Circuit board manufacturing method, circuit board and electronic equipment

Abstract

The present invention discloses a circuit board manufacturing method, a circuit board and an electronic device, and relates to the field of semiconductor technology. The circuit board manufacturing method comprises: providing a conductive substrate, on which a conductive circuit is arranged, and on which a conductive pad area is provided; forming a conductive pad thickening layer on the conductive pad area, and the conductive pad thickening layer is used for welding electronic components. The circuit board in the present invention adds a conductive pad thickening layer on the conductive pad area where the conductive circuit and the electronic component are welded, thereby increasing the stability of welding and improving the reliability of the circuit board; and because only the conductive pad area on the conductive substrate is thickened, the cost of the post-production circuit of the substrate is greatly reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a circuit board manufacturing method, a circuit board and an electronic device. Background Art

[0002] As the integration of electronic devices becomes higher and higher, various types of electronic boards are increasingly used. In the manufacturing process of boards, various components are usually soldered to the circuit board using technologies such as reflow soldering. At present, the effect of the soldering process is not stable, and the circuit board and components are prone to peeling after soldering, affecting the use of the product. Summary of the invention

[0003] The main purpose of the present invention is to provide a circuit board manufacturing method, a circuit board and an electronic device, aiming to solve the technical problem in the prior art that the circuit board and the components are easily peeled off after welding.

[0004] To achieve the above object, the present invention provides a circuit board manufacturing method, which comprises:

[0005] Providing a conductive substrate, on which a conductive circuit is arranged, and on which a conductive pad area is provided;

[0006] A conductive pad thickening layer is formed on the conductive pad area, and the conductive pad thickening layer is used for soldering electronic components.

[0007] Optionally, forming a conductive pad thickening layer on the conductive pad area includes:

[0008] forming a first metal layer on a conductive substrate;

[0009] forming a patterned isolation layer on the first metal layer, wherein the isolation layer exposes a first region of the first metal layer located above the conductive pad region;

[0010] A conductive pad thickening layer is formed on the first area.

[0011] Optionally, after forming the conductive pad thickening layer on the first area, the method further includes:

[0012] Remove the isolation layer;

[0013] A second region of the first metal layer located below the isolation layer is removed.

[0014] Optionally, forming a conductive pad thickening layer on the first area includes:

[0015] An electroplating process or an atomic layer deposition process is used to form a conductive pad thickening layer on the first area.

[0016] Optionally, a conductive substrate is provided, comprising:

[0017] Providing a glass substrate;

[0018] A conductive circuit layer is formed on a glass substrate by using a sputtering process, and a conductive pad area is provided on the conductive circuit layer.

[0019] Optionally, the conductive circuit layer includes at least two second metal layers, an insulating layer is provided between two adjacent second metal layers, two adjacent second metal layers are connected via a third metal layer, and the insulating layer and the third metal layer are provided on the same layer.

[0020] Optionally, after forming the conductive circuit layer on the glass substrate by a sputtering process, the method further includes:

[0021] A protection layer is formed on the conductive circuit layer.

[0022] Optionally, before forming the conductive pad thickening layer on the conductive pad area, the method further includes:

[0023] The protective layer is subjected to photolithography processing to expose the conductive pad area on the conductive circuit layer.

[0024] In addition, to achieve the above-mentioned purpose, the present invention also provides a circuit board, which is manufactured by the circuit board manufacturing method as described above.

[0025] In addition, to achieve the above object, the present invention also provides an electronic device, which includes the circuit board as described above.

[0026] In the present invention, a conductive substrate is provided, a conductive circuit is arranged on the conductive substrate, and a conductive pad area is provided on the conductive circuit; a conductive pad thickening layer is formed on the conductive pad area, and the conductive pad thickening layer is used to weld electronic components to form a circuit board. The circuit board in the present invention adds a conductive pad thickening layer on the conductive pad area where the conductive circuit and the electronic component are welded, thereby increasing the stability of welding and improving the reliability of the circuit board; and because only the conductive pad area on the conductive substrate is thickened, the cost of the post-production circuit of the substrate is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the process of the first embodiment of the circuit board manufacturing method of the present invention;

[0028] Figure 2 It is a schematic structural diagram of a first embodiment of a conductive substrate of the present invention;

[0029] Figure 3 This is a schematic structural diagram of an embodiment of a circuit board of the present invention;

[0030] Figure 4 It is a structural schematic diagram of a stage in the process of manufacturing the circuit board of the present invention;

[0031] Figure 5 It is a schematic diagram of the flow chart of the second embodiment of the circuit board manufacturing method of the present invention;

[0032] Figure 6 It is a schematic structural diagram of a second embodiment of a conductive substrate of the present invention.

