A carrier tape for carrying electronic components, a packaging system device and a packaging method

Abstract

The present invention provides a carrier tape for carrying electronic components, a packaging system device and a packaging method, wherein the carrier tape for carrying electronic components comprises a carrier tape body, at least one packaging pocket is arranged on the surface of the carrier tape body, the packaging pocket protrudes from the surface of the carrier tape body, the packaging pocket comprises a bottom and a side portion, the side portion and the bottom are arranged to form an open cavity for accommodating electronic components, a connecting slope is arranged between the side portion and the bottom for connection, the connecting slope gradually shrinks along the side portion toward the bottom surface, and a central groove penetrating the bottom is provided on the surface of the bottom. The present invention can avoid scratches on electronic components and has high safety, stability and reliability.

Description

Technical Field

[0001] The invention belongs to the technical field of packaging, and relates to a carrier tape for carrying electronic components, a packaging system device and a packaging method. Background Art

[0002] Carrier Tape refers to a strip product used in the packaging field. It has a specific thickness and has holes (also called pockets) for holding products distributed evenly along its length. Carrier tape is generally used in conjunction with a cover tape (upper sealing tape). The product is carried and stored in the pockets of the carrier tape, and the cover tape is sealed on top of the carrier tape to form a closed package to protect the product from contamination and damage during transportation.

[0003] There is a center hole in the pocket of the carrier tape, which is used for picking up and placing products and vacuum processing. The center hole is generally punched and has sharp edges. During transportation, due to vibration, the products stored in the carrier tape will repeatedly contact the center hole and scratches will be produced due to wear.

[0004] CN103786912A discloses a carrier tape connector for connecting carrier tapes, the carrier tape comprising: a carrier tape main body for accommodating electronic components; and a top tape covering a concave portion of the carrier tape main body for accommodating electronic components and pasted on the carrier tape main body, the carrier tape connector being composed of an adhesive sheet pasted across the two carrier tapes in a manner of connecting the carrier tape main bodies and the top tapes of two carrier tapes as connection objects whose ends are butted against each other, respectively, and the two valleys in the serrated shape formed on one side of the carrier tape connector are located on both side edges of the top tape on the carrier tape main body of one of the two carrier tapes whose top tape is peeled off first.

[0005] CN111348235A discloses a carrier tape, comprising a strip-shaped carrier tape body, the carrier tape body comprising a plurality of adsorption holes and a plurality of carrier tape index holes, the plurality of adsorption holes and the plurality of carrier tape index holes being holes passing through the carrier tape body, the plurality of carrier tape index holes extending in a row along a carrier tape winding direction, the plurality of adsorption holes being evenly distributed in an area outside the plurality of carrier tape index holes in the carrier tape body.

[0006] CN110654714A discloses a carrier system for semiconductor components, which includes: a covering tape; and a carrier substrate, including a first side and a second side, the first side of the carrier substrate and the second side of the carrier substrate extending along a length of the carrier substrate, the carrier substrate including: a plurality of pockets between the first side of the carrier substrate and the second side of the carrier substrate, and the pockets are configured to accommodate the semiconductor components; and a plurality of non-adhesive areas arranged in a first row along the length of the carrier substrate and a plurality of non-adhesive areas arranged in a second row along the length of the carrier substrate, the non-adhesive areas of the first row being located on one side of the plurality of pockets, and the non-adhesive areas of the second row being located on a side of the plurality of pockets different from the side of the plurality of pockets where the non-adhesive areas of the first row are located.

[0007] Existing carrier tapes are usually made by punching technology, and the punching edges are sharp. During transportation, electronic components are easily scratched or damaged due to wear and tear due to vibration. Therefore, improving the carrier tape structure is very important to ensure the integrity of electronic components during transportation and packaging. Summary of the invention

[0008] In view of the deficiencies in the prior art, an object of the present invention is to provide a carrier tape for carrying electronic components, a packaging system device and a packaging method, which can avoid scratches on the electronic components and have higher safety, stability and reliability.

