Electronic Devices

Abstract

An electronic device includes a substrate, a polarizing plate, a flexible circuit board, a first transparent adhesive layer, a first colloid and a second colloid. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizing plate is arranged on the first side of the substrate. The flexible circuit board is connected to the first side of the substrate by a conductive adhesive. There is a gap between the flexible circuit board and the polarizing plate. The first transparent adhesive layer is arranged on the second side of the substrate. The first colloid is bonded to at least two of the substrate, the polarizing plate and the flexible circuit board. The second colloid is bonded to at least two of the substrate, the flexible circuit board and the first transparent adhesive layer. The first colloid is not in contact with the second colloid. The present case provides an electronic device, which can improve the problem of cracks generated during the bending test of an ultra-thin flexible substrate and strengthen the structure of the joint.

Description

Technical Field

[0001] The present invention relates to an electronic device. Specifically, the present invention relates to an electronic device in the field of touch control technology. Background Art

[0002] The existing touch panel does not have sufficient support on the upper and lower edges of the bonding area. During the touch panel assembly process, a bending test is required to confirm the stress load of the product, which makes it easy for cracks to occur at the joints of future ultra-thin flexible substrates and flexible circuit boards. For example, the previous technology CN106444121B only uses an adhesive layer on one side of the substrate, which cannot meet the stress bonding support of future ultra-thin flexible substrates.

[0003] Therefore, the above technology still has many defects, and practitioners in this field need to develop other suitable joining methods. Summary of the invention

[0004] One aspect of the present case relates to an electronic device. The electronic device includes a substrate, a polarizing plate, a flexible circuit board, a first transparent adhesive layer, a first colloid, and a second colloid. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizing plate is disposed on the first side of the substrate. The flexible circuit board is connected to the first side of the substrate with a conductive adhesive. There is a gap between the flexible circuit board and the polarizing plate. The first transparent adhesive layer is disposed on the second side of the substrate. The first colloid is bonded to at least two of the substrate, the polarizing plate, and the flexible circuit board. The second colloid is bonded to at least two of the substrate, the flexible circuit board, and the first transparent adhesive layer. The first colloid is not in contact with the second colloid.

[0005] In some embodiments, a thickness of the first colloid on the first side of the substrate is 2 to 5 times the thickness of the substrate.

[0006] In some embodiments, the thickness of the substrate is less than or equal to 50 microns.

[0007] In some embodiments, the first colloid and the second colloid are made of the same material or different materials.

[0008] In some embodiments, the first colloid and the second colloid are one of acrylic glue and silicone glue.

[0009] In some embodiments, the electronic device further comprises a second transparent adhesive layer. The second transparent adhesive layer is disposed on the polarizing plate and partially overlaps or does not overlap with the first colloid.

[0010] In some embodiments, the thickness of the second colloid does not exceed 100 microns.

[0011] In some embodiments, the width of the second colloid is no greater than 0.4 mm.

[0012] In some embodiments, the first colloid is bonded to the polarizing plate and the flexible circuit board and partially overlaps with the second transparent adhesive layer. The second colloid is bonded to the substrate, the flexible circuit board and the first transparent adhesive layer.

[0013] In some embodiments, the first colloid bonds the polarizing plate and the flexible circuit board and does not overlap with the second transparent adhesive layer. The second colloid bonds the substrate, the flexible circuit board and the first transparent adhesive layer.

[0014] In some embodiments, the first colloid is bonded to the polarizing plate and the flexible circuit board and partially overlaps with the second transparent adhesive layer. The second colloid is bonded to the substrate and the flexible circuit board.

[0015] In some embodiments, the first colloid is bonded to the polarizing plate and the flexible printed circuit board and partially overlaps with the second transparent adhesive layer. The second colloid is bonded to the substrate and the first transparent adhesive layer.

[0016] In some embodiments, the first colloid is bonded to the polarizing plate and the flexible printed circuit board and does not overlap with the second transparent adhesive layer. The second colloid is bonded to the substrate and the first transparent adhesive layer.

