Method and device for identifying position of device to be transferred

Abstract

The present application provides a method and device for identifying the position of a device to be transferred; in a distribution area of ​​a wafer carried on a target base of a transfer device, after identifying a target marking area, the first target position coordinates of a marking point corresponding to the target marking area are determined, the distribution area is an occupied area of ​​the device to be transferred in the wafer, based on the first target position coordinates and the first historical position coordinates corresponding to the marking point, a coordinate conversion relationship is determined, the first historical position coordinates are determined based on at least one of the second historical position coordinates of each device to be transferred in the pre-identified wafer, the second historical position coordinates are position coordinates relative to an auxiliary device, and the coordinate systems of the transfer device and the auxiliary device are the same; based on the coordinate conversion relationship, the second historical position coordinates of each device to be transferred in the wafer are converted to obtain the second target position coordinates of each device to be transferred relative to the transfer device, thereby shortening the identification time.

Description

Background Art

[0002] When the transfer equipment transfers thousands or even tens of thousands of devices to be transferred distributed on the wafer to the transfer target on the substrate, the relative positions of the devices to be transferred and the transfer target are changed through the relative movement of the wafer and the substrate. When it is determined that the positions of the devices to be transferred and the transfer target are completely aligned, the transfer equipment transfers the devices to be transferred to the transfer target and completes a transfer.

[0003] Before starting the transfer, the transfer equipment needs to determine the position coordinates of the device to be transferred and the transfer target. Since the position coordinates of the device to be transferred relative to the wafer are different on different wafers, the transfer equipment needs to use a camera to take a picture of the position coordinates of the device to be transferred on the wafer to identify the position coordinates of the device to be transferred on the wafer.

[0004] When taking photos for recognition, on the one hand, due to the limitation of the mechanical structure of the equipment and the maximum resolution of the camera, it is impossible to increase the distance between the camera and the wafer to capture a large number of devices to be transferred within the same camera field of view. On the other hand, the edge of the camera field of view is distorted, resulting in poor recognition accuracy. In order to ensure recognition accuracy, the camera captures a small number of devices to be transferred at a time, and then switches the camera field of view multiple times to take photos through relative movement between the camera and the wafer, and uses a visual stitching algorithm to calculate the position coordinates of all devices to be transferred.

[0005] In summary, the camera needs to move relative to the wafer hundreds of times to complete the position identification of all the components to be transferred, which causes the transfer equipment to spend a lot of time identifying the position coordinates of the components to be transferred, resulting in low work efficiency. Summary of the invention

[0006] The present application provides a method and device for identifying the position of a device to be transferred, so as to shorten the time for a transfer device to identify the position coordinates of the device to be transferred and improve the transfer efficiency.

[0007] In a first aspect, an embodiment of the present application provides a method for identifying a position of a device to be transferred, the method comprising:

[0008] In the distribution area of ​​the wafer Wafer carried on the target base of the transfer device, after identifying the target marking area, the first target position coordinates of the marking point corresponding to the target marking area are determined, wherein the distribution area is the occupied area of ​​the device to be transferred in the wafer;

[0009] Based on the first target position coordinates and the first historical position coordinates corresponding to the marking point, a coordinate conversion relationship is determined, wherein the first historical position coordinates are determined based on at least one second historical position coordinate among the second historical position coordinates of each device to be transferred in the pre-identified wafer, the second historical position coordinates are position coordinates relative to the auxiliary device, and the coordinate systems of the transfer device and the auxiliary device are the same;

[0010] Based on the coordinate conversion relationship, the second historical position coordinates of each component to be transferred in the wafer are converted to obtain the second target position coordinates of each component to be transferred relative to the transfer device.

[0011] In a second aspect, an embodiment of the present application provides a device for identifying a position of a device to be transferred, the device comprising:

[0012] A first determination unit is used to determine the first target position coordinates of the marking point corresponding to the target marking area in the distribution area of ​​the wafer Wafer carried on the target base of the transfer device after identifying the target marking area, wherein the distribution area is the occupied area of ​​the device to be transferred in the wafer;

[0013] A second determination unit is used to determine a coordinate conversion relationship based on the first target position coordinate and the first historical position coordinate corresponding to the marking point, wherein the first historical position coordinate is determined based on at least one second historical position coordinate among the second historical position coordinates of each device to be transferred in the pre-identified wafer, the second historical position coordinate is a position coordinate relative to the auxiliary device, and the coordinate systems of the transfer device and the auxiliary device are the same;

[0014] The obtaining unit is used to convert the second historical position coordinates of each component to be transferred in the wafer based on the coordinate conversion relationship to obtain the second target position coordinates of each component to be transferred relative to the transfer device.

[0015] In a third aspect, an embodiment of the present application provides a device for identifying a position of a device to be transferred, comprising: a memory and a processor, wherein the memory is used to store computer instructions; and the processor is used to execute computer instructions to implement the steps of a method for identifying a position of a device to be transferred provided in an embodiment of the present application.

[0016] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, which stores computer instructions. When the computer instructions are executed by a processor, the steps of the method for identifying the position of a device to be transferred provided in the embodiment of the present application are implemented.

[0017] In the fifth aspect, an embodiment of the present application provides a computer program product, which includes computer instructions, and the computer instructions are stored in a computer-readable storage medium; when the processor of the electronic device reads the computer instructions from the computer-readable storage medium, the processor executes the computer instructions, so that the electronic device executes the steps of the method for identifying the position of the device to be transferred provided in the embodiment of the present application.

