A dry etching device for detector

Abstract

The present invention discloses a dry etching device for a detector, which is used for dry etching of wafers, and includes: an etching chamber, which is open; an etching assembly, which is arranged in the etching chamber; an air inlet box, which is connected to the etching chamber; a vacuum pumping device, which is connected to the etching chamber; a plurality of clamping parts, which are used to clamp the wafer; a power part, which is used to drive the clamping part to enter or leave the upper area of ​​the etching chamber; a closed ring; and a driving part, which is used to drive the closed ring to move, so as to seal the clamping part with the etching chamber. After the etching process is completed, the operation is stopped. The driving part is used to drive the sealing ring to descend, and the power part is used to drive the clamping part to move away, so that another clamping part and the wafer are located above the etching chamber, and the etching operation is repeated again. The etching process can be carried out continuously with high efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of dry etching, and in particular to a dry etching device for a detector. Background Art

[0002] Dry etching is a technology that uses plasma to etch thin films. When gas exists in the form of plasma, it has two characteristics: on the one hand, the chemical activity of the active radicals in the plasma is much stronger than that of the gas under normal conditions. According to the different materials to be etched, choosing the right gas can react with the material faster to achieve the purpose of etching and removal; on the other hand, the electric field can be used to guide and accelerate the plasma so that it has a certain amount of energy. When it bombards the surface of the etched object, it will knock out the atoms of the etched material, thereby achieving the purpose of etching by physical energy transfer. At present, dry etching can be carried out by a single chemical reaction method or by a combination of chemical etching and physical bombardment.

[0003] A dry etching machine and a dry etching method are disclosed in Chinese Patent Application No.: 201811646355.2, wherein the dry etching machine includes a process chamber for etching a wafer, the process chamber includes a bottom plate, a lifting component, a rotating component and a bearing component, and a wafer fixing device is provided on the bearing component. When dry etching is performed, the lifting component and the rotating component are adjusted so that the etching surface of the wafer faces downward, and the etching plasma is released from the pores on the bottom plate and diffuses upward to the etching surface. The dry etching machine can prevent impurities on the top and side walls of the process chamber from falling to the etching surface during the etching process and affecting the etching quality. For example, there is a patent application in Chinese Patent Application No.: 202021646878.X. These technical solutions cannot perform continuous processing operations, have low efficiency, and need further improvement. Summary of the invention

[0004] In order to solve at least one aspect of the technical problems existing in the background technology, the present invention provides a dry etching device for a detector with high efficiency.

[0005] The present invention provides a dry etching device for a detector, which is used for dry etching of a wafer, and comprises:

[0006] An etching chamber, which is open;

[0007] An etching component, disposed in the etching chamber;

[0008] an air inlet box, connected to the etching chamber;

[0009] A vacuum pumping device connected to the etching chamber;

[0010] A plurality of clamping parts, used for clamping the wafer;

[0011] A power unit, used to drive the clamping unit to enter or leave the upper area of ​​the etching chamber;

[0012] A closed loop;

[0013] A driving part is used to drive the closed ring to move so as to seal the clamping part and the etching chamber.

[0014] Preferably, the closed ring is sleeved on the etching chamber and enables the etching chamber to move in a vertical direction;

[0015] The driving part is a cylinder, and the output end of the cylinder is connected to the etching chamber.

[0016] Preferably, the power unit comprises:

[0017] Support plate;

[0018] A motor, whose output end is connected to the support plate; wherein,

[0019] A plurality of support plates are mounted on the support plate and distributed around the output end of the motor.

[0020] Preferably, the clamping portion comprises:

[0021] a clamping assembly mounted on the support plate;

[0022] a first sealing ring, mounted on the support plate and located around the clamping assembly;

[0023] The top of the closed ring is provided with a first receiving groove for receiving the first sealing ring.

[0024] Preferably, the clamping portion further comprises a second sealing ring mounted on the support plate and located around the clamping assembly; a second receiving groove for receiving the second sealing ring is provided at the top end of the closed ring.

[0025] Preferably, the cross-sectional width of the first sealing ring or the second sealing ring increases gradually from bottom to top.

