Cooling devices and electronic equipment

Abstract

A cooling device includes a jet plate and a carrier plate, the carrier plate is provided with a receiving groove, a liquid inlet hole and a liquid outlet hole, the jet plate is arranged in the receiving groove, the jet plate is protruded with a plurality of nozzles, a diversion chamber is arranged between the jet plate and the carrier plate, the diversion chamber is connected with the liquid inlet hole, the liquid inlet hole is used for injecting cooling liquid, a reflux chamber for cooling liquid reflux is formed in the receiving groove, and the reflux chamber is separated from the diversion chamber, the liquid outlet hole is connected with the reflux chamber and is used for cooling liquid to flow out of the reflux chamber, the cooling liquid is distributed to the jet plate through the diversion chamber, and is sprayed into the reflux chamber through at least one nozzle for heat exchange, and the cooling liquid after heat exchange is gathered in the reflux chamber and flows out through the liquid outlet hole. The present application also provides an electronic device. By setting a diversion chamber and setting a nozzle on the jet plate, the jet of cooling liquid is realized with the help of the nozzle, the convective heat exchange effect is strong and the heat dissipation effect is good.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a cooling device and electronic equipment. Background Art

[0002] With the improvement of hardware integration in electronic equipment, the number of integrated chips and components on circuit boards continues to increase. During the operation of electronic equipment, chips and components will generate a lot of heat. In addition, the power of high-performance chips on circuit boards continues to increase, and the integration of single cabinets in the computer room where electronic equipment is placed continues to increase, resulting in an increase in the power density of single cabinets in the computer room, which makes the demand for cooling of electronic equipment in the computer room continue to increase. In order to avoid the impact of heat on chips and components, air-cooled radiators are usually used to simultaneously remove the heat from chips and auxiliary devices. The air-cooled radiators currently used cannot meet the growing demand for heat dissipation. Summary of the invention

[0003] In view of this, it is necessary to provide a cooling device and an electronic device with good cooling effect.

[0004] According to a first aspect of an embodiment of the present application, a cooling device is provided, comprising a jet plate and a carrier plate, wherein the carrier plate is provided with a receiving groove, a liquid inlet hole and a liquid outlet hole, the jet plate is arranged in the receiving groove, the jet plate is protruding with a plurality of nozzles, a diversion chamber is provided between the jet plate and the carrier plate, the diversion chamber is connected with the liquid inlet hole, the liquid inlet hole is used for injecting cooling liquid, a reflux chamber for reflux of cooling liquid is formed in the receiving groove, and the reflux chamber is separated from the diversion chamber, the liquid outlet hole is connected with the reflux chamber and is used for the cooling liquid to flow out of the reflux chamber, the cooling liquid is distributed to the jet plate through the diversion chamber, and is sprayed into the reflux chamber through at least one of the nozzles for heat exchange, and the cooling liquid after heat exchange converges in the reflux chamber and flows out through the liquid outlet hole.

[0005] The cooling device is provided with a flow diversion cavity between the jet plate and the carrier plate, and a nozzle is provided on the jet plate, so that the cooling liquid in the flow diversion cavity is sprayed by the nozzle, and the heat-generating unit is cooled by the strong convection heat exchange effect of the jet, and the heat exchange effect is good.

[0006] In a possible design of the first aspect, the nozzle extends from the jet plate to a side away from the carrier plate, the jet plate is provided with a spray hole, and the spray hole penetrates the jet plate and the nozzle. Through the extended nozzle and the spray hole provided therein, the cooling liquid in the diversion cavity can form a jet under the action of the driving force, thereby being sprayed onto the surface of the heating unit.

[0007] In a possible design of the first aspect, the carrier plate includes a top wall and a peripheral wall, the peripheral wall surrounds the top wall to form the accommodating groove, and the liquid inlet and the liquid outlet are both provided on the top wall.

[0008] In a possible design of the first aspect, the diversion cavity is arranged on the jet plate.

[0009] In a possible design of the first aspect, the diversion chamber includes a jet plate and a side wall surrounding the jet plate, one end of the side wall is in contact with the jet plate, and the other end is in contact with the top wall, and the liquid inlet hole passes through the area of ​​the top wall surrounded by the side wall.

[0010] In a possible design of the first aspect, the thickness of the injection wall is in the range of 1 mm to 2 mm.

[0011] In a possible design of the first aspect, the size of the port of the nozzle located in the diverter chamber is larger than the size of the port located in the return chamber. The design of different sizes at both ends can distribute the cooling liquid in the diverter chamber to the nozzle for easy spraying.

[0012] In a possible design of the first aspect, the nozzle hole is located in the middle of the nozzle. The centrally designed nozzle hole can facilitate the molding of the protruding nozzle during the metal injection molding (MIM) and injection molding processes.

[0013] In a possible design of the first aspect, the length of the nozzle extending out of the jet plate is in the range of 0.5 mm to 2 mm.

[0014] In a possible design of the first aspect, the aperture of the port of the nozzle located in the reflux chamber is in the range of 0.2 mm-1.5 mm.

[0015] In a possible design of the first aspect, the nozzles are evenly distributed on the jet plate. Evenly distributed nozzles are conducive to evenly distributing the cooling liquid to each nozzle.

