A component identification method and structure

Abstract

The present invention discloses a component identification method, including setting a first identification layer on a substrate layer on the upper surface of a component, setting at least one intermediate identification layer on a dielectric layer inside the component corresponding to the first identification layer, setting a second identification layer on a substrate layer on the lower surface of the component corresponding to the intermediate identification layer, and sequentially combining, superimposing, and sintering the substrate layer on the upper surface of the component provided with the first identification layer, the dielectric layer provided with the intermediate identification layer, and the substrate layer on the lower surface of the component provided with the second identification layer in the order of top, middle, and bottom, so that the first identification layer, the intermediate identification layer, and the second identification layer are combined to form an integrated identification pattern. The component identification method can make the identification on the component fit in without falling off, increase the physical nesting effect in addition to the bonding force between the original materials, ensure the stability of the identification structure design, and ensure that the component identification is effectively identified.

Description

Technical Field

[0001] The invention relates to the field of electronic component identification, and in particular to a component identification method and structure. Background Art

[0002] Due to their wide range of uses, components are usually used in a variety of structural types to achieve characteristic function requirements. Since product design and production usually show differences in directionality, inductance and polarity, the outermost surface of electronic components is marked to distinguish the inductance direction during testing and the product placement direction during packaging through color and appearance to maintain product consistency and reduce usage deviations caused by product polarity. In the existing component process, in order to ensure that the product direction can be effectively identified, the mark is usually placed on the outermost side of the magnet. However, due to collisions with each other during product production, or extrusion and deformation between the equipment, the mark may be worn and damaged. In severe cases, the entire surface may fall off, resulting in the loss of the function of identifying the product direction. Summary of the invention

[0003] The object of the present invention is to provide a component identification method and structure that can ensure that the component identification is effectively identified, so as to improve the bonding force between the identification and the component so that they are tightly combined and not easily worn or fallen off.

[0004] The present invention provides a component identification method, comprising the following steps:

[0005] S1. Setting a first identification layer on the substrate layer on the upper surface of the component;

[0006] S2, at least one intermediate identification layer is provided in the internal dielectric layer of the component corresponding to the first identification layer;

[0007] S3, providing a second identification layer on the substrate layer on the lower surface of the component corresponding to the intermediate identification layer;

[0008] S4. Combine and stack the substrate layer on the upper surface of the component provided with the first identification layer, the dielectric layer on the middle identification layer, and the substrate layer on the lower surface of the component provided with the second identification layer in the order of top, middle and bottom, and sinter them to form the first identification layer, the middle identification layer and the second identification layer into an integrated identification pattern.

[0009] Preferably, step S1 comprises the following steps:

[0010] S1-1, providing an upper groove on the substrate layer on the upper surface of the component;

[0011] S1-2, printing a marking paste in the upper groove to form a first marking layer.

[0012] Preferably, step S2 comprises the following steps:

[0013] S2-1, at least one intermediate layer groove with upper and lower surfaces connected to each other on the dielectric layer inside the component corresponding to the first identification layer is provided, and the length of the intermediate layer groove is smaller than that of the upper groove;

[0014] S2-2, printing a marking paste in the groove of the intermediate layer to form an intermediate marking layer.

[0015] Preferably, step S3 comprises the following steps:

[0016] S3-1, setting a lower groove on the substrate layer on the lower surface of the component corresponding to the intermediate identification layer, wherein the length scale of the lower groove is equal to the upper groove;

[0017] S3-2, printing a marking paste in the lower groove to form a second marking layer.

[0018] The present invention also provides a component identification structure, including: a first identification layer arranged on a substrate layer on the upper surface of the component, at least one intermediate identification layer arranged on a dielectric layer inside the component corresponding to the first identification layer, and a second identification layer arranged on a substrate layer on the lower surface of the component corresponding to the intermediate identification layer. The first identification layer, the intermediate identification layer, and the second identification layer are stacked and sintered in the order of top, middle, and bottom on the substrate layer on the upper surface of the component, the dielectric layer, and the substrate layer on the lower surface to form an integrated identification pattern structure.

[0019] Preferably, the method further comprises arranging an upper groove on the substrate layer on the upper surface of the component, and printing a marking paste in the upper groove to form a first marking layer.

[0020] Preferably, at least one intermediate groove having upper and lower surfaces connected to each other and concave is provided in the component internal dielectric layer corresponding to the first identification layer, and identification paste is printed in the intermediate groove to form the intermediate identification layer.

[0021] Preferably, the method further comprises providing a lower groove on the substrate layer on the lower surface of the component corresponding to the intermediate marking layer, and printing marking paste in the lower groove to form a second marking layer.

[0022] Preferably, the length dimension of the middle layer groove is smaller than the length dimensions of the upper groove and the lower groove, and the length dimensions of the upper groove and the lower groove are equal.

