This is a diagram showing an embodiment of the present disclosure. Figure 1 A perspective view of a rear surface of an electronic device.

[0029] Reference Figure 1 and Figure 2 According to one embodiment, the electronic device 100 may include a housing 110, wherein the housing 110 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding a space between the first surface 110A and the second surface 110B. According to another embodiment, the housing 110 may refer to a structure forming a portion of the first surface 110A, the second surface 110B, and the side surface 110C. According to one embodiment, the first surface 110A may be formed by a front plate 102 (e.g., a glass plate or a polymer plate coated with various coatings), and at least a portion of the front plate 102 is substantially transparent. The second surface 110B may be formed by a substantially opaque rear plate 111. The rear plate 111 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or any combination thereof. The side surface 110C may be formed by a side frame structure (or "side member") 118 that is combined with the front plate 102 and the rear plate 111 and includes metal and / or polymer. The rear plate 111 and the side frame structure 118 may be integrally formed and may be made of the same material (e.g., a metal material such as aluminum).

[0030] In the illustrated embodiment, the front plate 102 may include two first regions 110D, which are respectively disposed at the long edges of the front plate 102 and are seamlessly bent and extended from the first surface 110A toward the rear plate 111. In the illustrated embodiment, the rear plate 111 may include two second regions 110E, which are respectively disposed at the long edges of the rear plate 111 and are seamlessly bent and extended from the second surface 110B toward the front plate 102 (see FIG. Figure 2). In various embodiments, the front plate 102 (or the rear plate 111) may include only one of the first regions 110D (or the second regions 110E). In various embodiments, the first region 110D or the second region 110E may be partially omitted. In an embodiment, when viewed from the side of the electronic device 100, the side frame structure 118 may have a first thickness (or width) on a side that does not include one of the first regions 110D or one of the second regions 110E, and may have a second thickness that is less than the first thickness on another side that includes one of the first regions 110D or one of the second regions 110E.

[0031] According to one embodiment, the electronic device 100 may include at least one of the following: a display 101, audio modules 103, 107, and 114, sensor modules 104, 116, and 119, camera modules 105, 112, and 113, a key input device 117, a light emitting device 106, and connector holes 108 and 109. In various embodiments, the electronic device 100 may omit at least one of the above components (e.g., the key input device 117 or the light emitting device 106), or may further include other components.

[0032] For example, the display 101 may be exposed through a substantial portion of the front plate 102. In various embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first surface 110A and the first area 110D. In various embodiments, the outline (i.e., edges and corners) of the display 101 may have substantially the same form as the outline of the front plate 102. In another embodiment (not shown), in order to expand the exposed area of ​​the display 101, the interval between the outline of the display 101 and the outline of the front plate 102 may be substantially unchanged.

[0033] In another embodiment (not shown), a recess or opening may be formed in a portion of the display area of ​​the display 101 to accommodate at least one of the audio module (e.g., audio module 114), the sensor module 104, the camera module 105, and the light emitting device 106. In another embodiment (not shown), at least one of the audio module (e.g., audio module 114), the sensor module 104, the camera module 105, the sensor module 116 (e.g., fingerprint sensor), and the light emitting device 106 may be disposed on the back of the display area of ​​the display 101. In another embodiment (not shown), the display 101 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a stylus. In various embodiments, at least a portion of the sensor modules 104 and 119 and / or at least a portion of the key input device 117 may be disposed in one of the first regions 110D and / or one of the second regions 110E.

[0034] The audio modules 103, 107, and 114 may correspond to a microphone hole (e.g., audio module 103) and a speaker hole (e.g., audio modules 107 and 114). The microphone hole may include a microphone disposed therein for acquiring external sound, and in one case, may include multiple microphones to sense the direction of the sound. The speaker hole may be classified into an external speaker hole and a call receiver hole. In various embodiments, the microphone hole and the speaker hole may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be provided without a speaker hole.

[0035] The sensor modules 104, 116, and 119 may generate electrical signals or data corresponding to the internal operating state or external environmental conditions of the electronic device 100. The sensor modules 104, 116, and 119 may include a first sensor module (e.g., sensor module 104) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 110A of the housing 110, and / or a third sensor module (e.g., sensor module 119) (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (e.g., sensor module 116) (e.g., a fingerprint sensor) disposed on the second surface 110B of the housing 110. The fingerprint sensor may be disposed on the first surface 110A (e.g., the display 101) of the housing 110 and the second surface 110B of the housing 110. The electronic device 100 may further include at least one of the following: a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0036] The camera modules 105, 112 and 113 may include a first camera device (e.g., camera module 105) disposed on a first surface 110A of the electronic device 100, and a second camera device (e.g., camera module 112) and / or a flash (e.g., camera module 113) disposed on a second surface 110B. The camera module 105 or the camera module 112 may include one or more lenses, an image sensor and / or an image signal processor. The flash may include, for example, a light emitting diode or a xenon lamp. In various embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device 100.