[0016] In a possible design of the first aspect, the spray holes are provided on some of the nozzles, and the spray holes can be provided on the nozzles according to different heat outputs, so as to facilitate centralized cooling of high heat generation areas.

[0017] In a possible design of the first aspect, the jet plate is provided with nozzles of different sizes, and different numbers of nozzle holes are designed on the nozzles. The size of the nozzle can be designed according to the different heat generation of the heating unit, so that a large nozzle is arranged in a high heat generation area, and multiple nozzle holes are concentrated on it, which is conducive to reducing the spacing between the nozzle holes, thereby improving the cooling effect of the area.

[0018] In a possible design of the first aspect, the nozzle is cylindrical, prismatic, truncated cone or truncated pyramidal.

[0019] In a possible design of the first aspect, there is a gap between adjacent nozzles, and the gap forms a reflux channel for the cooling liquid after injection. The design of the reflux channel is conducive to the outflow of the cooling liquid after injection, thereby improving the overall efficiency of the cooling device.

[0020] In a possible design of the first aspect, the gap is arranged on the jet plate based on a flow topology. The shape and position of the nozzle can be set according to the flow topology, so as to reasonably optimize the reflow channel between the nozzles.

[0021] In a possible design of the first aspect, the nozzle is made by machining, injection molding, metal powder injection molding, or 3D printing. Different processing methods can obtain nozzles that can meet different injection requirements, so that they can be applied to electronic devices with different heat output.

[0022] In a possible design of the first aspect, the material of the nozzle is selected from metal or non-metallic material. Selecting the material of the nozzle according to the different injection and driving forces can increase the service life.

[0023] In a possible design of the first aspect, the jet plate is fixed to the carrier plate by welding, bonding, or screws. A variety of different fixing methods can be conveniently selected according to the size and requirements of the electronic device.

[0024] In a possible design of the first aspect, a sealing member is further provided between the jet plate and the carrier plate. The design of the sealing member can improve the sealing effect.

[0025] In a possible design of the first aspect, a flow equalizing plate is provided in the flow dividing chamber to equalize the flow of the cooling liquid entering the flow dividing chamber, thereby preventing uneven flow distribution.

[0026] In a possible design of the first aspect, the diverter cavity is arranged on the carrier plate. The diverter cavity arranged as required can facilitate different processing and assembly of the carrier plate and the jet plate.

[0027] A possible design of the first aspect is that the carrier plate includes a top wall, a peripheral wall and a side wall, the liquid inlet and the liquid outlet are respectively arranged on the top wall, the peripheral wall extends outward from the circumference of the top wall, the top wall and the peripheral wall surround the receiving groove, the side wall extends outward from the receiving groove of the top wall to form the diverter cavity around the top wall, and the side wall surrounds the liquid inlet, and the jet plate includes a jet wall, which is arranged on the side wall and seals the diverter cavity. It is convenient to uniformly manufacture the carrier plate, and different jet plates can be designed according to cooling needs, so as to improve production efficiency and flexibly design the cooling device.

[0028] In a possible design of the first aspect, the injection wall is arranged on the side wall through a sealing member. The design of the sealing member can improve the sealing effect.

[0029] A possible design of the first aspect is that the cooling device also includes a connecting pipe and a partition plate, one end of the connecting pipe is connected to the liquid inlet hole, and the other end is connected to a through hole provided on the partition plate, the diversion chamber includes the partition plate, the jet plate and a side wall surrounding the jet plate, and the partition plate, the top wall and the surrounding wall are enclosed to form the reflux chamber.

[0030] In a possible design of the first aspect, the connecting pipe is arranged on the top wall through a sealing member. The design of the sealing member can improve the sealing effect.

[0031] In a possible design of the first aspect, the connecting pipe is arranged on the top wall by welding. The welding connection can improve the sealing connection effect between the connecting pipe and the top wall.

[0032] In a possible design of the first aspect, the partition plate is further provided with a partition cavity, the partition cavity is communicated with the connecting pipe, and the flow diversion cavity is communicated with the partition cavity. The design of the partition cavity can increase the amount of cooling liquid contained, thereby improving the density and uniformity of the jet.

[0033] In a possible design of the first aspect, the jet plate is arranged on the partition plate via a sealing member. The design of the sealing member can improve the sealing effect.

[0034] In a possible design of the first aspect, the partition plate is integrally formed on the carrier plate, the flow diversion cavity is disposed on the partition plate, and the jet plate includes a jet wall, the jet wall is disposed on the partition plate and seals the flow diversion cavity. The integrally formed design allows for uniform manufacture of carrier plates, and for designing different jet plates according to cooling needs, thereby improving production efficiency and flexibly designing cooling devices.

[0035] According to a second aspect of an embodiment of the present application, an electronic device is provided, comprising a circuit board, a heating unit and a cooling device, wherein the heating unit is arranged on the circuit board, the cooling device is the cooling device of the first aspect and any possible design, the carrier plate is arranged on the circuit board, the heating unit is arranged in the reflux chamber, and the jet plate is arranged on a surface of the carrier plate facing the heating unit.

[0036] The electronic device has a simple structure and is easy to process. The heating unit is sealed in the reflux chamber. It only needs to provide a nozzle on the jet plate. With the help of the diversion chamber provided between the jet plate and the carrier plate, jet cooling of the heating unit can be achieved through the nozzle. The processing is convenient and the processing cost is reduced.

