Injection control method, device, electronic device and storage medium

Abstract

The embodiment of the present invention discloses a material injection control method, device, electronic device and storage medium, which specifically relates to the field of intelligent manufacturing technology. The method comprises: using ultra-wideband (UWB) positioning technology to locate a target mold and obtain the current position of the target mold; determining whether the current position of the target mold belongs to a preset material injection area of ​​the material injection device; when the current position of the target mold belongs to the preset material injection area, obtaining the material injection configuration information of the material injection device and obtaining the mold configuration information of the target mold; determining whether the material injection configuration information matches the mold configuration information; if the material injection configuration information matches the mold configuration information, controlling the material injection device to inject material into the target mold, and if the material injection configuration information does not match the mold configuration information, issuing an alarm prompt. The embodiment of the present invention can reduce the error rate of material injection and improve production efficiency and product quality.

Description

Technical Field

[0001] The embodiments of the present invention relate to manufacturing technology, and more particularly to a material injection control method, device, electronic device and storage medium. Background Art

[0002] In the manufacturing field, mold injection is one of the most important links in the factory production line. However, in the process of injection equipment injecting materials into the mold, injection errors such as over-injection, under-injection, and wrong injection are very likely to occur, which seriously affects production costs and efficiency, and slows down the transformation and upgrading of enterprises from traditional manufacturing to intelligent manufacturing. Summary of the invention

[0003] The embodiments of the present invention provide a material injection control method, device, electronic device and storage medium, which can reduce the material injection error rate and improve production efficiency and product quality.

[0004] In a first aspect, an embodiment of the present invention provides a material injection control method, comprising:

[0005] Using ultra-wideband (UWB) positioning technology to locate the target mold, and obtaining the current position of the target mold;

[0006] Determining whether the current position of the target mold belongs to a preset injection area of ​​the injection equipment;

[0007] When the current position of the target mold belongs to the preset injection area, obtaining injection configuration information of the injection equipment and obtaining mold configuration information of the target mold;

[0008] Determining whether the injection configuration information matches the mold configuration information;

[0009] If the injection configuration information matches the mold configuration information, the injection device is controlled to inject material into the target mold; if the injection configuration information does not match the mold configuration information, an alarm is issued.

[0010] In a second aspect, an embodiment of the present invention provides an injection control device, comprising:

[0011] A positioning module is used to locate the target mold using ultra-wideband (UWB) positioning technology to obtain the current position of the target mold;

[0012] A determination module, used to determine whether the current position of the target mold belongs to a preset injection area of ​​the injection equipment;

[0013] an acquisition module, used for acquiring the injection configuration information of the injection equipment and acquiring the mold configuration information of the target mold when the current position of the target mold belongs to the preset injection area;

[0014] A matching module, used to determine whether the injection configuration information matches the mold configuration information;

[0015] The control module is used to control the injection device to inject material into the target mold if the injection configuration information matches the mold configuration information, and to issue an alarm if the injection configuration information does not match the mold configuration information.

[0016] In a third aspect, an embodiment of the present invention further provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, an injection control method as described in any one of the embodiments of the present invention is implemented.

[0017] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the injection control method as described in any one of the embodiments of the present invention.

[0018] In the embodiment of the present invention, the ultra-wideband UWB positioning technology can be used to locate the target mold to obtain the current position of the target mold; determine whether the current position of the target mold belongs to the preset injection area of ​​the injection equipment; when the current position of the target mold belongs to the preset injection area, obtain the injection configuration information of the injection equipment, and obtain the mold configuration information of the target mold; determine whether the injection configuration information matches the mold configuration information; if the injection configuration information matches the mold configuration information, control the injection equipment to inject material into the target mold, and if the injection configuration information does not match the mold configuration information, issue an alarm prompt. That is, the embodiment of the present invention can rely on UWB high-precision positioning technology to sense the position of the mold in real time, and when sensing that the mold enters the injection area of ​​the injection equipment, introduce an information proofreading mechanism, and determine whether to control the injection equipment to inject material into the mold through information matching, thereby reducing the injection error rate and improving production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a flow chart of the injection control method provided in an embodiment of the present invention.

[0021] Figure 2 It is another flow chart of the injection control method provided in an embodiment of the present invention.

[0022] Figure 3 It is a structural schematic diagram of the injection control device provided in an embodiment of the present invention.

[0023] Figure 4 It is a structural schematic diagram of the injection control system provided by an embodiment of the present invention.

[0024] Figure 5 It is a structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0026] Figure 1 A flow chart of the injection control method provided in an embodiment of the present invention is provided. The method can be executed by the injection control device provided in an embodiment of the present invention. The device can be implemented in software and / or hardware. In a specific embodiment, the device can be integrated in an electronic device, the electronic device can be a server, and the server can be a background server corresponding to an ultra-wideband (UWB) positioning system. The following embodiments will be described by taking the device integrated in an electronic device as an example. Figure 1 , the method may specifically include the following steps:

[0027] Step 101: Use ultra-wideband (UWB) positioning technology to locate the target mold and obtain the current position of the target mold.