[0033] Description of Figure Numbers:

[0034] Label name Label name 10 Substrate 40 Protective layer 20 Conductive layer 50 Conductive pad thickening layer 201 Second metal layer 60 Electronic components 202 Insulation layer 70 First metal layer 203 The third metal layer 80 Isolation layer 30 Conductive pad area

[0035] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0036] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0037] Reference Figure 1 , Figure 1 The present invention provides a first embodiment of a method for manufacturing a circuit board.

[0038] In a first embodiment, the circuit board manufacturing method includes the following steps:

[0039] Step S10: providing a conductive substrate, on which a conductive circuit is disposed, and on which a conductive pad area is provided.

[0040] It should be noted that the execution subject of this embodiment is a circuit board manufacturing device, which has the function of executing various processes in circuit board manufacturing, such as sputtering, electroplating, atomic deposition, chemical deposition, exposure, etching, etc. There are mature technologies for components to realize related functions, and this embodiment will not be repeated here.

[0041] Reference Figure 2 , Figure 2 It is a schematic structural diagram of the first embodiment of the conductive substrate of the present invention.

[0042] like Figure 2 As shown, in this embodiment, the conductive substrate may include a substrate 10 and a conductive layer 20 disposed on the substrate 10. The substrate 10 may be polyimide, polyester film or glass substrate, etc. The conductive layer 20 includes a plurality of metal wires to form a conductive circuit, and the material of the metal wires may be molybdenum copper, molybdenum gold, molybdenum nickel, titanium copper, titanium nickel, titanium gold, etc. The specific structure of the conductive substrate may be set as required, and this embodiment is not limited thereto.

[0043] It should be noted that various electronic components usually need to be soldered on the circuit board, and the conductive circuit mainly realizes the connection between various electronic components to transmit electrical signals. The area on the conductive circuit and the area for soldering electronic components is used as the conductive pad area 30. For example, the circuit board can be used to drive an LED lamp group to form a backlight source or an RGB display light source. At this time, the conductive circuit needs to be wired according to the corresponding driving circuit, and the conductive pad area 30 is used to solder the LED lamp.

[0044] Usually, in order to ensure the reliability of the conductive substrate, a protective layer 40 is provided in the conductive circuit except the conductive pad area 30. The protective layer 40 is an insulating layer to prevent the conductive layer 20 from leaking electricity. The material of the protective layer 40 can be ink or the like.

[0045] Step S20: forming a conductive pad thickening layer on the conductive pad area, the conductive pad thickening layer being used for soldering electronic components.

[0046] Reference Figure 3 , Figure 3 It is a schematic structural diagram of an embodiment of a circuit board of the present invention.

[0047] It should be noted that the conductive pad thickening layer 50 has conductive properties, and after the electronic component 60 is welded, the electronic component 60 forms a power circuit with the conductive circuit through the conductive pad thickening layer 50. The material of the conductive pad thickening layer 50 can be the same as or different from the material of the conductive circuit, such as copper, nickel, gold, silver, tin, etc., and its thickness can be 5 to 40 μm.

[0048] It should be noted that after adding the conductive pad thickening layer 50, the connection thickness between the electronic component 60 and the conductive circuit is increased, so that the stability of the welding is better. Therefore, during the subsequent reflow process, the electronic component is not easy to fall off.

[0049] In a specific implementation, the conductive pad thickening layer 50 can be formed by sputtering or deposition. A thickening layer can be first formed on the conductive substrate, and then the thickening layer outside the conductive pad region 30 is removed by etching, and the thickening layer on the conductive pad region 30 is retained to form the conductive pad thickening layer 50. Sputtering, deposition and etching processes are already mature technologies, and will not be described in detail in this embodiment.

[0050] Reference Figure 4 , Figure 4The schematic diagram of the structure of a stage in the process of manufacturing the circuit board of the present invention. In this embodiment, in order to improve the formation efficiency of the conductive pad thickening layer 50, the formation process of the conductive pad thickening layer 50 can be: forming a first metal layer 70 on the conductive substrate; forming a patterned isolation layer 80 on the first metal layer 70, the isolation layer 80 exposes the first area of ​​the first metal layer 70 located above the conductive pad area 30; and forming the conductive pad thickening layer 50 on the first area.

