An electromagnetic relay and relay device that can be immersed in a liquid cooling environment

Abstract

This invention discloses an electromagnetic relay and relay device that can be immersed in a liquid-cooled environment. The electromagnetic relay includes a housing portion and a plurality of leads passing through the housing portion; it also includes a sealing member disposed in the housing portion, and the sealing member at least surrounds the plurality of leads, or there are several sealing members, each sealing member surrounding at least one lead; the sealing member protrudes from the end of the housing portion where the leads are located, and the protruding end of the sealing member is used for sealing engagement with a PCB board to which the plurality of leads are connected, so that a sealed cavity is formed between the housing portion and the PCB board, encompassing the joint between the leads and the housing portion. When this invention is applied in a liquid environment in conjunction with a PCB board, it can prevent liquid from seeping into the interior of the electromagnetic relay from the joint between the leads and the housing portion, thus making this invention suitable for immersion in a liquid-cooled environment.

Description

Technical Field

[0001] This invention relates to a relay, and more particularly to an electromagnetic relay and relay device that can be immersed in a liquid-cooled environment. Background Technology

[0002] Power supplies are the power source for all electronic products. They come in many types and have wide applications. In today's new era of high efficiency, energy saving, environmental protection, and continuous innovation, higher demands are placed on the performance of power supplies and complete equipment. Traditional power supplies and complete equipment operate in indoor or outdoor environments. To reduce power consumption and improve operating efficiency, circuit design is optimized from the outset, using low-power electronic components and installing cooling fans. However, for equipment with power supplies that need to operate continuously, such as data center server systems, operating noise, heat generation, and equipment failure rates increase accordingly, resulting in low overall energy efficiency. This still fails to meet the requirements of high efficiency, energy saving, and environmental protection. Therefore, liquid cooling has been proposed as a solution.

[0003] Employing liquid cooling, especially flowing liquid cooling, can significantly reduce equipment wear and tear, improve operating efficiency, and align with energy conservation and environmental protection principles. Immersion liquid cooling improves heat dissipation design by directly submerging the entire unit in an insulating liquid (which will not cause short circuits). Heat generated by the electronic components inside the power supply is directly and efficiently transferred to the liquid, reducing the need for active cooling components such as thermal interface materials, heat sinks, and fans. These improvements increase energy efficiency and allow for higher packaging density. The implementation of immersion liquid cooling for power supplies also provides strong support for improving the energy efficiency, reducing failure rates, lowering data center noise, and reducing maintenance costs of other power supply-related equipment, such as data center servers.

[0004] Directly immersing a power supply in a liquid allows its components, including electromagnetic relays, resistors, inductors, power semiconductors, rectifier bridges, transformers, and current transformers, to operate at the same capacity as in the atmosphere due to the liquid's high insulation and heat dissipation properties. This also enhances heat dissipation and increases power density. However, for mechanically actuated switching devices like electromagnetic relays, prolonged immersion in liquids necessitates preventing liquid infiltration. Otherwise, the liquid may cause poor contact and delayed operation, potentially leading to power supply malfunction. Practical verification shows that some non-mechanically actuated devices, such as resistors, power semiconductors, inductors, and transformers, are unaffected by liquid resistance and can operate normally in liquids using standard encapsulation methods. However, during conventional electromagnetic relay soldering (wave soldering, reflow soldering, etc.), the sealant at the junction of the relay leads and the housing can melt due to heat, potentially creating tiny gaps and resulting in a poor seal. Therefore, prolonged immersion of electromagnetic relays in a liquid-cooled environment carries the risk of liquid infiltration. When liquid enters the electromagnetic relay, the liquid resistance will directly affect the contact, operation, and release of the electromagnetic relay, thereby affecting the normal operation of the power supply. Summary of the Invention

[0005] This invention addresses the technical problems existing in the prior art by providing an electromagnetic relay and relay device that can be immersed in a liquid-cooled environment, which can meet the requirements of long-term immersion in a liquid-cooled environment.

[0006] The technical solution adopted by the present invention to solve its technical problem is: an electromagnetic relay that can be immersed in a liquid-cooled environment, including a housing part and a plurality of leads passing through the housing part; it also includes a sealing member, which is disposed in the housing part and at least surrounds the plurality of leads, or the number of sealing members is a plurality, and each sealing member surrounds at least one lead; the sealing member protrudes from the end of the housing part where the leads are disposed, and the protruding end of the sealing member is used for sealing and engaging with the PCB board to which the plurality of leads are connected, so that a sealed cavity is formed between the housing part and the PCB board, which encloses the joint between the leads and the housing part.

