Optical image stabilization device, electronic device

Abstract

The present invention provides an optical image stabilization device and an electronic device that use a mobile image sensor chip for motion compensation, wherein the optical image stabilization device that use a mobile image sensor chip for motion compensation includes: an image sensor chip, a carrier, a contact component, a lower substrate, and a shape memory alloy drive component; wherein the image sensor chip is fixedly arranged on the carrier and electrically connected, and the carrier contacts the lower substrate through the contact component to be electrically connected to an external circuit; the image sensor chip moves in the X and Y directions and rotates in the plane under the drive of the shape memory alloy drive component to perform motion compensation. In the present invention, an image sensor chip is used for motion compensation, and the image sensor chip is electrically connected to the external circuit through the contact component, and the structure and process are simple, which improves the product yield, reduces the manufacturing cost, improves the reliability, and improves the image quality.

Description

Technical Field

[0001] The present invention relates to the field of image imaging technology, and in particular to an optical anti-shake device and electronic equipment that uses a mobile image sensor chip for motion compensation. Background Art

[0002] When a handheld portable smart device is used to take photos, the physiological tremor of the human body is unavoidable and cannot be overcome through training. As a result, the handheld portable smart device will inevitably shake along with the human body when taking photos, resulting in a decrease in image quality. The most obvious manifestation is that the image obtained is blurry and unclear.

[0003] Existing handheld portable smart devices use a lens assembly that can move in the XY axis direction in the camera module to compensate for the physiological tremor of the human body and obtain high-quality images. However, with the advancement of technology and the increasing pursuit of images by consumers, the camera module of existing handheld portable smart devices has become larger and heavier due to the increase in the size of the image sensor. The traditional method of moving the lens in the XY axis direction for compensation has become increasingly difficult to push the heavy lens. Moreover, the angle that can be compensated by the method of moving the lens in the XY axis direction for compensation can no longer meet customers' demand for image quality.

[0004] In the prior art, the optical image stabilization method provided by the movable photosensitive element has a relatively complex structure and requires multiple tiny precision mechanical structures in the image sensor module. Most of the applications are prone to problems such as low product yield, high cost, and high reliability risk. Summary of the invention

[0005] The purpose of the present invention is to provide an optical image stabilization device and an electronic device that use a mobile image sensor chip for motion compensation, so as to solve the technical problem that in the traditional technology, the lens is required to perform movement compensation in the XY axis direction, but the lens is heavy and difficult to push and has a large size, which makes it difficult to meet the compensation requirements for certain angles and is insufficient to meet the higher image quality requirements.

[0006] In order to solve the above technical problems, the present invention provides an optical image stabilization device using a mobile image sensor chip for motion compensation, comprising: an image sensor chip, a carrier board, a contact component, a lower substrate and a shape memory alloy driving component;

[0007] Wherein, the image sensor chip is fixedly arranged on the carrier and electrically connected, and the carrier contacts the lower substrate through a contact component to be electrically connected with an external circuit;

[0008] The image sensor chip is driven by the shape memory alloy driving component to move in the X and Y directions and rotate in a plane to perform motion compensation.

[0009] Preferably, the contact component is disposed on a carrier board, and the carrier board is fixed to and electrically connected to the image sensor chip.

[0010] Preferably, the carrier board is further provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit;

[0011] The circuit wiring unit is adapted to provide electrical connection between the image sensor chip and the capacitor unit and / or resistor unit and / or inductor unit and / or the auxiliary chip and the contact component, so as to be electrically connected to the circuit on the lower substrate.

[0012] Preferably, the carrier plate is further provided with: a rebound component;

[0013] The shape memory alloy driving component is suitable for deforming when powered on to drive the image sensor chip to move in the X and Y directions and rotate in a plane to perform motion compensation;

[0014] The rebound component is suitable for driving the image sensor chip to return to its original position through the rebound force when the shape memory alloy driving component is powered off.