[0009] To achieve this object, the present invention adopts the following technical solutions:

[0010] In a first aspect, the present invention provides a carrier tape for carrying electronic components, the carrier tape for carrying electronic components comprising a carrier tape body, at least one packaging pocket being arranged on the surface of the carrier tape body, the packaging pocket protruding from the surface of the carrier tape body, the packaging pocket comprising a bottom and a side portion, the side portion and the bottom being arranged to form an open cavity for accommodating electronic components, a connecting slope being arranged between the side portion and the bottom for connection, the connecting slope gradually shrinking along the side portion toward the bottom surface, the surface of the bottom being provided with a central groove penetrating the bottom.

[0011] The carrier tape for carrying electronic components provided by the present invention changes the joint between the bottom and the side of the packaging pocket from a right angle to an inclined surface. When the electronic components are placed in the pocket, the contact point between the electronic components and the carrier tape is on the inclined surface, which can prevent the electronic components from contacting the central groove on the bottom surface of the carrier tape and avoid scratches.

[0012] It should be noted that in the present invention, a plurality of packaging pockets can be provided on the surface of the carrier body to increase the total packaging volume of the carrier, and electronic components can be quickly dropped into the packaging pockets during packaging.

[0013] As a preferred technical solution of the present invention, the angle between the connecting slope and the horizontal plane where the surface of the bottom is located is 3 to 20°, for example, it can be 3°, 5°, 6°, 8°, 9°, 10°, 12°, 14°, 16°, 15°, 18° or 20°, but is not limited to the listed values. Other unlisted values ​​within the numerical range are also applicable, preferably 5 to 10°.

[0014] Preferably, the projection length of the connecting slope on the extended surface of the bottom surface is 0.5 to 3 mm, for example, it can be 0.5 mm, 0.6 mm, 0.8 mm, 1 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2 mm, 2.2 mm, 2.5 mm, 2.8 mm or 3 mm, but is not limited to the listed values, and other unlisted values ​​within this numerical range are also applicable.

[0015] As a preferred technical solution of the present invention, the side portion includes four side walls connected in sequence, one side of the side wall is connected to the surface of the bottom, and the other side is connected to the surface of the carrier body, and a first connecting portion is provided at the joint of two adjacent side walls for transition.

[0016] Preferably, the side wall is connected to the bottom via a connecting slope, the side wall corresponds to the connecting slope one by one, and a second connecting portion is provided at the joint of two adjacent connecting slopes for transition.

[0017] Preferably, the first connecting portion is an arc surface, and the second connecting portion is an inclined surface.

[0018] It should be noted that in the present invention, any side wall of the packaging pocket corresponds to a connecting slope connected to its bottom, and a slope is set at the joint of two adjacent connecting slopes, which can make the side connection of the packaging pocket continuous and avoid scratching electronic components by sharp angles at the connection.

[0019] Preferably, the electronic components are placed at the bottom of the packaging pocket, the connecting slope supports the electronic components, and the distance between the side and the electronic components is 0.1 to 0.5 mm, for example, it can be 0.1 mm, 0.12 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.28 mm, 0.3 mm, 0.35 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.45 mm, 0.48 mm or 0.5 mm, but it is not limited to the listed values, other unlisted values ​​within the numerical range are also applicable, and it is further preferably 0.1 to 0.3 mm.

[0020] It should be noted that the distance between the electronic components and the side of the packaging pocket in the present invention is shortened, which can reduce the vibration amplitude and thus reduce scratches.

[0021] As a preferred technical solution of the present invention, the bottom is provided with a downwardly recessed receiving groove, and a central groove is opened at the bottom of the receiving groove.

[0022] Preferably, the accommodating groove comprises a first surface and a second surface, and the first surface transitions in an arc from the surface of the bottom to the second surface.

[0023] Preferably, a central groove is formed on the second surface.

[0024] Preferably, the cross section of the central groove is a circular structure.

[0025] Preferably, the diameter of the accommodating groove is larger than the diameter of the central groove.

