Electronic component and method of mounting an electronic component

Abstract

The invention relates to an electronic component (1), comprising: a semiconductor chip (2), an encapsulation material (3) at least partially surrounding the semiconductor chip (2), and a protective layer (4), the protective layer being formed with a material different from the encapsulation material (3), wherein a side of the encapsulation material (3) facing away from the semiconductor chip (2) is at least partially covered by the protective layer (4). The invention also relates to a method for mounting the electronic component (1).

Description

Technical Field

[0001] The present invention relates to an electronic component and also to a method for mounting an electronic component. Summary of the invention

[0002] The object to be achieved is to provide an improved electronic component. Another object to be achieved is to provide a method for mounting an electronic component.

[0003] An electronic component is provided.

[0004] The electronic component can be, for example, an integrated circuit, a transistor, a memory element, a resistor or an optoelectronic component. For example, the optoelectronic component is a semiconductor laser component, a light emitting diode, an optical amplifier or a photodiode.

[0005] For example, semiconductor laser components can be realized in a so-called TO configuration (TO: “Transistor Outline”). Compact TO metal housings are common in this case. Compact TO metal housings are basically made of steel or copper.

[0006] According to at least one embodiment, the electronic component comprises a semiconductor chip. The semiconductor chip is, for example, an electronic semiconductor chip. For example, the semiconductor chip is an optoelectronic semiconductor chip. An optoelectronic semiconductor chip (for example a light emitting diode chip, a photodiode chip and / or a laser diode chip) has an epitaxially grown semiconductor layer sequence, which has an active region, which is designed to detect or generate electromagnetic radiation. During operation, the optoelectronic semiconductor chip can emit and / or receive electromagnetic radiation in a wavelength range in the ultraviolet (UV) radiation, blue light and / or infrared range, for example.

[0007] According to at least one embodiment, the electronic component has an encapsulation material that at least partially surrounds the semiconductor chip. That is, the semiconductor chip is at least partially surrounded by the encapsulation material and is thus protected from external mechanical or chemical influences. Alternatively or additionally, the encapsulation material can be used as a matrix material for the luminescent material to form a conversion layer. The luminescent material is then provided to absorb the electromagnetic radiation emitted by the semiconductor chip and convert it into another electromagnetic radiation. The electromagnetic radiation emitted by the semiconductor chip is then different from the other electromagnetic radiation emitted by the luminescent material.

[0008] The encapsulation material is preferably permeable or transparent to electromagnetic radiation, such as visible light. The encapsulation material is preferably formed from a polymer. The encapsulation material can, for example, include epoxy resin or silicone resin, or be made of epoxy resin or silicone resin.

[0009] According to at least one embodiment, the electronic component has a protective layer, which is formed with a material different from the coating material. The protective layer preferably has a polymer different from the polymer of the coating material as a material. Compared with the coating material, the material of the protective layer has different chemical and physical properties. For example, the material has different solubility in different solvents and / or the material has different temperature stability. The protective layer is preferably arranged to protect the coating material from environmental influences (such as dirt and particles).

[0010] The protective layer can preferably be peeled off from the covering material, in particular without residue. This means, for example, that when the protective layer is peeled off, the protective layer can be completely removed without leaving residues on the surface on which the protective layer was applied before peeling off.

[0011] For example, the protective layer has a thickness of at least 0.01 mm and at most 0.1 mm. The protective layer preferably has a thickness of at least 0.015 mm and at most 0.08 mm. Too thin a protective layer can result in insufficient protection of the covering material from environmental influences, such as dirt, and too thick a protective layer can result in a deterioration in the strippability of the protective layer.

[0012] According to at least one further embodiment, the electronic component has a side of the encapsulation material facing away from the semiconductor chip, which is at least partially covered by a protective layer. The protective layer can completely or partially cover the side of the encapsulation material facing away from the semiconductor chip. The protective layer can be applied as a layer and / or as a film. In addition, the protective layer can preferably be applied directly to the encapsulation material. Alternatively, a water-soluble polymer material can be arranged as an adhesive layer between the protective layer and the encapsulation material and, for example, has polyvinyl alcohol. The polymer material of the adhesive layer is in particular different from the protective layer.

