Image Sensor

Abstract

The present invention provides an image sensor. The image sensor comprises: a frame; a circuit substrate, which is arranged in the frame; an optical lens, which is arranged in the frame, and the optical lens and the circuit substrate are arranged at intervals, and the circuit substrate is located in the extension direction of the optical axis of the optical lens; a light source structure, a light source structure is arranged on at least one group of oppositely arranged side walls of the frame, and the light emitting direction of the light source structure is arranged toward the optical lens; a reflective structure, which is arranged between the light source structure and the optical lens, and the reflective structure is arranged at an angle to the optical axis of the optical lens, so that the light emitted by the light source structure is reflected by the reflective structure to the to-be-scanned surface of the image sensor, and the to-be-scanned surface is located on the side of the optical lens away from the circuit substrate. The present invention solves the problem of poor display effect of image sensors in the prior art.

Description

Technical Field

[0001] The present invention relates to the field of optical image sensing, and in particular to an image sensor. Background Art

[0002] With the development of science and technology, the field of optical image sensing has become increasingly mature. There are many types of image sensors. Taking contact image sensors as an example, contact image sensors are widely used in the field of industrial detection. However, in terms of the light source structure of contact image sensors in the prior art, the array-shaped light source used has great limitations for certain special detections, such as mirror detection and metal plate brushed surface detection. The scanned image is prone to wavy light and dark stripes along with the LED of the array light source. The traditional way to deal with light and dark stripes is to attach a diffuser film to the glass of the contact image sensor. However, due to the limitations of the space and structure inside the contact image sensor, the LED array light source is very close to the diffuser film, so light-like light and dark textures will still appear when scanning the brushed surface of the metal plate. At the same time, due to the limitations of the space inside the contact image sensor, the distance between the diffuser film and the light source structure cannot be increased indefinitely, which ultimately leads to uneven diffuse light.

[0003] That is to say, the image sensor in the prior art has the problem of poor display effect. Summary of the invention

[0004] The main purpose of the present invention is to provide an image sensor to solve the problem of poor display effect of image sensors in the prior art.

[0005] In order to achieve the above-mentioned purpose, the present invention provides an image sensor, comprising: a frame; a circuit substrate, which is arranged in the frame; an optical lens, which is arranged in the frame, the optical lens and the circuit substrate are arranged at intervals, and the circuit substrate is located in the extension direction of the optical axis of the optical lens; a light source structure, the light source structure is arranged on at least one group of oppositely arranged side walls of the frame, and the light emitting direction of the light source structure is arranged toward the optical lens; a reflective structure, which is arranged between the light source structure and the optical lens, and the reflective structure is arranged at an angle to the optical axis of the optical lens, so that the light emitted by the light source structure is reflected by the reflective structure to the to-be-scanned surface of the image sensor, and the to-be-scanned surface is located on the side of the optical lens away from the circuit substrate.

[0006] Furthermore, the reflective structure is arranged at an acute angle or an obtuse angle with the optical axis of the optical lens.

[0007] Furthermore, the image sensor also includes a transparent plate, which is covered on the frame and located on the light-emitting side of the frame, and a light-scattering film is provided on a surface of the transparent plate facing the optical lens.

[0008] Furthermore, the image sensor also includes a baffle, and the baffles are arranged on at least two sides of the light source structure, the extension direction of the baffle is perpendicular to the extension direction of the optical axis of the optical lens, at least one side of the baffle extends to the reflective structure, and a diffuse reflection coating is arranged on the surface of the baffle facing the light source structure.

[0009] Furthermore, the image sensor also includes a baffle, two baffles are correspondingly arranged for the same light source structure, a light channel is formed between the two baffles, the light source structure is arranged at a first end of the light channel, the second end of the light channel faces the reflective structure, and one of the baffles is arranged between the circuit substrate and the light source structure.

[0010] Furthermore, the image sensor also includes a reflector, there are multiple reflectors, two reflectors are correspondingly arranged for the same light source structure, a light channel is formed between the two reflectors, the light source structure is arranged at a first end of the light channel, and the second end of the light channel faces the reflective structure, and one of the reflectors is arranged between the circuit substrate and the light source structure.