[0015] Preferably, the shape memory alloy driving component comprises: a shape memory alloy wire, one end of which is electrically connected to the carrier board, and the other end of which is electrically connected to the lower substrate below the image sensor chip to be electrically connected to an external circuit; there are at least two shape memory alloy wires.

[0016] Preferably, the resilient component comprises: an inner mounting frame and a flexure;

[0017] The inner mounting frame is fixedly connected to the carrier board, the inner circle of the inner mounting frame is suitable for accommodating the image sensor chip, and the outer circle of the inner mounting frame is suitable for leading out the flexure;

[0018] The flexure is provided with a plurality of elastic cantilevers, the elastic cantilevers are fixedly connected to the outer fixing frame, and the image sensor chip is suitable for restoring an initial position under the action of the elastic cantilevers.

[0019] Preferably, the elastic cantilever is L-shaped and half surrounds the inner mounting frame.

[0020] Preferably, the shape memory alloy wire is suitable for being arranged on two sides of the image sensor chip, corresponding to the flexure.

[0021] Preferably, the capacitor unit is arranged around the chip.

[0022] Preferably, the capacitor unit includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the chip.

[0023] Preferably, the circuit wiring unit is further provided with electrical contact points, the electrical contact points correspond to the contact components, and the number of the contact points is less than the number of chip pads.

[0024] Preferably, the contact component is arranged below the image sensor chip, and comprises an elastic contact and a conductive rolling member, wherein the elastic contact is located between the electrical contact point and the conductive rolling member.

[0025] Preferably, the electrical contact point is a pad.

[0026] Preferably, the elastic contact is a flat spring sheet to improve the stability of the electrical contact of the contact component.

[0027] Preferably, the contact component is also suitable for being coated with a lubricant to improve the conductivity.

[0028] Preferably, a limiting structure is arranged outside the conductive rolling element to control the rolling element to move within the range of the limiting structure.

[0029] Preferably, the lateral distance of the limiting structure is greater than the diameter of the rolling component by more than 50 micrometers, thereby reducing or avoiding the contact between the rolling component and the areas on both sides of the limiting structure, thereby reducing friction.

[0030] Preferably, a magnetic component is further provided on the carrier, and the magnetic component generates an attractive force with the lower substrate of the image sensor chip to provide a contact force between the carrier, the contact component and the lower substrate.

[0031] Preferably, the image sensor chip is electrically connected to the carrier board by metal wire bonding or flip-chip bonding.

[0032] Preferably, the outer fixing frame is disposed on the lower substrate and is suitable for limiting the movement of the image sensor chip within a certain space.

[0033] Preferably, the displacement of the image sensor chip is fed back through a change in resistance of the shape memory alloy wire after power is supplied.

[0034] The technical solution of the present invention further provides an electronic device, comprising: the optical image stabilization device for performing motion compensation using a mobile image sensor chip as described above.

[0035] Compared with the prior art, the optical image stabilization device of the present invention using a mobile image sensor chip for motion compensation has the following beneficial effects:

[0036] The technical solution of the present invention adopts an image sensor chip for motion compensation. The image sensor chip is electrically connected to an external circuit through a contact component, has a simple structure and process, improves product yield, reduces manufacturing costs, improves reliability, and improves image quality.

[0037] Furthermore, in the technical solution provided by the present invention, the optical image stabilization device using a mobile image sensor chip for motion compensation is provided with a rolling element to realize electrical connection between the chip and the lower substrate during movement, and has a simple structure.

[0038] Furthermore, in the technical solution provided by the present invention, the optical image stabilization device that uses a mobile image sensor chip for motion compensation is merged in the carrier through circuits, thereby reducing the connection ports between the carrier and the lower substrate, thereby reducing the number of rolling parts between the carrier and the lower substrate, thereby simplifying the structure, reducing the volume, and facilitating assembly.

[0039] Furthermore, in the technical solution provided by the present invention, the optical image stabilization device that uses a mobile image sensor chip for motion compensation is provided with a magnetic component to increase the contact force between the image sensor chip and the lower substrate, thereby increasing stability.

