A semiconductor product calibration device

Abstract

The present application provides a semiconductor product calibration device. The semiconductor product calibration device is used to calibrate and align plate-shaped semiconductor products, and includes a base plate, an alignment frame, and a flattening plate; wherein the base plate is used to place the semiconductor product; the alignment frame is stacked on the semiconductor product and is used to align the imprint of the semiconductor product; the flattening plate is stacked on the alignment frame to flatten the alignment frame. In the above embodiment, by arranging a flattening plate on the alignment frame, it is beneficial to improve the flatness of the alignment frame and the plate-shaped semiconductor product during the calibration process, thereby improving the calibration efficiency.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor product calibration device. Background Art

[0002] Quad Flat No-lead Package (QFN) products, especially smaller QFN products, are usually packaged together with multiple QFN products during packaging, and then separated to form a single QFN product. Due to the particularity of its packaging method, it is usually impossible to directly identify whether the position of the laser mark on the front is on the product, and it can only be confirmed after separation. However, if the problem of mark offset is found after separation, it is easy to cause the product to be scrapped. Therefore, it is necessary to provide a calibration device to calibrate the mark position of each QFN product after packaging and before segmentation. Summary of the invention

[0003] One aspect of the present application provides a semiconductor product calibration device for calibrating and aligning a plate-shaped semiconductor product, which includes a base plate, an alignment frame, and a leveling plate; wherein:

[0004] A base plate, used for placing the semiconductor product;

[0005] An alignment frame, stacked on the semiconductor product, for aligning the imprint of the semiconductor product;

[0006] A flattening plate is stacked on the alignment frame to flatten the alignment frame.

[0007] Optionally, the semiconductor product calibration device includes a limiting component to fix and limit the alignment frame, the semiconductor product and the leveling plate.

[0008] Optionally, in the length direction of the semiconductor product calibration device, the base plate has a first end and a second end relative to each other, and the limit assembly includes an installation limit groove provided at the first end of the base plate and opening toward the second end of the base plate, and the alignment frame, the semiconductor product and one end of the leveling plate can be inserted into the installation limit groove.

[0009] Optionally, a limiting structure is provided at the first end of the base plate, the limiting structure having a notch portion, the limiting structure is assembled on the upper surface of the first end of the base plate, and forms the installation limiting groove with the base plate at the notch portion of the limiting structure.

[0010] Optionally, the limiting assembly includes a first limiting block and a second limiting block which are arranged at the second end of the base plate, the first limiting block and the second limiting block are provided with relative limiting notches, and the first limiting block and the second limiting block are relatively arranged at the second end of the base plate, so that the limiting notch of the first limiting block and the limiting notch of the second limiting block can limit the end of the leveling plate close to the second end of the base plate and the side of the leveling plate close to the second end of the base plate.

[0011] Optionally, the limiting assembly includes a fixing assembly rotatably disposed at the second end of the base plate to fix the leveling plate, the alignment frame, and the semiconductor product.

[0012] Optionally, the fixing assembly includes a rotating shaft rotatably provided on the base plate, and a rolling wheel is provided on the outer sleeve of the rotating shaft; the rotating shaft can be rotated to a fixed position for calibrating the semiconductor product, and at the fixed position, the rolling wheel is pressed against the leveling plate to fix the leveling plate, the alignment frame and the semiconductor product; the rotating shaft can be rotated to an initial position, and at the initial position, the leveling plate, the alignment frame and the semiconductor product can be stacked on the base plate or removed from the base plate.

[0013] Optionally, the base plate has a first end retaining wall extending upward from the edge of the first end of the base plate, and a first side retaining wall extending upward from the two side edges of the base plate close to the first end, and an installation groove cover plate is provided on the first end retaining wall and the first side retaining wall, and the first end retaining wall, the first side retaining wall and the installation groove cover plate together form the installation limit groove.

[0014] Optionally, the base plate has a second end retaining wall extending upward from the edge of the second end of the base plate, and a second side retaining wall extending upward from the two side edges of the base plate near the second end, the second end retaining wall can limit the end of the leveling plate near the second end of the base plate, and the second side retaining wall can limit the side of the leveling plate near the second end of the base plate.

