Photolithography apparatus and substrate adjustment method for photolithography apparatus

Abstract

The present invention discloses a photolithography device and a substrate adjustment method for the photolithography device. The photolithography device comprises a workpiece stage and a roller stage. The roller stage is used to transmit the substrate to the workpiece stage. The workpiece stage comprises a substrate adjustment device. The substrate adjustment device is used to adjust the Rz direction position of the substrate on the substrate station. The substrate adjustment device comprises a plurality of adsorption rotation modules, a plurality of clamping modules and a plurality of driving modules. When the substrate deviates in the Rz direction, the adsorption rotation module supports the plurality of substrates, the clamping module clamps the substrate and drives the substrate to rotate around the adsorption rotation module, so that the Rz direction position of the substrate on the substrate station can be adjusted.

Description

Technical Field

[0001] The present invention relates to the technical field of photolithography, and in particular to a photolithography device and a substrate adjustment method for the photolithography device. Background Art

[0002] In many semiconductor equipment such as lithography machines, the substrate needs to be handed over through a transfer station when it is transferred to the exposure station. Generally, a transfer station needs to be set up in front of the exposure station to transfer the substrate to the exposure position. In existing lithography machines, the substrate transfer fork mostly transfers 1500mm*1850mm substrates and does not have the ability to transfer two 1500mm*925mm substrates. Limited by the current level of technology, the evaporation machine on the production line can only process substrates with a maximum size of 1500mm*925mm. In order to improve the overall efficiency of the production line, the lithography machine needs to be able to directly expose a 1500mm*925mm substrate.

[0003] In addition, due to differences in demand or process requirements, the production line and roller table 2 only transfer a single 1500mm*925mm substrate each time, which requires the substrate transfer fork to be able to transfer two 1500mm*925mm substrates to the workpiece table in two times. Therefore, the substrate transfer fork needs to be able to transfer two 1500mm*925mm substrates to the workpiece table for exposure.

[0004] Because the entire workpiece stage will compensate once in the X, Y and Rz directions before scanning and exposure, if the two substrates are not parallel, the pattern on one substrate will inevitably be slanted, which will affect the yield and reduce production capacity. In order to adapt to the scanning and exposure of two substrates on the workpiece stage at the same time, it is necessary to adjust the two substrates in the Rz direction at the same time after transmission and loading, so that the Rz direction postures of the two substrates are consistent. Due to the constraints of spatial dimensions and high movement speed, the distance between the two substrates needs to be as small as possible to reduce the size and weight of the workpiece stage to adapt to the stroke of the exposure machine, and it is also beneficial to reduce the length of the transmission plate fork to improve stability.

[0005] Therefore, how to adjust the Rz direction position of the substrate relative to the workpiece stage is increasingly becoming one of the technical problems that technical personnel in this field need to solve urgently.

[0006] It should be noted that the information disclosed in the background technology section of the invention is only intended to deepen the understanding of the general background technology of the invention, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Summary of the invention

[0007] The object of the present invention is to provide a substrate adjustment device and method, a work stage, a photolithography device and method, which are used to solve the problem in the prior art that the Rz direction position of the substrate relative to the work stage needs to be adjusted.

[0008] In order to solve the above technical problems, the present invention provides a photolithography device, comprising a workpiece stage and a roller stage, wherein the roller stage is used to transfer a substrate to the workpiece stage, wherein the workpiece stage comprises a substrate adjustment device, wherein the substrate adjustment device is used to adjust the Rz direction position of substrates of the same size or different sizes on the substrate station, wherein the substrate adjustment device comprises:

[0009] A plurality of adsorption and rotation modules are configured to adsorb a plurality of substrates when the substrates are offset in the Rz direction, so that the substrates rotate only around the rotation center of the adsorption and rotation modules when being clamped;

[0010] A plurality of clamping modules, which are configured to clamp the substrate when the substrate is deflected in the Rz direction;

[0011] A plurality of driving modules are configured to drive the adsorption and rotation modules and / or the clamping modules to perform lifting movements, and drive the clamping modules to perform horizontal movements to drive the corresponding substrates to rotate around the adsorption and rotation modules.