[0018] The beneficial effects of this application are as follows:

[0019] The embodiment of the present application provides a method and device for identifying the position of a device to be transferred, which is used to shorten the time for the transfer device to identify the position coordinates of the device to be transferred and improve the transfer efficiency. In the embodiment of the present application, the transfer device and the auxiliary device operate in parallel, and after the auxiliary device pre-identifies the second historical position coordinates of each device to be transferred in the wafer, the wafer is placed on the target base of the transfer device, and in the distribution area of ​​the wafer carried on the target base of the transfer device, after the target marking area is identified, the first target position coordinates of the marking point corresponding to the target marking area are determined; then, based on the first target position coordinates and the first historical position coordinates corresponding to the marking point, a coordinate conversion relationship is determined, wherein the first historical position coordinates are determined based on at least one of the pre-identified second historical position coordinates, and the coordinate systems of the transfer device and the auxiliary device are the same; finally, based on the coordinate conversion relationship, the second historical position coordinates of each device to be transferred in the wafer are converted to obtain the second target position coordinates of each device to be transferred relative to the transfer device;

[0020] Under the limitations of limited camera field of view resolution and distortion at the edge of the camera field of view, when the transfer device identifies the component to be transferred, the number of times the camera field of view is moved and photographed is reduced from hundreds of times to several times, thereby greatly reducing the time required for the transfer device to identify the position coordinates of the component to be transferred and improving the transfer efficiency. In addition, an auxiliary device is introduced in the embodiment of the present application, and the auxiliary device works in parallel with the transfer device, thereby reducing the time required for the transfer device to identify the position coordinates of the component to be transferred while maintaining the recognition accuracy.

[0021] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a flow chart of a method for identifying the position of a device to be transferred in an embodiment of the present application;

[0024] Figure 2 This is a structural diagram of a transfer device in an embodiment of the present application;

[0025] Figure 3 This is a structural diagram of an auxiliary device in an embodiment of the present application;

[0026] Figure 4 This is a schematic diagram of transferring a wafer from an auxiliary device to a transfer device in an embodiment of the present application;

[0027] Figure 5 This is a schematic diagram of determining the position coordinates of a device to be transferred on a transfer device in an embodiment of the present application;

[0028] Figure 6 This is a schematic diagram of the first method of determining a target marking area in a distribution area of ​​a wafer in an embodiment of the present application;

[0029] Figure 7 This is a schematic diagram of determining a target marking area in a distribution area of ​​a wafer in the second embodiment of the present application;

[0030] Figure 8 This is a schematic diagram of determining a target marking area in a distribution area of ​​a wafer in the third embodiment of the present application;

[0031] Fig. 9 This is a schematic diagram of determining at least one sub-area in a distribution area of ​​a wafer in an embodiment of the present application;

[0032] Fig.10 This is a flowchart of a specific implementation method of a method for identifying a position of a device to be transferred in an embodiment of the present application;

[0033] Fig.11 A structural diagram of a device for identifying a position of a device to be transferred in an embodiment of the present application;

[0034] Fig.12 This is a structural diagram of a device for identifying a position of a device to be transferred in an embodiment of the present application. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and beneficial effects of this application clearer, the technical solution in the embodiment of this application will be clearly and completely described in conjunction with the drawings in the embodiment of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] The terms "first", "second" and the like in the specification and claims of this application and the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0037] The following is a brief introduction to the design concept of the embodiments of the present application.

[0038] The present application relates to the field of precision transfer equipment, and is applicable to the transfer operation of devices to be transferred on a substrate, such as the transfer of chips.

[0039] During the device transfer operation, the transfer equipment needs to transfer thousands or even tens of thousands of devices to be transferred in the wafer to the corresponding transfer target in the substrate in a very short time. Currently, the relative position of the device to be transferred and the transfer target is changed by the relative movement of the wafer and the substrate. When the position of the device to be transferred and the transfer target are completely aligned, the device to be transferred is transferred to the transfer target to complete a transfer.

[0040] It can be seen that before starting the transfer, the transfer equipment first needs to obtain the position coordinates of all transfer targets and devices to be transferred. The coordinates of the transfer target in the substrate can be calculated using the design value of the relative position relationship between the transfer target and the substrate. However, the coordinates of the devices to be transferred relative to the wafer are different on different wafers. Therefore, it is necessary to use the camera in the transfer equipment to take photos and identify the position coordinates of the devices to be transferred on the wafer. The accuracy and time of determining the position coordinates of the devices to be transferred by taking photos and identifying will directly affect the transfer accuracy and efficiency.

[0041] Since there are usually thousands or even tens of thousands of devices to be transferred on a wafer, the position coordinates of the devices to be transferred are limited by the mechanical structure of the equipment and the maximum resolution of the camera. It is impossible to capture a large number of devices to be transferred within the same camera field of view by increasing the distance from the camera to the wafer. On the other hand, the edges of the camera field of view are distorted, and the recognition accuracy is poor.

[0042] In order to ensure the final recognition accuracy, the camera can only take pictures of a small number of devices to be transferred at a time, and then the camera and the wafer move relative to each other, switch the camera field of view multiple times to take pictures, and use the visual stitching algorithm to calculate the position coordinates of all devices to be transferred. Generally, the camera needs to move relative to the wafer hundreds of times to complete the position recognition of all devices to be transferred. This means that for a certain substrate, the transfer equipment needs to spend a lot of time to identify the position coordinates of the devices to be transferred, which makes it difficult to meet the requirements for the total transfer time and has low work efficiency.

