Electronic device including air adsorption member and speaker module

Abstract

In various embodiments, an electronic device includes: a diaphragm; a speaker module including a speaker configured to output sound through vibration of the diaphragm; and a housing that accommodates the diaphragm and the speaker module therein and includes a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite to the first direction. The electronic device also includes an air adsorption member including an air adsorption material, disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member being configured to reduce air resistance to the diaphragm disposed above the speaker module without restricting vibration of the diaphragm.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including an air adsorption member capable of minimizing and / or reducing air resistance to vibration of a diaphragm disposed above a speaker module. Background Art

[0002] With the popularity of various portable electronic devices such as smart phones, various modules that perform specific functions are being provided in the electronic devices. For example, the electronic device may include at least one speaker module for outputting sound. The speaker module may convert an electrical signal generated at the electronic device into an audible sound signal through the vibration of a diaphragm and output the sound signal. Summary of the invention

[0003] Technical issues

[0004] As the thickness of electronic devices becomes thinner, speaker modules also need to be thinner. When the speaker module becomes thinner, the vibration space of the diaphragm becomes narrower.

[0005] In the electronic device, sounds with opposite phases may be generated in a first direction (e.g., rear surface) and a second direction (e.g., front surface) of the diaphragm. Therefore, in order to prevent and / or reduce destructive interference due to opposite phases in the first direction and the second direction, the electronic device may be designed to separate a first space formed in the first direction and a second space formed in the second direction relative to the diaphragm.

[0006] The diaphragm of the speaker module equipped in the electronic device may be limited in vibration due to the resistance of the ambient air, so that the sound reproduction efficiency may be reduced. For example, when the vibration of the diaphragm is limited, the sound output through the speaker module may be reduced or the sound quality may be degraded.

[0007] Solution to the problem

[0008] An embodiment of the present disclosure may provide an electronic device including an air adsorption member disposed in a certain space (e.g., a rear space) of a housing in which a speaker module is mounted. The air adsorption member promotes compression and relaxation of air, thereby minimizing and / or reducing air resistance to a diaphragm disposed above the speaker module without restricting vibration of the diaphragm. In addition, this can ensure reliable amplitude of the diaphragm, thereby improving sound quality in the low frequency band.

[0009] According to various example embodiments of the present disclosure, an electronic device may include: a diaphragm; a speaker module including at least one speaker configured to output sound through vibration of the diaphragm; a housing that accommodates the diaphragm and the speaker module therein and includes a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite to the first direction; and an air adsorption member including an air adsorption material, disposed in the first space and having a volume ratio of 90% or less of the first space.

[0010] According to various example embodiments of the present disclosure, an electronic device may include: a diaphragm; a speaker module including at least one speaker configured to output sound through vibration of the diaphragm; a shell accommodating the diaphragm and the speaker module therein, the shell including a first shell arranged at an upper position of the electronic device and a second shell arranged at a lower position of the electronic device, the shell including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite to the first direction; and an air adsorption member including an air adsorption material, arranged in at least a portion of the first shell and / or the second shell or arranged between the first shell and the second shell, and configured to adsorb air in the first space and / or the second space.

[0011] Advantageous Effects of the Invention

[0012] An embodiment of the present disclosure may provide an electronic device including an air adsorption member disposed in a certain space (e.g., a rear space) of a housing in which a speaker module is mounted. The air adsorption member promotes compression and relaxation of air, thereby minimizing and / or reducing air resistance to a diaphragm disposed above the speaker module without restricting vibration of the diaphragm. In addition, this can ensure reliable amplitude of the diaphragm, thereby improving sound quality in the low frequency band. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description in conjunction with the accompanying drawings, in which:

[0014] Figure 1 is a perspective view showing a front surface of an example mobile electronic device according to an embodiment of the present disclosure;

[0015] Figure 2 This is a diagram showing an embodiment of the present disclosure. Figure 1 a perspective view of the rear surface of the illustrated mobile electronic device;

[0016] Figure 3 This is a diagram showing an embodiment of the present disclosure. Figure 1 and Figure 2 An exploded perspective view of the mobile electronic device shown;

[0017] Figure 4 is a cross-sectional view showing an example configuration of an example electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure;

[0018] Figure 5 is a diagram showing an example air adsorption member included in an electronic device according to an embodiment of the present disclosure;

[0019] Figure 6 is a diagram showing an example air adsorption member included in an electronic device according to an embodiment of the present disclosure;

[0020] Figure 7 is a diagram showing a molecular structure of an example air adsorbing material included in an electronic device according to various embodiments of the present disclosure;

[0021] Figure 8 is a diagram showing an example air adsorption member fixed to a housing of an electronic device according to an embodiment of the present disclosure;

[0022] Fig. 9 is a diagram showing an example air adsorption member fixed to a housing of an electronic device according to an embodiment of the present disclosure;

[0023] Fig.10 is a diagram showing an example air adsorption member fixed to a housing of an electronic device according to an embodiment of the present disclosure;

[0024] Fig.11 is a diagram showing an example air adsorption member fixed by a rib formed in a housing of an electronic device according to an embodiment of the present disclosure;

[0025] Fig.12 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure;

[0026] Fig.13 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure;

[0027] Fig.14 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure;

[0028] Fig.15 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure;

[0029] Fig.16is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure;

[0030] Fig.17 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure;

[0031] Fig.18 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings.