[0037] The key input device 117 may be provided on the side surface 110C of the housing 110. In another embodiment, the electronic device 100 may not include some or all of the above-mentioned key input devices 117, and the key input device 117 not included may be implemented in another form such as a soft key on the display 101. In various embodiments, the key input device 117 may include a sensor module 116 provided on the second surface 110B of the housing 110.

[0038] For example, the light emitting device 106 may be disposed on the first surface 110A of the housing 110. For example, the light emitting device 106 may provide status information of the electronic device 100 in an optical form. In various embodiments, the light emitting device 106 may provide a light source associated with the operation of the camera module 105. The light emitting device 106 may include, for example, a light emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0039] Connector holes 108 and 109 may include: a first connector hole (e.g., connector hole 108), a connector suitable for sending and receiving power and / or data to and from an external electronic device (e.g., a universal serial bus (USB) connector); and / or a second connector hole (e.g., connector hole 109), a connector suitable for sending and receiving audio signals to and from an external electronic device (e.g., a headphone jack).

[0040] Figure 3 This is a diagram showing an embodiment of the present disclosure. Figure 1 An exploded perspective view of an electronic device.

[0041] Reference Figure 3 , the electronic device 300 (for example, Figure 1 The electronic device 100 may include a side frame structure 310, a first support member 311 (e.g., a bracket), a front panel 320, a display 330 (e.g., the display 101), a printed circuit board (PCB) 340, a battery 350, a second support member 360 (e.g., a back cover), an antenna 370, and a back panel 380. In various embodiments, the electronic device 300 may omit at least one of the above components (e.g., the first support member 311 or the second support member 360), or may further include another component. Some components of the electronic device 300 may be different from those of the electronic device 300. Figure 1 or Figure 2 Those components of the illustrated electronic device 100 are the same or similar, and thus description thereof is omitted below.

[0042] According to certain embodiments, the side frame structure 310 may be integrally formed with the first support member 311. According to embodiments, the side frame structure 310 may include a first surface 3101 facing the front plate 320, a second surface 3102 facing a direction opposite to the direction of the first surface 3101 and facing the rear plate 380, and a side surface 3103 surrounding a space between the first surface 3101 and the second surface 3102. According to embodiments, the first support member 311 may be formed to extend from the side surface in a direction of the internal space of the electronic device 300.

[0043] The first support member 311 is disposed inside the electronic device 300 and can be connected to the side frame structure 310 or integrated with the side frame structure 310. The first support member 311 can be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The first support member 311 can be combined with the display 330 on one side thereof and can also be combined with the PCB 340 on the other side thereof. On the PCB 340, a processor, a memory and / or an interface can be mounted. The processor can include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP).

[0044] The memory may include, for example, volatile memory or non-volatile memory.

[0045] The interface may include, for example, a high-definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0046] The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as the PCB 340. The battery 350 may be integrally disposed within the electronic device 300, and may be detachably disposed from the electronic device 300.

[0047] The antenna 370 may be disposed between the back plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device, or transmit and receive power required for wireless charging. The antenna structure may be formed by a portion or combination of the side frame structure 310 and / or the first support member 311.

[0048] Figure 4A is a perspective view of an electronic device 400 showing a stacked structure of printed circuit boards 420 and 430 according to certain embodiments, and Figure 4B is a perspective view of an electronic device 400 illustrating a stacked structure of printed circuit boards 420 and 430 according to certain embodiments.

[0049] Figure 4A The electronic device 400 may be at least partially similar to Figure 3 The electronic device 300 may also include other embodiments of the electronic device.

[0050] Reference Figure 4A and Figure 4B , electronic device 400 (eg, Figure 3 The electronic device 300 in the embodiment may include a housing (eg, Figure 1 The housing 110 in the embodiment includes a first plate 481 (eg, Figure 3 The front plate 320 in the middle), the second plate 480 facing away from the first plate 481 ( Figure 3 380), and a side frame structure 410 (eg, Figure 3 According to an embodiment, the electronic device 400 may include a first support member 411 (eg, Figure 3 According to an embodiment, the first support member 411 may be arranged to extend from the side frame structure 410 into the internal space. As another example, the first support member 411 may be separately arranged in the internal space of the electronic device 400. According to an embodiment, the first support member 411 may extend from the side frame structure 410 and may be at least partially formed of a conductive material. According to an embodiment, the electronic device 400 may include a camera structure 490, wherein the camera structure 490 is arranged in a space defined between the first plate 481 and the second plate 480.