[0012] Optionally, the driving module includes a first lifting unit, a second lifting unit and a horizontal motion unit;

[0013] The first lifting unit is used to drive the adsorption and rotation module to perform lifting movement;

[0014] The horizontal motion unit is used to drive the clamping module to perform horizontal motion so as to drive the corresponding substrate to rotate around the adsorption rotation module;

[0015] The second lifting unit is used to drive the horizontal motion unit to perform lifting motion so that the clamping module is located at a clamping position and an avoidance position. The clamping position is used to adjust the position of the substrate in the Rz direction, and the avoidance position is used to make the clamping module located below the plane where the surface of the substrate position is located.

[0016] Optionally, one of the second lifting units drives one or at least two of the horizontal motion units to perform lifting motion, and each of the horizontal motion units drives one of the clamping modules to perform horizontal motion to drive the corresponding substrate to rotate around the adsorption rotation module.

[0017] Optionally, one of the first lifting units drives one of the adsorption rotating modules to perform lifting motion.

[0018] Optionally, the number of the adsorption and rotation modules is one or at least two, and the number of the clamping modules is at least two;

[0019] One of the adsorption and rotation modules is used to support one of the substrates;

[0020] Each of the clamping modules is used for clamping one of the substrates.

[0021] Optionally, the substrate adjustment device further comprises a clamping position monitoring module;

[0022] The clamping position monitoring module is used to feed back the clamping position of the clamping module.

[0023] Optionally, the substrate adjustment device further includes:

[0024] A detection module, configured to detect whether the substrate is offset in the Rz direction on the substrate station;

[0025] The substrate station has a reference edge, and the detection module detects whether the substrate is offset in the Rz direction on the substrate station by acquiring angle deviation data between the substrate and the reference edge.

[0026] Optionally, the substrate station is used to float the substrate when adjusting the position of the substrate in the Rz direction, and to adsorb the substrate during exposure;

[0027] The base station is provided with a groove for accommodating the clamping module, and the base station is also provided with a through hole for accommodating the adsorption rotation module.

[0028] Based on the same inventive concept, the present invention also provides a substrate adjustment method for a lithography device, which is used to adjust the Rz direction position of substrates of the same size or different sizes on a substrate station, and the substrate adjustment method comprises the following steps:

[0029] Transferring a plurality of substrates to an adsorption rotating module on a substrate station;

[0030] When the substrate deviates in the Rz direction on the substrate station, the clamping module clamps the corresponding substrate and drives the corresponding substrate to rotate around the adsorption rotation module to adjust the Rz direction position of the substrate on the substrate station.

[0031] Optionally, the substrate includes a whole plate and a half plate, wherein the size of the whole plate is larger than that of the half plate, the whole plate occupies at least two of the substrate workstations, and the half plate occupies one of the substrate workstations.

[0032] Optionally, when the substrate is a half plate, the substrate adjustment method comprises the following steps:

[0033] transferring the half-plate to the corresponding substrate station;

[0034] The clamping modules located on both sides of the base station are raised to the clamping station, and the adsorption rotation module supports the half plate;

[0035] The clamping modules located at both sides of the substrate station cooperate to clamp the half plate and drive the half plate to rotate around the adsorption rotation module to adjust the Rz direction position of the half plate on the substrate station.

[0036] Optionally, when the substrate includes one whole plate, the substrate adjustment method includes the following steps:

[0037] The clamping module covered by the whole plate is lowered to the avoidance position;

[0038] Transferring the entire plate to a corresponding substrate station;

[0039] The clamping modules located on both sides of the whole plate are raised to the clamping station, and the adsorption rotating module supports the whole plate;

[0040] The clamping modules located on both sides of the whole plate cooperate to clamp the whole plate and drive the whole plate to rotate around the adsorption rotation module to adjust the Rz direction position of the whole plate on the substrate station.

[0041] Optionally, when the substrate includes a plurality of half plates, the substrate adjustment method includes the following steps:

[0042] transferring a plurality of the half panels to corresponding substrate stations;

[0043] The clamping modules located on both sides of the plurality of half plates are all raised to the clamping positions, and the plurality of adsorption and rotation modules respectively support the corresponding half plates;

[0044] The clamping modules located on both sides of the plurality of half plates cooperate to clamp the corresponding half plates respectively, and drive the plurality of half plates to rotate around the adsorption rotation module to respectively adjust the Rz direction positions of the plurality of half plates on the substrate station.