[0017] In some embodiments, the first colloid bonds the polarizing plate and the flexible circuit board and does not overlap with the second transparent adhesive layer. The second colloid bonds the substrate and the flexible circuit board.

[0018] In summary, the present invention provides an electronic device to improve the problem of cracks generated during the bending test of an ultra-thin flexible substrate and strengthen the joint structure.

[0019] The above description is only used to illustrate the problem to be solved by this case, the technical means to solve the problem, and the effects produced, etc. The specific details of this case will be introduced in detail in the following implementation method and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The content of this case can be better understood by referring to the embodiments in the subsequent paragraphs and the following drawings:

[0021] Figure 1A It is a partial structural diagram of an electronic device according to some embodiments of the present invention;

[0022] Figure 1B is a partial structural diagram of an electronic device according to some embodiments of the present invention;

[0023] Figure 1C is a partial structural diagram of an electronic device according to some embodiments of the present invention;

[0024] Figure 1D It is a partial structural diagram of an electronic device according to some embodiments of the present invention;

[0025] Figure 1EIt is a partial structural diagram of an electronic device according to some embodiments of the present invention;

[0026] Figure 1F It is a partial structural diagram of an electronic device according to some embodiments of the present invention;

[0027] Figure 2 A partial structural top view of an electronic device according to some embodiments of the present invention;

[0028] Figure 3 It is a partial structural side view of an electronic device according to some embodiments of the present invention;

[0029] Figure 4 A partial structural top view of an electronic device according to some embodiments of the present invention;

[0030] Figure 5 A partial structural side view of an electronic device according to some embodiments of the present invention; and

[0031] Figure 6 It is a bottom view of a partial structure of an electronic device according to some embodiments of the present case.

[0032]

Explanation of symbols

[0033] 100: Electronic devices

[0034] 110: Substrate

[0035] 120: Polarizing plate

[0036] 130: Flexible printed circuit board

[0037] 140: First transparent adhesive layer

[0038] 150,152: First colloid

[0039] 160~160B: Second colloid

[0040] 170: Second transparent adhesive layer

[0041] 180: Cover

[0042] H1~H9,H41:Thickness

[0043] D1, D4: Width

[0044] G: Gap

[0045] C: Conductive glue DETAILED DESCRIPTION

[0046] The spirit of the present invention will be clearly illustrated below with the accompanying drawings and detailed descriptions. After understanding the embodiments of the present invention, any person having ordinary knowledge in the technical field can make changes and modifications based on the techniques taught by the present invention without departing from the spirit and scope of the present invention.

[0047] The terms used herein are only for describing specific embodiments and are not intended to be limiting of the present invention. Singular forms such as "a", "this", "here", "this" and "the" as used herein also include plural forms.

[0048] The words “include,” “including,” “have,” “contain,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0049] The terms used herein generally have the ordinary meaning of each term used in the field, in the context of the present invention, and in the specific context, unless otherwise noted. Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the present invention.

[0050] Figure 1A This is a partial structural diagram of an electronic device according to some embodiments of the present invention. Figure 1A The electronic device 100 includes a substrate 110 , a polarizing plate 120 , a flexible printed circuit board 130 , a first transparent adhesive layer 140 , a first colloid 150 , and a second colloid 160 . In some embodiments, the electronic device 100 further includes a second transparent adhesive layer 170 and a cover plate 180 .

[0051] In some embodiments, the substrate 110 includes a first side and a second side. Figure 1A The second side is Figure 1A The first side is opposite to the second side. Figure 1A Although the first side and the second side are shown as the top and the bottom in the figure, in practice, the first side and the second side are not limited to the top and the bottom. In some embodiments, the substrate 110 is a one-piece glass touch panel (One Glass Solution, OGS) structure. It should be noted that this one-piece touch panel is also more likely to break when it falls or hits. However, since the substrate 110 in this case is made of plastics such as CPI (Colorless Polyimide) or PI (Polyimide) or PET (polyethylene terephthalate), the substrate 110 slightly reduces the impact force when it falls or hits and withstands a certain range of bending.