[0043] Based on the above content, in order to shorten the time spent on identifying the position coordinates of the device to be transferred, further shorten the total time spent on transferring the device to be transferred, and improve the working efficiency of the transfer equipment, a method and device for identifying the position of the device to be transferred are provided in an embodiment of the present application.

[0044] Below, the position identification method of the device to be transferred provided by the exemplary embodiment of the present application is described in conjunction with the accompanying drawings. It should be noted that the above application scenario is only shown to facilitate understanding of the spirit and principles of the present application, and the implementation of the present application is not limited in this regard.

[0045] Please refer to Figure 1 , Figure 1 An exemplary flow chart of a method for identifying a position of a device to be transferred in an embodiment of the present application is provided, comprising the following steps:

[0046] Step S100, after identifying a target marking area in a distribution area of ​​a wafer carried on a target base of a transfer device, determine the first target position coordinates of a marking point corresponding to the target marking area, wherein the distribution area is an occupied area of ​​the device to be transferred in the wafer.

[0047] When the transfer device transfers the components to be transferred in the wafer to the corresponding transfer targets in the substrate, the transfer device needs to identify the position coordinates of each component to be transferred in the wafer.

[0048] In the embodiment of the present application, the transfer device includes: a workbench carrying a substrate, a target base on which a wafer can be mounted, also called a wafer base, and the wafer base can move in the X and Y directions of the transfer device, and a camera, please refer to Figure 2 , Figure 2 A structural diagram of a transfer device in an embodiment of the present application is provided as an example.

[0049] In a possible implementation, when the transfer device identifies the position coordinates of the component to be transferred in the wafer, the wafer should be mounted on a target base of the transfer device, and then the position of the component to be transferred in the wafer is identified by a first camera.

[0050] When the transfer device identifies the position of the device to be transferred, in order to reduce the number of times the first camera moves and shoots from hundreds to a few times, the time for identifying the position of the device to be transferred is shortened. In the embodiment of the present application, a set of independent auxiliary equipment is proposed, and the auxiliary equipment and the transfer device work in parallel.

[0051] The auxiliary equipment includes: an auxiliary base on which wafers can be mounted, also known as a wafer base, and the wafer base can move in the X and Y directions of the auxiliary equipment, as well as a camera. Please refer to Figure 3 , Figure 3 The structural diagram of an auxiliary device in the embodiment of the present application is provided as an example. It should be noted that the coordinate system of the transfer device and the auxiliary device is the same.

[0052] Generally, the auxiliary equipment and the transfer equipment work in parallel as follows: while the transfer equipment is identifying and transferring the device to be transferred in the wafer, the auxiliary equipment is identifying the device to be transferred in the wafer to be transferred, and after the transfer equipment completes the transfer of the device to be transferred in the wafer, the wafer whose position has been identified by the auxiliary equipment is transferred to the target base of the transfer equipment for position identification and transfer of the device to be transferred, and at the same time, the auxiliary equipment is identifying the device to be transferred in the next wafer to be transferred; please refer to Figure 4 , Figure 4 A schematic diagram of transferring a wafer from an auxiliary device to a transfer device in an embodiment of the present application is provided as an example.

[0053] For example, while the transfer device is performing position identification and transfer of the device A to be transferred in Wafer-A, the auxiliary device is performing position identification of the device B to be transferred in Wafer-B. After the transfer device completes the transfer of the device A to be transferred in Wafer-A, Wafer-B whose position has been identified by the auxiliary device is transferred to the target base of the transfer device, and the device B to be transferred in Wafer-B is then position identified and transferred.

[0054] Therefore, in the embodiment of the present application, the transfer device only needs to move the first camera several times to identify the first target position coordinates of the marking point corresponding to the target marking area in the distribution area of ​​the wafer, and then determine the coordinate conversion relationship based on the first target position coordinates and the first historical position coordinates corresponding to the marking point; wherein the first historical position coordinates are determined based on at least one second historical position coordinate of the second historical position coordinates pre-identified by the auxiliary device for each device to be transferred in the wafer;

[0055] Finally, based on the coordinate conversion relationship, the second historical position coordinates identified by the auxiliary device for each component to be transferred in the wafer are converted to obtain the second target position coordinates of each component to be transferred relative to the transfer device. For details, see steps S101 to S102.

[0056] Step S101, determining a coordinate conversion relationship based on the first target position coordinates and the first historical position coordinates corresponding to the mark point.

[0057] Among them, the first historical position coordinate is determined based on at least one second historical position coordinate of the pre-identified second historical position coordinates of each device to be transferred in the wafer, the second historical position coordinate is the position coordinate relative to the auxiliary equipment, and the coordinate system of the target base and the auxiliary equipment is the same.

[0058] Step S102: based on the coordinate conversion relationship, convert the second historical position coordinates of each component to be transferred in the wafer to obtain the second target position coordinates of each component to be transferred relative to the transfer device.

