Heat dissipation device of power module and heat dissipation system of inverter

Abstract

The present application relates to a heat dissipation device for a power module and a heat dissipation system for an inverter. The device comprises: a substrate having a receiving groove, and a first heat dissipation channel, wherein the power module is received in the receiving groove, and the first heat dissipation channel is zigzagly arranged at the periphery of each receiving groove and contacts with the groove peripheral wall of each receiving groove. The use of the device can improve the heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of frequency converters, and in particular to a heat dissipation device for a power module and a heat dissipation system for a frequency converter. Background Art

[0002] During the use of electrical equipment, serious temperature rise may occur due to high switching frequency and large current. For example, the frequency converter is an electric power control device that controls the AC motor by changing the working power frequency of the motor. If the temperature rise phenomenon is not alleviated after it occurs, it will affect its safe and stable operation.

[0003] In the prior art, when cooling the power module of the inverter, a refrigerant is generally introduced into the radiator, and the refrigerant contacts the power module, thereby cooling the power module through the refrigerant. However, the existing radiator is limited to cooling only one side of the power module, resulting in low heat dissipation efficiency. Summary of the invention

[0004] Based on this, it is necessary to provide a heat dissipation device for a power module and a heat dissipation system for an inverter that can improve the heat dissipation efficiency in order to solve the above technical problems.

[0005] In a first aspect, the present application provides a heat dissipation device for a power module, the device comprising: a substrate having a receiving groove, and a first heat dissipation channel, the power module being received in the receiving groove, the first heat dissipation channel being zigzagly arranged at the periphery of each of the receiving grooves and in contact with the peripheral wall of each of the receiving grooves.

[0006] In one of the embodiments, the device further includes: a second heat dissipation channel connected to the first heat dissipation channel, the second heat dissipation channel is laid on the back side of the substrate and is in thermal contact with the bottom wall of each of the accommodating grooves.

[0007] In one embodiment, the second heat dissipation channel is disposed in a circuitous manner along the arrangement direction of the bottom walls of each of the accommodating grooves.

[0008] In one embodiment, the first heat dissipation channel forms a circuitous pipeline between two adjacent accommodating grooves.

[0009] In one embodiment, the contact surfaces of the power module adjacent to the peripheral wall and the bottom wall of the accommodating groove are coated with heat dissipation silicone, and the power module contacts the peripheral wall and the bottom wall of the accommodating groove through the heat dissipation silicone.

[0010] In one of the embodiments, the device further includes: an inlet temperature sensor disposed at the inlet of the first heat dissipation channel, and an outlet temperature sensor disposed at the outlet of the second heat dissipation channel.

[0011] In a second aspect, the present application provides a heat dissipation system for a frequency converter, the system comprising: a refrigerant compressor, a frequency conversion controller, and a heat dissipation device for the above-mentioned power module, the frequency conversion controller controls the refrigerant compressor to output the refrigerant to the first heat dissipation channel.

[0012] In one of the embodiments, the heat dissipation device further includes: an inlet temperature sensor disposed at the inlet of the first heat dissipation channel, and an outlet temperature sensor disposed at the outlet of the second heat dissipation channel;

[0013] The system further includes a refrigerant regulating valve; the frequency conversion controller is in communication connection with the inlet temperature sensor, the outlet temperature sensor and the refrigerant regulating valve;

[0014] The inlet temperature sensor detects the refrigerant inlet temperature and transmits the detected refrigerant inlet temperature to the frequency conversion controller;

[0015] The outlet temperature sensor detects the refrigerant outlet temperature and transmits the detected refrigerant outlet temperature to the frequency conversion controller;

[0016] The frequency conversion controller receives the refrigerant inlet temperature and the refrigerant outlet temperature, and controls and adjusts the operating frequency of the refrigerant compressor according to the opening of the refrigerant regulating valve and the difference between the refrigerant outlet temperature and the refrigerant inlet temperature.

[0017] In one of the embodiments, the system further comprises: an ambient temperature sensor communicatively connected to the frequency conversion controller;

[0018] The ambient temperature sensor detects the ambient temperature and transmits the detected ambient temperature to the frequency conversion controller;

[0019] The frequency conversion controller receives the ambient temperature and controls the opening of the refrigerant regulating valve according to the difference between the ambient temperature and the refrigerant outlet temperature. The refrigerant compressor outputs the refrigerant to the first heat dissipation channel through the refrigerant regulating valve.

[0020] In one of the embodiments, the system further comprises: an air-cooling heat dissipation component communicatively connected to the frequency conversion controller;

[0021] When the difference between the ambient temperature and the refrigerant outlet temperature is greater than a first temperature threshold, the frequency conversion controller controls the air-cooling heat dissipation component to be in a working state.