[0052] In addition, the polarizer 120 is disposed on the first side of the substrate 110. The flexible circuit board 130 is connected to the first side of the substrate 110 by a conductive adhesive C. In some embodiments, the thickness H1 of the substrate 110 is less than or equal to 50 micrometers. In some embodiments, the conductive adhesive C is anisotropic conductive adhesive.

[0053] In some embodiments, there is a gap G between the flexible circuit board 130 and the polarizing plate 120. The first transparent adhesive layer 140 is disposed on the second side of the substrate 110. The first colloid 150 is bonded to at least two of the substrate 110, the polarizing plate 120 and the flexible circuit board 130. The second colloid 160 is bonded to at least two of the substrate 110, the flexible circuit board 130 and the first transparent adhesive layer 140. The first colloid 150 is not in contact with the second colloid 160. In some embodiments, the width D1 of the gap G ranges from 0.5 mm to 1.5 mm. When the first colloid 150 fills the gap G, the width of the first colloid 150 is the same as the gap G. In some embodiments, the shapes and sizes of the first colloid 150 and the second colloid 160 are not limited to the drawings.

[0054] In some embodiments, the thickness H3 of the first transparent adhesive layer 140 is 100 micrometers. The thickness H6 of the second transparent adhesive layer 170 is 50 micrometers. The thickness H7 of the cover plate 180 is 60 micrometers. It should be noted that the first transparent adhesive layer 140 and the second transparent adhesive layer 170 are elastic and can absorb most of the external force, thereby reducing the influence of the external force on the substrate 110.

[0055] In some embodiments, the first colloid 150 and the second colloid 160 are made of the same material or different materials. In some embodiments, the material of the first colloid 150 and the second colloid 160 can be one of an acrylic adhesive and a silicone adhesive. In some embodiments, the acrylic adhesive can be one of the models such as Hysol-PC40-UMF, PERTEX-8106 and Henkel-3319M, but is not limited thereto. In some embodiments, the silicone adhesive can be Wacker-Lumi100 and Maitu-OP2012L. It should be noted that the first colloid 150 and the second colloid 160 of the present case are a curing adhesive and are used to strengthen and consolidate the joint structure of the substrate 110 and the flexible circuit board 130 of the present case, so that the panel will not crack after the joint structure is bent dozens of times.

[0056] In some embodiments, the first colloid 150 is bonded to the polarizing plate 120 and the flexible circuit board 130 and partially overlaps with the second transparent adhesive layer 170 . The second colloid is bonded to the substrate 110 , the flexible circuit board 130 and the first transparent adhesive layer 140 .

[0057] Figure 1BFIG. 1 is a partial structural diagram of an electronic device according to some embodiments of the present invention. In some embodiments, the first colloid 150 is bonded to the polarizing plate 120 and the flexible circuit board 130 and does not overlap with the second transparent adhesive layer 170 . The second colloid 150 is bonded to the substrate 110 , the flexible circuit board 130 and the first transparent adhesive layer 140 .

[0058] Figure 1C FIG. 1 is a partial structural diagram of an electronic device according to some embodiments of the present invention. In some embodiments, the first colloid 150 is bonded to the polarizing plate 120 and the flexible circuit board 130 and partially overlaps with the second transparent adhesive layer 170 . The second colloid 160 is bonded to the substrate 110 and the flexible circuit board 130 .

[0059] Figure 1D FIG. 1 is a partial structural diagram of an electronic device according to some embodiments of the present invention. In some embodiments, the first colloid 150 is bonded to the polarizing plate 120 and the flexible printed circuit board 130 and partially overlaps with the second transparent adhesive layer 170. The second colloid 160A is bonded to the substrate 110 and the first transparent adhesive layer 140. It should be noted that the second colloid 160A includes a thickness H8 and a width D3. The dispensing range of the second colloid 160A is determined according to the structure and the shape and size are not limited to the attached figure.