[0059] In a possible implementation, when the position coordinates of each device to be transferred in the wafer on the transfer device are rotated R and translated T as a whole relative to the position coordinates on the auxiliary device, the coordinate transformation relationship is determined as follows:

[0060] Assume that there are four marking points, namely, marking point 1 (Mark1), marking point 2 (Mark2), marking point 3 (Mark3) and marking point 4 (Mark4);

[0061] On the auxiliary device, the first historical position coordinates of Mark1, Mark2, Mark3 and Mark4 are (x i ,y i ),i∈1,2,3,4, the second historical position coordinate of a device P to be transferred is (x P ,y P );

[0062] Move the wafer to the transfer device, and the first target position coordinates of Mark1, Mark2, Mark3 and Mark4 are (x' i ,y' i ),i∈1,2,3,4, the second target position coordinate of the device P' to be transferred corresponding to a device P to be transferred is (x' P ,y' P ), please refer to Figure 5 , Figure 5 A schematic diagram of determining the position coordinates of a device to be transferred on a transfer device in an embodiment of the present application is exemplarily provided.

[0063] At this time, for line segment M 1 M 2 , there are the following expressions:

[0064]

[0065]

[0066] in Combining expressions (1) and (2), we can obtain:

[0067]

[0068]

[0069] T x =x' 1 +sinθy 1 -cosθx 1

[0070] T y =y' 1 -sinθx 1 -cosθy 1

[0071] The position coordinates of the corresponding device P' to be transferred on the transfer device can be determined based on the position coordinates of the device P to be transferred on the auxiliary device as follows:

[0072]

[0073] Since, after the wafer is moved to the transfer device, the position coordinates of the devices to be transferred will be slightly changed, therefore, in the embodiment of the present application, for one device to be transferred, line segments M and M are respectively used. 1 M 2 、M 2 M 4 、M 4 M 3 、M 3 M 1 , determine the position coordinates of the device to be transferred on the transfer device, then average the determined position coordinates, and use the average calculation result as the second target position coordinates of the device to be transferred relative to the transfer device.

[0074] In the embodiment of the present application, under the limitations of limited camera field of view resolution and distortion at the edge of the camera field of view, when the transfer device identifies the component to be transferred, the number of times the camera field of view is moved and photographed is reduced from hundreds of times to several times, thereby greatly reducing the time required for the transfer device to identify the position coordinates of the component to be transferred and improving the transfer efficiency; and in the embodiment of the present application, an auxiliary device is introduced, and the auxiliary device works in parallel with the transfer device, thereby reducing the time for the transfer device to identify the position coordinates of the component to be transferred while maintaining the recognition accuracy.

[0075] Because, firstly, the corresponding position coordinates, i.e., the second historical position coordinates, of each component to be transferred in the Wafer are pre-identified based on the auxiliary equipment; then, the Wafer with the identified position coordinates is transferred to the target base of the transfer equipment, and the position of the component to be transferred in the Wafer is identified on the transfer equipment; therefore, only the target marking area is identified in the transfer equipment, and after the target marking area is identified, the second target position coordinates of each component to be transferred relative to the transfer equipment can be determined by means of coordinate conversion.

[0076] In a possible implementation, based on the position information of the historical marking area relative to the distribution area in the wafer, the devices to be transferred at the same position as the position information in the distribution area are identified, and a target area consisting of the identified devices to be transferred is determined; after determining that the target area is consistent with the contour of the historical marking area, it is determined that the target marking area is identified;

[0077] The historical marking area is marked in the auxiliary device after identifying and obtaining the corresponding second historical position coordinates for each device to be transferred in the wafer.

[0078] In the embodiment of the present application, at least three marking areas are marked, and each marking area includes at least one device to be transferred, which is described below using a specific case.

[0079] Case 1: There are three target marking areas, which are areas corresponding to three corners in the distribution area, and each target marking area contains a device to be transferred.

[0080] Please refer to Figure 6 , Figure 6 An exemplary schematic diagram of the first method of determining a target marking area in a distribution area of ​​a wafer in an embodiment of the present application is provided; in order to improve efficiency, one of three devices to be transferred located at a corner of the distribution area can be selected as the target marking area.

[0081] After the target marking area is identified, since the marking area contains a device to be transferred, the second target position coordinates of the device to be transferred relative to the transfer device are used as the first target position coordinates of the marking point.

[0082] Case 2: There are four target marking areas, which are areas corresponding to the four corners of the distribution area, and each marking area contains a device to be transferred.

[0083] Please refer to Figure 7 , Figure 7 A schematic diagram of a second method of determining a target marking area in a distribution area of ​​a wafer in an embodiment of the present application is exemplarily provided;

[0084] Since the relative positions of the components to be transferred on the wafer may change slightly during the process of moving the wafer from the auxiliary device to the transfer device, one of the four components to be transferred located at the corners of the distribution area can be selected as the target marking area to reduce the error.

[0085] After the target marking area is identified, since the marking area contains a device to be transferred, the second target position coordinates of the device to be transferred relative to the transfer device are used as the first target position coordinates of the marking point.

[0086] Case 3: There are four target marking areas, which are areas corresponding to the four corners in the distribution area, and each target marking area is composed of multiple devices to be transferred.

[0087] Please refer to Figure 8 , Figure 8 A schematic diagram of a third method of determining a target marking area in a distribution area of ​​a wafer in an embodiment of the present application is exemplarily provided;

[0088] Considering that the devices to be transferred near the four corners of the distribution area may fall off, and the camera can photograph more than one device to be transferred at a time, multiple devices to be transferred can be selected at the four corners as target marking areas.

[0089] After the target marking area is identified, since the target marking area contains multiple devices to be transferred, the second target position coordinates of each device to be transferred relative to the transfer device are determined, and all the second target position coordinates are averaged, and the average value is used as the first target position coordinate of the marking point.