[0013] According to at least one embodiment of the electronic component, the electronic component comprises a semiconductor chip, an encapsulation material at least partially surrounding the semiconductor chip, and a protective layer formed from a material different from the encapsulation material, wherein a side of the encapsulation material facing away from the semiconductor chip is at least partially covered by the protective layer.

[0014] One concept of current electronic components is to apply a protective layer to the encapsulation material in order to protect the surface of the encapsulation material from environmental influences, preferably from dirt and particles. The protective layer should preferably be applied when the electronic component is assembled.

[0015] Particularly preferably, the material for the protective layer is selected, the material is intact during the installation process, and can then be peeled off particularly easily and especially without residue.By the protective layer not being damaged, especially not being peeled off during the installation process, the encapsulating material is advantageously protected during the installation process.

[0016] According to at least one embodiment, the protective layer is soluble in a polar solvent. The polar solvent preferably has a functional group from which a hydrogen atom in the molecule can be split into a proton. For example, the protective layer is soluble in a polar solvent such as an alcohol, water, a carboxylic acid and / or an inorganic acid.

[0017] According to at least one embodiment, the protective layer is a water-soluble polymer or is made of a water-soluble polymer. This means that the protective layer can preferably be almost completely soluble in water.

[0018] The water-soluble polymer preferably has a sufficient number of hydrophilic groups and has only a low degree of crosslinking. The hydrophilic groups can be nonionic, anionic, cationic or zwitterionic groups. The following list shows hydrophilic, i.e. water-soluble groups that can serve as structural units for water-soluble polymers:

[0019]

[0020] The water-soluble polymers are obtained in particular from the above-mentioned structural units. Here, the water-soluble polymers can, for example, have the same structural units or the water-soluble polymers can have different structural units. If the water-soluble polymers have different structural units, this can also be referred to as a water-soluble copolymer. A water-soluble copolymer is a polymer consisting of two or more different types of structural units. By combining different types of monomer units, the chemical and physical properties of the water-soluble copolymer can be adjusted particularly well.

[0021] According to at least one preferred embodiment, the water-soluble polymer comprises polyvinyl alcohol or consists of polyvinyl alcohol. Polyvinyl alcohol is particularly soluble in water due to the hydrophilic hydroxyl (OH) groups and can be removed particularly well from the encapsulation material without leaving residues in the process.

[0022] Additionally, polyvinyl alcohol forms a thermoplastic polymer. Thermoplastic polymers are characterized by a low degree of branching of the carbon chain and the carbon chains being connected to each other via weak physical bonds. Therefore, polyvinyl alcohol is particularly well suited as a protective material due to its high flexibility and good water solubility.

[0023] According to at least one embodiment, the encapsulation material comprises silicone or is made of silicone. Silicone is preferably present in optical quality and has particularly good aging stability compared to epoxy resins. Silicone as an encapsulation material is a transparent, elastic thermosetting material. Other advantages are that silicone yellows slightly during operation, is heat-resistant and is UV-stable. For example, the encapsulation material has a permeability to electromagnetic radiation of at least 90%, in particular at least 95%. Silicone has a certain viscosity depending on the molecular properties, i.e., for example, the chain mobility / length and the side groups. As a result, dirt and particles remain attached to the encapsulation material.

[0024] According to at least one embodiment, the protective layer is in direct contact with the coating material. This means that preferably no additional layer is arranged between the protective layer and the coating material. For example, the protective layer can be bonded directly to the surface due to the sticky surface of the coating material. The protective layer is used to protect against dirt and particles due to the direct contact with the coating material.