[0033] The following description with reference to the accompanying drawings is provided to assist in understanding the various embodiments of the present disclosure. It includes various details to assist in such understanding, but these details are to be considered as examples only. Therefore, it will be appreciated by those of ordinary skill in the art that various changes and modifications may be made to the various example embodiments described herein without departing from the scope of the present disclosure. In addition, descriptions of well-known functions and structures may be omitted for clarity and conciseness.

[0034] The terms and words used in the following description and claims are not limited to the written meanings, but are only used to enable the present disclosure to be understood. Therefore, it should be apparent to those skilled in the art that the following description of various example embodiments of the present disclosure is provided for illustrative purposes only and not for the purpose of limiting the present disclosure.

[0035] It will be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0036] Figure 1 is a perspective view showing a front surface of an example mobile electronic device according to an embodiment of the present disclosure.

[0037] Figure 2 This is a diagram showing an embodiment of the present disclosure. Figure 1 A perspective view of a rear surface of an electronic device.

[0038] Reference Figure 1 and Figure 2 According to an embodiment, the electronic device 100 may include a housing 110 including a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding a space between the first surface 110A and the second surface 110B. In another embodiment (not shown), the housing may represent a Figure 1 The structure of a portion of the first surface 110A, the second surface 110B, and the side surface 110C shown. According to one embodiment, the first surface 110A can be formed by a front plate 102, at least a portion of which is substantially transparent (e.g., a polymer plate or a glass plate including various coatings). The second surface 110B can be formed by a substantially opaque rear plate 111. The rear plate 111 can be made of coated glass or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of the above materials. The side surface 110C can be formed by a side frame structure (or "side member") 118, which is connected to the front plate 102 and to the rear plate 111 and includes metal and / or polymer. In some embodiments, the rear plate 111 and the side frame structure 118 can be formed as one piece and can include the same material (e.g., a metal material such as aluminum).

[0039] In the illustrated embodiment, the front plate 102 may include two first regions 110D at both long edge ends of the front plate 102, such that the two first regions 110D are bent from the first surface 110A toward the rear plate 111 and extend seamlessly. Figure 2 ), the back plate 111 may include two second areas 110E at two long edge ends, so that the two second areas 110E are bent from the second surface 110B toward the front plate 102 and extend seamlessly. In some embodiments, the front plate 102 (or the back plate 111) may include only one of the first areas 110D (or the second areas 110E). In another embodiment, a portion of the first area 110D or the second area 110E may not be included. In the above embodiments, when viewed from the side surface of the electronic device 100, the side frame structure 118 may have a first thickness (or width) in a portion of the side surface that does not include the first area 110D or the second area 110E as described above, and may have a second thickness that is less than the first thickness in a portion of the side surface that includes the first area 110D or the second area 110E.

[0040] According to an embodiment, the electronic device 100 may include at least one of a display 101, an audio module (including 103, 107, and 114), a sensor module (including 104, 116, and 119), a camera module (including 105, 112, and 113), a key input device 117, a light emitting element 106, and a connector hole (including 108 and 109). In some embodiments, at least one of the elements of the electronic device 100 (for example, the key input device 117 or the light emitting element 106) may be omitted, or the electronic device 100 may additionally include another element.

[0041] For example, the display 101 may be exposed through a corresponding portion of the front plate 102. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first region 110D of the side surface 110C and the first surface 110A. In some embodiments, the display 101 may have a corner formed in a shape substantially the same as that of an adjacent periphery of the front plate 102. In another embodiment (not shown), in order to increase the exposed area of ​​the display 101, the interval between the periphery of the display 101 and the periphery of the front plate 102 may be formed to be substantially the same.

[0042] In another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display 101, and at least one of the voice receiver hole 114, the first sensor module 104, the first camera device 105, and the light emitting element 106 may be included in and aligned with the recess or opening. In another embodiment (not shown), at least one of the voice receiver hole 114, the first sensor module 104, the first camera device 105, the fourth sensor module 116, and the light emitting element 106 may be included on the back of the screen display area of ​​the display 101. In another embodiment (not shown), the display 101 may be coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus, or may be arranged adjacent to the touch sensing circuit, the pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus. In some embodiments, at least a portion of the first sensor module 104 and the third sensor module 119 and / or at least a portion of the key input device 117 may be disposed in the first region 110D and / or the second region 110E.

