Speaker base assembly and speaker

Abstract

The present invention belongs to the field of audio playback, and in particular to a speaker base assembly and a speaker, wherein the speaker base assembly comprises: a base, which is made of a low-density material; a power amplifier device, which is provided with at least one and connected to the base; a counterweight, which is made of a material with high density and high thermal conductivity, connected to the base, and in contact with at least one of the power amplifier devices. The speaker base assembly of the present invention removes a radiator, thereby reducing the overall volume of the speaker base assembly.

Description

Technical Field

[0001] The invention belongs to the field of audio playback, and in particular relates to a speaker base assembly and a speaker. Background Art

[0002] The speaker base assembly includes a base, a counterweight, an amplifier device, and a radiator. The base is made of low-density materials such as plastic or wood, that is, the base is light in weight, and the vibration generated by the speaker when it is working can easily cause the speaker to resonate. If the speaker is light in weight, this resonance will affect the sound quality of the speaker, so a counterweight is needed to adjust the weight of the entire speaker and reduce the resonance. The amplifier device is used to amplify weak electrical signals to drive the speaker to make sound. During use, heat is generated, which increases the temperature of the amplifier device. If the temperature of the amplifier device is too high, it will cause damage to the amplifier device. Therefore, a radiator is needed to reduce the temperature of the amplifier device. The radiator is usually large in size, which results in a larger overall size of the speaker base assembly. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a speaker base assembly, which is intended to solve the problem of large overall volume.

[0004] The present invention is achieved in that:

[0005] A speaker base assembly, comprising:

[0006] a base, made of a low-density material;

[0007] A power amplifier device, at least one of which is connected to the base;

[0008] The counterweight block is made of a material with high density and high thermal conductivity, is connected to the base, and is in contact with at least one of the power amplifier components.

[0009] Optionally, the counterweight block is in contact with the power amplifier device through a thermally conductive adhesive.

[0010] Optionally, the counterweight block includes a counterweight block body and at least two heat-conducting contact parts connected to the counterweight block body, the heat-conducting contact parts are arranged at intervals, and the heat-conducting contact parts are in contact with at least one of the power amplifier devices.

[0011] Optionally, the heat-conducting contact portion is integrally connected to the counterweight body.

[0012] Optionally, the counterweight block is detachably connected to the base.

[0013] Optionally, the counterweight block is detachably connected to the base via a bolt structure.

[0014] Optionally, the counterweight is at least partially injection-molded as one piece with the base.

[0015] Optionally, each of the power amplifier components is mounted on the base via a PCB board.

[0016] Optionally, the power amplifier device is located between the base and the counterweight, and is pressed against the base by the counterweight.

[0017] The present invention provides a sound box, comprising the sound box base assembly as described above.

[0018] Based on the structural design of the present invention, since the material used to make the counterweight block has a high density characteristic, the counterweight block can play a role in adding weight to adjust the weight of the speaker box to which the speaker base assembly is applied and reduce resonance. Furthermore, since the material used to make the counterweight block has a high thermal conductivity characteristic and the counterweight block is in contact with the power amplifier device, the counterweight block can absorb heat from the power amplifier device in contact and play a role in heat dissipation. In this way, the speaker base assembly no longer needs to be separately configured with a radiator. Therefore, compared with the existing speaker base assembly, the speaker base assembly of the present invention removes the radiator and reduces the overall volume of the speaker base assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 is a three-dimensional structural diagram of a speaker base assembly provided by an embodiment of the present invention;

[0021] Figure 2 yes Figure 1 A magnified structural diagram of the middle part;

[0022] Figure 3 yes Figure 1 Exploded view of the speaker base assembly.

[0023] Description of Figure Numbers:

[0024] Label name Label name 100 Base 200 Power amplifier device 300 Counterweight 310 Counterweight body 320 Thermal contact 400 Thermally conductive adhesive 500 PCB board DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0026] An embodiment of the present invention provides a speaker base assembly.