[0051] According to certain embodiments, the electronic device 400 may include a pair of printed circuit boards 420 and 430 disposed between a first board 481 and a second board 480 in an internal space of the electronic device 400. According to embodiments, when the first board 481 is viewed from above, the pair of printed circuit boards 420 and 430 may be arranged to overlap each other at least partially. According to embodiments, the pair of printed circuit boards 420 and 430 may include a first printed circuit board 420 (e.g., a main substrate) disposed between the first support member (or board) 411 and the second board 480, and a second printed circuit board 430 (e.g., a sub-substrate) disposed between the first printed circuit board 420 and the second board 480. According to embodiments, the electronic device 400 may include an inner plug-in 440 disposed between the first printed circuit board 420 and the second printed circuit board 430. According to embodiments, the inner plug-in 440 may electrically interconnect the two first printed circuit boards 420 and the second printed circuit board 430 by being soldered to the first printed circuit board 420 and the second printed circuit board 430 via a plurality of conductive vias. According to an embodiment, the interposer 440 may have a shape substantially the same as at least one of the first printed circuit board 420 and the second printed circuit board 430, and an opening 441 may be defined at the center of the interposer 440. According to an embodiment, the opening 441 may accommodate an electronic component (e.g., various electrical components or a shielding case) disposed on at least one of the two first printed circuit boards 420 and the second printed circuit board 430. According to an embodiment, the electronic device 400 may include a second support member 450 disposed between the second printed circuit board 430 and the second board 480. According to an embodiment, the second support member 450 may be disposed at a position where the second support member 450 at least partially overlaps with the second printed circuit board 430. According to an embodiment, the second support member 450 may include a metal plate.

[0052] According to certain embodiments, the electronic device 400 may include a stacked structure in which a first printed circuit board 420, an interposer 440, a second printed circuit board 430, and a second support member 450 are stacked on a first support member (or board) 411. According to embodiments, the electronic device 400 may include at least one screw 470 that passes through at least a portion of the first printed circuit board 420 and the interposer 440 so that the first printed circuit board 420 and the interposer 440 do not participate in fastening, and the at least one screw 470 is fastened so that the first printed circuit board 420 is fixed to the first support member 411 via the second support member 450 (e.g., in a mutually exclusive sense).

[0053] According to a specific embodiment, the first supporting member 411 may include at least one screw fastening portion 412, wherein the screw fastening portion 412 includes a screw fastening hole 4121. According to an embodiment, the first printed circuit board 420 may include at least one screw fixing portion 422 formed at a position facing the at least one screw fastening portion 412. According to an embodiment, the screw fixing portion 422 may include a recess having a predetermined size formed in a portion of an edge of the first printed circuit board 420. In another embodiment, the screw fixing portion 422 may include a through hole formed in the first printed circuit board 420.

[0054] According to an embodiment, the second printed circuit board 430 may include at least one first screw guide groove 432 formed at a position facing the at least one screw fixing portion 422. According to an embodiment, the interposer 440 may include at least one second screw guide groove 442 formed at a position facing the first screw guide groove 432 in the second printed circuit board 430. According to an embodiment, the first screw guide groove 432 and the second screw guide groove 442 may have the same size and shape. The first screw guide groove 432 and the second screw guide groove 442 may guide the screw to be fastened, but may be formed to a size that does not participate in the fastening. According to an embodiment, each of the first screw guide groove 432 and the second screw guide groove 442 may include a recessed portion formed in a portion of an edge of one of the second printed circuit board 430 and the interposer 440. According to an embodiment, each of the first screw guide groove 432 and the second screw guide groove 442 may include a through hole formed through one of the second printed circuit board 430 and the interposer 440.

[0055] According to a specific embodiment, the second support member 450 may include a screw inlet portion 452 formed at a position facing the screw fixing portion 422 of the first printed circuit board 420. According to an embodiment, the screw inlet portion 452 may include a through hole 4521 through which the screw 470 passes. According to an embodiment, the screw inlet portion 452 may be formed to be lower than the surface of the second support member 450. For example, when the second support member 450 includes a metal plate, the screw inlet portion 452 may be formed by a pressing or molding process. For example, when the second support member 450 is made of a polymer material, the screw inlet portion 452 may be formed by a pressing or injection molding process. According to an embodiment, due to the screw inlet portion 452, the screw 470 fastened through the second support member 450 may not protrude from the outer surface of the second support member 450.

[0056] According to certain embodiments, the electronic device 400 may include a washer member 460 having a predetermined thickness to press or support the first printed circuit board 420 when accommodated in the first screw guide groove 432 and the second screw guide groove 442. According to embodiments, the washer member 460 may be formed to have a thickness that compensates for the thickness of the second printed circuit board 430 and the interposer 440, wherein the second printed circuit board 430 and the interposer 440 do not participate in fastening the screw 470. Therefore, the screw 470 introduced into the screw entrance portion 452 in the second support member 450 passes through the through hole 461 of the washer member 460 and is then fastened to the screw fastening portion 412 in the first support member 411, whereby the first printed circuit board 420 may be securely fixed to the first support member 411 via the second support member 450. For example, the second printed circuit board 430 may be fixed to the first printed circuit board 420 via the interposer 440. This is due to the fact that the interposer 440 is fixed to the first printed circuit board 420 and the second printed circuit board 430 by a soldering process using solder.