[0022] In one of the embodiments, when the ambient temperature is greater than a first temperature threshold, the frequency conversion controller controls the working gear of the air-cooling heat dissipation component according to the change in the ambient temperature.

[0023] The heat dissipation device of the power module and the heat dissipation system of the inverter accommodate the power module in a receiving groove and set a first heat dissipation channel in a zigzag manner on the groove wall of the receiving groove, so that multiple surfaces of the power module can contact the first heat dissipation channel, thereby increasing the heat dissipation area of ​​the power module, thereby improving the heat dissipation efficiency and enhancing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of a heat dissipation device in one embodiment;

[0025] Figure 2 A schematic diagram of the structure of a receiving groove in one embodiment;

[0026] Figure 3 is a schematic structural diagram of a heat dissipation device in another embodiment;

[0027] Figure 4 is a schematic structural diagram of a heat dissipation device in another embodiment;

[0028] Figure 5 A control logic diagram of a heat dissipation system of a frequency converter in one embodiment;

[0029] Figure 6 FIG. 4 is a diagram showing the internal structure of an electronic device in one embodiment. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0036] In a first aspect of the present application, a heat dissipation device for a power module is provided, such as Figure 1As shown, it is a schematic diagram of the structure of the heat dissipation device, wherein the heat dissipation device includes: a substrate 102 with a receiving groove, and a first heat dissipation channel 104, wherein the power module can be received in each receiving groove, and the first heat dissipation channel 104 is zigzagly arranged on the periphery of each receiving groove, and contacts with the groove peripheral wall of each receiving groove. The substrate 102 is used to support each receiving groove and the first heat dissipation channel 104. It can be understood that each receiving groove and the first heat dissipation channel 104 can be arranged on the substrate 102, and can also be arranged in the substrate 102, and the present application does not limit this. Among them, the substrate 102 can be a basic material for manufacturing various structures. In a specific example, the substrate 102 can be a copper-clad laminate.

[0037] The number and size of the receiving grooves provided on the substrate 102 can be set in combination with the number and type of power modules to be actually received. Figure 1 In the figure, the example of the arrangement of the receiving grooves 106, 108, and 110 for receiving the power modules of the first size, and the receiving grooves 112, 114, and 116 for receiving the power modules of the second size is used for explanation. It should be understood that the number of receiving grooves included in the substrate and the size of each receiving groove may also be set differently, for example, the size of each receiving groove may be the same, or there may also be a receiving groove for receiving the power modules of the third size. The embodiments of the present application are not specifically limited.

[0038] Among them, in general production applications, most equipment requires the use of inverters. Therefore, this application takes the heat dissipation of the power module of the inverter as an example to illustrate, wherein the power module of the inverter is also called an inverter module, and its power module can convert the DC voltage of the input module into a three-phase AC power supply to drive the motor, wherein the power module can include an IGBT (insulated gate bipolar transistor) module, a diode module, a triode module, etc.

[0039] Take the power module including IGBT module and diode module as an example, refer to Figure 1 As shown, the accommodating grooves 106, 108, and 110 can be used to accommodate IGBT modules. Figure 1 The accommodating grooves 112, 114 and 116 can be used to accommodate the diode module. It is understandable that the specific number of accommodating grooves can be set according to actual conditions. In this application, a heat dissipation device with 6 accommodating grooves is used as an example to illustrate the heat dissipation process of the inverter power module.

[0040] In one embodiment, the first heat dissipation channel 104 can be a channel through which the refrigerant flows, wherein the first heat dissipation channel 104 can be a heat dissipation channel with a milling channel structure, and the first heat dissipation channel 104 can also be a heat dissipation pipeline with a copper tube structure. The heat dissipation channel with a milling channel structure is used as an example for explanation in this application. Since the milling channel structure reduces one heat conduction process compared to the traditional copper tube structure, the heat dissipation channel with a milling channel structure can effectively improve the heat dissipation efficiency.

[0041] In one embodiment, the first heat dissipation channel 104 forms a circuitous pipeline between two adjacent accommodating grooves.

[0042] Specifically, Figure 1 Taking the adjacent accommodating grooves 114 and 116 as an example, the first heat dissipation channel 104 can start from the top of the right side wall of the accommodating groove 116, pass from the top of the right side wall of the accommodating groove 116 to the bottom of the right side wall, go around to the lower side wall, and then go around from the lower side wall to the bottom of the left side wall of the accommodating groove 116. The first heat dissipation channel 104 goes from the bottom of the left side wall of the accommodating groove 116 to the top of the left side wall of the accommodating groove 116, and then goes around along the top of the right side wall of the accommodating groove 114 to the bottom of the right side wall of the accommodating groove 114. By forming a detour pipeline between the accommodating grooves, the heat dissipation area of ​​each accommodating groove can be increased, and the heat dissipation efficiency can be improved.