[0040] Furthermore, in the technical solution provided by the present invention, the optical image stabilization device that uses a mobile image sensor chip for motion compensation uses a shape memory alloy wire to provide a driving force and an elastic flexure to provide a restoring force, and has a light and simple structure, a small size, and a low cost.

[0041] Furthermore, in the technical solution provided by the present invention, in the optical image stabilization device that uses a mobile image sensor chip for motion compensation, the chip displacement can be reflected by the resistance value of the shape memory alloy wire, and there is no need to set up a Hall feedback loop to feedback the displacement. The structure is simple, the size is small, and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figures 1 to 5 FIG. 1 is a schematic diagram of the structure of an optical image stabilization device that uses a mobile image sensor chip to perform motion compensation in one embodiment of the present invention. DETAILED DESCRIPTION

[0043] Many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present invention, so the present invention is not limited to the specific implementation disclosed below.

[0044] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the schematic diagrams are only examples and should not limit the scope of protection of the present invention.

[0045] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the optical image stabilization device of the image sensor of the present invention using a mobile image sensor chip for motion compensation is described in detail below with reference to the accompanying drawings.

[0046] The technical solution of the present invention provides an optical image stabilization device that uses a mobile image sensor chip for motion compensation, and uses the image sensor chip to translate on the XY axis and rotate around the optical axis of the image sensor chip to achieve the purpose of optical image stabilization compensation.

[0047] Specifically, the following combination Figures 1 to 5 The implementation method of this case is specifically described.

[0048] In an embodiment of the present invention, an optical image stabilization device using a mobile image sensor chip for motion compensation is provided, which includes: an image sensor chip 111, a lower substrate 200, a contact component 120 and a shape memory alloy driving component 300.

[0049] Specifically, refer to Figure 1 As shown, in this embodiment, the contact component 120 is disposed on the carrier 100 , and the carrier 100 and the image sensor chip 111 are fixed and electrically connected.

[0050] refer to Figure 1 As shown, the image sensor chip 111 contacts the lower substrate 200 through the contact component 120 to be electrically connected to the external circuit; when powered on, the image sensor chip 111 moves in the X and Y directions and rotates in the plane under the drive of the shape memory alloy driving component 300 to perform motion compensation.

[0051] Combined with the enlarged view of the local section Figure 2 As shown, in this embodiment, the shape memory alloy driving component 300 includes: a shape memory alloy wire 301, one end of the shape memory alloy wire 301 is electrically connected to the carrier 100, and the other end is electrically connected to the lower substrate 200 below the image sensor chip 111, so as to be electrically connected to the external circuit; there are at least two shape memory alloy wires 301. The shape memory alloy wire 301 is suitable for deforming when powered on to drive the image sensor chip 111 to move in the X and Y directions and rotate in the plane to perform motion compensation.

[0052] Among them, shape memory alloys (SMA) are materials composed of two or more metal elements that have shape memory effect (SME) through thermoelasticity and martensitic phase transformation and its inversion. When the power is on, the shape memory alloy wire can shrink, and when the power is off, the shape memory alloy wire will return to its original state. For example, Liu Zhiqiang and Li Hui published a paper in "Functional Materials", 2004 Supplement (35): "Study on the Driving Performance of TiNi Shape Memory Alloy under Current Excitation", which conducted a preliminary study on the relationship between the constraint recovery stress and temperature of TiNi shape memory alloy wire under current excitation through experiments. The main considerations are the current application method, the magnitude of the constant current, the number of thermal cycles, and the influence of the maximum pre-tension strain on the constraint recovery stress. The experimental results show that the recovery stress of TiNi shape memory alloy wire has good thermal cycle stability under large constant current excitation.

[0053] One end of the shape memory alloy wire 301 is electrically connected to the carrier 100, and the other end is electrically connected to the lower substrate 200 below the image sensor chip 111, so as to be electrically connected to the external circuit. In this way, the shape memory alloy wire 301 can maintain electrical connection with the external circuit and maintain a state of being electrically controlled. On the other hand, the shape memory alloy wire 301 is connected to the carrier 100 and the lower substrate 200, and when it is deformed, it can generate traction on the carrier 100, thereby driving the carrier 100 to move.