[0026] It should be noted that, in the present invention, a downwardly recessed receiving groove is provided at the bottom of the packaging pocket, and a circular arc transition is formed from the surface of the bottom of the packaging pocket to the surface of the bottom of the receiving groove. Even if the electronic components come into contact with the bottom of the packaging pocket, since the punching edge (the sharper part) of the center groove is at a certain distance from the bottom of the packaging pocket and the step edge in contact with the bottom of the electronic components is rounded, scratches on the electronic components can be avoided.

[0027] As a preferred technical solution of the present invention, the depth of the receiving groove is 0.05-2mm, for example, it can be 0.05mm, 0.07mm, 0.1mm, 0.15mm, 0.2mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.2mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2mm, but is not limited to the listed values, other unlisted values ​​within the numerical range are also applicable, and it is further preferred to be 0.07-0.12mm.

[0028] Preferably, the diameter of the receiving groove is 1 to 3 mm, for example, it can be 1 mm, 1.2 mm, 1.5 mm, 1.6 mm, 1.8 mm, 2 mm, 2.2 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.8 mm or 3 mm, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0029] Preferably, the diameter of the center groove is 0.7-1.5 mm, for example, it can be 0.7 mm, 0.75 mm, 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.45 mm or 1.5 mm, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0030] As a preferred technical solution of the present invention, at least one positioning hole is formed on the surface of the carrier body.

[0031] Preferably, the positioning hole is a round hole.

[0032] In a second aspect, the present invention provides a packaging system device, comprising a cover tape and the carrier tape for carrying electronic components as described in the first aspect, wherein the cover tape is located on a side surface of the carrier tape body away from the cavity of the packaging pocket.

[0033] In a third aspect, the present invention provides a packaging method, wherein the packaging method uses the packaging system device described in the second aspect to package electronic components, and the packaging method comprises:

[0034] The electronic components are placed in the packaging bag, and then the cover tape is closed on one side of the open end of the packaging bag to seal it.

[0035] As a preferred technical solution of the present invention, the cover tape is closed and heat-sealed;

[0036] Preferably, the packaging method further comprises rolling up the sealed carrier tape body.

[0037] As a preferred technical solution of the present invention, the electronic components are placed at the bottom of the packaging pocket, and the connecting inclined surface is pressed against the edge of the electronic components for support.

[0038] The system refers to an equipment system, a device system or a production device.

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] The carrier tape, packaging system device and packaging method for carrying electronic components provided by the present invention change the joint between the bottom and the side of the packaging pocket from a right angle to an inclined surface. When the electronic components are placed in the pocket, the contact point between the electronic components and the carrier tape is on the inclined surface, which can prevent the electronic components from contacting the central groove on the bottom surface of the carrier tape and avoid scratches. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1A schematic structural diagram of a carrier tape carrying electronic components provided in a specific embodiment of the present invention;

[0042] Figure 2 A schematic diagram of the structure of a packaging bag for carrying electronic components provided in a specific embodiment of the present invention;

[0043] Figure 3 A schematic structural diagram of a central slot for carrying electronic components provided in a specific embodiment of the present invention.

[0044] Among them, 1-carrier body; 2-packaging pocket; 3-connecting slope; 4-center groove; 5-accommodating groove; 6-electronic components; 7-positioning hole. DETAILED DESCRIPTION

[0045] It should be understood that, in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0046] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "disposed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0047] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0048] In a specific embodiment, the present invention provides a carrier tape for carrying electronic components, such as Figure 1As shown, the carrier tape carrying electronic components includes a carrier tape body 1, at least one packaging pocket 2 is arranged on the surface of the carrier tape body 1, and the packaging pocket 2 protrudes from the surface of the carrier tape body 1. The packaging pocket 2 includes a bottom and a side, and the side and the bottom are surrounded to form an open cavity for accommodating electronic components 6, such as Figure 2 As shown, a connecting slope 3 is provided between the side and the bottom for connection, and the connecting slope 3 gradually shrinks along the side toward the bottom surface, and a central groove 4 penetrating the bottom is provided on the surface of the bottom.