[0037] In a possible design of the second aspect, the carrier board is arranged on the circuit board through a sealing member. The design of the sealing member can improve the sealing effect.

[0038] In a possible design of the second aspect, there is a gap between the nozzle and the heating unit to form a jet cavity in the reflux cavity.

[0039] In a possible design of the second aspect, the distance between the nozzle and the heating unit is in the range of 0.2 mm to 1.5 mm.

[0040] In a possible design of the second aspect, a sputtering layer is provided on the heating unit, and the sputtering layer can achieve waterproof sealing of the heating unit and improve safety performance.

[0041] In a possible design of the second aspect, the sputtered layer is formed by sputtering on the surface of the heating unit.

[0042] In a possible design of the second aspect, the heating unit is further provided with a resin layer. The provision of the resin layer can improve the waterproof effect of the heating unit.

[0043] In a possible design of the second aspect, the cooling device further comprises a mounting frame, the mounting frame is arranged on the circuit board and surrounds the heating unit, and the carrier is arranged on the mounting frame. The mounting frame can be a metal reinforcement plate (stiffener reinforcement rib, ring, made of stainless steel or copper) provided by the heating unit (such as a chip, etc.) of the electronic device, or can be a separately arranged mounting frame, so as to be installed as needed.

[0044] In a possible design of the second aspect, the mounting frame is arranged on the circuit board through a sealing member to seal the heating unit in the reflow chamber. The design of the sealing member can improve the sealing effect.

[0045] In a possible design of the second aspect, the carrier plate is arranged on the mounting frame through a sealing member. The sealing effect can be improved by designing a sealing member such as an adhesive or an O-ring.

[0046] In a possible design of the second aspect, a mounting surface is provided on a side of the mounting frame away from the circuit board, and the carrier board is arranged on the mounting surface. The design of the mounting surface facilitates the installation of the cooling device and improves assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a three-dimensional schematic diagram of a cooling device provided in the first embodiment of the present application.

[0048] Figure 2 yes Figure 1 A perspective exploded view of the cooling device from another perspective.

[0049] Figure 3 yes Figure 1 A schematic cross-sectional structure diagram of the cooling device shown.

[0050] Figure 4 It is a schematic cross-sectional structure diagram of an electronic device provided in the second embodiment of the present application.

[0051] Figure 5 It is a three-dimensional schematic diagram of a cooling device provided in the third embodiment of the present application.

[0052] Figure 6 yes Figure 5 An exploded perspective schematic diagram of the cooling device shown.

[0053] Figure 7 yes Figure 5 A schematic cross-sectional structure diagram of the cooling device shown.

[0054] Figure 8 yes Figure 5 A three-dimensional schematic diagram of the jet plate of the cooling device shown.

[0055] Fig. 9 yes Figure 5 Another schematic perspective view of the jet plate of the cooling device shown.

[0056] Fig.10 It is a structural schematic diagram of the nozzle distribution of the jet plate.

[0057] Fig.11 It is a second structural schematic diagram of the nozzle distribution of the jet plate.

[0058] Fig.12 It is a third structural schematic diagram of the nozzle distribution of the jet plate.

[0059] Fig.13 It is a fourth structural schematic diagram of the nozzle distribution of the jet plate.

[0060] Fig.14 It is a fifth structural schematic diagram of the nozzle distribution of the jet plate.

[0061] Fig.15 It is a schematic cross-sectional structure diagram of an electronic device provided in the fourth embodiment of the present application.

[0062] Fig.16 It is a schematic cross-sectional structure diagram of an electronic device provided in the fifth embodiment of the present application.

[0063] Fig.17 It is a schematic cross-sectional structure diagram of an electronic device provided in the sixth embodiment of the present application.

[0064] Main component symbols

[0065] Cooling device 100, 300, 400, 600, 800, 903

[0066] Carrier board 10

[0067] Top wall 101

[0068] Peripheral wall 102

[0069] Liquid inlet hole 11

[0070] Liquid outlet 12

[0071] Accommodation groove 13

[0072] Jet cavity 131

[0073] Liquid inlet pipe 14

[0074] Liquid outlet pipe 15

[0075] Jet plate 20

[0076] Diverter cavity 21

[0077] Diverter hole 211

[0078] Nozzle 22

[0079] Nozzle 221

[0080] Jet Wall 23

[0081] Side wall 24

[0082] Seal 30

[0083] Divider plate 40

[0084] Connecting pipe 41

[0085] Communication hole 411

[0086] Partition chamber 42

[0087] Electronic equipment 200, 500, 700, 900

[0088] Circuit board 201

[0089] Heating unit 202

[0090] Mounting frame 203

[0091] Sputtered layer 204

[0092] Resin layer 205

[0093] Mounting surface 704

[0094] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0095] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0096] Hereinafter, if used, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more. Positional terms such as "upper", "lower", "left", and "right" are defined relative to the orientation of the components schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for description and clarification relative to the components, and may change accordingly according to changes in the orientation of the components placed in the accompanying drawings.

[0097] In this application, if used, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be fixed connection, detachable connection, or integrated; can be directly connected or indirectly connected through an intermediate medium. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.

