Radiator, packaging structure and electronic equipment

Abstract

The present application provides a radiator, a packaging structure and an electronic device, which relate to the field of heat dissipation technology. The radiator includes a radiator body and an air duct, wherein: the radiator body includes a heat sink and a vertical arm, one end of the vertical arm is fixed to the heat sink, and the vertical arm can be connected to the device to be cooled. The air duct is used to ventilate the radiator body. When the radiator of the embodiment of the present application is used in the packaging structure, the radiator can be connected to the device to be cooled in the packaging structure through the vertical arm, so that the heat on the device is transferred to the radiator body through the vertical arm, so as to achieve the heat dissipation of the device by the radiator. The radiator of the embodiment of the present application achieves heat dissipation of the device by direct contact with the device, and the thermal resistance between the two is small, and the heat dissipation performance is good. In addition, since the structure of the radiator is relatively simple, it is conducive to the miniaturization design of the radiator.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat sink, a packaging structure, and an electronic device. Background Art

[0002] As power electronic converters evolve toward higher density and flatter design, surface-mount power devices, such as metal-oxide-semiconductor field-effect transistors (MOSFETs) and gallium nitride high electron mobility transistors (GaN), are becoming widely used. These devices generate power loss, leading to higher temperatures. Therefore, appropriate heat dissipation measures are required to manage device temperature and prevent overheating, which could lead to device failure.

[0003] The core heat-generating component of SMD power devices is the die. Different packaging options allow heat from the die to be dissipated through different paths. Currently, two typical packaging options exist for SMD power devices: bottom-cooling and top-cooling. Because top-cooling SMD power devices require a top-mounted heat sink for heat dissipation and offer superior heat dissipation capabilities, top-cooling is currently the most common method for dissipating heat from high-power SMD power devices.

[0004] However, when using top-side cooling, a flexible thermally conductive material must be placed between the heat sink and the SMD power device. To ensure the dielectric strength of the flexible thermally conductive material, its thickness is typically increased. This introduces a significant thermal resistance between the heat sink and the SMD power device, making it unable to meet the heat dissipation requirements of high-power SMD power devices. Summary of the Invention

[0005] The present application provides a heat sink, a packaging structure, and an electronic device to improve the heat dissipation performance of the heat sink, thereby achieving effective heat dissipation of the heat sink to the heat dissipation device.

[0006] In the first aspect, an embodiment of the present application provides a heat sink, which can be used, but is not limited to, to dissipate heat for chips, insulated gate bipolar transistors, or other common high-power semiconductor devices. The heat sink may include a heat sink body and an air duct. The heat sink body includes a heat sink and two or more vertical arms, with two adjacent vertical arms spaced apart. In addition, one end of the vertical arm is fixed to the heat sink, and the other end is used to connect to the device to be dissipated. The air duct is used to ventilate the heat sink body. When the heat sink of the embodiment of the present application is used in a packaging structure, the heat sink body can be fixed to the device to be dissipated in the packaging structure through the vertical arm, so that the heat on the device can be conducted to the heat sink plate through the vertical arm, and the heat sink body can quickly dissipate heat when the air duct is ventilated, so as to achieve heat dissipation of the device by the heat sink. The heat sink of the embodiment of the present application can achieve heat dissipation of the device by direct contact between the vertical arm and the device, and the thermal resistance between the two is small, and its heat dissipation performance is good. In addition, the structure of the heat sink is relatively simple, which is conducive to the miniaturization design of the heat sink.

[0007] In one possible implementation of the present application, the heat sink body may further include a connection portion disposed at the end of the vertical arm away from the heat sink. In this implementation, when there are two or more vertical arms, the vertical arms can provide stable support for the heat sink. Furthermore, since the heat sink contacts the device via the connection portion disposed on the vertical arms, the vertical arms serve as channels for heat conduction between the heat sink and the device. Therefore, providing multiple vertical arms can increase the number of heat conduction channels between the heat sink and the device, thereby improving the heat conduction efficiency between the two and accelerating heat dissipation.