[0028] UWB technology is a wireless carrier communication technology that does not use a sinusoidal carrier but uses nanosecond non-sinusoidal narrow pulses to transmit data, so it occupies a wide spectrum range. UWB technology has the advantages of low system complexity, low power spectrum density of transmitted signals, insensitivity to channel fading, low interception capability, and high positioning accuracy. It is more suitable for high-speed wireless access in dense multipath places such as indoors. Specifically, in an embodiment of the present invention, UWB technology is applied to an indoor production line to locate related equipment on the production line.

[0029] Specifically, the relevant equipment that needs to be positioned on the production line may include molds and injection equipment. Both the molds and injection equipment may include one or more. A UWB microtag (i.e., mold tag) may be installed on each mold, and the mold tag may be bound to the corresponding mold (for example, the mold tag and the mold may be bound through the identification information of the mold tag and the identification information of the mold, and the identification information may be a model, number, etc.). The mold tag is used to locate the corresponding mold; a UWB microtag (i.e., device tag) may be installed on each injection equipment, and the device tag may be bound to the corresponding injection equipment (for example, the device tag and the injection equipment may be bound through the identification information of the device tag and the identification information of the injection equipment, and the identification information may be a model, number, etc.). The device tag is used to locate the corresponding injection equipment. The specific installation method of the UWB microtag may be to place or adsorb the UWB microtag on the corresponding equipment. The UWB microtag is a battery-powered positioning device that can be used to transmit UWB signals. Different UWB microtags may have different identification information.

[0030] In addition, multiple UWB micro base stations can be deployed around the production line. The specific number of UWB micro base stations can be determined according to actual needs. The more base stations there are, the more accurate the positioning results will be, but the resulting positioning hardware cost will be higher and the amount of positioning calculation data will be larger. The UWB micro tag can be used to transmit UWB signals and the UWB micro base station can be used to receive UWB signals, so as to realize the positioning of molds and injection equipment. This positioning technology is UWB positioning technology. In practical applications, on the injection production line, the position of the injection equipment is generally fixed, so the position of the injection equipment located by the equipment tag is generally fixed. The mold will move with the conveyor belt, so the position of the mold located by the mold tag is generally variable, so the injection equipment can be located once, and the mold needs to be located in real time and continuously. For example, the target mold can be any mold that needs to be located on the injection production line. The UWB positioning technology can be used to locate the target mold in real time to obtain the current position of the target mold.

[0031] Step 102 , determining whether the current position of the target mold belongs to a preset injection area of ​​the injection equipment, if yes, executing step 103 , if no, returning to executing step 101 .

[0032] Specifically, an electronic map of the injection production line can be created in advance, and the injection equipment can be located using UWB positioning technology to obtain the specific location of the injection equipment, and the specific location of the injection equipment can be marked on the electronic map, and an area can be circled on the electronic map according to the specific location of the injection equipment marked on the electronic map, thereby obtaining a preset injection area of ​​the injection equipment. For example, a circular area, a square area, a rectangular area, etc. can be circled on the electronic map with the specific location of the injection equipment as the center.

[0033] For example, the current position of the target mold can be represented by coordinates, and the preset injection area can be represented by a coordinate set. It can be determined whether the coordinates of the current position of the target mold belong to the coordinate set of the preset injection area; if so, it is determined that the current position of the target mold belongs to the preset injection area; if not, it is determined that the current position of the target mold does not belong to the preset injection area. When the current position of the target mold does not belong to the preset injection area, the UWB positioning technology can continue to be used to locate the target mold.

[0034] In addition, after obtaining the current position of the target mold, the current position of the target mold can be marked on the electronic map in real time, and whether the target mold enters the preset injection area of ​​the injection equipment can be determined by detecting the electronic map.

[0035] Step 103, obtaining injection configuration information of the injection equipment, and obtaining mold configuration information of the target mold.

[0036] For example, the injection configuration information may include basic information of a preset mold and basic information of a material to be injected into the preset mold, wherein the basic information of the mold may include the state of the mold (such as in use, idle, abandoned, faulty, etc.), model, number, name, etc., and the basic information of the material may include the model, number, name, injection volume, etc. of the material. The preset mold may include one or more preset molds. When there are multiple preset molds, the injection configuration information may include basic information of each preset mold and basic information of the material to be injected into each preset mold.

[0037] For example, the mold configuration information may include basic information of the target mold and basic information of the material to be injected into the target mold, or the mold configuration information may only include basic information of the target mold. The basic information of the target mold may also include the state, model, number, name, etc. of the target mold, and the basic information of the material to be injected into the target mold may also include the model, number, name, injection amount, etc. of the material.

[0038] In a specific embodiment, for example, the injection configuration information of the injection equipment may be as shown in Table 1 below:

[0039]

[0040]

[0041] Table 1

[0042] As shown in Table 1, the injection equipment can inject materials into three preset molds, the numbers of the three molds are 1, 2, and 3, and the models are A, B, and C; the numbers of the materials to be injected into the three molds are 11, 22, and 33, and the injection amounts of the materials to be injected are X, Y, and Z. It should be noted that Table 1 is only an example and does not constitute a limitation on the specific implementation.