[0098] When the following embodiments are described in detail in conjunction with schematic diagrams, for ease of explanation, the diagrams showing the local structures of the devices will not be partially enlarged according to the general scale, and the schematic diagrams are only examples and should not limit the scope of protection of this application.

[0099] Embodiment 1

[0100] like Figure 1-3 As shown, a cooling device 100 provided in the first embodiment of the present application is shown. The cooling device 100 is used to cool a heat generating unit, especially a high heat flux density chip or power device such as a CPU in an electronic device.

[0101] The cooling device 100 includes a carrier plate 10 and a jet plate 20. The jet plate 20 is disposed on the carrier plate 10. The carrier plate 10 is used for the inlet and outlet of cooling liquid. The jet plate 20 is used to form a jet of cooling liquid entering the cooling device 100 and spray it onto the heating unit, thereby cooling the heating unit.

[0102] A diverter cavity 21 is provided on one side of the jet plate 20 close to the carrier plate 10. The carrier plate 10 is provided with a liquid inlet hole 11 and a liquid outlet hole 12. The liquid inlet hole 11 is used for the injection of cooling liquid. The liquid outlet hole 12 is used for the outflow of the cooling liquid after injection. The diverter cavity 21 is connected with the liquid inlet hole 11. The diverter cavity 21 is used to receive the cooling liquid and distribute the cooling liquid to the jet plate 20. A plurality of nozzles 22 are protrudingly provided on the jet plate 20. The nozzles 22 are provided on one side of the jet plate 20 away from the carrier plate 10. The nozzles 22 are used to spray the cooling liquid in the diverter cavity 21 toward the heating unit to cool the heating unit.

[0103] The carrier plate 10 is provided with a receiving groove 13. The jet plate 20 is arranged in the receiving groove 13. A reflux cavity for reflux of cooling liquid is formed in the receiving groove 13. The reflux cavity is separated from the diversion cavity 21. The liquid outlet 12 is connected to the reflux cavity. The liquid outlet 12 is used for the cooling liquid that flows into the reflux cavity after being sprayed from the nozzle 22 to flow out. The reflux cavity can seal the sprayed cooling liquid to prevent it from flowing out from other parts of the carrier plate 10.

[0104] The carrier plate 10 includes a top wall 101 and a peripheral wall 102. The peripheral wall 102 extends outward from the circumference of the top wall 101 perpendicular to the top wall 101. The peripheral wall 102 surrounds the top wall 101 to form a receiving groove 13. The liquid inlet 11 and the liquid outlet 12 are both disposed on the top wall 101.

[0105] The jet plate 20 includes a jet wall 23. The diversion chamber 21 includes the jet wall 23 and a side wall 24 surrounding the jet wall 23. The side wall 24 is perpendicular to the jet wall 23. The jet wall 23 and the side wall 24 are integral. One end of the side wall 24 contacts the jet plate 20, and the other end contacts the top wall 101. The liquid inlet 11 passes through the area of ​​the top wall 101 surrounded by the side wall 24. The liquid outlet 12 passes through the area of ​​the top wall 101 not surrounded by the side wall 24. The area of ​​the area surrounded by the side wall 24 on the top wall 101 is smaller than the area of ​​the top wall 101.

[0106] A liquid inlet pipe 14 and a liquid outlet pipe 15 are provided on a side of the carrier plate 10 away from the accommodating groove 13. The liquid inlet hole 11 is connected to the liquid inlet pipe 14. The liquid outlet hole 12 is connected to the liquid outlet pipe 15. The liquid inlet pipe 14 is used to communicate with an external cooling liquid delivery pipeline. The liquid outlet pipe 15 is used to communicate with an external cooling liquid recovery pipeline.

[0107] The nozzle 22 extends from the injection wall 23 to a side away from the carrier 10. The injection wall 23 is provided with a spray hole 221. The spray hole 221 penetrates the injection wall 23 and the nozzle 22 to connect the diverter cavity 21 and the reflux cavity. The spray hole 221 is used to spray the cooling liquid in the diverter cavity 21 onto the surface of the heat generating unit under power drive, so that the surface of the heat generating unit impacted produces a strong heat exchange effect.

[0108] There is a gap between two adjacent nozzles 22 , and the gap forms a reflux channel for the cooling liquid to reflux after being sprayed.

[0109] When in use, the carrier board 10 is arranged on the electronic device, and the heating unit is sealed in the reflux chamber. The cooling liquid flows into the liquid inlet hole 11 through the liquid inlet pipe 14, enters the diverter chamber 21, and is distributed to each nozzle hole 221 located on the injection wall 23 in the diverter chamber 21. Subsequently, driven by an external driving force (such as a pump), the cooling liquid distributed to the nozzle holes 221 is respectively sprayed to the surface of the heating unit through the nozzle holes 221, thereby contacting and impacting the surface of the heating unit, and generating a strong convection heat exchange effect with the area directly impacted, absorbing the heat of the heating unit. Subsequently, part of the sprayed cooling liquid is blocked by the surface of the heating unit and returns to the direction of the jet plate 20, and in the process of returning, it flows out of the jet plate 20 from the gap between the nozzles 22 to the surroundings of the heating unit, and the remaining cooling liquid flows directly from the surface of the heating unit to the surroundings of the heating unit. Finally, the cooling liquid flowing to the surroundings of the heating unit is gathered and flows from the liquid outlet hole 12 to the liquid outlet pipe 15, and then is sent out of the cooling device 100 to complete the cooling of the heating unit.