[0008] In a possible implementation of the present application, the connecting portion, the heat sink and the vertical arm can be configured as an integrally formed structure, and the connecting portion is formed by bending the end of the vertical arm away from the heat sink. This can effectively simplify the structure of the radiator.

[0009] In addition, the connecting portion can also be set as a solder pad extending from the vertical arm, so that the connecting portion can be connected to the metal surface of the device to be cooled by welding, so as to reduce the thermal resistance between the radiator and the device to be cooled, thereby improving the heat conduction efficiency between the two.

[0010] Because heat sinks deform when heated, they can generate stress between the heat sink and the device. To prevent this stress from acting on the device and causing damage, one possible implementation of this application can create a gap between two adjacent vertical arms, thereby reducing the stress between the heat sink and the device through deformation of the arms. Furthermore, an air duct can be formed in the gap between two adjacent vertical arms.

[0011] In a possible implementation of the present application, when forming the air duct of the radiator, the radiator body can also be set as a hollow structure, so that the cavity of the hollow structure can be used as the air duct, thereby further simplifying the radiator structure.

[0012] In addition to the above-mentioned setting position of the connection part, in a possible implementation of the present application, the connection part can also be set on a side surface of the heat sink away from the vertical arm, so that the heat can be conducted to the vertical arm through the heat sink for heat dissipation.

[0013] In a possible implementation of the present application, the projection of the connecting portion on the heat sink can also be made to fall within the contour of the heat sink, which can make the structure of the heat sink more compact and help reduce the space occupied by the heat sink.

[0014] In addition, in the present application, the heat sink body can be made of, but is not limited to, metals with good thermal conductivity such as copper, silver or gold, or alloys with good thermal conductivity, or materials with a coating with good thermal conductivity.

[0015] On the second aspect, the embodiment of the present application further provides a packaging structure, which may include a device to be cooled, and a heat sink of the first aspect, which may be fixedly connected to the device. The device to be cooled in the packaging structure may be, but is not limited to, a chip, an insulated gate bipolar transistor, or other common high-power semiconductor devices. The packaging structure of the embodiment of the present application is relatively simple in structure, which is conducive to the miniaturization design of the packaging structure. In addition, since the thermal resistance between the heat sink and the device is small in the packaging structure of the embodiment of the present application, effective heat dissipation of the device can be achieved.

[0016] In a possible implementation of the present application, in order to achieve the connection between the radiator and the device, a soldering pad can be provided on the device, so that the vertical arm of the radiator can be welded to the soldering pad to achieve the fixation of the radiator and the device. In this embodiment, the structure of the packaging structure can be effectively simplified by welding the radiator to the soldering pad on the device. Among them, the radiator and the device can be welded by any welding process such as reflow soldering, diffusion soldering, ultrasonic welding or laser welding, etc., but not limited to, to improve the structural stability of the packaging structure. By connecting the radiator and the device by welding, the thermal resistance between the two can be effectively reduced, which is conducive to improving the heat dissipation efficiency of the radiator to the device. In addition, the connection between the radiator and the device by welding can also effectively simplify the difficulty of process control, reduce costs, and simplify the packaging structure composed of the radiator and the device.

[0017] In one possible implementation of the present application, when specifically arranging the solder pads of the device, the solder pads may be an integral structure, so that the connecting portion of the heat sink can be soldered to the solder pads. In other implementations of the present application, the number of solder pads can be the same as the number of arms of the heat sink, so that the arms and solder pads are soldered in a one-to-one correspondence. This can prevent stress problems caused by large-area soldering and facilitate the alignment of the heat sink position by utilizing the surface tension of the solder.

[0018] In addition to the aforementioned connection method of soldering the heat sink to the device's pads, in another possible implementation of the present application, the device may also include a substrate. In this case, the heat generated by the device can be transferred to the heat sink through the substrate by connecting the vertical arms of the heat sink to the substrate. The heat sink can also be fixed to the substrate by soldering. In this implementation, since no additional pads are provided on the device, the structure of the packaging structure can be effectively simplified.

