A slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness

Abstract

The present invention discloses a slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness in the technical field of silicon wafer processing equipment. The slicer comprises: a basic component, comprising a base, a top of the base is provided with an electric push rod, and the power end of the electric push rod is connected to a fixed table, first vertical rods are provided at both ends of the rear side of the top of the base, a motor is provided on the left side of the first vertical rod on the right side, the front sides of two groups of the first vertical rods are fixedly connected to a fixed plate, and support rods are provided at both ends of the front side of the fixed plate; a diamond wire component comprises a mounting plate, the mounting plate can be easily pushed by a grip rod and a universal wheel, and then the mounting block can be contacted with the fixed plate by positioning the support rod and the fixed block, so as to facilitate the rapid installation of the locking bolt, and at the same time, the cross rod is inserted into the power end of the motor to realize the rapid replacement of the diamond wire, so that the slicing thickness of the silicon wafer can be changed by rapidly replacing the diamond wires with different spacings.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing equipment, in particular to a slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness. Background Art

[0002] Polycrystalline silicon wafers are a form of single-element silicon. When molten single-element silicon solidifies under supercooling conditions, silicon atoms are arranged into many crystal nuclei in the form of diamond lattices. If these crystal nuclei grow into grains with different crystal plane orientations, these grains will combine and crystallize into polycrystalline silicon. The production of polycrystalline silicon wafers requires the use of a slicer.

[0003] Traditional silicon wafer slicers generally cut using diamond wires. When the thickness of silicon wafer slices needs to be adjusted, it is necessary to change the spacing between the diamond wires. Therefore, the diamond wires on the slicer need to be replaced with diamond wires with the required spacing. However, it is currently quite laborious to replace the diamond wires on the slicer. For this reason, we propose a slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness. Summary of the invention

[0004] The object of the present invention is to provide a slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness, comprising: a basic component, comprising a base, an electric push rod is arranged on the top of the base, and the power end of the electric push rod is connected to the fixed platform, first vertical rods are arranged at both ends of the rear side of the top of the base, a motor is arranged on the left side of the first vertical rod on the right side, the front sides of two groups of the first vertical rods are fixedly connected to the fixed plate, and support rods are arranged at both ends of the front side of the fixed plate; a diamond wire component, comprising a mounting plate, mounting blocks are arranged on both sides of the mounting plate, and two groups of the mounting blocks are respectively sleeved on the two groups of the support rods, and locking bolts connected to the fixed plate are arranged on the two groups of the mounting blocks, two groups of rotating shafts with the same structure are rotatably connected to the mounting plate through bearings, and main rollers are arranged on the front sides of the two rotating shafts, annular diamond wires are wound around the two groups of the main rollers, and the diamond wires are located above the fixed platform, and a cross rod plugged into the power end of the motor is arranged at the rear end of the rotating shaft on the right side.

[0006] As a preferred solution of the slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness described in the present invention, connecting plates are provided on both sides of the bottom of the mounting plate, universal wheels are provided at the bottom of the two groups of connecting plates, and the bottom of the universal wheels is in contact with the base.

[0007] As a preferred solution of the slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness described in the present invention, gripping rods are provided on both sides of the bottom of the mounting plate, and the two groups of gripping rods are respectively located on the side away from each other of the two groups of connecting plates.

[0008] As a preferred solution of the slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness described in the present invention, the grip rod is L-shaped, and the vertical section of the grip rod is connected to the mounting plate, and the horizontal section of the grip rod is located above the base.

[0009] As a preferred solution of the slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness described in the present invention, the power end of the motor is rotatably connected to the fixed plate through a bearing.

[0010] As a preferred solution of the slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness described in the present invention, a fixing block penetrating the fixing plate is arranged at the rear side of the mounting plate.

[0011] As a preferred solution of the slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness described in the present invention, the top of the fixed plate is fitted with a connecting block, the bottom of the connecting block is evenly provided with second vertical rods, and the second vertical rods pass through the fixed plate and the fixed block in sequence.

