Method for managing a processing device

Abstract

The present invention provides a management method of a processing apparatus, which automatically implements processing of a wafer from association of a pattern with new processing conditions. The processing apparatus has a chuck table which holds a wafer, a processing unit which grinds the wafer, a conveyance unit which conveys the wafer from a cassette and to the chuck table, a camera unit which photographs the wafer to acquire an image which reflects a pattern formed on the front side of the wafer, and an information registration section. The method is a management method when a pattern is registered in the information registration section in association with processing conditions, and has the following steps: a processing condition registration step of registering the processing conditions in the information registration section; an automatic processing program start step of starting an automatic processing program which automatically processes the wafer; a photographing step of forming an image which reflects the pattern of the wafer using the camera unit; and a pattern registration step of registering the pattern reflected in the image in the information registration section in association with the processing conditions.

Description

Management methods for processing equipment Technical Field

[0001] The present invention relates to a management method for a processing apparatus. In a processing apparatus that performs a series of steps according to an automatic processing program, such as sequentially removing each wafer from a box containing multiple wafers and processing them until they are returned to the box, an image showing the pattern on the front side of the wafer is associated with the processing conditions and registered. Background Technology

[0002] In the manufacturing process of device chips used in electronic devices such as mobile phones or computers, firstly, multiple devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed on the front side of a wafer made of semiconductors. Next, the wafer is thinned to a specified thickness by grinding from the back side, and this back side is polished to divide the wafer into individual devices to form individual device chips.

[0003] The grinding, polishing, and dicing of wafers are performed by various processing apparatuses, which include a chuck stage for holding the wafers and a processing unit for processing the wafers held by the chuck stage. Wafers are stored in cassettes before being loaded into the processing apparatus. Then, cassettes containing multiple wafers are loaded into the processing apparatus. An automatic processing program is registered in the control unit of the processing apparatus, which executes a series of steps to sequentially remove and process the wafers stored in the cassettes until they are returned to the cassettes.

[0004] Here, the appropriate processing conditions vary depending on the type of wafer or the resulting device chip. Therefore, multiple processing conditions are pre-registered in the control unit. When the automatic processing program begins, the appropriate processing conditions are read and processing is performed according to those conditions. For example, if the processing conditions are inappropriate, or if a wafer of a type other than the pre-set category is brought into the processing equipment, processing cannot be performed properly. In such cases, not only will the desired processing result not be obtained, but damage to the wafer or the processing equipment may also occur, becoming a problem.

[0005] Therefore, it is possible to incorporate a function into the processing apparatus to determine whether the wafer being processed is the object to be processed under the set processing conditions. For example, it is possible to use a camera unit to photograph the wafer being processed, and to detect the shape (key pattern) of the components constituting the device formed on the front side of the wafer, as well as codes such as QR codes or barcodes attached to the wafer. This allows for the determination of the wafer's category and whether it is the object to be processed based on the set processing conditions (see Patent Document 1).

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-54056

[0007] When processing a new type of wafer that has not yet been processed in the processing apparatus, new processing conditions need to be registered in the control unit of the processing apparatus. At this time, in order to obtain a pattern for judgment and register it in association with the processing conditions, it is necessary to photograph the new type of wafer using a camera unit. Therefore, in the processing apparatus, after the cassette containing the wafer is moved in, in order to photograph the wafer using the camera unit, the wafer must be temporarily removed from the cassette before the automatic processing program begins.

[0008] Furthermore, the automated processing procedure must be restarted after the wafer is returned to the cassette following the photograph. This involves repeatedly moving the wafer in and out, resulting in a longer processing time before processing begins. Additionally, the operator of the processing equipment must instruct the control unit to start the automated processing procedure after registering the processing conditions with the control unit. In other words, processing new types of wafers requires more effort and time. Summary of the Invention

[0009] The present invention was made in view of the above-mentioned problems, and its object is to provide a method for managing a processing apparatus that can automatically implement the process from registration of a pattern associated with processing conditions to the processing of the wafer when processing of a new type of wafer begins.

[0010] According to one aspect of the present invention, a management method for a processing apparatus is provided. The processing apparatus includes: a chuck stage having a holding surface on its upper surface for holding a wafer whose front side faces the holding surface; a processing unit for grinding or polishing the wafer held by the chuck stage from the back side; a transfer unit for removing the wafer from a cassette placed in a cassette holding area for storing wafers and transferring the wafer to the chuck stage; a camera unit for taking a picture of the wafer to obtain an image, the image showing a pattern formed on the front side of the wafer; an information registration unit for registering the pattern shown in the image in association with processing conditions when the wafer is processed by the processing unit; and a determination unit for determining that the wafer before processing is a wafer to be processed by detecting the pattern registered in the information registration unit in association with the processing conditions of the wafer removed from the cassette. The management method of the processing apparatus is a management method for registering the pattern in association with the processing conditions in the information registration unit within the processing apparatus, characterized in that the processing apparatus... The management method includes the following steps: a processing condition registration step, in which the processing conditions for processing a new type of wafer are registered in an information registration unit; an automatic processing program start step, in which the processing apparatus starts an automatic processing program, which causes the processing apparatus to perform the following automatic processing: after placing a cassette containing the new type of wafer in the cassette placement area, the new type of wafer is transferred from the cassette to the chuck table using a transfer unit, processed using the processing unit according to the processing conditions registered in the processing condition registration step, and removed from the chuck table using the transfer unit; an image capture step, in which an image of the pattern of the new type of wafer is formed using a camera unit while the transfer unit transfers the new type of wafer from the cassette to the chuck table according to the automatic processing program and the chuck table holds the new type of wafer; and a pattern registration step, in which the pattern reflected in the image formed by the image capture step is associated with the new processing conditions registered in the processing condition registration step and registered in the information registration unit.