[0023] The present invention combines and stacks and sinters the substrate layer on the upper surface of the component provided with the first identification layer, the dielectric layer on the middle identification layer, and the substrate layer on the lower surface of the component provided with the second identification layer in the order of top, middle and bottom, so that the first identification layer, the middle identification layer and the second identification layer are combined to form an integrated identification pattern, so that the identification on the component can be embedded without falling off, and in addition to the bonding force between the original materials, the physical nesting effect is increased, thereby ensuring the stability of the identification structure design and being able to ensure that the component identification is effectively identified.

[0024] In further preferred solutions, more advantages can be obtained: for example, by optimizing the logo production method from a single-layer design to a "I"-shaped structure design in which the length of the middle layer groove is smaller than the upper and lower grooves, the stability and bonding force of the logo are further improved. The original logo and components simply rely on the bonding force between the materials after sintering, but when this invention is designed and produced, after the product is sintered, the first logo layer, the second logo layer and the middle logo layer are connected and combined to present an "I"-shaped nested structure at the transverse section angle. The internal dielectric layer of the component corresponding to the first logo layer is provided with a middle layer groove with concave surfaces connected on the upper and lower sides. The ceramic material of the component in the edge area of ​​the groove is integrated with the overall ceramic material, so that the multi-layer logo can be embedded without falling off, thereby further improving the stability of the logo design structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a structure using a single-layer structure for a prior art logo design;

[0026] Figure 2 An exploded schematic diagram of a component identification structure provided by an embodiment of the present invention;

[0027] Figure 3 A schematic diagram of the structure of a component identification structure provided by an embodiment of the present invention;

[0028] Figure 4 A schematic diagram of a process flow of a component identification method provided by an embodiment of the present invention;

[0029] Figure 5 A schematic diagram of a process for setting a first identification layer provided in an embodiment of the present invention;

[0030] Figure 6 A schematic diagram of the process of setting the intermediate identification layer provided by an embodiment of the present invention;

[0031] Figure 7 A schematic diagram of a process for setting a second identification layer provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0033] Before introducing the embodiments of the present invention, the causes of the technical problems in the prior art are first explained in conjunction with the accompanying drawings. The components described may be inductors or chips, etc. The components described in this solution are described by taking inductors as an example. First, the existing inductor logo design adopts a single-layer structure, and the logo is directly printed on the sheet, forming a logo area in the middle part and a ceramic sheet around it, such as Figure 1 As shown, the logo is placed on the outermost side of the magnet. However, due to collisions during the product manufacturing process, or extrusion and deformation between the products and the equipment, part of the logo may be worn and damaged. In severe cases, the entire surface may fall off, resulting in the loss of the function of identifying the direction of the product.

[0034] Figure 2 It is a structural schematic diagram of a component identification structure provided according to an embodiment of the present invention, including a first identification layer 2 arranged on a substrate layer 1 on the upper surface of the component, at least one intermediate identification layer 4 is arranged on a dielectric layer 3 inside the component corresponding to the first identification layer 2, and a second identification layer 6 is arranged on a substrate layer 5 on the lower surface of the component corresponding to the intermediate identification layer 4. The first identification layer 2, the intermediate identification layer 4, and the second identification layer 6 are stacked and sintered in the order of top, middle, and bottom on the substrate layer 1 on the upper surface of the component, the dielectric layer 3, and the substrate layer 5 on the lower surface to form an integrated identification pattern structure.

[0035] An upper groove is provided on the substrate layer 1 on the upper surface of the component, and a marking paste is printed in the upper groove to form a first marking layer 2. At least one intermediate layer groove whose upper and lower surfaces are both connected by concave surfaces is provided on the internal dielectric layer 3 of the component corresponding to the first marking layer. In this embodiment, an intermediate layer groove whose upper and lower surfaces are both connected by concave surfaces is provided, and a marking paste is printed in the intermediate layer groove to form an intermediate marking layer 4. A lower groove is provided on the substrate layer 5 on the lower surface of the component corresponding to the intermediate marking layer 4, and a second marking layer 6 is formed by printing a marking paste in the lower groove. The length dimension of the intermediate layer groove is smaller than the length dimensions of the upper groove and the lower groove, and the length dimensions of the upper groove and the lower groove are equal, so that the first marking layer 2, the intermediate marking layer 4, and the second marking layer 6 are connected and combined to present an "I"-shaped nested structure, such as Figure 3 As shown, the internal dielectric layer of the component corresponding to the first identification layer 2 is provided with an intermediate layer groove with concave surfaces connected on both the upper and lower sides, and the component ceramic material in the edge area of ​​the groove is integrated with the overall ceramic material, so that the multi-layer logo can be embedded without falling off, thereby further improving the stability of the logo design structure.