[0045] Optionally, when the substrate includes a plurality of the whole plates, the substrate adjustment method includes the following steps:

[0046] The clamping modules covered by the plurality of said whole panels are lowered to the avoidance position;

[0047] transferring the plurality of said whole plates to corresponding substrate stations;

[0048] The clamping modules located on both sides of the plurality of whole plates are all raised to the clamping positions, and the plurality of adsorption and rotation modules respectively support the corresponding whole plates;

[0049] The clamping modules located on both sides of the plurality of whole boards cooperate to clamp the corresponding whole boards respectively, and drive the whole boards to rotate around the adsorption rotation module to adjust the Rz direction position of the whole boards on the substrate station.

[0050] Optionally, when the substrate includes a plurality of the half panels and a plurality of the whole panels, the substrate adjustment method includes the following steps:

[0051] The clamping modules covered by the plurality of said whole panels are lowered to the avoidance position;

[0052] Transferring the plurality of half panels and the plurality of whole panels to corresponding substrate stations;

[0053] The clamping modules located on both sides of the plurality of half plates and on both sides of the plurality of whole plates are all raised to the clamping stations, and the plurality of adsorption and rotation modules respectively support the corresponding half plates and the whole plates;

[0054] The clamping modules located on the plurality of half-plates cooperate to clamp the corresponding half-plates respectively, and drive the plurality of half-plates to rotate around the adsorption rotation module to respectively adjust the Rz direction positions of the plurality of half-plates on the substrate station;

[0055] The clamping modules located on both sides of the plurality of whole boards cooperate to clamp the corresponding whole boards respectively, and drive the whole boards to rotate around the adsorption rotation module to adjust the Rz direction position of the whole boards on the substrate station.

[0056] Compared with the prior art, the present invention has the following beneficial effects:

[0057] 1. The photolithography device proposed in the present invention comprises a workpiece table and a roller table, wherein the roller table is used to transfer a substrate to the workpiece table, the workpiece table comprises a substrate adjustment device, the substrate adjustment device is used to adjust the Rz direction position of the substrate on the substrate station, and the substrate adjustment device comprises a plurality of adsorption and rotation modules, a plurality of clamping modules and a plurality of driving modules. When the substrate deviates in the Rz direction, the adsorption and rotation module supports a plurality of substrates, the clamping module clamps the substrate, and drives the substrate to rotate around the adsorption and rotation module, so that the Rz direction position of the substrate on the substrate station can be adjusted. The technical solution of the present application solves the problem of inconsistent adjustment of the Rz of two substrates relative to the workpiece table after being loaded at the same time. At the same time, the present solution does not need to measure the outer dimensions of the substrate to convert the reference reference position, and can only measure the angle deviation data between the substrate and the reference edge of the workpiece table through CCD, and compensate for the angle deviation by independently adjusting the angle of each substrate. The utilization rate of the substrate is improved to a certain extent, and the productivity of the equipment is improved. In addition, the technical solution of the present application has a simple structure, does not need to leave a large space on the substrate station, and has no effect on the modal and surface accuracy of the substrate station.

[0058] 2. By setting different types of clamping modules, different application scenarios can be met, for example, it can be applied to scenarios with only one substrate, or it can be applied to scenarios with two, three, four or even more substrates, or it can be applied to scenarios with four or more substrates. Through the structural design of multiple clamping modules, it can be compatible with the clamping of full-size substrates and half-plates without adjusting the layout of the clamping modules, avoiding the need to continuously increase the number of clamping modules when adjusting the positions of multiple substrates, thereby occupying too much volume on the workpiece table. The integration of the clamping module structure is improved and the cost of the device is reduced.

[0059] 3. Through the combination of different numbers of adsorption rotation modules and clamping modules, the Rz direction positions of three or four substrates can be adjusted simultaneously, which effectively improves the versatility of the substrate adjustment device for substrate sizes, improves the efficiency of substrate position adjustment, and saves the procurement cost of exposure equipment to a certain extent.