[0057] According to certain embodiments, even if the first support member 411, the first printed circuit board 420, the interposer 440, the second printed circuit board 430, and the second support member 450 are stacked to have a height via the screws 470, since the first printed circuit board 420 is fixed to the first support member 411 via the second support member 450, the interposer 440 can be prevented from being damaged by external impact. In addition, even if the second printed circuit board 430 does not participate in screw fastening, since the peripheral area except the first screw guide groove 432 has an area overlapping with the interposer 440, it may be advantageous to secure a wider electrical component installation space.

[0058] As another embodiment, the role of the washer member may be replaced by adjusting the height and shape of the screw fastening portion 412 without the washer member 460. For example, the screw fastening portion 412 may extend from the first supporting member 411 to a predetermined height, may pass through the first printed circuit board 420, the interposer 440, and the second printed circuit board 430, and then may be fastened with the screw 470 via the second supporting member 450.

[0059] Figure 5A is a perspective view partially showing a state in which two printed circuit boards 420 and 430 are stacked via an interposer 440 according to various embodiments, and Figure 5B 4 is a perspective view partially illustrating a state in which two printed circuit boards 420 and 430 are stacked via an interposer 440 according to certain embodiments.

[0060] Reference Figure 5A and Figure 5B, the first printed circuit board 420, the interposer 440, and the second printed circuit board 430 may be sequentially stacked on the first supporting member 411. In this case, the screw fastening portion 412 in the first supporting member 411 and the screw fixing portion 422 in the first printed circuit board 420 may be arranged to face each other. According to an embodiment, the first screw guide groove 432 in the second printed circuit board 430 and the second screw guide groove 442 in the interposer 440 may also be arranged at a position facing the screw fixing portion 422.

[0061] According to certain embodiments, the first screw guide groove 432 in the second printed circuit board 430 and the second screw guide groove 442 in the insert 440 may have a size and shape that does not participate in screw fastening. According to embodiments, when the first board (e.g., the first board 481 in FIG. 4 ) is viewed from above, the first screw guide groove 432 in the second printed circuit board 430 and the second screw guide groove 442 in the insert 440 may be formed to have a size and / or shape that includes the screw fixing portion 422 in the first printed circuit board 420. For example, as shown in the figure, when the first board (e.g., the first board 481 in FIG. 4 ) is viewed from above, Figure 4A When the first plate 481 is formed in the first screw guide groove 432, the second screw guide groove 442 may have the same shape and may have a predetermined gap g with the screw fixing portion 422. According to an embodiment, a screw (e.g., Figure 4B The screws 470 in the first support member 411 can fix the first printed circuit board 420 to the first support member 411 without contacting the first screw guide groove 432 and the second screw guide groove 442.

[0062] According to certain embodiments, the first screw guide slot 432 and the second screw guide slot 442 do not participate in screw tightening, but guide the screw (eg, Figure 4B The screw 470 in the first printed circuit board 420 is provided in the insert 440 and the second printed circuit board 430 overlapping the first printed circuit board 420. Therefore, the height for screw fastening can be compensated. Therefore, the electronic device 400 may include a washer member 460 provided at a position corresponding to the first screw guide groove 432 and the second screw guide groove 442. According to an embodiment, the washer member 460 may be provided to be included in the screw fixing portion 422 above the first printed circuit board 420 when being accommodated in the first screw guide groove 432 and the second screw guide groove 442 at the same time.

[0063] Fig. 6A is a perspective view partially showing a state in which the second supporting member 450 is provided via the gasket member 460 according to a specific embodiment, and Figure 6B 4 is a perspective view partially illustrating a state in which the second supporting member 450 is provided via the gasket member 460 according to certain embodiments.

[0064] Figure 6B Shown along Fig. 6A A cross section of the electronic device 400 taken along line AA′ in FIG.

[0065] Reference Fig. 6A and Figure 6B , in a state where the washer member 460 is accommodated in the first screw guide groove 432 and the second screw guide groove 442 and is disposed on the first printed circuit board 420, the second support member 450 may be disposed on the second printed circuit board 430. In this case, the screw entrance portion 452 in the second support member 450 may be disposed at a position facing the washer member 460. For example, the through hole 4521 in the screw entrance portion 452, the through hole 461 in the washer member 460, and the fastening hole 4121 in the first support member 411 may be aligned to overlap with each other. Therefore, when a screw (e.g., Figure 4B When the screw 470 in the first support member 411 is fastened through the through hole 4521 in the screw entrance portion 452, the screw can be fastened to the fastening hole 4121 in the first support member 411 through the through hole 461 in the washer member 460. In this case, since the screw (e.g., Figure 4B By fastening the screws 470 in the second support member 450, the second support member 450 is pressed toward the first support member 411, and the washer member 460 presses the top surface of the first printed circuit board 420 through the pressed second support member 450, whereby the first printed circuit board 420 can be firmly fixed to the first support member 411. As another embodiment, the screws can be fastened to the screw fixing portion 422 in the first printed circuit board 420 and the screw fastening portion 412 in the first support member 411 at the same time.

