A multi-purpose wireless RFID tag suitable for different frequency bands

Abstract

A multi-purpose wireless RFID tag applicable to different frequency bands. The invention relates to a multi-purpose wireless RFID tag applicable to different frequency bands, belonging to the technical field of RFID tags. A multi-purpose wireless RFID tag applicable to different frequency bands is provided, which can realize the multi-frequency performance of the tag and broaden the application scope of the product. It includes a substrate, glue, a chip, a metal layer one, a substrate one, a frequency point group, glue and a surface material arranged in sequence from bottom to top, the chip is connected to the metal layer one through a conductive glue, the frequency point group includes glue, a metal layer and a substrate arranged in sequence from bottom to top, and in the vertical direction, the metal layer and the metal layer one have a partial overlap. The frequency point group includes at least two. The two metal layers in the adjacent frequency point groups have a partial overlap in the vertical direction. A glue-free area is provided on the outside of the glue in the frequency point group. The glue is a removable glue, and the thickness of the removable glue is 10-30 um. The present invention is convenient for processing and improves the competitiveness of the product.

Description

Technical Field

[0001] The invention relates to a multi-purpose wireless RFID tag applicable to different frequency bands, belonging to the technical field of RFID tags. Background Art

[0002] Radio Frequency Identification (RFID) technology, also known as wireless radio frequency identification, is a communication technology that can identify specific targets and read and write related data through radio signals without establishing mechanical or optical contact between the identification system and the specific target.

[0003] In the Chinese market, the application of high-frequency RFID technology is still the mainstream trend of industry development, while ultra-high frequency is the future development trend. In China, RFID has formed a mature application model in the fields of electronic tickets, access control, mobile payment, etc., and the application in these fields is mostly concentrated in low and high frequency bands. In terms of high-frequency applications, domestic manufacturers' chip design, manufacturing, ticket production process, packaging technology, etc. have gradually shown strong competitive strength and advantages. After several years of rapid development, the domestic RFID high-frequency industry chain has been continuously improved and can be compared with the international level, becoming the backbone of this market. In the field of ultra-high frequency RFID, the current market share in the overall market is only at a low level, but with the continuous popularization and development of ultra-high frequency RFID in many fields such as new retail of shoes and clothing, unmanned convenience stores, book management, medical health, aviation, logistics, and transportation, ultra-high frequency RFID will become a key breakthrough in the development of the industry in the future.

[0004] In order to adapt to the increasingly complex application environment and more and more special application requirements, the application capabilities of RFID tags are getting higher and higher. The existing conventional UHF tags are composed of a substrate, a front metal antenna, a conductive adhesive, and a chip. The front metal antenna is attached to the top of the substrate, and the conductive adhesive is located above the metal antenna to connect the metal antenna and the chip. Conventional RFID UHF tags obtain energy by receiving electromagnetic waves to activate themselves to radiate electromagnetic waves in a fixed direction outward, thereby performing radio frequency information transmission and communication. The existing RFID UHF tags in the industry are designed and developed for a single application frequency and a single application environment. Therefore, the tag application market is limited, resulting in insufficient product competitiveness and a lack of extensive product application.

[0005] Therefore, it is a general trend to propose a multi-purpose wireless RFID tag suitable for different frequency bands to solve the above problems, enhance the competitiveness of enterprise products and reduce enterprise costs.

[0006] In addition, there are RFID tags suitable for multi-bands on the market. They are mainly divided into 2-3 areas by adding virtual cuts on the surface of the tag. By tearing off different virtual cut areas of the antenna, the different frequency points of the tag can be tested. However, this method has high requirements on production precision. In addition, there is a risk that the customer will tear the label when tearing it, causing the label to become completely invalid.

[0007] At the same time, the publication number of the National Intellectual Property Administration published on February 26, 2021 is CN112418375A, and the name is "A multi-band anti-counterfeiting RFID tag", which is provided with a rubber surface material and a rubber base material. From the rubber surface material to the rubber base material, there are an antenna front aluminum layer, a first strong glue layer, an antenna substrate layer, a weak glue layer, a fragile film layer, a second strong glue layer, an antenna back aluminum layer and a chip in sequence; the antenna front aluminum layer and the antenna back aluminum layer are provided with antennas of at least two frequency bands connected to the chip. However, during use, only two frequency bands can be used (i.e., one high frequency and one ultra-high frequency); at the same time, the two multi-band antenna designs cannot overlap, which will affect the performance of the two frequency bands; and the fragile layer process is used, which requires high production precision and cannot be mass-produced. Summary of the invention

[0008] In view of the above problems, the present invention provides a multi-purpose wireless RFID tag applicable to different frequency bands, which can realize multi-frequency performance of the tag and broaden the application range of the product.

