Thermoplastic polyimide composition and application thereof, preparation of thermoplastic polyimide and application thereof

Abstract

The present invention relates to the field of thermoplastic polyimide materials, and discloses a thermoplastic polyimide composition and its application, thermoplastic polyimide preparation and its application. The composition comprises component A, component B and optional component C; component A is a thermoplastic polyimide resin having a structure shown in formula (1): wherein Ar is a residue of a diprimary amine monomer; Ar is selected from one or more of the following groups: x is 0.45-0.9; EG is a capping agent residue, selected from one of the following groups: the viscosity of the thermoplastic polyimide resin at 30°C is 0.35-0.55dL / g; component B is an imide oligomer; and component C is an additive. The thermoplastic polyimide composition has the characteristics of low extrusion temperature, high melt index and high heat resistance stability.

Description

Technical Field

[0001] The present invention relates to the technical field of thermoplastic polyimide materials, in particular to a thermoplastic polyimide composition and application thereof, a thermoplastic polyimide product prepared from the thermoplastic polyimide composition and application thereof. Background Art

[0002] Polyimide is a resin material with excellent comprehensive properties, with the advantages of good thermal stability, excellent mechanical properties, good dimensional stability, excellent chemical stability, high breakdown voltage, low dielectric constant, high flame retardancy, low expansion coefficient, and is widely used in high-tech fields such as electronic appliances, aerospace, automobile, chemical machinery. On the other hand, due to the extremely strong interaction force between the molecular chain and molecules of polyimide rigidity, it is difficult for polymer to melt, which limits the processing and application range of polyimide. Therefore, a lot of methods have been developed to improve the thermoplastic processability of polyimide. For example, flexible groups are introduced in the main chain molecule, such as -O-, -S-, -CH2-, etc., to reduce the rigidity of the molecular chain, reduce the intermolecular force, but can cause the glass transition temperature of polyimide to decline. CN102634021A discloses a thermoplastic polyimide resin and a preparation method thereof. The thermoplastic polyimide resin is prepared by reacting a mixed dianhydride composed of 1,2,3,4-benzenetetracarboxylic dianhydride and other commonly used tetracarboxylic dianhydrides, a diamine, and phthalic anhydride or aniline to polymerize the mixed dianhydride and the diamine, and using phthalic anhydride or aniline as a capping agent to control the molecular weight. This polyimide resin has good thermal stability and excellent thermoplastic processability. The inherent viscosity can reach 0.22-0.90 dL / g, and the glass transition temperature is 220-420°C. Therefore, the polyimide resin can be widely used in the preparation of high-temperature resistant engineering plastics, films, adhesives and other materials.

[0003] However, the products made from the thermoplastic polyimide resin have the disadvantages of low melt index and high extrusion temperature required for extrusion injection molding. Summary of the Invention

[0004] The purpose of the present invention is to overcome the problems of viscosity control and high extrusion temperature of polyimide compositions in the prior art, and to provide a thermoplastic polyimide composition and its application, as well as the preparation and application of thermoplastic polyimide. The thermoplastic polyimide composition has the characteristics of low extrusion temperature, high melt index and high heat resistance and stability.

[0005] In order to achieve the above object, the first aspect of the present invention provides a thermoplastic polyimide composition, wherein the composition comprises component A, component B and optional component C;

[0006] The component A is a thermoplastic polyimide resin having a structure shown in formula (1):

[0007]

[0008] Wherein, Ar is the residue of a diprimary amine monomer; Ar is selected from one or more of the following groups:

[0009]

[0010] x is 0.45-0.9;

[0011] EG is a capping agent residue selected from one of the following groups:

[0012]

[0013] The viscosity of the thermoplastic polyimide resin at 30° C. is 0.35-0.55 dL / g;

[0014] The component B is an imide oligomer;

[0015] The component C is an additive.

[0016] A second aspect of the present invention provides a thermoplastic polyimide product, wherein the product is prepared by blending, extruding, and injection molding a thermoplastic polyimide composition;

[0017] The thermoplastic polyimide composition is the above-mentioned thermoplastic polyimide composition.