[0043] Step 104 , determining whether the injection configuration information matches the mold configuration information. If the injection configuration information matches the mold configuration information, executing step 105 ; if the injection configuration information does not match the mold configuration information, executing step 106 .

[0044] Specifically, when the mold configuration information only includes the basic information of the target mold, it can be determined whether the basic information of the preset mold included in the injection configuration information contains the basic information of the target mold. If so, it is determined that the injection configuration information matches the mold configuration information. If not, it is determined that the injection configuration information does not match the mold configuration information. This method can avoid injection errors caused by incorrect mold use. When the mold configuration information includes the basic information of the target mold and the basic information of the material to be injected into the target mold, it can be determined that: (1) whether the basic information of the preset mold included in the injection configuration information contains the basic information of the target mold; (2) whether the basic information of the material to be injected into the preset mold included in the injection configuration information is the same as the basic information of the material to be injected into the target mold; when the judgment result of (1) is yes and the judgment result of (2) is the same, it is determined that the injection configuration information matches the mold configuration information. Otherwise, it is determined that the injection configuration information does not match the mold configuration information. This method can avoid injection errors caused by incorrect mold use and incorrect material information writing.

[0045] For example, the injection configuration information is shown in Table 1. If the mold configuration information of the target mold is mold number 2 and mold model B, it can be determined that the injection configuration information matches the mold configuration information of the target mold; or if the mold configuration information of the target mold is mold number 2, mold model B, material number 22, and injection volume Y, it can also be determined that the injection configuration information matches the mold configuration information of the target mold; in addition, if the mold configuration information of the target mold is mold number 2, mold model B, material number 33, and injection volume Z, that is, the basic mold information of the two matches, but the basic material information does not match, then it is determined that the mold configuration information of the target mold does not match the injection configuration information of the material equipment.

[0046] Step 105, controlling the injection equipment to inject material into the target mold.

[0047] Specifically, the injection equipment can be controlled to inject material into the target mold according to the injection configuration information. For example, if the injection configuration information is shown in Table 1, the mold number of the target mold is 2 and the mold model is B, then the injection equipment can be controlled to inject material numbered 22 into the target mold, and the injection amount is Y.

[0048] Step 106: issue an alarm.

[0049] For example, the injection equipment can be controlled to emit sound, light and other alarm signals to alert relevant personnel of injection abnormalities; or alarm information can be generated and sent to a terminal to alert relevant personnel of injection abnormalities through the terminal. The terminal can be a mobile phone, computer, etc., and the relevant personnel can be operators and / or managers of the production line.

[0050] In the embodiment of the present invention, the ultra-wideband UWB positioning technology can be used to locate the target mold to obtain the current position of the target mold; determine whether the current position of the target mold belongs to the preset injection area of ​​the injection equipment; when the current position of the target mold belongs to the preset injection area, obtain the injection configuration information of the injection equipment, and obtain the mold configuration information of the target mold; determine whether the injection configuration information matches the mold configuration information; if the injection configuration information matches the mold configuration information, control the injection equipment to inject material into the target mold, and if the injection configuration information does not match the mold configuration information, issue an alarm prompt. That is, the embodiment of the present invention can rely on UWB high-precision positioning technology to sense the position of the mold in real time, and when sensing that the mold enters the injection area of ​​the injection equipment, introduce an information proofreading mechanism, and determine whether to control the injection equipment to inject material into the mold through information matching, thereby reducing the injection error rate and improving production efficiency and product quality.

[0051] The injection control method provided by the embodiment of the present invention is further described below. Figure 2 As shown, the injection control method of this embodiment may include the following steps:

[0052] Step 201 : acquiring injection configuration information of an injection device and mold configuration information of a target mold from a production management server.

[0053] For example, the production management server may be a backend server corresponding to the Manufacturing Execution System (MES), which is a production information management system for the execution layer of the workshop of a manufacturing enterprise, and can provide the enterprise with manufacturing data management, planning and scheduling management, production scheduling management, inventory management, etc. In the embodiment of the present invention, the injection configuration information of the injection equipment and the mold configuration information of the target mold can be obtained from the production management server.

[0054] Specifically, the injection configuration information may include basic information of the preset mold and basic information of the material to be injected into the preset mold, wherein the basic information of the mold may include the state of the mold (such as in use, idle, abandoned, faulty, etc.), model, number, name, etc., and the basic information of the material may include the model, number, name, injection volume, etc. of the material. The preset mold may include one or more preset molds. When there are multiple preset molds, the injection configuration information may include basic information of each preset mold and basic information of the material to be injected into each preset mold.

[0055] Specifically, the mold configuration information may include basic information of the target mold and basic information of the material to be injected into the target mold, or the mold configuration information may only include basic information of the target mold. The basic information of the target mold may also include the state, model, number, name, etc. of the target mold, and the basic information of the material to be injected into the target mold may also include the model, number, name, injection amount, etc. of the material.

[0056] Step 202, writing the injection configuration information into the equipment tag, and writing the mold configuration information into the mold tag.