[0110] The nozzle 22 of the jet plate 20 is manufactured by machining, injection molding, metal powder injection molding, 3D printing, etc. The material of the nozzle 22 can be selected from metal or non-metal materials.

[0111] The thickness of the jet wall 23 of the jet plate 20 is in the range of 1 mm to 2 mm, and preferably, the thickness of the jet wall 23 is 1.5 mm. The length of the nozzle 22 extending from the jet wall 23 is in the range of 0.5 mm to 2 mm, and preferably, the extension length of the nozzle 22 is 1 mm. The aperture of the spray hole 221 is in the range of 0.2 mm to 1.5 mm, and preferably, the aperture of the spray hole 221 is 0.35 mm.

[0112] The nozzle 22 may be cylindrical, prism-shaped, truncated cone-shaped, prism-shaped, etc. When the nozzle 22 is cylindrical, the wall thickness of the nozzle 22 is in the range of 0.15 mm-0.25 mm, preferably, the wall thickness of the nozzle 22 is 0.2 mm. When the nozzle 22 is a quadrangular prism, the wall thickness of the nozzle 22 is in the range of 0.15 mm-0.35 mm, preferably, the wall thickness of the nozzle 22 is 0.25 mm.

[0113] The end of the spray hole 221 close to the diverter chamber 21 is further formed with a diverter hole 211. The aperture of the diverter hole 211 is larger than the aperture of the opening of the end of the spray hole 221 close to the return chamber, that is, the size of the port of the nozzle 22 located in the diverter chamber 21 is larger than the size of the port located in the return chamber. The diverter hole 211 is used to converge the cooling liquid in the diverter chamber 21 to the spray hole 221, so as to facilitate the spraying of the nozzle 22.

[0114] In one embodiment, the diverter hole 211 is roughly conical. The diverter hole 211 can also be cylindrical, prism-shaped, prism-shaped, etc. Preferably, the spray hole 221 is located in the middle of the diverter hole 211. The centrally designed spray hole can facilitate the molding of the protruding nozzle during the metal powder injection molding technology (Metal Injection Molding, MIM) and injection molding (InjectionMolding) process.

[0115] In one embodiment, the jet plate 20 is fixed to the carrier plate 10 by welding, bonding, screw connection, etc.

[0116] In one embodiment, a sealing member such as a sealant or a sealing ring is further disposed between the jet plate 20 and the carrier plate 10 to prevent the cooling liquid from flowing out from between the jet plate 20 and the carrier plate 10 .

[0117] In one embodiment, a flow equalizing plate (not shown) may be further provided in the flow dividing chamber 21 to equalize the flow of the cooling liquid entering the flow dividing chamber 21 and then flow it into each nozzle 22 to prevent uneven flow distribution.

[0118] The cooling device 100 has a simple structure. A diverter cavity 21 is provided on the jet plate 20, and a receiving groove 13 is provided on the carrier plate 10. A nozzle 22 with a spray hole 221 is provided on the side of the jet plate 20 facing away from the carrier plate 10. A reflux channel is formed by means of the gap between the nozzles 22, and the reflux cavity formed by the receiving groove 13 and the heating unit is used to realize the reflux and outflow of the cooling liquid. The cooling liquid in the diverter cavity 21 is sprayed toward the heating unit by means of the nozzle 22. The strong convection heat exchange effect of the jet is strong, the heat dissipation effect is good, the processing precision requirement is low, the installation is simple, the processing is convenient, and the processing cost is reduced.

[0119] In the specific implementation of the present application, the cooling liquid may be cooling water, or other cooling liquids suitable for heating units, especially for electronic devices, such as electronic fluorinated liquid or other liquid coolants.

[0120] Embodiment 2

[0121] like Figure 4 As shown, an electronic device 200 provided in a second embodiment of the present application is provided with a cooling device 300 .

[0122] Specifically, the electronic device 200 includes a circuit board 201, a heating unit 202, a mounting frame 203, and a cooling device 300. The heating unit 202 is disposed on the circuit board 201. The mounting frame 203 is disposed on the circuit board 201 and surrounds the heating unit 202. The carrier 10 of the cooling device 300 is disposed on the mounting frame 203. The jet plate 20 of the cooling device 300 is disposed on a surface of the carrier 10 adjacent to the heating unit 202.

[0123] The cooling device 300 and Figure 1 The main difference of the cooling device 100 in the first embodiment is that the diverter cavity 21 is arranged on the carrier plate 10 .

[0124] Specifically, the diverter cavity 21 includes a top wall 101 and a side wall 24 surrounding the top wall 101. The side wall 24 extends downward from the receiving groove 13 of the top wall 101 perpendicular to the top wall 101. The jet plate 20 is generally in the shape of a flat plate and includes an injection wall 23. The injection wall 23 is disposed on the side wall 24 and seals the diverter cavity 21.

[0125] In one embodiment, the side wall 24 is separated from the injection wall 23, and the side wall 24 is integrated with the carrier 10. The injection wall 23 is arranged on the side wall 24 through a sealing member 30 such as a sealant or an O-ring to seal the diversion chamber 21.