[0018] A third aspect of the present invention provides use of the thermoplastic polyimide composition or the thermoplastic polyimide product in automobiles and / or electronic appliances.

[0019] Through the above technical solution, the thermoplastic polyimide composition and its application, and the thermoplastic polyimide product prepared from the thermoplastic polyimide composition and its application provided by the present invention achieve the following beneficial effects:

[0020] The thermoplastic polyimide composition of the present invention comprises a thermoplastic polyimide resin with a special structure, and the obtained composition has a lower extrusion temperature and a higher melt index.

[0021] Furthermore, the thermoplastic polyimide composition provided by the present invention includes an imide oligomer having a unique structure, which exhibits excellent compatibility with the thermoplastic polyimide resin. When added to the composition, it can significantly improve the composition's processing properties and heat resistance. In particular, the imide oligomer's structure exhibits isomerism, which increases the twisting irregularity of the imide oligomer's molecular chain, thereby enhancing its plasticizing effect. This significantly increases the composition's melt index, further reduces extrusion temperature, and further improves heat resistance and stability. DETAILED DESCRIPTION

[0022] The endpoints of the ranges and any values ​​disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoints of each range, the endpoints of each range and individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered to be specifically disclosed herein.

[0023] A first aspect of the present invention provides a thermoplastic polyimide composition, wherein the composition comprises component A, component B and optional component C;

[0024] The component A is a thermoplastic polyimide resin having a structure shown in formula (1):

[0025]

[0026] Wherein, Ar is the residue of a diprimary amine monomer; Ar is selected from one or more of the following groups:

[0027]

[0028] x is 0.45-0.9;

[0029] EG is a capping agent residue selected from one of the following groups:

[0030]

[0031] The viscosity of the thermoplastic polyimide resin at 30° C. is 0.35-0.55 dL / g;

[0032] The component B is an imide oligomer;

[0033] The component C is an additive.

[0034] In the present invention, the composition includes a polyimide resin with a specific structure. Since the polyimide resin contains isomeric structural units of phthalic anhydride, the molecular chain is twisted, and a specific end-capping agent structure is introduced, so that the polyimide resin has the performance characteristics of a high melt index and a low extrusion temperature. The composition using the polyimide resin with this special structure as the base resin has a high melt index and a low extrusion temperature.

[0035] In the present invention, x represents the weight percentage of the structural unit in the polyimide resin. x can be measured by FI-IR or calculated based on the feed and residual amount.

[0036] In the present invention, the viscosity of the polyimide resin is measured using the national standard GB / T 10247-2008 method.

[0037] According to the present invention, based on the total weight of the thermoplastic polyimide composition, the content of component A is 90-98 wt %, the content of component B is 1-10 wt %, and the content of component C is 0.1-5 wt %.

[0038] In the present invention, when the amounts of component A, component B and component C meet the above ranges, the obtained composition has a high melt index and a low extrusion temperature.

[0039] Furthermore, based on the total weight of the thermoplastic polyimide composition, when the content of component A is 93-95 wt %, the content of component B is 1-5 wt %, and the content of component C is 0.1-1 wt %, the composition has even better performance.

[0040] According to the present invention, Ar is selected from one or more of the following groups:

[0041]

[0042] According to the present invention, x is 0.5-0.8.

[0043] According to the present invention, the viscosity of the thermoplastic polyimide resin at 30° C. is 0.4-0.5 dL / g; the melt index of the thermoplastic polyimide resin at 360° C. and a load of 12.5 kg is 0.5-5 g / 10 min, preferably 1-5 g / 10 min.

[0044] In the present invention, the viscosity of the polyimide resin is measured using the national standard GB / T 10247-2008 method, and the melt index is measured using the national standard GB / T 3682.1-2018 method.

[0045] In one embodiment of the present invention, the polyimide has a structure shown in formula (3):

[0046]

[0047] wherein x is 0.5-0.8, and Ar is as described above.

[0048] According to the present invention, the imide oligomer has a structure shown in formula (2):

[0049]

[0050] wherein y is an integer of 1-10; and R is a residue of a diprimary amine monomer.