[0043] In one embodiment, the first heat dissipation channel 104 may include a refrigerant inlet 118 and a refrigerant outlet 120 , wherein the refrigerant may flow into the first heat dissipation channel 104 through the refrigerant inlet 118 .

[0044] Take the above-mentioned substrate with 6 receiving grooves as an example. Figure 2 As shown, there are 6 receiving grooves arranged in total, namely, receiving groove 106, receiving groove 108, receiving groove 110, receiving groove 112, receiving groove 114 and receiving groove 116. Figure 2 In the figure, an example of each containing groove being arranged in parallel is used for explanation. In other embodiments, the size and position of each containing groove can be adaptively adjusted according to the size and position of the power module, etc. Since the embodiment of the present application involves a total of 3 IGBT modules and 3 diode modules, when designing the size of each containing groove, it can be adaptively set according to the size of the IGBT module and the diode module, so that the containing groove and the power module have better adaptability.

[0045] In one embodiment, reference Figure 3 As shown, the device further includes: a second heat dissipation channel 302 communicated with the first heat dissipation channel 104, the second heat dissipation channel 302 is laid on the back side of the substrate 102, and is in thermal contact with the bottom wall of each of the accommodating grooves.

[0046] Among them, the second heat dissipation channel 302 is connected to the first heat dissipation channel 104. Specifically, the refrigerant inlet 304 of the second heat dissipation channel 302 can be connected to the refrigerant outlet 120 of the first heat dissipation channel 104, wherein the refrigerant can flow into the first heat dissipation channel 104 from the refrigerant inlet 118 of the first heat dissipation channel 104, and flow from the refrigerant inlet 118 of the first heat dissipation channel 104 to the refrigerant outlet 120 of the first heat dissipation channel 104. Since the refrigerant inlet 304 of the second heat dissipation channel 302 is connected to the refrigerant outlet 120 of the first heat dissipation channel 104, the refrigerant can enter the refrigerant inlet 304 of the second heat dissipation channel 302.

[0047] Among them, the second heat dissipation channel 302 can also be a heat dissipation channel with a milling channel structure, and the first heat dissipation channel 104 can also be a heat dissipation pipeline with a copper tube structure. The heat dissipation channel with a milling channel structure is used as an example for explanation in this application. Since the milling channel structure reduces one heat conduction process compared to the traditional copper tube structure, the heat dissipation channel with a milling channel structure can effectively improve the heat dissipation efficiency.

[0048] Specifically, the second heat dissipation channel 302 connected to the first heat dissipation channel 104 is laid on the back of the substrate 102 and is in thermal contact with the bottom wall of each accommodating groove. The first heat dissipation channel 104 and the second heat dissipation channel 302 work together to increase the heat dissipation surface of each accommodating groove to 5 fully wrapped surfaces, greatly increasing the contact area. At the same time, due to the double-layer milling channel structure, the refrigerant flow channel can be extended, so that the refrigerant can pass around the same power module multiple times, thereby effectively improving the heat dissipation efficiency.

[0049] In one embodiment, the second heat dissipation channel is arranged in a circuitous manner along the arrangement direction of the bottom wall of each receiving slot. Specifically, the second heat dissipation channel 302 is arranged from the bottom wall of the receiving slot 106, passes through the receiving slot 108, the receiving slot 110, the receiving slot 112, and the receiving slot 114, until it reaches the bottom wall of the receiving slot 116, and then circuitously passes through the bottom wall of the receiving slot 116 to the receiving slot 106. With this arrangement, the power modules in each receiving slot can achieve a balanced heat dissipation effect, and the problem of poor heat dissipation effect of the power modules in the receiving slots far from the second heat dissipation channel 302 can be effectively avoided.

[0050] In one embodiment, a sponge may be packaged outside the heat dissipation device so that the cooling capacity generated by the refrigerant in the first heat dissipation channel 104 and the second heat dissipation channel 302 is not lost.

[0051] In one embodiment, the contact surfaces of the power module adjacent to the peripheral wall and the bottom wall of the accommodating groove are coated with heat dissipation silicone, and the power module contacts the peripheral wall and the bottom wall of the accommodating groove through the heat dissipation silicone.

[0052] Among them, heat dissipation silicone is a thermally conductive material with low thermal resistance, high thermal conductivity and high flexibility. The high flexibility of this material can reduce the pressure required between components, while covering the microscopic uneven surface so that the components can fully contact and improve the heat conduction efficiency. It is particularly suitable for heat conduction needs with limited space. Therefore, by applying heat dissipation silicone to the contact surfaces adjacent to the peripheral wall of the IGBT module, the diode module and the bottom wall of the groove, the IGBT module and the diode module in the groove can be better fitted with each groove, improving the thermal conductivity between the module and the groove, and greatly improving the heat conduction efficiency of the entire heat dissipation device.