[0057] Specifically, multiple UWB micro base stations can be deployed around the production line, and a UWB micro tag (i.e., device tag) can be installed on each injection device, and the device tag installed on each injection device can be bound to the corresponding injection device. The device tag is used to locate the corresponding injection device; a UWB micro tag (i.e., mold tag) can be installed on each mold, and the mold tag installed on each mold can be bound to the corresponding mold. The mold tag is used to locate the corresponding mold. After obtaining the injection configuration information of the injection device, the injection configuration information can be written into the device tag installed on the corresponding injection device. After obtaining the mold configuration information of the mold, the mold configuration information can be written into the mold tag installed on the corresponding mold.

[0058] Step 203 , obtaining the equipment positioning data obtained by each base station when positioning the injection equipment. The injection equipment is equipped with an equipment tag, and the equipment positioning data is obtained by each base station by measuring the UWB signal emitted by the equipment tag.

[0059] For example, after the positioning is started, the device tag installed on the injection device will emit a UWB signal, and each base station will receive the UWB signal emitted by the device tag. Each base station will measure the transmission time of the UWB signal from the device tag to the corresponding base station, and calculate the distance between the device tag and the corresponding base station according to the transmission time and the signal transmission speed. The distance between the device tag and itself calculated by each base station is the device positioning data. Each base station can report the device positioning data calculated by itself to the electronic device, or a main base station can be determined from multiple base stations, and the main base station reports the device positioning data calculated by each base station to the electronic device, and the electronic device obtains the device positioning data of each base station. For example, multiple base stations include base station 1, base station 2 and base station 3, and these three base stations can directly send the device positioning data calculated by themselves to the electronic device; when the main base station is specified from the three base stations, the main base station can send the device positioning data of the three base stations to the electronic device. For example, if the main base station is specified as base station 1, base station 2 and base station 3 can send their respective device positioning data to base station 1, and base station 1 sends the device positioning data of the three base stations to the electronic device.

[0060] Step 204 , calculating the current position of the injection equipment according to the equipment positioning data and the preset position information of each base station.

[0061] For example, the preset location information of each base station is fixed known data, and the time-of-arrival (TOA) positioning method, the time difference of arrival (TDOA) positioning method, etc. can be used to calculate the equipment positioning data and the preset location information of each base station, so as to obtain the current location of the injection equipment. On the injection production line, the location of the injection equipment is generally fixed, so the location of the injection equipment located by the equipment tag is generally fixed, so the injection equipment only needs to be located once.

[0062] Step 205, setting a preset injection area according to the current position of the injection equipment.

[0063] Specifically, an electronic map of the injection production line can be created in advance, and the injection equipment can be located using UWB positioning technology to obtain the specific location of the injection equipment. The specific location of the injection equipment can be marked on the electronic map, and an area can be circled on the electronic map based on the specific location of the injection equipment marked on the electronic map to obtain the preset injection area of ​​the injection equipment.

[0064] Step 206 , obtaining mold positioning data obtained by each base station by positioning the target mold. A mold tag is installed on the target mold, and the mold positioning data is obtained by each base station by measuring the UWB signal emitted by the mold tag.

[0065] The target mold can be any mold that needs to be positioned. Similarly, after the positioning is started, the mold tag installed on the target mold will emit a UWB signal, and each base station will receive the UWB signal emitted by the mold tag. Each base station will measure the transmission time of the UWB signal from the mold tag to the corresponding base station, and calculate the distance between the mold tag and the corresponding base station based on the transmission time and the signal transmission speed. The distance between the mold tag and itself calculated by each base station is the mold positioning data. Each base station can report the mold positioning data calculated by itself to the electronic device, or a main base station can be determined from multiple base stations, and the main base station will report the mold positioning data calculated by each base station to the electronic device, and the electronic device obtains the mold positioning data of each base station.

[0066] Step 207: Calculate the current position of the target mold according to the mold positioning data and the preset position information of each base station.

[0067] The method for calculating the current position of the target mold can be the same as the method for calculating the current position of the injection equipment, which will not be repeated here. On the injection production line, the mold will move with the conveyor belt, so the position of the mold located by the mold label is generally changing, so the mold needs to be located in real time and continuously.

[0068] In addition, after obtaining the current position of the target mold, the current position of the target mold can be marked in real time on the electronic map, so as to facilitate the monitoring of the target mold. Subsequently, the electronic map can be detected to determine whether the target mold enters the preset injection area of ​​the injection equipment.

[0069] Step 208, determining whether the current position of the target mold belongs to the preset injection area of ​​the injection equipment, if yes, executing step 209, if no, returning to step 206 to continue positioning.

[0070] That is, to determine whether the target mold enters the preset injection area of ​​the injection equipment, it can be determined by the belonging relationship of the coordinates or by detecting the electronic map, which is not specifically limited here.

[0071] Step 209 , determining whether the number of molds in the preset injection area is 1, if it is 1, executing step 210 , if not 1, executing step 213 .

