Infrared temperature sensing device and infrared temperature measuring module thereof
By adopting reverse electrical series and specific light band processing design in infrared temperature sensing devices, the problems of inconvenient temperature measurement products and thermal energy interference are solved, and high-precision temperature measurement is achieved and easy to integrate into Other equipment.
Patent Information
- Application Number
- CN202011166245.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-10-21
- Filing Date
- 2020-10-27
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2040-10-27
AI Technical Summary
Existing temperature measurement products (such as forehead thermometers) are usually used independently, not convenient to carry around, and are difficult to integrate in other equipment without being affected by thermal energy interference.
An infrared temperature sensing device is designed, which includes a base, a sensing component, a reflection compensation sensing component and a shield compensation sensing component to reduce the external through reverse electrical connection and reflection and absorption of a specific light band. Thermal energy interference improves measurement accuracy.
It effectively reduces the impact of external thermal energy on temperature sensing, improves temperature measurement accuracy, and can integrate the device into other devices such as smartphones.
Smart Images
Figure CN114459607B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a temperature sensing device, and more particularly to an infrared temperature sensing device and an infrared temperature measuring module thereof. Background Art
[0002] Today's living environment is full of various infectious diseases, and the symptoms of many infectious diseases are initially judged by body temperature (such as coronavirus). However, existing body temperature measurement products (such as forehead thermometers) are all independent products and are usually not carried with people. Therefore, it is very inconvenient when you need to confirm your body temperature temporarily. Therefore, how to integrate the existing temperature measurement device into other equipment without being affected by the heat energy generated by the equipment has become one of the important issues today.
[0003] Therefore, the applicant believes that the above defects can be improved, and has devoted himself to research and applied scientific principles, and finally proposed an application that is reasonably designed and effectively improves the above defects. Summary of the invention
[0004] The embodiments of the present application provide an infrared temperature sensing device and an infrared temperature measuring module thereof, which can effectively improve the defects that may occur in the existing infrared temperature sensing device.
[0005] According to one aspect of the present application, an embodiment of the present application discloses an infrared temperature sensing device, which includes: an infrared temperature measurement module, including: a base, including a first seat surface and a second seat surface located on opposite sides; a sensing component, installed on the base and including: M sensing components, any one of which includes a first carrier installed on the first seat surface, a first sensing layer formed on the first carrier, and an absorption layer formed on the first sensing layer; N1 reflection-type compensation sensing components, any one of which includes a second carrier installed on the first seat surface, a second sensing layer formed on the second carrier, and a reflection layer formed on the second sensing layer; and N2 shielding-type compensation sensing components, any one of which includes a third carrier installed on the first seat surface, a third sensing layer formed on the third carrier, an absorption layer formed on the third sensing layer, and a shielding sheet formed next to the third sensing layer; wherein, M , N1, and N2 are positive integers, N1 compensation sensing components and N2 reflection-type compensation sensing components are reversely electrically connected in series with M sensing components, and the reflection layer can be used to reflect the light band suitable for absorption by the absorption layer, and the shielding film can be used to shield the light band suitable for absorption by the absorption layer; a metal cover is arranged on the first seat surface of the base to jointly surround and form a accommodating space; wherein the M sensing components, N1 reflection-type compensation sensing components, and N2 shielding-type compensation sensing components are all located in the accommodating space, and the infrared temperature measurement module is not provided with any signal processing components in the accommodating space; wherein the metal cover is formed with a through hole connected to the accommodating space, and when the metal cover is projected toward the sensing component, a projection area corresponding to the through hole falls on the first sensing layer of at least one sensing component; and a filter is installed on the metal cover and covers the through hole, so as to make the wavelength of the light passing through the filter and the through hole suitable for absorption by the absorption layer.
[0006] Optionally, the M sensing components are arranged in X rows along a first direction and in Y columns along a second direction perpendicular to the first direction, and X and Y are positive integers greater than 1; the N1 reflective compensation sensing components are located on one side of the M sensing components, and the N2 shielding compensation sensing components are located on the other side of the M sensing components.