[0053] In one embodiment, reference Figure 4 As shown, the device further includes: an inlet temperature sensor 402 disposed at the inlet 118 of the first heat dissipation channel 104 , and an outlet temperature sensor 406 disposed at the outlet 306 of the second heat dissipation channel 304 .

[0054] Among them, when measuring the temperature of the refrigerant inlet 118 of the first heat dissipation channel 104 and the temperature of the refrigerant outlet 306 of the second heat dissipation sensor 302, any temperature measuring device such as an infrared thermometer, a temperature sensor, a thermometer, etc. can be used for measurement. In the embodiments of the present application, temperature sensors are used to measure the temperature of the refrigerant inlet 118 and the temperature of the refrigerant outlet 306. Specifically, an inlet temperature sensor 402 is used to measure the temperature of the refrigerant inlet 118 of the first heat dissipation channel 104, and an outlet temperature sensor 406 is used to measure the temperature of the refrigerant outlet 306 of the second heat dissipation sensor 302.

[0055] The heat dissipation device of the power module can accommodate the power module in a groove and set a first heat dissipation channel in a zigzag manner on the groove wall of the groove, so that multiple surfaces of the power module can contact the heat dissipation channel, thereby increasing the heat dissipation area of ​​the power module and improving the heat dissipation efficiency.

[0056] On the other hand, the present application also provides a heat dissipation system for a frequency converter, wherein the heat dissipation system for the frequency converter may include a refrigerant compressor, a frequency conversion controller, and a heat dissipation device for a power module, and the frequency conversion controller may control the refrigerant compressor to output the refrigerant to a first heat dissipation channel. For details of the heat dissipation device for the power module, please refer to the above description of the heat dissipation device.

[0057] In one embodiment, the refrigerant compressor can be used to compress the refrigerant so that the refrigerant circulates continuously, and the refrigerant compressor can be arranged outside the frequency conversion cabinet.

[0058] In one embodiment, the frequency conversion controller can be any single-chip microcomputer or PLC (programmable logic controller) that can realize the communication control function, wherein the frequency conversion controller can be arranged in a frequency conversion cabinet, wherein the frequency conversion cabinet can be a square shell with an overall length of 1M, a width of 0.8M, and a height of 1.1M.

[0059] In one embodiment, the heat dissipation device includes the inlet temperature sensor 402 and the outlet temperature sensor 406 as described above; the system also includes a refrigerant regulating valve; the frequency conversion controller is communicatively connected with the inlet temperature sensor 402, the outlet temperature sensor 406 and the refrigerant regulating valve; the inlet temperature sensor 402 detects the refrigerant inlet temperature, and transmits the detected refrigerant inlet temperature to the frequency conversion controller; the outlet temperature sensor 406 detects the refrigerant outlet temperature, and transmits the detected refrigerant outlet temperature to the frequency conversion controller, the frequency conversion controller receives the refrigerant inlet temperature and the refrigerant outlet temperature, and controls and adjusts the operating frequency of the refrigerant compressor according to the opening of the refrigerant regulating valve and the difference between the refrigerant outlet temperature and the refrigerant inlet temperature.

[0060] Among them, the refrigerant regulating valve can be a solenoid valve, the refrigerant regulating valve can be a component in the refrigerant compressor, and the function of the refrigerant regulating valve can be to allow the compressed refrigerant to flow into the inlet of the first heat dissipation channel 104. In some embodiments, the refrigerant regulating valve can include multiple refrigerant flow channels, wherein the multiple refrigerant flow channels can be arranged side by side, each refrigerant flow channel can be provided with a corresponding gear switch valve and a shut-off hole, and the refrigerant flow rate that can pass through each refrigerant flow channel is consistent, wherein the gear and opening of each refrigerant flow channel respectively correspond to the number of refrigerant flow channels opened when the refrigerant regulating valve is in operation.

[0061] In one embodiment, the refrigerant regulating valve may include 4 flow channels. Specifically, when the number of refrigerant flow channels opened can be set to 1, the opening ratio of the refrigerant regulating valve is 25%, and the working gear of the refrigerant regulating valve is 1 gear. When the number of refrigerant flow channels opened can be set to 2, the opening ratio of the refrigerant regulating valve is 50%, and the working gear of the refrigerant regulating valve is 2 gear. When the number of refrigerant flow channels opened can be set to 3, the opening ratio of the refrigerant regulating valve is 75%. When the number of refrigerant flow channels opened can be set to 4, the opening ratio of the refrigerant regulating valve is 100%. The refrigerant regulating valve may also be provided with other numbers of refrigerant flow channels, and the opening ratio and gear of each refrigerant flow channel may also be set differently.

