Display panel and mobile terminal

Abstract

The embodiment of the present application provides a display panel and a mobile terminal; the display panel includes a display area and a fan-out wiring area located on one side of the display area, the display panel also includes a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer, the first metal layer is located in the fan-out wiring area, and the second metal layer and the third metal layer both extend from the display area to the fan-out wiring area; wherein the second insulating layer includes a first insulating portion located in the fan-out wiring area and a second insulating portion located in the display area, and the thickness of the first insulating portion is greater than the thickness of the second insulating portion; the above-mentioned display panel can avoid the insulating layer between the second metal layer and the third metal layer located in the fan-out wiring area from being broken down due to high temperature by increasing the thickness of the insulating layer between the second metal layer and the third metal layer located in the fan-out wiring area, thereby improving the withstand voltage value of the display panel and further improving the product yield of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel and a mobile terminal. Background Art

[0002] Mini-LED (Mini Light Emitting Diode) technology is a technology that integrates an LED array with a size of 100μm on a chip. The Mini-LED display panel made using this technology has the advantages of adjustable regional brightness, high color rendering, and high contrast.

[0003] In order to achieve the narrow frame design of the Mini-LED display panel, a plurality of metal traces located in different layers are currently arranged in the fan-out trace area of ​​the Mini-LED display panel, and an insulating layer is arranged between two adjacent metal traces. Since the Mini-LED display device is current-driven, the fan-out trace area is the area where the current of the Mini-LED display device is concentrated because it is provided with a plurality of metal traces of different signal types. When the Mini-LED display device is working, the input of the working current makes the temperature of the overlapping area of ​​the plurality of metal traces located in the fan-out trace area higher, causing the insulating layer between the two adjacent metal traces to be easily broken down, thereby causing the withstand voltage value of the display panel to decrease, and then causing the display panel to be very prone to signal tolerance problems such as bright lines.

[0004] Therefore, there is an urgent need for a display panel and a mobile terminal to solve the above technical problems. Summary of the invention

[0005] The embodiments of the present application provide a display panel and a mobile terminal, which can improve the technical problem of decreased withstand voltage of display panels in the current technology.

[0006] An embodiment of the present application provides a display panel, comprising a display area and a fan-out wiring area located on one side of the display area; wherein the display panel comprises: a substrate, a first metal layer disposed on the substrate, a first insulating layer disposed on the substrate and covering the first metal layer, a second metal layer disposed on the first insulating layer, a second insulating layer disposed on the second metal layer, and a third metal layer disposed on the second insulating layer, wherein the first metal layer is located in the fan-out wiring area, the second metal layer extends from the display area to the fan-out wiring area, and the third metal layer extends from the display area to the fan-out wiring area;

[0007] The second insulating layer includes a first insulating portion located in the fan-out wiring area and a second insulating portion located in the display area, and the thickness of the first insulating portion is greater than the thickness of the second insulating portion.

[0008] Optionally, in some embodiments of the present application, the second insulating portion includes a first inorganic insulating layer, and the first insulating portion includes the first inorganic insulating layer and a second inorganic insulating layer disposed on the first inorganic insulating layer;

[0009] The material of the second inorganic insulating layer is the same as that of the first inorganic insulating layer.

[0010] Optionally, in some embodiments of the present application, the second insulating portion includes a third inorganic insulating layer, and the first insulating portion includes the third inorganic insulating layer and an organic insulating layer disposed on the third inorganic insulating layer.

[0011] Optionally, in some embodiments of the present application, the thickness of the organic insulating layer is less than the thickness of the third inorganic insulating layer.

[0012] Optionally, in some embodiments of the present application, the organic insulating layer includes a main body portion and overlapping portions disposed at two ends of the main body portion;

[0013] Wherein, the thickness of the overlapping portion is smaller than the thickness of the main body portion.

[0014] Optionally, in some embodiments of the present application, the material of the third inorganic insulating layer includes at least one of nitride silicon and nitride oxide, and the material of the organic insulating layer includes PFA plastic.

[0015] Optionally, in some embodiments of the present application, the thickness of the second insulating portion ranges from 5000 angstroms to 6000 angstroms.