[0025] According to at least one embodiment, the coating material is chemically bonded to the protective layer. This means that the protective layer is chemically bonded to the coating material. For example, the OH groups of polyvinyl alcohol are bonded to the silicon atoms of silicone resin. For example, the chemical bond can be a coordination bond or a covalent bond. The chemical bond between the protective layer and the coating material is preferably not a strong bond, because in the case of too strong a chemical bond, the protective layer will become difficult to separate from the coating material during peeling in the method. However, too weak a chemical bond results in low protection of the coating material and leads to unintentional separation of the protective material, for example, when installing the assembly.

[0026] The combination of a casing material comprising silicone and a protective layer soluble in polar solvents advantageously results in a chemical bond which leads to good adhesion of the protective layer to the casing material and to residue-free detachment of the protective layer from the casing material in polar solvents.

[0027] According to at least one embodiment, the intermediate layer and / or the covering layer are arranged on the side of the protective layer facing away from the semiconductor chip. For example, the intermediate layer can be in direct contact with the protective layer. Additionally, the covering layer can be in direct contact with the intermediate layer. The advantage of applying the additional layer to the protective layer is that the additional layer can be easily removed from the solvent pool during stripping in the method, because the additional layer floats on the solvent surface due to the intermediate layer and the covering layer. Preferably, the solvent pool is filled with a polar solvent, for example water. In addition, the intermediate layer and / or the covering layer serve as additional protection for the protective layer and thus for the encapsulating material.

[0028] For example, the cover layer can be removed before the protective layer is applied to the electronic component or after the protective layer is applied to the electronic component.

[0029] According to at least one embodiment, the intermediate layer has a water-soluble adhesive material. The thickness of the intermediate layer is preferably between at least 0.01 mm and at most 0.1 mm. The thickness of the intermediate layer is preferably between at least 0.015 mm and at most 0.08 mm. In addition, the intermediate layer can include two or more sublayers. For example, the thickness of the intermediate layer is formed thinner than the thickness of the protective layer.

[0030] For example, the protective layer is in direct contact with the coating material on the side facing away from the semiconductor chip. The intermediate layer is in direct contact with the protective layer on the side facing away from the coating material. The cover layer is in direct contact with the intermediate layer on the side facing away from the protective layer. The protective layer preferably has a thickness between at least 0.030 mm and at most 0.035 mm, for example, a thickness of 0.033 mm. The intermediate layer preferably has a thickness between at least 0.017 mm and at most 0.023 mm, for example, a thickness of 0.020 mm.

[0031] In accordance with at least one embodiment, the electronic component is a radiation-emitting component, in particular an edge-emitting semiconductor laser component.

[0032] An edge-emitting semiconductor laser component comprises a semiconductor chip which is designed to emit laser radiation. This means that, during operation, the semiconductor chip emits electromagnetic radiation, for example in a wavelength range between infrared (IR) and UV radiation.

[0033] According to at least one embodiment, the semiconductor chip emits electromagnetic radiation in a wavelength range in the infrared range during operation. The wavelength range of the infrared range is between at least 1 millimeter and at most 780 nanometers. The wavelength range is preferably between at least 1000 nanometers and at most 780 nanometers, particularly preferably, the range is between at least 950 nanometers and at most 850 nanometers.

[0034] Infrared semiconductor laser components are also used in airborne laser scanning (LIDAR) sensor devices ("Light Detection And Ranging").

[0035] Alternatively, the semiconductor chip can emit electromagnetic radiation in a wavelength range in the green spectral range during operation.

[0036] The semiconductor chip is in particular an edge-emitting semiconductor laser chip, wherein the laser radiation emerges at the end faces, i.e. the facets, of the semiconductor chip. That is, the radiation transmission surface of the semiconductor chip is located at the first end face, through which the laser radiation generated during operation emerges from the semiconductor chip.

[0037] Furthermore, the edge-emitting semiconductor laser component comprises a cladding material which at least partially surrounds the semiconductor chip. The cladding material preferably completely surrounds the radiation transmission surface of the semiconductor chip, for example. The surface from which the electromagnetic radiation of the edge-emitting semiconductor laser component emerges is currently referred to as the radiation exit surface. The radiation exit surface of the electronic component is parallel to the radiation transmission surface of the semiconductor chip.