[0007] Optionally, the M sensing components are arranged together with the N1 reflective compensation sensing components and the N2 shielding compensation sensing components in a matrix arrangement of X rows and Y+2 columns; the N1 reflective compensation sensing components are the first column in the matrix arrangement, and the N2 shielding compensation sensing components are the last column in the matrix arrangement.
[0008] Optionally, the M sensing components are arranged together with the N1 reflective compensating sensing components in a first matrix arrangement of X rows and Y+1 columns; and the M sensing components are arranged together with the N2 shielding compensating sensing components in a second matrix arrangement of X+1 rows and Y columns.
[0009] Optionally, the first carrier of the M sensing components is a one-piece structure integrally formed with the second carrier of the N1 reflective compensation sensing components and / or the third carrier of the N2 shielding compensation sensing components.
[0010] Optionally, the M sensing components, N1 reflective compensation sensing components, and N2 shielding compensation sensing components are all spaced apart from each other, and the N1 reflective compensation sensing components and the N2 shielding compensation sensing components are reversely electrically connected in series with the M sensing components through metal bonding wires.
[0011] Optionally, the infrared temperature sensing device is further defined to be installed in a mobile device of a smart phone.
[0012] According to another aspect of the present application, the embodiment of the present application also discloses an infrared temperature measurement module of an infrared temperature sensing device, which includes: a base, including a first seat surface and a second seat surface located on opposite sides; and a sensing component installed on the base and including: M sensing components, any one of which includes a first carrier installed on the first seat surface, a first sensing layer formed on the first carrier, and an absorption layer formed on the first sensing layer; N1 reflection-type compensation sensing components, any one of which includes a second carrier installed on the first seat surface, a second sensing layer formed on the second carrier, and a reflection layer formed on the second sensing layer; and N2 shielding-type compensation sensing components, any one of which includes a first carrier installed on the first seat surface, a second sensing layer formed on the second carrier, and a reflection layer formed on the second sensing layer. A third carrier, a third sensing layer formed on the third carrier, an absorption layer formed on the third sensing layer, and a shielding film formed next to the third sensing layer; wherein M, N1, and N2 are positive integers greater than 1, N1 compensation sensing components and N2 reflection-type compensation sensing components are reversely electrically connected in series with the M sensing components, and the reflection layer can be used to reflect the light band suitable for absorption by the absorption layer, and the shielding film can be used to shield the light band suitable for absorption by the absorption layer; the M sensing components are arranged in X rows along a first direction and in Y columns along a second direction perpendicular to the first direction, and X and Y are positive integers greater than 1; the N1 reflection-type compensation sensing components are located on one side of the M sensing components, and the N2 shielding-type compensation sensing components are located on the other side of the M sensing components.
[0013] Optionally, the M sensing components are arranged together with the N1 reflective compensation sensing components and the N2 shielding compensation sensing components in a matrix arrangement of X rows and Y+2 columns; the N1 reflective compensation sensing components are the first column in the matrix arrangement, and the N2 shielding compensation sensing components are the last column in the matrix arrangement.
[0014] Optionally, the M sensing components are arranged together with the N1 reflective compensating sensing components in a first matrix arrangement of X rows and Y+1 columns; and the M sensing components are arranged together with the N2 shielding compensating sensing components in a second matrix arrangement of X+1 rows and Y columns.
[0015] In summary, the infrared temperature sensing device and the infrared temperature measurement module disclosed in the embodiment of the present application can effectively reduce the influence of external heat energy by connecting M sensing components, N1 reflective compensation sensing components, and N2 shielding compensation sensing components in reverse electrical series, thereby improving the measurement accuracy of the temperature measurement components.