[0090] Select multiple devices to be transferred on the wafer as marking points. The transfer equipment identifies the marking points by recognizing the outline. This can handle the situation where the devices to be transferred on the wafer fall off or the relative positions of the devices to be transferred change slightly.

[0091] Taking into account that the relative positions of the components to be transferred on the wafer may change significantly, affecting the accuracy of recognition, in an embodiment of the present application, after the target marking area is identified, the second historical position coordinates of each component to be transferred in the wafer are converted, and before the second target position coordinates of each component to be transferred relative to the transfer device are obtained, further verification can be performed to ensure the accuracy of recognition.

[0092] Generally, in order to improve efficiency, further verification will be performed after the target marked area is identified. Below, a specific implementation example is taken to explain the verification process.

[0093] Step A: divide the distribution area to obtain at least one sub-area.

[0094] In a possible implementation, based on the first target position coordinates of the marking point corresponding to the identified target marking area, the distribution area is divided into at least one sub-area consistent with the number of marking points, wherein each sub-area contains a target marking area.

[0095] Please refer to Fig. 9 , Fig. 9 A schematic diagram of determining at least one sub-area in a distribution area of ​​a wafer in an embodiment of the present application is provided as an example. According to the positions of the marking points Mark1 to Mark4 corresponding to each target marking area, the distribution area of ​​the device to be transferred on the wafer is evenly divided into four sub-areas.

[0096] Step B: for any sub-region, in a designated area of ​​the sub-region, identifying third target position coordinates corresponding to a designated number of target devices to be transferred.

[0097] Step C: determining the target relative positions between the components to be transferred based on the identified third target position coordinates of the components to be transferred.

[0098] Step D: determining an offset based on the target relative positions between the target components to be transferred and the historical relative positions between the target components to be transferred.

[0099] Please refer to Fig. 9 , in the middle of the four sub-areas, select a specified number of devices to be transferred as verification areas, and the specified number selected can enable the camera to complete the shooting in the same field of view and record the outline of the verification area;

[0100] It should be noted that the designated area and the designated quantity are marked by the auxiliary device after identifying and obtaining the corresponding second historical position coordinates of each device to be transferred in the wafer.

[0101] Calculate the offset of the device to be transferred on the auxiliary device and the transfer device in the verification area, that is, the relative position error; wherein the threshold of the relative position error is set according to the transfer accuracy requirements of different substrates. When the accuracy requirement is high, part of the recognition speed can be sacrificed.

[0102] Step E: After determining that the offset is within the allowable error range, determine the coordinate transformation relationship based on the first target position coordinates and the first historical position coordinates corresponding to the marking point, so as to transform the second historical position coordinates of each component to be transferred in the Wafer based on the transformation relationship to obtain the second target position coordinates of each component to be transferred relative to the transfer device.

[0103] When the relative position error is within the threshold, the relative position change of the sub-area is considered acceptable. The coordinate conversion relationship can be determined directly based on the first target position coordinates and the first historical position coordinates corresponding to the marking point, and the second historical position coordinates of each device to be transferred in the Wafer are converted based on the conversion relationship to obtain the second target position coordinates of each device to be transferred relative to the transfer device. The transfer device only needs to move and take pictures a few times to complete the position recognition of the device to be transferred, shortening the recognition time and improving the transfer efficiency.

[0104] When the relative position error exceeds the threshold, it is considered that the relative position of the devices to be transferred in the sub-area has changed too much, and the coordinate conversion relationship cannot be used to convert the second historical position coordinates of each device to be transferred in the Wafer. It is necessary to use a camera to take pictures of the devices to be transferred in the sub-area one by one for positioning. For areas where the relative position relationship has changed too much, you can choose to identify the coordinates by taking pictures one by one, which can achieve a trade-off between accuracy requirements and recognition time.

[0105] It should be noted that when the relative position error is within the allowable range, the transfer device only needs to move and take pictures a few times to complete the position identification of all devices to be transferred. Compared with the previous hundreds of times, it can greatly save the time spent by the transfer device on identifying the devices to be transferred, and still maintain a high recognition accuracy. Even if there is a sub-area position error that does not meet the conditions, it can still be identified by coordinate transformation in the sub-area that meets the conditions, saving a lot of time.

[0106] Please refer to Fig.10 , Fig.10 A flowchart of a specific implementation method of a method for identifying a position of a device to be transferred in an embodiment of the present application is provided as an example, comprising the following steps:

[0107] Step S1000: Preliminarily identify the position coordinates of each component to be transferred in the wafer by using an auxiliary device.

[0108] The auxiliary equipment has a wafer base on which the wafer can be mounted. The wafer base can be moved in the X and Y directions of the equipment, and a large number of components to be transferred are distributed on the wafer.

[0109] The auxiliary device has a camera that can take pictures of the device to be transferred to obtain the position information of the device to be transferred. The field of view of the camera can be switched by moving the wafer base relative to the camera.

[0110] While the transfer equipment is transferring the previous substrate, the auxiliary equipment is identifying the position coordinates of the components to be transferred on the wafer corresponding to the next substrate.

[0111] Step S1001, after identifying the second historical position coordinates corresponding to each device to be transferred in the wafer through the auxiliary device, determine the historical marking area in the distribution area of ​​the wafer according to the identification result;

[0112] After the auxiliary equipment completes the position identification of all the devices to be transferred on the wafer, it selects an appropriate number of devices to be transferred at the four corners of the distribution area of ​​the wafer according to the identification results, and uses the area composed of the selected devices to be transferred as the historical marking area.