[0016] Optionally, in some embodiments of the present application, the thickness of the second insulating layer is greater than the thickness of the first insulating layer.

[0017] Optionally, in some embodiments of the present application, the first metal layer includes a light shielding layer located in the display area, the second metal layer includes a gate layer located in the display area, and the third metal layer includes a source and drain layer located in the display area.

[0018] Correspondingly, an embodiment of the present application further provides a mobile terminal, comprising a terminal body and a display panel as described in any one of the above items, wherein the terminal body and the display panel are combined into one.

[0019] The embodiment of the present application provides a display panel and a mobile terminal; the display panel includes a display area and a fan-out wiring area located on one side of the display area, the display panel also includes a substrate, a first metal layer arranged on the substrate, a first insulating layer arranged on the substrate and covering the first metal layer, a second metal layer arranged on the first insulating layer, a second insulating layer arranged on the second metal layer, and a third metal layer arranged on the second insulating layer, the first metal layer is located in the fan-out wiring area, and the second metal layer and the third metal layer both extend from the display area to the fan-out wiring area; wherein the second insulating layer includes a first insulating portion located in the fan-out wiring area and a second insulating portion located in the display area, and the thickness of the first insulating portion is greater than the thickness of the second insulating portion; the above-mentioned display panel can avoid the insulating layer between the second metal layer and the third metal layer located in the fan-out wiring area from being broken down due to high temperature by increasing the thickness of the insulating layer between the second metal layer and the third metal layer located in the fan-out wiring area, thereby improving the withstand voltage value of the display panel and further improving the product yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A schematic diagram of the planar area division of a display panel provided in an embodiment of the present application;

[0022] Figure 2 A schematic diagram of a display panel provided in an embodiment of the present application, wherein the multiple metal layers are located in an overlapping area within a fan-out wiring area;

[0023] Figure 3 A schematic cross-sectional view of a first display panel provided in an embodiment of the present application;

[0024] Figure 4 A schematic cross-sectional view of a second display panel provided in an embodiment of the present application;

[0025] Figure 5 A schematic cross-sectional view of a third display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0027] The embodiments of the present application are aimed at the technical problem that the withstand voltage of the display panel of the current technology decreases, and the embodiments of the present application can improve the above technical problem.

[0028] The technical solution of the present application is now described in conjunction with specific embodiments.

[0029] See also Figures 1 to 5 The embodiment of the present application provides a display panel 100, comprising a display area 10 and a fan-out wiring area 21 located on one side of the display area 10; wherein the display panel 100 comprises: a substrate 101, a first metal layer 102 disposed on the substrate 101, a first insulating layer 103 disposed on the substrate 101 and covering the first metal layer 102, a second metal layer 104 disposed on the first insulating layer 103, a second insulating layer 105 disposed on the second metal layer 104, and a third metal layer 106 disposed on the second insulating layer 105, the first metal layer 102 is located in the fan-out wiring area 21, the second metal layer 104 extends from the display area 10 to the fan-out wiring area 21, and the third metal layer 106 extends from the display area 10 to the fan-out wiring area 21;

[0030] The second insulating layer 105 includes a first insulating portion located in the fan-out wiring area 21 and a second insulating portion located in the display area 10 , and the thickness of the first insulating portion is greater than the thickness of the second insulating portion.

[0031] The display panel 100 provided in the embodiment of the present application can prevent the insulating layer between the second metal layer 104 and the third metal layer 106 in the fan-out wiring area 21 from being broken down due to high temperature by increasing the thickness of the insulating layer between the second metal layer 104 and the third metal layer 106 in the fan-out wiring area 21, thereby improving the withstand voltage value of the display panel 100 and further improving the product yield of the display panel 100.

[0032] The technical solution of the present application is now described in conjunction with specific embodiments.

[0033] Embodiment 1

[0034] like Figure 1 As shown, it is a schematic diagram of the planar area division of the display panel 100 provided in an embodiment of the present application; wherein, the display panel 100 includes a display area 10 and a frame area 20 located around the display area 10, and the frame area 20 is provided with metal wirings of various signal types including gate drive metal signal lines; further, a plurality of metal wirings, a driving chip of the display panel 100 and a flexible printed circuit board are also provided at the lower end of the frame area 20, which are used to drive and transmit the electrical signals of the entire screen. wherein, the plurality of metal wirings correspond to the fan-out wiring area 21 (fanout area) of the display panel 100, and the driving chip and the flexible printed circuit board correspond to the driving circuit area 22 of the display panel 100.