[0011] Furthermore, the frame has a set of first and second side walls that are oppositely arranged, and light source structures are arranged on the first and second side walls. The optical axes of the two light source structures are located on the same straight line, and the line connecting the light source structure and the optical lens is perpendicular to the optical axis of the optical lens.

[0012] Furthermore, the frame also has a bottom wall connecting the first side wall and the second side wall, the bottom wall is arranged opposite to the light-emitting side of the frame, an installation space is formed between the first side wall and the second side wall, the installation space is arranged close to the light-emitting side of the frame relative to the bottom wall, the light source structure, the optical lens and the reflective structure are arranged in the installation space, and the circuit substrate is arranged on the bottom wall.

[0013] Furthermore, the light source structure includes an LED; and / or the reflective structure includes a reflector; and / or the image sensor further includes a shell, the frame is located inside the shell, and one side of the shell has a surface to be scanned.

[0014] Furthermore, the image sensor further comprises a photoelectric conversion chip, which is located on a surface of the circuit substrate facing the optical lens, and the photoelectric conversion chip is arranged corresponding to the optical lens.

[0015] According to the technical solution of the present invention, the image sensor includes a frame, a circuit substrate, an optical lens, a light source structure and a reflective structure, wherein the circuit substrate is arranged in the frame; the optical lens is arranged in the frame, the optical lens and the circuit substrate are arranged at intervals, and the circuit substrate is located in the extension direction of the optical axis of the optical lens; the light source structure is arranged on at least one group of oppositely arranged side walls of the frame, and the light emitting direction of the light source structure is arranged toward the optical lens; the reflective structure is arranged between the light source structure and the optical lens, and the reflective structure and the optical axis of the optical lens are arranged at an angle, so that the light emitted by the light source structure is reflected by the reflective structure to the to-be-scanned surface of the image sensor, and the to-be-scanned surface is located on the side of the optical lens away from the circuit substrate.

[0016] The frame provides installation positions for the circuit substrate, optical lens, light source structure and reflective structure. The reasonable division of the internal space of the frame is conducive to improving the reliability of the circuit substrate, optical lens, light source structure and reflective structure, while avoiding mutual interference between devices and ensuring the working stability of the image sensor. When the image sensor is working, the light emitted by the light source structure is irradiated onto the reflective structure, and the reflective structure reflects the light out of the frame to the surface to be scanned, irradiating the surface to be scanned, and then the light on the surface to be scanned is reflected onto the optical lens to transmit the image light information to the circuit substrate corresponding to the optical lens, thereby ensuring the stability of image transmission. By setting the reflective structure and reasonably planning the position of the light source structure in the frame, the distance between the light source structure and the surface to be scanned is equivalently lengthened without changing the overall size of the frame, and the light transmission path is effectively planned, ensuring the miniaturization of the image sensor while making the light irradiated to the surface to be scanned more uniform and soft, so that the image sensor can clearly display the image, which is conducive to the recognition of the subsequent image algorithm and improves the scanning efficiency. In addition, by providing a reflective structure, the uniformity of the light irradiated by the light source structure to the surface to be scanned is effectively improved, the problem of light and dark stripes in the scanned image of special scanning is overcome, the display effect is improved, and the scanning accuracy is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 A schematic diagram showing the structure of an image sensor according to a first embodiment of the present invention is shown;

[0019] Figure 2 Shows Figure 1 Schematic diagram of the equivalent optical path when the image sensor in FIG. is working;

[0020] Figure 3 A schematic diagram of the structure of an image sensor in the prior art is shown;

[0021] Figure 4 A schematic diagram showing the structure of an image sensor according to a second embodiment of the present invention is shown;

[0022] Figure 5 A schematic structural diagram of an image sensor according to a third embodiment of the present invention is shown.