[0015] Optionally, the thickness of the alignment frame is less than or equal to 0.3 mm.

[0016] Optionally, the alignment frame is made of stainless steel; and / or,

[0017] The material of the leveling plate is tempered glass.

[0018] The semiconductor product calibration device provided in the embodiment of the present application is beneficial to improving the flatness of the alignment frame and the plate-shaped semiconductor product during the calibration process, thereby improving the calibration efficiency, by arranging a flattening pressure plate on the alignment frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of an exploded view of a semiconductor product calibration device proposed according to an exemplary embodiment of the present application.

[0020] Figure 2 yes Figure 1 A three-dimensional assembly schematic diagram of a semiconductor product calibration device is shown.

[0021] Figure 3 yes Figure 2 A top view of a semiconductor product calibration device is shown.

[0022] Figure 4 yes Figure 2 A side view of a semiconductor product calibration apparatus is shown.

[0023] Figure 5 It is a schematic diagram of a partial structure of a semiconductor product calibration device proposed according to another exemplary embodiment of the present application. DETAILED DESCRIPTION

[0024] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0025] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The words "one" or "one" and the like used in this application specification and claims do not indicate a quantitative limitation, but indicate the existence of at least one. "Multiple" means two or more. "Including" or "including" and the like mean that the elements or objects appearing in front of "including" or "including" include the elements or objects listed after "including" or "including" and their equivalents, and do not exclude other elements or objects. "Connected" or "connected" and the like are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect. "On" and / or "below" and the like are only for the convenience of explanation, and are not limited to a position or a spatial orientation. The singular forms of "one", "said" and "the" used in this application specification and the attached claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0026] Quad Flat No-lead Package (QFN) products, especially smaller QFN products, are usually packaged together with multiple QFN products during packaging, and then separated to form a single QFN product. Due to the particularity of its packaging method, it is usually impossible to directly identify whether the position of the laser mark on the front is on the product, and it can only be confirmed after separation. However, if the problem of mark offset is found after separation, it is easy to cause the product to be scrapped. Therefore, it is necessary to provide a calibration device to calibrate the mark position of each QFN product after packaging and before segmentation.

[0027] Figure 1 This is a schematic diagram of an exploded view of a semiconductor product calibration device according to an exemplary embodiment of the present application. Figure 1 and, if necessary, combined Figures 2 to 5 As shown. The semiconductor product calibration device described in the present application can be used to calibrate and align plate-shaped semiconductor products. The semiconductor product calibration device includes a base plate 1, an alignment frame 2 and a flattening plate 3. The base plate 1 is used to place the semiconductor product. The alignment frame 2 is stacked on the semiconductor product to align the imprint of the semiconductor product. The flattening plate 3 is stacked on the alignment frame 2 to flatten the alignment frame 2.

[0028] In some embodiments, the alignment frame 2 is made of stainless steel. Compared with the alignment frame made of copper, the alignment frame 2 made of stainless steel is not easy to deform or damage, which is conducive to improving the life of the alignment frame.

[0029] Of course, the material of the alignment frame may also be other materials that can meet the strength requirements, and this application does not limit this.

[0030] The inventors have found through a large number of experiments that in some embodiments, the thickness of the alignment frame 2 can be set to be less than or equal to 0.3 mm. For example, 0.15 mm, 0.2 mm, etc. For example, the alignment frame 2 can be a stainless steel alignment frame less than or equal to 0.3 mm. Setting the alignment frame 2 within this thickness range is conducive to improving the accuracy of semiconductor product imprint calibration.

[0031] After a large number of experiments, the inventors found that in some embodiments, the material of the leveling plate 3 is tempered glass, which ensures that the alignment frame is flattened to improve the accuracy of calibration while reducing the occurrence of scratches and abrasions on the leveling plate 3.

[0032] It should be noted that the leveling plate 3 is a transparent structure to facilitate the inspection and calibration of the semiconductor product mark.

[0033] Furthermore, the semiconductor product calibration device includes a limiting component to fix and limit the alignment frame 2, the semiconductor product and the leveling plate 3.

