Cup cleaning device and working method thereof

Abstract

Multiple embodiments of the present invention relate to a cup cleaning device and a working method thereof, wherein the cup cleaning device comprises: a position adjustment device; a valve; a memory; and a processor connected to the position adjustment device, the valve and the memory, wherein the processor rotates an operating table device loaded with wafers, and controls the valve to spray a cleaning material for cleaning the multiple cups while the positions of the multiple cups for recovering chemical substances are adjusted by the position adjustment device, and controls the valve not to spray the cleaning material if a preset time has passed since the time point of spraying the cleaning material. Other embodiments can also be implemented.

Description

Technical Field

[0001] Various embodiments of the present invention relate to a cup cleaning device and a method of operating the same. Background Art

[0002] Generally, a plurality of patterns formed on a semiconductor substrate may be formed by a photolithography process, which may include a photoresist coating process, an exposure process, a development process, and a cleaning process.

[0003] Typically, the cleaning process can be performed by a single cleaning device, which may include a spin chuck for holding the wafer, a chemical nozzle for supplying chemicals to the wafer, and a cup (or processing cup) surrounding the spin chuck and connected to a waste liquid channel and an exhaust pipe at the bottom.

[0004] The background technology of the present invention is disclosed in Korean Patent Publication No. 2019-0007198 (published on January 22, 2019, title: cup cleaning device including processing cup). Summary of the invention

[0005] Various embodiments of the present invention disclose methods and apparatus for removing chemicals present in a plurality of cups and exhaust gases for recovering chemicals injected for wafer processing during a cleaning step in a semiconductor manufacturing process.

[0006] The cup cleaning device of multiple embodiments of the present invention includes: a position adjustment device; a valve; a memory; and a processor connected to the position adjustment device, the valve and the memory, the processor rotates the operating table device loaded with wafers, and controls the valve to spray cleaning material for cleaning the multiple cups while the positions of multiple cups for recovering chemical substances are adjusted by the position adjustment device, and controls the valve not to spray the cleaning material if a preset time has passed since the time of spraying the cleaning material.

[0007] According to multiple embodiments, as at least part of the action of controlling the valve to spray the cleaning substance, the processor identifies first cup position information based on the cup cleaning program information loaded from the memory, controls the position adjustment device to adjust the positions of the multiple cups based on the first cup position information, and then controls the valve to spray the cleaning substance.

[0008] According to multiple embodiments, the cup cleaning device may also include: a front nozzle, spraying a cleaning substance toward the upper end of the wafer; a back nozzle, spraying a cleaning substance toward the lower end of the wafer; a first cleaning nozzle, spraying a cleaning substance toward at least a portion of a housing surrounding a spindle that rotates the operating table device; and a plurality of second cleaning nozzles, spraying a cleaning substance toward the lower end of the cup.

[0009] According to multiple embodiments, the multiple second cleaning nozzles may include: at least one cleaning nozzle for cleaning a portion of the position adjustment device; at least one cleaning nozzle for cleaning the lower ends of the multiple cups; and at least one cleaning nozzle for cleaning at least a portion of the drain outlet.

[0010] According to various embodiments, at least one cleaning nozzle for cleaning a portion of the position adjustment device sprays cleaning material at a first pressure, and at least one cleaning nozzle for cleaning lower ends of the plurality of cups sprays cleaning material at a second pressure lower than the first pressure.

[0011] According to various embodiments, the processor identifies the execution time of the cleaning program according to the cup cleaning program information, and controls the valve not to spray the cleaning substance if the execution time has passed since the time point of spraying the cleaning substance.

[0012] According to various embodiments, the processor executes a drying procedure for drying the cleaning material after controlling the valve not to spray the cleaning material.

[0013] According to various embodiments, the position adjustment device comprises one of a hydraulic cylinder, a pneumatic cylinder, and a motor.

[0014] According to various embodiments of the present invention, the positions of multiple cups for recovering chemicals sprayed for wafer processing during a cleaning process in a semiconductor manufacturing process can be individually adjusted to effectively remove chemicals present inside each cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1a The diagram briefly illustrates the structure of an electronic device according to various embodiments.

[0016] Figure 1b is a block diagram of an electronic device according to various embodiments.

[0017] Figure 2 The diagram is an illustrative diagram for explaining a method for adjusting the height of a cup in an electronic device according to various embodiments.

[0018] Figure 3 The diagram is an illustrative diagram for describing a method for cleaning a cup in an electronic device according to various embodiments.