[0035] In the embodiment of the present application, the display panel 100 is a Mini-LED display panel; in order to achieve a narrow frame design, a plurality of metal routings of different signal types are arranged in the fan-out routing area 21 .

[0036] like Figure 2 As shown, it is a schematic diagram of the overlapping area of ​​multiple metal layers in the fan-out wiring area 21 of the display panel 100 provided in an embodiment of the present application; wherein, the display panel 100 includes a first metal layer 102, a second metal layer 104 and a third metal layer 106, the first metal layer 102, the second metal layer 104 and the third metal layer 106 have an overlapping portion 211 in the fan-out wiring area 21, and the first metal layer 102, the second metal layer 104 and the third metal layer 106 are arranged non-parallel to each other in the fan-out wiring area 21.

[0037] like Figure 3 , which is a cross-sectional schematic diagram of a first display panel 100 provided in an embodiment of the present application; wherein the display panel 100 includes a display area 10, a driving circuit area 22, and a fan-out wiring area 21 located in the display area 10 and the driving circuit area 22;

[0038] Further, the display panel 100 includes: a substrate 101, a first metal layer 102 disposed on the substrate 101, a first insulating layer 103 disposed on the substrate 101 and covering the first metal layer 102, a second metal layer 104 disposed on the first insulating layer 103, a second insulating layer 105 disposed on the second metal layer 104, and a third metal layer 106 disposed on the second insulating layer 105, the first metal layer 102 is located in the fan-out wiring area 21, the second metal layer 104 extends from the display area 10 to the fan-out wiring area 21, and the third metal layer 106 extends from the display area 10 to the fan-out wiring area 21;

[0039] The second insulating layer 105 includes a first insulating portion located in the fan-out wiring area 21 and a second insulating portion located in the display area 10 , and the thickness of the first insulating portion is greater than the thickness of the second insulating portion.

[0040] In the embodiment of the present application, the second insulating portion includes a first inorganic insulating layer 1051 , and the first insulating portion includes the first inorganic insulating layer 1051 and a second inorganic insulating layer 1052 disposed on the first inorganic insulating layer 1051 ;

[0041] The material of the second inorganic insulating layer 1052 is the same as that of the first inorganic insulating layer 1051 .

[0042] In the embodiment of the present application, the substrate 101 is a glass substrate, and the substrate 101 may also be a flexible substrate. The material used for the flexible substrate is a polymer material such as polyimide plastic, polyetheretherketone or transparent conductive polyester; in this embodiment, polyimide (PI) material is used, which has the characteristics of high temperature resistance, wide operating temperature range, no obvious melting point, high insulation performance, and stable dielectric constant, and therefore, is widely used in flexible substrates.

[0043] In the embodiment of the present application, the first metal layer 102 is arranged in the same layer as the light-shielding layer in the display panel 100, and the materials of the first metal layer 102 and the light-shielding layer are formed of Al alloy, Cr, Mo, W or a stacked film of the above; wherein, the light-shielding layer is arranged in the display area 10, which can prevent the light incident from the substrate 101 side from affecting the working characteristics of the semiconductor device located in the display area 10.

[0044] In the embodiment of the present application, the first insulating layer 103 is disposed in the same layer as the buffer layer in the display area 10. The buffer layer is prepared by chemical vapor deposition, wherein the chemical vapor deposition method includes low pressure chemical vapor deposition, thermal vapor deposition, catalytic chemical vapor deposition, plasma enhanced chemical vapor deposition, etc.

[0045] Further, the material of the first insulating layer 103 is a stack of a silicon nitride (SiNx) layer and a silicon oxide (SiOx) layer. Preferably, the thickness of the silicon nitride film layer in the first insulating layer 103 is 500 angstroms, and the thickness of the silicon oxide film layer is 3500 angstroms.