[0060] The present invention also provides a substrate adjustment method for a photolithography device, which belongs to the same inventive concept as the photolithography device and thus has the same beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 A schematic structural diagram of a photolithography device according to an embodiment of the present invention;

[0062] Figure 2 It is a schematic diagram of the layout of the adsorption rotation module and the clamping module;

[0063] Figure 3 A schematic diagram of a substrate adjustment device adjusting the position of a substrate in the Rz direction;

[0064] Figure 4 is a three-dimensional schematic diagram of a substrate adjustment device;

[0065] Figure 5 This is the main view of the adsorption rotation module;

[0066] Figure 6 for Figure 5 A cross-sectional view of

[0067] Figure 7 It is the main view of the clamping module;

[0068] Figure 8 is a top view of the clamping module;

[0069] Fig. 9 is a schematic diagram of a substrate adjustment device in a first application scenario in an embodiment of the present invention;

[0070] Fig.10It is a schematic diagram of the working process of the substrate adjustment device in the first application scenario of the embodiment of the present invention;

[0071] Fig.11 is a schematic diagram of a substrate adjustment device in a second application scenario in an embodiment of the present invention;

[0072] Fig.12 It is a schematic diagram of the working process of the substrate adjustment device in the second application scenario of the embodiment of the present invention;

[0073] Fig.13 is a schematic diagram of a substrate adjustment device in a third application scenario in an embodiment of the present invention;

[0074] Fig.14 It is a schematic diagram of the working process of the substrate adjustment device in the third application scenario of the embodiment of the present invention;

[0075] Fig.15 is a schematic diagram of a substrate adjustment device in a fourth application scenario in an embodiment of the present invention;

[0076] Fig.16 It is a schematic diagram of the working process of the substrate adjustment device in the fourth application scenario of the embodiment of the present invention;

[0077] Fig.17 A schematic flow chart of a substrate adjustment method for a photolithography device according to another embodiment of the present invention;

[0078] Among them, 1-workpiece table, 2-roller table, 10-adsorption rotation module, 101-voice coil motor, 102-suction cup, 103-guide rail, 104-suction cup seat, 105-bearing, 106-rising plate, 107-guide rail bracket, 108-mounting bracket, 109-adjustment bracket, 110-limit screw, 111-proximity switch, 112-proximity switch bracket, 113-encoder bracket, 114-encoder reader, 115-vertical limit block, 116-limit screw, 20-clamping module, 20-1-first type clamp Holding system, 20-2-Second type clamping system, 20-3-Third type clamping system, 201-Chuck, 202-Linear motor, 203-Cylinder, 204-Grating ruler, 205-Vertical guide rail, 206-Limiting bracket, 207-Limiting screw, 208-Encoder bracket, 209-Sensor sheet, 210-Proximity switch bracket, 211-Proximity switch, 212-Rising plate, 213-Vertical proximity switch, 214-Movable plate, 215-Guide rail, 216-Adapter plate, 30-Detection module, 40-Base station. DETAILED DESCRIPTION

[0079] The specific implementation of the present invention will be described in more detail below in conjunction with the schematic diagram. The advantages and features of the present invention will become clearer based on the following description. It should be noted that the drawings are all in a very simplified form and are not in exact proportions, and are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present invention.

[0080] In the description of the present invention, it is necessary to understand that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0081] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0082] Please refer to Figures 1 to 8 One embodiment of the present invention provides a photolithography device, characterized in that it includes a workpiece stage 1 and a roller stage 2, wherein the roller stage 2 is used to transfer a substrate to the workpiece stage 1, and the workpiece stage 1 includes a substrate adjustment device, wherein the substrate adjustment device is used to adjust the Rz direction position of substrates of the same size or different sizes on the substrate station. The substrate adjustment device includes a plurality of adsorption and rotation modules 10, a plurality of clamping modules 20, and a plurality of driving modules. The plurality of adsorption and rotation modules 10 are configured to adsorb a plurality of substrates when the substrates are offset in the Rz direction, so that the substrates rotate only around the rotation center of the adsorption and rotation modules when clamped. The plurality of clamping modules 20 are configured to clamp the substrates when the substrates are offset in the Rz direction. The plurality of driving modules are configured to drive the adsorption and rotation modules 10 and / or the clamping modules 20 to perform lifting and lowering movements, and drive the clamping modules 20 to perform horizontal movements to drive the corresponding substrates to rotate around the adsorption and rotation modules 10.

