Heat dissipation device

Abstract

The present invention provides a heat dissipation device, including a base, a plurality of fins and a plurality of strip-shaped plates. The fins protrude from the base side by side, and the fins respectively include a plurality of first end edges and a plurality of second end edges relative to each other, wherein the first end edges are connected to the base. The strip-shaped plates are parallel to the base and connected to at least a portion of the second end edges of the fins, and a plurality of strip-shaped openings are formed between the strip-shaped plates. The base, the fins and the strip-shaped plates together surround a plurality of chambers in a non-enclosed manner, and each strip-shaped opening is connected to a corresponding chamber. The distance between two adjacent fins is S, and the width of any one of the strip-shaped openings is d, and d / S is between 0.01 and 0.4.

Description

Technical Field

[0001] The invention relates to a heat dissipation device, and in particular to a heat dissipation device with better heat dissipation efficiency. Background Art

[0002] At present, some heat dissipation devices use natural convection supplemented by thermal radiation to dissipate heat. However, since the heat dissipation capacity of natural convection is very weak, large-area fins are often required to enhance heat dissipation. If such devices are limited by size such as volume and surface area, the size of the fins is difficult to increase, and the heat dissipation is correspondingly limited. Therefore, how to improve the heat dissipation efficiency is the research direction in this field. Summary of the invention

[0003] The invention provides a heat dissipation device with better heat dissipation efficiency.

[0004] A heat dissipation device of the present invention includes a base, a plurality of fins and a plurality of strip-shaped plates. The fins protrude from the base side by side, and the fins respectively include a plurality of first end edges and a plurality of second end edges relative to each other, wherein the first end edges are connected to the base. The strip-shaped plates are parallel to the base and connected to at least a portion of the second end edges of the fins, and a plurality of strip-shaped openings are formed between the strip-shaped plates. The base, the fins and the strip-shaped plates together surround a plurality of chambers in a non-enclosed manner, and each strip-shaped opening is connected to a corresponding chamber. The distance between two adjacent ones of the fins is S, and the width of any one of the strip-shaped openings is d, and d / S is between 0.01 and 0.4.

[0005] In one embodiment of the present invention, the d / S is between 0.1 and 0.35.

[0006] In an embodiment of the present invention, the number of the strip plates is equal to the number of the fins, and the strip plates are respectively connected to the second end edges of the fins.

[0007] In one embodiment of the present invention, the strip-shaped plates include two outer plates located at the outermost sides and a plurality of inner plates located between the two outer plates, and the inner plates have the same width.

[0008] In one embodiment of the present invention, the strip plates include a plurality of first-type plates and a plurality of second-type plates. The width of each first-type plate is different from the width of each second-type plate. The first-type plates and the second-type plates are arranged alternately.

[0009] In one embodiment of the present invention, the number of the strip plates is less than the number of the fins. The fins include a plurality of first fins and a plurality of second fins arranged in an alternating manner. The strip plates are respectively connected to the first fins and are not connected to the second fins.

[0010] In one embodiment of the present invention, the second fins have rounded corners or chamfered corners at a plurality of end edges away from the bottom plate.

[0011] In one embodiment of the present invention, the strip-shaped plates have rounded corners or chamfered corners.

[0012] In one embodiment of the present invention, the strip-shaped openings correspond to a plurality of center lines of the chambers.

[0013] In one embodiment of the present invention, the strip-shaped openings are staggered with respect to a plurality of center lines of the chambers.

[0014] In one embodiment of the present invention, two adjacent strip-shaped openings are grouped into a plurality of groups, and the two strip-shaped openings in each group are close to each other.

[0015] In one embodiment of the present invention, each of the strip-shaped plates has various thicknesses.