[0011] Preferably, the new type of wafer has a protective component attached to its front side, the camera unit has an infrared camera, and during the shooting step, the new type of wafer is held by the chuck stage through the protective component, and the camera unit takes a picture of the front side of the wafer from its back side.

[0012] Furthermore, preferably, the determination unit also has the following functions: determining whether there is a protective component pasted on the front side of the wafer before processing and whether it is appropriate based on the information related to the protective component registered in the information registration unit in association with the processing conditions; if it is determined that the protective component is inappropriate, or if it is determined that the protective component is not pasted on the wafer before processing, causing the processing unit not to process the wafer before processing; and in the pattern registration step, extracting the information related to the protective component from the image formed by the shooting step and registering it in the information registration unit in association with the processing conditions.

[0013] In one aspect of the management method of the processing apparatus of the present invention, after the processing conditions for processing a new type of wafer are registered in the information registration unit, an automatic processing program is started. Furthermore, during the process of transferring the new type of wafer from the cassette to the chuck table using a transfer unit and holding it using the chuck table, a camera unit photographs the front side of the wafer. Moreover, the camera unit forms an image showing a pattern provided on the front side of the wafer, and the pattern shown in the image is associated with the processing conditions and registered in the information registration unit.

[0014] Then, in the processing apparatus, each structural element is controlled according to the automatic processing program, and the wafer is processed under these processing conditions. Therefore, after the pattern is associated with the processing conditions and registered, it is not necessary to return the wafer to the cassette. That is, after the operator of the processing apparatus registers the processing conditions in the information registration unit, the pattern can be associated with the processing conditions and registered simply by starting the automatic processing program, and the wafer processing can be performed directly. Therefore, the processing of new types of wafers can be started quickly.

[0015] Therefore, according to one aspect of the present invention, a method for managing a processing apparatus is provided that, when processing a new type of wafer begins, automatically implements the process from registration of a pattern associated with processing conditions to wafer processing. Attached Figure Description

[0016] Figure 1 is a perspective view schematically showing the structure of the processing device.

[0017] Figure 2 is a schematic perspective view of the wafer.

[0018] Figure 3(A) is a cross-sectional view schematically showing one example of the shooting steps, and Figure 3(B) is a cross-sectional view schematically showing another example of the shooting steps.

[0019] Figure 4 is a schematic plan view showing the patterns registered in the information registration department in relation to processing conditions.

[0020] Figure 5(A) is a flowchart illustrating the steps of the management method of the processing apparatus according to the embodiment, and Figure 5(B) is a flowchart illustrating the steps of the wafer processing method.

[0021] Label Explanation

[0022] 1: Wafer; 1a: Front side; 1b: Back side; 3: Protective component; 5: Device; 2: Processing device; 4: Base; 6: Rotary worktable; 8: Chuck worktable; 8a: Holding surface; 10a, 10b: Processing unit (grinding unit); 12a, 12b: Spindle motor; 14a, 14b: Spindle; 16a, 16b: Wheel mounting base; 18a, 18b: Grinding wheel; 20a, 20b: Grinding tool; 22a, 22b: Column; 24a, 24b: Processing feed unit; 26a, 2 6b: Box loading stage (box loading area); 28a, 28b: Box; 30: Wafer transfer robot; 32: Positioning worktable; 34: Wafer loading mechanism (loading arm); 36: Wafer unloading mechanism (unloading arm); 38: Rotary cleaning device; 40, 46: Camera unit; 42: Control unit; 42a: Judgment unit; 42b: Information registration unit; 44: Display with touch panel; 48: Processing condition table; 50: Category; 52: Processing conditions; 54a, 54b, 54c, 54d: Pattern. Detailed Implementation

[0023] Embodiments of the present invention will be described with reference to the accompanying drawings. The processing apparatus managed by the processing apparatus management method of this embodiment is, for example, a processing apparatus for processing wafers made of semiconductor materials such as silicon and SiC (silicon carbide). FIG2 is a perspective view schematically showing the back side 1b of the wafer 1. In FIG2, structures that cannot be directly observed from the outside are shown in dashed lines.

[0024] Multiple intersecting pre-defined dividing lines (spacers) are formed on the front side 1a of wafer 1. Multiple ICs, LSIs, and other devices 5 are formed in the regions divided by these pre-defined dividing lines. Wiring layers, electrodes, etc. (not shown) are formed on the front side 1a of wafer 1 to facilitate the input and output of electrical signals to the devices 5.

[0025] When wafer 1 is diced along the predetermined dicing line, individual device chips can be formed. Furthermore, if wafer 1 is pre-thinned by grinding from the back side 1b and then polished on the back side 1b before dicing, thin device chips can be formed after dicing wafer 1. During grinding and polishing of wafer 1, a strip-shaped protective member 3 is provided on the front side 1a of wafer 1 to protect devices such as devices 5 formed on the front side 1a.

[0026] The protective component 3 includes, for example, a substrate (not shown) formed of epoxy resin, acrylic resin, synthetic rubber, polyimide, etc., and an adhesive layer (not shown) on the substrate. This adhesive layer may, for example, contain a UV-curable resin, which exerts strong adhesion to the wafer 1. However, when exposed to ultraviolet light, the adhesive layer cures, and the adhesive strength decreases. Then, when the protective component 3 is peeled off from the wafer 1, ultraviolet light is irradiated onto the protective component 3, further reducing the adhesive strength of the adhesive layer.

[0027] The processing apparatus managed by the processing apparatus management method of this embodiment is, for example, a grinding apparatus that grinds the wafer 1 from the back side 1b or a polishing apparatus that performs grinding. Hereinafter, the case where the processing apparatus is a grinding apparatus will be described as an example, but the processing apparatus is not limited to a grinding apparatus. FIG1 is a perspective view schematically showing the processing apparatus 2.