[0051] According to the present invention, in formula (2), R is selected from one or more of the following groups:

[0052]

[0053] In the present invention, the imide oligomer having the structure shown in formula (2) has an isomerized structure unit derived from 1,2,3,4-benzenetetracarboxylic dianhydride, which improves the twisting irregularity of the imide oligomer molecular chain, thereby enhancing its plasticizing effect, greatly increasing the melt index of the composition, greatly reducing the extrusion temperature, and further improving the heat resistance stability.

[0054] Furthermore, the thermoplastic polyimide composition provided by the present invention contains an imide oligomer with a special structure, which has excellent high temperature resistance and excellent compatibility with the thermoplastic polyimide resin. When added to the composition, it can significantly improve the processing performance and heat resistance of the composition.

[0055] According to the present invention, preferably, in formula (2), y is an integer of 1-5, more preferably an integer of 1-2.

[0056] According to the present invention, the viscosity of the imide oligomer at 30° C. is 0.1-0.3 dL / g, preferably 0.1-0.2 dL / g.

[0057] According to the present invention, the additive is selected from antioxidants and / or lubricants.

[0058] According to the present invention, the antioxidant is selected from at least one of antioxidant 1010 , antioxidant 264 and antioxidant 168 , preferably antioxidant 1010 .

[0059] According to the present invention, the lubricant is selected from stearic acid and / or pentaerythritol stearate, preferably pentaerythritol stearate.

[0060] According to the present invention, the additives are antioxidants and lubricants.

[0061] According to the present invention, the weight ratio of the antioxidant to the lubricant is 1-5:1, preferably 1-2:1.

[0062] According to the present invention, the composition has a melt index of >3 g / 10 min, preferably 3.5-10 g / 10 min, at 360° C. and a load of 12.5 kg.

[0063] According to the present invention, the extrusion temperature of the composition is 5-30° C. lower than the extrusion temperature of the thermoplastic polyimide.

[0064] According to the present invention, the extrusion temperature is less than 340°C, preferably 300-335°C.

[0065] A second aspect of the present invention provides a thermoplastic polyimide product, wherein the product is prepared by blending, extruding, and injection molding a thermoplastic polyimide composition;

[0066] The thermoplastic polyimide composition is the above-mentioned thermoplastic polyimide composition.

[0067] In the present invention, the thermoplastic polyimide composition uses the thermoplastic polyimide resin of the present invention as a base resin, and is coordinated with the imide oligomer of the present invention and optional additives. The thermoplastic polyimide resin contains isomeric structural units of phthalic anhydride, which leads to molecular chain distortion. The introduction of a specific end-capping agent structure enables the polyimide resin to have a high melt index and a low extrusion temperature. The structural units derived from 1,2,3,4-phthalic anhydride contained in the structure of the imide oligomer have isomeric characteristics, which improves the distortion and irregularity of the imide oligomer molecular chain, thereby enhancing its plasticizing effect. The combination of the two enables the composition to be extruded and injection molded at a relatively low extrusion temperature, for example, below 360° C., preferably 300-350° C., without affecting the mechanical properties of the composition, to produce a thermoplastic polyimide product, and a composition with a relatively high melt index is obtained.

[0068] According to the present invention, the mechanical properties of the thermoplastic polyimide product remain substantially unchanged and the thermal stability is effectively improved.

[0069] A third aspect of the present invention provides use of the thermoplastic polyimide composition or the thermoplastic polyimide product in automobiles and / or electronic appliances.

[0070] The present invention will be described in detail below by way of examples.

[0071] The viscosity of polyimide powder was measured using the national standard GB / T10247-2008 method;

[0072] The melt index of polyimide powder was measured using the national standard GB / T3682.1-2018 method;

[0073] The mechanical properties of polyimide specimens were measured using GB / T 1040-2006;

[0074] 1,2,3,4-Phenylenetetracarboxylic dianhydride is synthesized in the laboratory. The specific synthesis method is as follows (see the 2018 Shanghai University master's thesis, Preparation and Properties of Highly Soluble Phenylacetylene-Terminated Thermosetting Polyimide Resins, author Li Hanyuan):

[0075] Add 100g of cyclohexene, 200mL of carbon tetrachloride and 10mL of anhydrous ethanol to a 1000mL three-necked flask, then place it in an ice-water bath at 0°C. Dissolve 160g of liquid bromine in 100mL of carbon tetrachloride and add it dropwise to the flask. Control the addition to be completed within 10 hours. After the reaction is completed, evaporate the excess carbon tetrachloride and cyclohexene, and then distill under reduced pressure to obtain 188g of 1,2'-dibromocyclohexane.