[0019] Figure 4a to Figure 4b An illustrative diagram for explaining an example of a method for cleaning the lower end of a cup in an electronic device according to multiple embodiments.

[0020] Figure 5 It is an illustrative diagram for explaining another example of the method of cleaning the lower end of a cup in the electronic device according to the multiple embodiments.

[0021] Figure 6 The present invention is a flow chart for describing a method for cleaning a plurality of cups in an electronic device according to various embodiments. DETAILED DESCRIPTION

[0022] Hereinafter, multiple embodiments in this specification are described with reference to the accompanying drawings. The embodiments and the terms used therein are not used to limit the technology described in this specification to a specific embodiment, and should be understood to include multiple changes, equivalent technical solutions and / or alternative technical solutions of the corresponding embodiments. In the process of describing the accompanying drawings, similar reference numerals may be used for similar structural elements. As long as it is not clearly stated in the text, the expression of the singular may include the expression of the plural. In this specification, the expression of "A or B" or "at least one of A and / or B" may include all possible combinations of multiple items listed together. The expressions of "first", "second", "one", "two", etc. can modify the corresponding structural elements in a manner unrelated to the order or importance, and are only used to distinguish one structural element from other structural elements, and do not limit the corresponding structural elements. When it is mentioned that a certain (e.g., first) structural element is "connected (functionally or in terms of communication)" or "connected" to other (e.g., second) structural elements, the certain structural element may be directly connected to the other structural elements, or may be connected through other structural elements (e.g., third structural elements).

[0023] In this specification, for example, "configured to" and the like may be used interchangeably with "suitable for", "having the function of", "changed in the manner of", "made in the manner of", "capable of performing" or "designed in the manner of", etc., in hardware or software, depending on the situation. In some cases, the expression "a device configured to" may mean that the device is "configured in the manner of" together with other devices or multiple components. For example, the sentence "a processor configured to perform A, B, and C" may mean a dedicated processor for performing the corresponding actions (e.g., a built-in processor) or a general-purpose processor (e.g., a central processing unit (CPU) or an application processor) that can perform the corresponding actions by executing one or more software programs stored in a storage device.

[0024] Figure 1a The diagram briefly illustrates the structure of an electronic device according to various embodiments.

[0025] Reference Figure 1a , the cup cleaning device 10 may include an operating table device 11, a shaft 12, a housing 13, a plurality of cups 14, and a position adjustment device 15. According to one embodiment, a wafer or a cleaned wafer may be loaded on the operating table device 11. The shaft 12 may rotate the operating table device 11. The housing 13 may be configured to surround at least a portion of the shaft 12. The plurality of cups 14 may recover the chemical substances (or cleaning substances) sprayed onto the wafer. The position adjustment device 15 may adjust the positions of the plurality of cups 14, and may include a hydraulic cylinder, a pneumatic cylinder, or a motor. The operating table device 11 and the plurality of cups 14 may be referred to as the upper end 20 of the cup cleaning device 10. The housing 13 and the position adjustment device 15 may be referred to as the lower end 30 of the cup cleaning device 10. The lower end 30 of the cup cleaning device 10 may also include a drain port for discharging the chemical substances and / or cleaning substances.

[0026] Figure 1b is a block diagram of an electronic device according to various embodiments. Figure 2 The diagram is an illustrative diagram for explaining a method for adjusting the height of a cup in an electronic device according to various embodiments. Figure 3 The diagram is an illustrative diagram for describing a method for cleaning a cup in an electronic device according to various embodiments. Figure 4a to Figure 4b An illustrative diagram for explaining an example of a method for cleaning the lower end of a cup in an electronic device according to multiple embodiments. Figure 5 It is an illustrative diagram for explaining another example of the method of cleaning the lower end of a cup in the electronic device according to the multiple embodiments.

[0027] Reference Figure 1b to Figure 5 The cup cleaning device 100 may include a processor 120, a memory 130, a position adjustment device 150, and a valve 160. However, the present invention is not limited thereto. For example, the cup cleaning device 100 may further include an input device for receiving input, an output device for outputting information, and at least a portion of a communication circuit for communicating data with an external electronic device.

[0028] According to various embodiments, the processor 120 may control a plurality of hardware structural elements or software structural elements connected to the processor 120 by driving an operating system or an application program, and may perform various data processing and operations. According to one embodiment, the processor 120 may be implemented by a system on chip (SoC). The processor 120 may load instructions or data received from at least one of the other structural elements to the memory 130 and process them, and may store various data in the memory 130.