[0012] Compared with the prior art, the beneficial effects of the present invention are: the mounting plate can be easily pushed through the grip rod and the universal wheel, and then through the positioning of the support rod and the fixed block, the mounting block can be in contact with the fixed plate, so as to quickly install the locking bolt, and at the same time, the cross rod is inserted into the power end of the motor to realize the rapid replacement of the diamond wire, so that the slice thickness of the silicon wafer can be changed by quickly replacing the diamond wire with different spacings. By providing a second vertical rod and a connecting block, the fixed block can be further positioned to improve the stability of the diamond wire during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a front view schematic diagram of the overall structure of a slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness according to the present invention;

[0014] Figure 2 It is a schematic top view of the overall structure of a slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness according to the present invention;

[0015] Figure 3 The schematic diagram of the structure at position A of a slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness according to the present invention.

[0016] In the figure: 100, basic component; 101, base; 102, fixed platform; 103, first vertical rod; 104, motor; 105, fixed plate; 106, support rod; 200, diamond wire assembly; 201, mounting plate; 202, mounting block; 203, rotating shaft; 204, main roller; 205, diamond wire; 206, cross rod; 207, connecting plate; 208, universal wheel; 209, grip; 300, fixed block; 400, second vertical rod; 500, connecting block. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0018] Reference Figures 1 to 3 A slicer for processing polycrystalline silicon wafers with adjustable silicon slice thickness, comprising a basic component 100, including a base 101, an electric push rod is arranged on the top of the base 101, and the power end of the electric push rod is connected to a fixed platform 102, the fixed platform 102 is used to fix the silicon ingot, the electric push rod is used to drive the silicon ingot to move upward to be sliced ​​by a diamond wire 205, first vertical rods 103 are arranged at both ends of the rear side of the top of the base 101, a motor 104 is arranged on the left side of the first vertical rod 103 on the right side, the front sides of the two groups of first vertical rods 103 are fixedly connected to a fixed plate 105, and support rods 106 are arranged at both ends of the front side of the fixed plate 105;

[0019] The diamond wire assembly 200 includes a mounting plate 201, mounting blocks 202 are arranged on both sides of the mounting plate 201, and the two groups of mounting blocks 202 are respectively sleeved on the two groups of support rods 106, which can play the role of positioning and supporting the mounting plate 201, and the two groups of mounting blocks 202 are provided with locking bolts connected with the fixing plate 105, which are used to fix the mounting plate 201, and the mounting plate 201 is rotatably connected with two groups of rotating shafts 203 with the same structure through bearings, and the front sides of the two rotating shafts 203 are provided with main rollers 204, and the two groups of main rollers 204 are wound with annular diamond wires 205, and the diamond wires 205 are wound on the two groups of main rollers 204. The steel wire 205 is located above the fixed table 102, and the rear end of the right rotating shaft 203 is provided with a cross rod 206 inserted into the power end of the motor 104. The motor 104 drives the power end to rotate, so that the cross rod 206 can be just inserted into its power end. When the motor 104 drives the power end to rotate, the main roller 204 can be driven to rotate through the cross rod 206, and then the diamond wire 205 is rotated. The fixed table 102 is driven to move upward by the electric push rod, so that the silicon ingot contacts the diamond wire 205. As the fixed table 102 continues to move upward, the silicon ingot can be sliced.

[0020] Reference Figures 1 to 3 Connecting plates 207 are provided on both sides of the bottom of the mounting plate 201, and universal wheels 208 are provided at the bottom of the two sets of connecting plates 207, and the bottoms of the universal wheels 208 are in contact with the base 101, so that when the user pushes the mounting plate 201, the universal wheels 208 can roll on the base 101, which is more labor-saving.

[0021] Reference Figure 1 to Figure 2 Grip rods 209 are provided on both sides of the bottom of the mounting plate 201, and the two groups of grip rods 209 are respectively located on the sides away from each other of the two groups of connecting plates 207. The grip rods 209 are L-shaped, and the vertical section of the grip rods 209 is connected to the mounting plate 201, and the horizontal section of the grip rods 209 is located above the base 101, so that the user can pull and push the grip rods 209 to drive the mounting plate 201 to move.