[0016] Furthermore, the infrared temperature sensing device and the infrared temperature measurement module disclosed in the embodiments of the present application can effectively improve the measurement accuracy of the temperature measurement component by limiting specific conditions (such as: the reflective layer can be used to reflect the light band that the absorption layer is suitable for absorbing, the shielding plate can be used to shield the light band that the absorption layer is suitable for absorbing, and the filter is used to make the light band passing through the filter and the perforation suitable for absorption by the absorption layer).
[0017] To further understand the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, such description and drawings are only used to illustrate the present application and are not intended to limit the scope of protection of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1A This is a three-dimensional schematic diagram of the infrared temperature sensing device according to the first embodiment of the present application installed on a smart phone.
[0019] Figure 1B This is a three-dimensional schematic diagram of an infrared temperature sensing device according to another embodiment of the present application installed on a smart phone.
[0020] Figure 2 FIG. 1 is a cross-sectional schematic diagram of an infrared temperature sensing device according to Embodiment 1 of the present application.
[0021] Figure 3 This is a schematic diagram (1) of an infrared temperature measurement module according to Embodiment 1 of the present application.
[0022] Figure 4 This is a schematic diagram (2) of the infrared temperature measurement module of the first embodiment of the present application.
[0023] Figure 5 It is a cross-sectional schematic diagram of the infrared temperature measurement module of the second embodiment of the present application.
[0024] Figure 6 This is a plan view of the infrared temperature measurement module of the third embodiment of the present application.
[0025] Figure 7 This is a plan view of an infrared temperature measurement module according to the fourth embodiment of the present application.
[0026] Figure 8 This is a plan view of an infrared temperature measurement module according to the fifth embodiment of the present application. DETAILED DESCRIPTION
[0027] The following is an explanation of the implementation methods of the "infrared temperature sensing device and its infrared temperature measurement module" disclosed in this application through specific embodiments. Those skilled in the art can understand the advantages and effects of this application from the contents disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. In addition, the drawings of this application are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of this application in detail, but the disclosed contents are not intended to limit the scope of protection of this application.
[0028] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.
[0029] [Example 1]
[0030] See also Figures 1A to 4 As shown, it is the first embodiment of the present application. Figures 1A to 3 As shown, this embodiment discloses an infrared temperature sensing device 100, which is preferably a mobile device 201 installed in a smart phone 200 (such as: Figure 1A or Figure 1BThe infrared temperature sensing device 100 and the movable device 201 can be inserted or flipped together to facilitate the user's body temperature detection, but the present application is not limited thereto. In other embodiments not shown in the present application, the infrared temperature sensing device 100 can be applied to other portable communication devices (such as tablet computers, laptop computers, or wearable electronic products).
[0031] The infrared temperature sensing device 100 includes an infrared temperature measurement module 1, a metal cover 2 covering the infrared temperature measurement module 1, a filter 3 installed on the metal cover 2, and a sealant 4 for bonding the filter 3 to the inner surface of the metal cover 2. In this embodiment, the infrared temperature measurement module 1 is described in combination with the metal cover 2, the filter 3, and the sealant 4, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the infrared temperature sensing device 100 can also be used alone (e.g., retail) or in combination with other components.
[0032] The infrared temperature measurement module 1 includes a base 11 and a sensing component 12 installed on the base 11. The base 11 includes a first seat surface 111 and a second seat surface 112 located on opposite sides, and the base 11 is, for example, a metal base and is provided with a circuit conduction unit 113, but the present application is not limited thereto. It should be noted that the structure of the circuit conduction unit 113 of the base 11 is suitable for being electrically coupled with the sensing component 12 by wire bonding in this embodiment, but in other embodiments not shown in the present application, the circuit conduction unit 113 of the base 11 can also be designed to provide the sensing component 12 with electrical coupling in a flip-chip manner.
[0033] The sensing component 12 is fixed on the base 11 by die bonding in this embodiment, so as to achieve the effect of reducing the volume of the infrared temperature measurement module 1. The sensing component 12 in this embodiment includes M sensing components 121, N1 reflection type compensation sensing components 122 reversely electrically connected in series to the M sensing components 121, and N2 shielding type compensation sensing components 123 reversely electrically connected in series to the M sensing components 121.