[0016] Based on the above, the heat dissipation device of the present invention connects the strip plates parallel to the base to at least a portion of the second end edges of the fins, so that the base, the fins and the strip plates together surround a plurality of chambers in a non-enclosed manner, and a plurality of strip openings formed between the strip plates are connected to the chambers. The spacing between two adjacent ones of the fins is S, the width of any one of the strip openings is d, and d / S is between 0.01 and 0.4. According to simulation, when d / S is within the above range, the heat dissipation device has better heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A is a three-dimensional schematic diagram of a heat dissipation device according to an embodiment of the present invention;

[0018] Figure 1B yes Figure 1A A schematic top view of a heat dissipation device;

[0019] Figure 2 is a schematic top view of a heat dissipation device according to another embodiment of the present invention;

[0020] Figure 3A is a three-dimensional schematic diagram of a heat dissipation device according to another embodiment of the present invention;

[0021] Figure 3B yes Figure 3A A schematic top view of a heat dissipation device;

[0022] Figure 3C yes Figure 1A and Figure 3A The relationship diagram of d / S-heat dissipation in the heat dissipation device;

[0023] Figures 4 to 8 is a schematic top view of various heat dissipation devices according to other embodiments of the present invention;

[0024] Fig. 9 yes Figure 8 Schematic diagram of the interior of the heat plate of the heat sink.

[0025] Description of Reference Numerals

[0026] C: midline;

[0027] d, W, W1, W2: width;

[0028] H: height;

[0029] L, Li: length;

[0030] S: spacing;

[0031] T1, T2: thickness;

[0032] 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g: heat dissipation device;

[0033] 110: base;

[0034] 120, 120b: fin;

[0035] 122: first end edge;

[0036] 124, 124d: second end edge;

[0037] 126: first fin;

[0038] 128: second fin;

[0039] 130, 130a, 130b, 130c, 130d, 130e, 130f: strip-shaped plates;

[0040] 132, 132a, 132c, 132d, 132f: outer plate;

[0041] 134, 134a, 134b, 134c, 134d, 134e, 134f: inner plate;

[0042] 136, 136f: first type plate body;

[0043] 138, 138f: second type plate body;

[0044] 140: strip opening;

[0045] 145: chamber;

[0046] 150: hot plate;

[0047] 152: Loop. DETAILED DESCRIPTION

[0048] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0049] Figure 1A It is a three-dimensional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 1B yes Figure 1A Schematic diagram of the top view of the heat sink. Figure 1A and Figure 1B The heat dissipation device 100 of this embodiment can be, for example, a part of the housing of an electronic device, such as a part of the housing of a fanless electronic device (such as a 5G base station, a fanless industrial computer, a fanless gaming computer, or other forms of fanless computers), and can provide support, protection, and heat dissipation at the same time. Of course, the heat dissipation device 100 of this embodiment can also be used simply for heat dissipation, and the electronic device and function to which the heat dissipation device 100 is applied are not limited thereto.

[0050] In this embodiment, the heat dissipation device 100 includes a base 110, a plurality of fins 120, and a plurality of strip-shaped plates 130. The base 110 can contact a heat source (not shown). The fins 120 protrude from the base 110 side by side, and the fins 120 respectively include a plurality of opposite first edges 122 and a plurality of second edges 124. The first edges 122 are connected to the base 110.

[0051] The strip plates 130 are parallel to the base 110 and connected to at least a portion of the second end edges 124 of the fins 120. In this embodiment, the number of the strip plates 130 is equal to the number of the fins 120, and the strip plates 130 are respectively connected to the second end edges 124 of the fins 120. Of course, in other embodiments, only a portion of the fins 120 may be connected to the strip plates 130.

[0052] In addition, in this embodiment, the strip plates 130 include two outer plates 132 located at the outermost sides and a plurality of inner plates 134 located between the two outer plates 132. Figure 1B It can be clearly seen that in this embodiment, the widths W of the inner plates 134 are the same. Of course, in other embodiments, the widths of the inner plates 134 may also be different.

[0053] In this embodiment, the base 110, the fins 120 and the strip plate 130 can be integrated and can be made using aluminum extrusion technology, which has the advantage of low cost. Of course, the shapes, materials and molding methods of the base 110, the fins 120 and the strip plate 130 are not limited thereto.

[0054] like Figure 1B As shown, a plurality of strip openings 140 are formed between the strip plates 130, and the base 110, the fins 120 and the strip plates 130 together surround a plurality of chambers 145 in an unclosed manner, and each strip opening 140 is connected to a corresponding chamber 145. In this embodiment, the strip openings 140 correspond to a plurality of center lines C of the chambers 145, but the positions of the strip openings 140 are not limited thereto.