[0028] Next, the processing apparatus (grinding apparatus) 2 will be described in detail. A disc-shaped rotary table 6 is rotatably mounted on the base 4 in a horizontal plane. Three chuck tables 8 are arranged 120 degrees apart circumferentially on the upper surface of the rotary table 6. By rotating the rotary table 6, each chuck table 8 is positioned in the wafer loading / unloading area, the rough grinding area, and the fine grinding area, respectively.

[0029] In the wafer loading / unloading area, the wafer 1 is placed on the chuck table 8 before processing, and the wafer 1 is unloaded from the chuck table 8 after processing. In the rough grinding area, a processing unit (grinding unit) 10a is used to perform rough grinding on the wafer 1 at a relatively fast processing feed rate. In the fine grinding area, a processing unit (grinding unit) 10b is used to perform fine grinding, which results in a higher flatness of the ground surface than the rough grinding.

[0030] The chuck stage 8 has an internal suction path (not shown) connected at one end to a suction source (not shown), and the other end of the suction path is connected to a holding surface 8a on the upper surface of the chuck stage 8. The holding surface 8a is made of a porous material. When a negative pressure generated by the suction source is applied to the wafer 1 placed on the holding surface 8a through the porous material, the chuck stage 8 can attract and hold the wafer 1.

[0031] Columns 22a and 22b are erected at the rear of the base 4, and machining units 10a and 10b are respectively mounted on the columns 22a and 22b. The machining units 10a and 10b have spindles 14a and 14b respectively. The upper ends of the spindles 14a and 14b are connected to spindle motors 12a and 12b. The spindles 14a and 14b extend along the vertical direction driven by the spindle motors 12a and 12b.

[0032] Wheel mounting seats 16a and 16b are provided at the lower ends of each spindle 14a and 14b, and grinding wheels 18a and 18b are mounted on the lower surfaces of each wheel mounting seat 16a and 16b. The grinding wheels 18a and 18b have grinding tools 20a and 20b arranged in a ring on their lower surfaces, which grind the wafer 1 held by the chuck table 8. The processing units 10a and 10b are configured to move up and down via processing feed units 24a and 24b, respectively.

[0033] The front portion of the base 4 is one level higher than the portion where the rotating worktable 6 is located, and cassette mounting stages (cassette mounting areas) 26a and 26b are fixed to the front end of the base 4. For example, a cassette 28a for holding the wafer 1 before processing is placed on the cassette mounting stage 26a, and a cassette 28b for holding the wafer 1 after processing is placed on the cassette mounting stage 26b. However, the cassettes 28a and 28b are not limited to this.

[0034] The wafer transport robot 30 is mounted adjacent to the cassette loading stages 26a and 26b on the base 4. The front part of the base 4 is also equipped with a positioning worktable 32 with multiple positioning pins, a wafer loading mechanism (loading arm) 34, a wafer unloading mechanism (unloading arm) 36, and a rotary cleaning device 38 for cleaning and rotary drying the ground wafers 1.

[0035] Before processing, the wafer 1 is removed from the cassettes 28a and 28b placed on the cassette stages 26a and 26b by the wafer transfer robot 30. The wafer transfer robot 30 has multiple arms that are rotatably connected to each other at their ends, and a holding part for holding the wafer 1 at its front end. The cassette stage 26a is capable of lifting and lowering in a manner that makes the height of the target wafer 1 match the height of the holding part of the wafer transfer robot 30. In addition, the wafer transfer robot 30 is also capable of lifting and lowering.

[0036] Then, the wafer transfer robot 30 transfers the wafer 1 to the positioning table 32. In the positioning table 32, multiple positioning pins move radially inward toward the center of the positioning table 32 to clamp the wafer 1 from the outer periphery, thereby aligning the wafer 1 to the specified position.

[0037] The wafer loading mechanism (loading arm) 34 includes, for example, a shaft that can rotate about an axis fixed to the base 4; an arm that extends horizontally from the upper end of the shaft; and a holding part disposed at the front end of the arm to attract and hold the wafer 1 from above. The wafer loading mechanism 34 uses the holding part to hold the wafer 1, whose position has been adjusted by the positioning stage 32, from above and transports the wafer 1 to the chuck stage 8 disposed in the wafer loading / unloading area.

[0038] In this way, the wafer transfer robot 30 and the wafer loading mechanism (loading arm) 34 function as a transfer unit to remove the wafer 1 from the cassette 28a and transfer the wafer 1 to the chuck table 8.

[0039] Above the base station 4, a camera unit 40 is disposed along the path of the wafer 1 from the cassettes 28a, 28b placed in the cassette stages (cassette placement areas) 26a, 26b to its holding position on the chuck stage 8. The camera unit 40 is disposed, for example, above the chuck stage 8, which is located in the wafer loading / unloading area. Figure 3(A) is a schematic cross-sectional view of the wafer 1 taken by the camera unit 40.

[0040] The camera unit 40 captures an image of the wafer 1 from the back side 1b, obtaining an image of the front side 1a of the wafer 1 by capturing light such as infrared rays that have passed through the wafer 1. For example, the camera unit 40 may have an infrared camera and may also have an infrared light source. Then, the camera unit 40 captures an image of the front side 1a of the wafer 1 from the exposed back side 1b of the wafer 1, obtaining an image of the device 5 or other structures formed on the front side 1a of the wafer 1.

[0041] Alternatively, a camera unit 46 may be provided on the base 4 below the path along which the wafer 1 is moved from the cassettes 28a and 28b placed in the cassette stages (cassette placement areas) 26a and 28b to its holding position on the chuck stage 8. The camera unit 46 may be provided, for example, on the base 4 between the positioning stage 32 and the chuck stage 8 located in the wafer loading / unloading area. Figure 3(B) is a schematic cross-sectional view of the wafer 1 taken by the camera unit 46.