[0076] Add 200g of sodium hydroxide to 400mL of ethylene glycol, raise the temperature to 210℃, and after distilling off about 80mL of water, begin to dropwise add 188g of 1,2'-dibromocyclohexane and raise the temperature to 230℃. After the addition is complete, continue to introduce nitrogen and continue to collect the distillate for 1h. Use a separatory funnel to separate the aqueous layer of the product and dry it with anhydrous calcium chloride to finally obtain 72g of cyclohexadiene.

[0077] Take 72g of cyclohexadiene, add 80g of maleic anhydride, start mechanical stirring, and react in a 45°C water bath. Because it is an exothermic reaction, put it in a cold water bath to cool it down when the reaction starts. After the reaction is cooled, stir it for 12h, filter to obtain the crude product, and then concentrate the filtrate to collect the crude product. The crude product is boiled and washed with water to obtain 124g of bicyclo[2,2,2]-5-octene-2,3-dianhydride.

[0078] In a 500 mL flask, add 80 mL of 60% concentrated nitric acid, then add 60 mg of ammonium metavanadate and 20 mg of ammonium molybdate. Control the reaction temperature at 60°C, add 20 g of bicyclo[2,2,2]-5-octene-2,3-dianhydride in batches over 4 hours, and simultaneously add 30 mL of fuming nitric acid dropwise. After the reaction is complete, cool and filter, and recrystallize from water to obtain 25 g of cis-1,2,3,4-cyclohexanetetracarboxylic acid.

[0079] 10 g of cis-1,2,3,4-cyclohexanetetracarboxylic acid was added to 120 mL of glacial acetic acid, heated to reflux, and 95 mL of glacial acetic acid containing 16 g of bromine was added dropwise. After the addition was complete, the mixture was refluxed for 3 hours. After cooling, the mixture was recrystallized with water, filtered and dried to obtain 5 g of 1,2,3,4-benzenetetracarboxylic acid.

[0080] Finally, the obtained 1,2,3,4-benzene tetracarboxylic acid is recrystallized in acetic anhydride, and the filter cake is dried and placed in a sublimation tube for sublimation to obtain 1,2,3,4-benzene tetracarboxylic dianhydride.

[0081] 4,4′-Bis(3-aminophenoxy)diphenyl sulfone was purchased from Nanjing Yuezi Chemical Co., Ltd.;

[0082] 1,2,4,5-Pyromellitic dianhydride was purchased from Sinopharm Group Co., Ltd.;

[0083] The imide oligomer A has a structure shown in formula (2), wherein y is 1 and has a viscosity of 0.12 dL / g at 30°C. The specific structural formula is as follows:

[0084]

[0085] The preparation method is as follows: under nitrogen protection, 4,4′-bis(3-aminophenoxy)diphenyl sulfone (100 mmol) is added to a reaction bottle, 200 mL of N,N-dimethylacetamide is added, and stirred to completely dissolve it, then 1,2,3,4-benzenetetracarboxylic dianhydride (50 mmol) is added, and stirred at room temperature for 10 hours to obtain a polyamic acid solution, then phthalic anhydride (100 mmol) is added, and stirred at room temperature for 1 hour, and then 36 mL of chemical imidization reagent acetic anhydride and 18 mL of pyridine are added, and the mixture is reacted at 80° C. for 2 hours to obtain a polyimide solution; the above-mentioned polyimide solution is precipitated in ethanol, the precipitate is collected, thoroughly washed, and dried to obtain the product.