[0027] See also Figures 1 to 3 The speaker base assembly includes a base 100, a power amplifier device 200 and a counterweight 300. The base 100 is made of a low-density material. The power amplifier device 200 is provided with at least one and is connected to the base 100. The counterweight 300 is made of a material with high density and high thermal conductivity, is connected to the base 100, and is in contact with at least one power amplifier device 200.

[0028] It should be noted here that the low density of the base 100 is relative to the high density of the counterweight 300, that is, under the condition of equal volume, the weight of the base 100 is lighter than the weight of the counterweight 300, wherein the low-density material used to manufacture the base 100 may be plastic or wood, etc., and since the counterweight 300 also has high thermal conductivity in this embodiment, the material with both high density and high thermal conductivity used to manufacture the counterweight 300 may be copper or steel, etc.

[0029] In the present invention, since the material used to manufacture the counterweight 300 has a high density characteristic, the counterweight 300 can play a role in adding weight to adjust the weight of the speaker to which the speaker base assembly is applied and reduce resonance. Furthermore, since the material used to manufacture the counterweight 300 has a high thermal conductivity characteristic and the counterweight 300 is in contact with the power amplifier device 200, the counterweight 300 can absorb heat from the power amplifier device 200 in contact and play a role in heat dissipation. In this way, the speaker base 100 group no longer needs to be separately configured with a radiator. Therefore, compared with the existing speaker base assembly, the speaker base assembly of the present invention removes the radiator and reduces the overall volume of the speaker base assembly.

[0030] In the embodiment of the present invention, the counterweight 300 is in direct contact with all the power amplifier devices 200 .

[0031] Based on the manufacturing process cost, the manufacturing of the base 100, the power amplifier device 200 and the configuration block will not choose a very high precision process, and usually reach a manufacturing accuracy of millimeter level. Therefore, the outer dimensions of the base 100, the power amplifier device 200 and the configuration block will have a millimeter-level manufacturing tolerance. This results in that when the counterweight block 300 and the power amplifier device 200 are in contact, the two cannot be completely fitted together, resulting in a gap between the counterweight block 300 and the power amplifier device 200. The thermal conductivity of air is low, which results in poor heat transfer between the counterweight block 300 and the power amplifier device 200 in this part, thereby affecting the heat dissipation efficiency of the configuration block.

[0032] To this end, in the embodiments of the present invention, please refer to Figures 1 to 3The weight block 300 is in contact with the power amplifier device 200 through the thermal conductive adhesive 400. The thermal conductive adhesive 400, also known as thermal conductive silicone, is a silicone rubber made by mixing organic silicone as the main body and adding fillers, thermal conductive materials and other polymer materials. It has good thermal conductivity and electrical insulation properties. Based on this, firstly, the thermal conductive adhesive 400 can well fill the gap between the counterweight block 300 and the power amplifier device 200, and the thermal conductive adhesive 400 can also efficiently transfer the heat generated by the power amplifier device 200 to the counterweight block 300, thereby improving the heat dissipation efficiency. Secondly, since the counterweight block 300 is in contact with the power amplifier device 200 through the thermal conductive adhesive 400, that is, the counterweight block 300 and the power amplifier device 200 are in indirect contact, not direct contact, and there is a gap between the counterweight block 300 and the power amplifier device 200. In this way, during the manufacturing process, it is possible to avoid interference between the counterweight block 300 and the power amplifier device 200 due to manufacturing tolerances of the base 100, the power amplifier device 200 and the configuration block, resulting in subsequent inability to assemble.

[0033] In the embodiment of the present invention, please refer to Figures 1 to 3 The counterweight 300 includes a counterweight body 310 and at least two heat-conducting contact portions 320 connected to the counterweight body 310 . The heat-conducting contact portions 320 are arranged at intervals, and the heat-conducting contact portions 320 are in contact with at least one power amplifier device 200 . Firstly, in addition to the power amplifier device 200, the speaker base assembly also includes other functional devices, such as capacitors, resistors, etc., and when multiple power amplifier devices 200 are provided, each power amplifier device 200 will be arranged at intervals, and the area occupied by them is relatively large. If the configuration body is in direct contact with each power amplifier device 200, in order to avoid other functional devices, the structure of the configuration block body will be relatively complicated. Based on this, extending the heat conductive contact portion 320 to the power amplifier device 200 is beneficial to simplify the structure of the configuration block body. Secondly, the heat conductive contact portion 320 is used to transfer the heat of the power amplifier device 200 to the counterweight block body 310, and at least two heat conductive contact portions 320 are provided, so that each heat conductive contact portion 320 can transfer heat to the counterweight block body 310 from different places, which is beneficial to evenly conduct heat to the counterweight block body 310 and avoid the temperature of one end of the counterweight block body 310 being significantly higher than the other end. This is beneficial to improve the heat dissipation efficiency of the counterweight block 300.