[0055] It should be noted that the conventional first type of radiator is composed of a base plate and a plurality of fins. For this type of radiator, since the fins are completely open on the side away from the multiple ends of the base plate, some cold air is easily introduced through the gaps between the ends of the fins away from the base plate, and it is difficult to use the chimney effect to make the air flow upward and separate the heat from the radiator along the extension direction of the fins. In addition, the conventional second type of radiator is composed of two parallel base plates and a plurality of fins located between the two base plates. This type of radiator has a plurality of closed channels. Although the chimney effect can be used to bring the air flow upward and leave the radiator, the flow resistance of the air flow in the closed channel is large, and in the process of the hot air rising along the closed channel, the air in the upper half of the closed channel is easy to accumulate heat energy and affect the heat dissipation effect.

[0056] Compared to the conventional first type of heat sink, the heat sink 100 of this embodiment has a strip plate 130 located at the second end edge 124 of the fin 120, so that the chamber 145 is not on this side of the second end edge 124 of the fin 120 ( Figure 1B The lower side of the heat sink 100 is completely open without introducing too much cold air into the chamber 145, and the chimney effect can be better utilized to allow the air flow to move upward to remove heat energy from the heat sink 100.

[0057] Compared with the conventional second type of heat sink, the heat sink 100 of this embodiment has the strip openings 140 between the strip plates 130, which can not only reduce the flow resistance of the airflow in the chamber 145, but also can be provided on the side of the second end edge 124 ( Figure 1B The lower side of the chamber 145 is slightly cooled to introduce cold air, thereby slowing down the airflow in the chamber 145 along the Figure 1A The temperature accumulation degree when the fins 120 extend upward can effectively prevent the upper half of the chambers 145 from being overheated and affecting the heat dissipation effect.

[0058] Therefore, under the premise of moderate flow resistance, the heat dissipation device 100 of this embodiment can better utilize the chimney effect to provide greater buoyancy for the gas in the chamber 145, so that the gas in the chamber 145 can rise quickly and be taken away from the heat dissipation device 100 to achieve a good heat dissipation effect.

[0059] Figure 2 FIG. 1 is a top view schematic diagram of a heat dissipation device according to another embodiment of the present invention. Figure 2 The heat dissipation device 100a of this embodiment is Figure 1B The main difference of the heat dissipation device 100 is that Figure 1B In the embodiment, each strip plate 130 of the heat dissipation device 100 has a uniform thickness. In this embodiment, the outer plate 132a of the strip plate 130a has a plurality of different thicknesses T1 and T2, and the inner plate 132b has a plurality of thicknesses T1 and T2. Such a design can increase the total heat dissipation area of ​​the strip plate 130a and reduce the weight and material cost of the strip plate 130a.

[0060] Of course, in other embodiments, the strip plate 130a of the heat dissipation device 100a may also be partially uniformly thick and partially non-uniformly thick. In addition, the shape of the non-uniformly thick strip plate 130a is not limited by the diagram. From a top view, the edge profile of the strip plate 130a may also be an oblique line, an arc, a wave or an irregular edge.

[0061] Figure 3A It is a three-dimensional schematic diagram of a heat dissipation device according to another embodiment of the present invention. Figure 3B yes Figure 3A Schematic diagram of the top view of the heat sink. Figure 3A and Figure 3B The heat dissipation device 100b of this embodiment is Figure 1B The main difference of the heat dissipation device 100 is that Figure 1B The strip-shaped openings 140 correspond to the center lines C of the chambers 145 . In this embodiment, the strip-shaped openings 140 are staggered from the center lines C of the chambers 145 .

[0062] Specifically, in this embodiment, two adjacent strip-shaped openings 140 are grouped into multiple groups, and the two strip-shaped openings 140 in each group are close to each other. Such a design can form paired swirl flows that are close to mirror reflections. The paired swirl flows rise along the extension direction of the fins 120b. The periodic paired upward swirl flows can enhance the heat transfer effect of natural convection.

[0063] In addition, in this embodiment, the number of the strip plates 130b is less than the number of the fins 120b. The fins 120b include a plurality of first fins 126 and a plurality of second fins 128 arranged in a staggered manner, and the strip plates 130b are respectively connected to the first fins 126 and are not connected to the second fins 128. In this way, a strip opening 140 staggered from the center line C of the chamber 145 can be formed.

