A quick method for checking the deviation of mechanical drilling

Abstract

The present invention discloses a method for rapid deviation inspection of mechanical drilling, which adopts conductive hole disk and wire to design deviation module graphics, and the deviation module graphics adopts film pasting, exposure, development and etching to form the required conductive graphics on each layer that needs to be monitored; non-conductive mechanical holes are designed at the relative position of the wire according to the deviation requirements of the monitoring, and penetrate the monitoring layer, and form a loop required for power-on testing and a visually detectable form with the above-mentioned graphic design; conductive mechanical holes or conductive laser holes are designed at both ends of the circuit; a multimeter or a simple short-circuit fixture or electrical measurement is used to judge in the circuit, and the access, open circuit and circuit resistance are analyzed to confirm the deviation performance of the mechanical hole. By adopting methods such as graphic production and mechanical drilling, the deviation of the mechanical hole to each layer and the deviation method can be more effectively detected, and the different degrees and directions of the deviation of a single layer can be confirmed at the same time.

Description

Technical Field

[0001] The invention relates to the field of circuit boards, and in particular to a method for quickly checking the deviation of mechanical drilling. Background Art

[0002] At present, the production of circuit boards is developing towards high, precise and dense. Affected by the circuit design, the spacing between the mechanical hole and the conductor and the spacing between the mechanical hole pad are getting smaller and smaller. At present, the detection of mechanical drilling deviation is mainly through X-ray machine to check the deviation of the machine to the hole pad or visual inspection to see if there is exposed copper on the hole wall. However, as the number of layers increases, the deviation situation and direction cannot be accurately determined after the layers are stacked; in addition, the inspection of whether the copper is exposed on the hole wall of the non-electroplated mechanical hole also increases with the increase in the number of layers, and there is a risk of missed detection.

[0003] However, the existing offset detection has the following defects:

[0004] In actual operation, the mechanical holes are already offset, but it is difficult to identify them after the pad overlaps during testing, and the offset of the mechanical holes cannot be detected through electrical testing. The industry routinely inspects non-electroplated vias by visually inspecting whether there is any exposed metal conductor on the inside of the hole wall. However, as the number of layers increases, there is a risk of missed inspections due to visual limitations, resulting in low detection efficiency and low recognition. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art, one of the objectives of the present invention is to provide a method for rapid deviation inspection of mechanical drilling, which can solve the problems of low detection efficiency and low recognition.

[0006] One of the purposes of the present invention is achieved by the following technical solution:

[0007] A method for quickly checking the deviation of a mechanical drilling hole comprises the following steps:

[0008] Graphic design steps: Use conductive hole plates and wires to design offset module graphics. The offset module graphics are designed by film pasting, exposure, development, and etching to form the required conductive graphics at each level that needs to be monitored;

[0009] Loop formation step: non-conductive mechanical holes are designed at the relative position of the wires according to the offset requirements of the monitoring, running through the monitoring level, and forming a loop required for power-on testing and a visually detectable shape with the above-mentioned graphic design;

[0010] Hole design steps: Design the conductive mechanical holes or conductive laser holes at both ends of the circuit;

[0011] Detection steps: Use a multimeter or a simple short-circuit fixture or electrical measurement to make judgments in the circuit, analyze the open circuit, open circuit, and line resistance to confirm the deviation of the mechanical hole.

[0012] Furthermore, in the graphic design step, the width of the conductive line is defined according to design requirements.

[0013] Furthermore, in the graphic design step, the wires and the holes are designed to be in different relative directions according to the requirements of monitoring the relative directions of the holes and the graphics.

[0014] Furthermore, in the graphic design step, it is checked whether the conductive graphic meets the requirements, if so, the next step is executed, if not, rework is performed.

[0015] Furthermore, in the loop formation step, when the total number of layers is set to 2n and the layers where the mechanical holes are located are L1 to L2n, it is necessary to monitor the deviation of the L2 to L2n-1 layers. The non-conductive mechanical holes are designed to be drilled in the L1-2n layers, and the conductor patterns of each layer are distributed at the relative positions of the non-conductive mechanical holes.