[0034] Further, please combine Figures 2 to 4 As shown, in the length direction L of the semiconductor product calibration device, the base plate 1 has a first end 101 and a second end 102 opposite to each other. In some embodiments, the limiting assembly includes an installation limiting groove provided at the first end 101 of the base plate 1 and opening toward the second end 102 of the base plate 1, and the alignment frame 2, the semiconductor product and one end of the leveling plate 3 can be inserted into the installation limiting groove.

[0035] In some embodiments, a limiting structure is provided at the first end of the base plate 1. The limiting structure has a notch portion. The limiting structure is assembled on the upper surface of the first end of the base plate 1 and forms the installation limiting groove with the base plate 1 at the notch portion of the limiting structure.

[0036] In some embodiments, the limiting structure may include a first limiting member 4 and a second limiting member 5. The first limiting member 4 has a groove 41 that passes through the relative surface of the first structure 4 in the length direction L of the semiconductor product calibration device. The first limiting member 4 is fixed on the base plate 1, and can be specifically located on the upper surface of the base plate 1 close to the first end 101. The second limiting member 5 is provided at the outer end of the groove 41 (i.e., the end away from the second end 102 of the base plate 1) to partially or completely block the outer end of the groove 41, and form a notch portion of the limiting structure at the inner end of the groove 41 (which can be understood as the end close to the second end 102 of the base plate 1), so that the second limiting member 5, the first limiting member 4 and the base plate 1 jointly form the installation limiting groove at the notch portion.

[0037] It should be noted that the above-mentioned limiting structure can also be an integrally formed structural member. For example, the above-mentioned first limiting member 4 and the second limiting member 5 can be integrally formed to form a limiting structure. Of course. In other embodiments, the limiting structure can also be formed by other multiple structures, which is not limited in this application and can be set according to the specific application environment.

[0038] Further, the limiting assembly may include a first limiting block 61 and a second limiting block 62 disposed at the second end 102 of the bottom plate 1. The first limiting block 61 is provided with a limiting notch 611. The second limiting block 62 is provided with a limiting notch 621 opposite to the limiting block notch 611. The first limiting block 61 and the second limiting block 62 are relatively disposed at the second end 102 of the bottom plate 1, so that the limiting notch 611 of the first limiting block and the limiting notch 621 of the second limiting block 62 can limit the end of the leveling plate 3 close to the second end 102 of the bottom plate 1 and the side of the leveling plate 3 close to the second end 102 of the bottom plate 1.

[0039] The limiting notch 611 of the first limiting block 61 and the limiting notch 621 of the second limiting block 62 may be notch parts that match the corners of the flattening plate 3. Taking the flattening plate 3 as a rectangular structure as an example, the limiting notch parts 611 and 621 may be right-angled notches that match the right-angled corners of the rectangular flattening plate 3. It should be noted that the present application does not limit the specific shape of the limiting notch part, and it can be set according to the specific shape of the flattening plate.

[0040] Furthermore, the limiting assembly may also include a fixing assembly 7 rotatably disposed at the second end 102 of the base plate 1 to fix the leveling plate 3 , the alignment frame 2 , and the semiconductor product.

[0041] In some embodiments, the fixing assembly 7 includes a rotating shaft 71 rotatably disposed on the bottom plate 1, and a roller 72 is disposed on the outer cover of the rotating shaft 71. The rotating shaft 71 can be rotated to a fixed position for semiconductor product calibration (for example, Figure 4 701 shown). In this fixed position, the rolling wheel 72 can press against the flattening plate 3 to fix the flattening plate 3, the alignment frame 2, and the semiconductor product. The rotating shaft 71 can also rotate to the initial position (for example Figure 4 702 shown). At the initial position, the pressing plate 3 and the alignment frame 2 are leveled, and the semiconductor product can be stacked on the bottom plate 1 or taken out from the bottom plate 1.

[0042] Specifically, both ends of the rotating shaft 71 can be installed on both sides of the bottom plate through the rotating arms 73 and the rotating pins 74, so that the rotating shaft 71 can rotate with the rotating pins 74 as the rotating axis.