[0051] It should be noted that the first metal layer 70 and the isolation layer 80 can be formed by sputtering. After sputtering, the isolation layer 80 needs to be patterned to expose the first area of ​​the first metal layer 70 located above the conductive pad area 30. The patterning process refers to the use of a yellow light process to expose and etch the entire isolation layer 80, remove the isolation layer 80 material in some areas, and form a patterned isolation layer 80. The process of patterning has mature technology, and this embodiment will not be repeated here.

[0052] In specific implementation, the material of the first metal layer 70 can be the same material as the conductive layer 20, such as molybdenum copper, molybdenum gold, molybdenum nickel, titanium copper, titanium nickel, titanium gold, etc., and of course other materials can also be used. The isolation layer 80 is made of photoresist material, and the photoresist is covered on the first metal layer 70 using a semiconductor process. The conductive pad thickening layer 50 can be formed on the first area by an electroplating process or an atomic layer deposition process.

[0053] In this embodiment, after the conductive pad thickening layer 50 is formed, it is necessary to remove the excess part. Specifically, the isolation layer 80 is first removed, and then the second area of ​​the first metal layer 70 located below the isolation layer 80 is removed. As a result, the conductive pad area 30 also has the first metal layer 70 and the conductive pad thickening layer 50, and the thickness of the two is the increased thickness. Since it costs a lot to form a conductive pad thickening layer 50 with a certain thickness in the conductive pad area 30. By first forming a first metal layer 70, and then forming a conductive pad thickening layer 50 on the basis of the first metal layer 70, a thickening layer with a certain thickness can be added quickly above the conductive pad area 30.

[0054] In this embodiment, a conductive substrate is provided, a conductive circuit is arranged on the conductive substrate, and a conductive pad area is provided on the conductive circuit; a conductive pad thickening layer is formed on the conductive pad area, and the conductive pad thickening layer is used to weld electronic components to form a circuit board. The circuit board in this embodiment has a conductive pad thickening layer added to the conductive pad area where the conductive circuit and the electronic component are welded, which increases the stability of welding and improves the reliability of the circuit board; and because only the conductive pad area on the conductive substrate is thickened, the cost of the post-production circuit of the substrate is greatly reduced.

[0055] Reference Figure 5 , Figure 5 The flowchart of the second embodiment of the circuit board manufacturing method of the present invention is shown in FIG. Based on the above first embodiment, the present invention proposes a second embodiment of the circuit board manufacturing method.

[0056] In the second embodiment, step S10 may include:

[0057] Step S101: providing a glass substrate.

[0058] Compared with the traditional PCB (Printed Circuit Board) board using FR4 (a composite material made of tera-function epoxy resin plus filler (Filler) and glass fiber) or BT (Bismaleimide Triazine, resin substrate) as the substrate, the glass substrate has high flatness, strong rigidity, high-precision processing and active drive characteristics. Therefore, this embodiment uses the glass substrate as the base layer of the circuit board.

[0059] Step S102: forming a conductive circuit layer on the glass substrate by using a sputtering process, wherein the conductive circuit layer has a conductive pad area.

[0060] Continue to refer to Figure 2 The glass substrate is used as the substrate 10, and the conductive circuit layer is used as the conductive layer 20. The conductive circuit layer has a conductive circuit formed by a plurality of metal lines. The conductive circuit layer can be formed into a patterned conductive circuit layer by sputtering a metal layer and then removing a part of the area by etching or photolithography.

[0061] Reference Figure 6 , Figure 6 This is a schematic diagram of the structure of the second embodiment of the conductive substrate of the present invention. To achieve the layout of complex circuits, the conductive circuit layer includes at least two second metal layers 201, an insulating layer 202 is provided between two adjacent second metal layers 201, two adjacent second metal layers 201 are connected through a third metal layer 203, and the insulating layer 202 and the third metal layer 203 are arranged on the same layer.

[0062] In this embodiment, the conductive circuit layer is a multi-layer circuit structure, and each second metal layer 201 can have a different metal line layout. Two adjacent second metal layers 201 are electrically connected through the third metal layer 203 to ensure normal signal transmission. At the same time, the insulating layer 202 is used to isolate each second metal layer 201.