[0042] The camera unit 46 has a camera including a CCD sensor or a CMOS sensor, and may also have an illumination source. The camera unit 46 takes pictures of the wafer 1 being transported by the wafer loading mechanism 34 from the downward-facing front side 1a. When a protective member 3 is attached to the front side 1a of the wafer 1, the camera unit 46 can take pictures of the protective member 3, and can also take pictures of the front side 1a of the wafer 1 through the protective member 3.

[0043] Next, the control unit 42 of the processing apparatus 2 will be described. The control unit 42 is connected to each structural element of the processing apparatus 2 and has the function of controlling each structural element. The control unit 42 is, for example, a computer, which includes a processing unit such as a CPU (Central Processing Unit), a main storage device such as DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as flash memory. The processing unit and the like are operated according to software stored in the auxiliary storage device, thereby realizing the function of the control unit 42.

[0044] The processing conditions for processing the wafer 1 are pre-input and registered in the control unit 42. Furthermore, the control unit 42 controls each structural element according to these processing conditions. The processing conditions are appropriately set according to the type of wafer 1 and the desired processing result. Optimal processing conditions vary, for example, depending on the type of wafer 1, such as its diameter, thickness, and material. The processing conditions include various settings such as the finished thickness of the processed wafer 1, the rotational speed of the grinding wheel and grinding pad, the rotational speed of the chuck table 8, and the processing feed rate.

[0045] Furthermore, the control unit 42 has the function of determining whether the wafer 1 removed from the cassettes 28a and 28b placed on the cassette placement stage (cassette placement area) 26a and 28b is the wafer 1 to be processed. That is, it has the function of determining whether the wafer 1 is a wafer 1 suitable for processing based on the set / selected processing conditions.

[0046] The control unit 42 includes: a determination unit 42a, which determines whether the wafer 1 to be determined is the wafer 1 to be processed; and an information registration unit 42b, which registers information related to the pattern (key pattern) of the structure such as the device 5 that should be present on the front side 1a of the wafer 1. The information registration unit 42b has the function of sending the information to the determination unit 42a when the determination is performed by the determination unit 42a.

[0047] The shapes of the components, wiring, electrodes, and other structures of the device 5 formed on the front side 1a of the wafer 1 vary depending on the type of wafer 1. Therefore, the type of wafer 1 can be determined based on the shape (pattern) of the structures formed on the front side 1a of the wafer 1.

[0048] Therefore, the information registered in the information registration unit 42b is, for example, a feature pattern (key pattern) of each structure in an image obtained by having the camera units 40 and 46 photograph the front side 1a of the chip 1. The patterns 54a, 54b, 54c, and 54d registered in the information registration unit 42b are schematically shown in Figure 4.

[0049] The information registration unit 42b pre-registers patterns on the front 1a side of various types of wafers 1, associated with processing conditions and wafer 1 category information. Furthermore, when the operator of the processing apparatus 2 selects the type of wafer 1 to be processed or the processing conditions in the control unit 42, the control unit 42 controls each structural element of the processing apparatus 2 according to the processing conditions, and the determination unit 42a determines whether the pattern registered in association with the processing conditions is formed on the front 1a side of the wafer 1.

[0050] The processing apparatus 2 also includes a display unit such as a liquid crystal display (LCD) for displaying various information and warning screens; and an input interface such as a keyboard, mouse, or buttons for inputting various instructions to the control unit 42. Alternatively, the processing apparatus 2 may also include a display unit and a display 44 with a touch panel that functions as an input interface. In this case, images of operation buttons are displayed on the touch panel display 44, and the operator inputs instructions by touching the touch panel at the display location of the image.

[0051] When determining the wafer 1 to be processed, the determination unit 42a receives information related to the wafer 1 from the information registration unit 42b. Additionally, the camera units 40 and 46 capture images of the wafer 1 to be processed, obtaining an image showing the front side 1a of the wafer 1. The determination unit 42a determines whether the acquired image contains a pattern of a structure that the wafer 1 to be processed should have on the front side 1a.

[0052] When the determination unit 42a receives an image of the wafer 1 to be processed as information received from the information registration unit 42b, it compares the image received from the information registration unit 42b with the image obtained by the camera unit 40 using methods such as pattern matching.

[0053] When the two match, that is, when a pattern of the structure that the wafer 1 to be processed should have is found in the wafer 1 to be determined, the determination unit 42a determines that the wafer 1 to be determined is the wafer 1 to be processed. On the other hand, when the two do not match, that is, when a pattern of the structure that the wafer 1 to be processed should have is not found in the wafer 1 to be determined, the wafer 1 to be determined is not the wafer 1 to be processed.

[0054] For example, if the determination unit 42a determines that the wafer 1 to be determined is the wafer 1 to be processed, the processing unit (grinding unit) 10a, 10b can be directly used for processing (grinding). Alternatively, if the determination unit 42a determines that the wafer 1 to be determined is not the wafer 1 to be processed, the processing apparatus 2 does not process the wafer 1, for example, it moves the wafer 1 to the cassettes 28a, 28b placed on the cassette stages 26a, 26b.

[0055] The processing apparatus 2 includes: camera units 40 and 46, which are capable of taking pictures of the front side 1a of the wafer 1, which is the object of determination; and a control unit 42, which includes a determination unit 42a and an information registration unit 42b. Therefore, it is possible to appropriately process the wafer 1 that has been brought in under specified processing conditions based on the determination that it is the wafer 1 to be processed.

[0056] An automatic processing program is incorporated into the control unit 42. This program controls various structural elements to automatically process multiple wafers 1 housed in cassettes 28a and 28b sequentially. The control unit 42 automatically processes the wafers 1 by controlling the various structural elements according to the automatic processing program. For example, an operator using the processing apparatus 2 places cassettes 28a and 28b, which house multiple wafers 1 of the same type, on cassette mounting stages (cassette mounting areas) 26a and 28b, and issues a command to the control unit 42 to start the automatic processing program.