[0029] According to various embodiments, if the cleaning process is started, the processor 120 enables the operating station device (for example: Figure 1a The operating table device 11 in the cup cleaning process is rotated at a specified speed. For example, if the cleaning process is started, the processor 120 determines whether the cleaning wafer is loaded on the operating table device (or the chuck operating table device). If it is determined that the cleaning wafer is loaded on the operating table device, the preset speed (for example, preset RPM) is identified according to the cup cleaning program information, so that the operating table can be rotated at the identified speed. And, for example, if the cup cleaning program is started, the processor 120 identifies the preset speed according to the cup cleaning program information, so that the operating table device (or the chuck operating table device) loaded with the wafer can be rotated at the identified speed. If the cup cleaning program is started, the processor 120 can obtain the cup cleaning program information by loading the cup cleaning program information from the memory 130.

[0030] According to various embodiments, if the operating table device is rotated, the processor 120 can control the position adjustment device 150 based on the cup washing program information (for example: Figure 1a Specifically, the processor 120 can identify the first cup position information for adjusting the position of the cup according to the cup cleaning program information, and can control the position adjustment device 150 to adjust the position of the cup based on the first cup position information. Figure 2As shown, the processor 120 can control the position adjustment device 150 based on the first cup position information so that the plurality of cups 201, 203, 205 located at the starting position 200 move to the position of the table (for example, the first table 210, the second table 220 or the third table 230). In other examples, such as Figure 2 As shown, the processor 120 can control the position adjustment device 150 based on the first cup position information so that the plurality of cups 201, 203, 205 located at a position of the table (for example, the first table 210, the second table 220, or the third table 230) are moved to positions of other tables (the first table 210, the second table 220, or the third table 230). According to one embodiment, the cup position information can be changed according to the efficiency of the cleaning process program or the setting of the administrator.

[0031] According to various embodiments, the processor 120 controls the valve 160 to adjust the upper end (eg, Figure 1a The upper end 20 of the cup cleaning device 10 is cleaned. Figure 3 As shown, the processor 120 can control the valve 160 in such a manner that the front nozzle 301 moves toward the upper end of the cleaning wafer 305 and the cleaning material is supplied through the front nozzle 301 and the rear nozzle 303. The cleaning material supplied through the front nozzle 301 is sprayed toward the upper end of the cleaning wafer 305, and the cleaning material supplied through the rear nozzle 303 is sprayed toward the lower end of the cleaning wafer 305. The cleaning material sprayed toward the cleaning wafer 305 is scattered toward the periphery due to the rotation of the cleaning wafer, and the plurality of cups 307 surrounding the periphery of the cleaning wafer can be cleaned by the scattered cleaning material.

[0032] According to various embodiments, the processor 120 controls the valve 160 to adjust the lower end (eg, Figure 1a The cup cleaning device 10 is used to clean the lower end 30 of the cup cleaning device 10. For example, Figure 4a As shown, the processor 120 responds to the position of the plurality of cups having been adjusted so that the plurality of cups are positioned ... Figure 1a The valve 160 is controlled by the cleaning nozzles 401, 403, 405 configured in the housing 13) to spray the cleaning material.

[0033] The cleaning material is sprayed toward the device 407 for adjusting the position of the cup and the housing 409 surrounding the device 407 through the cleaning nozzles 401, 403, and 405, thereby cleaning the device 407 for adjusting the position of the cup and the housing 409 surrounding the device 407. Figure 4bAs shown in state 451, a portion of the cleaning nozzles 401, 403, and 405 spray cleaning substances in a manner to clean the lower end portion of the cup (for example, the lower end portion of the cup), as shown in state 453, another portion of the cleaning nozzles 401, 403, and 405 spray cleaning substances in a manner to clean the position adjustment device 407 and at least a portion of the housing 409, as shown in state 455, the remaining portion of the cleaning nozzles 401, 403, and 405 spray cleaning substances in a manner to clean the drain port and at least a portion of the housing 409. Among them, at least one of the cleaning nozzles 401, 403, and 405 that sprays cleaning substances toward the position adjustment device 407 sprays cleaning substances at a first pressure, and at least one of the cleaning nozzles that sprays cleaning substances toward the housing 409 sprays cleaning substances at a second pressure that is lower than the first pressure. Figure 4a In the figure, three cleaning nozzles 401, 403, and 405 are shown, but this is only an example, and the number of cleaning nozzles can be adjusted according to needs or experimental results.