[0034] It should be noted that "reverse electrical series connection" in this embodiment means that the negative electrode of the sensing component 121 is connected to the negative electrode of the reflective compensation sensing component 122 and the shielding compensation sensing component 123, so that the noise of the sensing component 121 (such as the internal heat energy of the metal cover 2 and the base 11) is offset by the reflective compensation sensing component 122 and the shielding compensation sensing component 123. Accordingly, the infrared temperature measurement module 1 can effectively reduce the external heat energy impact by connecting the sensing component 121, the reflective compensation sensing component 122 and the shielding compensation sensing component 123 in reverse electrical series connection, thereby improving the measurement accuracy of the sensing component 12.
[0035] In more detail, any of the sensing components 121 includes a first carrier 1211 mounted on the first seat surface 111, a first sensing layer 1212 formed on the first carrier 1211, and an absorption layer 1213 formed on the first sensing layer 1212. Furthermore, any of the reflection-type compensation sensing components 122 includes a second carrier 1221 mounted on the first seat surface 111, a second sensing layer 1222 formed on the second carrier 1221, and a reflection layer 1223 formed on the second sensing layer 1222. Any of the shielding-type compensation sensing components 123 includes a third carrier 1231 mounted on the first seat surface 111, a third sensing layer 1232 formed on the third carrier 1231, an absorption layer 1233 formed on the third sensing layer 1232, and a shielding sheet 1234 formed beside the third sensing layer 1232.
[0036] It should be noted that the reflective layer 1223 in this embodiment must be able to be used to reflect the light band that the absorption layer 1213 is suitable for absorbing; that is, any reflective layer that cannot reflect the light band that the absorption layer 1213 is suitable for absorbing is different from the reflective layer 1223 referred to in this embodiment.
[0037] In addition, M, N1, and N2 are each positive integers, and M, N1, and N2 are each described as 1 in this embodiment, and the reflective compensation sensing component 122 and the shielding compensation sensing component 123 are arranged in a row with the sensing component 121 in this embodiment, and the sensing component 121 is disposed between the reflective compensation sensing component 122 and the shielding compensation sensing component 123, and the reflective compensation sensing component 122 and the shielding compensation sensing component 123 are reversely electrically connected in series with the sensing component 121 through metal bonding, but the present application is not limited thereto.
[0038] For example, if Figure 4As shown, at least two of the first carrier 1211 of the sensing component 121, the second carrier 1221 of the reflective compensation sensing component 122, and the third carrier 1231 of the shielding compensation sensing component 123 may be integrally formed as a single piece. Furthermore, in other embodiments not shown in the present application, the sensing component 121, the reflective compensation sensing component 122, and the shielding compensation sensing component 123 may be electrically connected in series in reverse order through circuits formed on the integrally formed first carrier 1211, the second carrier 1221, and the third carrier 1231.
[0039] In this embodiment, the thermistor unit 124 is installed on the first seat surface 111 of the base 11, and the thermistor unit 124 is preferably disposed adjacent to one side of the sensing component 121 to enhance the isothermal effect between the thermistor unit 124 and the adjacent sensing component 121, but the present application is not limited thereto. For example, in other implementations not shown in the present application, the thermistor unit 124 may also be built into the sensing component 121.
[0040] Furthermore, the sensing component 121, the reflective compensation sensing component 122, the shielding compensation sensing component 123, and the thermistor unit 124 in this embodiment can be electrically coupled to the base 11, and transmit the measured signal to the outside through the circuit conduction unit 113 of the base 11 (e.g., to the processing chip of the smart phone 200). In addition, in other implementations not shown in this application, the sensing component 12 can also be transmitted to the outside through the signal processing component of the base 11 and then through the circuit conduction unit 113.