[0062] In one of the embodiments, it can be set that when the opening of the refrigerant regulating valve reaches a preset opening, it is determined that a condition for controlling and adjusting the operating frequency of the refrigerant compressor is met, wherein the preset opening is set to determine whether the current opening of the refrigerant regulating valve reaches a condition for controlling and adjusting the operating frequency of the refrigerant compressor, wherein the preset opening can be adjusted according to actual conditions. For example, the preset opening is set to an opening of 100%, and the frequency conversion controller can only determine that a condition for controlling and adjusting the operating frequency of the refrigerant compressor is met when the opening of the refrigerant regulating valve reaches 100%. Optionally, the preset opening can also be set to 50%, that is, as long as the opening of the refrigerant regulating valve reaches 50%, the frequency conversion controller can determine that a condition for controlling and adjusting the operating frequency of the refrigerant compressor is met.

[0063] Among them, when the opening of the refrigerant regulating valve of the frequency conversion controller reaches a preset opening, the frequency conversion controller can determine the difference between the refrigerant inlet temperature and the refrigerant outlet temperature based on the refrigerant inlet temperature detected by the inlet temperature sensor 402 and the refrigerant outlet temperature detected by the outlet temperature sensor 406, and adjust the operating frequency of the refrigerant compressor according to the difference control. Among them, the operating frequency of the refrigerant compressor is a value that can be used to reflect the capacity of the refrigerant compressor. By increasing the operating frequency of the refrigerant compressor, the refrigerant flow rate can be increased.

[0064] Among them, when the opening of the refrigerant regulating valve reaches a preset opening, the frequency conversion controller can determine the difference between the refrigerant inlet temperature and the refrigerant outlet temperature based on the refrigerant inlet temperature detected by the inlet temperature sensor 402 and the refrigerant outlet temperature detected by the outlet temperature sensor 406, and control and adjust the operating frequency of the refrigerant compressor based on the difference. Among them, the operating frequency of the refrigerant compressor is a value that can be used to reflect the capacity of the refrigerant compressor. By increasing the operating frequency of the refrigerant compressor, the refrigerant flow rate can be increased.

[0065] Specifically, if the difference between the refrigerant outlet temperature and the refrigerant inlet temperature is greater than a set threshold, the frequency converter can send a control instruction to control and adjust the operating frequency of the refrigerant compressor. The threshold value set in this embodiment is 5°. When the difference is greater than 5°, the frequency converter can control to increase the operating frequency of the refrigerant compressor. The refrigerant compressor can be controlled to increase the compressor operating frequency by 10HZ every 30 seconds, thereby increasing the refrigerant flow rate, thereby improving the heat dissipation capacity of the radiator until the refrigerant compressor runs at maximum power.

[0066] Among them, if in the process of the frequency conversion controller controlling and adjusting the operating frequency of the refrigerant compressor, if the difference between the refrigerant outlet temperature and the refrigerant inlet temperature is less than or equal to 5°C, the frequency converter can control to gradually reduce the operating frequency of the refrigerant compressor. Specifically, the refrigerant compressor can be controlled to reduce the compressor operating frequency by 10HZ every 30 seconds, thereby reducing the refrigerant flow rate.

[0067] In one embodiment, when the system includes a refrigerant regulating valve and the heat dissipation device includes an outlet temperature sensor 406, the system also includes: an ambient temperature sensor communicatively connected to the frequency conversion controller; the ambient temperature sensor detects the ambient temperature and transmits the detected ambient temperature to the frequency conversion controller; the frequency conversion controller receives the ambient temperature and controls the opening of the refrigerant regulating valve according to the difference between the ambient temperature and the refrigerant outlet temperature, and the refrigerant compressor outputs the refrigerant to the first heat dissipation channel through the refrigerant regulating valve.

[0068] Among them, the ambient temperature sensor can be set inside the frequency conversion cabinet. Specifically, the ambient temperature sensor can be set in an open position in the frequency conversion cabinet. The ambient temperature sensor can be used to directly detect the ambient temperature inside the frequency conversion cabinet. The ambient temperature can be understood as the average temperature of the air in the frequency conversion cabinet.

