Heat sink and servo drive

Abstract

The present invention discloses a heat dissipation device and a servo driver, wherein the heat dissipation device is used for the servo driver and comprises: a housing, a partition is provided inside the housing, the partition separates the inner cavity of the housing into a receiving cavity and a heat dissipation cavity, the receiving cavity is used to accommodate the driving function component of the servo driver; a heat pipe is passed through the partition, the evaporation end of the heat pipe is located in the receiving cavity and is used to contact the driving function component, and the condensation end of the heat pipe is located in the heat dissipation cavity; a water cooling device comprises a cold water pipe arranged in the heat dissipation cavity, a water pump whose water outlet is connected to the cold water pipe, and a water tank connected to the water inlet end of the water pump, and the cold water pipe is in contact with the condensation end of the heat pipe; a temperature detection device is arranged in the receiving cavity and is used to contact the driving function component to detect the temperature of the driving function component; and a controller is electrically connected to both the temperature detection device and the water pump. The technical solution of the present invention can improve the heat dissipation performance of the heat dissipation device of the servo driver.

Description

Technical Field

[0001] The present invention relates to the technical field of servo drivers, and in particular to a heat dissipation device and a servo driver. Background Art

[0002] The AC servo system is a closed-loop control system that controls the rotation of the motor. It includes a servo drive, which includes a drive function component and a heat sink. The servo drive function component will continuously convert energy during operation, and energy will be lost during the continuous conversion process. Most of the lost energy is dissipated in the form of heat. The accumulation of heat will cause the temperature inside the servo drive to rise, which will affect the operating performance of each component and shorten the life of the component. The heat dissipation performance of the current servo drive heat sink is not good, which will affect the operating performance and life of the servo drive. Summary of the invention

[0003] The main purpose of the present invention is to provide a heat dissipation device, aiming to improve the heat dissipation performance of the heat dissipation device of a servo drive.

[0004] To achieve the above object, the heat dissipation device proposed in the present invention is used for a servo drive and comprises:

[0005] A housing having a partition plate therein, wherein the partition plate separates the inner cavity of the housing into a receiving cavity and a heat dissipation cavity, wherein the receiving cavity is used to accommodate a driving function component of the servo driver;

[0006] A heat pipe is provided through the partition, the evaporation end of the heat pipe is located in the accommodating cavity and is used to contact the driving function component, and the condensation end of the heat pipe is located in the heat dissipation cavity;

[0007] A water cooling device, comprising a cold water pipe disposed in the heat dissipation cavity, a water pump whose water outlet is connected to the cold water pipe, and a water tank connected to the water inlet of the water pump, wherein the cold water pipe is in contact with the condensation end of the heat pipe;

[0008] a temperature detection device, disposed in the accommodating cavity and used to contact the driving function component to detect the temperature of the driving function component; and

[0009] A controller is electrically connected to the temperature detection device and the water pump.

[0010] Optionally, the shell is provided with an air inlet and an air outlet both of which are connected to the heat dissipation cavity, and the heat dissipation device also includes a first heat dissipation fan arranged in the heat dissipation cavity, and the first heat dissipation fan is electrically connected to the controller to allow the air flow to flow from the air inlet through the condensation end of the heat pipe and out of the air outlet.

[0011] Optionally, a plurality of heat pipes are distributed at intervals, and the connecting lines of any three adjacent heat pipes form an equilateral triangle; and / or

[0012] The outer surfaces of the evaporation end and the condensation end of the heat pipe are both provided with fins.

[0013] Optionally, the water cooling device further includes a flow meter disposed between the water pump and the cold water pipe, and the flow meter is electrically connected to the controller.

[0014] Optionally, the cold water pipe is wound around the condensation end of the heat pipe.

[0015] Optionally, the water tank is provided with a water outlet and a water return port, the water inlet end of the water pump is connected to the water outlet, and the end of the cold water pipe away from the water pump is connected to the water return port.

[0016] Optionally, the heat dissipation device further comprises a semiconductor refrigeration sheet electrically connected to the controller, a cold end of the semiconductor refrigeration sheet is in contact with a condensation end of the heat pipe, and a hot end of the semiconductor refrigeration sheet is exposed outside the shell.

[0017] Optionally, the heat dissipation device further includes a second heat dissipation fan disposed outside the housing, the second heat dissipation fan is disposed corresponding to the hot end of the semiconductor refrigeration plate, and the second heat dissipation fan is electrically connected to the controller.

[0018] Optionally, the partition is provided with a raised reinforcement portion protruding toward the accommodating cavity, and the heat pipe is passed through the raised reinforcement portion.