[0041] In more detail, the metal cover 2 is disposed on the first plate surface 111 of the substrate 11 to jointly surround and form a containing space S. The sensing component 121, the compensation sensing component 122, and the shielding compensation component 123 are all located in the containing space S, and the infrared temperature measurement module 1 is preferably not provided with any signal processing component in the containing space S, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the infrared temperature measurement module 1 may be provided with any signal processing component in the containing space S, such as: a digital analog conversion (ADC) IC and a microcontroller, to process the compensation component signal, thereby effectively improving the measurement accuracy of the sensing component 12. However, the present application is not limited thereto.
[0042] The metal cover 2 is formed with a through hole 21 connected to the accommodating space S, and when an external infrared radiation enters the interior of the metal cover 2 (that is, the accommodating space S) through the through hole 21, the external infrared radiation is blocked by the shielding sheet 1234 of the shielding type compensation component 123 and does not reach the absorption layer 1233 of the shielding type compensation component 123. In other words, the shielding type compensation component 123 can only receive the heat radiation inside the metal cover 2.
[0043] Accordingly, when the metal cover 2 is heated, the interference of the radiation generated by its inner surface on the sensing component 121 can be compensated by the shielding compensation component 123, thereby reducing the interference to the sensing component 12 and further improving the measurement accuracy of the sensing component 12.
[0044] In this embodiment, the shielding sheet 1234 is installed on the first seat surface 111 of the base 11, and the shielding sheet 1234 is located between the sensing component 121 and the shielding compensation component 123, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the shielding sheet 1234 can also be disposed at the through hole 21 of the metal cover 2.
[0045] Furthermore, when the base 11 is heated, the interference to the sensing component 121 can be compensated by the reflective compensation component 122 , thereby reducing the interference to the sensing component 12 , thereby improving the measurement accuracy of the sensing component 12 .
[0046] [Example 2]
[0047] See also Figure 5 As shown, it is the second embodiment of the present application. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:
[0048] In this embodiment, the filter 3 is mounted on the outer surface of the metal cover 2 and covers the perforation 21, so that the wavelength of the light passing through the filter layer 3 and the perforation 21 is suitable for absorption by the absorption layer 1213. In this embodiment, the filter 3 is attached to the outer surface of the metal cover 2 by the adhesive 4, so as to isolate the radiation generated by the adhesive 4 when heated through the metal cover 2, thereby preventing the adhesive 4 from affecting the detection of the sensing component 12.
[0049] [Example 3]
[0050] See also Figure 6As shown, it is the third embodiment of the present application. Since this embodiment is similar to the first embodiment, the similarities between the two embodiments will not be described in detail, and the differences between this embodiment and the first embodiment are roughly described as follows:
[0051] In this embodiment, M is 2, N1 and N2 are 1 respectively; the reflective compensation sensing component 122 and the shielding compensation sensing component 123 are staggered in this embodiment, and the two sensing components 121 are respectively arranged at the corners of the two, and are adjacent to the reflective compensation sensing component 122 and the shielding compensation sensing component 123; that is, the two sensing components 121, the reflective compensation sensing component 122, and the shielding compensation sensing component 123 are arranged in a square in this embodiment, but the present application is not limited thereto. For example, in other implementations not shown in the present application, M, N1, and N2 can each be 1, and the sensing component 121, the reflective compensation sensing component 122, and the shielding compensation sensing component 123 are arranged in an L shape.
[0052] More specifically, any one of the sensing components 121 is adjacent to the reflective compensation sensing component 122 and the shielding compensation sensing component 123, which are adjacent to each other and sandwiched at 90 degrees. In this embodiment, the two sensing components 121 are located diagonally opposite to each other, and the through hole of the metal cover corresponds to any one of the sensing components 121 (the metal cover is not shown in the figure, please refer to Figure 2 ), so that the reflective compensation sensing component 122 and the shielding compensation sensing component 123 can be used to detect thermal interference from the base 11 and the surrounding of the metal cover 2.