[0063] In a specific implementation, the first second metal layer 201 can be formed on a glass substrate by sputtering, and then the first second metal layer 201 is etched by a yellow light process to obtain a first conductive circuit. Then, an insulating layer 202 is covered on the first second metal layer 201, and then the insulating layer 202 is etched, etc., so that only the portion of the insulating layer 202 above the first conductive circuit is retained. At the same time, the etched insulating layer 202 also needs to expose a portion of the first second metal layer 201 to set the third metal layer 203. Then, a second second metal layer 201 is formed above the insulating layer 202. According to this process cycle, multiple layers of the second metal layer 201 can be set, and the specific number of layers can be set according to user needs, which is not limited in this embodiment.

[0064] In this embodiment, a protective layer 40 may be formed on the conductive circuit layer to protect the conductive circuit layer. The protective layer 40 is an insulating layer to prevent the conductive layer 20 from leaking electricity. The material of the protective layer 40 may be ink, etc. In addition, due to the existence of the protective layer 40, before the conductive pad area 30 is thickened, the protective layer 40 needs to be photolithographically processed to expose the conductive pad area 30 on the conductive circuit layer.

[0065] In this embodiment, a glass substrate is provided, and then a sputtering process is used to form a conductive circuit layer on the glass substrate, and the conductive circuit layer has a conductive pad area to form a conductive substrate. In this embodiment, the glass substrate is used as the base material, so that the circuit board has the characteristics of high flatness and strong rigidity. At the same time, the conductive circuit layer can also adopt a multi-layer circuit setting, so that the circuit board can carry more complex power cables.

[0066] In addition, to achieve the above purpose, the present invention also proposes a circuit board, which is manufactured by the circuit board manufacturing method as described above. The specific steps of the circuit board manufacturing method can refer to the above, and the circuit board can also refer to the above drawings. Since the circuit board can adopt the technical solutions of all the above embodiments, it at least has the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0067] In addition, to achieve the above purpose, the present invention also provides an electronic device, the electronic device includes the circuit board as described above. The specific structure of the circuit board can refer to the above. Since the electronic device can adopt the technical solutions of all the above embodiments, it at least has the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0068] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or system including the element.

[0069] The serial numbers of the embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. In a unit claim that lists several means, several of these means may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order and these words may be interpreted as names.

[0070] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as a read-only memory image (ROM) / random access memory (RAM), a magnetic disk, or an optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present invention.

[0071] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a circuit board, characterized in that: The circuit board manufacturing method comprises: Providing a conductive substrate, on which a conductive circuit is arranged, and on which a conductive pad area is provided; forming a conductive pad thickening layer on the conductive pad area, wherein the conductive pad thickening layer is used for welding electronic components; The step of forming a conductive pad thickening layer on the conductive pad region comprises: forming a first metal layer on the conductive substrate; forming a patterned isolation layer on the first metal layer, wherein the isolation layer exposes a first area of ​​the first metal layer located above the conductive pad area; A conductive pad thickening layer is formed on the first area.

2. The method for manufacturing a circuit board according to claim 1, wherein: After forming the conductive pad thickening layer on the first area, the method further includes: removing the isolation layer; A second region of the first metal layer located below the isolation layer is removed.

3. The method for manufacturing a circuit board according to claim 1, wherein: The step of forming a conductive pad thickening layer on the first region includes: A conductive pad thickening layer is formed on the first region by using an electroplating process or an atomic layer deposition process.

4. The method for manufacturing a circuit board according to claim 1, wherein: A conductive substrate is provided, comprising: Providing a glass substrate; A conductive circuit layer is formed on the glass substrate by a sputtering process, and a conductive pad area is provided on the conductive circuit layer.

5. The method for manufacturing a circuit board according to claim 4, characterized in that: The conductive circuit layer includes at least two second metal layers, an insulating layer is provided between two adjacent second metal layers, and the two adjacent second metal layers are connected via a third metal layer, and the insulating layer and the third metal layer are provided in the same layer.

6. The method for manufacturing a circuit board according to claim 4, characterized in that: After the conductive circuit layer is formed on the glass substrate by the sputtering process, the method further comprises: A protection layer is formed on the conductive circuit layer.

7. The method for manufacturing a circuit board according to claim 6, wherein: Before forming the conductive pad thickening layer on the conductive pad area, the method further includes: The protective layer is subjected to photolithography to expose the conductive pad area on the conductive circuit layer.

8. A circuit board, characterized in that: The circuit board is manufactured by the circuit board manufacturing method according to any one of claims 1 to 7.

9. An electronic device, characterized in that: The electronic device comprises the circuit board as claimed in claim 8.

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