[0069] The frequency conversion controller can calculate the difference between the ambient temperature and the refrigerant outlet temperature according to the ambient temperature detected by the received ambient temperature sensor and the refrigerant outlet temperature detected by the outlet temperature sensor 406, and control the opening of the refrigerant regulating valve according to the difference. Specifically, as shown in Table 1, the corresponding relationship between the difference range between the ambient temperature sensor and the outlet temperature sensor 406 and the opening and gear position of the refrigerant regulating valve is:

[0070] Table 1

[0071]

[0072] It can be seen from Table 1 that the opening ratio of the refrigerant regulating valve can include four openings, namely 25%, 50%, 75% and 100%, among which 25% opening can correspond to the 1st gear, 50% opening can correspond to the 2nd gear, 75% opening can correspond to the 3rd gear, and 100% opening can correspond to the 4th gear. Among them, the opening ratio and gear position of the refrigerant regulating valve can also be set in other different ways.

[0073] Among them, when the difference between the ambient temperature measured by the ambient temperature sensor and the refrigerant outlet temperature measured by the outlet temperature sensor 406 is between 5°-10°, the frequency conversion controller can output the first refrigerant regulating valve opening adjustment instruction, and control the opening of the refrigerant regulating valve to be 25%. At this time, the gear position of the refrigerant regulating valve is 1st gear. When the difference between the ambient temperature measured by the ambient temperature sensor and the refrigerant outlet temperature measured by the outlet temperature sensor 406 is between 10°-15°, the frequency conversion controller can output the second refrigerant regulating valve opening adjustment instruction, and control the opening of the refrigerant regulating valve to be 50%. At this time, the gear position of the refrigerant regulating valve is 2nd gear, when the difference between the ambient temperature measured by the ambient temperature sensor and the refrigerant outlet temperature measured by the outlet temperature sensor 406 is between 15°-20°, the frequency conversion controller can output the third refrigerant regulating valve opening adjustment instruction, control the opening of the refrigerant regulating valve to be 75%, and the gear position of the refrigerant regulating valve is 3rd gear, when the difference between the ambient temperature measured by the ambient temperature sensor and the refrigerant outlet temperature measured by the outlet temperature sensor 406 is above 20°, the frequency conversion controller can output the fourth refrigerant regulating valve opening adjustment instruction, control the opening of the refrigerant regulating valve to be 100%, and the gear position of the refrigerant regulating valve is 4th gear. Thus, the frequency conversion controller can adjust the opening of the refrigerant regulating valve according to the difference between the ambient temperature and the refrigerant outlet temperature, so that the opening of the refrigerant regulating valve can be adaptively adjusted according to the ambient temperature and the refrigerant outlet temperature, which can not only timely make corresponding countermeasures for temperature changes, but also avoid unnecessary energy waste to a certain extent.

[0074] In one of the embodiments, when the system includes an ambient temperature sensor, the system also includes: an air-cooled heat dissipation component that is communicatively connected to the frequency conversion controller; when the ambient temperature detected by the ambient temperature sensor is greater than a first temperature threshold, the frequency conversion controller controls the air-cooled heat dissipation component to be in a working state.

[0075] Among them, the air-cooling heat dissipation component can be arranged inside the frequency conversion cabinet. Specifically, the air-cooling heat dissipation component can be a small fan. By turning on the air-cooling heat dissipation component, on the one hand, the inside of the frequency conversion cabinet can be cooled, and on the other hand, the air inside and outside the frequency conversion cabinet can be circulated.

[0076] Among them, the first temperature threshold refers to the temperature value set for determining whether the air-cooled heat dissipation component can be turned on, wherein the value of the first temperature threshold can be determined based on the refrigerant outlet temperature measured by the outlet temperature sensor 406. For example, the first temperature threshold can be set to be consistent with the refrigerant outlet temperature measured by the outlet temperature sensor 406. When the ambient temperature detected by the ambient temperature sensor of the frequency conversion controller is greater than the first temperature threshold (that is, greater than the temperature measured by the outlet temperature sensor 406), the air-cooled heat dissipation component is controlled to be in a working state.

[0077] In one of the embodiments, when the air-cooling heat dissipation component is in working state, the working gear of the air-cooling heat dissipation component can also be controlled according to the change of ambient temperature. Specifically, after the air-cooling heat dissipation component is in the working gear, it can be set that when the ambient temperature detected by the ambient temperature sensor rises by one degree, the gear of the air-cooling heat dissipation component increases by one gear until it increases to the maximum gear. Among them, the gear of the air-cooling heat dissipation component can be divided according to the frequency of the fan of the air-cooling heat dissipation component (that is, the fan speed).

[0078] In one embodiment, if Figure 5 As shown, it is a control logic diagram of the heat dissipation system of the inverter, wherein the heat dissipation system of the inverter includes a refrigerant compressor, a frequency conversion controller, an ambient temperature sensor, an air-cooled heat dissipation component and a heat dissipation device of the power module, wherein the heat dissipation device of the power module is provided with an inlet temperature sensor of the inlet of the first heat dissipation channel, and an outlet temperature sensor of the second heat dissipation channel.