[0016] Furthermore, in the loop forming step, it is checked whether the relative position design of the non-conductive mechanical hole meets the requirements. If so, the next step is executed; if not, rework is performed.

[0017] Furthermore, in the detection step, if the relative distance between the mechanical hole and the conductor is Amil and the line width is Bmil, A>B, when the mechanical drilling deviation is greater than or equal to A, the conductor is disconnected, forming an open circuit, and it is measured whether it is in an open circuit state. If so, X-ray or CT is used to observe whether the line width is broken at the intersection of the mechanical hole and the conductor.

[0018] Furthermore, in the detection step, the change in the position or distance of the mechanical hole relative to the wire is analyzed to confirm that the detection module monitors the deviation of the mechanical hole and the pattern.

[0019] Furthermore, in the detection step, the width of the wire is increased or narrowed, and the deviation of the mechanical hole and the pattern is analyzed through the change of the resistance value or the size of the wire gap.

[0020] Furthermore, in the detection step, the data of the connection, disconnection and line resistance are summarized and analyzed and formed into a record table.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. By adopting methods such as graphic production and mechanical drilling, it is more effective to detect the deviation and displacement of mechanical holes on each layer, and at the same time, the degree and direction of the deviation of a single layer can be confirmed.

[0023] 2. The mechanical drilling module can be tested in a variety of ways, solving the problems of process monitoring and finished product monitoring at the same time. At the same time, its design is more flexible, and it can monitor different deviation sizes and directions according to the needs; it can be designed with the PCB finished board, with better traceability and detection capabilities, reducing leakage caused by manual inspection; in addition, it can provide 100% full inspection conditions to reduce the occurrence of product quality abnormalities and leakage.

[0024] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a flow chart of a preferred embodiment of the method for rapid deviation inspection of mechanical drilling of the present invention;

[0026] Figure 2 This is a cross-sectional view of the offset detection;

[0027] Figure 3 It is a front view without deviation;

[0028] Figure 4 It is a front view of the offset situation without showing the contour line;

[0029] Figure 5 This is a front view showing the deviation of the contour line;

[0030] Figure 6 It is a front view of the offset situation;

[0031] Figure 7 A schematic diagram for monitoring 360° directional deviation;

[0032] Figure 8 Schematic diagram for monitoring the deviation in the X and Y directions. DETAILED DESCRIPTION

[0033] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0034] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0036] See also Figure 1-8 , a method for quickly checking the deviation of mechanical drilling, comprising the following steps:

[0037] Graphic design steps: Use conductive hole plates and wires to design offset module graphics. The offset module graphics are designed by film pasting, exposure, development, and etching to form the required conductive graphics at each level that needs to be monitored;

[0038] Preferably, in the graphic design step, the width of the wire is defined according to the design requirements. According to the requirements of the relative direction of the monitoring hole and the graphic, the wire and the hole are designed to be in different relative directions. Check whether the conductive graphic meets the requirements, if so, execute the next step, if not, rework.

[0039] If mechanical drilling is required in the L1-2n layer, the monitoring offset level is L2 to L2n-1 layer, and the offset module graphics are designed in L2, L3, Ln+2...L2n-2, L2n-1, and the conductive hole pad graphics are designed in L1 and L2n. The graphics are designed to form a loop required for power-on testing and a visually detectable form with the hole. Specifically, the offset module graphics are formed through processes such as film pasting, exposure, development, and etching to form the required conductive graphics on each layer that needs to be monitored. The width of the wire can be defined according to the design requirements.