[0009] The technical solution of the present invention is: comprising a base material, glue, a chip, a metal layer 1, a substrate 1, a frequency point group, glue and a surface material arranged in sequence from bottom to top,

[0010] The chip is connected to the metal layer 1 through a conductive glue.

[0011] The frequency point group includes glue, a metal layer and a substrate arranged in sequence from bottom to top, and in the vertical direction, the metal layer and the metal layer 1 are partially overlapped.

[0012] The frequency point group includes at least two.

[0013] Two metal layers in adjacent frequency point groups have partial overlap in the vertical direction.

[0014] A glue-free area is provided outside the glue in the frequency point group.

[0015] The glue is removable glue, and the thickness of the removable glue is 10-30 um.

[0016] The metal layer 1 and the metal layer 2 are both conductive materials, including Al, copper, silver paste or graphene.

[0017] The substrate 1 and the substrate 2 are both non-conductive materials, including PET, PVC, PTFE or resin.

[0018] The thickness of the metal layer and the substrate ranges from 1 to 100 um.

[0019] In operation, the present invention improves production efficiency by arranging the chip at the lower part of the label; a frequency point group is arranged on the upper part of the metal layer 1 connected to the chip, and a substrate 1 is arranged between the frequency point group and the metal layer 1, so that the metal layer in the frequency point group is in a non-contact state with the metal layer 1, and at the same time, the metal layer and the metal layer 1 have a partial overlap, so that the performance frequency of the label is achieved in an optimal state through a non-contact coupling method.

[0020] The invention facilitates processing and improves product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention,

[0022] Figure 2 yes Figure 1 Schematic diagram of the decomposition of

[0023] Figure 3 is a schematic diagram of the application of the present invention,

[0024] Figure 4 yes Figure 3 Schematic diagram of the three-dimensional structure,

[0025] Figure 5 yes Figure 3 Schematic diagram of the decomposition of

[0026] In the figure, 1 is the base material, 2 is the glue, 3 is the chip, 4 is the metal layer 1, 5 is the base material 1, 6 is the frequency point group, 61 is the metal layer, 62 is the base material, 63 is the glue-free area,

[0027] 7 is the surface material, 81 is the metal layer 2, 82 is the substrate 2, 91 is the metal layer 3, and 92 is the substrate 3. DETAILED DESCRIPTION

[0028] The present invention Figure 1-2 As shown, it includes a base material 1, glue 2, a chip 3, a metal layer 4, a substrate 5, a frequency point group 6, glue 2 and a surface material 7 arranged in sequence from bottom to top.

[0029] The chip 3 is connected to the metal layer 4 through conductive glue.

[0030] The frequency point group 6 includes glue 2, a metal layer 61 and a substrate 62 arranged in sequence from bottom to top. In the vertical direction, the metal layer 61 partially overlaps with the metal layer 4.

[0031] In operation, the present invention improves production efficiency by arranging the chip at the lower part of the label; a frequency point group is arranged on the upper part of the metal layer 1 connected to the chip, and a substrate 1 is arranged between the frequency point group and the metal layer 1, so that the metal layer in the frequency point group is in a non-contact state with the metal layer 1, and at the same time, the metal layer and the metal layer 1 have a partial overlap, so that the performance frequency of the label is achieved in an optimal state through a non-contact coupling method.

[0032] Among them, metal layer 1 contacts the chip to form product frequency point 1; chip + metal layer 1 + metal layer in the frequency point group form product frequency point 2; it can be torn off according to usage requirements.

[0033] The chip is at the bottom, which prevents the chip from being damaged by the strong adhesive during label tearing, thus affecting the label performance.

[0034] The frequency point group 6 includes at least two. In this way, multiple layers can be selected according to the needs, which is convenient for processing and forms multiple frequency points of different combinations in three-dimensional space.

[0035] Two metal layers 61 in adjacent frequency point groups 6 partially overlap in the vertical direction.

[0036] The glue outside the frequency point group is provided with a glue-free area 63. The glue-free area is provided to facilitate the user to tear off the corresponding frequency point group, thereby obtaining the required frequency point, facilitating operation and having high reliability.

[0037] The glue 2 is a removable glue, and the thickness of the removable glue is 10-30 um. The glue can ensure that after the surface material or the frequency point group is torn off, the glue will not remain on the label.

[0038] The metal layer 14 and the metal layer 61 are both conductive materials, including Al, copper, silver paste or graphene, which can be selected according to processing requirements.

[0039] The substrate 1 5 and the substrate 62 are both non-conductive materials with a certain degree of softness, including PET, PVC, PTFE or resin, which can be selected according to processing requirements.