[0064] It is worth mentioning that in this embodiment, the distance between two adjacent fins 120 is S (indicated by Figure 1B ), the width of any of these strip openings 140 is d (indicated at Figure 1B ), Figure 3C yes Figure 1A and Figure 3A The relationship between d / S and heat dissipation in the heat dissipation device. Figure 3C , Figure 3C Yes Figure 1A Heat dissipation device 100 and Figure 3A The heat sink 100b is simulated, and the height H ( Figure 1A ) is 250 mm, and the total length L of the fin 120 and the strip plate in the length direction is Figure 1A ) is 16 mm, and the length Li of the fin 120 (indicated at Figure 1B ) is 15 mm, the spacing S (marked on Figure 1B ) is 12 millimeters (mm). Of course, the size of the heat dissipation device 100 is not limited thereto.

[0065] When the temperature difference between the heat sink and the ambient air is 55K, the simulation shows that the d / S of a single channel is between 0.01 and 0.4, which has a good heat dissipation effect. In a preferred embodiment, d / S is between 0.1 and 0.35, for example, when d / S=0.20, the heat dissipation is 4.5% better than the second conventional heat sink, and 34% better than the first conventional heat sink, and has a better heat dissipation effect.

[0066] Figures 4 to 8 is a top view schematic diagram of various heat dissipation devices according to other embodiments of the present invention. Figure 4 The heat dissipation device 100c of this embodiment is Figure 3B The main difference of the heat dissipation device 100b is that Figure 3B In the embodiment, the outer plate body 132 of the strip plate body 130b of the heat dissipation device 100b is of uniform thickness, and the inner plate body 134b is of uniform thickness.

[0067] In this embodiment, the outer plate 132c of the strip plate 130c has various thicknesses T1 and T2, and the inner plate 134b has various thicknesses T1 and T2. Such a design can increase the total heat dissipation area of ​​the strip plate 130c and reduce the weight and material cost of the strip plate 130c.

[0068] Of course, in other embodiments, the strip plate 130c of the heat dissipation device 100c may also be partially uniformly thick and partially non-uniformly thick. In addition, the shape of the non-uniformly thick strip plate 130c is not limited to the diagram, and in a top view, the edge contour of the strip plate 130c may also be an oblique line, an arc, a wave or an irregular edge.

[0069] See also Figure 5 The heat dissipation device 100d of this embodiment is Figure 3B The main difference of the heat dissipation device 100b is that, in this embodiment, the outer plate 132d and the inner plate 134d of the strip plate 130d have rounded corners or chamfers, or / and the second fin 128 has rounded corners or chamfers at the second end edge 124d away from the bottom plate. Such a design can reduce the resistance of the external cold air entering the chamber 145 through the strip opening 140.

[0070] See also Figure 6 The heat dissipation device 100e of this embodiment is Figure 3B The main difference of the heat dissipation device 100b is that, in this embodiment, the number of the strip plates 130e is equal to the number of the fins 120. The strip plates 130e include a plurality of inner plates 134e, and the inner plates 134e include a plurality of first-type plates 136 and a plurality of second-type plates 138. The width W1 of each first-type plate 136 is different from the width W2 of each second-type plate 138, and the first-type plates 136 and the second-type plates 138 are arranged in a staggered manner.

[0071] Similarly, in this embodiment, the strip-shaped openings 140 are staggered at the multiple center lines C of the chambers 145. Two adjacent strip-shaped openings 140 are grouped together and divided into multiple groups. In each group, two strip-shaped openings 140 are close to each other, so that paired and mirror-like vortex flows can be formed to rise, thereby achieving a better natural convection effect.

[0072] See also Figure 7 The heat dissipation device 100f of this embodiment is Figure 6 The main difference of the heat sink 100e is that Figure 6 In the embodiment, each of the outer plate 132 , the first plate 136 , and the second plate 138 of the heat dissipation device 100 e has a uniform thickness.

[0073] In this embodiment, each strip plate 130f has a non-uniform thickness. Specifically, each of the outer plate 132f, the first type plate 136f and the second type plate 138f of the inner plate 134f has a plurality of thicknesses T1 and T2. Such a design can increase the total heat dissipation area of ​​the strip plate 130f and reduce the weight and material cost of the strip plate 130f.