[0040] Specifically, different relative directions of the wire and the hole can be designed according to the relative direction requirements of the monitoring hole and the pattern: the wire of the detection module is designed to be at different angles or arc lengths; please refer to Figure 7 , such as the guide design is two 180° arcs, forming a 360° hole-to-hole pattern, so as to monitor the deviation of the hole-to-hole pattern in the 360° direction; please refer to Figure 8, such as designing the conductor in vertical and horizontal directions, monitoring four directions, etc., but not limited to this. If the monitoring direction changes, the arc length can be designed from 0° to 360° according to requirements; if the monitoring direction changes, straight lines of different angles can be designed according to requirements, 0° to 360°; if the monitoring direction changes, straight lines of different directions can be designed according to requirements, arcs, single groups, and multiple groups. If confirmation is required for each layer, the layers are staggered; if the layers are combined for monitoring, the layers are combined for design; the degree of test deviation can be one or more according to requirements, and the design can be combined as needed.

[0041] Loop formation step: non-conductive mechanical holes are designed at the relative position of the wires according to the offset requirements of the monitoring, running through the monitoring level, and forming a loop required for power-on testing and a visually detectable shape with the above-mentioned graphic design;

[0042] Preferably, in the loop forming step, when the total number of layers is set to 2n and the layers where the mechanical holes are located are L1 to L2n, it is necessary to monitor the deviation of the L2 to L2n-1 layers, and the non-conductive mechanical holes are designed to be drilled in the L1-2n layers, and the conductor patterns of each layer are distributed in the relative positions of the non-conductive mechanical holes. In the loop forming step, it is checked whether the relative position design of the non-conductive mechanical holes meets the requirements, if so, the next step is executed, if not, rework is performed.

[0043] For details, please refer to Figure 7-8 When the mechanical hole is offset, the relative position of the L1-2n non-conducting mechanical hole and the wire changes. When the position offset becomes relatively larger, the conductive wire will be cut smaller and cut off by the non-conducting hole. During the monitoring test, the degree of deviation can be confirmed by the change in resistance value.

[0044] Hole design steps: Design the conductive mechanical holes or conductive laser holes at both ends of the circuit;

[0045] Testing steps: Use a multimeter or a simple short-circuit fixture or electrical measurement to make judgments in the circuit, analyze the resistance of the circuit, the circuit break, and the line to confirm the deviation of the mechanical hole. Summarize and analyze the data of the circuit, the circuit break, and the line resistance and form a record table.

[0046] Preferably, in the detection step, if the relative distance between the mechanical hole and the wire is Amil and the line width is Bmil, A>B, when the mechanical drilling deviation is greater than or equal to A, the wire is disconnected to form an open circuit, and it is measured whether it is in an open circuit state. If so, X-ray or CT is used to observe whether there is a line width break at the intersection of the mechanical hole and the wire.

[0047] Preferably, in the detection step, the change in the position or distance of the mechanical hole relative to the wire is analyzed to confirm that the detection module monitors the deviation of the mechanical hole and the pattern.

[0048] Preferably, in the detection step, the width of the wire is increased or narrowed, and the deviation of the mechanical hole and the pattern is analyzed by the change of the resistance value or the size of the wire gap.

[0049] Specifically, the following are some examples:

[0050] For example, if the relative distance between the mechanical hole and the wire is 8 mils and the line width is 3 mils, when the mechanical drilling deviation is greater than or equal to 8 mils, the wire is disconnected and an open circuit is formed. When measured by a multimeter / simple short-circuit fixture / electrical measurement, the measurement result is an open circuit. When observed by X-ray / CT and other equipment, it can be seen that the line width is broken at the intersection of the mechanical hole and the wire.

[0051] For example, if the relative distance between the mechanical hole and the conductor is 8 mils and the line width is 3 mils, when the mechanical drilling hole deviates by 5 mil to 8 mils, there will be a gap in the conductor. When measured by a multimeter / simple short-circuit fixture / electrical measurement, the resistance value is too large. The resistance value can be confirmed by standard coupon measurement or batch data statistics, and the degree of deviation can be determined by the change in resistance value. When observed by X-ray / CT and other equipment, it can be seen that there is a gap in the line width at the intersection of the mechanical hole and the conductor.