[0007] The housing portion includes a first component and a second component. The first component is an outer shell with an opening at one end. The second component is disposed at the opening of the outer shell, and the plurality of leads are respectively inserted through the second component. The sealing member is disposed on the outer shell and surrounds the second component and the plurality of leads, so that after the sealing member is sealed and fitted with the PCB board, a joint portion is formed between the housing portion and the PCB board, which encompasses the periphery of the outer shell and the second component, as well as a sealing cavity for the joint portion between the second component and each lead.

[0008] Furthermore, the seal has a frame-shaped structure that is closed on all four sides.

[0009] Furthermore, the seal and the housing are integrally molded as a single structure through insert injection molding, or the seal and the housing are sealed together.

[0010] Furthermore, the bottom of the outer casing is provided with a frame-shaped fixing groove located around the second component, and the sealing element is sealed and embedded in the fixing groove.

[0011] Furthermore, the sealant is fixed to the perimeter of the fixing groove with adhesive.

[0012] Furthermore, the seal is polygonal or annular; the second component is a base plate, side plate, top plate, base, or cover.

[0013] Furthermore, the sealing element is a metal material that can be soldered to the PCB board, or the sealing element is a sealing ring that can be deformed by compression, so that the sealing ring can fit and seal with the PCB board by deforming.

[0014] Furthermore, the sealing element is a copper frame.

[0015] The present invention also provides a relay device, including a PCB board, and an electromagnetic relay as described above that can be immersed in a liquid-cooled environment. The plurality of leads are electrically connected to the PCB board, the sealing element is welded to the PCB board around its perimeter, and / or the sealing element is completely fitted and sealed to the PCB board around its perimeter, so that the sealed cavity is formed between the housing portion and the PCB board.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. Since the present invention also includes a sealing element disposed on the housing portion and surrounding the plurality of leads, or, the number of sealing elements is plurality, each sealing element surrounding at least one lead; the sealing element protrudes from the end of the housing portion where the lead is disposed, and the protruding end of the sealing element is used for sealing engagement with the PCB board to which the plurality of leads are connected, so that a sealed cavity is formed between the housing portion and the PCB board, encompassing the joint between the lead and the housing portion. Therefore, when the present invention is applied in liquid-cooled environment in conjunction with the PCB board, it can prevent liquid (referring to insulating liquid) from seeping into the interior of the electromagnetic relay from the joint between the lead and the housing portion, thereby making the present invention suitable for operation in a liquid-cooled environment.

[0018] 2. The housing portion includes the outer shell and the second component. The plurality of leads are respectively inserted into the second component. The sealing member is disposed on the outer shell and surrounds the second component and the plurality of leads. After the sealing member is sealed and fitted with the PCB board, a sealing cavity is formed between the housing portion and the PCB board to protect the joint between the outer shell and the second component, as well as the joint between the second component and each lead. Therefore, when the present invention is applied in liquid cooling environment in combination with the PCB board, it can also prevent liquid from seeping into the electromagnetic relay from the joint between the outer shell and the second component (where tiny gaps are easily formed when the adhesive around the outer shell and the second component is thin). This achieves an all-round sealing protection effect for the entire electromagnetic relay, allowing the electromagnetic relay to work normally when immersed in liquid cooling environment for a long time.

[0019] 3. The sealing element has a frame-shaped structure that is closed on all four sides, making the structure of the sealing element relatively simple, low in cost, and easy to install in the housing part.

[0020] 4. The seal and the housing are integrally molded as an insert, or the seal and the housing are sealed together, ensuring a tight seal. When the seal and housing are sealed together, the fixing groove makes the connection between them more convenient and reliable.

[0021] 5. The sealing element is a metal material that can be welded to the PCB board, or the sealing element is a sealing ring that can be deformed by compression, making the connection between the sealing element and the PCB board more convenient and reliable.