[0054] Furthermore, by symmetrically arranging the shape memory alloy wires 301 on both sides or around the carrier 100 , the carrier 100 can maintain relatively symmetrical rotation or horizontal X / Y direction movement under the traction of the shape memory alloy wires 301 .

[0055] Furthermore, by controlling the contraction of the shape memory alloy wire 301 through electric current, the movement of the carrier 100 can be controlled. Combined with the amount of movement that needs to be compensated during the focusing process, the motion compensation function during the focusing process can be realized, thereby realizing the optical image stabilization function.

[0056] Specifically, in this embodiment, the image sensor chip 111 is electrically connected to the carrier 100 through metal wire bonding or flip chip bonding.

[0057] refer to Figure 3 to Figure 4 As shown, specifically, in this embodiment, the carrier plate 100 is further provided with: a resilient component 400;

[0058] The resilient component 400 is suitable for driving the image sensor chip 111 to return to its original position through the resilient force when the shape memory alloy wire 301 is powered off.

[0059] Specifically, in this embodiment, the resilient component 400 includes an inner mounting frame 410 and a bending portion 420 .

[0060] The inner mounting frame 410 is fixedly connected to the carrier board 100 , and the outer ring of the inner mounting frame 410 is suitable for leading out the bending portion 420 .

[0061] As shown in the figure, the flexure 420 is provided with a plurality of elastic cantilevers, which are fixedly connected to the outer fixing frame 500, and the image sensor chip 111 is suitable for restoring the initial position under the action of the elastic cantilevers. In this embodiment, the elastic cantilever is L-shaped and half surrounds the inner mounting frame 410. Figure 3 to Figure 4 As shown, one end of one of the elastic cantilevers is connected to one side of the inner mounting frame in the Y direction, and the other end is connected to one side of the outer fixing frame 500 in the Y direction. At least two elastic cantilevers are arranged in the same direction and manner, and the adjacent two elastic cantilevers are connected end to end.

[0062] Preferably, the two mounting ends of the elastic cantilever are not in a horizontal plane, so that the flexure 420 has a certain elastic preload in the Z-axis direction.

[0063] Specifically, in this embodiment, the shape memory alloy wire 301 is suitable for being arranged on both sides of the image sensor chip 111 , corresponding to the bending portion 420 .

[0064] Specifically, the rebound force of the flexure 420 is opposite to the direction of the traction force generated by the contraction of the shape memory alloy wire 301 when power is turned on. In this way, when the shape memory alloy wire 301 is powered off and restored to its original state, the rebound force provided by the flexure 420 can quickly drive the carrier to return to its original position, thereby ensuring that the position of the image sensor chip 111 is quickly restored to its original position.

[0065] Furthermore, in the technical solution provided by the present invention, the shape memory alloy wire 301 and the flexure 420 of the rebound component are arranged between the carrier 100 and the lower substrate 200 in cooperation with each other, ensuring that the carrier 100 can drive the image sensor chip 111 to move to complete the anti-shake position compensation function through the shape memory alloy wire 301 when the power is on, and can also drive the image sensor chip 111 to return to its original position more quickly under the action of the rebound force of the flexure 420 when the power is off.

[0066] Furthermore, the shape memory alloy wire 301 and the flexure portion 420 of the resilient component are both slender components, which are arranged on both sides or around the carrier 100 in cooperation with each other, and do not occupy too much space of the entire optical image stabilization device that uses a mobile image sensor chip for motion compensation, thereby saving the overall volume of the device.

[0067] For further reference, Figure 4 As shown, specifically, in this embodiment, the carrier 100 is further provided with: a capacitor unit 44 and / or a resistor unit (not shown) and / or an inductor unit (not shown) and / or an auxiliary chip (not shown), and a circuit wiring unit (not shown).

[0068] In this embodiment, the capacitor unit 44 is disposed around the image sensor chip 111. Specifically, the capacitor unit 44 includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the chip.