[0034] According to various embodiments, the processor 120 controls the valve 160 to adjust the lower end (eg, Figure 1a The cup cleaning device 10 is used to clean the lower end 30 of the cup cleaning device 10. For example, Figure 5 As shown, the processor 120 may be provided by surrounding an axis for rotating the wafer (e.g.: Figure 1a The housing 501 of the shaft 12) (for example: Figure 1a The cleaning nozzle 503 configured in a part of the shell 13) sprays a cleaning substance to clean the shell 501.

[0035] According to various embodiments, the processor 120 may continuously adjust the position of the cup based on the first cup position information during the spraying of the cleaning substance. Figure 2 As shown in FIG. 1 , if a predetermined time has passed since the cleaning material was sprayed while the positions of the plurality of cups 201, 203, 205 were at the positions of the tables 210, 220, 230, the processor 120 controls the position adjustment device 150 to adjust the positions of the plurality of cups 201, 203, 205 to other tables 210, 220, 230. In another example, if a predetermined time has passed since the cleaning material was sprayed while the positions of the plurality of cups 201, 203, 205 were at the positions of the tables 210, 220, 230, the processor 120 controls the position adjustment device 150 to adjust the positions of the plurality of cups 201, 203, 205 to the starting position 200. According to one embodiment, the number of times the positions of the cups are adjusted and / or the time for adjusting the positions of the cups may be adjusted to other values ​​according to needs or settings of a manager.

[0036] According to various embodiments, if the cleaning process is finished, the processor 120 may perform a drying process. For example, the processor 120 controls the valve 160 to spray a drying substance for drying the cleaning substance. For example, if a predetermined time has passed since the time point when the cleaning process is executed, the processor 120 controls the valve 160 in a manner of spraying the drying substance toward the upper end of the cleaning wafer. According to an embodiment, the processor 120 may identify second cup position information for adjusting the position of the cup according to the cup cleaning process information, and control the position adjustment device 150 to adjust the positions of the plurality of cups based on the second cup position information during the spraying of the drying substance.

[0037] According to various embodiments, if the drying process is completed, the processor 120 may unload the cleaned wafer from the operating table device. For example, if a predetermined time has passed since the time point when the drying process was executed, the processor 120 may control the valve 160 in a manner that the drying material is not sprayed, and the cleaned wafer may be unloaded from the operating table device.

[0038] According to various embodiments, the position adjustment device 150 may adjust the positions of a plurality of cups for recovering chemicals used in a semiconductor manufacturing process based on the control of the processor 120. According to an embodiment, the position adjustment device 150 may be composed of a hydraulic cylinder, an air cylinder, or a motor.

[0039] According to various embodiments, the valve 160 may supply a cleaning substance for a cleaning process and a drying substance for a drying process to the relevant nozzles according to the control of the processor 120 .

[0040] In the above description, it is assumed that the number of cups used in the semiconductor manufacturing process is 3 (for example, the first cup, the second cup, and the third cup), but the present invention is not limited thereto. For example, the number of cups used in the semiconductor manufacturing process may be more than 3 or less than 3, and in each case, the position of the cups may be adjusted by the same or similar method as described above.

[0041] As described above, the cup cleaning apparatus 100 can effectively remove the chemical substances existing inside each cup by individually adjusting the positions of the plurality of cups for recovering the chemical substances sprayed for wafer processing during the cleaning process.

[0042] Figure 6 The present invention is a flow chart for describing a method for cleaning a plurality of cups in an electronic device according to various embodiments.

[0043] Reference Figure 6 In step 601, a cup cleaning device (e.g. Figure 1a The cup cleaning device 10 or Figure 1b A processor (e.g., Figure 1bThe processor 120 in the embodiment of the present invention can load the wafer (or cleaned wafer) onto the operating station device (for example: Figure 1a The operating table device 11).

[0044] In step 603, the processor 120 rotates the operating table device at a specified speed in response to the wafer being loaded on the operating table device. For example, the processor 120 may obtain speed information for rotating the operating table device according to the cup cleaning program information loaded from the memory 130, and rotate the operating table device based on the obtained speed information.