[0040] The thickness of the metal layer 61 and the substrate 62 is in the range of 1-100 um.

[0041] The label processed by the present invention is flexible and can be used in a wider range of occasions.

[0042] The number of metal layers can be several, and each metal layer is connected by glue, and the total thickness of the several metal layers combined with the glue does not exceed 800um.

[0043] Several metal layers are in a non-contact state with each other. By partially overlapping the metal layers, a non-contact coupling method is used to achieve the optimal frequency point of tag performance.

[0044] In specific applications, such as Figure 3-5 As shown, for example, two frequency point groups are set, including surface material 7, glue 2, substrate three 92, metal layer three 91, glue 2, substrate two 82, metal layer two 81, glue 2, substrate one 5, metal layer one 4, chip 3, glue 2 and base material 1.

[0045] It is composed of multiple metal layer antennas, which are connected and fixed by glue. The performance frequency of the tag is diversified through mutual electromagnetic coupling between the layers.

[0046] Among them, metal layer one contacts the chip to form product frequency point one; chip + metal layer one + metal layer two form product frequency point two; chip + metal layer one + metal layer two + metal layer three form product frequency point three. There is a non-conductive substrate and glue between the metal layers, and they are not in direct contact.

[0047] For demand frequency point 3, users can use the multi-layer composite product directly; for demand frequency point 2, the surface material and metal layer 3 can be torn off and used directly; for demand frequency point 1, users can tear off metal layer 2 again and use it directly;

[0048] Production and processing method: connecting the chip and metal layer 1 (including substrate 1) through conductive glue to form semi-finished product 1; compounding semi-finished product 1 and metal layer 2 (including substrate) through removable glue to form semi-finished product 2; compounding semi-finished product 2, metal layer 3 (including substrate) and surface material through removable glue to form final product label;

[0049] The chip models connected in the present invention are: Ucode9, Ucode8, Ucode7 series, Monza 700 series, MonzaR6, Monza 5, Monza 4, H3, H4, H9.

[0050] The present invention is convenient and practical, and has the following advantages:

[0051] 1) Through the contactless structure design of multi-layer metal layer antenna, the multi-frequency performance of the tag can be achieved, broadening the application scope of the product;

[0052] 2) Multi-layer metal antennas use overlapping areas (i.e. partial overlap) to perform wireless coupling, which reduces the difficulty of the production process and improves production efficiency;

[0053] 3) The product chip is designed to face downwards, and each layer is equipped with removable glue to ensure that the product is not damaged during use, improve product safety, and ensure product service life;

[0054] 4) Implement a product in the RFID field with different reading distance performance;

[0055] 5) Innovatively propose to combine multiple layers of RFID antennas and apply them in multiple fields by tearing off the labels layer by layer.

[0056] Regarding the contents disclosed in this case, there are a few points that need to be explained:

[0057] (1) The drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design;

[0058] (2) In the absence of conflict, the embodiments and features of the embodiments disclosed in this case may be combined with each other to obtain new embodiments;

[0059] The above are only specific implementation methods disclosed in this case, but the protection scope of the present disclosure is not limited thereto. The protection scope disclosed in this case should be based on the protection scope of the claims.

Claims

1. A multi-purpose wireless RFID tag suitable for different frequency bands, characterized in that , including a substrate, glue, chip, metal layer 1, substrate 1, frequency point group, glue and surface material arranged in sequence from bottom to top, The chip is connected to the metal layer 1 through a conductive glue. The frequency point group includes glue, a metal layer and a substrate arranged in sequence from bottom to top, and in the vertical direction, the metal layer and the metal layer 1 partially overlap; The frequency point group includes at least two, and the metal layer in the frequency point group is in a non-contact state with the metal layer 1; Two metal layers in adjacent frequency point groups have partial overlap in the vertical direction for wireless coupling; Metal layer 1 contacts the chip to form product frequency point 1; chip + metal layer 1 + metal layer in the frequency point group form product frequency point 2; It can be torn off according to the use requirements; It is made of multiple metal layers, which are connected and fixed by glue. The performance frequency of the tag is diversified through mutual electromagnetic coupling between the layers. A glue-free area is provided outside the glue in the frequency point group; The glue is removable glue, and the thickness of the removable glue is 10-30 um; The metal layer 1 and the metal layer 2 are both conductive materials, including AL, copper, silver paste or graphene; The substrate 1 and the substrate 2 are both non-conductive materials, including PET, PVC, PTFE or resin.

2. A multi-purpose wireless RFID tag suitable for different frequency bands according to claim 1, characterized in that , the thickness of the metal layer and the substrate ranges from 1 to 100 um.

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