[0113] Step S1002, determining the location information and outline of the historical marking area relative to the distribution area in the wafer and the first historical location coordinates of the marking point corresponding to the historical marking area;

[0114] For the four corners of the wafer distribution area, an appropriate number of devices to be transferred are selected respectively, and the position information of each device to be transferred and the outline of the historical marking area are determined. At the same time, the second historical position coordinates of each selected device to be transferred are determined, and the average of each second historical position coordinate is taken as the first historical position coordinate of the corresponding marking point. The number of devices to be transferred selected can meet the requirements of shooting in the same photographing field of view.

[0115] Step S1003, dividing the distribution area in the wafer into four sub-areas according to the marking points corresponding to the determined historical marking area, and selecting a specified number of devices to be transferred in each sub-area to form a verification area, and recording the outline of the verification area;

[0116] According to the positions of mark point 1 (Mark1) to mark point 4 (Mark4), the distribution area in the wafer is evenly divided into four sub-areas. In the middle of the four sub-areas, a specified number of components to be transferred are selected as verification areas. The specified number selected allows the camera to shoot in the same field of view and record the outline of the verification area to check whether the relative positions of the components to be transferred on the wafer have changed significantly.

[0117] Step S1004, after determining that the transfer device has completed the transfer of the device to be transferred in the previous wafer, the wafer whose second historical position coordinates of the device to be transferred have been identified by the auxiliary device is transferred to the wafer of the transfer device;

[0118] The transfer equipment has a workbench for carrying the substrate. The substrate is placed on the workbench, and there are numerous transfer target positions distributed on the substrate. The transfer equipment has a target base on which the wafer can be installed, also known as a wafer base. The wafer base can move in the X and Y directions of the equipment, and there are numerous devices to be transferred distributed on the wafer. The transfer equipment also has a camera that can take pictures of the devices to be transferred to obtain the position information of the devices to be transferred.

[0119] When the transfer device completes the transfer of a substrate, the workbench will be replaced with the next substrate. The wafer that has completed position recognition on the auxiliary device is moved to the wafer base of the transfer device, and all the information recognized by the auxiliary device is sent to the transfer device.

[0120] Step S1005, the transfer device identifies a target marking area in a distribution area of ​​the wafer Wafer carried on the target base, and determines a first target position coordinate of a marking point corresponding to the target marking area;

[0121] The transfer device first uses the position information of the historical marking area obtained on the auxiliary device relative to the distribution area in the wafer as the rough position information of the target marking area on the transfer device relative to the distribution area in the wafer. After moving the camera field of view of the transfer device to the position corresponding to the rough position information, the components to be transferred corresponding to the rough position information are identified, and the contour of the components to be transferred identified is determined. When the overlap rate of the contour is greater than a certain degree, it is regarded as that the corresponding target marking area is identified. The coordinates of all components to be transferred corresponding to the target marking area are averaged to obtain the first target position coordinates of the marking point corresponding to the target marking area on the transfer device.

[0122] Step S1006, the transfer device identifies the target verification area corresponding to each sub-area in the distribution area of ​​the wafer Wafer carried on the target base, and determines the third target position coordinates corresponding to the target to-be-transferred device contained in the target verification area;

[0123] The transfer device uses the coordinates of the verification area of ​​each sub-area obtained on the auxiliary device as the rough coordinates of the verification area on the transfer device, moves the camera field of view to that position, and identifies the outline of the device to be transferred corresponding to the verification area. When the outline overlap rate is greater than a certain level, it is considered that the corresponding verification area is identified, and the third target position coordinates corresponding to the target device to be transferred contained in the verification area are determined.

[0124] Step S1007, determining an offset based on the target relative positions between the target devices to be transferred and the historical relative positions between the target devices to be transferred, and after determining that the offset is within the allowable error range, determining a coordinate conversion relationship based on the first target position coordinates and the first historical position coordinates corresponding to the marking point;

[0125] Take photos of all the devices to be transferred in the verification area, compare the relative position relationship of all the devices to be transferred in the verification area with the relative position relationship of the area on the auxiliary equipment. When the average error is less than the set threshold, it is considered that the relative position change of all the devices to be transferred in the sub-area corresponding to the verification area is within the error allowable range. The coordinate transformation relationship can be determined based on the first target position coordinates and the first historical position coordinates corresponding to the marking point, and coordinate transformation is performed based on the coordinate transformation relationship to determine the second target position coordinates of each device to be transferred relative to the transfer equipment. Otherwise, it is necessary to use a camera to shoot each sub-area one by one to identify the position.

[0126] Step S1008 , based on the coordinate conversion relationship, convert the second historical position coordinates of each component to be transferred in the wafer to obtain the second target position coordinates of each component to be transferred relative to the transfer device.

[0127] Based on the coordinate transformation relationship, the coordinates of the second target position of each component to be transferred relative to the transfer device are determined, and the number of times the camera field of view moves and shoots when the mobile device identifies the component to be transferred is reduced from hundreds of times to a few times, greatly reducing the time required for the transfer device to identify the position of the component to be transferred and improving the transfer efficiency.