[0038] According to at least one embodiment, the radiation exit surface is located on the side of the encapsulation material facing away from the semiconductor chip. The electromagnetic radiation of the semiconductor chip passes through the encapsulation material and through the radiation exit surface. The protective layer is arranged downstream of the radiation exit surface. That is, the protective layer is arranged on the encapsulation material at a distance from the semiconductor chip laterally. The protective layer extends in particular laterally or perpendicularly to the bottom side of the semiconductor chip.

[0039] In accordance with at least one embodiment, the underside of the semiconductor chip is perpendicular to the radiation passage area and the radiation exit area.

[0040] In addition, the edge-emitting semiconductor laser component comprises a protective layer, which at least partially surrounds the cladding material. In particular, the protective layer covers the cladding material, in particular at the radiation exit surface. The protective layer particularly preferably completely covers the cladding material at the radiation exit surface.

[0041] According to at least one embodiment, the electronic component has a radiation exit surface, which is partially or completely covered by the protective layer. This means that another layer can be arranged between the protective layer and the radiation exit surface. The protective layer is preferably arranged on the radiation exit surface.

[0042] In edge-emitting electronic semiconductor laser components, the radiation exit surface is arranged at the end face of the electronic semiconductor laser component. In addition, the radiation exit surface is preferably completely covered by a protective layer. The protective layer protects the radiation exit surface from possible scratches and / or dirt, such as particles, on the surface of the encapsulation material. Advantageously, the light coupling out from the radiation exit surface of the electronic component is improved by the protective layer, because in this method, the removal of the protective layer produces a preferably cleaner radiation exit surface.

[0043] A method for mounting an electronic component is also provided. Preferably, the electronic component described here can be mounted by means of the method described here. That is to say, all features disclosed for the electronic component are also disclosed for the method for mounting an electronic component, and vice versa.

[0044] According to at least one embodiment of the method for mounting an electronic component, the electronic component described herein is provided, the electronic component is placed on a carrier, and the protective layer is then peeled off.

[0045] According to at least one embodiment, providing an electronic component comprises the following steps:

[0046] - Provide semiconductor chips,

[0047] - surrounding the semiconductor chip at least partially with an encapsulation material, and

[0048] - Applying a protective layer at least partially to the casing material.

[0049] In a first step, a semiconductor chip is provided. The semiconductor chip is then at least partially surrounded by an encapsulation material. For example, the semiconductor chip is surrounded by an encapsulation material on one to five sides of the semiconductor chip. The sixth side of the semiconductor chip, which corresponds in particular to the bottom side, is preferably free of encapsulation material. The bottom side is preferably arranged on a support surface. Alternatively, the encapsulation material can simultaneously encapsulate a plurality of semiconductor chips. This means that a plurality of semiconductor chips are encapsulated by a common encapsulation material.

[0050] The protective layer is applied, for example, by means of a spin coating process. The spin coating process is a method of applying a thin and uniform layer or film to a coating material. Here, a semiconductor chip, which is at least partially surrounded by a coating material, is fixed to a turntable. The desired amount of the protective layer is applied as a solution by means of a dosing device over the center of the semiconductor chip, wherein the semiconductor chip is at least partially surrounded by the coating material. The acceleration, the final rotation speed and the time are adjusted at the spin coater, and the protective layer is evenly distributed to the desired position of the coating material surface and dried. If necessary, the final drying can be carried out in a furnace, for example, in a thermally assisted manner. Here, preferably, a common protective layer is applied to a common coating material, which coats a plurality of semiconductor chips.

[0051] Another method for applying the protective layer is to apply a small amount of the protective layer solution in a targeted manner at the desired location, for example at the radiation exit surface, by means of a suitable metering method (for example needle metering).

[0052] According to at least one embodiment, the carrier comprises a circuit board. The circuit board is preferably a printed circuit board. The circuit board is particularly preferably a sensor printed circuit board.