[0126] In one embodiment, the nozzle 22 of the spray wall 23 is opposite to the heating unit 202 .

[0127] There is a gap between the nozzle 22 and the heating unit 202 to form a jet cavity 131 for jet in the reflux cavity formed by the accommodating groove 13. The jet cavity 131 is used for the cooling liquid sprayed from the spray hole 221 to be sprayed toward the heating unit 202 for heat exchange, thereby taking away the heat on the heating unit 202.

[0128] Specifically, the distance between the nozzle 22 and the heating unit, that is, the thickness of the jet cavity 131 (jet height Height or jet gap gap) ranges from 0.2 mm to 1.5 mm. Preferably, the distance is 0.5 mm.

[0129] In one embodiment, the heat generating unit 202 may be a high heat flux density chip or power device such as a CPU. The circuit board 201 is a substrate of a power device such as a chip.

[0130] In one embodiment, the heating unit 202 is soldered on the circuit board 201 and is electrically connected to the circuit board 201 .

[0131] In one embodiment, the surface of the heating unit 202 may be processed by sputtering metal or other materials (such as SiN) to form a sputtering layer 204 (Sputtering), and the sputtering layer 204 may seal the heating unit 202 to achieve a waterproof effect.

[0132] In one embodiment, the heating unit 202 may be filled or coated with epoxy resin to form a resin layer 205 between the heating unit 202 and the mounting frame 203 , thereby improving the waterproof effect of the heating unit 202 .

[0133] The mounting frame 203 may be a metal reinforcement plate (stiffener rib, ring, made of stainless steel or copper) of the heat generating unit (such as a chip, etc.) of the electronic device 200. In one embodiment, the mounting frame 203 may also be a separately provided frame for installing a cooling device.

[0134] In one embodiment, the mounting frame 203 can be sealed on the circuit board 201 on which the heating unit 202 is mounted by a sealing member 30 such as a sealant or an O-ring, thereby cooperating with the peripheral wall 102 to seal the heating unit 202 in the reflow chamber.

[0135] In one embodiment, the peripheral wall 102 is mounted on the mounting frame 203 by adhesive bonding or a sealing member 30 such as an O-ring.

[0136] The electronic device 200 has a simple structure, and the carrier board 10 is integrally formed for ease of processing. It only requires a nozzle 22 with a spray hole 221 to be provided on the jet plate 20, and the heating unit 202 to be sealed in the reflux chamber with the aid of a seal 30. The nozzle 22 can then be used to achieve jet cooling of the heating unit 202, which facilitates processing and reduces processing costs.

[0137] Embodiment 3

[0138] like Figure 5-7 As shown, a cooling device 400 is provided in the third embodiment of the present application.

[0139] and Figure 1 The main difference of the cooling device 100 in the first embodiment is that the cooling device 400 further includes a partition plate 40. The partition plate 40 is disposed in the accommodating groove 13 and is located on the side of the diverter cavity 21 close to the top wall 101. The partition plate 40, the jet plate 20 and the side wall 24 enclose the diverter cavity 21, and the partition plate 40, the top wall 101 and the peripheral wall 102 enclose the reflux cavity. The partition plate 40 separates the diverter cavity 21 from the top wall 101, so that the liquid outlet 12 and the liquid outlet pipe 15 can be flexibly disposed on the top wall 101.

[0140] Specifically, the cooling device 400 further includes a connecting pipe 41 . The connecting pipe 41 is provided with a connecting hole 411 , one end of the connecting pipe 41 is connected to the liquid inlet hole 11 , and the other end of the connecting pipe 41 is connected to a through hole provided on the partition plate 40 .

[0141] In one embodiment, a partition cavity 42 is further provided on the partition plate 40. The partition cavity 42 is communicated with the communication hole 411. The jet plate 20 is provided on the partition plate 40 and the flow dividing cavity 21 is communicated with the partition cavity 42.

[0142] In one embodiment, the connecting pipe 41 is installed on the carrier 10 by screws, and the connecting pipe 41 is sealed with the top wall 101 by a seal 30. The connecting pipe 41 can also be installed on the top wall 101 by welding to achieve connection and sealing with the carrier 10.

[0143] In one embodiment, the jet plate 20 is mounted on the partition plate 40 by screws and is sealed with the partition plate 40 by a seal 30 .

[0144] In one embodiment, the carrier board 10 is disposed on the electronic device via a sealing member 30 .

[0145] The cooling device 400 has a simple structure. A partition plate 40 is added to separate the diversion chamber 21 from the top wall 101 in the accommodating groove 13, so that the liquid outlet hole 12 and the liquid outlet pipe 15 can be arranged at any position of the top wall 101 of the carrier plate 10, which is convenient for flexible design of the liquid outlet pipe 15 and can improve the problem of uneven flow caused by the offset of the cooling liquid outlet position.

[0146] In one embodiment, see Figure 8 The nozzles 22 can be evenly distributed on the spray wall 23, and each nozzle 22 is provided with the spray hole 221. Fig. 9 As shown, it is also possible to open a spray hole 221 on some of the nozzles 22, or after all the nozzles 22 have opened the spray holes 221, some of the spray holes 221 can be sealed by fillers such as sealants, so that the positions of the spray holes 221 on the injection wall 23 can be flexibly set, thereby allowing the positions of the spray holes 221 to be selectively set on the jet plate 20 according to the different heat generated by the heating unit.