[0019] The number of heat sinks installed on a device in a packaged structure can be adjusted based on its specific heat dissipation requirements. In one possible implementation of the present application, only one heat sink can be installed on the device, and the position of the heat sink can be adjusted based on the portion of the device used to connect to the heat sink. For example, the heat sink can be installed on one side of the device, and the projection of the heat sink on the device falls within the device's outline. In addition, the size of the heat sink can be increased so that the projection of the heat sink on the device exceeds the device's outline, thereby increasing the heat dissipation area of ​​the heat sink and improving its heat dissipation performance.

[0020] In another possible implementation of the present application, the device may be provided with multiple heat sinks, with adjacent heat sinks spaced apart. In this way, in addition to the air ducts of the two heat sinks, the gap between the two heat sinks can also be used as an air duct, thereby increasing the heat dissipation channel. Furthermore, by providing two or more heat sinks on the device, the number of connecting portions connected to the device can be increased, thereby facilitating rapid heat transfer from the multiple connecting portions to the heat sink body. Furthermore, this also helps to increase the heat dissipation area, thereby improving heat dissipation efficiency.

[0021] When two or more heat sinks are placed on a device, the projections of each heat sink on the device can be positioned within the device's outline. In other implementations, the projections of some heat sinks on the device can be positioned within the device's outline, while at least one side of the projections of some other heat sinks can extend beyond the device's outline. Alternatively, at least one side of the projection of each heat sink on the device can extend beyond the device's outline. This can further increase the heat dissipation area of ​​the heat sink, thereby improving heat dissipation efficiency.

[0022] In a third aspect, an embodiment of the present application further provides an electronic device, which may include a printed circuit board and the packaging structure of the second aspect, wherein the packaging structure is electrically connected to the printed circuit board to implement the function of the packaging structure.

[0023] In the electronic device of the embodiment of the present application, the packaging structure has good heat dissipation performance, thus the electronic device has good heat dissipation performance. In addition, due to the small size of the packaging structure, it can facilitate the miniaturization and thinness of the electronic device. Moreover, because the packaging structure occupies less space in the electronic device, it can be provided with more functional modules, thereby facilitating the integration of more functions in the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic structural diagram of a radiator provided in one embodiment of the present application;

[0025] Figure 2 A schematic diagram of a production process for a heat sink provided in one embodiment of the present application;

[0026] Figure 3 A schematic structural diagram of a radiator provided in another embodiment of the present application;

[0027] Figure 4 A schematic diagram of a production process for a heat sink provided in another embodiment of the present application;

[0028] Figure 5 A schematic diagram of the packaging structure provided in one embodiment of the present application;

[0029] Figure 6 A side view of a device provided in one embodiment of the present application;

[0030] Figure 7 A top view of a device provided in one embodiment of the present application;

[0031] Figure 8 A top view of a packaging structure provided in one embodiment of the present application;

[0032] Figure 9 A side view of a packaging structure provided in one embodiment of the present application;

[0033] Figure 10 A schematic diagram of a packaging structure provided in another embodiment of the present application;

[0034] Figure 11 A top view of a packaging structure provided in another embodiment of the present application;

[0035] Figure 12 A side view of a packaging structure provided by another embodiment of the present application;

[0036] Figure 13 A schematic diagram of a packaging structure provided in another embodiment of the present application;

[0037] Figure 14 A top view of a packaging structure provided in another embodiment of the present application;

[0038] Figure 15 A side view of a packaging structure provided by another embodiment of the present application;

[0039] Figure 16 A schematic diagram of a packaging structure provided in another embodiment of the present application;

[0040] Figure 17 A top view of a packaging structure provided in another embodiment of the present application;

[0041] Figure 18 A side view of a packaging structure provided in another embodiment of the present application.