[0045] In step 605, the processor 120 may execute a cleaning procedure during the adjustment of the position of the cup. For example, the processor 120 may control the position adjustment device 150 based on the first cup position information identified according to the cup cleaning procedure information, and control the valve 160 to spray the upper end portion (e.g., Figure 1a The upper end portion 20 in the cup cleaning device 100) and the lower end portion of the cup cleaning device 100 (for example: Figure 1a According to one embodiment, the processor 120 can confirm the execution time of the cleaning program according to the cup cleaning program information, and if the execution time of the cleaning program has passed since the time point when the cleaning program is executed, the cleaning program can be ended. For example, if the execution time of the cleaning program has passed since the time point when the cleaning program is executed, the processor 120 controls the valve 160 so that the cleaning substance is not sprayed. In other examples, if the execution time of the cleaning program has passed since the time point when the cleaning program is executed, the processor 120 controls the valve 160 so that the cleaning substance is not sprayed, and controls the position adjustment device 150 so that the multiple cups are located at the starting position (for example: Figure 2 The starting position in is 200).

[0046] In step 607, the processor 120 may execute a drying program during the adjustment of the position of the cup. For example, in response to the end of the cleaning program, the processor 120 controls the valve 160 to spray a drying material for drying the cleaning material, identifies the second cup position information for adjusting the position of the cup according to the cup cleaning program information, and controls the position adjustment device 150 to adjust the positions of the plurality of cups based on the second cup position information. According to one embodiment, the processor 120 confirms the execution time of the drying program according to the cup cleaning program information, and may end the drying program if the execution time of the drying program has passed since the time point when the drying program is executed. For example, if the execution time of the drying program has passed since the time point when the drying program is executed, the processor 120 controls the valve 160 so that the drying material is not sprayed. In other examples, if the execution time of the drying program has passed since the time point when the drying program is executed, the processor 120 controls the valve 160 so that the drying material is not sprayed, and controls the position adjustment device 150 so that the plurality of cups are located at the starting position (for example: Figure 2 The starting position in is 200).

[0047] In step 609, the processor 120 may unload the wafer. For example, in response to the drying process being completed, the processor 120 stops the rotation of the stage device and ends the cleaning process by unloading the wafer from the stage device.

[0048] In the above, a case is described in which the cup cleaning device 100 rotates the operating table device at a specified speed after loading the cleaning wafer on the operating table device. However, according to multiple embodiments of the present invention, the cup cleaning device 100 can also omit the step of loading the cleaning wafer on the operating table device and rotate the operating table device at a specified speed.

[0049] As described above, the cup cleaning apparatus 100 can effectively remove the chemical substances existing inside each cup by individually adjusting the positions of the plurality of cups for recovering the chemical substances sprayed for wafer processing during the cleaning process.

[0050] The various embodiments of this specification may be implemented by including a computer program stored in a machine (e.g., Figure 1b The cup cleaning device 100 in the embodiment of the present invention may be a readable storage medium (e.g.: Figure 1b For example, the device (e.g., Figure 1b A processor (e.g., Figure 1bThe processor 120 in the device may retrieve at least one instruction from the storage medium among the one or more stored instructions and execute the instruction. This may enable the device to perform at least one function according to the at least one retrieved instruction. The one or more instructions may include code generated by an encoder or code that can be run by an interpreter. The device-readable storage medium may be formed in the form of a non-transitory storage medium. Among them, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves). The term does not distinguish between semi-permanent storage in a storage medium and temporary storage.

[0051] According to multiple embodiments, each structural element (e.g., module or program) of the structural elements described above may include a single or multiple individuals. According to multiple embodiments, one or more structural elements or actions in the multiple structural elements described above may be omitted, or one or more other structural elements or actions may be added. Alternatively or additionally, multiple structural elements (e.g., module or program) may be integrated into one structural element. In this case, the integrated structural element can perform one or more functions of each structural element in the multiple structural elements in the same or similar manner as the functions performed by the corresponding structural elements in the multiple structural elements before the integration. According to multiple embodiments, multiple actions performed by modules, programs or other structural elements may be performed sequentially, in parallel, repeatedly or heuristically, and one or more of the multiple actions may be performed in other orders or omitted, or one or more other actions may be added.

Claims

1. A cup cleaning device, characterized in that: include: Position adjustment device; valve; Memory; as well as A processor connected to the position adjustment device, the valve and the memory, The processor rotates the stage device on which the wafer is loaded. During the period when the positions of the plurality of cups for recovering chemical substances are adjusted by the position adjusting device, the processor controls the valve to spray the cleaning substance for cleaning the plurality of cups. If a preset time has passed since the time point of spraying the cleaning material, the processor controls the valve not to spray the cleaning material, The cup cleaning device also includes a first cleaning nozzle that sprays a cleaning substance toward at least a portion of a housing surrounding a shaft that rotates the table device.