[0023] The above drawings include the following reference numerals:

[0024] 10. Frame; 11. First side wall; 12. Second side wall; 13. Bottom wall; 20. Circuit substrate; 30. Optical lens; 40. Light source structure; 50. Reflective structure; 60. Surface to be scanned; 70. Transparent plate; 80. Diffusive film; 90. Photoelectric conversion chip; 100. Baffle; 200. Reflective element. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0027] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0028] In order to solve the problem of poor display effect of image sensors in the prior art, the present invention provides an image sensor.

[0029] Embodiment 1

[0030] like Figures 1 to 5As shown, the image sensor includes a frame 10, a circuit substrate 20, an optical lens 30, a light source structure 40 and a reflective structure 50. The circuit substrate 20 is arranged in the frame 10; the optical lens 30 is arranged in the frame 10, and the optical lens 30 and the circuit substrate 20 are arranged at intervals, and the circuit substrate 20 is located in the extension direction of the optical axis of the optical lens 30; the light source structure 40 is arranged on at least one group of oppositely arranged side walls of the frame 10, and the light emitting direction of the light source structure 40 is arranged toward the optical lens 30; the reflective structure 50 is arranged between the light source structure 40 and the optical lens 30, and the reflective structure 50 is arranged at an angle to the optical axis of the optical lens 30, so that the light emitted by the light source structure 40 is reflected by the reflective structure 50 to the to-be-scanned surface 60 of the image sensor, and the to-be-scanned surface 60 is located on the side of the optical lens 30 away from the circuit substrate 20.

[0031] The frame 10 provides an installation position for the circuit substrate 20, the optical lens 30, the light source structure 40 and the reflective structure 50. The reasonable division of the internal space of the frame 10 is conducive to improving the reliability of the circuit substrate 20, the optical lens 30, the light source structure 40 and the reflective structure 50, while avoiding mutual interference between the components, and ensuring the working stability of the image sensor. When the image sensor is working, the light emitted by the light source structure 40 irradiates the reflective structure 50, and the reflective structure 50 reflects the light out of the frame 10 to the surface to be scanned 60, irradiating the surface to be scanned 60, and then the light on the surface to be scanned 60 is reflected to the optical lens 30, so as to transmit the image light information to the circuit substrate 20 corresponding to the optical lens 30, and ensure the stability of image transmission. By setting the reflective structure 50 and rationally planning the position of the light source structure 40 in the frame 10, the distance between the light source structure 40 and the surface to be scanned 60 is effectively lengthened without changing the overall size of the frame 10, and the light transmission path is effectively planned, which ensures the miniaturization of the image sensor while making the light irradiated to the surface to be scanned 60 more uniform and soft, so that the image sensor can clearly display the image, which is conducive to the recognition of the subsequent image algorithm and improves the scanning efficiency. In addition, by setting the reflective structure 50, the uniformity of the light irradiated from the light source structure 40 to the surface to be scanned 60 is effectively improved, the light stripes of the scanned image of the special scan are overcome, the display effect is improved, and the scanning accuracy is guaranteed.

[0032] like Figure 1As shown, the image sensor also includes a photoelectric conversion chip 90. An array of photoelectric conversion chips 90 is arranged on the surface of the circuit substrate 20 facing the optical lens 30, and the photoelectric conversion chip 90 is arranged corresponding to the optical lens 30. This arrangement enables the circuit substrate 20 to carry the photoelectric conversion chip 90 and provide a circuit for the photoelectric conversion chip 90 to achieve signal transmission. The photoelectric conversion chip 90 is arranged corresponding to the optical lens 30. This arrangement enables the photoelectric conversion chip 90 to receive image light information transmitted from the optical lens 30, so that the photoelectric conversion chip 90 is used for light sensing and charge accumulation, and converts the light signal into an electrical signal to achieve signal transmission and conversion, thereby ensuring the stability of image transmission.

[0033] like Figure 1 As shown, the reflective structure 50 is arranged at an acute angle or an obtuse angle with the optical axis of the optical lens 30. The angle between the reflective structure 50 and the optical axis of the optical lens 30 can be adjusted according to actual conditions to ensure that the reflective structure 50 can smoothly reflect the light emitted by the light source structure 40 out of the frame 10, and then irradiate the surface to be scanned 60, thereby ensuring the stability of light transmission.