[0086] The imide oligomer B has a structure shown in formula (2), wherein y is 1 and has a viscosity of 0.15 dL / g at 30°C. The specific structural formula is as follows:

[0087]

[0088] The preparation method is as follows: under nitrogen protection, 4,4'-diaminodiphenyl ether (100 mmol) is added to a reaction bottle, 200 mL of N,N-dimethylacetamide is added, and the mixture is stirred to completely dissolve, and then 1,2,3,4-benzenetetracarboxylic dianhydride (50 mmol) is added, and the mixture is stirred at room temperature for 10 hours to obtain a polyamic acid solution, and then phthalic anhydride (100 mmol) is added, and the mixture is stirred at room temperature for 1 hour, and then 36 mL of a chemical imidization reagent, acetic anhydride, and 18 mL of pyridine are added, and the mixture is reacted at 80°C for 2 hours to obtain a polyimide solution; the above-mentioned polyimide solution is precipitated in ethanol, and the precipitate is collected, thoroughly washed, and dried to obtain the product.

[0089] Other raw materials used in the examples and comparative examples are all commercially available.

[0090] Preparation Example 1

[0091] The preparation method of the thermoplastic polyimide resin I having the structure shown below is as follows:

[0092] (1) Under nitrogen protection, 4,4′-bis(3-aminophenoxy)diphenyl sulfone (64.8735 g, 150.0 mmol) was added to a reaction flask, and 415 mL of N,N-dimethylacetamide was added and stirred to completely dissolve. Then, 1,2,3,4-benzenetetracarboxylic dianhydride (6.4454 g, 29.55 mmol) and 1,2,4,5-pyromellitic dianhydride (25.7818 g; 118.2 mmol) were added and stirred at room temperature for 10 hours to obtain a polyamic acid solution. After the viscosity of the polyamic acid reached 0.45 dL / g, phthalic anhydride (1.3330 g, 9 mmol) was added and stirred at room temperature for 1 hour. Then, 36 mL of acetic anhydride and 18 mL of pyridine as a chemical imidization reagent were added and reacted at 80°C for 2 hours to obtain a polyimide solution.

[0093] (2) Preparation of polyimide powder: The polyimide solution was diluted to a solid content of 10%, and then precipitated in a precipitant. The precipitate was collected, thoroughly washed, dried, and then pulverized in a pulverizer for 3 minutes to obtain a thermoplastic polyimide powder having a viscosity of 0.40 dL / g and a melt index of 3 g / 10 min.

[0094] The structure of the polyimide is calculated based on the feed amount and the residual amount.

[0095]

[0096] Ar is:

[0097]

[0098] Preparation Example 2

[0099] The preparation method of the thermoplastic polyimide resin II having the structure shown below is as follows:

[0100] (1) Under nitrogen protection, 4,4′-bis(3-aminophenoxy)diphenyl sulfone (57.5125 g, 132.98 mmol) was added to a reaction flask, and 415 mL of N,N-dimethylacetamide was added and stirred to completely dissolve. Then, 1,2,3,4-benzenetetracarboxylic dianhydride (3.6361 g, 16.67 mmol) and 1,2,4,5-pyromellitic dianhydride (29.0819 g, 133.33 mmol) were added and stirred at room temperature for 10 hours to obtain a polyamic acid solution. After the viscosity of the polyamic acid reached 0.5 dL / g, aniline (0.8383 g, 9 mmol) was added and stirred at room temperature for 2 hours. Then, 36 mL of chemical imidization reagent acetic anhydride and 18 mL of pyridine were added and reacted at 90°C for 1 hour to obtain a polyimide solution.

[0101] (2) Preparation of polyimide powder: The polyimide solution was diluted to a solid content of 8 wt %, and then precipitated in a precipitant. The precipitate was collected, thoroughly washed, dried, and then pulverized in a pulverizer for 5 minutes to obtain a thermoplastic polyimide powder having a viscosity of 0.44 dL / g and a melt index of 0.6 g / 10 min.

[0102] The structure of the polyimide is calculated based on the feed amount and the residual amount.

[0103]

[0104] Ar is:

[0105]

[0106] Example 1

[0107] The thermoplastic polyimide composition comprises: thermoplastic polyimide resin I with a content of 95 wt %, imide oligomer A with a content of 4.9 wt %, and lubricant pentaerythritol stearate with a content of 0.1 wt %.