[0036] Figure 4 It is a flow chart of a component identification method provided according to an embodiment of the present invention, including S1, setting a first identification layer on the substrate layer on the upper surface of the component; S2, setting at least one intermediate identification layer on the internal dielectric layer of the component corresponding to the first identification layer; S3, setting a second identification layer on the substrate layer on the lower surface of the component corresponding to the intermediate identification layer; S4, combining, superimposing and sintering the substrate layer on the upper surface of the component with the first identification layer, the dielectric layer with the intermediate identification layer, and the substrate layer on the lower surface of the component with the second identification layer in the order of top, middle and bottom, so that the first identification layer, the intermediate identification layer and the second identification layer are combined to form an integrated identification pattern.

[0037] The first identification layer can be set up in the following way: Figure 5 As shown:

[0038] S1-1, providing an upper groove on the substrate layer on the upper surface of the component;

[0039] S1-2, printing a marking paste in the upper groove to form a first marking layer.

[0040] The setting of the intermediate identification layer can be done in the following way. The specific process is as follows: Figure 6 As shown:

[0041] S2-1, at least one intermediate layer groove with upper and lower surfaces connected to each other on the dielectric layer inside the component corresponding to the first identification layer is provided, and the length of the intermediate layer groove is smaller than that of the upper groove;

[0042] S2-2, printing a marking paste in the groove of the intermediate layer to form an intermediate marking layer.

[0043] The second identification layer can be set up in the following way: Figure 7 As shown:

[0044] S3-1, setting a lower groove on the substrate layer on the lower surface of the component corresponding to the intermediate identification layer, wherein the length scale of the lower groove is equal to the upper groove;

[0045] S3-2, printing a marking paste in the lower groove to form a second marking layer.

[0046] Impact tests were conducted with different impact intensities, and the verification results were as follows: with respect to existing single-sided labels, the labels of this embodiment are more stable, and can be effectively identified while ensuring stability and not falling off; and for labels that only have upper and lower bottom surfaces, the label design of this embodiment is also more stable, and can play a good stabilizing role. At the same time, the label production method is optimized from a single-layer design to an "I"-shaped structure design in which the length of the middle layer groove is smaller than the upper and lower grooves, thereby further improving the stability and bonding strength of the label.

[0047] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A component identification method, characterized in that: The steps include: S1. Setting a first identification layer on the substrate layer on the upper surface of the component; S2, at least one intermediate identification layer is provided in the internal dielectric layer of the component corresponding to the first identification layer; S3, providing a second identification layer on the substrate layer on the lower surface of the component corresponding to the intermediate identification layer; S4, combining and superimposing the substrate layer on the upper surface of the component provided with the first identification layer, the dielectric layer on the middle identification layer, and the substrate layer on the lower surface of the component provided with the second identification layer in the order of top, middle, and bottom, and sintering them so that the first identification layer, the middle identification layer, and the second identification layer are combined to form an integrated identification pattern; The S1 comprises the following steps: S1-1, providing an upper groove on the substrate layer on the upper surface of the component; S1-2, printing a marking paste in the upper groove to form a first marking layer; The S2 comprises the following steps: S2-1, providing at least one intermediate layer groove whose upper and lower surfaces are both concavely connected in the dielectric layer inside the component corresponding to the first identification layer; S2-2, printing a marking paste in the groove of the intermediate layer to form an intermediate marking layer; The S3 comprises the following steps: S3-1, setting a lower groove on the substrate layer on the lower surface of the component corresponding to the intermediate identification layer; S3-2, printing a marking paste in the lower groove to form a second marking layer.

2. The component identification method according to claim 1, characterized in that: The length dimension of the middle layer groove is smaller than that of the upper groove.

3. The component identification method according to claim 2, characterized in that: The length scale of the lower groove is equal to that of the upper groove.

4. A component identification structure, characterized in that: include: A first identification layer is arranged on the substrate layer on the upper surface of the component, at least one intermediate identification layer is arranged on the dielectric layer inside the component corresponding to the first identification layer, and a second identification layer is arranged on the substrate layer on the lower surface of the component corresponding to the intermediate identification layer. The first identification layer, the intermediate identification layer, and the second identification layer are stacked and sintered in the substrate layer, the dielectric layer, and the substrate layer on the upper surface of the component in the order of top, middle, and bottom to form an integrated identification pattern structure; it also includes an upper groove arranged on the substrate layer on the upper surface of the component, and the first identification layer is formed by printing identification paste in the upper groove, and at least one intermediate layer groove with upper and lower surfaces connected by concave surfaces is arranged on the dielectric layer inside the component corresponding to the first identification layer, and the intermediate layer groove is printed with identification paste to form the intermediate identification layer, and a lower groove is arranged on the substrate layer on the lower surface of the component corresponding to the intermediate identification layer, and the second identification layer is formed by printing identification paste in the lower groove.

5. The component identification structure according to claim 4, characterized in that: The length of the middle layer groove is smaller than the lengths of the upper groove and the lower groove, and the lengths of the upper groove and the lower groove are equal.

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