[0053] According to at least one embodiment, the protective layer is stripped in a solvent bath, which is preferably filled with a polar solvent, such as water. This means that after the electronic component is mounted on a carrier, the protective layer is stripped in a solvent bath. Water removes the chemical bonds between the protective layer and the coating material. This method for removing the protective layer is gentle compared to conventional methods (i.e., for example, water pressure and with the aid of cleaning agents) and does not damage the coating material. The method can be supported thermally, i.e., by temperatures between 4°C and 100°C, particularly preferably between 25°C and 60°C, to accelerate the dissolution of the protective layer. Preferably, the protective layer, and optionally the intermediate layer and the cover layer remain in the solvent bath. These layers can be removed from the solvent bath by means of a suitable method.

[0054] The idea behind the electronic component is to protect the radiation exit surface of the encapsulation material of the electronic component from environmental influences, such as dirt and particles.

[0055] Conventional electronic components with epoxy resin encapsulation materials or electronic components with transistor outline (TO) metal housings can be cleaned of dirt and particles using water pressure and with the aid of cleaning agents. In the case of electronic components with more age-stable, more elastic encapsulation materials made of silicone, conventional cleaning processes are not possible due to the deterioration of the elastic encapsulation material.

[0056] The water-soluble protective layer protects the surface of the coating material from dirt, such as particles. In addition, applying the protective layer to the coating material is very useful for the end user. First, the electronic component is mounted on a carrier, and then the protective layer can be peeled off without problems, for example in a solvent bath. Therefore, the operability is significantly improved for the end user, because the electronic component is protected from harmful environmental influences and pollution until the end. The optical coupling output is thus improved, because the scattered light and the reduction of the absolute output power caused by absorbing the laser radiation at the dirt / particles do not occur. On the contrary, the probability of contaminating the electronic component is significantly reduced and the failure after installation can be significantly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Further advantageous embodiments and developments of the electronic component and of the method for mounting an electronic component are apparent from the exemplary embodiments described below in conjunction with the figures.

[0058] The accompanying drawings show:

[0059] Figure 1 , Figure 2 , Figure 3 and Figure 4 Schematic cross-sectional views of electronic components according to embodiments are shown respectively,

[0060] Figure 5 , Figure 6 and Figure 7 Schematic cross-sectional views showing various method stages of a method for mounting an electronic component according to an embodiment.

[0061] Identical, similar or identically functioning elements are provided with the same reference numerals in the drawings. The drawings are schematic diagrams and are therefore not necessarily true to scale. Rather, individual elements, in particular layer thicknesses, may be shown exaggeratedly for better illustration and / or for better understanding. DETAILED DESCRIPTION

[0062] according to Figure 1The electronic component 1 of the exemplary embodiment of the present invention comprises a semiconductor chip 2, an encapsulation material 3 and a protective layer 4. During operation, the semiconductor chip 2 emits electromagnetic radiation in a wavelength range in the infrared range. The wavelength range of the infrared range is between 1000 nanometers and 780 nanometers, inclusive, preferably between 950 nanometers and 850 nanometers, inclusive. The encapsulation material 3 at least partially surrounds the semiconductor chip 2.

[0063] At present, for example, five sides of the semiconductor chip 2 are surrounded by the encapsulation material 3. The sixth side of the semiconductor chip 2 corresponding to the lower side 8 is free of the encapsulation material 3. The side of the encapsulation material 3 facing away from the semiconductor chip 2 is at least partially covered by the protective layer 4. The encapsulation material 3 has silicone or is made of silicone. In addition, the protective layer 4 is soluble in polar solvents. The protective layer 4 has a water-soluble polymer or is made of a water-soluble polymer. The water-soluble polymer is, for example, polyvinyl alcohol. Polyvinyl alcohol has OH groups and is bonded to the encapsulation material 3. Therefore, the protective layer 4 has a material different from the encapsulation material 3. The material of the protective layer 4 is selected so that the protective layer 4 is intact during the installation process and can then be peeled off particularly simply and in particular without residue.