[0060] Figure 1E The following is a partial structural diagram of an electronic device according to some embodiments of the present invention. In some embodiments, the first colloid 150 is bonded to the polarizing plate 120 and the flexible printed circuit board 130 and does not overlap with the second transparent adhesive layer 170. The second colloid 160B is bonded to the substrate 110 and the first transparent adhesive layer 140. It should be noted that the second colloid 160B includes a thickness H9 and a width D4, and the second colloid 160B determines the dispensing range and the shape and size are not limited to the attached figure.

[0061] Figure 1F FIG. 1 is a partial structural diagram of an electronic device according to some embodiments of the present invention. In some embodiments, the first colloid 150 is bonded to the polarizing plate 120 and the flexible circuit board 130 and does not overlap with the second transparent adhesive layer 170. The second colloid 160 is bonded to the substrate 110 and the flexible circuit board 130. The first transparent adhesive layer 140 may not be in contact with the second colloid 160. The structures of the first transparent adhesive layer 140 and the second transparent adhesive layer 170 may be designed according to practical requirements and are not limited to the first transparent adhesive layer 140 and the second transparent adhesive layer 170. Figures 1A to 1F For the limit.

[0062] In some embodiments, to make the structure of the electronic device 100 of the present invention easier to understand, please refer to Figure 1A , Figure 2 and Figure 3 . Figure 2 FIG. 4 is a partial structural side view of an electronic device according to some embodiments of the present invention. Figure 3 According to some embodiments of the present invention, a method Figure 2 A top view of a partial structure of the electronic device shown. It should be noted that Figure 2 and Figure 3 The partial structure of FIG. 1 only presents the substrate 110 , the polarizing plate 120 , the flexible printed circuit board 130 and the first colloid 150 .

[0063] In some embodiments, see Figure 2 The first colloid 150 is on the substrate 110 and the first colloid 150 must fill the gap G. In addition, the thickness H4 of the first colloid 150 is between 70 micrometers and 110 micrometers. The thickness H41 of the partial layer structure 152 of the first colloid 150 on the flexible circuit board 130 is between 20 and 60 micrometers.

[0064] In some embodiments, the thickness H6 of the first colloid 150 on the first side of the substrate 110 is 2 to 5 times the thickness H1 of the substrate 110. In some embodiments, the thickness H41 of the partial layered structure 152 of the first colloid 150 on the flexible circuit board 130 is 0.8 to 2.4 times the thickness H1 of the substrate 110.

[0065] In some embodiments, see Figure 3 There is a gap G between the flexible circuit board 130 and the polarizing plate 120. Figure 3 As shown, the first colloid 150 is used to fill the joint between the flexible printed circuit board 130 and the substrate 110, and the polarizing plate 120 is joined. In some embodiments, the thickness H2 of the polarizing plate 120 is 66 micrometers.

[0066] In some embodiments, the first colloid 150 and the second colloid 160 are not in contact with each other, and therefore, the second colloid 160 cannot be seen from a top view.

[0067] In some embodiments, the second transparent adhesive layer 170 is disposed on the polarizing plate 120 and partially overlaps or does not overlap with the first colloid 150 .

[0068] Figure 4 FIG. 1 is a partial structural side view of an electronic device according to some embodiments of the present invention. Figure 2 , Figure 4 A side view of the second colloid 160 is added.

[0069] In some embodiments, see Figure 4 The thickness H5 of the second colloid 160 is not more than 100 micrometers, and the second colloid 160 is about 4 times the thickness of the substrate 110. The thickness H4 of the first colloid 150 is about 0.7 to 1.1 times the thickness H5 of the second colloid 160.

[0070] Figure 5 According to some embodiments of the present invention, a method Figure 4 A top view of a partial structure of an electronic device is shown. Figure 6 According to some embodiments of the present invention, a method Figure 4 A bottom view of a partial structure of an electronic device is shown.