[0108] After blending, the melt index of the thermoplastic polyimide composition was 4 g / 10 min (12.5 kg / 360° C.), and the extrusion temperature of the composition was 320° C. using a WELLZOON brand C-type high-temperature desktop extruder.

[0109] Comparative Example 1

[0110] The thermoplastic polyimide composition includes: thermoplastic polyimide resin I: content of 100 wt%.

[0111] The thermoplastic polyimide composition has a melt index of 3 g / 10 min (12.5 kg / 360° C.), and the extrusion temperature using a WELLZOON brand C-type high-temperature desktop extruder is 340° C.

[0112] Example 2

[0113] The thermoplastic polyimide composition comprises: thermoplastic polyimide resin I: content of 97 wt %, imide oligomer B: content of 2.5 wt %, and antioxidant 1010: content of 0.5 wt %.

[0114] After blending, the melt index of the thermoplastic polyimide composition was 3.5 g / 10 min (12.5 kg / 360° C.), and the extrusion temperature of the composition was 330° C. using a WELLZOON brand C-type high-temperature desktop extruder.

[0115] Example 3

[0116] The thermoplastic polyimide composition comprises: a thermoplastic polyimide resin I with a content of 96 wt %, an imide oligomer B with a content of 3 wt %, and an antioxidant 1010 with a content of 1 wt %.

[0117] After blending, the melt index of the thermoplastic polyimide composition was 3.7 g / 10 min (12.5 kg / 360° C.), and the extrusion temperature of the composition was 330° C. using a WELLZOON brand C-type high-temperature desktop extruder.

[0118] Example 4

[0119] The thermoplastic polyimide composition comprises: a thermoplastic polyimide resin I with a content of 96 wt % and an imide oligomer B with a content of 4 wt %.

[0120] After blending, the melt index of the thermoplastic polyimide composition was 3.2 g / 10 min (12.5 kg / 360° C.), and the extrusion temperature using a WELLZOON brand C-type high-temperature desktop extruder was 335° C.

[0121] Example 5

[0122] The thermoplastic polyimide composition comprises: thermoplastic polyimide resin II with a content of 96 wt %, imide oligomer B with a content of 4.8 wt %, antioxidant 1010 with a content of 0.1 wt % and lubricant pentaerythritol stearate with a content of 0.1 wt %.

[0123] After blending, the melt index of the thermoplastic polyimide composition was 3.5 g / 10 min (12.5 kg / 360° C.), and the extrusion temperature of the composition was 330° C. using a WELLZOON brand C-type high-temperature desktop extruder.

[0124] Comparative Example 2

[0125] The thermoplastic polyimide composition includes: thermoplastic polyimide resin II: content of 100 wt%.

[0126] The thermoplastic polyimide composition has a melt index of 0.6 g / 10 min (12.5 kg / 360° C.), and the extrusion temperature of the WELLZOON brand C-type high-temperature desktop extruder is 360° C.

[0127] Test Case

[0128] The polyimide compositions of the examples and comparative examples were injection molded at 340° C. and 210 bar to obtain polyimide samples. The mechanical properties of the obtained polyimide samples were tested. The test results are shown in Table 1.

[0129] Table 1

[0130] serial number Tensile strength (MPa) Tensile modulus (GPa) Elongation at break (%) Example 1 111.7 3 4.7 Comparative Example 1 110.6 3 5 Example 2 116.6 3 6.7 Example 3 110.1 3 5.2 Example 4 110 3 4.7 Example 5 117.1 3 3.9 Comparative Example 2 116.4 3 4.1

[0131] As can be seen from the above table, the samples prepared by injection molding the polyimide composition provided by the present invention have comparable tensile strength, tensile modulus and elongation at break, indicating that the thermoplastic polyimide composition provided by the present invention does not affect the basic mechanical properties of the resin.

[0132] From the above Examples 1-5 and Comparative Examples 1-2, it can be seen that the addition of component B and component C increases the melt index of the composition and reduces the temperature required for extrusion.

[0133] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited thereto. Within the technical concept of the present invention, various simple variations of the technical solution of the present invention may be made, including combining the various technical features in any other appropriate manner. These simple variations and combinations should also be regarded as disclosed in the present invention and fall within the scope of protection of the present invention.