[0043] The audio module (including 103, 107 and 114) may include a microphone hole 103 and a speaker hole. A microphone for acquiring external sound may be arranged in the microphone hole 103, and in some embodiments, multiple microphones may be arranged therein so that the direction of the sound can be sensed. The speaker hole may include an outer speaker hole 107 and a voice receiver hole 114. In some embodiments, the outer speaker hole 107 and the voice receiver hole 114 and the microphone hole 103 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without the outer speaker hole 107 and the voice receiver hole 114.

[0044] The sensor modules (including 104, 116, and 119) may generate an electrical signal or data value corresponding to an internal operating condition of the electronic device 100 or an external environmental condition thereof. The sensor modules (including 104, 116, and 119) may include, for example, a first sensor module 104 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) arranged on a first surface 110A of the housing 110 and / or a third sensor module 119 (e.g., an HRM sensor) and / or a fourth sensor module 116 (e.g., a fingerprint sensor) arranged on a second surface 110B of the housing 110. The fingerprint sensor may be arranged not only on the first surface 110A (e.g., the display 101) of the housing 110, but also on its second surface 110B. The electronic device 100 may further include a sensor module not shown, such as at least one of the following: a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a brightness sensor.

[0045] The camera module (including 105, 112 and 113) may include a first camera device 105 arranged on a first surface 110A of the electronic device 100, a second camera device 112 arranged on a second surface 110B thereof, and / or a flash 113. The first camera device 105 and the second camera device 112 may include a single lens or multiple lenses, an image sensor, and / or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be arranged on a single surface of the electronic device 100.

[0046] The key input device 117 may be arranged on the side surface 110C of the housing 110. In another embodiment, the electronic device 100 may not include a part of the above-mentioned key input device 117 or the entire key input device 117, and the (not included) key input device 117 may be implemented in another type (such as a soft key) on the display 101. In some embodiments, the key input device may include a fourth sensor module 116 arranged on the second surface 110B of the housing 110.

[0047] For example, the light emitting element 106 may be arranged on the first surface 110A of the housing 110. For example, the light emitting element 106 may provide information about the status of the electronic device 100 in the form of light. In another embodiment, for example, the light emitting element 106 may provide a light source that cooperates with the operation of the first camera device 105. The light emitting element 106 may include, for example, a light emitting diode (LED), an infrared light emitting diode (IR LED), and a xenon lamp.

[0048] The connector holes (including 108 and 109) may include: a first connector hole 108, capable of accommodating a connector (e.g., a universal serial bus (USB) connector) for sending power and / or data to / receiving power and / or data from an external electronic device; and / or a second connector hole (e.g., a headphone jack) 109, capable of accommodating a connector for sending audio signals to / receiving audio signals from an external electronic device.

[0049] Figure 3 This is a diagram showing an embodiment of the present disclosure. Figure 1 An exploded perspective view of an electronic device.

[0050] Reference Figure 3 , the electronic device 300 may include a side frame structure 310, a first support member 311 (e.g., a bracket), a front panel 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear panel 380. In some embodiments, at least one of the elements of the electronic device 300 (e.g., the first support member 311 or the second support member 360) may be omitted, or the electronic device 300 may further include other elements. At least one of the elements of the electronic device 300 may be identical to Figure 1 or Figure 2 At least one of the elements of the electronic device 100 is the same or similar, and its repeated description will be omitted here.

[0051] The first support member 311 may be arranged inside the electronic device 300 and connected to the side frame structure 310, or may be formed integrally with the side frame structure 310. For example, the first support member 311 may be made of a metal material and / or a non-metallic (e.g., polymer) material. The display 330 may be coupled to one surface of the first support member 311, and the printed circuit board 340 may be coupled to another surface thereof. The processor, memory, and / or interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing device, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communication processor.

[0052] For example, the memory may include volatile memory or non-volatile memory.

[0053] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0054] The battery 350 is a device for supplying power to at least one element of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 350 may be arranged on substantially the same plane as the printed circuit board 340. The battery 350 may be arranged integrally inside the electronic device 300, or may be arranged so that it can be attached to / detached from the electronic device 300.

[0055] The antenna 370 may be disposed between the back plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the antenna 370 may perform near field communication with an external device, or may wirelessly transmit / receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or combination of the side frame structure 310 and / or the first support member 311.