[0034] like Figure 1 As shown, the image sensor further includes a transparent plate 70, which is covered on the frame 10 and located on the light-emitting side of the frame 10, and a diffuser film 80 is provided on the surface of the transparent plate 70 facing the optical lens 30. Since the transparent plate 70 is transparent and covered on the light-emitting side of the frame 10, such a configuration prevents the transparent plate 70 from blocking the transmitted light, thereby ensuring the stability of light transmission. The diffuser film 80 is provided on the surface of the transparent plate 70 facing the optical lens 30 except for the position corresponding to the optical lens 30. Since the diffuser film 80 has a diffuser effect, when the image sensor is working, the light emitted by the light source structure 40 is irradiated onto the reflective structure 50, and the light is reflected by the reflective structure 50 and irradiated onto the diffuser film 80. The diffuser film 80 scatters the light and reasonably adjusts the light distribution trend. The transmitted light is irradiated onto the surface to be scanned 60, and then the surface to be scanned 60 reflects the light back onto the optical lens 30, and after passing through the optical lens 30, it is irradiated onto the light hole of the photoelectric conversion chip 90, thereby completing the transmission of light information.

[0035] like Figure 2 As shown in the figure, it is a schematic diagram of the equivalent optical path of the image sensor when it is working. As shown in the figure, the actual light-emitting position of the two light source structures 40 is equivalent to the position marked by the dotted line in the figure. Through the reflection of the two reflective structures 50, the distance between the two light source structures 40 and the diffuser film 80 is equivalently lengthened, so that the diffuser film 80 can fully diffuse the light, making the light irradiated on the surface to be scanned 60 more uniform and soft.

[0036] like Figure 3As shown, it is a schematic diagram of the structure of an image sensor in the prior art. Since the light source structure in the prior art is not arranged on the side wall of the frame, and no reflective structure 50 is provided, the distance between the light source structure and the diffuser film is too close, which makes it easy to cause light and dark stripes when scanning the brushed surface of the metal plate, affecting the actual scanning effect. At the same time, due to the limitation of the internal space of the frame, it is difficult to lengthen the distance between the light source structure and the diffuser film, resulting in uneven diffuse light of the diffuser film, making the light irradiated on the surface to be scanned 60 uneven.

[0037] like Figure 1 As shown, the frame 10 has a set of first side walls 11 and second side walls 12 arranged opposite to each other, and light source structures 40 are arranged on the first side walls 11 and the second side walls 12, and the optical axes of the two light source structures 40 are located on the same straight line, and the line connecting one light source structure 40 and the optical lens 30 is perpendicular to the optical axis of the optical lens 30. A set of reflective structures 50 and light source structures 40 are correspondingly arranged on the left and right sides of the optical lens 30, and the reflective structures 50 in one set are located between the optical lens 30 and the light source structure 40.

[0038] like Figure 1 As shown, the frame 10 also has a bottom wall 13 connecting the first side wall 11 and the second side wall 12, and the bottom wall 13 is arranged opposite to the light-emitting side of the frame 10, that is, the bottom wall 13 is arranged opposite to the transparent plate 70; an installation space is formed between the first side wall 11 and the second side wall 12, and the installation space is arranged near the light-emitting side of the frame 10 relative to the bottom wall 13, that is, the installation space is arranged on one side of the transparent plate 70. The light source structure 40, the optical lens 30 and the reflective structure 50 are arranged in the installation space, and the circuit substrate 20 is arranged on the bottom wall 13. By reasonably dividing the internal space of the frame 10, the arrangement of the components inside the frame 10 is made more reasonable, the reliability of the components is ensured, and at the same time, the trend of the light of the light source structure 40 is planned, so that the light irradiated on the surface to be scanned 60 is more uniform.

[0039] Specifically, in the present application, the light source structure 40 is an LED, and the reflective structure 50 is a reflector.