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments; however, the electromagnetic relay and relay device of the present invention that can be immersed in a liquid-cooled environment are not limited to the embodiments. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural schematic diagram of the present invention in Embodiment 1 (base facing upwards);

[0024] Figure 2 This is a three-dimensional structural schematic diagram of the copper frame of the present invention in Embodiment 1;

[0025] Figure 3 This is a three-dimensional structural schematic diagram of the outer shell of the present invention in Embodiment 1;

[0026] Figure 4 This is a front view of the present invention and the PCB board in the mating state according to Embodiment 1;

[0027] Figure 5 This is a three-dimensional structural schematic diagram of the present invention in Embodiment 2 (base facing upwards);

[0028] Figure 6This is a three-dimensional structural schematic diagram of the sealing ring of the present invention in Embodiment 2;

[0029] Figure 7 This is a three-dimensional structural schematic diagram of the outer shell of the present invention in Embodiment 2;

[0030] Figure 8 This is a front view (including auxiliary tooling or pressure block) of the present invention and the PCB board in the mating state in Embodiment 2;

[0031] Among them, 1. Outer shell, 11. Fixing groove, 111. Filling notch; 12. Bottom surface of outer shell, 2. Base plate, 3. Lead-out foot, 4. Copper frame, 41. Bottom surface of copper frame, 5. PCB board, 6 / 7. Solder, 8. Sealing ring, 9. Auxiliary tooling or pressure block. Detailed Implementation

[0032] Example 1

[0033] Please see Figures 1-4 As shown, an electromagnetic relay of the present invention, which can be immersed in a liquid-cooled environment, includes a housing portion, a plurality of leads 3 passing through the housing portion, and a hollow sealing member. The sealing member is disposed in the housing portion and surrounds the plurality of leads 3. The sealing member protrudes from the end of the housing portion where the leads 3 are disposed, and the protruding portion of the sealing member is used for sealing engagement with a PCB board to which the plurality of leads 3 are connected, so that a sealed cavity is formed between the housing portion and the PCB board, encompassing the joint between the leads 3 and the housing portion. In other embodiments, the number of sealing members is several, and each sealing member surrounds at least one lead, with each lead being surrounded by a corresponding sealing member. "Surrounding" means that one component surrounds another component; for example, the sealing member surrounds the lead.

[0034] In this embodiment, the housing portion includes a first component and a second component. The first component is a shell 1 with an opening at one end, and the second component seals the opening of the shell 1. A plurality of lead-out feet 3 are respectively inserted into the second component. A sealing member is disposed on the shell 1 and surrounds the second component and the plurality of lead-out feet 3, so that after the sealing member is sealed with the PCB board, a joint portion is formed between the housing portion and the PCB board, encompassing the shell 1 and the second component around its perimeter, as well as a sealing cavity for the joint portion between the second component and each lead-out foot 3. The end of the shell with the opening is the bottom end. The second component is specifically a bottom plate, but is not limited to this; it can also be a side plate, top plate, base, or cover, etc. For example, when the end of the shell with the opening is a side end of the shell, the second component can be a side plate, etc.; when the end of the shell with the opening is a top end, the second component can be a top plate, etc. In other embodiments, the housing portion includes a first component and a second component. The first component is an outer shell with an opening at one end, and the second component seals the opening of the outer shell. The plurality of lead-out feet are respectively inserted through the outer shell. The second component is a bottom plate, side plate, top plate, base, or cover, etc. The joint between the outer shell 1 and the periphery of the second component refers to the portion between the outer shell 1 and the periphery of the second component. The joint between the second component and each lead-out foot 3 refers to the portion of the second component through which the lead-out foot 3 passes and the portion between each lead-out foot.

[0035] In this embodiment, the sealing element is a frame-shaped structure that is closed on all four sides, and the sealing element is polygonal or annular. For example, the sealing element can be quadrilateral, triangular, circular, elliptical, etc.

[0036] In this embodiment, the sealing element is a metal material that can be soldered to the PCB board. Specifically, the sealing element is a copper frame 4, but it is not limited to this. The copper frame 4 is quadrilateral, but it is not limited to this. The sealing element (i.e., the copper frame 4) is sealed to the outer shell 1, but it is not limited to this. In other embodiments, the sealing element and the outer shell are integrally molded into a single structure through insert injection molding.

[0037] In this embodiment, the bottom end of the outer casing 1 is provided with a frame-shaped fixing groove 11 located around the base plate 2. The sealing element (i.e., the copper frame 4) is sealed and embedded in the fixing groove 11. Specifically, the sealing element (i.e., the copper frame 4) is fixed to the fixing groove 11 by applying adhesive around its perimeter. The fixing groove 11 has adhesive filling notches 111 around its perimeter, and these notches 111 are located on the inner sidewall of the fixing groove 11 near the base plate 1. In this way, not only can the copper frame 4 be prevented from falling off, but the gap between the copper frame 4 and the fixing groove 11 can also be effectively sealed using the sealing adhesive. After the copper frame 4 is installed, the bottom surface 41 of the copper frame protrudes from the bottom surface 12 of the outer casing.

