Heat dissipation surface expansion device based on high-thermal-conductivity graphene film

Abstract

The invention relates to a heat dissipation surface expansion device based on a high-thermal-conductivity graphene film. The heat dissipation surface expansion device comprises a satellite body, single-machine equipment, a graphene film, a heat pipe and a bracket, the stand-alone device is installed inside the satellite body, and the graphene film and the support are installed outside the satellite body; the graphene film is connected with the satellite body and the support, and at least one heat pipe is connected to the graphene film. The device has the advantages that heat on a single machine is firstly transmitted to the satellite mounting plate and the graphite film, the heat dissipation surface is expanded through the graphene film, the heat conduction effect is enhanced through the heat pipe, and finally the heat is radiated to a cold space through the graphene film, so that the problem of insufficient heat dissipation capability of a satellite is solved; the whole set of device is high in structural reliability, the whole set of device product is not provided with movable parts, passive thermal control measures are adopted, and the problems of starting, stopping and failure of a system do not exist; the problem of heat dissipation of high-heat-consumption single-machine equipment under the conditions of satellite envelope and insufficient weight is solved.

Description

Technical Field

[0001] The present invention relates to the field of spacecraft thermal control technology, and in particular to a heat dissipation surface expansion device based on a high thermal conductivity graphene film. Background Art

[0002] With the development of satellite communication technology, related satellites are moving towards higher power consumption, and high power consumption means greater heat consumption. The main means of communication technology are active phased array and laser, both of which are characterized by concentrated power consumption. Communication satellites often adopt a multi-satellite launch method. Their weight and envelope resources are limited, but the heat generated during operation is large, and their thermal control is often a key issue in the thermal design of related spacecraft. If appropriate methods are not taken, since the equipment is concentrated in a small area, if no effective thermal control measures are taken, the sharp increase in temperature during operation will cause the equipment to fail directly.

[0003] To ensure heat dissipation, heat is often transferred to the heat dissipation surface through heat pipes, graphene films, etc., and a low-absorption and high-emissivity coating is sprayed on the heat dissipation surface, and finally dissipated into outer space. However, due to weight and resource constraints, the size of the heat dissipation surface limits the maximum amount of heat that a spacecraft can dissipate.

[0004] In order to improve the heat dissipation capacity of spacecraft, loop heat pipes, fluid loops and other technologies combined with deployable radiators can increase the heat dissipation surface of the star and achieve the purpose of reducing the temperature of the equipment, but they require more weight resources and are not as reliable as traditional heat pipes, graphene membranes and other products. In the case of limited resources, appropriate methods need to be adopted to ensure the temperature.

[0005] Chinese patent document: CN117080709A, publication date: 2023.11.17, discloses a heat dissipation device for a single unit outside a microwave radar antenna cabin, including a heat sink arranged between the antennas of the single unit, a heat pipe arranged inside the heat sink, an effective heat dissipation surface of the heat sink is provided with a graphene film, and the outer surface of the graphene film is sprayed with a thermal control coating. The heat on the single unit is first transferred to the heat sink, and then transferred to the effective heat dissipation surface of the heat sink through the heat pipe, and then radiated to the cold space through the graphene film. However, the essence of this technical solution is still the traditional heat dissipation method in which heat pipes and graphite films cooperate with each other. The heat dissipation capacity depends on the size of the heat sink, and the heat dissipation surface cannot be effectively expanded to meet the heat dissipation requirements of high-power equipment.

[0006] Chinese patent document: CN116946395A, publication date: 2023.10.27, discloses a temperature control device for expanding the heat dissipation surface of a magnetic levitation platform satellite payload. The heat dissipation surface expansion method of this technical solution is similar to that of patent CN117080709A. Both are based on the existing structure of the satellite and cannot create a heat dissipation surface for the satellite.

[0007] Chinese patent document: CN115649482A, publication date: 2023.01.31, discloses a high-stability thermal control device and method for star sensors. The device and method achieve smaller temperature fluctuations of the star sensor box and the star sensor bracket on orbit through an integrated design of a star sensor bracket, KS-1 thermal control white paint, F46 film, multi-layer thermal insulation material, heating plate, high thermal conductivity flexible extended heat dissipation surface and titanium alloy thermal insulation pad. The heat consumption level of the star sensor in this technical solution is generally smaller, and the purpose is different from that of the present invention.

[0008] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Summary of the invention

[0009] The purpose of the present invention is to provide a heat dissipation surface expansion device based on a high thermal conductivity graphene film, which solves the technical problem of insufficient satellite heat dissipation capacity.

