Power supply module and mass analyzer

Abstract

The present invention improves the performance of a power module. In particular, the generation of discharge is prevented within the power module, and the power module is miniaturized. As a means for this, a plurality of substrates are arranged within the power module so as to overlap when viewed from above. In this case, a low-voltage circuit (3) and a high-voltage circuit are formed on a first substrate (2) while maintaining a distance (L) between each other for preventing creeping discharge, and a low-voltage circuit (5) is formed on a second substrate (4). In addition, the distance between the components constituting the high-voltage AC circuit (8) formed in the high-voltage circuit and the components constituting the low-voltage circuit (5) is at least three times the shortest distance (D) between the components constituting the high-voltage DC circuit (7) formed in the high-voltage circuit and the components constituting the low-voltage circuit (5) at which no space discharge occurs.

Description

Technical Field

[0001] The present invention relates to a power supply module and a mass spectrometer, and more particularly to a high-voltage module internally including a substrate having a high-voltage DC circuit and a high-voltage AC circuit and other substrates, and a mass spectrometer using the high-voltage module. Background Art

[0002] For example, a power supply module is known as a device that supplies a high voltage to an ion source or a detector mounted on a mass spectrometer.

[0003] Patent document 1 (Japanese Patent Application Laid-Open No. 7-99777) describes a two-layer structure in which a sub-substrate having a step-up rectifier circuit is arranged on a main substrate serving as a high-voltage power supply in order to achieve both low cost and high precision.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 7-99777 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] Generally speaking, power modules increase in size as their electrical characteristics, such as higher output voltage and reduced noise, improve. On the other hand, devices equipped with power modules (such as mass spectrometers) require further increases in voltage and noise to achieve higher analytical sensitivity, while also requiring miniaturization to improve usability.

[0009] Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

[0010] Means for solving problems

[0011] The outline of representative embodiments among the embodiments disclosed in this application will be briefly described as follows.

[0012] In a typical embodiment, a power module is provided with multiple substrates stacked in a plan view. A first low-voltage circuit and a high-voltage circuit are formed on the first substrate, maintaining a creeping discharge prevention distance between them to prevent creeping discharge. A second low-voltage circuit is formed on the second substrate. Furthermore, the distance between components forming the high-voltage AC circuit formed in the high-voltage circuit and components forming the second low-voltage circuit is at least three times the shortest distance between components forming the high-voltage DC circuit formed in the high-voltage circuit and components forming the second low-voltage circuit without causing space discharge.

[0013] Effects of the Invention

[0014] According to a representative embodiment, the performance of a power module can be improved. In particular, the occurrence of discharge in the power module can be prevented, and the power module can be miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a side view showing a partially cutaway portion of the power module according to the first embodiment of the present invention.

[0016] Figure 2 It is a formula that expresses the distance to prevent space discharge.

[0017] Figure 3 This is a graph showing the characteristics of the creeping discharge prevention distance and the space discharge prevention distance with respect to the potential difference.

[0018] Figure 4 This is a circuit diagram showing a ground wiring structure of a power module according to a comparative example.

[0019] Figure 5 This is a circuit diagram showing the noise path of a power module of a comparative example.

[0020] Figure 6 This is a circuit diagram showing the noise path of a power module of a comparative example.

[0021] Figure 7 This is a circuit diagram showing the noise path of a power module of a comparative example.

[0022] Figure 8 This is a circuit diagram showing a power supply module according to Modification 1 of Embodiment 1 of the present invention.

[0023] Figure 9 This is a side view showing a portion of a power module according to a first modification of the first embodiment of the present invention in section.

[0024] Figure 10 This is a side view showing a partially cutaway portion of a power module according to a second modification of the first embodiment of the present invention.

[0025] Figure 11 This is a side view showing a portion of a power module in cross section, which is a third modification of the first embodiment of the present invention.

[0026] Figure 12 This is a side view showing a portion of a power module in cross section, which is a fourth modification of the first embodiment of the present invention.

[0027] Figure 13 This is a schematic diagram showing a mass spectrometer as a second embodiment of the present invention.

[0028] Figure 14 This is a side view showing a partially cutaway portion of a power module as a comparative example. DETAILED DESCRIPTION

[0029] The following describes embodiments of the present invention in detail with reference to the accompanying drawings. In all drawings used to illustrate the embodiments, components having identical functions are denoted by identical reference numerals, and repeated descriptions thereof are omitted. Furthermore, in the embodiments, descriptions of identical or similar components are generally not repeated unless otherwise required.

[0030] (Implementation 1)

[0031] The following describes a power supply module that outputs a high voltage (high-voltage power supply module) and is internally configured with multiple, separated and overlapping substrates. This embodiment distinguishes between the distance between the high-voltage DC circuit formed on the first substrate and the second substrate within the power supply module, and the distance between the high-voltage AC circuit formed on the first substrate and the second substrate within the power supply module. This achieves discharge prevention, noise reduction, and miniaturization of the power supply module. In this application, the components and wiring (printed wiring) that constitute a circuit are sometimes referred to as components that constitute the circuit.