[0042] Reference numerals:

[0043] 1- Radiator; 101- Radiator body; 1011- Heat sink; 1012- Arm; 1013- Connection; 102- Air duct; 103- Cutout; 2- Metal sheet; 201- Bending line; 202- Heat sink area; 203- Arm area; 204- Connection area;

[0044] 3-device; 301-pad; 4-packaging structure. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0046] The terms used in the following embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification of the present application and the appended claims, the singular expressions "a", "a", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" refer to one, two or more. The term "and / or" is used to describe the association relationship of associated objects, indicating that three relationships can exist; for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship.

[0047] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0048] First, let me explain the application scenarios of heat sinks. With the development of current electronic devices, there are more and more high-power devices in electronic devices, such as metal-oxide-semiconductor field-effect transistors (MOSFET) and gallium nitride high electron mobility transistors (GaN) and other surface mount power devices. Since surface mount power devices will generate power loss, resulting in temperature increase, the requirements for heat sinks are also getting higher and higher, so corresponding heat dissipation measures are needed to control the temperature of power devices to prevent the power devices from failing due to excessive temperature. In addition, as current electronic devices develop towards miniaturization and integration, the space left for heat dissipation components is getting smaller and smaller, so the heat dissipation capacity of high-power semiconductor devices at high power density needs to be improved urgently.

[0049] The core heat-generating component of power devices is the bare die, and different packaging forms can allow the heat on the bare die to be dissipated through different paths. Currently, the typical packaging forms of surface mount power devices are bottom heat dissipation and top heat dissipation. Among them, the thermal resistance from the bare die to the bottom heat dissipation pad of the bottom heat dissipation power device is relatively small. After the power device is soldered to the printed circuit board (PCB), the heat is mainly transferred from the bottom heat dissipation channel to the PCB, and then diffuses on the PCB, relying on the heat dissipation capacity of the PCB itself to achieve temperature reduction. In addition, welded bus bars or heat sinks can be added to other places on the PCB to help enhance the heat dissipation capacity of the PCB. However, due to the large thermal resistance of the PCB itself, when the heat consumption of the power device is relatively large, the bottom heat dissipation solution may be difficult to achieve the goal of temperature management.

[0050] Traditional top-side cooling power devices offer low thermal resistance from the die to the top heatsink pad. After the device is soldered to the PCB, a heat sink is required to dissipate heat. This specialized heat sink provides superior heat dissipation compared to bottom-side cooling packages, making top-side cooling a common solution for high-power semiconductor devices.

[0051] However, existing heat sinks are typically made of aluminum profiles. When placing a heat sink on a power device, a flexible thermally conductive material is placed between the device's top heat sink pad and the heat sink. The heat sink is then secured to the PCB using fasteners such as screws, pressing the heat sink against the flexible thermally conductive material. This flexible thermally conductive material can be thermally conductive silicone, thermally conductive grease, thermally conductive pads, thermally conductive gel, or the like. Typically, multiple power devices are clustered together on a PCB, all requiring heat dissipation. Therefore, a larger heat sink is constructed from aluminum profiles to directly cover all of the power devices. Given the varying circuit nodes on the top heat sink pads of different power devices, short-circuiting through the aluminum profile heat sink is undesirable. Therefore, each power device is typically connected to the heat sink through an insulating flexible thermally conductive material. Commonly used insulating flexible thermally conductive materials, such as thermally conductive gel, require a relatively thick material thickness to ensure dielectric strength. Furthermore, to accommodate the height tolerances of the multiple power devices and the surface flatness tolerances of the aluminum profile heat sink, a thicker insulating flexible thermally conductive material is also required to achieve contact. It is understandable that an insulating flexible thermally conductive material that is too thick will introduce a large thermal resistance, thereby failing to meet the heat dissipation requirements of power devices with higher power consumption.

[0052] The heat sink provided in the embodiments of this application is primarily designed for power devices using top-mounted heat dissipation packaging. It can be used, but is not limited to, to dissipate heat for chips, insulated gate bipolar transistors (IGBTs), or other common high-power semiconductor devices, and exhibits excellent heat dissipation performance. For ease of description, the high-power semiconductor devices are referred to as "devices" in the various embodiments of this application. The heat sink provided in the embodiments of this application is now described in detail with reference to the accompanying drawings.