[0069] In this embodiment, the circuit wiring unit is suitable for providing electrical connection between the image sensor chip 111 and the capacitor unit and / or resistor unit and / or inductor unit and / or auxiliary chip and the contact component, so as to be electrically connected to the circuit on the lower substrate.

[0070] Furthermore, in the present embodiment, the circuit wiring unit is suitable for realizing pin merging of the image sensor chip 111 through circuits, so that the electrical connection between the image sensor chip 111 and the lower substrate 200 through the carrier 100 is simplified.

[0071] Specifically, in this embodiment, the circuit wiring unit is further provided with electrical contact points, and the electrical contact points correspond to the contact components 120. Since the circuit wiring unit reduces the connection relationship between the image sensor chip 111 and the lower substrate 200 by merging the lines, the number of connection points between the carrier and the lower substrate is reduced, so that the number of electrical contact points is less than the number of chip pads, thereby simplifying the overall structure, reducing the volume, and facilitating assembly.

[0072] Combination Figure 1 ,refer to Figure 5 As shown, specifically, in this embodiment, the contact component 120 is disposed below the image sensor chip 111 and includes an elastic contact 409 and a conductive rolling element.

[0073] The conductive rolling element is a conductive metal ball, which is suitable for being located on the lower surface of the carrier 100 and contacting the electrical contact points of the circuit wiring unit in the carrier 100 exposed on the lower surface of the carrier 100. The conductive rolling element ensures that when the carrier 100 moves in the X direction or the Y direction, a stable electrical connection can be maintained between the point contact points of the conductive rolling element and the carrier 100.

[0074] Preferably, the electrical contact points are located around the lower surface of the carrier 100, so that the contact components 120 (conductive rolling elements) are located on four sides of the carrier 100, which can support the carrier 100 and maintain its stable level.

[0075] The elastic contact 409 is located between the electrical contact point and the conductive rolling element. The elastic contact 409 is a flat spring sheet to improve the stability of the electrical contact of the contact component.

[0076] Specifically, in this embodiment, the electrical contact point is a pad.

[0077] Furthermore, the contact component 120 is also suitable for being coated with a lubricant to improve the conductivity.

[0078] Specifically, in this embodiment, a limiting structure is disposed outside the conductive rolling element to control the rolling element to move within the range of the limiting structure.

[0079] Specifically, in this embodiment, the lateral distance of the limiting structure is greater than the diameter of the rolling component by more than 50 microns, thereby reducing or avoiding the contact between the rolling component and the areas on both sides of the limiting structure, thereby reducing friction. Specifically, in this embodiment, the outer fixing frame is disposed on the lower substrate, and is suitable for limiting the movement of the image sensor chip within a certain space.

[0080] In summary, in this embodiment, the image sensor chip is connected to the lower substrate 200 through the contact component 120, so as to achieve electrical communication with the external circuit, so that the overall structure is simple and the process is simple, which can well improve the product yield, reduce the manufacturing cost, improve the reliability and improve the image quality.

[0081] Specifically, in this embodiment, a magnetic component is also provided on the carrier, and the magnetic component generates an attractive force with the lower substrate of the image sensor chip to provide a contact force between the carrier, the contact component and the lower substrate. In this way, the provision of the magnetic component also makes the structure of the chip OIS anti-shake module simple and easy to install.

[0082] Specifically, in this embodiment, the displacement of the image sensor chip is fed back through the change in resistance of the shape memory alloy wire after power is applied. In this way, in the technical solution provided by the present invention, the displacement of the image sensor chip 111 can be reflected through the resistance value of the shape memory alloy wire, and there is no need to set a Hall feedback loop to feed back the displacement, which has a simple structure, small size and low cost.

[0083] In addition, an embodiment provided by the present invention also includes an electronic device, including: the optical image stabilization device that uses a mobile image sensor chip to perform motion compensation as described above.