[0049] Furthermore, the angle between the connecting inclined surface 3 and the horizontal plane where the bottom surface is located is 3 to 20°, preferably 5 to 10°.

[0050] The projection length of the connecting inclined surface 3 on the extension surface of the bottom surface is 0.5-3 mm.

[0051] Furthermore, the side portion includes four side walls connected in sequence, one side of the side wall is connected to the surface of the bottom, and the other side is connected to the surface of the carrier body 1, and a first connecting portion is provided at the joint of two adjacent side walls for transition.

[0052] The side wall is connected to the bottom through the connecting bevel 3. The side wall corresponds to the connecting bevel 3 one by one. A second connecting portion is provided at the joint of two adjacent connecting bevels 3 for transition. The first connecting portion is an arc surface, and the second connecting portion is a bevel. Each side wall of the packaging pocket 2 corresponds to a connecting bevel 3 connected to its bottom. A bevel is provided at the joint of two adjacent connecting bevels 3, which can make the side connection of the packaging pocket 2 continuous and avoid the sharp angle of the connection from scratching the electronic components 6.

[0053] The electronic component 6 is placed at the bottom of the packaging pocket 2, and the connecting slope 3 supports the electronic component 6. The distance between the side and the electronic component 6 is 0.1-0.5 mm, preferably 0.1-0.3 mm. The distance between the electronic component 6 and the side of the packaging pocket 2 is shortened in the present invention, which can reduce the vibration amplitude and thus reduce scratches.

[0054] Furthermore, if Figure 3 As shown, the bottom is provided with a downwardly recessed receiving groove 5, and the bottom of the receiving groove 5 is provided with a central groove 4. The receiving groove 5 includes a first surface and a second surface, and the first surface is arc-shaped transition from the surface of the bottom to the direction of the second surface.

[0055] The cross section of the central groove 4 is a circular structure. The diameter of the receiving groove 5 is larger than the diameter of the central groove 4. In the present invention, the bottom of the packaging bag 2 is provided with a downwardly recessed receiving groove 5, and a circular arc transition is formed from the surface of the bottom of the packaging bag 2 to the surface of the bottom of the receiving groove 5. When the electronic component 6 contacts the bottom of the packaging bag 2, since the punching edge (sharper part) of the central groove 4 is at a certain distance from the bottom of the electronic component 6, and the step edge in contact with the bottom of the electronic component 6 is rounded, scratching of the electronic component 6 can be avoided.

[0056] Furthermore, the depth of the receiving groove 5 is 0.05-2 mm, preferably 0.07-0.12.

[0057] The diameter of the receiving groove 5 is 1-3 mm. The diameter of the central groove 4 is 0.7-1.5 mm.

[0058] Furthermore, at least one positioning hole 7 is formed on the surface of the carrier body 1. The positioning hole 7 is a circular hole.

[0059] In a specific embodiment, the present invention provides a packaging system device, which includes a covering tape and a carrier tape carrying electronic components as described in a specific embodiment, wherein the covering tape is located on a side surface of a carrier tape body 1 away from the cavity of the packaging pocket 2.

[0060] In another specific embodiment, the present invention provides a packaging method, wherein the packaging method uses the packaging system device described in a specific embodiment to package the electronic component 6, and the packaging method includes:

[0061] The electronic components 6 are placed in the packaging bag 2, and then the cover tape is closed on one side of the open end of the packaging bag 2 to seal it.

[0062] Furthermore, the cover tape is closed and then heat-sealed.

[0063] The packaging method further comprises rolling up the sealed carrier tape body 1 .

[0064] Furthermore, the electronic component 6 is placed at the bottom of the packaging pocket 2, and the connecting slope 3 is pressed against the edge of the electronic component 6 for support.