[0032] <Structure of Power Module of This Embodiment>

[0033] Figure 1 This figure shows a partially cutaway side view of the power module in Embodiment 1. The power module includes a metal housing 1 electrically connected to a ground line, and a first substrate 2 and a second substrate 4 housed (arranged) within the metal housing 1. Specifically, the metal housing 1 is electrically grounded to prevent electric shock and external noise. The metal housing 1 is, for example, a rectangular parallelepiped shape that can be manufactured at low cost.

[0034] The first substrate 2 and the second substrate 4 each have a main surface and a back surface on the opposite side of the main surface as part of the surface. The first substrate 2 and the second substrate 4 are so-called printed substrates in which printed wiring is provided on one or both of the main surface and the back surface of the substrate made of an insulator. In addition, depending on the design, wiring is sometimes also provided on the inner layer of each of the first substrate 2 and the second substrate 4. In addition, semiconductor elements (such as transistors), capacitor elements or resistor elements and other elements are mounted on one or both of the main surface and the back surface of each of the first substrate 2 and the second substrate 4. That is, in each of the first substrate 2 and the second substrate 4, one of the main surface and the back surface, or both of the main surface and the back surface are mounting surfaces.

[0035] The first substrate 2 and the second substrate 4 are respectively configured to be parallel to each other at positions where they overlap when viewed from above. That is, the main surface and back surface of the first substrate 2 are parallel to the main surface and back surface of the second substrate 4. The main surface or back surface of the first substrate 2 is opposite to the main surface or back surface of the second substrate 4. In the direction perpendicular to the main surface of the first substrate 2 (height direction, substrate stacking direction, longitudinal direction), the first substrate 2 and the second substrate 4 are configured at different height positions. By configuring the first substrate 2 and the second substrate 4 to be parallel to each other, the manufacture of the power module can be facilitated, the distance between the substrates can be easily designed, and the transmission of signals, etc. between the substrates also becomes easier.

[0036] The first substrate 2 has a high voltage area and a low voltage area. A high voltage power supply circuit is formed in the high voltage area of the first substrate 2, and the high voltage power supply circuit includes a high voltage DC circuit 7 and a high voltage AC circuit 8. A low voltage circuit 3 is formed in the low voltage area of the first substrate 2. The second substrate 4 has a low voltage area, and a low voltage circuit 5 is formed in the low voltage area. The high voltage power supply circuit operates at a higher voltage than each of the low voltage circuits 3 and 5. That is, the high voltage DC circuit 7 and the high voltage AC circuit 8 both operate at a higher voltage than each of the low voltage circuits 3 and 5. Figure 1 In FIG. 1 , dotted lines are shown at three locations on the side surface of the first substrate 2 in order to divide the first substrate 2 into four regions.

[0037] The high-voltage circuit operates at a voltage of, for example, 300 V or greater, or 1000 V or greater, while the low-voltage circuits 3 and 5 operate at a voltage of less than 300 V. In this embodiment, a circuit in which the voltage of an electrical signal flowing through the circuit has an amplitude of 300 V or greater is referred to as a high-voltage AC circuit. Furthermore, a circuit in which the voltage amplitude of an electrical signal flowing through the circuit is less than 300 V, and the maximum absolute value of the voltage is 300 V or greater is referred to as a high-voltage DC circuit. Furthermore, a circuit in which the voltage amplitude of an electrical signal flowing through the circuit is less than 300 V, and the maximum absolute value of the voltage is less than 300 V is referred to as a low-voltage circuit.

[0038] The first substrate 2 and the second substrate 4 are electrically connected using an inter-substrate connection unit (transmission unit) 18, for example. The inter-substrate connection unit 18 is a transmission unit for transmitting signals and power between the first substrate 2 and the second substrate 4. Specifically, it is considered that power is transmitted via a cable having a connector at the end, and signals are transmitted via optical communication using a photocoupler. In addition, as the inter-substrate connection unit 18, only one of a cable or a connector may be used. In addition, as the inter-substrate connection unit 18, a transformer may be used for magnetic transmission.

[0039] Next, the distances between the aforementioned circuits are described. A high potential difference is generated between the high-voltage circuit and the low-voltage circuits 3 and 5 disposed on the first substrate 2. Therefore, the high-voltage circuit and the low-voltage circuits 3 and 5 need to be separated by a distance greater than that at which discharge does not occur. For example, the element (component) 15 constituting the high-voltage circuit of the first substrate 2 and the element (component) 17 constituting the low-voltage circuit 3 are configured to be separated by a distance greater than L at which creeping discharge does not occur. In other words, the shortest distance between the low-voltage region of the first substrate 2 and the high-voltage region of the first substrate 2 is distance L.

[0040] Distance L is the distance along the mounting surface of the first substrate 2, defining the minimum distance between components constituting the high-voltage circuit and components constituting the low-voltage circuit 3. Specifically, distance L is the minimum distance required to prevent creeping discharge, known as the creeping discharge prevention distance. Creeping discharge, as used herein, refers to discharge that occurs along the surface of the substrate.