[0034] For further information, see Figures 1 to 3 The heat-conducting contact portion 320 is integrally connected to the counterweight body 310. In this way, the heat transfer efficiency between the heat-conducting contact portion 320 and the counterweight body 310 can be improved, thereby improving the heat dissipation efficiency of the counterweight 300.

[0035] Of course, in other embodiments, the heat-conducting contact portion 320 and the counterweight body 310 are detachably connected, and the detachable connection can be achieved by means of bolts or snaps.

[0036] In the embodiment of the present invention, the counterweight block 300 is detachably connected to the base 100. In this way, the counterweight block 300 and the base 100 can be manufactured separately, which is beneficial to reduce the difficulty of production.

[0037] Specifically, the counterweight 300 is detachably connected to the base 100 via a bolt structure. The structure is simple and convenient for assembly and disassembly. The specific operation only requires tightening by rotating the screws.

[0038] Of course, in other embodiments, the counterweight 300 is at least partially injection-molded as one piece with the base 100 .

[0039] In the embodiment of the present invention, please refer to Figures 1 to 3 , each power amplifier device 200 is installed on the base 100 through a PCB board 500, that is, each power amplifier device 200 is fixed to the PCB board 500, and the PCB board 500 is further fixed to the base 100. In this way, firstly, the PCB board 500 can be arranged with a printed circuit, and each power amplifier device 200 is fixed to the PCB board 500 to achieve electrical connection with other functional devices. Secondly, each power amplifier device 200 is fixed to the PCB board 500. There is a relatively mature manufacturing process. Therefore, after each power amplifier device 200 is fixed to the PCB board 500, during the assembly process, it is only necessary to assemble the PCB board 500 to the base 100 to complete the assembly.

[0040] In the embodiment of the present invention, the power amplifier device 200 is located between the base 100 and the counterweight 300, and is pressed against the base 100 by the counterweight 300. In this way, there is no need for a locking structure between the base 100 and the power amplifier device 200, and the base 100 only needs to be provided with a structure for lateral displacement.

[0041] The present invention also proposes a speaker, which includes a speaker base assembly. The specific structure of the speaker base assembly refers to the above embodiment. Since the speaker adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0042] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A speaker base assembly, characterized in that: include: a base, made of a low-density material; A power amplifier device, at least one of which is connected to the base; A counterweight block is made of a material with high density and high thermal conductivity, and is connected to the base. The counterweight block is detachably connected to the base, or the counterweight block is at least partially injection-molded as one piece with the base. The counterweight block includes a counterweight block body and at least two thermally conductive contact parts connected to the counterweight block body, each of the thermally conductive contact parts is arranged at intervals, and each of the thermally conductive contact parts is in contact with at least one of the power amplifier devices. Each of the power amplifier devices is fixed to a PCB board, and the PCB board is further fixed to the base. The power amplifier device is located between the base and the counterweight block, and is pressed against the base by the counterweight block, and no locking structure is required between the base and the power amplifier device.

2. The speaker base assembly according to claim 1, characterized in that: The counterweight block is in contact with the power amplifier device through heat conductive adhesive.

3. The speaker base assembly according to claim 1, characterized in that: The heat-conducting contact portion is integrally connected to the counterweight body.

4. The speaker base assembly according to claim 1, characterized in that: The counterweight block is detachably connected to the base via a bolt structure.

5. A sound box, characterized in that: The invention comprises a speaker base assembly as claimed in any one of claims 1 to 4.

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