[0065] Example 1

[0066] The present embodiment provides a packaging system device, including a carrier tape for carrying electronic components, the carrier tape for carrying electronic components includes a carrier tape body 1, sixteen packaging pockets 2 are arranged on the surface of the carrier tape body 1, and the packaging pockets 2 protrude from the surface of the carrier tape body 1. The packaging pocket 2 includes a bottom and a side, the side and the bottom are surrounded to form an open cavity for accommodating electronic components 6, a connecting slope 3 is arranged between the side and the bottom for connection, the connecting slope 3 gradually shrinks along the side toward the bottom surface, and a through center groove 4 is provided on the surface of the bottom. Sixteen positioning holes 7 are equidistantly provided on the surface of the carrier tape body 1. The packaging system device also includes a covering tape, which is pasted on one side surface of the cavity of the carrier tape body 1 away from the packaging pocket 2.

[0067] The angle between the connecting bevel 3 and the horizontal plane where the bottom surface is located is 10°. The projection length of the connecting bevel 3 on the extension surface of the bottom surface of the packaging pocket 2 is 2 mm. The side portion includes four side walls that are connected in sequence, one side of the side wall is connected to the bottom surface through the connecting bevel 3, and the other side is connected to the surface of the carrier body 1. The joints of two adjacent side walls are provided with arc surfaces for transition, and the joints of two adjacent side walls are provided with bevels for transition. The electronic component 6 is placed at the bottom of the packaging pocket 2, and the connecting bevel 3 supports the electronic component 6. The distance between the side portion and the electronic component 6 is 0.2 mm.

[0068] A downwardly recessed receiving groove 5 is provided at the bottom of the packaging bag 2, and the receiving groove 5 includes a first surface and a second surface, wherein the first surface transitions in an arc from the surface of the bottom to the second surface, and the second surface is provided with a central groove 4 that passes through the bottom surface of the packaging bag 2. The depth of the receiving groove 5 is 0.1 mm, the diameter is 2 mm, and the diameter of the central groove 4 is 1 mm.

[0069] Example 2

[0070] The present embodiment provides a packaging system device, including a carrier tape for carrying electronic components, the carrier tape for carrying electronic components includes a carrier tape body 1, sixteen packaging pockets 2 are arranged on the surface of the carrier tape body 1, the packaging pockets 2 protrude from the surface of the carrier tape body 1, the packaging pockets 2 include a bottom and a side, the side and the bottom are surrounded to form an open cavity for accommodating electronic components 6, a connecting slope 3 is arranged between the side and the bottom for connection, the connecting slope 3 gradually shrinks along the side toward the bottom surface, and a through center groove 4 is provided on the surface of the bottom. Sixty-four positioning holes 7 are equidistantly provided on the surface of the carrier tape body 1. The packaging system device also includes a covering tape, which is pasted on one side surface of the cavity of the carrier tape body 1 away from the packaging pocket 2.

[0071] The angle between the connecting bevel 3 and the horizontal plane where the bottom surface is located is 3°. The projection length of the connecting bevel 3 on the extension surface of the bottom surface of the packaging pocket 2 is 0.5mm. The side portion includes four side walls that are connected in sequence, one side of the side wall is connected to the bottom surface through the connecting bevel 3, and the other side is connected to the surface of the carrier body 1. The joints of two adjacent side walls are provided with arc surfaces for transition, and the joints of two adjacent side walls are provided with bevels for transition. The electronic component 6 is placed at the bottom of the packaging pocket 2, and the connecting bevel 3 supports the electronic component 6. The distance between the side portion and the electronic component 6 is 0.1mm.

[0072] A downwardly recessed receiving groove 5 is provided at the bottom of the packaging bag 2, and the receiving groove 5 includes a first surface and a second surface, wherein the first surface transitions in an arc from the surface of the bottom to the second surface, and the second surface is provided with a central groove 4 that passes through the bottom surface of the packaging bag 2. The depth of the receiving groove 5 is 0.1 mm, the diameter is 2 mm, and the diameter of the central groove 4 is 0.7 mm.