[0046] In the embodiment of the present application, the second metal layer 104 is disposed in the same layer as the gate layer in the display area 10. The second metal layer 104 and the gate layer are made of Al alloy, Cr, Mo, W or a stacked film of the above.

[0047] Furthermore, the second metal layer 104 and the gate layer may be formed by coating, including but not limited to vacuum evaporation, magnetron sputtering coating, ion sputtering coating, etc.

[0048] In the embodiment of the present application, the second insulating layer 105 includes a first insulating portion located in the fan-out wiring area 21 and a second insulating portion located in the display area 10, and the thickness of the first insulating portion is greater than the thickness of the second insulating portion. The second insulating portion includes a first inorganic insulating layer 1051, and the first insulating portion includes the first inorganic insulating layer 1051 and a second inorganic insulating layer 1052 disposed on the first inorganic insulating layer 1051;

[0049] The material of the second inorganic insulating layer 1052 is the same as that of the first inorganic insulating layer 1051 .

[0050] Furthermore, the first inorganic insulating layer 1051 is disposed in the same layer as the interlayer insulating layer in the display area 10. The materials of the first inorganic insulating layer 1051 and the interlayer insulating layer are at least one of silicon oxide and silicide. The first inorganic insulating layer 1051 and the interlayer insulating layer are both prepared by chemical vapor deposition. In the process of preparing the first inorganic insulating layer 1051 and the interlayer insulating layer, silicon source gas is required, wherein SiH 4 、Si 2 H 6 、SiCl 4 、SiHCl 3 、SiH 2 Cl 2 、SiH 3 Cl3 、SiF 4 etc. as silicon source gas.

[0051] Preferably, the material of the first inorganic insulating layer 1051 is silicon oxide, and the thickness of the silicon oxide is 5000 angstroms.

[0052] In the embodiment of the present application, the material of the second inorganic insulating layer 1052 is the same as that of the first inorganic insulating layer 1051, and the preparation process of the second inorganic insulating layer 1052 is the same as that of the first inorganic insulating layer 1051. Further, the thickness of the second inorganic insulating layer 1052 is less than the thickness of the first inorganic insulating layer 1051, and the maximum thickness of the second inorganic insulating layer 1052 is 1000 angstroms. This is because when the thickness of the second insulating layer 105 between the second metal layer 104 and the third metal layer 106 is greater than 6000 angstroms, when the second metal layer 104 and the third metal layer 106 are overlapped by opening, the excessive thickness of the second insulating layer 105 will increase the difficulty of the process, thereby increasing the opening cost.

[0053] Furthermore, since the second inorganic insulating layer 1052 is only located in the fan-out wiring area 21 , an additional photomask process is required, which will increase the cost and prolong the process time.

[0054] In the embodiment of the present application, the third metal layer 106 is disposed in the same layer as the source and drain electrode layer in the display, wherein the materials of the third metal layer 106 and the source and drain electrode layer are at least one of Mo, Al, Cu and Ti, and the thickness ranges from 2000 angstroms to 8000 angstroms.

[0055] In the embodiment of the present application, since the Mini-LED display panel 100 is current driven, the fan-out wiring area 21 is provided with a plurality of metal wirings of different signal types, which is the area where the current of the Mini-LED display panel 100 is concentratedly input. When the Mini-LED display device is working, the input of the working current makes the temperature of the overlapping area of ​​the plurality of metal wirings in the fan-out wiring area 21 (the overlapping area 211 between the first metal layer 102, the second metal layer 104 and the third metal layer 106) higher, thereby causing the second insulating layer 105 portion ( Figure 3 The second metal layer 104 and the third metal layer 106 are most vulnerable to being hit in the A1 and A2 regions because the distance between the second metal layer 104 and the third metal layer 106 is the smallest in the A1 and A2 regions.

[0056] At this time, since the second inorganic insulating layer 1052 is also arranged between the second metal layer 104 and the third metal layer 106, the existence of the second inorganic insulating layer 1052 can increase the distance between the second metal layer 104 and the third metal layer 106, thereby increasing the withstand voltage of the display panel 100 and, at the same time, reducing the parasitic capacitance between the second metal layer 104 and the third metal layer 106.