[0056] The electronic device may include at least one of the following: various medical devices (e.g., various portable medical measuring devices (such as blood glucose meters, heart rate monitors, blood pressure monitors or thermometers, etc.), magnetic resonance angiography (MRA) devices, magnetic resonance imaging (MRI) devices, computed tomography (CT) devices, scanners or ultrasound devices, etc.), navigation devices, global positioning system (GPS) receivers, event data recorders (EDRs), flight data recorders (FDRs), vehicle infotainment devices, electronic equipment for ships (e.g., navigation systems, gyrocompasses, etc.), avionics equipment, security devices, vehicle audio bodies, industrial or household robots, automated teller machines (ATMs), point of sale (POS) devices, or Internet of Things (IoT) devices (e.g., light bulbs, various sensors, electricity or gas meters, sprinkler devices, fire alarms, thermostats, street lights, toasters, exercise equipment, hot water tanks, heaters, boilers, etc.).

[0057] The electronic device may also include at least one of the following: a part of furniture or a building / structure, an electronic board, an electronic signature receiving device, a projector, or various measuring instruments (such as a water meter, an electric meter, a gas meter, or a wave meter, etc.). The electronic device may be one or more combinations of the above devices. The electronic device may be a flexible electronic device. In addition, the electronic device is not limited to the above devices, and may include new electronic devices according to the development of new technologies.

[0058] The embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. However, the embodiments of the present disclosure are not limited to specific embodiments, and should be understood to include all modifications, changes, equivalent devices and methods, and / or alternative embodiments of the present disclosure.

[0059] As used herein, the term "A or B", "at least one of A or / and B", or "one or more of A or / and B" includes all possible combinations of the items listed with it. For example, "A or B", "at least one of A and B", or "at least one of A or B" may mean, for example, (1) including at least one A, (2) including at least one B, or (3) including both at least one A and at least one B.

[0060] As used herein, terms such as "first" and "second" can modify various elements regardless of the order and / or importance of the corresponding elements, and do not limit the corresponding elements. These terms can be used for the purpose of distinguishing one element from another element. For example, a first user device and a second user device can indicate different user devices regardless of order or importance. For example, a first element can be referred to as a second element without departing from the scope of this disclosure, and similarly, a second element can be referred to as a first element.

[0061] It will be understood that when an element (e.g., a first element) is "(operably or communicatively) coupled to / (operably or communicatively) coupled to" another element (e.g., a second element) or "connected to" another element (e.g., a second element), the element may be directly coupled to / directly coupled to the other element, and there may be an intervening element (e.g., a third element) between the element and the other element. It will also be understood that when an element (e.g., a first element) is "directly coupled to / directly coupled to" another element (e.g., a second element) or "directly coupled to" another element (e.g., a second element), there may be no intervening element (e.g., a third element) between the element and the other element.

[0062] The term "module" as used herein may be defined as a unit including, for example, one of hardware, software, and firmware, or any combination thereof. The term "module" may be used interchangeably with, for example, the terms "unit," "logic," "logic block," "component," or "circuit," etc. A "module" may be the smallest unit of an integrated component, or a portion thereof. A "module" may be the smallest unit or a portion thereof that performs one or more functions.

[0063] Figure 4 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure.

[0064] Reference Figure 4 According to an embodiment of the present invention, an electronic device 400 (eg, Figure 1 The electronic device 100 or Figure 3The electronic device 300 in the embodiment may include a diaphragm 410, a speaker module (eg, including a speaker) 420, a housing 450 (eg, Figure 1 The housing 110 in the embodiment includes a first space 460 , a second space 470 and an air adsorption member 500 .

[0065] According to one embodiment, the diaphragm 410 may generate sound by vibrating up and down. The sound generated by the vibration of the diaphragm 410 may be output through the sound output port 402 formed or provided in a certain direction.

[0066] According to one embodiment, the speaker module 420 may be disposed below the diaphragm 410. The speaker module 420 may be configured to receive, for example, a signal from a printed circuit board (eg, Figure 3 The electrical signal received by the PCB 340 in the diaphragm 410 is converted into a sound signal through the vibration of the diaphragm 410. According to various embodiments, the speaker module 420 may include various speaker components such as, for example but not limited to, a yoke, a magnet, a plate, a voice coil, etc.

[0067] According to one embodiment, the housing 450 may accommodate the speaker module 420. The housing 450 may include a first housing 430 (e.g., an upper housing) and a second housing 440 (e.g., a lower housing). The housing 450 may include a first housing 430 and a second housing 440 coupled to each other. The first housing 430 and the second housing 440 may be disposed above and below the speaker module 420, respectively. The first housing 430 may be formed, for example, of a single material (e.g., metal) and extend above the speaker module 420. The first housing 430 may be coupled to a first plate 432, for example, formed of another material (e.g., plastic). The second housing 440 may be formed, for example, of a single material (e.g., metal) and extend below the speaker module 420. The second housing 440 may be coupled to a second plate 442, for example, formed of another material (e.g., plastic).