[0079] Specifically, this embodiment is described by taking the frequency conversion controller as the execution subject as an example, wherein, when the frequency converter in the frequency conversion cabinet starts to work, the ambient temperature sensor arranged inside the frequency conversion cabinet detects the ambient temperature T inside the frequency conversion cabinet. 环 , and the ambient temperature T 环 Output to the frequency converter, the outlet temperature sensor will also detect the refrigerant outlet temperature T 出 , and the measured refrigerant outlet temperature T 出 Output to the frequency converter, where the ambient temperature can be understood as the average temperature of the air in the frequency converter cabinet. 出 The temperature is higher than the ambient temperature T 环 When the frequency conversion controller is on, it can control the air cooling components to be in working state.

[0080] Among them, when the air-cooling heat dissipation component is in working state, it can also be adjusted according to the ambient temperature T 环 The change in temperature T can be used to control the working position of the air-cooling heat dissipation component. Specifically, after the air-cooling heat dissipation component is in working state, the ambient temperature T can be set. 环 Every time the temperature rises by one degree, the gear of the air-cooling heat dissipation component increases by one gear until it increases to the maximum gear. The gear of the air-cooling heat dissipation component can be divided according to the frequency of the fan of the air-cooling heat dissipation component (that is, the fan speed).

[0081] When the air-cooled heat dissipation component is working, when the ambient temperature sensor measures the ambient temperature T 环 and refrigerant outlet temperature T 出 When the measured refrigerant outlet temperature difference is greater than 5°, the refrigerant cooling system is turned on. Specifically, it can be set at T 环 and T 出When the difference is between 5° and 10°, the frequency conversion controller can output the first refrigerant regulating valve opening adjustment instruction to control the refrigerant regulating valve ( Figure 5 The opening of the solenoid valve in the refrigerant is 25%. At this time, the gear position of the refrigerant regulating valve is 1st gear. When the ambient temperature T 环 and refrigerant outlet temperature T 出 When the measured refrigerant outlet temperature difference is between 10° and 15°, the frequency conversion controller can output the second refrigerant regulating valve opening adjustment instruction to control the opening of the refrigerant regulating valve to 50%. At this time, the gear position of the refrigerant regulating valve is 2nd gear. When the ambient temperature T 环 and refrigerant outlet temperature T 出 When the measured refrigerant outlet temperature difference is between 15° and 20°, the frequency conversion controller can output the third refrigerant regulating valve opening adjustment instruction to control the opening of the refrigerant regulating valve to 75%. At this time, the gear position of the refrigerant regulating valve is gear 3. When the ambient temperature T 环 and refrigerant outlet temperature T 出 When the measured difference of the refrigerant outlet temperature is above 20°, the frequency conversion controller can output the fourth refrigerant regulating valve opening adjustment instruction to control the opening of the refrigerant regulating valve to be 100%. At this time, the gear position of the refrigerant regulating valve is gear 4. Thus, the opening of the refrigerant regulating valve is adjusted according to the ambient temperature and the refrigerant outlet temperature, thereby improving the heat dissipation efficiency.

[0082] When the opening of the refrigerant regulating valve reaches the preset opening ( Figure 5 When the opening of the solenoid valve in the middle is 100%, the operating frequency of the refrigerant compressor can be controlled and adjusted according to the difference between the refrigerant outlet temperature and the refrigerant inlet temperature. The operating frequency of the refrigerant compressor is a value that can be used to reflect the capacity of the refrigerant compressor. By increasing the operating frequency of the refrigerant compressor, the refrigerant flow rate can be increased. Specifically, if the difference between the refrigerant outlet temperature and the refrigerant inlet temperature is greater than a set threshold value, the frequency converter can send a control instruction to control and adjust the operating frequency of the refrigerant compressor, wherein the threshold value set in this embodiment is 5°. When the difference is greater than 5°, the frequency converter can control to increase the operating frequency of the refrigerant compressor, wherein the refrigerant compressor can be controlled to increase the compressor operating frequency by 10HZ every 30 seconds, thereby increasing the refrigerant flow rate, thereby improving the heat dissipation capacity of the radiator until the compressor reaches maximum power operation. If during the process of the frequency converter controlling and adjusting the operating frequency of the refrigerant compressor, if the difference between the refrigerant outlet temperature and the refrigerant inlet temperature is less than or equal to 5°C, the frequency converter can control to gradually reduce the operating frequency of the refrigerant compressor, specifically, the refrigerant compressor can be controlled to reduce the compressor operating frequency by 10HZ every 30 seconds, thereby reducing the refrigerant flow rate.