[0064] Figure 1 It is an edge-emitting semiconductor laser component. The semiconductor chip 2 emits electromagnetic radiation and outputs electromagnetic radiation at the end face, that is, at the radiation transmission surface 9 of the semiconductor chip 2. The side of the electronic component 1 corresponds to the radiation exit surface 10. The radiation exit surface 10 of the electronic component 1 is parallel to the radiation transmission surface 9 of the semiconductor chip 2. The protective layer 4 is applied on the radiation exit surface 10 to protect the surface of the encapsulation material 3. The protective layer protects the electronic component 1 from dirt and particles. The protective layer 4 is in direct contact with the encapsulation material 3 here, but can also be installed with the help of an additional adhesive layer. The adhesive layer, for example, has a polyvinyl alcohol with a different chain length from the protective layer 4. The protective layer 4 can be installed as a layer and / or as a film.

[0065] Figure 2 The embodiment shown in FIG. 1 shows an electronic component 1, which is connected to Figure 1 The electronic component 1 of FIG. 1 is different in that a protective layer 4 is additionally arranged on the upper side 11 of the electronic component 1 opposite the semiconductor chip 2. The semiconductor chip 2 can emit electromagnetic radiation in all directions, for example. In addition, the protective layer 4 arranged on the upper side 11 can be used, for example, for better adhesion of the protective layer 4 arranged on the radiation exit surface 10.

[0066] according to Figure 3In the embodiment of the present invention, in addition to the protective layer 4, an additional intermediate layer 5 and a cover layer 6 are arranged on the side of the protective layer 4 away from the semiconductor chip 2. The intermediate layer 5 is preferably in direct contact with the protective layer 4, and the cover layer 6 is in direct contact with the intermediate layer 5. The thickness of the protective layer 4 is between at least 0.01 mm and at most 0.1 mm. In particular, the protective layer 4 has a thickness between at least 0.030 mm and at most 0.035 mm. For example, the thickness of the protective layer 4 is 0.033 mm. The intermediate layer 5 preferably has a thickness between at least 0.01 mm and 0.1 mm. In particular, the intermediate layer 5 has a thickness between at least 0.017 mm and at most 0.023 mm. For example, the thickness of the intermediate layer 5 is 0.020 mm.

[0067] Advantageously, during stripping in a solvent bath, for example a water bath, the layer sequence can preferably be removed in such a way that it floats on the water surface after stripping. The intermediate layer 5 comprises a water-soluble adhesive material, preferably a water-soluble polymer material, and can also comprise, for example, a polyvinyl alcohol having a different chain length than the protective layer 4 .

[0068] Figure 4 The embodiment shown in FIG. 1 shows an electronic component 1, which is connected to Figure 3 The electronic component 1 in FIG. 1 is different in that no cover layer 6 is arranged on the intermediate layer 5. Before the protective layer 4 and the intermediate layer 5 are applied to the electronic component 1, the cover layer 6 is removed.

[0069] In accordance with Figures 5 to 7 In the method for mounting an electronic component 1 of an embodiment, in a first step, an electronic component 1 is provided, Figure 5 .

[0070] The electronic component 1 is provided by first placing the semiconductor chip 2 with its underside 8 on a support surface and then at least partially surrounding the semiconductor chip 2 with the encapsulation material 3. The electronic component 1 is obtained by applying the protective layer 4 as a solution to the encapsulation material 3 at least partially, for example, by means of a spin coating process. The protective layer 4 is distributed as a solution to the desired locations on the surface of the encapsulation material 3 and dried. For example, the final drying can be carried out in a furnace with thermal support. The electronic component 1 is placed on a carrier 7 during assembly. Figure 6 The carrier 7 is, for example, a circuit board. For example, the carrier 7 is a printed circuit board.

[0071] In the final step, the protective layer 4 and / or the intermediate layer 5 and / or the cover layer 6 are peeled off from the covering material 3. Figure 7 .