[0053] In addition, in the infrared temperature measurement module 1 of the present embodiment, the base 11 may be a multi-layer circuit board, so that the electrical coupling between the sensing component 121, the reflective compensation sensing component 122 and the shielding compensation sensing component 123 may be through the circuit conduction unit in the base (the substrate is not shown in the figure, please refer to Figure 2 ) to achieve, but the present application is not limited thereto.
[0054] [Example 4]
[0055] See also Figure 7 As shown, it is the fourth embodiment of the present application. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:
[0056] In this embodiment, the N1 reflective compensation sensing components 122 are located on one side of the M sensing components 121 (eg: Figure 7), and the N2 shielding type compensation sensing components 123 are located on the other side of the M sensing components 121 (eg: Figure 7 ), and N2 shielding-type compensation sensing components 123 are located between the M sensing components 121 and separated by a plurality of shielding sheets 1234, so as to be able to detect internal thermal interference from the base 11 and the metal cover 2, but the present application is not limited thereto.
[0057] The M sensing components 121 are arranged in X rows along a first direction D1, and in Y columns along a second direction D2 perpendicular to the first direction D1. Furthermore, the M sensing components 121 in this embodiment are arranged in a matrix of X rows and Y+2 columns together with the N1 reflective compensation sensing components 122 located on the upper side and the N2 shielding compensation sensing components 123 located on the lower side, and X and Y are positive integers greater than 1. That is, the M sensing components 121, the N1 reflective compensation sensing components 122, and the N2 shielding compensation sensing components 123 in this embodiment are arranged in a matrix.
[0058] More specifically, the M sensing components 121 are arranged in X rows and Y columns, so M is equal to X times Y. The N1 reflective compensation sensing components 122 are the first column in the matrix arrangement, so N1 is equal to X; the N2 shielding compensation sensing components 123 are the last column in the matrix arrangement, and N2 is also equal to X. In this embodiment, X and Y are each 5, so M is 25, N1 and N2 are each 5, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, X and Y may not be 5, and X may not be equal to Y.
[0059] In addition, in this embodiment, the substrate may be a multi-layer circuit board (the substrate is not shown in the figure, please refer to Figure 2 ), so that the electrical coupling between the M sensing components 121, the N1 reflective compensation sensing components 122, and the N2 shielding compensation sensing components 123 can be through the circuit conduction unit in the substrate (the substrate is not shown in the figure, please refer to Figure 2 ) to achieve, but the present application is not limited thereto.
[0060] [Example 5]
[0061] See also Figure 8 As shown, it is the fifth embodiment of the present application. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:
[0062] In this embodiment, the N1 reflective compensation sensing components 122 are located on one side of the M sensing components 121 (eg: Figure 8 ), and the N2 shielding type compensation sensing components 123 are located on the other side of the M sensing components 121 (eg: Figure 8 ), and N2 shielding-type compensation sensing components 123 are located between the M sensing components 121 and separated by a plurality of shielding sheets 1234, so as to be able to detect internal thermal interference from the base 11 and the metal cover 2, but the present application is not limited thereto.
[0063] The M sensing components 121 are arranged in X rows along a first direction D1, and in Y columns along a second direction D2 perpendicular to the first direction D1. Furthermore, the M sensing components 121 in this embodiment are arranged together with the N1 reflective compensation sensing components 122 on the upper side in a first matrix arrangement of X rows and Y+1 columns; and the M sensing components 121 in this embodiment are arranged together with the N2 shielding compensation sensing components 123 on the left side in a second matrix arrangement of X+1 rows and Y columns, and X and Y are positive integers greater than 1. That is, the arrangement of the M sensing components 121, the N1 reflective compensation sensing components 122, and the N2 shielding compensation sensing components 123 in this embodiment is roughly in a matrix shape.
[0064] More specifically, the M sensing components 121 are arranged in X rows and Y columns, so M is equal to X multiplied by Y. The N1 reflective compensation sensing components 122 are the first column in the first matrix arrangement, so N1 is equal to X; the N2 shielding compensation sensing components 123 are the first row in the second matrix arrangement, and N2 is equal to Y. In this embodiment, X and Y are respectively 5 and 6, so M is 30, N1 and N2 are respectively 5 and 6, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, X and Y may not be 5 and 6, that is, X may not be equal to Y.