[0057] When the automatic processing program begins, the control unit 42 causes the transfer unit (wafer transfer robot 30) to remove the wafer 1 from the cassettes 28a and 28b and transfer it to the positioning table 32. Then, by using the pins of the positioning table 32 to clamp the wafer 1, the wafer 1 is aligned to a predetermined position. Next, the transfer unit (wafer loading mechanism 34) is controlled to move the wafer 1 from the positioning table 32 to the chuck table 8 positioned in the wafer loading / unloading area.

[0058] Then, wafer 1 is processed according to the prescribed processing conditions for processing wafer 1. First, wafer 1 is held by the chuck table 8, and the rotary table 6 is rotated to move the chuck table 8 to the rough grinding area. Next, the chuck table 8 and the grinding wheel 18a are rotated at a prescribed speed, and the grinding wheel 18a is lowered at a prescribed feed rate to bring the grinding tool 20a into contact with wafer 1, processing wafer 1 (rough grinding) to a prescribed thickness. Similarly, wafer 1 is processed in the fine grinding area (fine grinding).

[0059] Then, the rotary table 6 is rotated to position the chuck table in the wafer loading / unloading area, and the chuck table 8 releases the wafer 1 from its holding position. Next, the transfer unit (wafer unloading mechanism 36) transfers the wafer 1 from the chuck table 8 to the rotary cleaning device 38, where the rotary cleaning device 38 cleans the wafer 1. Finally, the wafer transfer robot 30 transfers the wafer 1 from the rotary cleaning device 38 to the cassettes 28a and 28b.

[0060] The automated processing program continues until all unprocessed wafers 1 stored in cassettes 28a and 28b have been processed, and ends when all wafers 1 are returned to cassettes 28a and 28b. Furthermore, the next wafer 1 will not wait until one wafer 1 is removed from and returned to cassettes 28a and 28b. That is, when a step is completed for a preceding wafer 1, that step is immediately performed on the subsequent wafer 1, while the next step is performed on the preceding wafer 1.

[0061] Furthermore, in the automatic processing procedure, the control unit controls the camera units 40 and 46 to capture images of the front side 1a of the wafer 1 from the time the wafer 1 is removed from the cassettes 28a and 28b until it is processed, thus forming an image. The image displays a pattern provided on the front side 1a of the wafer 1. Then, the determination unit 42a determines whether a specific pattern (key pattern) related to the processing conditions during wafer 1 processing is registered in the information registration unit 42b in the image.

[0062] If a specific pattern (key pattern) is identified in the image as a result of the determination, the wafer 1 is determined to be the wafer to be processed, and processing is performed. On the other hand, if the specific pattern is not identified in the image, the wafer 1 is determined not to be the wafer to be processed, and the wafer 1 is not processed and is returned to the boxes 28a and 28b. This prevents damage to the wafer 1 and the processing apparatus 2, etc.

[0063] Here, when processing a new type of wafer 1 that has not been processed using the processing apparatus 2 is started, the processing conditions must be registered in the information registration unit 42b. Moreover, in order to carry out the determination of the determination unit 42a, the pattern (key pattern) of the structure disposed on the front side 1a of the wafer 1 that is the object of processing under the processing conditions must be associated with the processing conditions and registered in the information registration unit 42b.

[0064] However, in the past, when camera units 40 and 46 were used to photograph the front 1a of the wafer 1 in order to register the pattern in the information registration unit 42b, the photographing had to be performed differently from the process performed by the automatic processing program. That is, after the operator placed the boxes 28a and 28b containing the new type of wafer 1 on the box placement stage 26a and 26b, he input a command to the control unit 42 through the input interface to remove the wafer 1 from the boxes 28a and 28b.

[0065] Then, the wafer 1 is positioned opposite the camera units 40 and 46, and the camera units 40 and 46 capture an image of the front side 1a of the wafer 1, which is then displayed on the display unit. The operator selects a pattern from the image displayed on the display unit that can be used for determination by the determination unit 42a, and associates the pattern with new processing conditions and registers it in the information registration unit 42b.

[0066] Here, since automatic processing cannot begin directly, the completed chip 1 must be stored in boxes 28a and 28b. Then, when the automatic processing program begins, chip 1 is removed from boxes 28a and 28b again for processing. Thus, when processing a new type of chip 1 begins, the time spent is spent temporarily removing chip 1 from boxes 28a and 28b, registering the pattern, and then storing chip 1 back in boxes 28a and 28b.

[0067] Therefore, in the management method of the processing apparatus of this embodiment, in order to save such effort, the pattern is registered in the information registration unit 42b during the automatic processing performed according to the automatic processing program. Figure 5(A) is a flowchart explaining the process of each step of the processing method of the processing apparatus of this embodiment. Hereinafter, each step of the management method will be described.

[0068] First, the processing conditions for processing the new type of wafer 1 are registered in the information registration unit 42b in step S10. The operator of the processing apparatus 2 registers the processing conditions suitable for processing the new type of wafer 1 in the information registration unit 42b using the input interface.

[0069] Next, the automatic processing program start step S20 is implemented. In the automatic processing program start step S20, with the cassettes 28a and 28b containing the new type of wafer 1 placed on the cassette mounting stage (cassette mounting area) 26a and 26b, the operator inputs a command to start the automatic processing program to the control unit 42. Then, the processing apparatus 2 starts the automatic processing program.

[0070] In the automated processing procedure, the transfer unit moves the new type of wafer 1 from the cassettes 28a and 28b to the chuck table 8. Then, the new type of wafer 1 is processed using the processing units 10a and 10b according to the processing conditions registered in the processing condition registration step (S10). The processed wafer 1 is then removed from the chuck table 8 by the transfer unit and returned to the cassettes 28a and 28b. Alternatively, the processed wafer 1 can be stored in cassettes 28a and 28b that were previously used to store it.