[0043] Two shorter rolling wheels 72 are arranged at intervals on the outer sleeve of the rotating shaft 71. The material of the rolling wheel 72 can be a flexible rolling piece of PU material to avoid scratching the tempered glass and to flexibly press the tempered glass. Of course, the rolling wheel can also be a flexible slow rolling piece formed by other flexible materials.

[0044] It should be noted that, for semiconductor products of different thicknesses, the fixing positions may be different.

[0045] Furthermore, the semiconductor product calibration device also includes a positioning pin 8. Since the alignment frame can be set as a thinner stainless steel alignment frame, the overall length of the positioning pin can be set relatively shorter. Of course, in some other embodiments, the length of the positioning pin may not be adjusted. The length of the positioning pin can be set according to specific needs, and the present application does not limit this. In some embodiments, the positioning root of the positioning pin 8 can be set relatively short. Correspondingly, the positioning tip of the positioning pin 8 can be set relatively long to facilitate the positioning of the semiconductor product, the alignment frame and the leveling plate, and to facilitate the assembly and removal of the alignment frame. It can be understood that the cross-sectional dimension of the positioning tip of the positioning pin mentioned here is smaller than the cross-sectional dimension of the positioning root.

[0046] Correspondingly, the bottom plate 1 is provided with a positioning hole 12 for installing the positioning pin 8. Correspondingly, the alignment frame 2 may also be provided with a frame positioning hole (not shown) corresponding to the positioning hole 12. The alignment frame 2 is positioned on the bottom plate 1 by the cooperation between the positioning pin 8, the positioning hole 12 and the frame positioning hole.

[0047] Figure 5 is a schematic diagram of the bottom plate and the limit assembly of the semiconductor product calibration device according to another exemplary embodiment of the present application. Figure 5 , and when necessary, combine Figures 1 to 4 As shown. Figure 5 As shown, in some other embodiments, the semiconductor product calibration device includes a base plate 1 ′. Figure 5 The semiconductor product calibration device shown above Figures 1 to 4 The difference between the semiconductor product calibration devices shown is mainly in the different ways of forming the limit grooves, and the specific structures of the fixing components of the two are also slightly different. Figure 5 The embodiment shown is similar to the above Figures 1 to 4 The similarities or similarities in the illustrated embodiments may be referred to the above related descriptions and will not be elaborated here.

[0048] The fixing assembly may include a rotating shaft 71' rotatably disposed on the bottom plate 1', and a rolling wheel 72' is disposed on the outer sleeve of the rotating shaft 71'; the rotating shaft 71' can be rotated to a fixed position (not shown) for calibrating the semiconductor product. In the fixed position, the rolling wheel 72' is pressed against the leveling plate 3 to fix the leveling plate 3, the alignment frame 2, and the semiconductor product; the rotating shaft 71' can be rotated to an initial position (not shown). In the initial position, the leveling plate 3, the alignment frame 2, and the semiconductor product can be stacked on the bottom plate 1 or taken out from the bottom plate 1. Similarly, for semiconductor products of different thicknesses, the fixed position may be different. Different from the above embodiment, the rolling wheel 72' is a longer rolling member.

[0049] The two ends of the rotating shaft 71' can be installed on both sides of the bottom plate through the rotating arm 73' and the rotating pin 74', so that the rotating shaft 71' can rotate with the rotating pin 74' as the rotating axis. Specifically, the rotating pin 74' is connected to the lower end of the rotating arm 73' through the rotating bearing 75', and the rotating shaft 71' is fixedly connected to the rotating arm 73' through the connecting piece 76'. Therefore, the rotating arm 73' can drive the rotating shaft 71' to rotate with the rotating pin 74' as the rotating axis.

[0050] Please refer to Figure 5 As shown in the figure, the limiting assembly is described. In this embodiment, the bottom plate 1' has a first end retaining wall 131' extending upward from the edge of the first end of the bottom plate 1', and a first side retaining wall 132' extending upward from the two sides of the bottom plate 1' close to the first end. The first end retaining wall 131' and the first side retaining wall 132' are provided with a mounting groove cover plate 4'. The mounting groove cover plate 4' is fixed to the first end retaining wall 131' by a connecting member 9', so as to form a mounting limiting groove together with the first end retaining wall 131' and the first side retaining wall 132'.