[0065] In addition, in this embodiment, the substrate may be a multi-layer circuit board (the substrate is not shown in the figure, please refer to Figure 2 ), so that the electrical coupling between the M sensing components 121, the N1 reflective compensation sensing components 122, and the N2 shielding compensation sensing components 123 can be through the circuit conduction unit in the substrate (the substrate is not shown in the figure, please refer to Figure 2 ) to achieve, but the present application is not limited thereto.
[0066] [Technical Effects of the Embodiments of the Present Application]
[0067] In summary, the infrared temperature sensing device and the infrared temperature measurement module disclosed in the embodiment of the present application can effectively reduce the influence of external heat energy by connecting M sensing components, N1 reflective compensation sensing components, and N2 shielding compensation sensing components in reverse electrical series to each other, thereby improving the measurement accuracy of the temperature measurement components.
[0068] Furthermore, the infrared temperature sensing device and the infrared temperature measuring module disclosed in the embodiments of the present application can effectively improve the measurement accuracy of the temperature measuring component by limiting specific conditions (such as: the reflective layer can be used to reflect the light band that the absorption layer is suitable for absorbing, the infrared temperature measuring module can be provided with any signal processing component in the accommodating space, the filter is used to make the wavelength of the light passing through the filter and the perforation suitable for absorption by the absorption layer, and the shielding plate is used to shield the light band that the absorption layer is suitable for absorption).
[0069] Furthermore, the infrared temperature sensing device and the infrared temperature measurement module disclosed in the embodiment of the present application can also arrange the M sensing components, N1 reflection-type compensation sensing components, and N2 shielding-type compensation sensing components roughly into a matrix shape, so as to detect internal thermal interference through the position layout of the reflection-type compensation sensing components and the shielding-type compensation sensing components according to design requirements.
[0070] The contents disclosed above are only preferred feasible embodiments of the present application, and are not intended to limit the patent scope of the present application. Therefore, all equivalent technical changes made using the description and drawings of the present application are included in the patent scope of the present application.
Claims
1. An infrared temperature sensing device, It is characterized in that The infrared temperature sensing device comprises: An infrared temperature measurement module, comprising: A base, comprising a first seat surface and a second seat surface located on opposite sides; A sensing component, mounted on the base and comprising: M sensing components, any one of which comprises a first carrier mounted on the first seat surface, a first sensing layer formed on the first carrier, and an absorption layer formed on the first sensing layer; N1 reflective compensation sensing components, each of which comprises a second carrier mounted on the first seat surface, a second sensing layer formed on the second carrier, and a reflective layer formed on the second sensing layer; and N2 shielded compensating sensing components, each of which comprises a third carrier mounted on the first seat surface, a third sensing layer formed on the third carrier, an absorption layer formed on the third sensing layer, and a shielding sheet formed beside the third sensing layer; Wherein, M, N1, and N2 are positive integers, N1 reflective compensation sensing components and N2 shielding compensation sensing components are reversely electrically connected in series to the M sensing components, and the reflective layer can be used to reflect the light band suitable for absorption by the absorption layer, and the shielding sheet can be used to shield the light band suitable for absorption by the absorption layer; a metal cover, disposed on the first seat surface of the base to jointly surround and form a containing space; wherein the M sensing components, the N1 reflection-type compensation sensing components, and the N2 shielding-type compensation sensing components are all located in the containing space, and the infrared temperature measurement module is not provided with any signal processing components in the containing space; wherein the metal cover is formed with a through hole connected to the containing space, and when the metal cover is projected toward the sensing component, a projection area corresponding to the through hole falls on the first sensing layer of at least one of the sensing components; and A filter is installed on the metal cover and covers the through hole, so as to make the wavelength band of the light passing through the filter and the through hole suitable for absorption by the absorption layer.