[0026] Preferably, the clamping assembly comprises a plurality of clamping rods distributed in a circumferential direction, the clamping rods are connected to the support plate, and steps for placing wafers are provided on the clamping rods.

[0027] Preferably, the number of the steps is at least two.

[0028] Preferably, the clamping rod is detachably connected to the support plate.

[0029] Preferably, a plurality of air inlet holes are provided in the etching cavity, which are arranged around the etching cavity, and the plurality of air inlet holes are connected to the air inlet box.

[0030] The beneficial effects brought about by one aspect of the present invention are:

[0031] The wafer is clamped by the clamping part. The clamping part is driven to move by the power part so that the wafer is located above the etching cavity. The closed ring is driven to rise by the driving part to seal the space area between the clamping part and the etching cavity.

[0032] Then, the gas is extracted by vacuum equipment, and the inert gas is introduced into the etching chamber by the air inlet. The wafer is etched by the etching component.

[0033] After the etching process is completed, the operation is stopped. The driving part is used to drive the sealing ring to descend, and the power part is used to drive the clamping part to move away, so that another clamping part and the wafer are located above the etching chamber, and the etching operation is repeated again.

[0034] The etching process can be carried out continuously with high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the structure of one aspect disclosed in the present invention;

[0036] Figure 2 It is a schematic diagram of the structure of the closed ring disclosed in the present invention when it cooperates with the first sealing ring and the second sealing ring;

[0037] Figure 3 A top view of the closed loop disclosed in the present invention;

[0038] Figure 4 A top view of the first sealing ring and the second sealing ring disclosed in the present invention;

[0039] Figure 5 It is a schematic structural diagram of the clamping rod disclosed in the present invention. DETAILED DESCRIPTION

[0040] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other; the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left" and "right" indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the positions or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0042] Reference Figure 1-5 The present invention provides a dry etching device for a detector, which is used for dry etching of a wafer, and comprises:

[0043] An etching chamber 1 is open; an etching assembly 2 is arranged in the etching chamber 1; an air inlet box 3 is connected to the etching chamber 1; a vacuum pump 4 is connected to the etching chamber 1; a plurality of clamping parts are used to clamp the wafer; a power part is used to drive the clamping part to enter or leave the upper area of ​​the etching chamber 1; a closed ring 5; a driving part 6 is used to drive the closed ring 5 to move so as to seal the clamping part and the etching chamber 1.

[0044] The wafer is clamped by the clamping part. The clamping part is driven to move by the power part so that the wafer is located above the etching chamber 1. The sealing ring 5 is driven to rise by the driving part 6 to seal the space area between the clamping part and the etching chamber 1. Figure 2 shown.

[0045] Then, the vacuum device 4 is used to extract the gas, and the etching gas is introduced through the gas inlet box 3 body 1. The etching component 2 is used to etch the wafer.

[0046] After the etching process is completed, the operation is stopped, the sealing ring is driven down by the driving part 6, and the clamping part is driven away by the power part, so that another clamping part and the wafer are located above the etching chamber 1, and the etching operation is repeated again.

[0047] This embodiment can perform etching processing operations continuously with high efficiency.

[0048] As a further improvement of the above embodiment, in one implementation, the closed ring 5 is sleeved on the etching chamber 1 and can move the etching chamber 1 in a vertical direction; the driving part 6 is a cylinder, and the output end of the cylinder is connected to the etching chamber 1. The closed ring 5 can be driven to rise and fall by the cylinder.

[0049] As a further improvement of the above embodiment, in one implementation, the power unit includes:

[0050] A support plate 7; a motor 8, whose output end is connected to the support plate 7; wherein a plurality of the clamping parts are mounted on the support plate 7 and distributed around the output end of the motor 8. The motor 8 can be used to drive the support plate 7 to rotate and adjust the position of the clamping part to facilitate continuous processing.

[0051] As a further improvement of the above embodiment, in one embodiment, the clamping portion includes:

[0052] A clamping assembly is mounted on the support plate 7; a first sealing ring 9 is mounted on the support plate 7 and is located around the clamping assembly; the top of the closing ring 5 is provided with a first receiving groove 11 for receiving the first sealing ring 9. When the wafer is located on the etching chamber 1, the cylinder is used to drive the closing ring 5 to rise, so that the first sealing ring 9 enters the first receiving groove 11 to achieve sealing. Figure 2 shown.