[0051] Furthermore, the bottom plate 1' has a second end retaining wall 141' extending upward from the edge of the second end of the bottom plate 1', and a second side retaining wall 142' extending upward from the two sides of the bottom plate 1' near the second end. The second end retaining wall 141' can limit the end of the leveling plate 3 near the second end of the bottom plate 1', and the second side retaining wall 142' can limit the side of the leveling plate 3 near the second end of the bottom plate 1.

[0052] In addition, a third side retaining wall 15' extending upward may also be provided in the middle of the side edge of the bottom plate 1', which is not limited in the present application.

[0053] In the present application, the structural embodiments and method embodiments may complement each other if they do not conflict.

[0054] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A semiconductor product calibration device, used for calibrating and aligning a plate-shaped semiconductor product, characterized in that: It includes a base plate, an alignment frame and a leveling plate; among which, A base plate, used for placing the semiconductor product; An alignment frame, stacked on the semiconductor product, for aligning the imprint of the semiconductor product; A flattening plate, stacked on the alignment frame to flatten the alignment frame; The semiconductor product calibration device includes a limiting assembly to fix and limit the alignment frame, the semiconductor product and the leveling plate; In the length direction of the semiconductor product calibration device, the base plate has a first end and a second end opposite to each other, the limiting assembly includes an installation limiting groove provided at the first end of the base plate and opening toward the second end of the base plate, and the alignment frame, the semiconductor product and one end of the leveling plate can be inserted into the installation limiting groove; The limiting assembly includes a fixing assembly rotatably disposed at the second end of the bottom plate to fix the leveling plate, the alignment frame, and the semiconductor product; The fixing assembly includes a rotating shaft rotatably arranged on the base plate, and a rolling wheel is arranged on the outer sleeve of the rotating shaft; the rotating shaft can be rotated to a fixed position for calibrating the semiconductor product, and at the fixed position, the rolling wheel is pressed against the leveling plate to fix the leveling plate, the alignment frame and the semiconductor product; the rotating shaft can be rotated to an initial position, and at the initial position, the leveling plate, the alignment frame and the semiconductor product can be stacked on the base plate or taken out from the base plate.

2. The semiconductor product calibration device according to claim 1, characterized in that: A limiting structure is provided at the first end of the base plate, wherein the limiting structure has a notch portion. The limiting structure is assembled on the upper surface of the first end of the base plate and forms the installation limiting groove with the base plate at the notch portion of the limiting structure.

3. The semiconductor product calibration device according to claim 1, characterized in that: The limiting assembly includes a first limiting block and a second limiting block arranged at the second end of the base plate, the first limiting block and the second limiting block are provided with relative limiting notches, the first limiting block and the second limiting block are relatively arranged at the second end of the base plate, so that the limiting notch of the first limiting block and the limiting notch of the second limiting block can limit the end of the leveling plate close to the second end of the base plate and the side of the leveling plate close to the second end of the base plate.

4. The semiconductor product calibration device according to claim 1, characterized in that: The base plate has a first end retaining wall extending upward from the edge of the first end of the base plate, and a first side retaining wall extending upward from the two side edges of the base plate close to the first end, and the first end retaining wall and the first side retaining wall are provided with an installation groove cover plate, and the first end retaining wall, the first side retaining wall and the installation groove cover plate jointly form the installation limit groove.

5. The semiconductor product calibration device according to claim 1, characterized in that: The base plate has a second end retaining wall extending upward from the edge of the second end of the base plate, and a second side retaining wall extending upward from the two side edges of the base plate close to the second end. The second end retaining wall can limit the end of the leveling plate close to the second end of the base plate, and the second side retaining wall can limit the side of the leveling plate close to the second end of the base plate.

6. The semiconductor product calibration device according to claim 1, characterized in that: The thickness of the alignment frame is less than or equal to 0.3 mm.

7. The semiconductor product calibration device according to claim 1, characterized in that: The alignment frame is made of stainless steel; and / or The material of the leveling plate is tempered glass.

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