[0071] After the automatic processing program starts in step S20, the following imaging step S30 is performed: an image showing the pattern of the new type of wafer 1 is formed using camera units 40 and 46. The imaging step S30 is performed while the transfer unit transfers the new type of wafer 1 from boxes 28a and 28b to the chuck table 8 according to the automatic processing program, and the chuck table 8 holds the new type of wafer 1.

[0072] The imaging of wafer 1 can be performed, for example, by camera unit 40 when wafer 1 is transported to chuck stage 8 located in wafer loading / unloading area. Figure 3(A) is a schematic cross-sectional view of wafer 1 taken in imaging step S30.

[0073] On the chuck stage 8, the back side 1b, which is the surface of the wafer 1 being processed, is exposed upwards and faces the camera unit 40. Therefore, it is not possible to directly photograph the front side 1a of the wafer 1, which has a pattern. Therefore, the camera unit 40 detects light of the wavelength that passes through the wafer 1 to form an image. For example, the camera unit 40 includes an infrared camera, which forms an image by capturing infrared light that passes through the wafer 1.

[0074] Alternatively, the imaging of wafer 1 can also be performed by camera unit 46 during the process of wafer 1 being moved from positioning stage 32 to chuck stage 8 positioned in wafer loading / unloading area by wafer loading mechanism 34. Figure 3(B) is a schematic cross-sectional view of wafer 1 taken in imaging step S30. Camera unit 46 faces the front side 1a of wafer 1 and takes an image of the front side 1a through protective member 3 attached to wafer 1.

[0075] Next, the pattern registration step S40 is performed as follows: the pattern reflected in the image formed by the imaging step S30 is associated with the new processing condition registered by the processing condition registration step S10 and registered in the information registration unit 42b. Figure 4 is a processing condition table 48 schematically showing the concept of the information registered in the information registration unit 42b. As shown in Figure 4, multiple processing conditions 52 corresponding to the categories 50 of multiple wafers 1 are registered in the information registration unit 42b.

[0076] Furthermore, patterns associated with each processing condition are registered in the information registration section 42b. In the example shown in Figure 4, processing condition 52 for processing wafer 1 of category 50 "1" is "A", and processing condition 52 "A" is associated with pattern 54a. Similarly, processing condition 52 "B" is associated with pattern 54b, and processing condition 52 "C" is associated with pattern 54c.

[0077] Figure 4 illustrates the following situation: when the processing condition 52 of wafer 1, which is a new category 50 "4", is registered as "D" in the processing condition registration step (S10), the pattern 54d reflected in the image obtained by the shooting step S30 is associated with the processing condition 52 "D" and registered.

[0078] Here, the preferred structure for registration as a pattern (key pattern) is a structure with a characteristic shape that is easily determined by the determination unit 42a among the structures provided on the front side 1a of the chip 1 projected in the image. The control unit 42 automatically determines the pattern to be registered based on the structure projected in the image. Alternatively, the obtained image itself may be registered as a pattern in the information registration unit 42b.

[0079] In the processing apparatus 2, the path along which each wafer 1 is transported to the chuck stage 8 is approximately constant, particularly the area traversed by the wafer 1 after it has been positioned by the positioning stage 32. Therefore, when each wafer 1 is photographed using camera units 40 and 46, the same area on the front side 1a is photographed. In other words, regardless of the pattern registered, it can be easily observed on the front side 1a of the wafer 1. Therefore, even if the pattern is automatically determined and registered, it will not be a problem.

[0080] Furthermore, the pattern registered in the information registration unit 42b can also be selected by the operator. For example, the image obtained through the imaging step S30 can be displayed on the display 44 with a touch panel, and the operator can select a registered pattern from that image. The operator can select a pattern that has inherent features in the chip 1.

[0081] When a pattern is registered in connection with new processing conditions 52 in the pattern registration step S40, the determination unit 42a can determine whether the wafer 1 is the wafer 1 to be processed before processing the wafer 1 that is taken out from the boxes 28a and 28b.

[0082] In the processing apparatus 2, after the pattern registration step S40 is completed, a processing step S50 is performed to process the wafer 1 of the new category used for pattern registration according to the automatic processing program. In the processing step S50, the chuck table 8 holding the wafer 1 is moved sequentially to the rough grinding area and the fine grinding area, and the wafer 1 is processed using the processing units (grinding units) 10a and 10b according to the new processing conditions registered in the processing condition registration step S10.

[0083] Then, the removal step S60 is performed. In the removal step S60, the processed wafer 1 is removed from the processing apparatus 2. In the removal step S60, the chuck table 8, which holds the wafer 1 processed by the processing units (grinding units) 10a and 10b, is moved to the wafer loading / unloading area. Then, the wafer 1 is transported to the rotary cleaning apparatus 38 by the wafer unloading mechanism (unloading arm) 36, the wafer 1 is cleaned by the rotary cleaning apparatus 38, and the wafer transport robot 30 transports the wafer 1 to the boxes 28a and 28b.

[0084] Thus, in the management method of the processing apparatus in this embodiment, when processing a new type of wafer 1 using the processing apparatus 2, and when registering a pattern in association with the new processing conditions, after photographing the wafer 1 using camera units 40 and 46, the wafer 1 is not returned to the boxes 28a and 28b. An automatic processing program is started, and during the process of transferring the wafer 1 to the chuck table 8 for processing, the front side 1a of the wafer 1 is photographed, and the pattern is registered.

[0085] Therefore, it is not necessary to start the automatic processing program after returning wafer 1 to cassettes 28a and 28b. That is, after the operator of the processing apparatus 2 registers the new processing conditions in the information registration unit 42b, the pattern is registered simply by starting the automatic processing program and associating it with those processing conditions, so pattern registration does not take time or effort. Moreover, automatic processing continues until all wafers 1 that should be stored in cassettes 28a and 28b have been processed.