[0083] The difference from the prior art lies in that the lithography device proposed in the embodiment of the present invention includes a workpiece table 1 and a roller table 2, the roller table 2 is used to transfer the substrate to the workpiece table 1, the workpiece table 1 includes a substrate adjustment device, the substrate adjustment device is used to adjust the Rz direction position of the substrate on the substrate station, the substrate adjustment device includes a plurality of adsorption rotation modules, a plurality of clamping modules and a plurality of driving modules, when the substrate is offset in the Rz direction, the adsorption rotation module 10 supports a plurality of substrates, the clamping module 20 clamps the substrate and drives the substrate to rotate around the adsorption rotation module 10, so as to adjust the Rz direction position of the substrate on the substrate station 40. The technical solution of the present application solves the problem of inconsistent adjustment of the Rz direction of the workpiece stage 1 after two substrates are loaded at the same time, and can be compatible with the clamping of full-size substrates and half-plates without adjusting the layout of the clamping module 20. At the same time, the present solution does not need to measure the outer dimensions of the substrate to convert the reference reference position. The angle deviation data between the substrate and the reference edge of the workpiece stage 1 can be measured only by CCD (Charge-coupled Device), and the angle of each substrate can be adjusted independently to compensate for the angle deviation. To a certain extent, the utilization rate of the substrate is improved, and the productivity of the equipment is improved. In addition, the technical solution of the present application has a simple structure, and does not need to leave a large space on the substrate station 40, and has no effect on the modal and surface accuracy of the substrate station 40. It should be noted that the substrate station 40 may include a porous ceramic suction cup, which is mainly used to float the substrate when adjusting the position of the substrate in the Rz direction, and adsorb the substrate during exposure. Since the substrate is floated when adjusting the position of the substrate in the Rz direction, the damage to the substrate during the adjustment process can be effectively reduced, and the utilization rate of the substrate is improved.

[0084] Figure 2 and Figure 3 This is the layout diagram of the adsorption rotation module 10 and the clamping module 20. Since it is necessary to be compatible with the clamping of the half plate, four slots need to be opened on the substrate station 40 to facilitate the entry of the four clamping modules 20. Since the A3 and B3 clamping modules occupy the Y-direction dimension, in order to prevent the entire edge of the substrate from being exposed and the two substrates from interfering during rotation, the total Y-direction dimension of the substrate station 40 needs to be increased. Figure 3 For example, the Y-dimension of the substrate station 40 is increased from 1850mm to 1870mm. When clamping a full board, since the Y-dimension of the substrate is smaller than that of the substrate station 40, the front end of the Y-dimension of the full board is flush with the substrate station 40 after the board is loaded. In order to enable the B2 clamping module in the Y-dimension to clamp the substrate, the depth of the groove opened on the corresponding substrate station 40 is increased by 20mm.