[0010] The present invention provides a heat dissipation surface expansion device based on a high thermal conductivity graphene film, comprising a satellite body, a stand-alone device, a graphene film, a heat pipe and a bracket; the stand-alone device is installed inside the satellite body, and the graphene film and the bracket are installed outside the satellite body; the graphene film is connected to the satellite body and the bracket, and at least one heat pipe is connected on the graphene film.

[0011] Furthermore, thermally conductive silicone grease is provided between the stand-alone device and the cabin plate of the satellite body.

[0012] Furthermore, one side of the graphene film is connected to the deck of the satellite body, and the other side of the graphene film is connected to the bracket.

[0013] Furthermore, the transverse thermal conductivity of the graphene film is ≥800 W / m·K.

[0014] Furthermore, a layer of first heat dissipation film is sprayed on the upper surface of the graphene film and the lower surface of the connection portion between the graphene film and the bracket.

[0015] Furthermore, a layer of aluminum foil is adhered to the upper surface of the graphene film and the lower surface of the connection portion of the graphene film and the bracket, and a layer of a second heat dissipation film is sprayed on the aluminum foil.

[0016] Furthermore, thermal conductive silicone grease is provided between the heat pipe and the graphene film.

[0017] Furthermore, the bracket and the satellite body are arranged in the same plane.

[0018] Furthermore, the support is a hollow structure.

[0019] Furthermore, holes are provided at positions corresponding to the graphene film and the bracket.

[0020] The heat dissipation surface expansion device based on high thermal conductivity graphene film provided by the present invention first transfers the heat on the single machine to the satellite mounting plate and the graphene film, expands the heat dissipation surface through the graphene film, strengthens the thermal conductivity effect with heat pipes, and finally radiates to the cold space through the graphene film, thereby solving the problem of insufficient satellite heat dissipation capacity; the whole set of device of the present invention has high structural reliability, the whole set of device products has no moving parts, and all are passive thermal control measures, and there are no problems of system startup, termination and failure; it solves the heat dissipation problem of single-machine equipment with high heat consumption when the satellite envelope and weight are insufficient, and at the same time adapts to the temperature requirements under different external heat flow conditions, has the characteristics of high adaptability, good reliability, flexible design, and low cost; the device has no moving parts, and has the characteristics of light weight, high adaptability, good reliability, flexible design, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A front view schematic diagram of a heat dissipation surface expansion device based on a high thermal conductivity graphene film provided in an embodiment of the present invention.

[0022] Figure 2 for Figure 1 Schematic diagram of a top view of a heat dissipation surface expansion device based on a high thermal conductivity graphene film.

[0023] Figure 3 It is a schematic diagram of the temperature curve of a high-power device that does not adopt the device of the present invention.

[0024] Figure 4 This is a schematic diagram of the temperature curve of a high-power device after the device of the present invention is adopted.

[0025] Figure 5 This is a schematic diagram of the temperature curve of a high-power device after using two sets of the device of the present invention.

[0026] The reference numerals and components involved in the drawings are as follows:

[0027] 1. Satellite body

[0028] 2. Single machine equipment

[0029] 3. Graphene membrane

[0030] 4. Heat pipe

[0031] 5. Bracket DETAILED DESCRIPTION

[0032] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0033] The terms "first", "second", "third", "fourth" and the like in the description and claims of the present invention are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence.

[0034] Example 1

[0035] Figure 1 A front view schematic diagram of a heat dissipation surface expansion device based on a high thermal conductivity graphene film provided in an embodiment of the present invention, Figure 2 for Figure 1 A top view of a heat dissipation surface expansion device based on a high thermal conductivity graphene film. Figure 1 , Figure 2 The heat dissipation surface expansion device based on the high thermal conductivity graphene film provided in an embodiment of the present invention includes a satellite body 1, a stand-alone device 2, a graphene film 3, a heat pipe 4 and a bracket 5; the stand-alone device 2 is installed inside the satellite body 1, and the graphene film 3 and the bracket 5 are installed outside the satellite body 1; the graphene film 3 is connected to the satellite body 1 and the bracket 5, and at least one heat pipe 4 is connected on the graphene film 3.