[0128] Based on the same inventive concept, the present application embodiment also provides a method for identifying the position of a device to be transferred 1100. Fig.11 , Fig.11 An exemplary device 1100 for identifying a position of a device to be transferred in an embodiment of the present application is provided, comprising:

[0129] The first determining unit 1101 is used to determine the first target position coordinates of the marking point corresponding to the target marking area after identifying the target marking area in the distribution area of ​​the wafer Wafer carried by the target base of the transfer device, wherein the distribution area is the occupied area of ​​the device to be transferred in the Wafer;

[0130] The second determining unit 1102 is used to determine a coordinate conversion relationship based on the first target position coordinates and the first historical position coordinates corresponding to the marking point, wherein the first historical position coordinates are determined based on at least one second historical position coordinate among the second historical position coordinates of each device to be transferred in the pre-identified wafer, and the second historical position coordinates are position coordinates relative to the auxiliary device, and the coordinate systems of the transfer device and the auxiliary device are the same;

[0131] The obtaining unit 1103 is used to convert the second historical position coordinates of each component to be transferred in the wafer based on the coordinate conversion relationship to obtain the second target position coordinates of each component to be transferred relative to the transfer device.

[0132] In a possible implementation, after the first determining unit 1101 identifies the target marked area, and before determining the coordinate conversion relationship based on the first target position coordinates and the first historical position coordinates corresponding to the marked point, it is further configured to:

[0133] Dividing the distribution area to obtain at least one sub-area;

[0134] For any sub-region, in the sub-region, the third target position coordinates corresponding to each target device to be transferred contained in the verification region are identified, and based on the identified third target position coordinates of each target device to be transferred, the target relative positions between each target device to be transferred are determined;

[0135] Determining an offset based on a target relative position between each target device to be transferred and a historical relative position between each target device to be transferred;

[0136] If it is determined that the offset is within the allowable error range, a coordinate conversion relationship is determined based on the first target position coordinates and the first historical position coordinates corresponding to the marking point.

[0137] In a possible implementation manner, the second determining unit 1102 divides the distribution area in the following manner:

[0138] Based on the first target position coordinates of the marking point corresponding to the identified target marking area, the distribution area is divided into at least one sub-area consistent with the number of marking points, wherein each sub-area contains a target marking area.

[0139] In a possible implementation manner, the first determining unit 1101 is specifically configured to:

[0140] Based on the position information of the historical marking area relative to the distribution area in the wafer, identify the devices to be transferred at the same position as the position information in the distribution area, and determine the target area composed of the identified devices to be transferred;

[0141] After determining that the target area is consistent with the outline of the historical marking area, determining that the target marking area is identified;

[0142] The historical marking area is marked in the auxiliary device after identifying and obtaining the corresponding second historical position coordinates for each device to be transferred in the wafer.

[0143] In a possible implementation, the first determining unit 1101 determines the target position coordinates of the marking point corresponding to the target marking area in the following manner:

[0144] If the marking area includes a device to be transferred, the second target position coordinates of the device to be transferred relative to the transfer device are used as the first target position coordinates of the marking point;

[0145] If the marking area includes multiple devices to be transferred, the second target position coordinates of each device to be transferred relative to the transfer device are determined, and all the second target position coordinates are averaged, and the average value is used as the first target position coordinate of the marking point.

[0146] For the convenience of description, the above parts are divided into modules (or units) according to their functions and described separately. Of course, when implementing this application, the functions of each module (or unit) can be implemented in the same or multiple software or hardware.

[0147] After introducing the method and device for identifying the position of a device to be transferred according to an exemplary embodiment of the present application, next, an apparatus for identifying the position of a device to be transferred according to another exemplary embodiment of the present application is introduced.

[0148] Those skilled in the art will appreciate that various aspects of the present application may be implemented as a system, method or program product. Therefore, various aspects of the present application may be specifically implemented in the following forms, namely: a complete hardware implementation, a complete software implementation (including firmware, microcode, etc.), or a combination of hardware and software, which may be collectively referred to as "circuit", "module" or "system" herein.

[0149] In some possible implementations, the present application also provides a device for identifying the position of a device to be transferred. The device may include at least a memory 1201 and a processor 1202. Fig.12 , Fig.12The following is a block diagram of a device for identifying the position of a device to be transferred according to an embodiment of the present application. The memory stores program code, and when the program code is executed by the processor, the processor executes the steps of the method for identifying the position of a device to be transferred according to various exemplary embodiments of the present application described in this specification. For example, the processor may execute the following steps: Figure 1 Follow the steps shown in .

[0150] In some possible embodiments, various aspects of the method for identifying the position of a device to be transferred provided in the present application may also be implemented in the form of a program product, which includes a program code. When the program product is run on a computer device, the program code is used to enable the computer device to execute the steps of the method for identifying the position of a device to be transferred according to various exemplary embodiments of the present application described above in this specification.

[0151] The program product may use any combination of each or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection with each or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0152] The program product for controlling the sending of short messages according to the embodiment of the present application may be in the form of a portable compact disk read-only memory (CD-ROM) and include program codes, and may be run on a computing device.

[0153] The readable signal medium may include a data signal propagated in baseband or as a carrier wave-submodule, wherein the readable program code is carried. The data signal of this propagation may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. The readable signal medium may also be any readable medium other than a readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with a command execution system, device, or device.

[0154] The program code embodied on the readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wired, optical cable, RF, etc., or any suitable combination of the foregoing.

[0155] The program code for performing the operations of the present application can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" language or similar programming languages.

[0156] It should be noted that although several units or subunits of the device are mentioned in the above detailed description, this division is only exemplary and not mandatory. In fact, according to the embodiments of the present application, the feature vectors and functions of two or more units described above can be embodied in each unit. Conversely, the feature vectors and functions of each unit described above can be further divided into multiple units to be embodied.