[0068] According to various embodiments, a support member (e.g., a support piece) 425 may be provided between the second housing 440 and the speaker module 420. The support member 425 may absorb vibrations transmitted to the second housing 440 through the speaker module 420 when the diaphragm 410 provided above the speaker module 420 vibrates. The support member 425 may include, for example, but not limited to, a sponge, a non-woven fabric, etc., or any equivalent thereof. According to one embodiment, the support member 425 may be omitted. In this case, the speaker module 420 and the second housing 440 may be integrally formed. The left side of the speaker module 420 may at least partially include a step portion. The speaker module 420 may be spatially connected to the first space 460 through a vent (not shown) formed on at least a portion of its left side.

[0069] According to an embodiment, the housing 450 may define a first space 460 and a second space 470. The first space 460 may be provided in a first direction (eg, leftward) from the diaphragm 410 and the speaker module 420. The second space 470 may be provided in a second direction (eg, rightward) from the diaphragm 410 and the speaker module 420.

[0070] According to various embodiments, the first space 460 may be spatially connected to a vent (not shown) provided on at least a portion of the left side of the speaker module 420 to allow air to pass through. In addition, the first space 460 may be sealed. The second space 470 may be provided to connect the diaphragm 410 and the sound output port 402. The second space 470 may be open and not sealed. The speaker module 420 may have a ventilation structure in which the diaphragm 410 and the second space 470 are spatially connected to allow air to pass through.

[0071] According to one embodiment, an air adsorption member 500 may be provided at least partially in the first space 460. The air adsorption member 500 may include, for example, a solidified mixture having a molecular structure of particles and a binder, or any other suitable air adsorption material, and may promote adsorption and relaxation of the air 501 contained in the first space 460. The air adsorption member 500 may, for example, have a volume ratio in the range of about 70% to about 90% of the first space 460. In the first space 460, a space other than the air adsorption member 500 may, for example, be filled with the air 501.

[0072] The aforementioned volume ratio of about 70% to about 90% is merely an example, and it will be understood that the present disclosure is not limited to this ratio. For example, according to various embodiments, the first space 160 may contain the air adsorption member 500 in a volume ratio range from about 10% to about 99%, and also contain air 501 in the remaining space.

[0073] Figure 5 is a diagram illustrating an example air adsorption member included in an electronic device according to an embodiment of the present disclosure. Figure 6 is a diagram illustrating an air adsorption member included in an electronic device according to an embodiment of the present disclosure.

[0074] Reference Figure 5 , the air adsorbing member 500 may be formed by applying the air adsorbing material 520 to the sheet 510. The sheet 510 may be formed of a porous material. The sheet 510 may be solidified by absorbing the air adsorbing material 520. The sheet 510 may have a solid material including lumps connected by an adhesive.

[0075] Reference Figure 6, the air adsorption member 500 may be formed by embedding nanofibers 620 including an air adsorption material in a sheet 510 .

[0076] According to one embodiment, when the air 501 in the first space 460 passes through Figure 4 When the vibration of the diaphragm 410 disposed above the speaker module 420 is shown to be compressed, the air adsorbing material 520 of the air adsorbing member 500 may positively adsorb air, thereby minimizing and / or reducing air resistance to the diaphragm 410 .

[0077] According to one embodiment, when the air 501 in the first space 460 is relaxed or expanded by the vibration of the diaphragm 410 set above the speaker module 420, the air adsorption material 520 of the air adsorption member 500 can negatively adsorb the air, thereby minimizing and / or reducing the air resistance to the diaphragm 410.

[0078] Figure 7 is a diagram illustrating a molecular structure of an example air adsorbing material included in an electronic device according to various embodiments of the present disclosure.

[0079] Reference Figure 7 , the air adsorption material 520 according to various embodiments may include a mixture having a molecular structure of particles 702 and a binder 704 to perform positive adsorption and negative adsorption of air.

[0080] According to one embodiment, the air adsorbent material 520 may be formed, for example, by mixing a binder with at least one of granular activated carbon, powdered activated carbon, or acid red 27-crosslinked polyaniline (ARCP).

[0081] According to one embodiment, the air adsorbing material 520 may be formed, for example, by mixing a binder with Cu, Po1, Zr1, Zr2, or Al particles having a metal organic framework structure.

[0082] According to one embodiment, the air adsorbent 520 may be formed, for example, by mixing a binder with at least one of a diatomaceous earth component, a pearlite or a silica component, or a zeolite component.

[0083] According to one embodiment, the air adsorbent material 520 may be formed to have a specific surface area greater than the surface area of ​​a single solid substance. The air adsorbent material 520 may be formed to have a specific surface area greater than the surface area of ​​a single solid substance. 2 ) and / or oxygen (O 2 ))'s adsorption efficiency structure.

[0084] Figure 8is a diagram illustrating an example air adsorption member fixed to a housing of an electronic device according to an embodiment of the present disclosure.

[0085] In the description Figure 8 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0086] Reference Figure 8 The air adsorption member 500 may be fixed to the second housing 440 (eg, the lower housing) by a fixing member 441 formed on the second housing 440 , thereby being disposed in the first space 460 .