[0072] The protective layer 4 is stripped off in a solvent bath. The protective layer 4 is preferably stripped off in a water bath. The protective layer 4 can thus be advantageously separated from the encapsulation material 3 without problems and simply, and the surface of the encapsulation material 3 is free of any dirt and particles. This results in a preferred light coupling-out from the radiation exit surface 10 of the electronic component 1. The protective layer 4 is preferably stripped off from the encapsulation material 3 in a particularly residue-free manner.

[0073] Features and embodiments described in conjunction with the figures can be combined with one another according to further embodiments, even if not all combinations are explicitly described. Furthermore, the embodiments described in conjunction with the figures may alternatively or additionally have further features according to the description in the general part.

[0074] The invention described here is not limited by the description based on the exemplary embodiments. Rather, the invention includes any new feature and any combination of features, which in particular includes any combination of features in the claims, even if this feature or this combination itself is not explicitly described in the claims or exemplary embodiments.

[0075] This application claims the priority of German patent application 10 2019 109 586.7, the disclosure content of which is incorporated herein by reference.

[0076] Reference numerals list

[0077] 1 Electronic components

[0078] 2 Semiconductor Chips

[0079] 3. Coating material

[0080] 4. Protective layer

[0081] 5. Middle Layer

[0082] 6 Covering

[0083] 7 Carrier

[0084] 8 Lower side

[0085] 9 Radiation penetration surface

[0086] 10 Radiation exit surface

[0087] 11 Top surface.

Claims

1. An electronic component (1), the electronic component being an edge-emitting semiconductor laser component, the electronic component comprising: - semiconductor chips (2), - an encapsulation material (3), which at least partially surrounds the semiconductor chip (2), the encapsulation material (3) surrounding the semiconductor chip (2) as a whole on five sides, - Radiation exit surface (10) - a protective layer (4), the protective layer being formed using a material different from the coating material (3), wherein: - the side of the encapsulation material (3) facing away from the semiconductor chip (2) is at least partially covered by the protective layer (4), and The radiation exit surface (10) is partially or completely covered by the protective layer (4).

2. The electronic component (1) according to claim 1, wherein: The protective layer (4) is soluble in a polar solvent.

3. The electronic component (1) according to claim 1 or 2, wherein: The protective layer (4) contains a water-soluble polymer or is composed of a water-soluble polymer.

4. The electronic component (1) according to claim 3, wherein: The water-soluble polymer comprises polyvinyl alcohol or consists of polyvinyl alcohol.

5. The electronic component (1) according to claim 1 or 2, wherein: The encapsulation material (3) comprises silicone or consists of silicone.

6. The electronic component (1) according to claim 1 or 2, wherein: The protective layer (4) is in direct contact with the coating material (3).

7. The electronic component (1) according to claim 1 or 2, wherein: The coating material (3) forms a chemical bond with the protective layer (4).

8. The electronic component (1) according to claim 1 or 2, wherein: An intermediate layer (5) and / or a covering layer (6) are arranged on a side of the protective layer (4) facing away from the semiconductor chip (2).

9. The electronic component (1) according to claim 8, wherein: The intermediate layer (5) comprises a water-soluble adhesive material.

10. The electronic component (1) according to claim 1 or 2, wherein: During operation, the semiconductor chip (2) emits electromagnetic radiation with a wavelength in the infrared range.

11. A method (1) for mounting an electronic component, the method comprising the following steps: A) providing an electronic component (1) according to any one of claims 1 to 10, B) placing the electronic component (1) on a carrier (7), C) peeling off the protective layer (4).

12. The method according to claim 11, wherein: The provision of the electronic component (1) comprises the following steps: - providing semiconductor chips (2), - at least partially surrounding the semiconductor chip (2) with an encapsulation material (3), and - applying the protective layer (4) at least partially onto the casing material (3).

13. The method according to claim 11 or 12, wherein: The carrier (7) comprises a circuit board.

14. The method according to claim 11 or 12, wherein: The protective layer (4) is stripped off in a solvent bath.

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