[0073] Example 3

[0074] The present embodiment provides a packaging system device, including a carrier tape for carrying electronic components, the carrier tape for carrying electronic components includes a carrier tape body 1, sixteen packaging pockets 2 are arranged on the surface of the carrier tape body 1, the packaging pockets 2 protrude from the surface of the carrier tape body 1, the packaging pockets 2 include a bottom and a side, the side and the bottom are surrounded to form an open cavity for accommodating electronic components 6, a connecting slope 3 is arranged between the side and the bottom for connection, the connecting slope 3 gradually shrinks along the side toward the bottom surface, and a through center groove 4 is provided on the surface of the bottom. Sixteen positioning holes 7 are equidistantly provided on the surface of the carrier tape body 1. The packaging system device also includes a covering tape, which is pasted on one side surface of the cavity of the carrier tape body 1 away from the packaging pocket 2.

[0075] The angle between the connecting bevel 3 and the horizontal plane where the bottom surface is located is 5°. The projection length of the connecting bevel 3 on the extension surface of the bottom surface of the packaging pocket 2 is 1 mm. The side portion includes four side walls that are connected in sequence, one side of the side wall is connected to the bottom surface through the connecting bevel 3, and the other side is connected to the surface of the carrier body 1. The joints of two adjacent side walls are provided with arc surfaces for transition, and the joints of two adjacent side walls are provided with bevels for transition. The electronic component 6 is placed at the bottom of the packaging pocket 2, and the connecting bevel 3 supports the electronic component 6. The distance between the side portion and the electronic component 6 is 0.2 mm.

[0076] A downwardly recessed receiving groove 5 is provided at the bottom of the packaging bag 2, and the receiving groove 5 includes a first surface and a second surface, wherein the first surface transitions in an arc from the surface of the bottom to the second surface, and the second surface is provided with a central groove 4 that passes through the bottom surface of the packaging bag 2. The depth of the receiving groove 5 is 0.07 mm, the diameter is 1.5 mm, and the diameter of the central groove 4 is 1.2 mm.

[0077] Example 4

[0078] The present embodiment provides a packaging system device, including a carrier tape for carrying electronic components, the carrier tape for carrying electronic components includes a carrier tape body 1, sixteen packaging pockets 2 are arranged on the surface of the carrier tape body 1, the packaging pockets 2 protrude from the surface of the carrier tape body 1, the packaging pockets 2 include a bottom and a side, the side and the bottom are surrounded to form an open cavity for accommodating electronic components 6, a connecting slope 3 is arranged between the side and the bottom for connection, the connecting slope 3 gradually shrinks along the side toward the bottom surface, and a through center groove 4 is provided on the surface of the bottom. Sixteen positioning holes 7 are equidistantly provided on the surface of the carrier tape body 1. The packaging system device also includes a covering tape, which is pasted on one side surface of the cavity of the carrier tape body 1 away from the packaging pocket 2.

[0079] The angle between the connecting bevel 3 and the horizontal plane where the bottom surface is located is 10°. The projection length of the connecting bevel 3 on the extension surface of the bottom surface of the packaging pocket 2 is 2.5mm. The side portion includes four side walls that are connected in sequence, one side of the side wall is connected to the bottom surface through the connecting bevel 3, and the other side is connected to the surface of the carrier body 1. The joints of two adjacent side walls are provided with arc surfaces for transition, and the joints of two adjacent side walls are provided with bevels for transition. The electronic component 6 is placed at the bottom of the packaging pocket 2, and the connecting bevel 3 supports the electronic component 6. The distance between the side portion and the electronic component 6 is 0.3mm.

[0080] A downwardly recessed receiving groove 5 is provided at the bottom of the packaging bag 2, and the receiving groove 5 includes a first surface and a second surface, wherein the first surface transitions in an arc from the surface of the bottom to the second surface, and the second surface is provided with a central groove 4 that passes through the bottom surface of the packaging bag 2. The depth of the receiving groove 5 is 1.6 mm, the diameter is 2.6 mm, and the diameter of the central groove 4 is 1.5 mm.