[0053] As a further improvement of the above embodiment, in one embodiment, the clamping portion further includes a second sealing ring 10, which is mounted on the support plate 7 and is located around the clamping assembly; the top of the closing ring 5 is provided with a second receiving groove 12 for receiving the second sealing ring 10. When the wafer is located on the etching chamber 1, the cylinder is used to drive the closing ring 5 to rise, so that the second sealing ring 10 enters the second receiving groove 12 to achieve sealing. Figure 2 By providing the first sealing ring 9, the second sealing ring 10, the first receiving groove 11, and the second receiving groove 12, a double-layer sealing process is achieved, and the sealing effect is good.

[0054] As a further improvement of the above embodiment, in one implementation, the cross-sectional width of the first sealing ring 9 or the second sealing ring 10 gradually increases from bottom to top, so as to facilitate the first sealing ring 9 or the second sealing ring 10 to enter the first receiving groove 11 or the second receiving groove 12 .

[0055] As a further improvement of the above embodiment, in one implementation, the clamping assembly includes a plurality of clamping rods 13 distributed circumferentially, the clamping rods 13 are connected to the support plate 7, and the clamping rods 13 are provided with steps 14 for placing wafers. Figure 1 , 2 As shown in FIG. 5 , the wafer is placed on the step 14 and supported by the clamping rod 13 .

[0056] As a further improvement of the above embodiment, in one implementation, the number of the steps 14 is at least two, so as to facilitate supporting wafers of different sizes and have good adaptability.

[0057] As a further improvement of the above embodiment, in one implementation, the clamping rod 13 is detachably connected to the support plate 7, so as to facilitate replacement of the clamping rod 13 and placement of the clamping rod 13.

[0058] As a further improvement of the above embodiment, in one implementation, the etching chamber 1 is provided with a plurality of air inlet holes 15, which are arranged around the etching chamber 1, and the plurality of air inlet holes 15 are connected to the air inlet box 3, so that the gas flow is evenly distributed and the etching effect is improved.

[0059] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A dry etching device for a detector, used for dry etching of a wafer, characterized in that: include: An etching cavity, which is open; An etching component, disposed in the etching chamber; an air inlet box, connected to the etching chamber; A vacuum pumping device connected to the etching chamber; A plurality of clamping parts, used for clamping the wafer; A power unit, used to drive the clamping unit to enter or leave the upper area of ​​the etching chamber; A closed loop; a driving part, used for driving the closed ring to move so as to seal the clamping part and the etching chamber; The closed ring is sleeved on the etching chamber and enables the etching chamber to move in a vertical direction; The driving part is a cylinder, and the output end of the cylinder is connected to the etching chamber; The clamping portion comprises: a clamping assembly mounted on the support plate; a first sealing ring, mounted on the support plate and located around the clamping assembly; The top of the closed ring is provided with a first receiving groove for receiving the first sealing ring; The clamping portion further comprises a second sealing ring, which is mounted on the support plate and is located around the clamping assembly; a second receiving groove for receiving the second sealing ring is provided at the top of the closed ring; The cross-sectional width of the first sealing ring or the second sealing ring gradually increases from bottom to top; The clamping assembly comprises a plurality of clamping rods distributed in a circumferential direction, the clamping rods are connected to the support plate, and the clamping rods are provided with steps for placing wafers; When the wafer is located on the etching chamber, the cylinder is used to drive the sealing ring to rise, so that the first sealing ring enters the first receiving groove; and the second sealing ring enters the second receiving groove to achieve sealing.

2. According to the dry etching device for a detector according to claim 1, the power unit comprises: Support plate; A motor, whose output end is connected to the support plate; wherein, A plurality of the clamping parts are mounted on the support plate and distributed around the output end of the motor. 3 . The dry etching device for a detector according to claim 2 , wherein the number of the steps is at least two. 4 . According to the dry etching device for a detector as described in claim 3 , the clamping rod is detachably connected to the support plate.

5. According to the dry etching device for the detector according to claim 1, a plurality of air inlet holes are provided in the etching chamber, which are arranged around the etching chamber, and the plurality of air inlet holes are connected to the air inlet box.

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