[0053] Reference Figure 1 The embodiment of the present application provides a radiator 1, which may include a radiator body 101 and an air duct 102. The radiator body 101 may include a heat sink 1011 and an arm 1012. The arm 1012 is fixed to the heat sink 1011, and the end of the arm 1012 away from the heat sink 1011 may be connected to a device to be cooled. There are many ways to arrange the arm 1012 on the heat sink 1011, for example, Figure 1As shown, it is arranged in the edge area of ​​the heat sink 1011; in other possible embodiments, it can also be arranged in the middle area of ​​the heat sink 1011, or at any position of the heat sink 1011, as long as it can support the heat sink 1011. In the embodiment of the present application, the number of vertical arms 1012 is not specifically limited. For example, the vertical arms 1012 can be two, three, four or more. It can be understood that the vertical arms 1012 can serve as a heat transfer channel between the radiator 1 and the device to be radiated. The more vertical arms 1012 are arranged, the more heat transfer channels there are between the radiator 1 and the device to be radiated, the faster the heat transfer speed, and the larger the area of ​​the heat sink 1011, thereby effectively improving the heat dissipation performance of the radiator 1, which is beneficial to improving the heat dissipation effect of the radiator 1 on the device.

[0054] In addition, a certain gap may be provided between two adjacent vertical arms 1012 to avoid the risk of damage to mechanically stress-sensitive devices (such as GaN devices) due to stress caused by different materials and inconsistent thermal expansion coefficients when the vertical arms 1012 are fixed to the device to be heat-dissipated by welding.

[0055] When setting up the air duct 102, continue to refer to Figure 1 The radiator body 101 can be configured as a hollow structure surrounded by a heat sink 1011 and vertical arms 1012, with the cavity of the hollow structure serving as the air duct 102. In this embodiment, the vertical arms 1012 can be positioned on either side of the air duct 102. Furthermore, the vertical arms 1012 can be positioned at the edge of the heat sink 1011 to maximize the space of the air duct 102, thereby effectively improving the heat dissipation performance of the radiator 1. In some possible embodiments of the present application, the air duct 102 can also be formed between the vertical arms 1012, as long as the radiator 1 can achieve the desired heat dissipation and ventilation effect.

[0056] In addition to the above structure, in some embodiments of the present application, the radiator 1 may further include a connecting portion 1013, which is disposed at the end of the vertical arm 1012 away from the heat sink 1011. In this embodiment, the heat sink 1011, vertical arm 1012, and connecting portion 1013 may be formed as an integral structure, with the connecting portion 1013 being formed by bending the end of the vertical arm 1012 away from the heat sink 1011, thereby effectively simplifying the structure of the radiator 1. Furthermore, the projection of the connecting portion 1013 toward the heat sink 1011 may be located within the outline of the heat sink 1011, which facilitates the miniaturization of the radiator 1.

[0057] In addition to being provided on the vertical arm 1012, in some possible embodiments, the connecting portion 1013 may also be provided on a surface of the heat sink 1011 away from the vertical arm 1012. This allows the heat generated by the device to be cooled to be conducted to the vertical arm 1012 via the heat sink 1011 to achieve heat dissipation.

[0058] In other embodiments of the present application, in order to achieve better heat dissipation performance for the heat sink 1, the selection of the material for the heat sink 1 is also important. The heat sink 1 in the embodiment of the present application can be made of metal, alloy, or material with a metal coating. For example, the heat sink 1 can be made of copper, which can make the heat sink 1 have a higher thermal conductivity and facilitate the welding of the heat sink 1. In addition, the heat sink 1 can also be made of metals such as gold and silver to achieve better thermal conductivity of the heat sink 1.

[0059] In order to further understand the structure of the radiator 1 of the embodiment of the present application, the following describes a method for processing the radiator 1 of an embodiment. The method may be: first, referring to Figure 2 , flatten a metal sheet 2 (such as a copper sheet, etc.), and cut the metal sheet 2 to form a cutout 103, wherein the number of the cutout 103 is greater than or equal to 1, so that the formed heat sink 1 has two or more vertical arms 1012 (see Figure 3 ).