[0040] In an embodiment not shown in the figure, the image sensor further includes a housing, a frame 10 is located inside the housing, and one side of the housing has a surface to be scanned 60. This arrangement enables the housing to protect the frame 10, ensures the stability of the components inside the frame 10, and ensures that the image sensor can operate stably.

[0041] Embodiment 2

[0042] The difference from the first embodiment is that baffles 100 are added on the upper and lower sides of the light source structure 40 .

[0043] like Figure 4As shown, the image sensor also includes a baffle 100, and the baffles 100 are arranged on at least two sides of the light source structure 40. The extension direction of the baffle 100 is perpendicular to the extension direction of the optical axis of the optical lens 30. The baffle 100 on at least one side extends to the reflective structure 50. The surface of the baffle 100 facing the light source structure 40 is provided with a diffuse reflection coating, and the diffuse reflection coating is a high diffuse reflection coating.

[0044] Specifically, two baffles 100 are provided corresponding to the same light source structure 40, and a light channel is formed between the two baffles 100. The light source structure 40 is arranged at the first end of the light channel, and the second end of the light channel faces the reflective structure 50. One of the baffles 100 is arranged between the circuit substrate 20 and the light source structure 40, and the other baffle 100 is arranged between the light source structure 40 and the transparent plate 70. This arrangement enables most of the light emitted by the same light source structure 40 to be directly transmitted to the reflective structure 50, and a small part of the light emitted by the light source structure 40 is transmitted to the reflective structure 50 through multiple diffuse reflections of the upper and lower baffles 100. This arrangement enables the reflective structure 50 to receive not only the light directly irradiated by the light source structure 40, but also the light scattered outward from the light source structure 40, which is then reflected to the diffuse film 80 through the reflective structure 50 and then reaches the surface to be scanned 60. This arrangement avoids the loss of light energy of the light source structure 40, increases the utilization rate of the light source structure 40, improves the light intensity reflected from the reflective structure 50 to the surface to be scanned 60, directly increases the output of the image sensor, and makes the scanning effect better.

[0045] It should be noted that the material of the diffuse reflection coating is not limited here, as long as it can produce a diffuse reflection effect.

[0046] It should be noted that, in the present embodiment, the light diffusion film 80 is not provided on most of the areas on the surface of the transparent plate 70 corresponding to the baffle 100 between the same light source structure 40 and the transparent plate 70, which effectively saves the cost.

[0047] Embodiment 3

[0048] The difference from the first embodiment is that reflective elements 200 are added on the upper and lower sides of the light source structure 40 .

[0049] The difference from the second embodiment is that the baffle 100 in the second embodiment is replaced by a reflective member 200 .

[0050] like Figure 5As shown, the image sensor further includes a reflector 200, and there are multiple reflectors 200. Two reflectors 200 are correspondingly arranged for the same light source structure 40, and a light channel is formed between the two reflectors 200. The light source structure 40 is arranged at the first end of the light channel, and the second end of the light channel faces the reflective structure 50. One reflector 200 is arranged between the circuit substrate 20 and the light source structure 40, and the other reflector 200 is arranged between the light source structure 40 and the transparent plate 70. This arrangement enables most of the light emitted by the same light source structure 40 to be directly transmitted to the reflective structure 50, and a small part of the light emitted by the light source structure 40 is transmitted to the reflective structure 50 through multiple reflections of the upper and lower reflectors 200. This arrangement enables the reflective structure 50 to receive not only the light directly irradiated by the light source structure 40, but also the light scattered outward from the light source structure 40, which is then reflected to the diffuser film 80 through the reflective structure 50, and then reaches the surface to be scanned 60. This arrangement can also achieve the scanning effect in the second embodiment.

[0051] Specifically, in the present application, the reflective structure 50 and the reflective element 200 are both reflectors.