[0072] Generally speaking, in order to ensure production safety and avoid injection errors, there can only be one mold in the preset injection area of ​​an injection device. Therefore, after the target mold enters the preset injection area of ​​the injection equipment, it can be determined by positioning whether the number of molds in the preset injection area is 1. If the number of molds in the preset injection area is not 1, it means that there are other molds also staying in the preset injection area at this time, and an alarm prompt can be issued.

[0073] Step 210 : acquiring injection configuration information of an injection device from a device tag through a plurality of base stations, and acquiring mold configuration information of a target mold from a mold tag through a plurality of base stations.

[0074] In a specific implementation, the injection configuration information and the device positioning data can be obtained at the same time or separately. That is, the device tag can transmit the injection configuration information stored in the device tag while transmitting the UWB signal, so the electronic device can obtain the injection configuration information when obtaining the device positioning data from the base station; or the device tag can only transmit the UWB signal, and when needed later, the device tag will transmit the injection configuration information stored in the device tag, so the electronic device can first obtain the device positioning data through the base station, and then obtain the injection configuration information through the base station.

[0075] Specifically, the mold configuration information and mold positioning data can be obtained at the same time or separately. That is, the mold tag can transmit the mold configuration information stored in the mold tag while transmitting the UWB signal, so the electronic device can obtain the mold configuration information when obtaining the mold positioning data from the base station; or the mold tag can only transmit the UWB signal, and when needed later, the mold tag will transmit the mold configuration information stored in the mold tag, so the electronic device can first obtain the mold positioning data through the base station, and then obtain the mold configuration information through the base station.

[0076] Step 211, determine whether the injection configuration information matches the mold configuration information, if they match, execute step 212, if they do not match, execute step 213.

[0077] Specifically, when the mold configuration information only includes the basic information of the target mold, it can be determined whether the basic information of the preset mold included in the injection configuration information contains the basic information of the target mold. If so, it is determined that the injection configuration information matches the mold configuration information. If not, it is determined that the injection configuration information does not match the mold configuration information. When the mold configuration information includes the basic information of the target mold and the basic information of the material to be injected into the target mold, it can be determined whether the basic information of the preset mold included in the injection configuration information contains the basic information of the target mold, and whether the basic information of the material to be injected into the preset mold included in the injection configuration information is the same as the basic information of the material to be injected into the target mold; when the basic information of the preset mold included in the injection configuration information contains the basic information of the target mold, and the basic information of the material to be injected into the preset mold included in the injection configuration information is the same as the basic information of the material to be injected into the target mold, it is determined that the injection configuration information matches the mold configuration information, otherwise, it is determined that the injection configuration information does not match the mold configuration information.

[0078] Step 212, controlling the injection equipment to inject material into the target mold.

[0079] Specifically, the injection equipment can be controlled to inject material into the target mold according to the injection configuration information. In addition, before controlling the injection equipment to inject material into the target mold, it is also possible to determine whether the material on the injection equipment is sufficient (for example, it can be determined whether the remaining material amount on the injection equipment exceeds a preset amount, which is sufficient). If sufficient, the injection equipment is controlled to inject material into the target mold. If insufficient, an alarm is issued to prompt relevant personnel to replenish the material for the injection equipment.

[0080] Step 213, issuing an alarm prompt.

[0081] For example, the injection equipment can be controlled to emit sound, light and other alarm signals to alert relevant personnel of injection abnormalities; or alarm information can be generated and sent to a terminal to alert relevant personnel of injection abnormalities through the terminal. The terminal can be a mobile phone, computer, etc., and the relevant personnel can be operators and / or managers of the production line.

[0082] In some embodiments, when determining that the current position of the target mold belongs to the preset injection area, the following steps may also be included:

[0083] Obtain the residence time of the target mold in the preset injection area;

[0084] When the residence time exceeds the preset time threshold, an alarm will be issued.

[0085] That is, the time from the target mold entering the preset injection area to leaving the preset injection area can be monitored. If the time is greater than the preset time threshold, it means that an injection abnormality may have occurred, and an alarm can be issued. The preset time threshold can be set according to the conveying speed of the conveyor belt.

[0086] Specifically, segmented monitoring can also be performed, that is, the dwell time can include a first dwell time and a second dwell time. The first dwell time can be the time from when the target mold enters the preset injection area to when it reaches the injection point, and injection starts after arriving at the injection point. The second dwell time can be the time from when the target mold leaves the injection point to when it leaves the preset injection area. It is determined whether the first dwell time exceeds the first preset time threshold. If so, an alarm is issued; if not, the waiting process continues. It is determined whether the second dwell time exceeds the second preset time threshold. If so, an alarm is issued; if not, the waiting process continues. The first preset time threshold and the second preset time threshold can be the same or different, and are not specifically limited here.

[0087] Furthermore, after the target mold leaves the preset injection area, production process record information, alarm prompt record information, etc. can also be generated, and the generated information can be stored in a database for inspection.