[0057] In view of the technical problem that the withstand voltage of the display panel 100 of the current technology decreases, an embodiment of the present application provides a display panel 100, which includes a display area 10 and a fan-out wiring area 21 located on one side of the display area 10, and the display panel 100 also includes a substrate 101, a first metal layer 102 arranged on the substrate 101, a first insulating layer 103 arranged on the substrate 101 and covering the first metal layer 102, a second metal layer 104 arranged on the first insulating layer 103, a second insulating layer 105 arranged on the second metal layer 104, and a third metal layer 106 arranged on the second insulating layer 105, the first metal layer 102 is located in the fan-out wiring area 21, the second metal layer 104 and the third metal layer 106 both extend from the display area 10 to the fan-out wiring area 21, and the second insulating layer 105 includes a fan-out wiring area 21 located in the fan-out wiring area 2 1 and a second insulating portion located in the display area 10, the thickness of the first insulating portion is greater than the thickness of the second insulating portion, wherein the second insulating portion includes a first inorganic insulating layer 1051, and the first insulating portion includes the first inorganic insulating layer 1051 and a second inorganic insulating layer 1052 arranged on the first inorganic insulating layer 1051; the display panel 100 increases the thickness of the insulating layer between the second metal layer 104 and the third metal layer 106 in the fan-out wiring area 21 by adding a layer of the second inorganic insulating layer 1052 to the portion of the original first inorganic insulating layer 1051 corresponding to the fan-out wiring area 21, so as to avoid the insulating layer between the second metal layer 104 and the third metal layer 106 in the fan-out wiring area 21 from being broken down due to high temperature, thereby improving the withstand voltage value of the display panel 100 and further improving the product yield of the display panel 100.

[0058] Embodiment 2

[0059] like Figure 4, which is a cross-sectional schematic diagram of a second display panel 100 provided in an embodiment of the present application; wherein the structure of the display panel 100 in the second embodiment of the present application is the same as or similar to the structure of the display panel 100 in the first embodiment of the present application, and the only difference is that the second insulating portion includes a third inorganic insulating layer 1053, and the first insulating portion includes the third inorganic insulating layer 1053 and an organic insulating layer 1054 disposed on the third inorganic insulating layer 1053;

[0060] The thickness of the organic insulating layer 1054 is smaller than the thickness of the third inorganic insulating layer 1053 .

[0061] In the embodiment of the present application, the third inorganic insulating layer 1053 is disposed in the same layer as the interlayer insulating layer in the display area 10. The materials of the third inorganic insulating layer 1053 and the interlayer insulating layer are at least one of silicon oxide and nitride silicon. The third inorganic insulating layer 1053 and the interlayer insulating layer are both prepared by chemical vapor deposition. In the process of preparing the third inorganic insulating layer 1053 and the interlayer insulating layer, a silicon source gas is required, wherein SiH 4 、Si 2 H 6 、SiCl 4 、SiHCl 3 、SiH 2 Cl 2 、SiH 3 Cl 3 、SiF 4 etc. as silicon source gas.

[0062] Preferably, the material of the third inorganic insulating layer 1053 is silicon oxide, and the thickness of the silicon oxide is 5000 angstroms.

[0063] In the embodiment of the present application, the material of the organic insulating layer 1054 is PFA plastic but is not limited to organic materials of PFA plastic. Among them, PFA plastic is a copolymer of a small amount of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene. The melt adhesion is enhanced, the melt viscosity is reduced, and the performance is unchanged compared with polytetrafluoroethylene. This kind of resin can be directly processed into products using ordinary thermoplastic molding methods. However, in the embodiment of the present application, the organic insulating layer 1054 is mainly prepared by photolithography process, which is to ensure the preparation accuracy of the organic insulating layer 1054.

[0064] In the process of preparing the second insulating layer 105 in the second embodiment of the present application, an organic insulating layer 1054 is directly deposited on the original inorganic insulating layer, and then the organic insulating layer 1054 is patterned using a mask to retain a portion of the organic insulating layer 1054 corresponding to the fan-out wiring area 21, thereby ensuring that the film layer of the second insulating layer 105 corresponding to the fan-out wiring area 21 is thicker.