[0071] In some embodiments, see Figure 4 and Figure 6 The width D2 of the second colloid 160 relative to the flexible printed circuit board 130 with the substrate 110 as a reference does not exceed 0.4 mm, and the second colloid 160 overflowing on the substrate 110 does not need to be controlled.

[0072] According to the aforementioned embodiments, the present invention provides an electronic device, thereby improving the problem of cracks generated during the bending test of an ultra-thin flexible substrate and strengthening the joint structure.

[0073] Although the present invention is disclosed in detail with reference to the embodiments above, the present invention does not exclude other feasible implementations. Therefore, the protection scope of the present invention shall be subject to the scope defined in the appended claims, rather than being limited by the aforementioned embodiments.

[0074] For those skilled in the art, various changes and modifications can be made to the present invention without departing from the spirit and scope of the present invention. Based on the above embodiments, all changes and modifications made to the present invention are also included in the protection scope of the present invention.

Claims

1. An electronic device, characterized in that: Include: A substrate comprising a first side and a second side, wherein the first side is opposite to the second side; a polarizing plate disposed on the first side of the substrate; a flexible circuit board connected to the first side of the substrate by a conductive adhesive, wherein a gap is formed between the flexible circuit board and the polarizing plate; a first transparent adhesive layer, disposed on the second side of the substrate; a first colloid bonding at least two of the substrate, the polarizing plate and the flexible printed circuit, wherein the first colloid fills the gap between a first side wall of the polarizing plate and a second side wall of the flexible printed circuit; and A second colloid is bonded to at least two of the substrate, the flexible printed circuit board and the first transparent adhesive layer, wherein: The first colloid is not in contact with the second colloid; and The second colloid contacts the second side of the substrate.

2. The electronic device according to claim 1, characterized in that: The thickness of the first colloid on the first side of the substrate is 2 to 5 times the thickness of the substrate.

3. The electronic device according to claim 1, characterized in that: The thickness of the substrate is less than or equal to 50 microns.

4. The electronic device according to claim 1, characterized in that: The first colloid and the second colloid are made of the same material or different materials.

5. The electronic device according to claim 4, characterized in that: The first colloid and the second colloid include one of an acrylic glue system and a silicone glue system.

6. The electronic device according to claim 1, characterized in that: Also includes: A second transparent adhesive layer is disposed on the polarizing plate and partially overlaps or does not overlap with the first colloid.

7. The electronic device according to claim 1, characterized in that: The thickness of the second colloid is no more than 100 micrometers.

8. The electronic device according to claim 1, characterized in that: The width of the second colloid does not exceed 0.4 mm.

9. The electronic device according to claim 6, characterized in that: The first colloid is bonded to the polarizing plate and the flexible circuit board and partially overlaps with the second transparent adhesive layer, wherein the second colloid is bonded to the substrate, the flexible circuit board and the first transparent adhesive layer.

10. The electronic device according to claim 6, characterized in that: The first colloid is bonded to the polarizing plate and the flexible circuit board and does not overlap with the second transparent adhesive layer, wherein the second colloid is bonded to the substrate, the flexible circuit board and the first transparent adhesive layer.

11. The electronic device according to claim 6, characterized in that: The first colloid is bonded to the polarizing plate and the flexible circuit board and partially overlaps with the second transparent adhesive layer, wherein the second colloid is bonded to the substrate and the flexible circuit board.

12. The electronic device according to claim 6, characterized in that: The first colloid is bonded to the polarizing plate and the flexible printed circuit board and partially overlaps with the second transparent adhesive layer, wherein the second colloid is bonded to the substrate and the first transparent adhesive layer.

13. The electronic device according to claim 6, characterized in that: The first colloid is bonded to the polarizing plate and the flexible printed circuit board and does not overlap with the second transparent adhesive layer, wherein the second colloid is bonded to the substrate and the first transparent adhesive layer.

14. The electronic device according to claim 6, characterized in that: The first colloid is bonded to the polarizing plate and the flexible circuit board and does not overlap with the second transparent adhesive layer, wherein the second colloid is bonded to the substrate and the flexible circuit board.

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