[0087] According to an embodiment, the fixing member 441 may be formed at a certain position of the second housing 440. The fixing member 441 may be or may include, for example, a convex portion or a protruding portion. For example, the fixing member 441 may be formed integrally with the second housing 440.

[0088] Fig. 9 is a diagram illustrating an example air adsorption member fixed to a housing of an electronic device according to an embodiment of the present disclosure.

[0089] In the description Fig. 9 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0090] Reference Fig. 9 The air adsorption member 500 may be interposed between shock absorbing members 445 formed at inner sides of the first shell 430 (eg, upper shell) and the second shell 440 (eg, lower shell), respectively, so as to be disposed in the first space 460 .

[0091] According to one embodiment, the shock absorbing member 445 may be or may include, for example but not limited to, a sponge. The shock absorbing member 445 may prevent and / or reduce the impact of the solidified air adsorption member 500 in the first space 460. The shock absorbing member 445 may be provided only to one of the inner side of the first shell 430 and the inner side of the second shell 440.

[0092] Fig.10 is a diagram illustrating an example air adsorption member fixed to a housing of an electronic device according to an embodiment of the present disclosure.

[0093] In the description Fig.10In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0094] Reference Fig.10 , the air adsorption member 500 may be, for example, adhered to a tape 447 provided on the inner side of the second housing 440 (eg, the lower housing) to be disposed in the first space 460 .

[0095] The air adsorption member 500 may be, for example, adhered to an adhesive tape 447 formed on the inner side of a first housing 430 (eg, an upper housing) (not shown) to be disposed in the first space 460 .

[0096] Fig.11 is a diagram illustrating an example air adsorption member fixed by a rib formed in a housing of an electronic device according to an embodiment of the present disclosure.

[0097] In the description Fig.11 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0098] Reference Fig.11 The air adsorption member 500 may be, for example, fixed to a pair of ribs 449 formed on a second housing 440 (eg, a lower housing) of the electronic device 400 , thereby being disposed in the first space 460 .

[0099] According to an embodiment, the second housing 440 may include a pair of ribs 449 formed at the inner side of the second housing 440 and spaced apart from each other. The ribs 449 may be formed integrally with the second housing 440. The air adsorption member 500 may be fixed by being inserted between the pair of ribs 449, for example.

[0100] Fig.12 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure.

[0101] In the description Fig.12 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0102] Reference Fig.12, the air adsorption member 500 may be at least partially disposed in the first space 460. The first space 460 may contain air 501.

[0103] According to an embodiment, the air adsorption member 500 may be in a solidified state. The outside of the air adsorption member 500 may be at least partially combined with the housing 450 forming the first space 460 , and the inside of the air adsorption member 500 may be filled with a homogeneous or heterogeneous powder and granular mixture 530 .

[0104] Fig.13 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure.

[0105] In the description Fig.13 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0106] Reference Fig.13 , at least a portion of the cured air adsorption member 500 may be combined with the housing 450 at a position adjacent to the speaker module 420 , thereby forming a partition wall.

[0107] According to one embodiment, a ventilation net 435 may be provided to an upper portion of the first housing 430. The first space 460 may be filled with a homogeneous or heterogeneous powder and granular mixture 530. Due to the partition wall, the powder and granular mixture 530 may not invade the speaker module 420. The powder and granular mixture 530 may be injected into at least a portion of the first space 460, and then the first space 460 may be sealed by the ventilation net 435. The ventilation net 435 may be replaced with an air adsorption member 500.

[0108] Fig.14 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure.

[0109] In the description Fig.14 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0110] Reference Fig.14, the electronic device 400 may include a passive radiator 451. A portion of the housing 450, for example, a portion of the first housing 430 adjacent to the second housing 440, may be removed and replaced with the passive radiator 451 adjacent to the first space 460.

[0111] According to an embodiment, the first space 460 may be at least partially filled with the air adsorption member 500. The air adsorption member 500 may have a volume ratio of less than about 100% of the first space 460. In the first space 460, a space other than the air adsorption member 500 may be filled with air 501.

[0112] Fig.15 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure.

[0113] In the description Fig.15 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0114] Reference Fig.15 , the electronic device 400 may include a duct 453. A portion of the housing 450, such as a portion of the first housing 430 adjacent to the second housing 440, may be removed and replaced with a duct 453 adjacent to the first space 460. The duct 453 may increase the sound pressure of a specific frequency band by phase inversion. For example, the duct 453 may include a hole having a curved path to achieve phase inversion and compensate for a specific frequency.

[0115] According to one embodiment, the first space 460 may be at least partially filled with the air adsorption member 500. For example, when Fig.13 When the ventilation net 435 shown is formed at the upper portion of the first housing 430 , the air adsorption member 500 may be provided around the ventilation net 435 .