[0019] The present invention further provides a servo driver, which includes the above-mentioned heat dissipation device.

[0020] The heat dissipation device of the technical solution of the present invention is used for a servo drive, and comprises: a shell, a partition is provided in the shell, the partition separates the inner cavity of the shell into a containing cavity and a heat dissipation cavity, the containing cavity is used to accommodate the driving function component of the servo drive, and the shell can provide a containing and protection function for the servo driving function component; a heat pipe, which is passed through the partition, the evaporation end of the heat pipe is located in the containing cavity and is used to contact the driving function component. When the driving function component is running, a large amount of heat is generated, and the evaporation end of the heat pipe can quickly absorb the heat to reduce its temperature. In addition, the condensation end of the heat pipe is located in the heat dissipation cavity, and the condensation end can dissipate the heat conducted from the evaporation end in the heat dissipation cavity; a water cooling device, which comprises a cold water pipe arranged in the heat dissipation cavity, a water pump whose water outlet is connected to the cold water pipe, and a water tank connected to the water inlet end of the water pump, and And the cold water pipe is in contact with the condensation end of the heat pipe. It can be understood that the contact between the cold water pipe and the condensation end can quickly absorb the heat on the condensation end. The cold water pipe, the water pump and the water tank form a circulating water system, which can quickly and effectively discharge the heat inside the servo drive to the external environment, and water has the advantages of good thermal conductivity and low cost; the temperature detection device is arranged in the accommodating cavity and is used to contact the driving function component to detect the temperature of the driving function component. Because the driving function component has different temperature values ​​at different time stages, the temperature detection device can timely detect the temperature of the driving function component and let the operator know; it also includes a controller, which is electrically connected to the temperature detection device and the water pump. The controller can receive, identify and process information from the temperature detection device and control the operating state of the water pump. The present invention can greatly improve the heat dissipation performance of the heat dissipation device of the servo drive through the mutual cooperation of the heat pipe, the water cooling device, the temperature detection device and the controller, and has the effect of timely and rapid heat dissipation and energy saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 It is a structural schematic diagram of an embodiment of a heat dissipation device of the present invention;

[0023] Figure 2 for Figure 1 Cross-sectional view at AA in the middle.

[0024] Description of Figure Numbers:

[0025]

[0026] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, "and / or" in the full text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and technical solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0030] The invention provides a heat dissipation device.

[0031] Reference Figure 1 and Figure 2 In an embodiment of the present invention, the heat dissipation device is used for a servo drive and comprises:

[0032] The housing 100 is provided with a partition 110 therein. The partition 110 separates the inner cavity of the housing 100 into a receiving cavity 120 and a heat dissipation cavity 130. The receiving cavity 120 is used to accommodate a driving function component 101 of the servo driver.

[0033] The heat pipe 200 is disposed through the partition 110 , the evaporation end of the heat pipe 200 is located in the accommodating chamber 120 and is used to contact the driving functional component 101 , and the condensation end of the heat pipe 200 is located in the heat dissipation chamber 130 ;

[0034] The water cooling device includes a cold water pipe 301 disposed in the heat dissipation cavity 130, a water pump 302 whose water outlet is connected to the cold water pipe 301, and a water tank 303 connected to the water inlet of the water pump 302, wherein the cold water pipe 301 is in contact with the condensation end of the heat pipe 200;

[0035] The temperature detection device 400 is disposed in the accommodating cavity 120 and is used to contact the driving functional component 101 to detect the temperature of the driving functional component 101; and

[0036] The controller 500 is electrically connected to the temperature detection device 400 and the water pump 302 .