[0086] Furthermore, in the management method of the processing apparatus of this embodiment, when registering the pattern provided on the front side 1a of the wafer 1 in association with the processing conditions, other information that can be applied to the determination unit 42a for the determination of the wafer 1 can also be registered in the information registration unit 42b in association with the processing conditions. This other information is, for example, information related to the protective member 3 pasted on the front side 1a of the wafer 1.

[0087] A protective component 3 of an appropriate type is attached to the front side 1a of the wafer 1, depending on the type of the wafer 1 and the processing conditions performed by the processing apparatus 2. For example, the materials and thicknesses of the substrate layer and adhesive layer constituting the protective component 3 are appropriately selected. Furthermore, the appearance of the protective component 3 differs depending on its type, so it is possible to determine whether an appropriate type of protective component 3 is attached based on the appearance of the protective component 3 attached to the wafer 1.

[0088] For example, when the camera unit 46 takes an image of the front side 1a of the chip 1, since the image is taken through the protective member 3, information about the protective member 3 is included in the image. For example, the image is affected by the transparency and color of the protective member 3. Furthermore, the sharpness of the front side 1a of the chip 1 reflected in the image changes depending on the thickness of the protective member 3. In particular, when the focus position of the camera unit 46 is moved so that the focus position is aligned with the exposed surface of the protective member 3 (the surface that does not contact the front side 1a), the thickness of the protective member 3 can be calculated based on the distance the focus position is moved.

[0089] Furthermore, even when the front side 1a is photographed from the back side 1b using the camera unit 40, which includes an infrared camera, through the chip 1, the resulting image is affected by the protective member 3 attached to the front side 1a. The color (spectrum) of the infrared light detected by the camera unit 40 is greatly affected by the material of the protective member 3, which is mainly formed of organic resin or the like.

[0090] When information related to the protective component 3 attached to the wafer 1 is registered in the information registration unit 42b in association with the processing conditions, the determination unit 42a can determine whether the protective component 3 attached to the wafer 1 is of an appropriate category based on the image obtained by the imaging step S30. Therefore, in the pattern registration step S40, when the pattern is registered in association with the processing conditions registered in the information registration unit 42b by the processing conditions registration step S10, information related to the protective component 3 can also be registered in association with those processing conditions.

[0091] For example, when an image of the front side 1a of the wafer 1 is registered in the information registration unit 42b through the pattern registration step S40, the image is affected by the protective member 3, and therefore the information of the protective member 3 is registered in relation to the processing conditions. Furthermore, when the front side 1a of the wafer 1, which has been moved into the processing apparatus 2, is photographed using the camera units 40 and 46 and the determination unit 42a determines whether the wafer 1 is appropriate, the information related to the protective member 3 registered in the information registration unit 42b is referenced.

[0092] When an inappropriate type of protective component 3 is affixed, the desired processing result cannot be obtained even if the wafer 1 is processed under the processing conditions. Therefore, even if a pattern associated with the processing conditions is detected on the front side 1a of the wafer 1, the processing of the wafer 1 is stopped and the transport unit removes the wafer 1 if the determination unit 42a determines that the type of protective component 3 is inappropriate.

[0093] Furthermore, the desired processing results cannot be obtained if the protective component 3 is not attached to the front side 1a of the wafer 1. Therefore, when the determination unit 42a detects that the protective component 3 is not attached, it also stops the processing of the wafer 1 and causes the transport unit to remove the wafer 1. On the other hand, when the protective component 3 is detected attached to the wafer 1, if the type of wafer 1 and the type of protective component 3 are appropriate, the control unit 42 directly causes the processing units 10a and 10b to process the wafer 1.

[0094] Next, the processing method of wafer 1 will be described. This processing method of wafer 1 uses the management method of the processing apparatus of this embodiment described above to determine whether the category of subsequent wafer 1 is appropriate by using a pattern registered in the information registration unit 42b in association with the processing conditions, and automatically processes multiple wafers 1. Figure 5(B) is a flowchart describing the process of each step of this processing method of wafer 1.

[0095] When the above-described automatic processing procedure is performed, the front 1a of the new type of wafer 1 first removed from the boxes 28a and 28b is photographed, and the processing conditions and the pattern associated with those processing conditions are registered in the information registration unit 42b. Then, the photographing step S31 is performed on the wafer 1 subsequently removed from the boxes 28a and 28b.

[0096] In the imaging step S31, the wafer 1 in the cassettes 28a and 28b is transported by the wafer transfer robot 30 to the positioning stage 32, where the wafer 1 is positioned at a predetermined location. Then, the wafer loading mechanism 34 places the wafer 1 onto the chuck stage 8 located in the wafer loading / unloading area. Furthermore, during the process from when the wafer 1 is removed from the cassette 28a until it is placed on the chuck stage 8, the camera units 40 and 46 capture an image of the front side 1a of the wafer 1.

[0097] Alternatively, the chip 1 is stored in boxes 28a and 28b with the protective component 3 pre-attached to the front 1a side and the back 1b side facing upwards. Or, the chip 1 is stored in boxes 28a and 28b with the front 1a side facing upwards, and is transported to the positioning worktable 32 by flipping the front and back sides using the chip transfer robot 30.

[0098] Next, the following determination step S71 is performed: the determination unit 42a determines whether a pattern (key pattern) associated with the processing conditions during the processing of the wafer 1 is identified on the front side 1a of the wafer 1 in the image obtained by the imaging step S31. If the pattern is identified in the image, the determination unit 42a determines that the wafer 1 is a processing object processed under those processing conditions (S71). On the other hand, if the pattern is not identified in the image, the determination is that the wafer 1 is not a processing object processed under those processing conditions (S71).