[0088] In the embodiment of the present invention, the target mold can be positioned by using ultra-wideband UWB positioning technology to obtain the current position of the target mold; determine whether the current position of the target mold belongs to the preset injection area of ​​the injection equipment; when the current position of the target mold belongs to the preset injection area, obtain the injection configuration information of the injection equipment, and obtain the mold configuration information of the target mold; determine whether the injection configuration information matches the mold configuration information; if the injection configuration information matches the mold configuration information, control the injection equipment to inject material into the target mold, and if the injection configuration information does not match the mold configuration information, issue an alarm prompt. That is, the embodiment of the present invention can rely on UWB high-precision positioning technology to sense the position of the mold in real time, and when sensing that the mold enters the injection area of ​​the injection equipment, introduce an information proofreading mechanism, and determine whether to control the injection equipment to inject material into the mold through information matching, thereby avoiding injection errors caused by incorrect mold use, material information writing errors, etc., reducing the injection error rate, and improving production efficiency and product quality.

[0089] Furthermore, combining UWB positioning with MES realizes intelligent production management and visual control of molds, saving manpower and time costs.

[0090] In addition, the method provided in the embodiment of the present invention mainly introduces the use of UWB positioning technology to locate molds and injection equipment for the sake of positioning precision and accuracy. In actual applications, if the requirements for positioning precision and accuracy are not high, other positioning technologies can be used as substitutes, such as Wi-Fi, Bluetooth and other technologies for positioning, which are not specifically limited here.

[0091] Figure 3 1 is a structural diagram of an injection control device provided in an embodiment of the present invention, and the device is suitable for executing the injection control method provided in an embodiment of the present invention. Figure 3 As shown, the device may specifically include:

[0092] The positioning module 301 is used to locate the target mold by using ultra-wideband (UWB) positioning technology to obtain the current position of the target mold;

[0093] A determination module 302 is used to determine whether the current position of the target mold belongs to a preset injection area of ​​the injection equipment;

[0094] An acquisition module 303 is used to acquire the injection configuration information of the injection equipment and the mold configuration information of the target mold when the current position of the target mold belongs to the preset injection area;

[0095] A matching module 304 is used to determine whether the injection configuration information matches the mold configuration information;

[0096] The control module 305 is used to control the injection device to inject material into the target mold if the injection configuration information matches the mold configuration information, and to issue an alarm if the injection configuration information does not match the mold configuration information.

[0097] In one embodiment, the positioning module 301 is specifically used for:

[0098] Acquire mold positioning data obtained by each of a plurality of base stations positioning the target mold, wherein a mold tag is installed on the target mold, and the mold positioning data is obtained by each base station by measuring a UWB signal emitted by the mold tag, and the plurality of base stations are deployed around the injection molding production line;

[0099] The current position of the target mold is calculated according to the mold positioning data and the preset position information of each base station.

[0100] In one embodiment, the positioning module 301 is further used to locate the injection device using the UWB positioning technology to obtain the current position of the injection device;

[0101] The device also includes:

[0102] A setting module is used to set the preset injection area according to the current position of the injection equipment.

[0103] In one embodiment, the positioning module 301 uses the UWB positioning technology to locate the injection device to obtain the current position of the injection device, including:

[0104] Acquire equipment positioning data obtained by each base station locating the injection equipment, wherein an equipment tag is installed on the injection equipment, and the equipment positioning data is obtained by each base station by measuring a UWB signal emitted by the equipment tag;

[0105] The current position of the injection equipment is calculated according to the equipment positioning data and the preset position information of each base station.

[0106] In one embodiment, the device further comprises:

[0107] A writing module, used for obtaining the injection configuration information and the mold configuration information from a production management server; writing the injection configuration information into the device tag, and writing the mold configuration information into the mold tag;

[0108] The acquisition module 303 is specifically used for:

[0109] The injection configuration information of the injection equipment is acquired from the equipment tag through the multiple base stations, and the mold configuration information of the target mold is acquired from the mold tag through the multiple base stations.

[0110] In one embodiment, the determination module 302 is also used to determine the number of molds in the preset injection area; if the number of molds is 1, the acquisition module 303 is triggered to execute the steps of acquiring the injection configuration information of the injection equipment and acquiring the mold configuration information of the target mold; if the number of molds is not 1, the control module 305 is triggered to issue the alarm prompt.

[0111] In one embodiment, the acquisition module 303 is further used to acquire the residence time of the target mold in the preset injection area; when the residence time exceeds a preset time threshold, the control module 305 is triggered to issue the alarm prompt.

[0112] In one embodiment, the injection configuration information includes basic information of a preset mold and basic information of a material to be injected into the preset mold, and the mold configuration information includes basic information of a target mold and basic information of a material to be injected into the target mold. The matching module 304 is specifically used to:

[0113] Determine whether the basic information of the target mold matches the basic information of the preset mold, and determine whether the basic information of the material to be injected into the target mold matches the basic information of the material to be injected into the preset mold;

[0114] If the basic information of the target mold matches the basic information of the preset mold, and the basic information of the material to be injected into the target mold matches the basic information of the material to be injected into the preset mold, it is determined that the injection configuration information matches the mold configuration information.