[0041] The components mentioned here refer to the components and wiring (printed wiring) that constitute the high-voltage circuit or low-voltage circuit 3, and other structures that constitute the circuit. Components that constitute circuit components include, for example, conductors such as terminals of semiconductor components and insulating materials such as resin that constitutes part of the semiconductor component. This also applies to components that constitute the low-voltage circuit 5. Figure 1 The element 15 shown as an example is a component that is located closest to the low-voltage circuit 3 among the components constituting the high-voltage circuit, and the element 17 is a component that is located closest to the high-voltage circuit among the components constituting the low-voltage circuit 3.

[0042] In order to ensure the distance L, as Figure 1 As shown, an area 6 without mounted components is required. Area 6 of the first substrate 2 is the area between the low-voltage circuit 3 and the high-voltage circuit and is an area without conductive portions such as printed wiring. However, a transmission component (such as an optical fiber) made of an insulator for transmitting signals or power between the low-voltage circuit 3 and the high-voltage circuit may be mounted on the surface of the first substrate 2 in area 6. For example, a photocoupler or transformer can be used as this transmission component.

[0043] Furthermore, element 14, a component constituting the high-voltage circuit of first substrate 2, and element 13, a component constituting the low-voltage circuit 5, are spaced at a distance D greater than or equal to the distance required to prevent spatial discharge. Distance D is the minimum distance required to prevent spatial discharge and is referred to as the spatial discharge prevention distance. Element 13 and 14 are provided on the opposing mounting surfaces of first substrate 2 and second substrate 4, respectively. Figure 1 The element 14 shown as an example is a component that is located closest to the low-voltage circuit 5 among the components constituting the high-voltage circuit, and the element 13 is a component that is located closest to the high-voltage circuit among the components constituting the low-voltage circuit 5.

[0044] The relationship between the distance L and the distance D and the potential difference can be expressed by the following equations (1) and Figure 2 The formula (2) shown here represents the voltages L and D, respectively. Here, the high voltage used in the operation of the high-voltage circuit included in the first substrate 2 is Vh, and the low voltage used in the operation of the low-voltage circuits 3 and 4 is Vl. The unit of these voltages is kV. The units of distances L and D are each mm.

[0045] L=0.16(Vh-Vl) 2 +0.5(Vh-Vl)-0.07…(1)

[0046] Figure 3 The chart shows the distances L and D calculated using formula (1) and formula (2). The horizontal axis of the chart is the potential difference (high voltage (kV) - low voltage (kV)), and the vertical axis is the distance (mm) that can prevent discharge. In the chart, the distance L is represented by a dotted line, and the distance D is represented by a solid line. Figure 3 It can be seen that when the potential difference is the same, the distance L needs to be longer than the distance D. That is, discharge is more likely to occur when gas and solid (substrate) are between components than when only gas (air) is between components.

[0047] Therefore, from the perspective of preventing discharge, when forming the high-voltage circuit and the low-voltage circuit on the same substrate, it is necessary to maintain a distance L between these circuits. In contrast, when forming the high-voltage circuit and the low-voltage circuit on separate substrates, the distance between these circuits only needs to be a distance D that is smaller than the distance L. Therefore, in a power module, forming the high-voltage circuit and the low-voltage circuit on separate substrates can shorten the distance between the circuits compared to forming the high-voltage circuit and the low-voltage circuit on the same substrate, thereby enabling a more compact power module.

[0048] Next, the distances between the high-voltage DC circuit 7 and the high-voltage AC circuit 8 and other low-voltage circuits will be described, focusing on the high-voltage circuit region of the first substrate 2, which includes a high-voltage DC circuit 7 and a high-voltage AC circuit 8. The high-voltage circuit region of the first substrate 2 includes a DC region and an AC region, with the high-voltage DC circuit 7 formed in the DC region and the high-voltage AC circuit 8 formed in the AC region.

[0049] Here, element 14, which constitutes the high-voltage DC circuit 7 of the first substrate 2, element 13, which constitutes the low-voltage circuit 3 of the second substrate 4, and metal housing 1 are arranged at a distance greater than that required to prevent discharge under high DC voltage. Furthermore, element 16, which constitutes the high-voltage AC circuit 8 of the first substrate 2, element 13, which constitutes the low-voltage circuit 3 of the second substrate 4, and metal housing 1 are arranged at a distance greater than that required to prevent discharge under high AC voltage.

[0050] Specifically, the element 14, the element 13 and the metal shell 1 are configured to be spaced apart from each other by a distance greater than D. Here, compared with the high-voltage DC circuit 7, the high-voltage AC circuit 8 is more likely to discharge to other low-voltage circuits. Therefore, the distance at which no discharge occurs under the high voltage of the AC (the spatial discharge prevention distance) is three times the distance D (the distance 3D). That is, the element 16 and the metal shell 1 are configured to be spaced apart from each other by more than three times the distance D, and the element 16 and the element 13 are configured to be spaced apart from each other by more than three times the distance D. However, the element 13 and the metal shell 1 are at low voltage relative to each other, and therefore, the distance between them can also be less than the distance D. The distance L is greater than three times the distance D. In this way, by keeping the distance between the metal shell 1 and the components constituting the high-voltage AC circuit 8 at more than three times the distance D, it is possible to prevent discharge from occurring between the metal shell 1 and the high-voltage AC circuit 8.