[0052] For example, if the relative distance between the mechanical hole and the conductor is 8mil and the line width is 3mil, when the mechanical drilling deviation is <5mil, the conductor is intact. When measured by a multimeter / simple short-circuit fixture / electrical measurement, the circuit is normal and meets the resistance requirements. The resistance can be confirmed by standard coupon measurement or batch data statistics. When observed by X-ray / CT and other equipment, it can be seen that the conductor is intact and there is a distance between the mechanical hole and the conductor position.

[0053] The mechanical drilling module can be tested in a variety of ways, solving the problems of process monitoring and finished product monitoring at the same time. At the same time, its design is more flexible, and it can monitor different deviation sizes and directions according to the needs; it can be designed with the PCB finished board, with better traceability and detection capabilities, reducing leakage caused by manual inspection; in addition, it can provide 100% full inspection conditions to reduce the leakage of product quality abnormalities.

[0054] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A method for quickly checking the deviation of mechanical drilling, characterized in that: The following steps are involved: Graphic design steps: Use conductive hole plates and wires to design offset module graphics. The offset module graphics are designed by film pasting, exposure, development, and etching to form the required conductive graphics at each level that needs to be monitored; In the graphic design step, according to the requirement of monitoring the relative direction of the hole and the graphic, the wire and the hole are designed to be in different relative directions; Loop formation step: non-conductive mechanical holes are designed at the relative position of the wires according to the offset requirements of the monitoring, running through the monitoring level, and forming a loop required for power-on testing and a visually detectable shape with the above-mentioned graphic design; Hole design steps: Design the conductive mechanical holes or conductive laser holes at both ends of the circuit; Testing steps: Use a multimeter or a simple short-circuit fixture or electrical measurement to make judgments in the circuit, analyze the open circuit, open circuit, and line resistance to confirm the deviation of the mechanical hole; In the detection step, the width of the wire is increased or narrowed, and the deviation between the mechanical hole and the pattern is analyzed by the change of the resistance value or the size of the wire gap; In the detection step, the data of the connection, disconnection and line resistance are summarized and analyzed and formed into a record table.

2. The rapid deviation inspection method of mechanical drilling according to claim 1, characterized in that: In the graphic design step, the width of the conductive line is defined according to design requirements.

3. The rapid deviation inspection method of mechanical drilling according to claim 1, characterized in that: In the graphic design step, it is checked whether the conductive graphic meets the requirements. If so, the next step is executed; if not, rework is performed.

4. The rapid deviation inspection method of mechanical drilling according to claim 1, characterized in that: In the loop formation step, when the total number of layers is set to 2n and the layers where the mechanical holes are located are L1 to L2n, it is necessary to monitor the deviation of the L2 to L2n-1 layers. The non-conductive mechanical holes are designed to be drilled in the L1-2n layers, and the conductor patterns of each layer are distributed at the relative positions of the non-conductive mechanical holes.

5. The method for rapid deviation inspection of mechanical drilling according to claim 1, characterized in that: In the loop forming step, it is checked whether the relative position design of the non-conductive mechanical hole meets the requirements. If so, the next step is executed; if not, rework is performed.

6. The rapid deviation inspection method of mechanical drilling according to claim 1, characterized in that: In the detection step, if the relative distance between the mechanical hole and the wire is Amil and the line width is Bmil, A>B. When the mechanical drilling deviation is greater than or equal to A, the wire is disconnected to form an open circuit. It is measured whether it is in an open circuit state. If so, X-ray or CT is used to observe whether the line width is broken at the intersection of the mechanical hole and the wire.

7. The rapid deviation inspection method of mechanical drilling according to claim 1, characterized in that: In the detection step, the change in the position or distance of the mechanical hole relative to the wire is analyzed to confirm that the detection module monitors the deviation of the mechanical hole and the pattern.

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