[0036] The heat dissipation surface expansion device based on high thermal conductivity graphene film provided by the present invention is based on the satellite envelope and limited weight resources, with high thermal conductivity graphene film 3 as the main body, and cooperates with products such as bracket 5, thermal control white paint, aluminum foil and heat pipe 4 to achieve the purpose of expanding the heat dissipation surface, thereby realizing the heat dissipation of high-power stand-alone equipment; specifically, the present invention transfers the heat on the stand-alone to the satellite mounting plate and the graphite film first, expands the heat dissipation surface through the graphene film 3, strengthens the heat conduction effect with the heat pipe 4, and finally radiates to the cold space through the graphene film 3, thereby solving the problem of insufficient satellite heat dissipation capacity; the whole set of device structure reliability of the present invention is high, the whole set of device products has no moving parts, and all are passive thermal control measures, and there is no system startup, termination and failure problems; it solves the heat dissipation problem of high heat consumption stand-alone equipment under the conditions of insufficient satellite envelope and weight, and adapts to the temperature requirements under different external heat flow conditions, has the characteristics of high adaptability, good reliability, flexible design, and low cost; the device has no moving parts, and has the characteristics of light weight, high adaptability, good reliability, flexible design, etc.

[0037] Furthermore, thermal conductive silicone grease is provided between the stand-alone device 2 and the deck of the satellite body 1, so that the heat of the stand-alone device 2 can be transferred to the deck of the satellite body 1 in a timely manner.

[0038] Furthermore, one side of the graphene film 3 of the present invention is connected to the deck of the satellite body 1 , and the other side of the graphene film 3 is connected to the bracket 5 .

[0039] It should be noted that the connection between the graphene film 3 and the cabin board of the satellite body 1 and the bracket 5 can be bonded by gluing GD414 silicone rubber. In order to strengthen the connection, the bracket 5 can be screwed to the satellite body 1, and the bracket 5, the graphene film 3 and the heat pipe 4 can be screwed. The heat is transferred from the stand-alone device 2 to the cabin board of the satellite body 1 and then to the graphene film 3, and its heat transfer resistance is very small.

[0040] Furthermore, the transverse thermal conductivity of the graphene film 3 of the present invention is ≥800 W / m·K.

[0041] It should be noted that the graphene film 3 with a lateral thermal conductivity of ≥800W / m·K can transfer the heat generated by the single-machine equipment 2 to the heat dissipation surface outside the satellite body 1 in time, thereby improving the heat dissipation efficiency; and make up for the problem of insufficient heat dissipation surface when the envelope of the satellite body 1 is limited; the satellite body 1 generally has a hexahedral structure, and each surface is a certain distance away from the fairing. The space can be fully utilized, and the graphene film 3 can be used to extend the heat dissipation surface of the satellite body.

[0042] Furthermore, a layer of first heat dissipation film is sprayed on the upper surface of the graphene film 3 and the lower surface of the connection portion between the graphene film 3 and the bracket 5 .

[0043] It should be noted that the first heat dissipation film can be S781 white paint, and its solar absorption rate α s =0.21±0.02, infrared emissivity ε h =0.87±0.02; thus, the heat can be radiated to the space to the maximum extent and the temperature can be prevented from being too high when exposed to sunlight.

[0044] Furthermore, a layer of aluminum foil is pasted on the upper surface of the graphene film 3 and the lower surface of the connection portion of the graphene film 3 and the bracket 5, and a layer of a second heat dissipation film is sprayed on the aluminum foil.

[0045] It should be noted that the second heat dissipation film can be KS-ZA white paint, and its solar absorption rate α s =0.15±0.02, infrared emissivity ε h =0.9±0.02, the aluminum foil and the second heat dissipation film can further improve the heat dissipation capacity of the graphene film 3, and the on-track degradation is small.

[0046] Furthermore, thermal conductive silicone grease is provided between the heat pipe 4 and the graphene film 3 .

[0047] It should be noted that the heat pipe 4 can fully utilize the expanded heat dissipation surface of the graphene film 3 .

[0048] Furthermore, the bracket 5 and the satellite body 1 are arranged in the same plane.

[0049] It should be noted that the purpose of the design located in the same plane is to avoid multiple bending of the heat pipe, thereby improving the heat transfer efficiency. This requirement can also be relaxed when the envelope is limited.

[0050] Furthermore, the bracket 5 is a hollow structure.

[0051] It should be noted that the hollow structure design of the bracket 5 greatly reduces the weight of the device; the graphene membrane 3 is generally flexible and has no load-bearing function, and needs to be supported by the bracket 5. Compared with the traditional honeycomb panel structure, the bracket 5 has a more obvious weight advantage after being hollowed out.

[0052] Furthermore, holes are provided at positions corresponding to the graphene film 3 and the bracket 5 .

[0053] It should be noted that the hole design can avoid the antenna installed on the satellite body 1 or its field of view; according to the requirements of the extra-satellite antenna and its field of view, the graphene film 3 and the bracket 5 can also be made into special shapes.

[0054] In summary, the present invention can effectively solve the antenna temperature control problem under the conditions of satellite envelope and weight resource limitations; it solves the heat dissipation problem of high-power stand-alone equipment, and at the same time adapts to the temperature requirements under different external heat flow conditions, and has the characteristics of high adaptability, good reliability and flexible design.