[0066] According to certain embodiments, even if the first printed circuit board 420 is fixed to the first support member 411 via the washer member 460, the second printed circuit board 430 and the interposer 440 can be supported in their positions without engaging in screw fastening. Therefore, even when an impact is transmitted from the outside of the electronic device 400, the second printed circuit board 430 and the interposer 440 can be prevented from being twisted relative to the first printed circuit board 420.

[0067] Figure 7 4 is a perspective view partially illustrating a state in which a first printed circuit board 420 is fixed to a first supporting member 411 via a second supporting member 450 according to certain embodiments.

[0068] Reference Figure 7 In order to compensate for the height of the first screw guide groove 432 and the second screw guide groove 442, a separate washer member (eg, Fig. 6AThe washer member 460 of the second support member 450 may be provided, and the screw entrance portion 452 in the second support member 450 may also be used as a washer member simply by changing its structural variation. For example, the screw entrance portion 452 may include an extension portion 4522 extending to the top surface of the first printed circuit board 420, and the through hole 4451 may be formed in the extension portion 4522. Therefore, when the second support member 450 is disposed on the second printed circuit board 430, the extension portion 4522 may be disposed to substantially contact the first printed circuit board 420 while being guided by the first screw guide groove 432 and the second screw guide groove 442.

[0069] Fig. 8A is a plan view showing the configuration of an interposer 810 according to certain embodiments. Figure 8B is shown along Fig. 8A FIG. 8 is a cross-sectional view of a portion of the interposer 810 taken along line BB′ in FIG.

[0070] Fig. 8A The insert 810 in may be at least partially similar to Figure 4A The electronic device 400 may also include other embodiments of an internal plug-in.

[0071] Reference Fig. 8A and Figure 8B , the inner plug-in 810 (for example, Figure 4B The inner plug-in 440 in the embodiment may include facing the first printed circuit board 820 (eg, Figure 4B The first side 8101 of the first printed circuit board 420 in the embodiment of the present invention is opposite to the first side 8101 and faces the second printed circuit board 830 (for example, Figure 4B The second side 8102 ( Figure 8B ), and a side surface 8103 surrounding a space between the first face 8101 and the second face 8102. According to an embodiment, the interposer 810 may include a plurality of first connection pads 811 disposed on the first face 8101 and a plurality of second connection pads 812 disposed on the second face 8102. According to an embodiment, the plurality of first connection pads 811 and the plurality of second connection pads 812 may be electrically connected to each other via a plurality of conductive vias 813 formed to penetrate the interposer 810 from the first face 8101 to the second face 8102. According to an embodiment, the plurality of first connection pads 811 may be electrically connected to the first printed circuit board 820, and the plurality of second connection pads 812 may be electrically connected to the second printed circuit board 830. According to an embodiment, the plurality of first connection pads 811 and the plurality of second connection pads 812 may be used to transmit electrical signals (e.g., data signals and / or ground signals) between the first printed circuit board 820 and the second printed circuit board 830. According to an embodiment, the plurality of first connection pads 811 and the plurality of second connection pads 812 may include solder applied to the first side 8101 and the second side 8102 .

[0072] According to a specific embodiment, the first unit connection pad 811 of each of the plurality of first connection pads 811 may be electrically connected to the second unit connection pad 812 of each of the plurality of second connection pads 812 via at least two conductive vias 813. For example, the first unit connection pad 811 is electrically connected to the second unit connection pad 812 via the plurality of conductive vias 813. Therefore, even if any one of the conductive vias is damaged by an external impact, a smooth electrical connection between the first unit connection pad 811 and the second unit connection pad 812 may be achieved through the remaining vias.

[0073] According to certain embodiments, the insert 810 may include screw guide slots 815 disposed at edges and / or corners (eg, Figure 4B According to an embodiment, the insert 810 may include a first support pad 816 and a second support pad 817, wherein the first support pad 816 and the second support pad 817 are respectively arranged on the first face 8101 and the second face 8102 around the screw guide groove 815. According to an embodiment, the first support pad 816 and the second support pad 817 may be arranged to respectively surround the screw guide groove 815 on the first face 8101 and the second face 8102. According to an embodiment, the first support pad 816 and the second support pad 817 may be formed to prevent breakage caused by contact with the screw and / or the washer passing through the screw guide groove 815 and to enhance rigidity. According to an embodiment, the first support pad 816 and the second support pad 817 may be used to transmit electrical signals (e.g., data signals and / or ground signals) between the first printed circuit board 820 and the second printed circuit board 830.