[0116] Fig.16 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure.

[0117] In the description Fig.16 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 and Figure 7 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0118] Reference Fig.16 , the electronic device 400 may include an air adsorption member 500 replacing a part or all of the first housing 430 and the second housing 440 .

[0119] According to one embodiment, the outer surfaces of the first housing 430 and the second housing 440 replaced by the air adsorption member 500 may be coated with a coating member 540. The coating member 540 may prevent and / or reduce sound leakage to the outside of the first space 460.

[0120] According to various embodiments, only a portion of the first shell 430 and the second shell 440 may be replaced by the air adsorption member 500. In this case, the outer surface of the air adsorption member 500 may be treated by heat, pressure or ultraviolet (UV) light. This is to eliminate and / or reduce the function of compressing and relaxing air so that sound does not leak to the outside through the first space 460.

[0121] According to various embodiments, when only a portion of the first shell 430 and the second shell 440 is replaced by the air adsorption member 500, the outer surface of the air adsorption member 500 may be covered with a tape or any equivalent so that sound does not leak to the outside through the first space 460 (or leakage is reduced).

[0122] Fig.17 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure.

[0123] In the description Fig.17 In the embodiment shown, Figure 4 , Figure 5 , Figure 6 , Figure 7 and Fig.16 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0124] Reference Fig.17 , the electronic device 400 may include an air adsorption member 500 at least partially disposed in the second space 470 between the diaphragm 410 and the sound output port 402. In this case, the air adsorption member 500 may improve noise with respect to the sound output to the sound output port 402 through the diaphragm 410.

[0125] Fig.18 is a cross-sectional view showing an example configuration of an electronic device including an air adsorption member and a speaker module according to an embodiment of the present disclosure.

[0126] In the description Fig.18 In the embodiment shown, Figure 4 , Figure 5 , Figure 6, Figure 7 , Fig.16 and Fig.17 Descriptions of the same configurations and functions as those of the above-described embodiments shown may be omitted.

[0127] Reference Fig.18 , the electronic device 400 may include an air adsorption member 500 provided in at least a portion of the first housing 430 (or the first plate 432 ) disposed above the diaphragm 410 .

[0128] According to one embodiment, the air adsorption member 500 provided in at least a portion of the first housing 430 (or the first plate 432) may be positioned to be biased toward one side of the diaphragm 410. For example, the air adsorption member 500 may be disposed at a position that minimizes and / or reduces eccentric vibration of the diaphragm 410. The air adsorption member 500 may be disposed at a position where the upper resistance of the diaphragm 410 is relatively large.

[0129] According to various example embodiments of the present disclosure, an electronic device may include: a diaphragm; a speaker module including a speaker configured to output sound through vibration of the diaphragm; a housing that accommodates the diaphragm and the speaker module therein and includes a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite to the first direction; and an air adsorption member including an air adsorption material, disposed in the first space and having a volume ratio within a range of 90% or less of the first space.

[0130] According to various example embodiments, the air adsorption member may be at least partially cured.

[0131] According to various example embodiments, the first space may be sealed and may at least partially contain air.

[0132] According to various example embodiments, the housing may include: a first housing disposed above the diaphragm; and a second housing 440 disposed below the speaker module.

[0133] According to various example embodiments, the air adsorption member may be fixed to a fixing member formed on the second housing.

[0134] According to various example embodiments, the air adsorption member may be combined with a shock absorbing member provided at least one of an inner side of the first housing or an inner side of the second housing.

[0135] According to various example embodiments, the air adsorption member may be adhered to an adhesive tape provided on at least one of an inner side of the first housing or an inner side of the second housing.

[0136] According to various example embodiments, the air adsorption member may be fixed between a pair of ribs provided on the second housing.

[0137] According to various example embodiments, the air adsorption member may include an air adsorption material applied to a sheet, and the air adsorption material may have a molecular structure of particles and a binder configured to perform positive and negative adsorption of air.

[0138] According to various example embodiments, the air adsorption member may be at least partially solidified, an outer side of the air adsorption member may be combined with a housing forming the first space, and an inner side of the air adsorption member may be filled with a homogeneous or heterogeneous powder and granular mixture.

[0139] According to various example embodiments, the air adsorption member may be at least partially cured and combined with the housing at a position adjacent to the speaker module, thereby forming a partition wall in the first space 460 .

[0140] According to various example embodiments, the first space partitioned by the partition wall may be at least partially filled with the homogeneous or heterogeneous powder and granular mixture.

[0141] According to various example embodiments, the housing may have a ventilation net provided to an upper portion thereof, and the ventilation net may be formed of an air adsorption member.

[0142] According to various example embodiments, the electronic device may further include a passive radiator or a duct provided at a predetermined position relative to the first space.