[0081] Example 5

[0082] The present embodiment provides a packaging system device, including a carrier tape for carrying electronic components, the carrier tape for carrying electronic components includes a carrier tape body 1, sixteen packaging pockets 2 are arranged on the surface of the carrier tape body 1, the packaging pockets 2 protrude from the surface of the carrier tape body 1, the packaging pockets 2 include a bottom and a side, the side and the bottom are surrounded to form an open cavity for accommodating electronic components 6, a connecting slope 3 is arranged between the side and the bottom for connection, the connecting slope 3 gradually shrinks along the side toward the bottom surface, and a through center groove 4 is provided on the surface of the bottom. Sixteen positioning holes 7 are equidistantly provided on the surface of the carrier tape body 1. The packaging system device also includes a covering tape, which is pasted on one side surface of the cavity of the carrier tape body 1 away from the packaging pocket 2.

[0083] The angle between the connecting bevel 3 and the horizontal plane where the bottom surface is located is 20°. The projection length of the connecting bevel 3 on the extension surface of the bottom surface of the packaging pocket 2 is 3mm. The side portion includes four side walls that are connected in sequence, one side of the side wall is connected to the bottom surface through the connecting bevel 3, and the other side is connected to the surface of the carrier body 1. The joints of two adjacent side walls are provided with arc surfaces for transition, and the joints of two adjacent side walls are provided with bevels for transition. The electronic component 6 is placed at the bottom of the packaging pocket 2, and the connecting bevel 3 supports the electronic component 6. The distance between the side portion and the electronic component 6 is 0.5mm.

[0084] A downwardly recessed receiving groove 5 is provided at the bottom of the packaging bag 2, and the receiving groove 5 includes a first surface and a second surface, wherein the first surface transitions in an arc from the surface of the bottom to the second surface, and the second surface is provided with a central groove 4 that passes through the bottom surface of the packaging bag 2. The depth of the receiving groove 5 is 2 mm, the diameter is 3 mm, and the diameter of the central groove 4 is 1.5 mm.

[0085] Application Example 1

[0086] In this application example, the packaging system device provided in Example 1 is used to package semiconductor components. The packaging method includes:

[0087] The semiconductor element is placed at the bottom of the packaging bag 2, and the connecting slope 3 is pressed against the edge of the semiconductor element for support. Then, the cover tape is covered on one side of the open end of the packaging bag 2 for heat sealing, and the sealed carrier tape body 1 is rolled up.

[0088] When winding, the packaging bag 2 will contact the cover tape on the next layer of carrier tape. When the depth of the receiving groove 5 of the center groove 4 is too high, the center groove 4 will affect the cover tape on the carrier tape below it. When it is too low, the punching edge (sharper part) of the center groove 4 will still scratch the bottom of the semiconductor component.

[0089] The carrier tape for carrying electronic components provided by the present invention changes the joint between the bottom and the side of the packaging pocket 2 from a right angle to an inclined plane. When the electronic component 6 is placed in the pocket, the contact point between the electronic component 6 and the carrier tape is on the inclined plane, which can prevent the electronic component 6 from contacting the central groove 4 on the surface of the carrier tape body 1 to avoid scratches; the distance between the electronic component 6 and the side of the packaging pocket 2 is shortened, which can reduce the vibration amplitude and thus reduce scratches. An accommodating groove 5 is added to the bottom of the packaging pocket 2, and the surface of the bottom of the packaging pocket 2 transitions to the bottom of the accommodating groove 5 in an arc direction, so that the punching edge (sharper part) of the central groove 4 is at a certain distance from the bottom of the electronic component 6, and the step edge in contact with the bottom of the electronic component 6 is rounded, which can avoid scratching the electronic component 6.