[0051] The first substrate 2 is secured to the metal housing 1 via high-voltage insulating spacers 9, and the second substrate 4 is secured to the metal housing 1 via low-voltage insulating spacers 10. Furthermore, the high-voltage AC circuit 8 on the first substrate 2 is positioned near the output terminal 11 of the power module, with the high-voltage AC circuit 8 and the low-voltage circuit 3 positioned at the greatest distance from each other among the multiple circuits arranged on the first substrate 2. Securement of the first substrate 2 to the metal housing 1 via the high-voltage insulating spacers 9 prevents discharge from occurring between the circuits formed on the first substrate 2 and the metal housing 1 via the spacers.

[0052] In this embodiment, no components of other circuits are placed directly below or above the high-voltage AC circuit 8. In other words, the area overlapping the high-voltage AC circuit 8 and the low-voltage circuit 5 formed on the second substrate 4 are separated from each other when viewed from above. Furthermore, here, the high-voltage AC circuit 8 and the second substrate 4 are separated from each other when viewed from above. As a result, the shortest distance between the components constituting the high-voltage AC circuit 8 and the components constituting the low-voltage circuit 5 is a distance that is always inclined relative to the mounting surface of each substrate. Therefore, as long as this inclined distance is set to at least three times the distance D, there is no need to ensure that the distance between the substrates in the height direction is at least three times the distance D.

[0053] Therefore, for example, if the distance D between the first substrate 2 and the metal housing 1 is three times greater than the distance D in the height direction, the second substrate 4 can be arranged between the first substrate 2 and the metal housing 1 without increasing the distance between the first substrate 2 and the metal housing 1. This prevents the power module from becoming larger when substrates requiring a larger area for arranging various circuits are divided and overlapped.

[0054] <Effects of this embodiment>

[0055] Figure 14 FIG. 1 is a side view of a power module of a comparative example after a portion of the power module is cut away. Figure 1 The structure shown is different in that substrates are not stacked, but only the first substrate 2 is provided, and the low-voltage circuit 5 and the low-voltage circuit 3 are formed adjacent to each other on the first substrate 2 .

[0056] First, the issue of miniaturizing the power module design will be described. Within the power module, the distance between the high-voltage region and the low-voltage region where the ground line is located must ensure an appropriate creeping discharge prevention distance to prevent discharge. This creeping discharge prevention distance increases along with the potential difference between the high-voltage and low-voltage regions. Therefore, as the voltage increases, the creeping discharge prevention distance increases, leading to an increase in the size of the power module. Furthermore, if an AC component is present in the high-voltage region within the power module, the electromagnetic radiation (electromagnetic waves) generated by this AC component does not overlap with the wiring of the control circuit located in the low-voltage region. Therefore, the high-voltage region and the low-voltage region must be located at a sufficiently large distance from each other, which can easily lead to an increase in the size of the power module. In other words, it is difficult to achieve both discharge prevention and electromagnetic wave superposition prevention between the high-voltage and low-voltage regions while miniaturizing the power module design.

[0057] In the comparative example, from the viewpoint of preventing space discharge, the distance between the metal housing 1 and the element 16 constituting the high voltage AC circuit 8 needs to be at least three times the distance D. Therefore, when a rectangular parallelepiped metal housing 1 that can be manufactured at low cost is used, the spaces above and below the low voltage circuits 3 and 5 and the area 6 for ensuring the creepage distance (in the Figure 14 In the space 12) indicated by the hatched lines, useless space is generated.

[0058] In contrast, in this embodiment, by disposing the second substrate 4 in the space 12, the space inside the metal housing 1 can be effectively utilized, thereby miniaturizing the power module. Figure 1 As shown, Figure 14 The low voltage circuit 5 shown is formed on the second substrate 4 and is arranged below the first substrate 2. This allows the width of the power module in the direction (lateral direction) along the mounting surface of each substrate to be reduced, enabling the power module to be miniaturized.

[0059] In addition, in this embodiment, Figure 1 As shown, considering the presence of the high-voltage AC circuit 8, the components comprising the low-voltage circuit 5 formed on the second substrate 4 are positioned so as not to overlap with the high-voltage AC circuit 8 when viewed from above. The components comprising the low-voltage circuit 5 are positioned at least three times the distance D from the components comprising the high-voltage AC circuit 8. This prevents the occurrence of discharge and allows the height distance between these components and the components mounted on the first substrate 2 to be less than three times the distance D. This prevents an increase in the height of the power module and allows the substrates within the power module to be stacked, resulting in a more compact power module.

[0060] That is, in this embodiment, a multilayer structure of the printed circuit board is realized while preventing discharge, thereby providing a compact and high-performance power supply module.