[0065] Furthermore, the thickness of the organic insulating layer 1054 is less than the thickness of the third inorganic insulating layer 1053; preferably, the thickness of the third inorganic insulating layer 1053 is 5000 angstroms, and the thickness of the organic insulating layer 1054 is at most 1000 angstroms. This is because when the thickness of the second insulating layer 105 between the second metal layer 104 and the third metal layer 106 is greater than 6000 angstroms, when the second metal layer 104 and the third metal layer 106 are overlapped by opening, the excessive thickness of the second insulating layer 105 will increase the difficulty of the process, thereby increasing the opening cost.

[0066] In view of the technical problem that the withstand voltage of the display panel 100 of the current technology decreases, an embodiment of the present application provides a display panel 100, which includes a display area 10 and a fan-out wiring area 21 located on one side of the display area 10, and the display panel 100 also includes a substrate 101, a first metal layer 102 arranged on the substrate 101, a first insulating layer 103 arranged on the substrate 101 and covering the first metal layer 102, a second metal layer 104 arranged on the first insulating layer 103, a second insulating layer 105 arranged on the second metal layer 104, and a third metal layer 106 arranged on the second insulating layer 105, the first metal layer 102 is located in the fan-out wiring area 21, the second metal layer 104 and the third metal layer 106 both extend from the display area 10 to the fan-out wiring area 21, and the second insulating layer 105 includes a fan-out wiring area 21 located on the fan-out wiring area 21. The first insulating portion of the wiring area 21 and the second insulating portion located in the display area 10, the thickness of the first insulating portion is greater than the thickness of the second insulating portion, wherein the second insulating portion includes a third inorganic insulating layer 1053, and the first insulating portion includes the third inorganic insulating layer 1053 and an organic insulating layer 1054 arranged on the third inorganic insulating layer 1053; the above-mentioned display panel 100 increases the thickness of the insulating layer between the second metal layer 104 and the third metal layer 106 in the fan-out wiring area 21 by adding a layer of organic insulating layer 1054 to the part of the original first inorganic insulating layer 1051 corresponding to the fan-out wiring area 21, which can avoid the insulating layer between the second metal layer 104 and the third metal layer 106 in the fan-out wiring area 21 from being broken down due to high temperature, thereby improving the withstand voltage value of the display panel 100 and further improving the product yield of the display panel 100.

[0067] Embodiment 3

[0068] like Figure 5 , which is a cross-sectional schematic diagram of a third display panel 100 provided in an embodiment of the present application; wherein the structure of the display panel 100 in the third embodiment of the present application is the same as or similar to the structure of the display panel 100 in the second embodiment of the present application, and the only difference is that the organic insulating layer 1054 includes a main body 10541 and overlapping parts 10542 arranged at both ends of the main body 10541;

[0069] Among them, the thickness of the overlapping portion 10542 is smaller than the thickness of the main body portion 10541.

[0070] In the embodiment of the present application, the overlapping portion 10542 is close to the opening area between the second metal layer 104 and the third metal layer 106; the thickness of the overlapping portion 10542 is smaller than the thickness of the main body 10541, which can help prevent the problem of the height difference of the organic insulating layer 1054 from being unable to transition smoothly from high to low, thereby reducing the problem of the metal overlap being too thick that may exist between the second metal layer 104 and the third metal layer 106.

[0071] In the embodiment of the present application, the height difference between the main body portion 10541 and the overlapping portion 10542 is prepared by a half-tone mask process (HF-tone).