[0090] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A carrier tape for carrying electronic components, characterized in that: The carrier tape for carrying electronic components comprises a carrier tape body, at least one packaging pocket is arranged on the surface of the carrier tape body, the packaging pocket protrudes from the surface of the carrier tape body, the packaging pocket comprises a bottom and a side portion, the side portion and the bottom are arranged to form an open cavity for accommodating electronic components, a connecting slope is arranged between the side portion and the bottom for connection, the connecting slope gradually shrinks along the side portion toward the bottom surface, a central groove penetrating the bottom is provided on the surface of the bottom; the bottom is provided with a downwardly concave accommodating groove, and a central groove is provided at the bottom of the accommodating groove; The receiving groove comprises a first surface and a second surface, wherein the first surface transitions in an arc from the surface of the bottom to the second surface; The second surface is provided with a central groove; The cross section of the central groove is a circular structure; The diameter of the accommodating groove is greater than the diameter of the central groove.

2. The carrier tape for carrying electronic components according to claim 1, characterized in that: The angle between the connecting inclined surface and the horizontal plane where the surface of the bottom is located is 3 to 20 degrees.

3. The carrier tape for carrying electronic components according to claim 2, characterized in that: The angle between the connecting inclined surface and the horizontal plane where the surface of the bottom is located is 5 to 10 degrees.

4. The carrier tape for carrying electronic components according to claim 1, characterized in that: The projection length of the connecting inclined surface on the extension surface of the surface where the bottom is located is 0.5 to 3 mm.

5. The carrier tape for carrying electronic components according to claim 1, characterized in that: The side portion includes four side walls connected in sequence, one side of the side wall is connected to the surface of the bottom, and the other side is connected to the surface of the carrier body, and a first connecting portion is arranged at the joint of two adjacent side walls for transition.

6. The carrier tape for carrying electronic components according to claim 5, characterized in that: The side wall is connected to the bottom through a connecting slope, the side wall corresponds to the connecting slope one by one, and a second connecting portion is arranged at the joint of two adjacent connecting slopes for transition.

7. The carrier tape for carrying electronic components according to claim 5, characterized in that: The first connecting portion is an arc surface.

8. The carrier tape for carrying electronic components according to claim 6, characterized in that: The second connecting portion is an inclined surface.

9. The carrier tape for carrying electronic components according to claim 1, characterized in that: The electronic components are placed at the bottom of the packaging pocket, the connecting inclined surface supports the electronic components, and the distance between the side portion and the electronic components is 0.1-0.5 mm.

10. The carrier tape for carrying electronic components according to claim 9, characterized in that: The distance between the side portion and the electronic component is 0.1-0.3 mm.

11. The carrier tape for carrying electronic components according to claim 1, characterized in that: The depth of the receiving groove is 0.05-2 mm.

12. The carrier tape for carrying electronic components according to claim 1, characterized in that: The depth of the receiving groove is 0.07-0.12 mm.

13. The carrier tape for carrying electronic components according to claim 1, characterized in that: The diameter of the containing groove is 1 to 3 mm.

14. The carrier tape for carrying electronic components according to claim 1, characterized in that: The diameter of the central groove is 0.7-1.5 mm.

15. The carrier tape for carrying electronic components according to claim 1, characterized in that: At least one positioning hole is formed on the surface of the carrier body.

16. The carrier tape for carrying electronic components according to claim 15, characterized in that: The positioning hole is a round hole.

17. A packaging system device, characterized in that: The packaging system device comprises a covering tape and a carrier tape for carrying electronic components as claimed in any one of claims 1 to 16, wherein the covering tape is located on a side surface of the carrier tape body away from the cavity of the packaging pocket.

18. A packaging method, characterized in that: The packaging method uses the packaging system device according to claim 17 to package electronic components, and the packaging method includes: The electronic components are placed in the packaging bag, and then the cover tape is closed on one side of the open end of the packaging bag to seal it.

19. The packaging method according to claim 18, characterized in that: The cover tape is closed and heat-sealed.

20. The packaging method according to claim 18, characterized in that: The packaging method further comprises rolling up the sealed carrier tape body.

21. The packaging method according to claim 18, characterized in that: The electronic components are placed at the bottom of the packaging pocket, and the connecting inclined surface is pressed against the edge of the electronic components for support.

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