[0061] In the power module of this embodiment, the interior of the metal housing 1 is not filled with an insulator such as resin to prevent discharge. If such a resin were filled to cover the surface of the first substrate 2 or the second substrate 4, parasitic components (such as parasitic capacitance) would be generated by the resin. Consequently, the intensity of electromagnetic radiation superimposed from the high-voltage circuit on the low-voltage circuit increases, making it more likely that noise will affect multiple circuits.

[0062] In contrast, in this embodiment, neither the first substrate 2 nor the second substrate 4 is covered with resin within the metal housing 1. In other words, no resin is filled between the metal housing 1 and either the first substrate 2 or the second substrate 4, nor between the first substrate 2 and the second substrate 4. This prevents the generation of parasitic components and noise effects caused by the presence of resin, thereby improving the performance of the power module.

[0063] <Variation 1>

[0064] Hereinafter, as a first modification of the first embodiment, a structure for reducing noise electromagnetically radiated from a high-voltage AC circuit will be described.

[0065] <Details of room for improvement>

[0066] Figure 4 A circuit diagram showing a ground wiring structure of a power module as a comparative example is shown. Figure 4 The ground wiring diagram includes a power supply 31 of the power module, a digital circuit 33, an analog circuit 34, and a high-voltage circuit 35. It also includes a power circuit (transformer circuit) 32 that generates the power supply voltage for each of these circuits. Specifically, the power module includes a high-voltage circuit 35 that outputs a high voltage, a digital circuit 33 that controls the high-voltage circuit 35, and an analog circuit 34. The operating reference potential of the power circuit 32 is the ground line PG. Specifically, the power circuit 32 is electrically connected to the ground line PG. The digital circuit 33 is electrically connected to the ground line DG. The analog circuit 34 is electrically connected to the ground line AG. The high-voltage circuit 35 is electrically connected to the ground line HG.

[0067] The power source 31 is a power source external to the power module and is grounded. Figure 4 In the figure, the metal housing 1 housing the circuits in the power module is indicated by a dotted line. The power module is connected to a power source 31 outside the power module via a cable, which is led out of the terminal (connector) 111 to the outside of the metal housing 1. The ground wires PG, DG, AG, and HG are all ground wires provided in the circuits in the power module. Figure 4 As shown, ground lines PG and DG are electrically connected to each other. Furthermore, ground lines PG and DG are electrically connected to ground line AG. Ground line HG is electrically connected to ground lines PG and DG via ground line AG. Furthermore, power circuit 32 is electrically connected to power supply 31 via terminal 111 and a cable, and ground line PG is electrically connected to power supply 31 via terminal 111 and a cable.

[0068] The power circuit 32, the digital circuit 33 and the analog circuit 34 are Figure 1 The structure shown includes circuits other than the high voltage DC circuit 7 and the high voltage AC circuit 8 (for example, the low voltage circuit 3 or 4). Figure 1The illustrated configuration is included in a high-voltage DC circuit 7 or a high-voltage AC circuit 8 .

[0069] The power module of this embodiment (see Figure 1 ) by using Figure 1 When the miniaturization method described above is applied, for example, digital circuit 33 and analog circuit 34 mounted on second substrate 4 are placed close to high-voltage AC circuit 8, which is a noise source, and are easily affected by noise. Next, a method for miniaturizing the power module while suppressing noise current in low-voltage circuits will be described.

[0070] Figure 5 represents the path of the noise current through the power circuit 32, Figure 6 represents the path of the noise current through the digital circuit 33, Figure 7 3 shows the path of the noise current passing through the analog circuit 34 . Figures 5 to 7 The circuit shown is Figure 4 The circuit shown is the same. Figures 5 to 7 In , thick arrows indicate the paths along which noise current flows. Figures 5 to 7 , a capacitor 36 is shown as a parasitic capacitance.

[0071] The noise current is output from the noise source and flows along a loop path that returns to the noise source again. If the above electromagnetic radiation is limited to electromagnetic radiation caused by high voltage AC, it can be simply considered to be a capacitor 36 generated by electric field coupling. Figure 5 In the process, the noise current is output from the high voltage circuit 35, passes through the capacitor 36 and the power circuit 32, and then returns to the high voltage circuit 35 via the ground lines PG, AG, and HG. Figure 5 If the noise current path is not as shown, the noise current will not flow to the power circuit 32, and the conduction noise from the high voltage circuit 35 to other circuits can be reduced. Figure 6 、 Figure 7 When the noise path is clear, all noise currents must pass through the ground lines AG and HG in sequence.

[0072] <Structure and Effect of This Modification>

[0073] Since all noise currents must pass through the ground lines AG and HG in sequence, in this variation, Figure 8 As shown, an electric noise reduction filter 37 is disposed between the ground lines AG and HG, thereby blocking the noise current path.

[0074] Figure 8 The circuit shown in the figure has the same structure as that of the circuit shown in the figure except that a filter 37 for reducing electric noise is interposed between the ground lines AG and HG. Figure 4The circuit shown in FIG. Specifically, ground lines AG and HG are electrically connected to each other via electrical noise reduction filter 37. Specifically, ground line HG is electrically connected to ground line AG, ground line PG, and DG via electrical noise reduction filter 37 (noise reduction component 19 described below). In other words, ground line AG is electrically connected to electrical noise reduction filter 37, and electrical noise reduction filter 37 is electrically connected to ground line HG.