[0037] Reference Figure 1 and Figure 2In this embodiment, the heat dissipation device includes: a housing 100, a partition 110 is provided in the housing 100, and the partition 110 separates the inner cavity of the housing 100 into a receiving cavity 120 and a heat dissipation cavity 130. The receiving cavity 120 is used to accommodate the driving function component 101 of the servo driver, and the housing 100 can provide accommodation and protection for the servo driving function component 101; a heat pipe 200 is penetrated by the partition 110, and the evaporation end of the heat pipe 200 is located in the receiving cavity 120 and is used to communicate with the driving function component 101. The heat pipe 200 is in contact with the energy component 101. When the driving function component 101 is running, a large amount of heat will be generated. The evaporation end of the heat pipe 200 can quickly absorb the heat to reduce its temperature. In addition, the condensation end of the heat pipe 200 is located in the heat dissipation cavity 130. The condensation end can dissipate the heat conducted from the evaporation end in the heat dissipation cavity 130; the water cooling device includes a cold water pipe 301 arranged in the heat dissipation cavity 130, a water pump 302 whose water outlet is connected to the cold water pipe 301, and a water pump 302 connected to the water inlet end of the water pump 302. The heat pipe 200 is provided with a heat pump 302 and a heat pump 303. The heat pump 302 is provided with a heat pump 303 and a heat pump 303. The heat pump 302 is provided with a heat pump 303 and a heat pump 303. The heat pump 302 is provided with a heat pump 303 and a heat pump 303. The heat pump 302 is provided with a heat pump 303 and a heat pump 303. The heat pump 302 is provided with a heat pump 302 and a heat pump 303. The heat pump 302 is provided with a heat pump 302 and a heat pump 303. The heat pump 302 is provided with a heat pump 302 and a heat pump 303. The heat pump 302 is provided with a heat pump 302 and a heat pump 302 ... The controller 500 has the function of presetting a temperature threshold. When the temperature of the driving functional component 101 is greater than or equal to the preset temperature, that is, when the temperature of the driving functional component 101 is too high, the controller 500 controls the water pump 302 to start or increases the speed of the water pump 302 to increase the flow rate, so as to quickly reduce the temperature of the condensation end of the heat pipe 200 through the cold water pipe 301 of the water cooling device, thereby improving the heat dissipation efficiency of the heat pipe 200. The technical solution of the present invention can greatly improve the heat dissipation performance of the heat dissipation device of the servo drive through the mutual cooperation of the heat pipe 200, the water cooling device, the temperature detection device 400 and the controller 500, and has the effect of timely and rapid heat dissipation and energy saving.

[0038] Furthermore, in this embodiment, the shell 100 is provided with an air inlet and an air outlet 601 both connected to the heat dissipation cavity 130. Specifically, the air in the heat dissipation cavity 130 can be directly connected to the air of the external environment through the air inlet and the air outlet 601; the heat dissipation device of the present invention also includes a first heat dissipation fan 600, which is arranged in the heat dissipation cavity 130 and is electrically connected to the controller 500, so as to allow the air flow to flow from the air inlet through the condensation end of the heat pipe 200 to the air outlet 601. The controller 500 can control the operating state of the first heat dissipation fan 600 according to the temperature detected by the temperature detection device 400. When the temperature of the driving function component 101 is greater than or equal to the preset temperature, that is, when the temperature of the driving function component 101 is too high, the controller 500 controls the heat dissipation fan to start or increase the speed of its fan blades, or when the power of the water cooling device reaches the maximum, the temperature of the driving function component 101 still cannot be quickly reduced. At this time, the controller 500 controls the heat dissipation fan to start, and then increases the speed of the fan blades depending on the situation. In this embodiment, the air inlet and the air outlet 601 are respectively arranged on opposite sides of the heat pipe 200, the first heat dissipation fan 600 is arranged near the air inlet or directly at the air inlet, and the air outlet 601 is covered with a protective net. However, the present design is not limited to this, and in other embodiments, the part of the housing 100 including the heat dissipation cavity 130 can also be arranged as, but not limited to, a mesh body, and the airflow can enter and exit the heat dissipation cavity 130 through the mesh.

[0039] Without loss of generality, in this embodiment, the heat dissipation device includes a plurality of heat pipes 200, and the plurality of heat pipes 200 are distributed at intervals, and the connecting lines of any three adjacent heat pipes 200 form an equilateral triangle. According to the principles of fluid mechanics, such an arrangement of the heat pipes 200 can cause maximum turbulence in the fluid flowing through the heat pipes 200. Combined with the principles of heat transfer, the turbulence of the fluid can achieve a better heat exchange effect between the fluid and the heat pipes 200, that is, the heat dissipation airflow generated by the heat dissipation fan can better dissipate the heat on the condensation end of the heat pipe 200, thereby increasing the heat dissipation efficiency of the heat dissipation device.

[0040] Optionally, in this embodiment, fins are provided on the outer surfaces of the evaporation end and the condensation end of the heat pipe 200. Specifically, the fins on the evaporation end can increase the contact area between the evaporation end and the driving function component 101 and the air in the accommodating cavity 120, thereby increasing the heat absorption efficiency of the evaporation end; the fins on the condensation end can increase the contact area between the condensation end and the heat dissipation airflow generated by the heat dissipation fan and make the heat dissipation airflow more turbulent, thereby increasing the heat exchange efficiency between the heat dissipation airflow and the condensation end, and then increasing the heat dissipation efficiency of the heat dissipation device.