[0060] Then, the metal sheet 2 is bent. According to the design size requirements of the radiator 1, the cut metal sheet 2 is bent to form Figure 3 The heat sink 1011 and the vertical arm 1012 of the radiator body 101 are shown, and the cavity between the heat sink 1011 and the vertical arm 1012 forms the air duct 102. In addition, in the embodiment of the application, the cross-sectional shape of the radiator body 101 can be but is not limited to Figure 3 The notched rectangle shown in .

[0061] In some other embodiments of the present application, before cutting the metal sheet 2 to form the cutouts 103, the metal sheet 2 may be divided into regions. Figure 2 The metal sheet 2 is divided into an arm region 203 and a heat sink region 202 along one of its extension directions (the extension direction is consistent with the cutting direction of the incision 103) through a bending line 201, wherein the arm region 203 is located on both sides of the heat sink region 202. In this way, after the metal sheet 2 is cut, it can be bent along the bending line 201.

[0062] In addition, after the metal sheet 2 is divided into regions by the bending lines 201, when the metal sheet 2 is cut, the cutting depth of the cut 103 can be set according to the stress sensitivity of the device to be dissipated. For example, for stress-sensitive devices, the cutting depth of the cut 103 can be larger, for example, Figure 2 In the embodiment shown, the cutout 103 can be made to pass through the vertical arm area 203. In other embodiments, the cutout 103 can also be made to cut into the heat sink area 202. For stress-insensitive devices, refer to Figure 4 , the cutting depth of the incision 103 can be made smaller.

[0063] In some embodiments of the present application, in order to facilitate the connection between the vertical arm 1012 and the device to be cooled, when the metal sheet 2 is bent, reference is made to Figure 3 The end of the vertical arm 1012 is bent to form a connecting portion 1013. It can be understood that when the metal sheet 2 is divided into regions by the bending line 201, the reference Figure 2 or Figure 4 The end of the vertical arm area 203 away from the heat dissipation plate area 202 can be further divided into a connecting area 204, so that the vertical arm area 203 and the connecting area 204 can be bent along the bending line 201 to form Figure 3 The connection portion 1013 in the embodiment of the present invention.

[0064] Furthermore, in the embodiment of the present application, when the vertical arms 1012 and the connecting portion 1013 are bent, the bending direction of the vertical arm region 203 relative to the heat sink region 202 can be aligned with the bending direction of the connecting portion region 204 relative to the vertical arm region 203. This allows the heat sink 1 to occupy a smaller area, making it easier to install in a narrow space.

[0065] Because the heat sink 1 of the above embodiment is manufactured primarily through the steps of cutting and bending, its manufacturing cost is relatively low. Furthermore, the heat sink 1 is constructed from a single metal sheet 2, resulting in a relatively simple structure. This allows for improved heat dissipation performance while also enabling a compact design to meet the requirements of electronic device installation.

[0066] It is understandable that the above embodiments are merely illustrative of the structure and processing method of the radiator 1 of the present application. In some embodiments of the present application, the radiator 1 may also be a block structure, with a plurality of through holes provided on the radiator body 101 to serve as the air duct 102. In this case, the connection portion may be provided on the side of the radiator body 101 that is not passed through by the air duct 102. In this embodiment, when forming the radiator 1, the metal may be processed by engraving or other methods to form the air duct 102. Alternatively, in some other embodiments of the present application, the radiator 1 may also be formed by welding or bonding, and the structure of the radiator 1 formed is similar and will not be described in detail here.

[0067] Reference Figure 5 When the heat sink 1 of the embodiment of the present application is set on the device 3 to be dissipated to form a packaging structure 4, the heat sink 1 is taken as an arched structure including a heat sink 1011 and a vertical arm 1012 as an example to illustrate the arrangement of the heat sink 1 on the device 3. Figure 5 The end of the vertical arm 1012 of the heat sink 1 away from the heat sink 1011 can be fixed to the device 3. The heat sink 1 and the device 3 can be welded by any welding process such as, but not limited to, reflow welding, diffusion welding, ultrasonic welding or laser welding.