[0115] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example for illustration. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the functional modules described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0116] The device of the embodiment of the present invention can use ultra-wideband UWB positioning technology to locate the target mold and obtain the current position of the target mold; determine whether the current position of the target mold belongs to the preset injection area of ​​the injection equipment; when the current position of the target mold belongs to the preset injection area, obtain the injection configuration information of the injection equipment and obtain the mold configuration information of the target mold; determine whether the injection configuration information matches the mold configuration information; if the injection configuration information matches the mold configuration information, control the injection equipment to inject material into the target mold, and if the injection configuration information does not match the mold configuration information, issue an alarm prompt. That is, the embodiment of the present invention can rely on UWB high-precision positioning technology to sense the position of the mold in real time, and when sensing that the mold enters the injection area of ​​the injection equipment, introduce an information proofreading mechanism, and determine whether to control the injection equipment to inject material into the mold through information matching, thereby reducing the injection error rate and improving production efficiency and product quality.

[0117] An embodiment of the present invention further provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the injection control method provided in any of the above embodiments when executing the program.

[0118] An embodiment of the present invention further provides a computer-readable medium on which a computer program is stored. When the program is executed by a processor, the injection control method provided by any of the above embodiments is implemented.

[0119] The embodiment of the present invention also provides a material injection control system, such as Figure 4 As shown, it includes an injection device 401, a target mold 402, a base station 403, a production management server 404 and an electronic device 405. The injection device 401 is installed with an equipment tag 4011, and the target mold 402 is installed with a mold tag 4022. There can be multiple base stations 403. The electronic device 405 is used to execute the injection control method provided by the embodiment of the present invention. The specific process can be found in the description of the previous embodiment, which will not be repeated here.

[0120] Reference below Figure 5 , which shows a schematic diagram of the structure of a computer system 500 of an electronic device suitable for implementing an embodiment of the present invention. Figure 5 The electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0121] like Figure 5As shown, the computer system 500 includes a central processing unit (CPU) 501, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 502 or a program loaded from a storage part 508 into a random access memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the system 500 are also stored. The CPU 501, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0122] The following components are connected to the I / O interface 505: an input section 506 including a keyboard, a mouse, etc.; an output section 507 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 508 including a hard disk, etc.; and a communication section 509 including a network interface card such as a LAN card, a modem, etc. The communication section 509 performs communication processing via a network such as the Internet. A drive 510 is also connected to the I / O interface 505 as needed. A removable medium 511, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 510 as needed, so that a computer program read therefrom is installed into the storage section 508 as needed.

[0123] In particular, according to the embodiments disclosed in the present invention, the process described above with reference to the flowchart can be implemented as a computer software program. For example, the embodiments disclosed in the present invention include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 509, and / or installed from the removable medium 511. When the computer program is executed by the central processing unit (CPU) 501, the above-mentioned functions defined in the system of the present invention are executed.

[0124] It should be noted that the computer-readable medium shown in the present invention may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present invention, a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device. In the present invention, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable program code. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, which may send, propagate or transmit a program for use by or in conjunction with an instruction execution system, apparatus or device. The program code contained on the computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0125] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a module, a program segment, or a part of a code, and the above-mentioned module, program segment, or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flow chart, and the combination of the boxes in the block diagram or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0126] The modules and / or units involved in the embodiments of the present invention may be implemented in software or hardware. The modules and / or units described may also be arranged in a processor, for example, it may be described as follows: a processor includes a positioning module, a determination module, an acquisition module, a matching module, and a control module. The names of these modules do not, in some cases, constitute limitations on the modules themselves.

[0127] As another aspect, the present invention also provides a computer-readable medium, which may be included in the device described in the above embodiment; or it may exist independently and not be assembled into the device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by a device, the device includes: using ultra-wideband UWB positioning technology to locate the target mold and obtain the current position of the target mold; determining whether the current position of the target mold belongs to the preset injection area of ​​the injection equipment; when the current position of the target mold belongs to the preset injection area, obtaining the injection configuration information of the injection equipment and obtaining the mold configuration information of the target mold; determining whether the injection configuration information matches the mold configuration information; if the injection configuration information matches the mold configuration information, then controlling the injection equipment to inject the target mold, and if the injection configuration information does not match the mold configuration information, then issuing an alarm prompt.

[0128] According to the technical solution of the embodiment of the present invention, the target mold can be positioned by using ultra-wideband UWB positioning technology to obtain the current position of the target mold; determine whether the current position of the target mold belongs to the preset injection area of ​​the injection equipment; when the current position of the target mold belongs to the preset injection area, obtain the injection configuration information of the injection equipment, and obtain the mold configuration information of the target mold; determine whether the injection configuration information matches the mold configuration information; if the injection configuration information matches the mold configuration information, control the injection equipment to inject material into the target mold, and if the injection configuration information does not match the mold configuration information, issue an alarm prompt. That is, the embodiment of the present invention can rely on UWB high-precision positioning technology to sense the position of the mold in real time, and when sensing that the mold enters the injection area of ​​the injection equipment, introduce an information proofreading mechanism, and determine whether to control the injection equipment to inject material into the mold through information matching, thereby reducing the injection error rate and improving production efficiency and product quality.