[0147] In one embodiment, see Figure 10-11 The nozzle 22 may be a uniformly distributed cylindrical, prism-shaped, truncated cone-shaped, prism-shaped, etc. At this time, preferably, the spray hole 221 is arranged in the middle of the nozzle 22. The nozzles 22 of different shapes may also be mixed and arranged on the spray wall 23.

[0148] In one embodiment, if Fig.12 As shown, the gaps between the nozzles 22 can also be set to a strip shape, a wave shape, etc. according to the flow topology. At this time, a plurality of spray holes 221 can be set on one nozzle 22 as needed.

[0149] In one embodiment, see Fig.13 The position of the nozzle 22 can also be designed according to the heat generation of the heating unit. For example, when the heating unit is a chip, different numbers of nozzle holes 221 can be designed according to the power map of the chip. In this case, the nozzle holes 221 can be set on each of the nozzles 22.

[0150] In one embodiment, see Fig.14The nozzle 22 can also be designed according to the heat generated by the heat generating unit. For example, nozzles 22 of different sizes can be designed according to the distribution of the power area of ​​the chip. In this case, different numbers of nozzle holes 221 can be designed on different nozzles 22. In this case, since multiple nozzle holes 221 are opened on one nozzle 22, the spacing between the nozzle holes 221 can be set smaller, so that more nozzle holes 221 can be distributed in the high power density area, so as to achieve strong cooling of the high power density area.

[0151] By flexibly designing the nozzle 22 and the spray hole 221, the heat dissipation requirements of different heating units can be met, thereby improving the cooling efficiency of the cooling liquid.

[0152] Embodiment 4

[0153] like Fig.15 As shown, an electronic device 500 provided in a fourth embodiment of the present application is provided with a cooling device 600 .

[0154] The cooling device 600 and Figure 5 The main difference of the cooling device 400 in the third embodiment is that the partition plate 40 and the connecting pipe 41 are integrated with the carrier plate 10. The flow dividing chamber 21 is arranged on the partition plate 40.

[0155] Specifically, the flow dividing chamber 21 includes a partition plate 40 and a side wall 24 surrounding the partition plate 40. The jet plate 20 includes an injection wall 23. The injection wall 23 is disposed on the side wall 24 and seals the flow dividing chamber 21.

[0156] The electronic device 500 adopts the carrier board 10 of integrated design, so the position of the liquid pipe 15 can be flexibly designed. Meanwhile, different jet plates 20 can be selected according to different heating units 202 .

[0157] Embodiment 5

[0158] like Fig.16 FIG. 1 is an electronic device 700 provided in the fifth embodiment of the present application. The electronic device 700 includes a circuit board 201 , a heating unit 202 , a mounting frame 203 , and a cooling device 800 disposed on the mounting frame 203 .

[0159] and Figure 4 The difference of the electronic device 200 in the second embodiment is that the carrier board 10 of the cooling device 800 omits the peripheral wall 102. The top wall 101 is directly arranged on the mounting frame 203. The mounting frame 203, the circuit board 201 and the top wall 101 enclose the receiving groove 13.

[0160] Specifically, the thickness of the mounting frame 203 is thicker in the direction away from the circuit board 201, and a mounting surface 704 is provided on the side of the mounting frame 203 away from the circuit board 201. The top wall 101 is provided on the mounting surface 704. In one embodiment, the mounting surface 704 is a groove formed by the top surface of the mounting frame 203 being recessed toward the circuit board.

[0161] In one embodiment, the carrier board 10 can be fixed to the mounting frame 203 by means of fixing members such as screws. A sealing member such as a sealant or a sealing ring is also provided between the mounting frame 203 and the carrier board 10 for sealing.

[0162] In one embodiment, the wall surface of the mounting frame 203 is also relatively thick, so that the carrier board 10 can be easily fixed by screws or the like, and sealed by a sealing ring or the like.

[0163] The electronic device 700 changes the structure of the mounting frame 203 and sets the mounting frame 203 higher, thereby simplifying the design of the carrier 10. The carrier 10 can be conveniently set on the top of the mounting frame 203 by means of screws and other fixings. In addition, the carrier 10 does not have a peripheral wall 102, so the jet plate 20 can be protruded from the carrier 10 to facilitate subsequent installation and replacement.

[0164] Embodiment 6

[0165] like Fig.17 , an electronic device 900 provided in the sixth embodiment of the present application is shown. The electronic device 900 comprises a circuit board 201 , a heating unit 202 and a cooling device 903 disposed on the circuit board 201 .

[0166] and Figure 4 The difference between the electronic device 200 in the second embodiment is that the electronic device 900 omits the mounting frame, and the carrier board 10 of the cooling device 903 is directly arranged on the circuit board 201 .

[0167] Specifically, the peripheral wall 102 of the carrier plate 10 on the cooling device 903 extends a long distance away from the top wall 101 , and a side of the peripheral wall 102 away from the top wall 101 is disposed on the circuit board 201 .