[0068] Reference Figure 6 , usually, the device 3 can be a flat structure. Figure 7 The surface of the device 3 used to mount the heat sink 1 has a soldering pad 301. When specifically positioning the soldering pad 301 of the device 3, the soldering pad 301 can be an integral structure, so that each arm 1012 of the heat sink 1 can be soldered to the soldering pad 301. In some embodiments of the present application, the number of soldering pads 301 can be the same as the number of arms 1012 of the heat sink 1, so that the arms 1012 are soldered to the soldering pads 301 in a one-to-one correspondence. This prevents stress issues caused by large-area soldering and facilitates alignment of the heat sink using the surface tension of the solder.

[0069] Continue to refer to Figure 5 By connecting the heat sink 1 and the device 3 by welding, the thermal resistance between the two can be effectively reduced, thereby improving the heat dissipation efficiency of the heat sink 1 for the device 3. In addition, connecting the heat sink 1 and the device 3 by welding can also effectively simplify the process control difficulty, reduce costs, and simplify the packaging structure 4 formed by the heat sink 1 and the device 3.

[0070] When the heat sink 1 is specifically set on the device 3, the setting position of the heat sink 1 on the device 3 can be adjusted according to the part of the device 3 used to connect with the heat sink 1. Figure 8 and Figure 9 , the heat sink 1 is arranged on one side of the device 3 and falls within the outline of the device 3. In other embodiments, in order to meet the heat dissipation requirements of the device 3, the size of the heat sink 1 can also be adjusted. It can adjust the three dimensions of the height, width and length of the heat sink 1, or only adjust one or two of them. It is understandable that the specific adjustment method of the size of the heat sink 1 also depends on the constraints of the installation space in the electronic device. For example, in one possible embodiment of the present application, refer to Figure 10 and Figure 11 , the length and width of the heat sink 1 can be adjusted, and the direction of placing the heat sink 1 on the device 3 can be referred to. Figure 12 , so that the edge of the heat sink 1 exceeds the edge of the device 3. As a result, the heat sink 1 has a larger heat dissipation plate 1011 area, and its heat dissipation performance is further improved to meet the heat dissipation requirements of the device 3 with higher power consumption.

[0071] In some other embodiments of the present invention, multiple heat sinks 1 can be set on one device 3 at the same time. Figure 13 For example, placing two heat sinks 1 on a device 3 allows for a certain gap between the two heat sinks 1. This allows for a larger gap between the two heat sinks 1, in addition to the arched air ducts 102 of the two heat sinks 1, thereby increasing the heat dissipation channels. Furthermore, by placing two or more heat sinks 1 on a device 3, the number of arms 1012 connected to the device 3 can be increased, thereby facilitating faster heat transfer from the multiple arms 1012 to the heat sink 1's heat plate 1011. This also increases the heat dissipation area, thereby improving heat dissipation efficiency.

[0072] exist Figures 13 to 15 In the embodiment shown, the two heat sinks 1 provided on the device 3 are both within the edge range of the device 3. In other embodiments of the present application, when the space reserved for the heat sink 1 in the electronic device is large, two or more heat sinks 1 can be provided on the device 3, and the size of all or part of the heat sink 1 can be increased to improve its heat dissipation performance. Figures 16 to 18 ,exist Figures 16 to 18 In the illustrated embodiment, two heat sinks 1 are still provided on the device 3 as an example. When the two heat sinks 1 are provided, at least one side of each of them exceeds the edge of the device 3 .

[0073] In addition to the aforementioned method of providing a solder pad 301 on the surface of the device 3 and soldering the heat sink 1 to the solder pad 301 to form the package structure 4 of the heat sink 1 and the device 3, in other embodiments of the present application, the device 3 may include a substrate. In such an embodiment, the heat sink 1 may be directly connected to the substrate by soldering or other methods to form the package structure 4. This simplifies the structure of the package structure 4, which facilitates the miniaturization of the package structure 4.