[0074] According to a specific embodiment, the first support pad 816 and the second support pad 817 may be electrically connected to each other via a conductive material 818 applied to the side 8103 of the insert 810 in the screw guide groove 815. In another embodiment, the first support pad 816, the conductive material 818, and the second support pad 817 may be formed by solder applied from the first face 8101 to the second face 8102 through the side 8103 in a bypass manner. According to an embodiment, the first support pad 816 and the second support pad 817 may be formed to have a wider area than the peripheral connection pads 811 and 812. According to an embodiment, the first support pad 816 and the second support pad 817 may be formed to be higher than the peripheral connection pads 811 and 812. In this case, the support pads 816 and 817 may be formed by increasing the introduction of solder by increasing the thickness of the metal mask. According to an embodiment, when printed circuit boards 820 and 830 face interposer 810 , since printed circuit boards 820 and 830 are supported by support pads 816 and 817 formed higher than connection pads 811 and 812 , connection pads 811 and 812 may be prevented from being pressed and damaged.

[0075] Fig. 9A is a plan view showing the configuration of an interposer 810 according to certain embodiments. Fig. 9B is shown along Fig. 9A 8 is a cross-sectional view of a portion of the interposer 810 taken along line CC′ in FIG.

[0076] In the description Fig. 9A and Fig. 9B When the electrical connection structure of the plurality of first connection pads 811 and the plurality of first connection pads 812 is Fig. 8A and Figure 8B The electrical connection structures of the plurality of first connection pads 811 and the plurality of first connection pads 812 are substantially the same, and thus the description of the electrical connection structures of the plurality of first connection pads 811 and the plurality of first connection pads 812 will be omitted.

[0077] Reference Fig. 9A and Fig. 9B , the first support pad 816 and the second support pad 817 may be electrically connected to each other via a plurality of conductive vias 819, wherein the plurality of conductive vias 819 are formed to penetrate the interposer 810 from the first side 8101 to the second side 8102 at regular intervals. According to an embodiment, when a plurality of conductive vias 813 connecting the first connection pad 811 and the second connection pad 812 are formed, the plurality of conductive vias 819 may be formed of the same material.

[0078] Fig. 9C It is shown Fig. 9B A cross-sectional view of a portion of an improved inner insert in FIG.

[0079] Reference Fig. 9C , the interposer 810 may include a plurality of first connection pads 811 and 811' disposed on the first side 8101 and a plurality of second connection pads 812 and 812' disposed on the second side 8102. According to an embodiment, each of at least some of the plurality of first connection pads 811 and 811' and each of at least some of the plurality of second connection pads 812 and 812' may be electrically connected to each other via one conductive via 814. In this case, one conductive via 814 may be formed of a conductive material (e.g., Cu) having a volume greater than that of each of the at least two conductive vias 813, thereby facilitating a reduction in DC resistance (DCR). As another embodiment, each of at least some of the plurality of first connecting pads 811 and 811' and each of at least some of the plurality of second connecting pads 812 and 812' can be assigned to transmit the same signal, thereby reducing the risk of signal non-transmission even if one conductive via 814 is damaged or broken.

[0080] According to certain embodiments, each of at least some of the plurality of first connection pads 811 and 811' and each of at least some of the plurality of second connection pads 812 and 812' may be electrically connected to each other via at least two conductive vias 813. For example, in the case of signals that may be distorted (e.g., high-speed signals of a USB), it may be advantageous to electrically connect the first connection pads 811 and the second connection pads 812 to each other via at least two conductive vias 813.

[0081] According to certain embodiments, an electronic device (e.g., Figure 4A The electronic device 400 may include: a first supporting member (eg, Figure 4B The first support member 411 in the electronic device is disposed in the internal space of the electronic device and includes at least one screw fastening portion (eg, Figure 4B The screw fastening portion 412 in the first printed circuit board (eg, Figure 4B The first printed circuit board 420 in the embodiment of the present invention is stacked on the first supporting member and includes at least one screw fixing portion (eg, Figure 4B The screw fixing portion 422 in the second printed circuit board (eg, Figure 4B The second printed circuit in the first printed circuit board is spaced apart from the first printed circuit board and includes at least one first screw guide groove (e.g., Figure 4B at least one first screw guide slot 432 in the insert (eg, Figure 4B The inner plug-in 440 is disposed between the first printed circuit board and the second printed circuit board to electrically connect the first printed circuit board and the second printed circuit board, and the inner plug-in includes at least one second screw guide groove (e.g., Figure 4B a second screw guide groove 442 in the middle); and a second support member (eg, Figure 4B The second support member 450 in the second printed circuit board is disposed between the second printed circuit board and the second board and includes a screw entrance portion (eg, Figure 4B The second support member, the first printed circuit board, and the first support member may be connected via screws (e.g., Figure 4B The screws 470) in the middle are fixed to each other.