[0074] Of course, in other embodiments, the strip plate 130f of the heat dissipation device 100f may also be partially uniformly thick and partially non-uniformly thick. In addition, the shape of the non-uniformly thick strip plate 130f is not limited to the figure, and in a top view, the edge contour of the strip plate 130f may also be an oblique line, an arc, a wave or an irregular edge.

[0075] Fig. 9 yes Figure 8 Schematic diagram of the heat sink inside the heat plate. Figure 8 and Fig. 9 The heat dissipation device 100g of this embodiment is Figure 3B The main difference between the heat dissipation device 100b and the heat dissipation device 100g is that in this embodiment, the heat dissipation device 100g further includes a heat plate 150 for contacting a heat source (not shown). The heat plate 150 is disposed beside the base 110 to thermally contact the base 110, thereby further improving the heat dissipation efficiency.

[0076] In this embodiment, the heat plate 150 may be a metal plate, and may have a Fig. 9 Loop 152 is shown. Fig. 9 The loop 152 shown can be used as a loop of an oscillating heat pipe. After evacuation and injection of a suitable working fluid, an oscillating heat pipe with a highly uniform temperature effect can be formed.

[0077] In one embodiment, Fig. 9 The loop 152 is also formed on the base 110. In this way, the heat dissipation device does not need an additional heat plate 150. In other embodiments, the heat plate 150 may be embedded with a heat pipe array, and the heat plate 150 may also be replaced with a vapor chamber, which also has a good temperature uniformity effect.

[0078] In summary, the heat dissipation device of the present invention connects the strip plates parallel to the base to at least a portion of the second end edges of the fins, so that the base, the fins and the strip plates together surround a plurality of chambers in a non-enclosed manner, and a plurality of strip openings formed between the strip plates are connected to the chambers. The distance between two adjacent fins is S, the width of any one of the strip openings is d, and d / S is between 0.01 and 0.4. According to simulation, when d / S is within the above range, the heat dissipation device has better heat dissipation performance.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: Base; A plurality of fins protruding from the base side by side, the plurality of fins respectively comprising a plurality of opposite first end edges and a plurality of second end edges, wherein the plurality of first end edges are connected to the base; as well as A plurality of strip plates are parallel to the base and connected to at least a portion of the plurality of second end edges of the plurality of fins, a plurality of strip openings are formed between the plurality of strip plates, the base, the plurality of fins and the plurality of strip plates together surround a plurality of chambers in a non-enclosed manner, and each of the strip openings is connected to the corresponding chamber, wherein The distance between two adjacent ones of the plurality of fins is S, the width of any one of the plurality of strip-shaped openings is d, d / S is between 0.01 and 0.4, the plurality of strip-shaped openings are staggered at the plurality of center lines of the plurality of chambers, the plurality of strip-shaped openings are located in the same plane, two adjacent ones of the plurality of strip-shaped openings are grouped as one and divided into a plurality of groups, the two strip-shaped openings in each group are close to each other, and the two strip-shaped openings in each group are centered on the fin between the two strip-shaped openings and are mirror-symmetrically arranged on both sides of the fin.

2. The heat dissipation device according to claim 1, characterized in that: The number of the plurality of strip-shaped plates is equal to the number of the plurality of fins, and the plurality of strip-shaped plates are respectively connected to the plurality of second end edges of the plurality of fins.

3. The heat dissipation device according to claim 2, characterized in that: The plurality of strip-shaped plates include a plurality of first-type plates and a plurality of second-type plates. The width of each of the first-type plates is different from the width of each of the second-type plates. The plurality of first-type plates and the plurality of second-type plates are arranged alternately.

4. The heat dissipation device according to claim 1, characterized in that: The number of the plurality of strip plates is less than the number of the plurality of fins. The plurality of fins include a plurality of first fins and a plurality of second fins that are staggered. The plurality of strip plates are respectively connected to the plurality of first fins and are not connected to the plurality of second fins.

5. The heat dissipation device according to claim 4, characterized in that: The second fins have rounded corners or chamfers at end edges away from the base.

6. The heat dissipation device according to claim 1, characterized in that: The plurality of strip-shaped plates have rounded corners or chamfered corners.

7. The heat dissipation device according to claim 1, characterized in that: Each of the plurality of strip-shaped plates has a plurality of thicknesses.

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