[0143] According to various example embodiments of the present disclosure, an electronic device may include: a diaphragm; a speaker module including a speaker configured to output sound through vibration of the diaphragm; a shell accommodating the diaphragm and the speaker module therein, the shell including a first shell arranged at an upper position and a second shell arranged at a lower position, and including a first space formed in a first direction from the speaker module and a second space formed in a second direction opposite to the first direction; and an air adsorption member provided in at least a portion of the first shell and / or the second shell and / or arranged between the first shell and the second shell, the air adsorption member being configured to adsorb air in the first space and / or the second space.

[0144] According to various example embodiments, an outer surface of the air adsorption member may be coated with a coating member.

[0145] According to various example embodiments, the outer surface of the air adsorption member may be at least partially treated to eliminate and / or reduce the function of compressing and relaxing air, thereby preventing and / or reducing sound leakage to the outside of the first space.

[0146] According to various example embodiments, the first space may be sealed and may at least partially contain air.

[0147] According to various embodiments, a second space may be provided between the diaphragm and the sound output port, and the air adsorption member may be disposed at a predetermined position of the second space.

[0148] According to various example embodiments, at least a portion of the first housing disposed above the diaphragm may include an air adsorption member to minimize and / or reduce eccentric vibration of the diaphragm.

[0149] Although the present disclosure has been shown and described with reference to various example embodiments of the present disclosure, it will be understood that the various example embodiments are intended to be illustrative rather than restrictive. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the full scope of the present disclosure, including the appended claims.

Claims

1. An electronic device, comprising: A speaker module including a speaker configured to output sound through vibration of a diaphragm of the speaker; A housing for accommodating the speaker module, the housing comprising: a first space and a second space separated from the first space by the speaker module; and The air adsorption member is formed of an air adsorption material. wherein the air adsorbing member comprises a powder and a granular mixture, and the air adsorbing member is disposed in the first space, The outer side of the air adsorption member is solidified and combined with the shell forming the first space, and the inner side of the air adsorption member is filled with the powder and granular mixture so that the powder and granular mixture is surrounded by the solidified outer side of the air adsorption member. 2 . The electronic device according to claim 1 , wherein the air adsorbing material is applied to a sheet. The electronic device according to claim 1 , wherein the first space is sealed and at least partially includes air.

4. The electronic device according to claim 1, wherein the housing comprises: A first housing, disposed above the diaphragm; as well as A second housing is disposed below the speaker module. wherein the air adsorption member is fixed to a protrusion protruding from the second housing. 5 . The electronic device according to claim 4 , wherein the air adsorption member is combined with a shock absorbing member including a shock absorbing material and provided at least one of an inner side of the first housing or an inner side of the second housing. 6 . The electronic device according to claim 4 , wherein the air adsorption member is adhered to an adhesive tape provided on at least one of an inner side of the first housing or an inner side of the second housing. 7 . The electronic device according to claim 4 , wherein the air adsorption member is fixed between a pair of ribs provided on the second housing. 8 . The electronic device according to claim 1 , wherein the air adsorption material has a molecular structure including particles and a binder configured to perform positive adsorption and negative adsorption of air.

9. The electronic device according to claim 1, wherein a portion of the air adsorption member is solidified and provided at a position of the housing adjacent to the speaker module to define a partition wall in the first space, and The first space separated by the partition wall is at least partially filled with the powder and granular mixture.

10. The electronic device according to claim 9, wherein the housing includes a ventilation net provided to an upper portion thereof, and The ventilation net includes at least a portion of the air adsorbing member.

11. An electronic device comprising: A speaker module including a speaker configured to output sound through vibration of a diaphragm of the speaker; A housing for accommodating the speaker module therein, the housing comprising a first housing disposed at an upper position of the housing and a second housing disposed at a lower position of the housing, the housing further comprising: a first space and a second space separated from the first space by the speaker module; and an air adsorption member, formed of an air adsorption material, disposed in at least a portion of the first shell and / or the second shell or disposed between the first shell and the second shell, the air adsorption member being configured to adsorb air in the first space and / or the second space, wherein the air adsorbing member comprises a powder and a granular mixture and the air adsorbing member is disposed in the first space, The outer side of the air adsorption member is solidified and combined with the shell forming the first space, and the inner side of the air adsorption member is filled with the powder and granular mixture so that the powder and granular mixture is surrounded by the solidified outer side of the air adsorption member. 12 . The electronic device according to claim 11 , wherein an outer surface of the air adsorption member comprises a coating layer.

13. The electronic device according to claim 11, wherein an outer surface of the air adsorption member is configured to reduce compression and relaxation of air and reduce leakage of sound to the outside of the first space, and The first space is sealed and at least partially contains air. 14 . The electronic device according to claim 11 , wherein at least a portion of the first housing disposed above the diaphragm includes the air adsorption member and is configured to reduce eccentric vibration of the diaphragm.

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