[0083] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0084] In one embodiment, an electronic device is provided. The electronic device may be a frequency converter controller in a heat dissipation system of a frequency converter. The internal structure diagram thereof may be as shown in FIG. Figure 6 As shown. The electronic device includes a processor, a memory, a communication interface, a display screen and an input device connected via a system bus. Among them, the processor of the electronic device is used to provide computing and control capabilities. The memory of the electronic device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the electronic device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be implemented through WIFI, a mobile cellular network, NFC (near field communication) or other technologies.

[0085] Those skilled in the art will understand that Figure 6 The structure shown in the figure is merely a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the electronic device to which the scheme of the present application is applied. The specific electronic device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

[0086] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0087] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A heat dissipation device for a power module, characterized in that: The device includes: a substrate with a receiving groove, a first heat dissipation channel, and a second heat dissipation channel connected to the first heat dissipation channel, the power module is received in the receiving groove, the first heat dissipation channel is zigzagly arranged on the outer periphery of each of the receiving grooves, a detour pipeline is formed between two adjacent receiving grooves, and the second heat dissipation channel is laid on the back side of the substrate, and is in thermal contact with the bottom wall of each of the receiving grooves.

2. The heat dissipation device for a power module according to claim 1, characterized in that: The second heat dissipation channel is disposed in a circuitous manner along the arrangement direction of the bottom walls of the accommodating grooves.

3. The heat dissipation device for a power module according to claim 1, characterized in that: The contact surfaces of the power module and the groove peripheral wall and groove bottom wall of the accommodating groove are coated with heat dissipation silicone, and the power module is in contact with the groove peripheral wall and groove bottom wall of the accommodating groove through the heat dissipation silicone.

4. The heat dissipation device for a power module according to claim 1, characterized in that: The device further includes: an inlet temperature sensor disposed at the inlet of the first heat dissipation channel, and an outlet temperature sensor disposed at the outlet of the second heat dissipation channel.

5. The heat dissipation device for a power module according to claim 1, characterized in that: The first heat dissipation channel includes a heat dissipation channel with a milling channel structure or a heat dissipation pipeline with a copper tube structure.

6. The heat dissipation device for a power module according to claim 1, characterized in that: The refrigerant inlet of the second heat dissipation channel is connected to the refrigerant outlet of the first heat dissipation channel.

7. A heat dissipation system for a frequency converter, characterized in that: The system comprises: a refrigerant compressor, a frequency conversion controller, and a heat dissipation device for a power module according to any one of claims 1 to 6, wherein the frequency conversion controller controls the refrigerant compressor to output the refrigerant to the first heat dissipation channel.

8. The heat dissipation system of the frequency converter according to claim 7, characterized in that: The heat dissipation device further includes: an inlet temperature sensor disposed at the inlet of the first heat dissipation channel, and an outlet temperature sensor disposed at the outlet of the second heat dissipation channel; The system further includes a refrigerant regulating valve; the frequency conversion controller is communicatively connected with the inlet temperature sensor, the outlet temperature sensor and the refrigerant regulating valve; The inlet temperature sensor detects the refrigerant inlet temperature and transmits the detected refrigerant inlet temperature to the frequency conversion controller; The outlet temperature sensor detects the refrigerant outlet temperature and transmits the detected refrigerant outlet temperature to the frequency conversion controller; The frequency conversion controller receives the refrigerant inlet temperature and the refrigerant outlet temperature, and controls and adjusts the operating frequency of the refrigerant compressor according to the opening of the refrigerant regulating valve and the difference between the refrigerant outlet temperature and the refrigerant inlet temperature.

9. The heat dissipation system of the frequency converter according to claim 8, characterized in that: The system further comprises: an ambient temperature sensor communicatively connected to the frequency conversion controller; The ambient temperature sensor detects the ambient temperature and transmits the detected ambient temperature to the frequency conversion controller; The frequency conversion controller receives the ambient temperature and controls the opening of the refrigerant regulating valve according to the difference between the ambient temperature and the refrigerant outlet temperature. The refrigerant compressor outputs the refrigerant to the first heat dissipation channel through the refrigerant regulating valve.

10. The heat dissipation system of the frequency converter according to claim 9, characterized in that: The system further comprises: an air cooling and heat dissipation component communicatively connected to the frequency conversion controller; When the difference between the ambient temperature and the refrigerant outlet temperature is greater than a first temperature threshold, the frequency conversion controller controls the air-cooling heat dissipation component to be in a working state.

11. The heat dissipation system of the frequency converter according to claim 10, characterized in that: When the ambient temperature is greater than a first temperature threshold, the frequency conversion controller controls the working gear of the air-cooling heat dissipation component according to the change in the ambient temperature.

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