[0075] As the electric noise reduction filter 37 , for example, ferrite beads, resistor elements, capacitor elements, or the like can be used. Figure 9 The electric noise reduction filter 37 is equivalent to, for example, Figure 9 The noise reduction component 19 is shown. The noise reduction component 19 is mounted on a portion of the high voltage region of the first substrate that is connected to the region 6. Here, the noise reduction component 19 is formed in the region where the high voltage DC circuit 7 is formed.

[0076] Through the above, it is possible to reduce the noise current caused by electromagnetic radiation from the high-voltage AC circuit.

[0077] Therefore, even if a multilayer structure of a printed circuit board is adopted in the power module, which allows low-voltage circuits to be arranged close to high-voltage circuits, discharge prevention and suppression of noise current caused by electromagnetic radiation can be achieved, thereby realizing a compact and high-performance power module.

[0078] <Variation 2>

[0079] Next, as a second modification of this embodiment, the area of the low voltage circuit is very large relative to the area of the high voltage circuit, and it is not possible to arrange it in the Figure 1 The embodiment in the case of one second substrate 4 described above will be described.

[0080] Figure 10 FIG. 1 shows a side view of a power module of this modified example after a portion of the power module is cut away. Figure 10 As shown, the circuits of the low-voltage circuit not accommodated on the second substrate 4 are formed in the low-voltage region of the third substrate 91 disposed on the first substrate 2. The third substrate 91 is formed so as to overlap with the first substrate 2 when viewed from above. However, the components constituting the low-voltage circuit 94 formed on the third substrate 91 are separated from the AC region where the high-voltage AC circuit 8 is formed when viewed from above.

[0081] Here, relative to Figure 1 The third substrate 91 is accommodated in the structure shown in FIG. Figure 14In the space 12 marked with oblique lines, discharge is prevented. Furthermore, the element (component) 92 constituting the low-voltage circuit 94 formed on the third substrate 91 is configured to be spaced at a distance D or greater from the element 15 constituting the high-voltage DC circuit 7. Furthermore, the element 92 is configured to be spaced at a distance D or greater from the element (component) 93 constituting the high-voltage AC circuit 8. That is, the components constituting the low-voltage circuit formed on the third substrate 91 are formed to maintain a distance from the components mounted on the first substrate 2 under the same conditions as the second substrate 4. In other words, it can also be considered that the second substrate 4 is formed with a plurality of the first substrate 2 sandwiched therebetween.

[0082] As described above, even when the area of the low voltage circuit is much larger than that of the high voltage circuit and cannot be arranged in the area of the second substrate 4, a multilayer structure of the printed circuit board can be realized, and a small and high-performance power supply module can be provided.

[0083] <Variation 3>

[0084] Hereinafter, as a third modification of the present embodiment, a method of improving the noise tolerance of a power module using a multilayer substrate structure will be described.

[0085] Figure 11 The figure shows a side view of a part of the power module of this variant after being cut away. In the power module of this variant, the second substrate 4 among the multiple substrates constituting the multilayer structure has a metal layer (shielding plane layer, ground plane layer) 101 connected to the ground potential as an inner layer. In addition, the components constituting the low-voltage circuit 5 formed on the second substrate 4 are arranged on the surface of the second substrate 4 on the opposite side of the first substrate 2. That is, the metal layer 101 is between the first substrate 2 and the low-voltage circuit 5. In other words, the metal layer 101 is between the components constituting the low-voltage circuit 5 (such as the element 13) and the components constituting the high-voltage AC circuit 8. Here, the metal layer 101 is clamped by the two substrates constituting the second substrate 4. However, the surface of the metal layer 101 on the first substrate 2 side may also be exposed. The metal layer 101 is composed of, for example, electrically grounded copper foil. In order to facilitate understanding of the drawings, Figure 11 In FIG, the metal layer 101 is marked with hatching lines.

[0086] Thus, by providing the electromagnetic radiation-reducing metal layer 101 between the low-voltage circuit 5 on the second substrate 4 and the first substrate 2 including the high-voltage AC circuit 8, which serves as a noise source, it is possible to reduce the electromagnetic radiation superimposed on the low-voltage circuit 5. In other words, a compact power supply module with improved resistance to electromagnetic radiation noise from the high-voltage AC circuit can be realized.

[0087] In addition, this modification example can also be applied to Modification Example 2. That is, a metal layer can also be provided on each of a plurality of substrates provided to overlap with the substrate including the high-voltage AC circuit.

[0088] Alternatively, the metal layer 101 may have a stacked structure formed by stacking a plurality of metal layers, in which case the shielding effect can be enhanced.

[0089] <Variation 4>

[0090] Hereinafter, as a fourth modification of the present embodiment, a method of improving the safety of the power module will be described. Figure 12 A partially cutaway side view of a power module according to this modification is shown. Here, a protection circuit is formed in the low-voltage circuit 3 on the first substrate 2. The protection circuit protects the high-voltage circuit, ie, both the DC circuit and the AC circuit.