2. The infrared temperature sensing device according to claim 1, It is characterized in that The M sensing components are arranged in X rows along a first direction and in Y columns along a second direction perpendicular to the first direction, and X and Y are positive integers greater than 1; the N1 reflective compensation sensing components are located on one side of the M sensing components, and the N2 shielding compensation sensing components are located on the other side of the M sensing components.
3. The infrared temperature sensing device according to claim 2, It is characterized in that The M sensing components are arranged together with the N1 reflective compensation sensing components and the N2 shielding compensation sensing components to form a matrix arrangement of X rows and Y+2 columns; the N1 reflective compensation sensing components are the first column in the matrix arrangement, and the N2 shielding compensation sensing components are the last column in the matrix arrangement.
4. The infrared temperature sensing device according to claim 2, It is characterized in that The M sensing components are arranged together with the N1 reflective compensation sensing components in a first matrix arrangement of X rows and Y+1 columns; and the M sensing components are arranged together with the N2 shielding compensation sensing components in a second matrix arrangement of X+1 rows and Y columns.
5. The infrared temperature sensing device according to claim 1, It is characterized in that The first carrier of the M sensing components is a one-piece structure integrally formed with the second carrier of the N1 reflective compensation sensing components and / or the third carrier of the N2 shielding compensation sensing components.
6. The infrared temperature sensing device according to claim 1, It is characterized in that The M sensing components, the N1 reflective compensation sensing components, and the N2 shielding compensation sensing components are all arranged at intervals from each other, and the N1 reflective compensation sensing components and the N2 shielding compensation sensing components are reversely electrically connected in series with the M sensing components through metal bonding wires.
7. The infrared temperature sensing device according to claim 1, It is characterized in that The infrared temperature sensing device is further defined as being installed in a mobile device of a smart phone.
8. An infrared temperature measuring module of an infrared temperature sensing device, It is characterized in that The infrared temperature measuring module of the infrared temperature sensing device comprises: A base including a first seat surface and a second seat surface located on opposite sides; and A sensing component, mounted on the base and comprising: M sensing components, any one of which comprises a first carrier mounted on the first seat surface, a first sensing layer formed on the first carrier, and an absorption layer formed on the first sensing layer; N1 reflective compensation sensing components, each of which comprises a second carrier mounted on the first seat surface, a second sensing layer formed on the second carrier, and a reflective layer formed on the second sensing layer; and N2 shielded compensating sensing components, each of which comprises a third carrier mounted on the first seat surface, a third sensing layer formed on the third carrier, an absorption layer formed on the third sensing layer, and a shielding sheet formed beside the third sensing layer; Wherein, M, N1, and N2 are positive integers greater than 1, N1 reflective compensation sensing components and N2 shielding compensation sensing components are electrically connected in series with the M sensing components in reverse, and the reflective layer can be used to reflect the light band suitable for absorption by the absorption layer, and the shielding sheet can be used to shield the light band suitable for absorption by the absorption layer; the M sensing components are arranged in X rows along a first direction and in Y columns along a second direction perpendicular to the first direction, and X and Y are positive integers greater than 1; the N1 reflective compensation sensing components are located on one side of the M sensing components, and the N2 shielding compensation sensing components are located on the other side of the M sensing components.
9. The infrared temperature measuring module of the infrared temperature sensing device according to claim 8, It is characterized in that The M sensing components are arranged together with the N1 reflective compensation sensing components and the N2 shielding compensation sensing components to form a matrix arrangement of X rows and Y+2 columns; the N1 reflective compensation sensing components are the first column in the matrix arrangement, and the N2 shielding compensation sensing components are the last column in the matrix arrangement.
10. The infrared temperature measuring module of the infrared temperature sensing device according to claim 8, It is characterized in that The M sensing components are arranged together with the N1 reflective compensation sensing components in a first matrix arrangement of X rows and Y+1 columns; and the M sensing components are arranged together with the N2 shielding compensation sensing components in a second matrix arrangement of X+1 rows and Y columns.