[0129] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may occur depending on design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A material injection control method, characterized in that: include: Using ultra-wideband (UWB) positioning technology to locate the target mold, and obtaining the current position of the target mold; Determining whether the current position of the target mold belongs to a preset injection area of ​​the injection equipment; When the current position of the target mold belongs to the preset injection area, obtaining injection configuration information of the injection equipment and obtaining mold configuration information of the target mold; Determining whether the injection configuration information matches the mold configuration information; If the injection configuration information matches the mold configuration information, the injection device is controlled to inject material into the target mold; if the injection configuration information does not match the mold configuration information, an alarm is issued; Before determining whether the current position of the target mold belongs to the preset injection area of ​​the injection equipment, the method further includes: obtaining equipment positioning data obtained by each base station by positioning the injection equipment, wherein an equipment tag is installed on the injection equipment, and the equipment positioning data is obtained by each base station by measuring the UWB signal emitted by the equipment tag; calculating the current position of the injection equipment according to the equipment positioning data and the preset position information of each base station; and setting the preset injection area according to the current position of the injection equipment; Before locating the target mold by using the ultra-wideband (UWB) positioning technology to obtain the current position of the target mold, the method further includes: acquiring the injection configuration information and the mold configuration information from a production management server; writing the injection configuration information into the device tag, and writing the mold configuration information into the mold tag; The acquiring of the injection configuration information of the injection equipment and the mold configuration information of the target mold comprises: acquiring the injection configuration information of the injection equipment from the equipment tag through a plurality of base stations, and acquiring the mold configuration information of the target mold from the mold tag through the plurality of base stations; When the current position of the target mold belongs to the preset injection area, the method also includes: determining the number of molds in the preset injection area; if the number of molds is 1, triggering the steps of obtaining the injection configuration information of the injection equipment and obtaining the mold configuration information of the target mold; if the number of molds is not 1, issuing the alarm prompt.

2. The injection control method according to claim 1, characterized in that: The method of locating the target mold by using the ultra-wideband (UWB) positioning technology to obtain the current position of the target mold includes: Acquire mold positioning data obtained by each of a plurality of base stations positioning the target mold, wherein a mold tag is installed on the target mold, and the mold positioning data is obtained by each base station by measuring a UWB signal emitted by the mold tag, and the plurality of base stations are deployed around the injection molding production line; The current position of the target mold is calculated according to the mold positioning data and the preset position information of each base station.

3. The injection control method according to any one of claims 1 to 2, characterized in that: When the current position of the target mold belongs to the preset injection area, the method further includes: Obtaining the residence time of the target mold in the preset injection area; When the stay time exceeds a preset time threshold, the alarm prompt is issued.

4. The injection control method according to any one of claims 1 to 2, characterized in that: The injection configuration information includes basic information of a preset mold and basic information of a material to be injected into the preset mold, the mold configuration information includes basic information of a target mold and basic information of a material to be injected into the target mold, and determining whether the injection configuration information matches the mold configuration information includes: Determine whether the basic information of the target mold matches the basic information of the preset mold, and determine whether the basic information of the material to be injected into the target mold matches the basic information of the material to be injected into the preset mold; If the basic information of the target mold matches the basic information of the preset mold, and the basic information of the material to be injected into the target mold matches the basic information of the material to be injected into the preset mold, it is determined that the injection configuration information matches the mold configuration information.

5. A material injection control device, characterized in that: include: A positioning module is used to locate the target mold using ultra-wideband (UWB) positioning technology to obtain the current position of the target mold; A determination module, used to determine whether the current position of the target mold belongs to a preset injection area of ​​the injection equipment; an acquisition module, used for acquiring the injection configuration information of the injection equipment and acquiring the mold configuration information of the target mold when the current position of the target mold belongs to the preset injection area; A matching module, used to determine whether the injection configuration information matches the mold configuration information; A control module, configured to control the injection device to inject material into the target mold if the injection configuration information matches the mold configuration information, and to issue an alarm if the injection configuration information does not match the mold configuration information; The positioning module is further used to obtain equipment positioning data obtained by each base station positioning the injection equipment, the injection equipment is equipped with an equipment tag, and the equipment positioning data is obtained by each base station by measuring the UWB signal emitted by the equipment tag; Calculating the current position of the injection equipment according to the equipment positioning data and the preset position information of each base station; A setting module, used for setting the preset injection area according to the current position of the injection equipment; A writing module, used for obtaining the injection configuration information and the mold configuration information from a production management server; writing the injection configuration information into the device tag, and writing the mold configuration information into the mold tag; The acquisition module is specifically configured to acquire the injection configuration information of the injection equipment from the equipment tag through multiple base stations, and acquire the mold configuration information of the target mold from the mold tag through the multiple base stations; The determination module is also used to determine the number of molds in the preset injection area; if the number of molds is 1, the acquisition module is triggered to execute the steps of acquiring the injection configuration information of the injection equipment and acquiring the mold configuration information of the target mold; if the number of molds is not 1, the control module is triggered to issue the alarm prompt.

6. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the injection control method according to any one of claims 1 to 4 is implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the injection control method according to any one of claims 1 to 4 is implemented.

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