[0091] Thus, when a control signal line of the high voltage circuit output from the second substrate 4 to the first substrate 2 is disconnected due to a failure of the inter-substrate connection unit 18 , the protection circuit can stop the high voltage circuit of the first substrate 2 .

[0092] Here, terminals 111 for inputting voltage from a power source external to the power module are located on a substrate other than first substrate 2 (e.g., second substrate 4). Consequently, if the power module's power wiring is disconnected due to a failure in inter-substrate connection unit 18, power to first substrate 2 is lost, and the high-voltage circuit ceases operation.

[0093] Based on the above, even if the inter-substrate connection unit 18 between the first substrate 2 and the second substrate 4 fails or is disconnected, resulting in incomplete communication between the high-voltage circuit and the low-voltage control circuit of the second substrate 4, the high-voltage circuit will not get out of control, and the protection circuit can safely cut off the power supply.

[0094] In addition, Figure 12 , a cable 20 is shown extending from the terminal 111 to the outside of the metal housing 1, and a cable 21 is shown extending from the output terminal 11 formed in the high-voltage region to the outside of the metal housing 1. The cable 20 is electrically connected to the low-voltage circuit 5 via the terminal 111, and the cable 21 is electrically connected to the high-voltage AC circuit 8 via the output terminal 11. Each of the cables 20 and 21 is separated from the region between the first substrate 2 and the second substrate 4.

[0095] That is, neither cable 20 or 21 is located between the first substrate 2 and the second substrate 4. This prevents the cable 20 or 21 from coming into contact with components mounted on the first substrate 2 or the second substrate 4, potentially causing damage at any location and thus short circuits. Furthermore, the presence of the cable 20 or 21 between the first substrate 2 and the second substrate 4 prevents discharge from the high-voltage AC circuit 8 to the cable 20 or 21 or the second substrate 4.

[0096] <Variation 5>

[0097] In use Figure 1 In the power supply module described, the circuit with an electrical signal voltage less than 300V is called a low-voltage circuit, and the circuit with a voltage of 300V or more is called a high-voltage circuit, but high voltage, low voltage, DC and AC can also be distinguished by numerical values different from the above numerical values.

[0098] For example, as a first example, in the case of an AC circuit, a circuit with a voltage of 600 V or less may be referred to as a low-voltage circuit, and a circuit with a voltage exceeding 600 V may be referred to as a high-voltage circuit. Similarly, in the case of a DC circuit, a circuit with a voltage of 750 V or less may be referred to as a low-voltage circuit, and a circuit with a voltage exceeding 750 V may be referred to as a high-voltage circuit.

[0099] Furthermore, as a second example, high voltage and low voltage may also be defined by international standards such as IEC (International Electrotechnical Commission).

[0100] As a third example, in the case of an AC circuit, a circuit with a voltage of 1000 V or less may be referred to as a low-voltage circuit, and a circuit with a voltage exceeding 1000 V may be referred to as a high-voltage circuit. In this case, in the case of a DC circuit, a circuit with a voltage of 1500 V or less may be referred to as a low-voltage circuit, and a circuit with a voltage exceeding 1500 V may be referred to as a high-voltage circuit.

[0101] (Implementation Method 2)

[0102] exist Figure 12 in Figure 13 2 shows a schematic diagram of a mass spectrometer as Embodiment 2. The following describes the use of the power supply module described in Embodiment 1 for supplying power to a mass spectrometer. A mass spectrometer is, for example, a device for investigating the types and amounts of atoms constituting a sample.

[0103] The mass spectrometer of this embodiment includes an ion source 121 that ionizes a sample to be mass analyzed; a mass separator 126 that uses a filter electrode 127 to filter out unwanted ion molecules 125 from the ionized sample, allowing only ion molecules 124 with the mass to be analyzed to pass through. The mass spectrometer also includes an orbit control unit 128 that controls the orbits of ion molecules and electrons; a conversion dynode 122 that converts ion molecules into electrons (electricity); and a detector 123 that detects these electrons. The conversion dynode 122 and detector 123 are located within the orbit control unit 128. The mass spectrometer also includes an information processing unit that calculates mass based on the electrical signal obtained by the detector 123. The mass spectrometer includes a first power supply module that applies voltage to the ion source 121; a second power supply module that applies voltage to the filter electrode 127; a third power supply module that applies voltage to the conversion dynode 122; and a fourth power supply module that applies voltage to the detector 123. Furthermore, the mass spectrometer includes a mass spectrometer control unit that controls the first to fourth high-voltage power supply modules.

[0104] The power supply module installed in the mass spectrometer of the present invention has one or more of the structures described in Embodiment 1 and its variations 1 to 5. If the same voltage is applied to each component of the mass spectrometer, a single power supply module is sufficient. However, in practice, the increasing multifunctionality of mass spectrometers necessitates supplying different voltages to each component, and the number of power supply modules installed in the mass spectrometer increases accordingly.