[0085] For further information, please refer to Figure 5 and Figure 6 , Figure 5 is a front view of the adsorption and rotation module 10, Figure 6 It is a cross-sectional view of the adsorption and rotation module 10. The driving module includes a first lifting unit, a second lifting unit and a horizontal motion unit. The first lifting unit is used to drive the adsorption and rotation module to perform lifting and lowering motion; the horizontal motion unit is used to drive the clamping module to perform horizontal motion to drive the corresponding substrate to rotate around the adsorption and rotation module. The second lifting unit is used to drive one or two horizontal motion units to perform lifting and lowering motion, and each horizontal motion unit drives one clamping module to perform horizontal motion to drive the corresponding substrate to rotate around the adsorption and rotation module, and makes the clamping module be in a clamping position and an avoidance position, the clamping position is used to adjust the position of the substrate in the Rz direction, and the avoidance position is used to make the clamping module be located below the plane where the surface of the substrate position is located. Specifically, the first lifting unit is preferably a voice coil motor 101, and the adsorption and rotation module has an adsorption unit to adsorb or release the substrate, and the adsorption unit is preferably a suction cup 102. In the embodiments of the present invention, the first lifting unit uses the voice coil motor 101 and the adsorption unit uses the suction cup 102 as an example for description. In other embodiments, the first lifting unit may also use other types of motors, and the adsorption unit may also use other devices with the function of adsorbing and releasing the substrate, which is not limited here. Figures 1 to 3 It can be seen that in the embodiment of the present invention, the number of suction cups 102 in each of the adsorption and rotation modules 10 is 4. It is understandable that in other embodiments, the number of suction cups 102 can also be 1, 2, 3 or more, which is not limited here and can be selected according to actual needs. In the embodiment of the present invention, the adsorption and rotation module 10 is driven by the voice coil motor 101 to move up and down. The mover of the voice coil motor 101 rises under the guidance of the guide rail 103 so that the substrate is adsorbed on the four suction cups 102. Under the air flotation effect of the substrate station 40, the substrate can freely rotate around the axis of the voice coil motor 101 at a certain angle. When a substrate needs to be adjusted in the Rz direction, the suction cup 102 of the adsorption and rotation module 10 adsorbs one end of the substrate, and the horizontal reverse movement of the clamping module 20 causes the substrate to rotate around the axis of the coil motor, thereby achieving the purpose of adjusting the Rz direction position of the substrate. The adsorption and rotation module 10 is implemented by the suction cup 102 and the voice coil motor 101, which can effectively prevent the substrate from being damaged by other types of support mechanisms due to excessive force on the support area. Figure 5 and Figure 6The adsorption rotation module 10 also includes but is not limited to: a guide rail 103, a suction cup seat 104, a bearing 105, a rising plate 106, a guide rail bracket 107, a mounting bracket 108, an adjustment bracket 109, a limit screw 110, a proximity switch 111, a proximity switch bracket 112, an encoder bracket 113, an encoder reader 114, a vertical limit block 115, and a limit screw 116. It should be understood by those skilled in the art that the connection relationship of these structures can be referred to Figure 5 and Figure 6 The method shown in the figure may also utilize the existing connection methods in the prior art, which are not limited here and can be selected according to actual needs. Since these are not the focus of the present application, they will not be described here in order to save space.

[0086] For further information, please refer to Figure 7 and Figure 8 , Figure 7 This is a front view of a clamping module 20 provided in an embodiment of the present invention. Figure 8 for Figure 7 The driving module is used to drive the clamping module 20 when the substrate deviates in the Rz direction, so as to drive the substrate to rotate around the adsorption rotation module 10. The function of the clamping module 20 is to clamp the substrate. Figure 3 In the embodiment of the present invention, the clamping module 20 is a cylindrical clamp 201, and the clamping modules 20 located on both sides of the substrate can clamp the substrate. In addition to the cylindrical clamp 201 being used to realize the function of the clamping module 20, in other embodiments, the clamping module 20 can also be designed as a plate-shaped or long strip-shaped clamp 201. However, since this cylindrical clamping mechanism can effectively reduce the damage to the substrate during the adjustment process compared to the plate-shaped clamp 201, the cylindrical clamp 201 can be implemented as a preferred solution of the present invention.

[0087] Optionally, the driving module includes a horizontal motion unit, and the horizontal motion unit is used to drive the clamping module 20 to perform horizontal motion. Specifically, the horizontal motion unit is preferably a linear motor 202. In other embodiments, the horizontal motion unit can also use other types of motors, which are not limited here.

[0088] Furthermore, the driving module further includes a second lifting unit, which is used to drive the clamping module 20 to perform lifting motion. The second lifting unit is preferably a cylinder 203. The clamping module 20 can be driven by the cylinder 203 to perform lifting motion, so that the height of the clamping module 20 can be changed.

[0089] Furthermore, the substrate adjustment device further includes a clamping position monitoring module; the clamping position monitoring module is used to feedback the clamping position of the clamping module 20. The driving module may also be provided with a clamping position monitoring module, which is used to feedback the clamping position of the clamping module 20, thereby improving the accuracy of adjusting the position of the substrate in the Rz direction. The clamping position monitoring module is preferably a grating ruler 204.