[0099] If it is determined that wafer 1 is a workpiece to be processed under these processing conditions, processing step S51 is performed. In processing step S51, the rotary table 6 is rotated by one-third, and the chuck table 8 holding wafer 1 is moved to the rough grinding area. Then, wafer 1 is processed (rough grinding) under these processing conditions by processing unit 10a in the rough grinding area.

[0100] Then, the rotary table 6 is rotated to move the chuck table 8 to the fine grinding area, and the wafer 1 is processed (fine grinding) under these processing conditions using the processing unit 10b. Then, the rotary table 6 is rotated to move the chuck table 8 to the wafer loading / unloading area.

[0101] On the other hand, if it is determined in the determination step S70 that the wafer 1 transported to the chuck worktable 8 is not a processing object to be processed under the processing conditions, the processing step S51 is not performed.

[0102] Next, the wafer 1 is moved from the chuck table 8 to the cassettes 28a and 28b in a transfer step (S61). Specifically, the wafer 1 is moved to the rotary cleaning apparatus 38 using the wafer transfer mechanism 36, and then moved to the cassettes 28a and 28b using the wafer transfer robot 30. Here, if the wafer 1 has been processed in processing step S51, the rotary cleaning apparatus 38 is used to clean the wafer 1.

[0103] According to this processing method, processing can be performed after confirming that the wafer 1 placed into the processing apparatus 2 is the wafer 1 to be processed. Therefore, the wafer 1 can be processed under appropriate processing conditions, thereby obtaining the desired processing result. Then, the automatic processing program ends when all the wafers 1 stored in the boxes 28a and 28b are removed from the processing apparatus 2.

[0104] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made to implement it. In the above embodiments, the following situation was described: when information related to the pattern that the wafer 1 to be processed should have and information of the protective component 3 are registered in the information registration unit 42b, the wafer 1 that is first removed from the cartridges 28a and 28b is subjected to the imaging step S30. However, one aspect of the present invention is not limited to this.

[0105] That is, the imaging step S30 can also be performed on the second and subsequent wafers 1 removed from the boxes 28a and 28b, and in the pattern registration step S40, the pattern selected from the obtained image can also be registered in association with the processing conditions.

[0106] For example, when taking an image by step S30 on a new type of wafer 1 that is first removed from boxes 28a and 28b, the determination unit 42a may detect from the image that the protective component 3 is not attached to the wafer 1. Additionally, for example, there may be cases where it is determined that the wafer 1 is not a processing object registered in the information registration unit 42b under the processing conditions through the processing condition registration step S10.

[0107] In this case, when the pattern registration step S40 is performed using an image obtained by photographing the chip 1 of the new category, the appropriate pattern is not registered in the information registration unit 42b, and the subsequent determination unit 42a, which determines whether the chip 1 is appropriate, repeats the determination based on the inappropriate criteria.

[0108] Therefore, if a significant problem is found with the first new type of chip 1 removed from boxes 28a and 28b, that chip 1 can be returned to boxes 28a and 28b, and then other chips 1 can be removed from boxes 28a and 28b. Then, the imaging step S30 can be performed on the other chip 1, and the obtained image can be used to perform the pattern registration step S40.

[0109] Furthermore, the structure and method of the above embodiments can be implemented with appropriate modifications without departing from the purpose of the present invention.

Claims

1. A method for managing a processing apparatus, the processing apparatus comprising: a chuck stage having a holding surface on its upper surface for holding a wafer whose front side faces the holding surface; a processing unit for grinding or polishing the wafer held by the chuck stage from the back side; and a conveying unit for removing the wafer from a cassette placed in a cassette area for storing wafers and conveying the wafer to the chuck stage. A camera unit takes a picture of the wafer to obtain an image, the image of which shows a pattern formed on the front side of the wafer; an information registration unit registers the pattern shown in the image in association with the processing conditions when the wafer is processed by the processing unit. The determination unit, by detecting the pattern of the pre-processed wafer removed from the cassette and associating it with the processing conditions, registers it in the information registration unit and determines that the pre-processed wafer is a wafer to be processed. The management method of the processing apparatus is a management method for registering the pattern in the information registration unit in association with the processing conditions within the processing apparatus. The method is characterized by the following steps: a processing condition registration step, registering the processing conditions for processing a new type of wafer that has not previously been processed using the processing apparatus in the information registration unit; and an automatic processing program start step, causing the processing apparatus to start an automatic processing program, which causes the processing apparatus to perform the following automatic processing: after placing the cassette containing the new type of wafer in the cassette placement area, using the transfer sheet... The process involves: transferring the new type of wafer from the cassette to the chuck table; processing it using the processing unit according to the processing conditions registered in the processing condition registration step; and removing it from the chuck table using the transfer unit. A photographing step is performed where, during the process of the transfer unit transferring the new type of wafer from the cassette to the chuck table according to the automatic processing program and the chuck table holding the new type of wafer, an image of the pattern of the new type of wafer is formed using the camera unit. A pattern registration step is performed where the pattern in the image formed by the photographing step is associated with the new processing conditions registered in the processing condition registration step and registered in the information registration unit. The photographing step and the pattern registration step are performed during the automatic processing according to the automatic processing program.

2. The management method for the processing device according to claim 1, characterized in that, The new type of wafer has a protective component attached to its front side. The camera unit has an infrared camera. During the shooting step, the new type of wafer is held by the chuck stage through the protective component, and the camera unit takes a picture of the front side of the wafer from its back side.

3. The management method for the processing device according to claim 2, characterized in that, The determination unit also has the following functions: determining whether there is a protective component pasted on the front side of the wafer before processing and whether it is appropriate based on the information related to the protective component registered in the information registration unit in association with the processing conditions; if the protective component is determined to be inappropriate, or if the protective component is determined not to be pasted on the wafer before processing, causing the processing unit not to process the wafer before processing; in the pattern registration step, extracting the information related to the protective component from the image formed by the shooting step and registering it in the information registration unit in association with the processing conditions.

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