[0105] In this embodiment, by using the power supply module of Embodiment 1 as the power supply for a mass spectrometer, a compact mass spectrometer can be provided even when the number of power supply modules installed in the mass spectrometer is increased. Furthermore, the detection sensitivity of a mass spectrometer is significantly affected by the noise level of the power supply modules. Therefore, by installing a power supply module having the noise reduction unit described in Modification 1 or Modification 3 of Embodiment 1, a highly sensitive mass spectrometer can be provided.

[0106] As mentioned above, the invention completed by the present inventors has been specifically described based on the present embodiment. However, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the present invention.

[0107] For example, in the power supply module of the present application, a plurality of structures in Modifications 1 to 5 of Embodiment 1 may be applied in combination. In addition, a comparative example and Modifications 1 to 5 of Embodiment 1 may be combined.

[0108] Industrial applicability

[0109] The present invention can be widely used in power supply modules and mass spectrometers.

[0110] Description of Reference Numerals

[0111] 1 Metal housing

[0112] 2. First substrate

[0113] 3.5 Low voltage circuit

[0114] 3D, D, L distance

[0115] 4 Second substrate

[0116] 7 High voltage DC circuit

[0117] 8 High voltage AC circuits

[0118] 18 Inter-substrate connection unit

Claims

1. A power module, characterized in that: The device comprises a first substrate and a second substrate which overlap each other in a plan view, The first substrate has: a first region having a first circuit formed therein; a second region having a DC circuit operating at a higher voltage than the first circuit; a third region in which an AC circuit operating at a higher voltage than the first circuit is formed; a fifth region comprising the second region and the third region; as well as a sixth area located between the first area and the fifth area and having no wiring pattern mounted on the surface of the first substrate; The second substrate has a fourth region where a second circuit operating at a lower voltage than the DC circuit and the AC circuit is formed. When the shortest distance between the first region and the fifth region along the surface of the first substrate is L and the shortest distance between the components constituting the DC circuit and the components constituting the second circuit at which no spatial discharge occurs is D, the shortest distance between the components constituting the AC circuit and the components constituting the second circuit is at least three times the distance D. The distance L is greater than three times the distance D.

2. The power module according to claim 1, wherein: The amplitude of the first voltage of the electric signal flowing in the AC circuit is 300V or more, The amplitude of the second voltage of the electrical signal flowing in the DC circuit is less than 300 V, and the maximum absolute value of the second voltage is greater than or equal to 300 V. The amplitude of the third voltage of the electrical signal flowing in the first circuit is less than 300 V, and the maximum absolute value of the third voltage is less than 300 V. An amplitude of a fourth voltage of the electrical signal flowing in the second circuit is less than 300V, and a maximum absolute value of the third voltage is less than 300V.

3. The power module according to claim 1, wherein: The shortest distance between the components constituting the DC circuit and the components constituting the second circuit is less than three times the distance D.

4. The power module according to claim 1, wherein: The components constituting the AC circuit and the components constituting the second circuit are separated from each other in a plan view.

5. The power module according to claim 1, wherein: The power module further comprises: a metal housing electrically grounded; The first substrate and the second substrate are accommodated in the metal shell and fixed to the metal shell through insulating spacers.

6. The power module according to claim 5, characterized in that: No resin is filled between the metal housing and the first substrate or the second substrate, and between the first substrate and the second substrate.

7. The power module according to claim 5, characterized in that: The shortest distance between the metal housing and the components constituting the AC circuit is three times or more of the distance D.

8. The power module according to claim 5, characterized in that: The power module further comprises: a cable electrically connected to the second circuit and led out of the metal housing; The cable is separated with respect to a seventh region between the first substrate and the second substrate.

9. The power module according to claim 1, wherein: The first circuit is electrically connected to the first ground line, The second circuit is electrically connected to the second ground line, The DC circuit or the AC circuit is electrically connected to a third ground wire, The third ground is electrically connected to the first ground and the second ground via noise reduction components.

10. The power module according to claim 1, wherein: The mounting surface of the first substrate and the mounting surface of the second substrate are parallel to each other.

11. The power module according to claim 1, wherein: A plurality of second substrates are formed so as to sandwich the first substrate.

12. The power module according to claim 1, wherein: A protection circuit for protecting the DC circuit and the AC circuit is mounted in the first region.

13. The power module according to claim 1, wherein: The power module further comprises: a cable connected to an external power source of the power module; The cable is electrically connected to the second circuit.

14. The power module according to claim 1, wherein: The power module further comprises: a metal layer interposed between the components constituting the second circuit and the components constituting the AC circuit; The metal layer is electrically grounded.

15. A mass analysis device, characterized in that: The invention comprises an ion source for ionizing a sample, a filter electrode for selecting ions to be detected, an orbit control unit for controlling the movement orbits of ions and electrons, a conversion dynode for detecting the ions and converting them into electrons, and a detector for detecting the electrons. The conversion dynode and the detector are arranged in a track control unit. The power supply module according to claim 1 is used as a first power supply of the ion source, a second power supply of the filter electrode, a third power supply of the conversion dynode, or a fourth power supply of the detector.

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