2. The cup cleaning device according to claim 1, characterized in that: As at least part of the action of controlling the valve to spray the cleaning substance, the processor identifies first cup position information based on cup cleaning program information loaded from the memory, controls the position adjustment device to adjust the positions of the multiple cups based on the first cup position information, and controls the valve to spray the cleaning substance.

3. The cup cleaning device according to claim 1, characterized in that: The cup cleaning device also includes: A front nozzle sprays a cleaning substance toward an upper end of the wafer; a rear nozzle for spraying a cleaning substance toward a lower end of the wafer; and A plurality of second cleaning nozzles spray cleaning material toward the lower end of the cup.

4. The cup cleaning device according to claim 3, characterized in that: The plurality of second cleaning nozzles include: at least one cleaning nozzle for cleaning a portion of the position adjustment device; at least one cleaning nozzle for cleaning lower ends of the plurality of cups; and At least one cleaning nozzle for cleaning at least a portion of the drain opening.

5. The cup cleaning device according to claim 4, characterized in that: at least one cleaning nozzle for cleaning a portion of the position adjustment device sprays a cleaning substance at a first pressure, At least one cleaning nozzle for cleaning lower ends of the plurality of cups sprays a cleaning substance at a second pressure lower than the first pressure.

6. The cup cleaning device according to claim 1, characterized in that: The processor identifies the execution time of the cleaning program according to the cup cleaning program information, If the execution time has passed since the time point of spraying the cleaning material, the processor controls the valve not to spray the cleaning material.

7. The cup cleaning device according to claim 6, characterized in that: The processor executes a drying procedure for drying the cleaning material after controlling the valve not to spray the cleaning material.

8. The cup cleaning device according to claim 1, characterized in that: The position adjustment device includes one of a hydraulic cylinder, a pneumatic cylinder, and a motor.

9. A method for operating a cup cleaning device, the cup cleaning device comprising: A position adjustment device, a valve, a memory, and a processor connected to the position adjustment device, the valve, and the memory, The working method of the cup cleaning device is characterized by comprising the following steps: The processor loads the wafer onto the operating table device; The processor causes the operating table device to rotate; The processor executes the following cleaning program, that is, during the period when the positions of the plurality of cups for recovering chemical substances are adjusted by the position adjusting device, the valve is controlled to spray the cleaning substance for cleaning the plurality of cups; as well as the processor executing a drying process during a period in which the positions of the plurality of cups are adjusted, The cup cleaning device also includes a first cleaning nozzle that sprays a cleaning substance toward at least a portion of a housing surrounding a shaft that rotates the table device.

10. The operating method of the cup cleaning device according to claim 9, characterized in that: The steps of performing the cleaning procedure include the following steps: identifying first cup position information based on the cup cleaning program information loaded from the memory; controlling the position adjustment device to adjust the positions of the plurality of cups based on the first cup position information; as well as The valve is controlled to spray the cleaning substance.

11. The operating method of the cup cleaning device according to claim 9, characterized in that: The cup cleaning device also includes: A front nozzle sprays a cleaning substance toward an upper end of the wafer; a rear nozzle for spraying a cleaning substance toward a lower end of the wafer; and A plurality of second cleaning nozzles spray cleaning material toward the lower end of the cup.

12. The operating method of the cup cleaning device according to claim 11, characterized in that: The plurality of second cleaning nozzles include: at least one cleaning nozzle for cleaning a portion of the position adjustment device; at least one cleaning nozzle for cleaning lower ends of the plurality of cups; and At least one cleaning nozzle for cleaning at least a portion of the drain opening.

13. The operating method of the cup cleaning device according to claim 12, characterized in that: at least one cleaning nozzle for cleaning a portion of the position adjustment device sprays a cleaning substance at a first pressure, At least one cleaning nozzle for cleaning lower ends of the plurality of cups sprays a cleaning substance at a second pressure lower than the first pressure.

14. The operating method of the cup cleaning device according to claim 9, characterized in that: The steps of performing the cleaning procedure include the following steps: The execution time of the cleaning program is identified according to the cup cleaning program information, and if the execution time has passed since the time point of spraying the cleaning material, the valve is controlled not to spray the cleaning material.

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