[0084] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. An optical image stabilization device using a mobile image sensor chip for motion compensation, characterized in that: include: Image sensor chip, carrier board, contact components, lower substrate and shape memory alloy drive assembly; The image sensor chip is fixedly mounted on a carrier and electrically connected to the carrier, and the carrier contacts the lower substrate via a contact component to be electrically connected to an external circuit. The contact component is arranged on the carrier and electrically connected to the carrier. The contact component includes a conductive rolling element, which is used to maintain a stable electrical connection between the conductive rolling element and the carrier when the carrier moves in the X and Y directions. The image sensor chip moves in the X and Y directions and rotates in a plane under the drive of the shape memory alloy driving component to perform motion compensation.

2. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The carrier board is also provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit; The circuit wiring unit is adapted to provide electrical connection between the image sensor chip and the capacitor unit and / or resistor unit and / or inductor unit and / or the auxiliary chip and the contact component, so as to be electrically connected to the circuit on the lower substrate.

3. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The carrier plate is also provided with: a rebound component; The shape memory alloy driving component is suitable for deforming when powered on to drive the image sensor chip to move in the X and Y directions and rotate in a plane to perform motion compensation; The rebound component is suitable for driving the image sensor chip to return to its original position through the rebound force when the shape memory alloy driving component is powered off.

4. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 3, characterized in that: The shape memory alloy driving component includes: a shape memory alloy wire, one end of which is electrically connected to the carrier board, and the other end of which is electrically connected to the lower substrate below the image sensor chip to be electrically connected to an external circuit; there are at least two shape memory alloy wires.

5. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 4, characterized in that: The resilient component comprises: an inner mounting frame and a flexure; The inner mounting frame is fixedly connected to the carrier plate, and the outer ring of the inner mounting frame is suitable for leading out the flexure; The flexure is provided with a plurality of elastic cantilevers, the elastic cantilevers are fixedly connected to the outer fixing frame, and the image sensor chip is suitable for restoring an initial position under the action of the elastic cantilevers.

6. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 5, characterized in that: The elastic cantilever is L-shaped and half surrounds the inner installation frame.

7. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 5, characterized in that: The shape memory alloy wires are suitable for being arranged on two sides of the image sensor chip, corresponding to the bending parts.

8. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 2, characterized in that: The capacitor unit is arranged around the image sensor chip.

9. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 2, characterized in that: The capacitor unit includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the image sensor chip.

10. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 2, characterized in that: The circuit wiring unit is also provided with electrical contact points, the electrical contact points correspond to the contact components, and the number of the electrical contact points is less than the number of pads of the image sensor chip.

11. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 10, characterized in that: The contact component is arranged below the carrier plate, and comprises an elastic contact and a conductive rolling element, wherein the elastic contact is located between the electrical contact point and the conductive rolling element.

12. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 10, characterized in that: The electrical contact point is a pad.

13. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 11, characterized in that: The elastic contact is a flat spring sheet to improve the stability of the electrical contact of the contact component.

14. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1 or 11, characterized in that: The contact component is also suitable for being coated with lubricant to improve the conductivity.

15. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 11, characterized in that: A limiting structure is arranged outside the conductive rolling element to control the conductive rolling element to move within the range of the limiting structure.

16. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 15, characterized in that: The lateral distance of the limiting structure is greater than the diameter of the conductive rolling element by more than 50 microns, thereby reducing or avoiding the contact between the conductive rolling element and the areas on both sides of the limiting structure, thereby reducing friction.

17. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 1, characterized in that: The carrier is also provided with a magnetic component, which generates an attractive force with the lower substrate of the image sensor chip to provide a contact force between the carrier, the contact component and the lower substrate.

18. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 11, characterized in that: The image sensor chip is electrically connected to the carrier board by metal wire bonding or flip-chip bonding.

19. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 5, characterized in that: The outer fixing frame is arranged on the lower substrate and is suitable for limiting the movement of the image sensor chip within a certain space.

20. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 4, characterized in that: The displacement of the image sensor chip is fed back through the change in resistance of the shape memory alloy wire after power is supplied.

21. An electronic device, characterized in that: include: An optical image stabilization device using a mobile image sensor chip for motion compensation as claimed in claim 1.

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