[0041] Furthermore, in this embodiment, the water cooling device also includes a flow meter 304 arranged between the water pump 302 and the cold water pipe 301. The flow meter 304 is electrically connected to the controller 500 and can timely feed back the water flow rate in the cold water pipe 301 to the controller 500, so that the controller 500 can perform more accurate heat dissipation control.

[0042] Without loss of generality, in this embodiment, the cold water pipe 301 is tightly wound and arranged at the condensation end of the heat pipe 200. Specifically, the side of the cold water pipe 301 that contacts the condensation end of the heat pipe 200 is flat, and the cold water pipe 301 is tightly wound around the outer surface of the heat pipe 200, which can increase the heat exchange efficiency between the cold water pipe 301 and the condensation end of the heat pipe 200. Optionally, the condensation end of the heat pipe 200 is provided with a groove for the cold water pipe 301 to be wound, and the groove can increase the contact area between the cold water pipe 301 and the condensation end, thereby increasing the heat exchange between the cold water pipe 301 and the condensation end.

[0043] Optionally, in this embodiment, the water tank 303 of the water cooling device is provided with a water outlet and a water return port, and the water inlet end of the water pump 302 is connected to the water outlet. When the water pump 302 needs to pump water, it takes water from the water tank 303 through the water outlet of the water tank 303; the end of the cold water pipe 301 away from the water pump 302 is connected to the water return port, and the water flows through the part of the cold water pipe 301 that is wrapped around the heat pipe 200 and absorbs the heat of the heat pipe 200. It flows back to the water tank 303 through the water return port. In summary, it can be seen that the water in the water cooling device forms a circulating system, which can save water resources and can integrate the water cooling device into a closed system without constantly taking water from the outside and draining water to the outside. Optionally, the water tank 303 is provided with an opening for heat dissipation. When the water with the heat of the heat pipe 200 flows back to the water tank 303, its heat will be dissipated to the outside through the opening.

[0044] Furthermore, in this embodiment, the heat dissipation device also includes a semiconductor refrigeration plate 700 electrically connected to the controller 500, the cold end of the semiconductor refrigeration plate 700 is in contact with the condensation end of the heat pipe 200, and its hot end is exposed outside the shell 100, the cold end of the semiconductor refrigeration plate 700 can quickly absorb the heat of the condensation end of the heat pipe 200 to accelerate the dissipation of its heat, and the hot end of the semiconductor refrigeration plate 700 is used to dissipate the heat absorbed by the cold end to the external environment. It can be understood that the semiconductor refrigeration plate 700 cooperates with the heat pipe 200 to improve the heat dissipation efficiency of the heat dissipation device. Specifically, when the operating power of the water cooling device and / or the first cooling fan 600 reaches the maximum value, if the temperature of the driving functional component 101 is still too high, the controller 500 will further control the semiconductor refrigeration plate 700 to start, so as to increase the heat dissipation efficiency of the entire heat dissipation device. Furthermore, the controller 500 can also control the operating power of the semiconductor refrigeration plate 700, that is, the cooling effect of its cold end. However, the present design is not limited thereto. In other embodiments, the cold end of the semiconductor cooling sheet 700 may also be configured to be in direct contact with the driving functional component 101 , so as to directly absorb the heat of the driving functional component 101 .

[0045] Optionally, in this embodiment, the heat dissipation device also includes a second heat dissipation fan 701 arranged outside the shell 100, and the second heat dissipation fan 701 is arranged corresponding to the hot end of the semiconductor refrigeration plate 700, and the second heat dissipation fan 701 is electrically connected to the controller 500. The controller 500 can control the operating state of the second heat dissipation fan 701 according to the overall heat dissipation effect of the heat dissipation device. Specifically, after the operating power of the water cooling device, the first heat dissipation fan 600 and / or the semiconductor refrigeration plate 700 reaches a maximum value, if the temperature of the driving functional component 101 is still too high, the controller 500 will further control the second heat dissipation fan 701 to start, so as to increase the heat dissipation efficiency of the entire heat dissipation device.

[0046] Furthermore, in this embodiment, the partition 110 included in the shell 100 is provided with a raised reinforcement portion 111 protruding toward the accommodating cavity 120, and the heat pipe 200 is passed through the raised reinforcement portion 111. Specifically, the raised reinforcement portion 111 is shaped like a raised table-like body. It can be understood that the raised reinforcement portion 111 can enhance the structural strength of the heat pipe 200.