[0157] In addition, although the operations of the method of the present application are described in a specific order in the drawings, this does not require or imply that the operations must be performed in this specific order, or that all the operations shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or each step may be decomposed into multiple steps.

[0158] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A method for identifying the position of a device to be transferred, characterized in that: The method comprises: In a distribution area of ​​a wafer Wafer carried on a target base of a transfer device, after identifying a target marking area, determining a first target position coordinate of a marking point corresponding to the target marking area, wherein the distribution area is an occupied area of ​​the device to be transferred in the wafer; Divide the distribution area to obtain at least one sub-area; and, for any sub-area, identify in the sub-area the third target position coordinates corresponding to each target device to be transferred contained in the verification area, and determine the target relative positions between each target device to be transferred based on the identified third target position coordinates of each target device to be transferred; Determining an offset based on a target relative position between the target devices to be transferred and a historical relative position between the target devices to be transferred; If it is determined that the offset is within the allowable error range, a coordinate conversion relationship is determined based on the first target position coordinate and the first historical position coordinate corresponding to the marking point, wherein the first historical position coordinate is determined based on at least one second historical position coordinate among the pre-identified second historical position coordinates of each device to be transferred in the Wafer, the second historical position coordinate is a position coordinate relative to an auxiliary device, and the coordinate systems of the transfer device and the auxiliary device are the same; Based on the coordinate conversion relationship, the second historical position coordinates of each component to be transferred in the wafer are converted to obtain the second target position coordinates of each component to be transferred relative to the transfer device.

2. The method according to claim 1, characterized in that The dividing the distribution area comprises: Based on the first target position coordinates of the marking point corresponding to the identified target marking area, the distribution area is divided into at least one sub-area consistent with the number of the marking points, wherein each of the sub-areas contains one target marking area.

3. The method according to any one of claims 1 to 2, characterized in that: The target marking area is identified in the distribution area of ​​the wafer Wafer carried on the target base of the transfer device, specifically including: Based on the position information of the historical marking area relative to the distribution area in the wafer, identify the devices to be transferred at the same position as the position information in the distribution area, and determine the target area composed of the identified devices to be transferred; After determining that the target area is consistent with the outline of the historical marking area, determining that the target marking area is identified; The historical marking area is marked in the auxiliary device after identifying and obtaining the corresponding second historical position coordinates of each device to be transferred in the wafer.

4. The method according to claim 1, characterized in that The determining the target position coordinates of the marking point corresponding to the target marking area includes: If the marking area includes a device to be transferred, the second target position coordinates of the device to be transferred relative to the transfer device are used as the first target position coordinates of the marking point; If the marking area includes a plurality of devices to be transferred, the second target position coordinates of each device to be transferred relative to the transfer device are determined, and all the second target position coordinates are averaged, and the average value is used as the first target position coordinate of the marking point.

5. A device for identifying the position of a device to be transferred, characterized in that: The device comprises: A first determination unit is used to determine the first target position coordinates of the marking point corresponding to the target marking area after identifying the target marking area in the distribution area of ​​the wafer Wafer carried by the target base of the transfer device, wherein the distribution area is the occupied area of ​​the device to be transferred in the Wafer; Divide the distribution area to obtain at least one sub-area; and, for any sub-area, in the sub-area, identify the third target position coordinates corresponding to each target device to be transferred contained in the verification area, and determine the target relative position between each target device to be transferred based on the identified third target position coordinates of each target device to be transferred; determine the offset based on the target relative position between each target device to be transferred and the historical relative position between each target device to be transferred; A second determination unit is used to determine a coordinate conversion relationship based on the first target position coordinate and the first historical position coordinate corresponding to the marking point if it is determined that the offset is within an allowable error range, wherein the first historical position coordinate is determined based on at least one second historical position coordinate among the pre-identified second historical position coordinates of each device to be transferred in the wafer, the second historical position coordinate is a position coordinate relative to an auxiliary device, and the coordinate systems of the transfer device and the auxiliary device are the same; The obtaining unit is used to convert the second historical position coordinates of each component to be transferred in the wafer based on the coordinate conversion relationship to obtain the second target position coordinates of each component to be transferred relative to the transfer device.

6. The device according to claim 5, characterized in that The second determining unit divides the distribution area in the following manner: Based on the first target position coordinates of the marking point corresponding to the identified target marking area, the distribution area is divided into at least one sub-area consistent with the number of the marking points, wherein each of the sub-areas contains one target marking area.

7. The device according to any one of claims 5 to 6, characterized in that: The first determining unit is specifically configured to: Based on the position information of the historical marking area relative to the distribution area in the wafer, identify the devices to be transferred at the same position as the position information in the distribution area, and determine the target area composed of the identified devices to be transferred; After determining that the target area is consistent with the outline of the historical marking area, determining that the target marking area is identified; The historical marking area is marked in the auxiliary device after identifying and obtaining the corresponding second historical position coordinates of each device to be transferred in the wafer.

8. The device according to claim 5, characterized in that The first determining unit determines the target position coordinates of the marking point corresponding to the target marking area in the following manner: If the marking area includes a device to be transferred, the second target position coordinates of the device to be transferred relative to the transfer device are used as the first target position coordinates of the marking point; If the marking area includes a plurality of devices to be transferred, the second target position coordinates of each device to be transferred relative to the transfer device are determined, and all the second target position coordinates are averaged, and the average value is used as the first target position coordinate of the marking point.

Images