[0055] Figure 3 This is a schematic diagram of the temperature curve of a high-power device that does not use the device of the present invention. Figure 4 This is a schematic diagram of the temperature curve of a high-power device after using the device of the present invention. Figure 5 This is a schematic diagram of the temperature curve of a high-power device after using two sets of the device of the present invention. Please refer to Figure 3 , Figure 4 , Figure 5 The present invention compares the temperature of a certain satellite high-power equipment when the device is used and when the device is not used.

[0056] For example, the power consumption of the device is 200W after it is turned on. If the heat dissipation surface is not expanded and only traditional heat pipes and graphene film solutions are used, the temperature will be too high, which will lead to a decrease in the reliability of electronic components. Figure 3 The temperature range of the medium equipment is 37.6-50.3℃; Figure 4 The temperature range of medium-power equipment is 17.8-41.5℃. It can be seen that only one set of this device can achieve a cooling effect of 8.8℃ on high-power equipment.

[0057] Furthermore, using multiple sets of the device can continuously reduce the temperature of the equipment. If another set of the device is installed at a suitable location nearby and a network of heat pipes is formed, the temperature can be reduced to 7.4-33.5℃. Figure 5 This is the temperature curve of the high-power equipment after taking 2 sets of this device.

[0058] In summary, it is proved that the device provided according to the present invention can be used in a stacked manner, has no moving parts, and has the characteristics of light weight, high adaptability, good reliability, flexible design, etc.

[0059] Based on the above description, it can be seen that the advantages of the present invention are:

[0060] The heat dissipation surface expansion device based on high thermal conductivity graphene film provided by the present invention is based on the satellite envelope and limited weight resources, with high thermal conductivity graphene film 3 as the main body, and cooperates with products such as bracket 5, thermal control white paint, aluminum foil and heat pipe 4 to achieve the purpose of expanding the heat dissipation surface, thereby realizing the heat dissipation of high-power stand-alone equipment; specifically, the present invention transfers the heat on the stand-alone to the satellite mounting plate and the graphite film first, expands the heat dissipation surface through the graphene film 3, strengthens the heat conduction effect with the heat pipe 4, and finally radiates to the cold space through the graphene film 3, thereby solving the problem of insufficient satellite heat dissipation capacity; the whole set of device structure reliability of the present invention is high, the whole set of device products has no moving parts, and all are passive thermal control measures, and there is no system startup, termination and failure problems; it solves the heat dissipation problem of high heat consumption stand-alone equipment under the conditions of insufficient satellite envelope and weight, and adapts to the temperature requirements under different external heat flow conditions, has the characteristics of high adaptability, good reliability, flexible design, and low cost; the device has no moving parts, and has the characteristics of light weight, high adaptability, good reliability, flexible design, etc.

[0061] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A heat dissipation surface expansion device based on a high thermal conductivity graphene film, characterized in that: It comprises a satellite body (1), a single device (2), a graphene film (3), a heat pipe (4) and a bracket (5); The stand-alone device (2) is installed inside the satellite body (1), and the graphene film (3) and the bracket (5) are installed outside the satellite body (1); the graphene film (3) is connected to the satellite body (1) and the bracket (5), and at least one heat pipe (4) is connected to the top of the graphene film (3).

2. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 1, characterized in that: Thermally conductive silicone grease is provided between the stand-alone device (2) and the cabin plate of the satellite body (1).

3. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 1, characterized in that: One side of the graphene film (3) is connected to the deck of the satellite body (1), and the other side of the graphene film (3) is connected to the bracket (5).

4. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 1, characterized in that: The transverse thermal conductivity of the graphene film (3) is ≥800 W / m·K.

5. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 1, characterized in that: A layer of first heat dissipation film is sprayed on the upper surface of the graphene film (3) and the lower surface of the connection portion between the graphene film (3) and the bracket (5).

6. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 1, characterized in that: A layer of aluminum foil is adhered to the upper surface of the graphene film (3) and the lower surface of the connection portion between the graphene film (3) and the bracket (5), and a layer of a second heat dissipation film is sprayed on the aluminum foil.

7. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 1, characterized in that: Thermally conductive silicone grease is provided between the heat pipe (4) and the graphene film (3).

8. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 1, characterized in that: The bracket (5) and the satellite body (1) are arranged on the same plane.

9. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 8, characterized in that: The support (5) is a hollow structure.

10. The heat dissipation surface expansion device based on high thermal conductivity graphene film according to claim 1, characterized in that: Holes are provided at positions corresponding to the graphene film (3) and the support (5).

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