[0074] An embodiment of the present application provides an electronic device, which may include the packaging structure of any of the above embodiments and a printed circuit board, wherein the packaging structure is electrically connected to the printed circuit board to implement the function of the packaging structure.

[0075] In the electronic device of the embodiment of the present application, the packaging structure has good heat dissipation performance, so the heat dissipation performance of the electronic device is good. In addition, since the volume of the packaging structure is small, this can be conducive to the miniaturization and thinness design of the electronic device. Moreover, since the packaging structure occupies less space in the electronic device, more functional modules can be set in the electronic device to facilitate the integration of more functions in the electronic device. It is understandable that the electronic device provided in the embodiment of the present application can be, but is not limited to, terminal devices such as smart phones, smart TVs, smart TV set-top boxes, personal computers (personal computers, PCs), wearable devices, smart broadband, or telecommunications equipment such as wireless networks, fixed networks, servers, and electronic devices such as chip modules and memories, which are not listed here one by one.

[0076] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A radiator, characterized in that: include: Radiator body and air duct, including: The radiator body comprises a radiating plate and two or more vertical arms, and two adjacent vertical arms are arranged at intervals; One end of the vertical arm is fixed to the heat sink, and the other end is used to connect to the device to be cooled and conduct the heat generated by the device to the heat sink; The air duct is used to ventilate the radiator body; The radiator further comprises a connecting portion, which is arranged at an end of the vertical arm away from the heat dissipation plate; The connecting portion is formed by bending one end of the vertical arm away from the heat sink, and two adjacent connecting portions are arranged at intervals; The device to be cooled is a surface mount power device; the connecting portion is used to connect to the device to be cooled.

2. The heat sink according to claim 1, characterized in that The radiator body is a hollow structure formed by the heat dissipation plate and the vertical arms, and the cavity of the hollow structure forms the air duct.

3. The heat sink according to claim 1, characterized in that The connecting portion, the heat sink and the vertical arm are an integrally formed structure, and the connecting portion is formed by bending one end of the vertical arm away from the heat sink.

4. The radiator according to claim 1 or 3, characterized in that: The connecting portion is a pad extending from the vertical arm, and the pad is welded to the metal surface of the device to be cooled.

5. The radiator according to any one of claims 2 to 4, characterized in that: The projection of the connecting portion on the heat sink falls within the contour range of the heat sink.

6. A packaging structure, characterized in that: include: A device, and a radiator as claimed in any one of claims 1 to 5, wherein the vertical arm of the radiator is fixedly connected to the device.

7. The packaging structure according to claim 6, characterized in that: The device has a soldering pad, and the vertical arm of the heat sink is soldered to the soldering pad.

8. The packaging structure according to claim 7, characterized in that: The soldering pad is an integrated structure; or, the soldering pad and the vertical arm are arranged in a one-to-one correspondence.

9. The packaging structure according to claim 6, characterized in that: The device comprises a base plate, and the vertical arm is fixedly connected to the base plate.

10. The packaging structure according to any one of claims 6 to 9, characterized in that: The device is provided with a heat sink, and the projection of the heat sink on the device falls within the contour range of the device; or the projection of the heat sink on the device exceeds the contour range of the device.

11. The packaging structure according to any one of claims 6 to 9, characterized in that: The device is provided with two or more heat sinks, and two adjacent heat sinks are arranged at intervals.

12. The packaging structure according to claim 11, characterized in that: The projections of the heat sinks on the device all fall within the contour range of the device; or, the projections of some of the heat sinks on the device fall within the contour range of the device, and at least one side of the projections of some of the heat sinks on the device exceeds the contour range of the device; or, at least one side of the projection of each of the heat sinks on the device exceeds the contour range of the device.

13. An electronic device, characterized in that: include: A printed circuit board, and a packaging structure as claimed in any one of claims 6 to 12, wherein the packaging structure is electrically connected to the printed circuit board.

Images