[0082] According to certain embodiments, when the second supporting member is viewed from above, the screw fixing portion may be disposed at a position overlapping the first screw guide groove and / or the second screw guide groove.

[0083] According to certain embodiments, the screw fixing portion may be formed to be smaller than the first screw guide groove and / or the second screw guide groove.

[0084] According to certain embodiments, the first screw guide slot and the second screw guide slot may be formed to have the same size and / or shape.

[0085] According to certain embodiments, the screw entry portion may include a through hole (e.g., Figure 4B The through hole 4521 in the screw guide groove may be formed to be lower than the surface of the second supporting member at a position facing the second screw guide groove.

[0086] According to certain embodiments, the electronic device may further include: a gasket member (eg, Figure 4B The washer member 460 in the first support member is interposed between the screw fixing portion in the first printed circuit board and the screw entry portion in the second support member.

[0087] According to certain embodiments, the washer member may be at least partially received in the first screw guide slot and the second screw guide slot, and may be disposed in parallel with the first screw guide slot and the second screw guide slot.

[0088] According to certain embodiments, the gasket member may be formed to have a thickness at least equal to or greater than a sum of thicknesses of the second printed circuit board and the interposer.

[0089] According to certain embodiments, the washer member may be placed on a top surface including the screw fixing portion in the first printed circuit board, and may be disposed to be pressed by the screw entry portion in the second supporting member.

[0090] According to certain embodiments, the electronic device may further include: an extension portion (eg, Figure 7 An extension portion 4522 in the screw guide groove extends from the screw entrance portion toward the first supporting member, and the extension portion can be configured to be at least partially accommodated in the first screw guide groove and the second screw guide groove.

[0091] According to certain embodiments, the extension portion may be formed to have a depth that contacts a top surface of the first printed circuit board when assembled.

[0092] According to certain embodiments, an interposer (eg, interposer 810 in FIG. 8 ) may include: a first side (eg, Figure 8B The first surface 8101 in the figure faces the first supporting member; the second surface (eg, Figure 8B The second side 8102 in the figure is opposite to the first side; the side (e.g., Figure 8B 8103), surrounding the space between the first surface and the second surface; and a pair of support pads (e.g., Figure 8B The support pads 816 and 817 in the figure are arranged to surround the second screw guide groove and be exposed on the first surface and the second surface.

[0093] According to certain embodiments, the pair of support pads may be formed by applying to the side a support pad from the first side (e.g., Figure 8B The first support pad 816 in the middle extends to the support pad on the second side (e.g., Figure 8B The conductive material (eg, Figure 8B The conductive materials 818 in the circuit are electrically connected to each other.

[0094] According to certain embodiments, the interposer may further include: a plurality of connection pads (eg, Figure 8B The connection pads 811 and 812 in the embodiment are arranged to be exposed on the first and second surfaces; and a plurality of conductive vias (eg, Figure 8B The conductive via 813 in the embodiment is formed to penetrate the interposer from the first side to the second side and electrically connect the plurality of connection pads, and the support pad may have a larger area than the connection pad.

[0095] According to a specific embodiment, the insert may also include: a plurality of connecting pads, which are arranged to be exposed on the first side and the second side; and a plurality of conductive vias, which are formed to penetrate the insert from the first side to the second side and electrically connect the connecting pads, and the support pad may have a higher height than the connecting pads.

[0096] According to certain embodiments, the pair of support pads may be connected via at least one conductive via (e.g., Fig. 9B The conductive vias 819 in the inner plug are electrically connected to each other, wherein the at least one conductive via is formed to penetrate the inner plug from the first side to the second side.

[0097] According to certain embodiments, the first supporting member may be formed to extend from a side frame structure of the electronic device to the space.

[0098] According to certain embodiments, the electronic device may further include: a display (eg, Figure 3 The display 330 in the electronic device is arranged in the internal space to be visible from the outside through at least a portion of the electronic device.

[0099] According to certain embodiments, an electronic device (e.g., Figure 4A The electronic device 400 may include: a housing (eg, Figure 1 The housing 110 in the embodiment includes a first plate (eg, Figure 4A The first plate 481 in the figure), the second plate facing away from the first plate (for example, Figure 4A The second plate 480 in the first plate and the side frame structure surrounding the space between the first plate and the second plate (for example, Figure 4A side frame structure 410); a first supporting member (eg, Figure 4BThe first support member 411 in the space is arranged substantially parallel to the first plate and includes at least one screw fastening portion (eg, Figure 4B The screw fastening portion 412 in the first printed circuit board (eg, Figure 4B The first printed circuit board 420 in the embodiment is disposed between the first supporting member and the second board, and includes at least one screw fixing portion (eg, Figure 4B The screw fixing portion 422 in the second printed circuit board (eg, Figure 4B The second printed circuit 430 in the first printed circuit board is disposed between the first printed circuit board and the second board, and includes at least one first screw guide groove (e.g., Figure 4B at least one first screw guide slot 432 in the insert (eg, Figure 4B The inner plug-in 440 in the first printed circuit board is disposed between the first printed circuit board and the second printed circuit board to electrically connect the first printed circuit board and the second printed circuit board, and includes at least one second screw guide groove (e.g., Figure 4B a second screw guide groove 442 in the middle); and a second support member (eg, Figure 4B The second support member 450 in the second printed circuit board is disposed between the second printed circuit board and the second board and includes a screw entrance portion (eg, Figure 4B The second support member, the first printed circuit board, and the first support member may be connected via screws (e.g., Figure 4B The screws 470) in the middle are fixed to each other.