[0047] Without loss of generality, in this embodiment, the controller 500 can set a first preset temperature, a second preset temperature and a preset operating time. When the temperature of the driving function component 101 detected by the temperature detection device 400 is greater than or equal to the first preset temperature, the controller 500 controls the water pump 302 to start; after the water pump 302 runs for the preset operating time, if the temperature of the driving function component 101 detected by the temperature detection device 400 is still greater than or equal to the second preset temperature, the controller 500 controls the semiconductor refrigeration plate 700 to start, wherein the first preset temperature and the second preset temperature can be the same temperature value or different temperature values. Considering that the driving function component 101 is not suitable for enduring high temperatures for a long time, the second preset temperature is usually lower than the first preset temperature.

[0048] Optionally, in this embodiment, the temperature detection device 400 is a temperature sensor.

[0049] Optionally, the portion of the housing 100 including the accommodating cavity 120 is a sealed cavity, which can prevent external dust, water, insects, etc. from entering the accommodating cavity 120, thereby protecting the driving function component 101.

[0050] Optionally, the controller 500 is also provided with a wireless network connection device, which may specifically be but not limited to a WIFI connection device, which may send information such as the temperature of the driving functional component 101 to a wireless network signal receiving terminal such as a mobile phone, so that the operator can know and operate the relevant components of the servo drive.

[0051] The present invention also proposes a servo drive, which includes a heat dissipation device. The specific structure of the heat dissipation device refers to the above-mentioned embodiment. Since the servo drive adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0052] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A heat dissipation device for a servo drive, characterized in that: The heat dissipation device comprises: A housing having a partition plate therein, wherein the partition plate separates the inner cavity of the housing into a receiving cavity and a heat dissipation cavity, wherein the receiving cavity is used to accommodate a driving function component of the servo driver; A heat pipe is provided through the partition, the evaporation end of the heat pipe is located in the accommodating cavity and is used to contact the driving function component, and the condensation end of the heat pipe is located in the heat dissipation cavity; A water cooling device, comprising a cold water pipe disposed in the heat dissipation cavity, a water pump whose water outlet is connected to the cold water pipe, and a water tank connected to the water inlet of the water pump, wherein the cold water pipe is in contact with the condensation end of the heat pipe; a temperature detection device, disposed in the accommodating cavity and used to contact the driving function component to detect the temperature of the driving function component; and A controller, electrically connected to the temperature detection device and the water pump; The housing is provided with an air inlet and an air outlet both of which are connected to the heat dissipation cavity, and the heat dissipation device further comprises a first heat dissipation fan arranged in the heat dissipation cavity, and the first heat dissipation fan is electrically connected to the controller to allow air to flow from the air inlet through the condensation end of the heat pipe and out of the air outlet; There are a plurality of heat pipes distributed at intervals, and the connecting lines of any three adjacent heat pipes form an equilateral triangle; The water cooling device further comprises a flow meter disposed between the water pump and the cold water pipe, wherein the flow meter is electrically connected to the controller; The heat dissipation device further comprises a semiconductor refrigeration sheet electrically connected to the controller, the cold end of the semiconductor refrigeration sheet is in contact with the condensation end of the heat pipe, and the hot end of the semiconductor refrigeration sheet is exposed outside the housing; The controller sets a first preset temperature, a second preset temperature and a preset operating time. When the temperature of the driving function component detected by the temperature detection device is greater than or equal to the first preset temperature, the controller controls the water pump to start; after the water pump runs for the preset operating time, if the temperature of the driving function component detected by the temperature detection device is still greater than the second preset temperature, the controller controls the semiconductor refrigeration plate to start.

2. The heat dissipation device according to claim 1, characterized in that: The outer surfaces of the evaporation end and the condensation end of the heat pipe are both provided with fins.

3. The heat dissipation device according to claim 1, characterized in that: The cold water pipe is wound around the condensation end of the heat pipe.

4. The heat dissipation device according to claim 1, characterized in that: The water tank is provided with a water outlet and a water return port, the water inlet end of the water pump is communicated with the water outlet, and the end of the cold water pipe away from the water pump is communicated with the water return port.

5. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a second heat dissipation fan arranged outside the shell, the second heat dissipation fan is arranged corresponding to the hot end of the semiconductor refrigeration plate, and the second heat dissipation fan is electrically connected to the controller.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The partition is provided with a convex reinforcement portion protruding toward the accommodating cavity, and the heat pipe is penetrated through the convex reinforcement portion.

7. A servo driver, characterized in that: The servo drive comprises the heat dissipation device according to any one of claims 1 to 6.

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