[0022] Reference Figure 1 to Figure 2 The power end of the motor 104 is rotatably connected to the fixed plate 105 through a bearing, which can play a role in supporting the power end of the motor 104.

[0023] Reference Figures 1 to 3 A fixing block 300 penetrating the fixing plate 105 is provided on the rear side of the mounting plate 201 to position the mounting plate 201 .

[0024] When it is necessary to install the diamond wire 205 with the required spacing to change the slice thickness, the mounting plate 201 can be easily pushed through the grip 209 and the universal wheel 208, and then the mounting block 202 can be in contact with the fixed plate 105 through the positioning of the support rod 106 and the fixed block 300, so as to quickly install the locking bolts. At the same time, the cross rod 206 can be inserted into the power end of the motor 104, so that the diamond wire 205 can be quickly replaced. At this time, the diamond wire 205 is driven to rotate by two sets of main rollers 204, so that the silicon ingot on the continuously rising fixed table 102 can be sliced. Example

[0025] Reference Figure 1 to Figure 2 The top of the fixed plate 105 is fitted with a connecting block 500, and the bottom of the connecting block 500 is evenly provided with a second vertical rod 400, and the second vertical rod 400 passes through the fixed plate 105 and the fixed block 300 in sequence. The connecting block 500 prevents the second vertical rod 400 from falling, and the fixed block 300 can be limited by the second vertical rod 400, so that the mounting plate 201 can be further limited, so that the diamond wire 205 is relatively stable during slicing.

[0026] The rest of the structure is the same as that of Example 1.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A slicer for processing polycrystalline silicon wafers with adjustable silicon wafer slice thickness, characterized in that: The invention comprises a basic component (100) and a diamond wire component (200), wherein the basic component (100) comprises a base (101), wherein an electric push rod is arranged on the top of the base (101), and the power end of the electric push rod is connected to a fixed platform (102), and first vertical rods (103) are arranged at both ends of the rear side of the top of the base (101), and a motor (104) is arranged on the left side of the first vertical rod (103) on the right side, and the front sides of two groups of the first vertical rods (103) are fixedly connected to a fixed plate (105), and the fixed plate (105) is connected to the fixed plate (105). Support rods (106) are provided at both ends of the front side of the fixed plate (105); the diamond wire assembly (200) comprises a mounting plate (201), mounting blocks (202) are provided on both sides of the mounting plate (201), and two groups of mounting blocks (202) are respectively sleeved on two groups of support rods (106), and the two groups of mounting blocks (202) are provided with locking bolts connected to the fixed plate (105), and the mounting plate (201) is rotatably connected to two groups of rotating shafts (203) with the same structure through bearings, and Main rollers (204) are arranged at the front sides of the two rotating shafts (203), and annular diamond wires (205) are wound around the two sets of main rollers (204), and the diamond wires (205) are located above the fixed platform (102). A cross rod (206) plugged into the power end of the motor (104) is arranged at the rear end of the right rotating shaft (203); connecting plates (207) are arranged at both sides of the bottom of the mounting plate (201), and universal wheels (208) are arranged at the bottom of the two sets of connecting plates (207), and the universal wheels ( The bottom of the mounting plate (208) is in contact with the base (101); grip rods (209) are provided on both sides of the bottom of the mounting plate (201), and the two groups of grip rods (209) are respectively located on the sides of the two groups of connecting plates (207) that are away from each other; the grip rods (209) are in an L-shaped structure, and the vertical section of the grip rod (209) is connected to the mounting plate (201), and the horizontal section of the grip rod (209) is located above the base (101); the power end of the motor (104) is rotatably connected to the fixing plate (105) via a bearing.

2. The polycrystalline silicon wafer processing slicer with adjustable silicon wafer slice thickness according to claim 1, characterized in that: A fixing block (300) penetrating the fixing plate (105) is arranged on the rear side of the mounting plate (201).

3. The polycrystalline silicon wafer processing slicer with adjustable silicon wafer slice thickness according to claim 2, characterized in that: The top of the fixing plate (105) is fitted with a connecting block (500), the bottom of the connecting block (500) is evenly provided with second vertical rods (400), and the second vertical rods (400) sequentially penetrate the fixing plate (105) and the fixing block (300).

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