[0038] This invention discloses an electromagnetic relay that can be immersed in a liquid-cooled environment. In application, it is used in conjunction with a PCB board. Specifically, several leads 3 of the electromagnetic relay (including a moving spring lead, a stationary spring lead, and a coil lead) are respectively soldered onto the PCB board 5 (each lead 3 passes through a corresponding soldering hole on the PCB board 5, and the soldering hole is filled with solder 6 to prevent liquid from passing through). The copper frame 4 protrudes from one end of the outer shell 1 and is completely fitted to the PCB board 5, and is fixed to the PCB board 5 by solder 7. Figure 4 As shown. Thus, the sealed cavity is formed between the housing and the PCB board 5. When the present invention, combined with the PCB board 5, is immersed in a liquid (referring to an insulating liquid), the liquid is blocked from the outside by the copper frame 4. Simultaneously, the sealed cavity protects the joints b around the outer shell 1 and the base plate 2, as well as the joints a between the base plate 2 and each lead-out pin 3, ensuring that the liquid can only flow outside the electromagnetic relay and cannot penetrate into the interior of the electromagnetic relay. Figure 4 As shown in the diagram, the arrows indicate the direction of liquid flow.

[0039] Please see Figures 1-4 As shown, a relay device of the present invention includes a PCB board 5 and an electromagnetic relay capable of being immersed in a liquid-cooled environment, as described in Embodiment 1 above. The plurality of leads 3 are electrically connected to the PCB board 5. The sealing element (i.e., the copper frame 4) is welded to the PCB board 5 around its perimeter, forming a sealed cavity between the housing and the PCB board 5. This ensures that when the present invention is applied in a liquid-cooled environment, the liquid (referring to insulating liquid) can only flow outside the electromagnetic relay and cannot penetrate into it. Specifically, the plurality of leads 3 are welded to the PCB board 5. The PCB board 5 has a plurality of welding holes that mate one-to-one with each lead 3. After each lead 3 passes through a corresponding welding hole, the gap between the lead 3 and the welding hole is filled with solder 6.

[0040] When this invention is applied to liquid-cooled power supplies, it can ensure the operation of immersion liquid-cooled power supplies, breaking away from the traditional form of liquid-cooled power supplies that can only rely on air cooling for heat dissipation, reducing the overall losses of the power supply and its accessories, and improving its operating efficiency.

[0041] Example 2

[0042] Please see Figures 5-8 As shown, the electromagnetic relay of the present invention, which can be immersed in a liquid-cooled environment, differs from the first embodiment described above in that: the sealing element is a sealing ring 8 that can be deformed by compression, so that the sealing ring 8 can adhere and seal with the PCB board through deformation. The sealing ring 8 is specifically made of rubber, but is not limited to this. The sealing ring 8 is annular, but is not limited to this.

[0043] In this embodiment, the bottom of the outer shell 1 is also provided with a frame-shaped fixing groove 11 located around the base plate 2. The sealing element (sealing ring 8) is sealed and embedded in the fixing groove 11. Specifically, the sealing ring 8 is fixed to the fixing groove 11 by applying adhesive around its perimeter. This not only prevents the sealing ring 8 from falling off, but also effectively seals the gap between the sealing ring 8 and the fixing groove 11 using the encapsulating adhesive. The fixing groove 11 is provided with glue-filling notches 111 around its perimeter, and these glue-filling notches 111 are located on the inner sidewall of the fixing groove 11 near the base plate 1. The fixing groove 11 is square, but since the sealing ring 8 is deformable, although the initial shape (ring) of the sealing ring 8 is not consistent with the fixing groove 11, it will not affect the sealing ring 8 being embedded in the fixing groove 11. After the sealing ring 8 is assembled, it also partially protrudes from the bottom surface 12 of the outer shell to facilitate sealing and mating with the PCB board 5.

[0044] This invention discloses an electromagnetic relay that can be immersed in a liquid-cooled environment. In application, it is used in conjunction with a PCB board 5. Specifically, each lead 3 (including the moving spring lead, the stationary spring lead, and the coil lead) passes through the corresponding solder holes on the PCB board 5, and the sealing ring 8 is in complete contact with the PCB board 5. At this time, pressure F is applied to the auxiliary fixture or pressure block 9 on the top of the electromagnetic relay, causing the sealing ring 8 to deform under pressure. Then, solder 6 fills the gaps between each lead 3 and the solder holes on the PCB board 5, preventing liquid from seeping in through the gaps between the lead 3 and the solder holes. Finally, the auxiliary fixture or pressure block 9 on the top of the electromagnetic relay is removed. At this point, each lead 3 of the electromagnetic relay is soldered onto the PCB board 5, and the sealing ring 8 has been compressed and cannot return to its pre-deformation state. The sealing ring 8 and the PCB board 5 are completely fitted together, forming a sealed cavity between the electromagnetic relay and the PCB board 5. Therefore, when the present invention is applied in a liquid-cooled environment, the liquid (referring to insulating liquid) is blocked outside the sealed cavity and cannot penetrate into the electromagnetic relay through the joint between the outer shell 1 and the base plate 2, and the joint between the base plate 2 and the lead-out pin 3.