Claims

1. A thermoplastic polyimide composition, wherein: The composition comprises component A, component B and component C; The component A is a thermoplastic polyimide resin having a structure shown in formula (1): Wherein, Ar is the residue of a diamine monomer; Ar is selected from one or more of the following groups: x is 0.5-0.8; EG is a capping agent residue selected from one of the following groups: The viscosity of the thermoplastic polyimide resin at 30° C. is 0.35-0.55 dL / g; The thermoplastic polyimide resin has a melt index of 0.5-5 g / 10 min at 360° C. and a load of 12.5 kg; The component B is an imide oligomer; The imide oligomer has a structure shown in formula (2): wherein y is an integer from 1 to 10, and R is the residue of a dibasic primary amine monomer; The viscosity of the imide oligomer at 30° C. is 0.1-0.2 dL / g; The component C is an additive; The additives are antioxidants and lubricants; Based on the total weight of the thermoplastic polyimide composition, the content of component A is 90-98 wt %, the content of component B is 1-10 wt %, and the content of component C is 0.1-5 wt %.

2. The thermoplastic polyimide composition according to claim 1, wherein Based on the total weight of the thermoplastic polyimide composition, the content of component A is 93-95wt%, the content of component B is 1-5wt%, and the content of component C is 0.1-1wt%.

3. The thermoplastic polyimide composition according to claim 1 or 2, wherein the end-capping agent is selected from at least one of the structures shown below:

4. The thermoplastic polyimide composition according to claim 1 or 2, wherein: The thermoplastic polyimide resin has a viscosity of 0.4-0.5 dL / g at 30°C.

5. The thermoplastic polyimide composition according to claim 1 or 2, wherein The thermoplastic polyimide resin has a melt index of 1-4 g / 10 min at 360° C. and a load of 12.5 kg.

6. The thermoplastic polyimide composition according to claim 1 or 2, wherein y is an integer of 1-5.

7. The thermoplastic polyimide composition according to claim 1 or 2, wherein: y is an integer from 1 to 2.

8. The thermoplastic polyimide composition according to claim 1 or 2, wherein: R is selected from one or more of the following groups:

9. The thermoplastic polyimide composition according to claim 1 or 2, wherein: The antioxidant is selected from at least one of the antioxidant 1010 , the antioxidant 264 , and the antioxidant 168 .

10. The thermoplastic polyimide composition according to claim 9, wherein The antioxidant is antioxidant 1010.

11. The thermoplastic polyimide composition according to claim 1 or 2, wherein: The lubricant is selected from stearic acid and / or pentaerythritol stearate.

12. The thermoplastic polyimide composition according to claim 11, wherein The lubricant is pentaerythritol stearate.

13. The thermoplastic polyimide composition according to claim 1 or 2, wherein: The weight ratio of the antioxidant to the lubricant is 1-5:

1.

14. The thermoplastic polyimide composition according to claim 13, wherein The weight ratio of the antioxidant to the lubricant is 1-2:

1.

15. The thermoplastic polyimide composition according to claim 1 or 2, wherein: The composition has a melt index of >3 g / 10 min at 360° C. and a load of 12.5 kg.

16. The thermoplastic polyimide composition according to claim 15, wherein The composition has a melt index of 3.5-10 g / 10 min at 360° C. and a load of 12.5 kg.

17. A thermoplastic polyimide product, wherein: The product is prepared by blending, extruding and injection molding the thermoplastic polyimide composition; The thermoplastic polyimide composition is the thermoplastic polyimide composition according to any one of claims 1 to 16.

18. The thermoplastic polyimide article according to claim 17, wherein: The extrusion temperature of the composition is 5-30° C. lower than the extrusion temperature of the thermoplastic polyimide.

19. The thermoplastic polyimide article according to claim 18, wherein: The extrusion temperature of the composition is <340°C.

20. The thermoplastic polyimide article according to claim 17, wherein: The extrusion temperature of the composition is 300-335°C.

21. Use of the thermoplastic polyimide composition according to any one of claims 1 to 16 or the thermoplastic polyimide product according to any one of claims 17 to 20 in automobiles and / or electronic appliances.

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