[0100] According to certain embodiments, when the first plate is viewed from above, the screw fixing portion may be disposed at a position overlapping the first screw guide groove and / or the second screw guide groove.

[0101] The embodiments of the present disclosure disclosed in the specification and the drawings are only specific examples proposed to easily describe the technical matters of the present disclosure and help understand the present disclosure, and do not limit the scope of the present disclosure. Therefore, in addition to the embodiments disclosed herein, the scope of the specific embodiments of the present disclosure should be interpreted as including all modifications or improved forms derived from the technical concept of the specific embodiments of the present disclosure.

Claims

1. An electronic device, comprising: a first supporting member disposed in an internal space defined within the electronic device and comprising at least one screw fastening portion; a first printed circuit board stacked on the first supporting member and including at least one screw fixing portion disposed facing the at least one screw fastening portion; a second printed circuit board spaced apart from the first printed circuit board and comprising at least one first screw guide groove facing the at least one screw fixing portion; an interposer disposed between the first printed circuit board and the second printed circuit board to electrically connect the first printed circuit board and the second printed circuit board, and the interposer includes at least one second screw guide groove facing the at least one first screw guide groove; as well as a second supporting member stacked on the second printed circuit board and including a screw entrance portion facing the at least one first screw guide groove, wherein the second supporting member, the first printed circuit board and the first supporting member are fixed to each other via screws inserted through screw entry portions in the second supporting member, The plugins also include: a first surface facing the first supporting member; The second side, facing away from the first side; a side surface surrounding a space defined between the first surface and the second surface; and A pair of support pads are disposed around the second screw guide groove and are exposed on the first surface and the second surface.

2. The electronic device according to claim 1, wherein: The screw fixing portion is provided at a position overlapping with the first screw guide groove and / or the second screw guide groove.

3. The electronic device according to claim 2, wherein: The screw fixing portion is smaller than the first screw guide groove and / or the second screw guide groove.

4. The electronic device according to claim 1, wherein: The first screw guide groove and the second screw guide groove are formed to have the same size and / or shape.

5. The electronic device according to claim 1, wherein: The screw entrance portion defines a through hole, and is disposed to face the second screw guide groove and to be lower than a surface of the second support member with respect to a front surface of the electronic device.

6. The electronic device according to claim 5, further comprising: A washer member is interposed between the screw fixing portion in the first printed circuit board and the screw entry portion in the second supporting member.

7. The electronic device according to claim 6, wherein: The washer member is at least partially accommodated in the first screw guide groove and the second screw guide groove, and the washer member is disposed in parallel with the first screw guide groove and the second screw guide groove.

8. The electronic device according to claim 7, wherein: The gasket member has a thickness at least equal to or greater than the sum of the thicknesses of the second printed circuit board and the interposer.

9. The electronic device according to claim 8, wherein: A washer member is placed on the top surface including the screw fixing portion in the first printed circuit board, and the washer member is pressed by the screw entrance portion in the second supporting member.

10. The electronic device according to claim 5, further comprising: an extending member extending from the screw entrance portion toward the first supporting member, Wherein, the extension member is at least partially received in the first screw guide groove and the second screw guide groove.

11. The electronic device according to claim 10, wherein: The extension member defines a depth such that a portion of the extension member contacts the top surface of the first printed circuit board when assembled.

12. The electronic device according to claim 1, wherein: The pair of support pads are electrically connected to each other by a conductive material disposed on the side surface, and the conductive material extends from a first support pad on the first surface to a second support pad on the second surface.

13. The electronic device according to claim 1, wherein: The plugins also include: A plurality of connection pads exposed on the first side and the second side; and a plurality of conductive vias formed to penetrate the interposer from the first side to the second side and electrically connect the plurality of connection pads, Wherein, each support pad of the pair of support pads has a larger area than each connection pad of the plurality of connection pads.

14. The electronic device according to claim 1, wherein: The plugins also include: A plurality of connection pads exposed on the first side and the second side; and a plurality of conductive vias formed to penetrate the interposer from the first side to the second side and electrically connect the plurality of connection pads, Wherein, each support pad of the pair of support pads has a higher height than each connection pad of the plurality of connection pads.

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