[0045] Please see Figures 5-8 As shown, a relay device of the present invention includes a PCB board 5 and an electromagnetic relay capable of being immersed in a liquid-cooled environment as described in Embodiment 2 above. The plurality of leads 3 are respectively soldered to the PCB board 5. The sealing ring 8 is deformed by compression and completely adheres to the PCB board 5, forming a sealed cavity between the housing and the PCB board 5. Therefore, when the present invention is applied to a liquid environment, the liquid can only flow outside the electromagnetic relay and cannot penetrate into it, thus achieving a comprehensive sealing protection for the entire electromagnetic relay, enabling it to operate normally even when immersed in a liquid-cooled environment for extended periods.

[0046] The present invention provides an electromagnetic relay and relay device that can be immersed in a liquid-cooled environment. The parts not described herein are the same as or can be implemented using existing technologies.

[0047] The above embodiments are only used to further illustrate an electromagnetic relay and relay device that can be immersed in a liquid-cooled environment according to the present invention. However, the present invention is not limited to the embodiments. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. An electromagnetic relay that can be immersed in a liquid cooling environment, characterized in that: The electromagnetic relay includes a housing part, several lead-out pins passing through the housing part, and a seal provided on the housing part and sealingly fitted with a PCB board. When the electromagnetic relay is immersed in a liquid, the liquid is blocked outside by the housing part, the seal, and the PCB board and cannot penetrate into the interior of the electromagnetic relay; The housing part includes an outer shell as a first component with an opening at one end, and a bottom plate as a second component through which several lead-out pins pass respectively. The second component is arranged at the opening of the first component, and the opening end face of the first component is located outside the second component. There is a joint part between the periphery of the second component and the opening of the first component; The seal is arranged at the opening of the first component in a protruding structure, surrounding the joint part between the periphery of the second component and the first component, and the several lead-out pins passing through the second component. The protruding end of the seal is sealingly fitted with the PCB board connected to the several lead-out pins, so as to form a sealed cavity between the housing part and the PCB board that can accommodate the joint part between the second component and the first component, and the joint part between the lead-out pins and the second component.

2. The electromagnetic relay that can be immersed in a liquid cooling environment according to claim 1, characterized in that: The seal is in a frame-shaped structure with a closed perimeter.

3. The electromagnetic relay that can be immersed in a liquid cooling environment according to claim 2, characterized in that: The seal and the outer shell are integrally formed by insert injection molding; Alternatively, the seal and the outer shell are sealingly connected.

4. The electromagnetic relay that can be immersed in a liquid cooling environment according to claim 3, characterized in that: The end of the outer shell with an opening is provided with a frame-shaped fixing groove located outside the second component, and the seal is partially and sealingly embedded in the fixing groove.

5. The electromagnetic relay that can be immersed in a liquid cooling environment according to claim 4, characterized in that: The seal and the perimeter of the fixing groove are fixed by dispensing glue.

6. The electromagnetic relay that can be immersed in a liquid cooling environment according to any one of claims 1-5, characterized in that: The seal is made of a metal material that can be welded to the PCB board; Alternatively, the seal is a sealing ring that can be deformed by extrusion, so that the sealing ring can be deformed to fit and seal with the PCB board.

7. The electromagnetic relay that can be immersed in a liquid cooling environment according to claim 6, characterized in that: The seal is a copper frame.

8. The electromagnetic relay that can be immersed in a liquid cooling environment according to any one of claims 1-5, characterized in that: The seal is in a polygon or ring shape.

9. A relay device, including a PCB board; Characterized in that: It further includes an electromagnetic relay that can be immersed in a liquid cooling environment according to any one of claims 1-8; The several lead-out pins of the electromagnetic relay are respectively electrically connected to the PCB board; The periphery of the seal is welded to the PCB board, or the periphery of the seal is completely fitted and sealed with the PCB board, so as to form the sealed cavity between the housing part and the PCB board.

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