[0168] The peripheral wall 102 of the carrier plate 10 is also thicker than the peripheral wall 102 of the carrier plate 10 in the third embodiment, so as to provide sufficient strength to realize the function of the mounting frame.

[0169] In one embodiment, a sealing member 30 such as a sealant or a sealing ring is provided between the circuit board 201 and the peripheral wall 102 of the carrier board 10 for sealing.

[0170] The cooling device 903 has a simple structure, is easy to process and convenient to install. The electronic device 900 does not require a mounting frame and can be directly set on the circuit board 201 through the carrier plate 10 of the cooling device 903, which can reduce processing costs and improve heat dissipation efficiency.

[0171] It can be understood that the diverter cavity 21 can be arranged on the carrier plate 10, the jet plate 20, the partition plate 40 as needed, or formed by the carrier plate 10 and the jet plate 20, or by the partition plate 40 and the jet plate 20.

[0172] It can be understood that the jet plate 20 in the cooling device of the present application can also cool multiple heating units, and it is only necessary to seal the multiple heating units in the same reflux cavity at the same time and make the nozzles 22 on the jet plate 20 correspond to the corresponding heating units.

[0173] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the disclosure scope of the present application.

Claims

1. A cooling device (100), characterized in that: The device comprises a jet plate (20) and a carrier plate (10), wherein the carrier plate (10) comprises a top wall (101) and a peripheral wall (102), wherein the peripheral wall (102) surrounds the top wall (101) to form a receiving groove (13), wherein the receiving groove (13) is used to receive a heating unit (202), wherein a side of the heating unit facing the carrier plate is completely exposed in the receiving groove, and the top wall (101) is provided with a liquid inlet hole (11) and a liquid outlet hole (12); The jet plate (20) is arranged in the accommodating groove (13), the jet plate (20) is protrudingly provided with a plurality of nozzles (22), the jet plate (20) and the side wall (24) surrounding the jet plate (20) and the top wall (101) are enclosed to form a flow diversion cavity (21), or the jet plate (20) and the side wall (24) surrounding the jet plate (20) and the partition plate (40) are enclosed to form the flow diversion cavity (21); The diverter cavity (21) is in communication with the liquid inlet hole (11), the liquid inlet hole (11) is used to inject cooling liquid, a reflux cavity for cooling liquid reflux is formed in the accommodating groove (13), and the reflux cavity is separated from the diverter cavity, the liquid outlet hole (12) is in communication with the reflux cavity and is used for cooling liquid to flow out of the reflux cavity, the cooling liquid is distributed to the jet plate (20) through the diverter cavity (21), and is sprayed into the reflux cavity through at least one nozzle (22) for heat exchange, and the cooling liquid after heat exchange is gathered in the reflux cavity and flows out through the liquid outlet hole (12).

2. The cooling device according to claim 1, characterized in that The flow dividing chamber (21) comprises the jet plate (20) and the side wall (24) surrounding the jet plate (20); one end of the side wall (24) is in contact with the jet plate (20), and the other end is in contact with the top wall (101); the liquid inlet hole (11) passes through the area of ​​the top wall (101) surrounded by the side wall (24).

3. The cooling device according to claim 1, characterized in that: The size of the port of the nozzle (22) located in the diversion chamber (21) is larger than the size of the port located in the reflux chamber.

4. The cooling device according to claim 1, characterized in that: The jet plate (20) is provided with nozzles (22) of different sizes, and the nozzles (22) are designed with different numbers of spray holes (221).

5. The cooling device according to claim 1, characterized in that: There is a gap between two adjacent nozzles (22), and the gap forms a reflux channel for the cooling liquid to reflux after being sprayed.

6. The cooling device according to claim 5, characterized in that: The gap is arranged on the jet plate (20) based on the flow topology.

7. The cooling device according to claim 1, characterized in that: A flow equalizing plate is provided in the flow dividing chamber (21) to equalize the flow of the cooling liquid entering the flow dividing chamber (21).

8. The cooling device according to claim 2, characterized in that: The cooling device (100) further comprises a connecting tube (41) and the partition plate (40), one end of the connecting tube (41) being connected to the liquid inlet hole (11), and the other end being connected to a through hole provided on the partition plate (40), the diversion chamber (21) comprising the partition plate (40), the jet plate (20) and a side wall (24) surrounding the jet plate (20), and the partition plate (40) and the top wall (101) and the peripheral wall (102) enclose the reflux chamber.

9. An electronic device (200), characterized in that: include: Circuit board (201), a heating unit (202), the heating unit (202) being arranged on the circuit board (201), and The cooling device (100) according to any one of claims 1 to 8, wherein the carrier plate (10) is arranged on the circuit board (201), the heating unit (202) is arranged in the reflow cavity, and the jet plate (20) is arranged on a surface of the carrier plate (10) facing the heating unit (202).

10. The electronic device according to claim 9, characterized in that: There is a gap between the nozzle (22) and the heating unit (202) to form a jet cavity (131) in the reflow cavity.

11. The electronic device according to claim 9, characterized in that: A sputtering layer (204) is provided on the heating unit (202).

12. The electronic device according to claim 9, characterized in that: The electronic device (200) further comprises a mounting frame (203), wherein the mounting frame (203) is arranged on the circuit board (201) and surrounds the heating unit (202), and the carrier board (10) is arranged on the mounting frame (203).

Images