[0052] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0053] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0054] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An image sensor, It is characterized in that include: Frame (10); A circuit substrate (20), wherein the circuit substrate (20) is arranged in the frame (10); an optical lens (30), the optical lens (30) being arranged in the frame (10), the optical lens (30) being spaced apart from the circuit substrate (20), and the circuit substrate (20) being located in the extension direction of the optical axis of the optical lens (30); a light source structure (40), wherein the light source structure (40) is arranged on at least one group of oppositely arranged side walls of the frame body (10), and the light emitting direction of the light source structure (40) is arranged toward the optical lens (30); a reflective structure (50), the reflective structure (50) being arranged between the light source structure (40) and the optical lens (30), and the reflective structure (50) and the optical axis of the optical lens (30) being arranged at an angle, so that the light emitted by the light source structure (40) is reflected by the reflective structure (50) to a to-be-scanned surface (60) of the image sensor, the to-be-scanned surface (60) being located on a side of the optical lens (30) away from the circuit substrate (20); The optical axes of the two light source structures (40) on at least one set of oppositely disposed side walls of the frame (10) are located on the same straight line, and the line connecting the light source structure (40) and the optical lens (30) is perpendicular to the optical axis of the optical lens (30).

2. The image sensor according to claim 1, It is characterized in that The reflective structure (50) is arranged at an acute angle or an obtuse angle with the optical axis of the optical lens (30).

3. The image sensor according to claim 1, It is characterized in that The image sensor further comprises a transparent plate (70), the transparent plate (70) being covered on the frame (10) and located on the light-emitting side of the frame (10), and a light-scattering film (80) being provided on a surface of the transparent plate (70) facing the optical lens (30).

4. The image sensor according to claim 1, It is characterized in that The image sensor further comprises a baffle (100), the baffles (100) being arranged on at least two sides of the light source structure (40), the extension direction of the baffle (100) being perpendicular to the extension direction of the optical axis of the optical lens (30), the baffle (100) on at least one side extending to the reflective structure (50), and a diffuse reflection coating being arranged on a surface of the baffle (100) on one side facing the light source structure (40).

5. The image sensor according to claim 1, It is characterized in that The image sensor further comprises a baffle (100), two baffles (100) being arranged corresponding to the same light source structure (40), a light channel being formed between the two baffles (100), the light source structure (40) being arranged at a first end of the light channel, a second end of the light channel being directed toward the reflective structure (50), and one of the baffles (100) being arranged between the circuit substrate (20) and the light source structure (40).

6. The image sensor according to claim 1, It is characterized in that The image sensor further comprises a reflector (200), wherein the reflectors (200) are multiple, and two reflectors (200) are correspondingly arranged for the same light source structure (40), a light channel is formed between the two reflectors (200), the light source structure (40) is arranged at a first end of the light channel, and a second end of the light channel faces the reflector structure (50), and one of the reflectors (200) is arranged between the circuit substrate (20) and the light source structure (40).

7. The image sensor according to claim 1, It is characterized in that The frame (10) comprises a set of first side walls (11) and second side walls (12) arranged opposite to each other, and the light source structure (40) is arranged on both the first side walls (11) and the second side walls (12).

8. The image sensor according to claim 7, It is characterized in that The frame (10) further comprises a bottom wall (13) connecting the first side wall (11) and the second side wall (12); the bottom wall (13) is arranged opposite to the light-emitting side of the frame (10); an installation space is formed between the first side wall (11) and the second side wall (12); the installation space is arranged close to the light-emitting side of the frame (10) relative to the bottom wall (13); the light source structure (40), the optical lens (30) and the reflective structure (50) are arranged in the installation space; and the circuit substrate (20) is arranged on the bottom wall (13).

9. The image sensor according to claim 1, It is characterized in that The light source structure (40) comprises an LED; and / or The reflective structure (50) comprises a reflector; and / or The image sensor further comprises a housing, the frame (10) is located inside the housing, and one side of the housing has the surface (60) to be scanned.

10. The image sensor according to any one of claims 1 to 9, It is characterized in that The image sensor further comprises a photoelectric conversion chip (90), the photoelectric conversion chip (90) being located on a surface of a side of the circuit substrate (20) facing the optical lens (30), and the photoelectric conversion chip (90) being arranged corresponding to the optical lens (30).

Images