[0072] In view of the technical problem that the withstand voltage of the display panel 100 of the current technology decreases, an embodiment of the present application provides a display panel 100, which includes a display area 10 and a fan-out wiring area 21 located on one side of the display area 10, and the display panel 100 also includes a substrate 101, a first metal layer 102 arranged on the substrate 101, a first insulating layer 103 arranged on the substrate 101 and covering the first metal layer 102, a second metal layer 104 arranged on the first insulating layer 103, a second insulating layer 105 arranged on the second metal layer 104, and a third metal layer 106 arranged on the second insulating layer 105, the first metal layer 102 is located in the fan-out wiring area 21, the second metal layer 104 and the third metal layer 106 are extended from the display area 10 to the fan-out wiring area 21, the second insulating layer 105 includes a first insulating portion located in the fan-out wiring area 21 and a second insulating portion located in the display area 10, and the thickness of the first insulating portion is greater than The thickness of the second insulating portion is as follows: the second insulating portion includes a third inorganic insulating layer 1053, the first insulating portion includes the third inorganic insulating layer 1053 and an organic insulating layer 1054 arranged on the third inorganic insulating layer 1053, wherein the organic insulating layer 1054 includes a main body 10541 and overlapping portions 10542 arranged at both ends of the main body 10541, and the thickness of the overlapping portions 10542 is less than the thickness of the main body 10541; the above-mentioned display panel 100 increases the thickness of the insulating layer between the second metal layer 104 and the third metal layer 106 in the fan-out wiring area 21 by adding a layer of organic insulating layer 1054 to the portion of the original first inorganic insulating layer 1051 corresponding to the fan-out wiring area 21, so as to avoid the insulating layer between the second metal layer 104 and the third metal layer 106 in the fan-out wiring area 21 from being broken down due to high temperature, thereby improving the withstand voltage value of the display panel 100 and further improving the product yield of the display panel 100. At the same time, the thickness of the overlapping portion 10542 in the organic insulating layer 1054 is less than the thickness of the main portion 10541, which can help prevent the problem of the height difference of the organic insulating layer 1054 from being unable to transition smoothly from high to low, thereby reducing the problem of the metal overlap being too thick between the second metal layer 104 and the third metal layer 106.

[0073] Accordingly, the embodiment of the present application further provides a mobile terminal, comprising a terminal body and a display panel 100 as described in any one of the above items, wherein the terminal body and the display panel 100 are integrated into one. The mobile terminal has a wide range of applications in vehicle-mounted, mobile phones, tablets, computers and television products.

[0074] The display panel 100 and the mobile terminal provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, It is characterized in that The display panel includes a display area and a fan-out wiring area located on one side of the display area; wherein the display panel includes: substrate; A first metal layer is disposed on the substrate, and the first metal layer is located in the fan-out wiring area; A first insulating layer, disposed on the substrate and covering the first metal layer; A second metal layer is disposed on the first insulating layer, and the second metal layer extends from the display area to the fan-out wiring area; A second insulating layer is disposed on the second metal layer; and A third metal layer is disposed on the second insulating layer, and the third metal layer extends from the display area to the fan-out wiring area; The second insulating layer includes a first insulating portion located in the fan-out wiring area and a second insulating portion located in the display area, and the thickness of the first insulating portion is greater than the thickness of the second insulating portion; The second insulating portion includes a third inorganic insulating layer, and the first insulating portion includes the third inorganic insulating layer and an organic insulating layer disposed on the third inorganic insulating layer; The thickness of the organic insulating layer is smaller than the thickness of the third inorganic insulating layer.

2. The display panel according to claim 1, It is characterized in that The second insulating portion includes a first inorganic insulating layer, and the first insulating portion includes the first inorganic insulating layer and a second inorganic insulating layer disposed on the first inorganic insulating layer; The material of the second inorganic insulating layer is the same as that of the first inorganic insulating layer.

3. The display panel according to claim 1, It is characterized in that The organic insulating layer comprises a main body and overlapping parts arranged at two ends of the main body; Wherein, the thickness of the overlapping portion is smaller than the thickness of the main body portion.

4. The display panel according to claim 1, It is characterized in that The material of the third inorganic insulating layer includes at least one of nitride silicon and nitride oxide, and the material of the organic insulating layer includes PFA plastic.

5. The display panel according to claim 1, It is characterized in that The thickness of the second insulating portion is in a range of 5000 angstroms to 6000 angstroms.

6. The display panel according to claim 1, It is characterized in that The thickness of the second insulating layer is greater than that of the first insulating layer.

7. The display panel according to claim 1, It is characterized in that The first metal layer includes a light shielding layer located in the display area, the second metal layer includes a gate layer located in the display area, and the third metal layer includes a source and drain layer located in the display area.

8. A mobile terminal, It is characterized in that The invention comprises a terminal body and a display panel as claimed in any one of claims 1 to 7, wherein the terminal body and the display panel are integrated into one body.

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