[0090] It should be noted that the specific structure of the clamping module 20 can be selected according to actual needs, for example, Figure 2 and Figure 3 In the B2 clamping module, since the substrate is loaded in the substrate station 40 from the A2 clamping module to the B2 clamping module, the B2 clamping module does not need to have the function of lifting and lowering, that is, the B2 clamping module does not need to be provided with the second lifting unit. It can be understood by those skilled in the art that there are many other situations, and the above components can be freely combined according to actual needs, which will not be described one by one here.

[0091] In the embodiment of the present invention, the clamping module 20 can cooperate with a driving module, that is, a cylinder 203 and a group of linear motors 202. The clamping module 20 of this structure is defined as a first type of clamping system 20-1. The first type of clamping system 20-1 can be lifted and lowered by the cylinder 203, and can make way for the substrate when loading. The linear motors 202 drive the clamping modules 20 to clamp in the direction close to the substrate. One of the clamping modules 20 in the first type of clamping system 20-1 is a first clamping module. It is understandable that please refer to Figure 7 and Figure 8 The clamping module 20 also includes but is not limited to: a vertical guide rail 205, a limit bracket 206, a limit screw 207, an encoder bracket 208, a sensor sheet 209, a proximity switch bracket 210, a proximity switch 211, a rising plate 212, a vertical proximity switch 213, a movable plate 214, a guide rail 215, and an adapter plate 216.

[0092] The two clamping modules 20 can also cooperate with the two driving modules, wherein the clamping modules 20 and the driving modules are arranged one by one, and each driving module is used to drive a corresponding clamping module 20 when the substrate deviates in the Rz direction. The clamping module 20 of this structure is defined as the second type of clamping system 20-2. For the structure of the second type of clamping system 20-2, please refer to Figure 7 and Figure 8The vertical and horizontal movements of the clamping module 20 are provided by the cylinder 203 and two sets of linear motors 202. The second type of clamping system 20-2 can be lifted and lowered by the cylinder 203 under the guidance of two sets of vertical guide rails 205, and can make way for the substrate when loading. The two clamps 201 are driven by two sets of linear motors 202 and the feedback of two sets of grating rulers 204 to control the clamping position. In fact, the second type of clamping system 20-2 can be regarded as two sets of the first type of clamping system 20-1. In terms of structure, the two sets of the first type of clamping system 20-1 are integrated and designed to form the second type of clamping system 20-2. The two clamping modules 20 in the second type of clamping system 20-2 are the second clamping module and the third clamping module.

[0093] The four clamping modules 20 can also cooperate with the four driving modules, wherein the clamping modules 20 and the driving modules are arranged in a one-to-one correspondence, and each driving module is used to drive a corresponding clamping module 20 when the substrate is offset in the Rz direction. The clamping modules 20 of this structure are defined as a third-type clamping system 20-3, and the third-type clamping system 20-3 can be regarded as four groups of the first-type clamping systems 20-1 or two groups of the second-type clamping systems 20-2. In terms of structure, the four groups of the first-type clamping systems 20-1 or the two groups of the second-type clamping systems 20-2 are integrated and designed to form the third-type clamping system 20-3. The four clamping modules in the third-type clamping system are respectively the fourth clamping module, the fifth clamping module, the sixth clamping module and the seventh clamping module.

[0094] By setting different types of clamping modules 20, different application scenarios can be met. For example, the first type of clamping system 20-1 can be used in scenarios with only one substrate, the second type of clamping system 20-2 can be used in scenarios with two, three, four or even more substrates, and the third type of clamping system 20-3 can be used in scenarios with four or more substrates. The structural design of the second type of clamping system 20-2 and the third type of clamping system 20-3 avoids the problem of constantly increasing the number of clamping modules 20 when adjusting the positions of multiple substrates, thereby occupying too much volume of the workpiece table 1. The integration of the clamping module 20 structure is improved, and the cost of the device is reduced. Please refer to Figures 9 to 16 In the embodiment of the present invention, four different application scenarios are exemplified, which are the adjustment strategies of the substrate adjustment device for the Rz direction position of the substrate when the number of the substrate is one, two, three and four, and the corresponding structure of the substrate adjustment device. It can be understood that there are many other application scenarios, and the substrate adjustment device can be set to many different structures according to the corresponding application scenarios, which will not be described one by one here.

[0095] For the first application scenario, please refer to Fig. 9 When the number of the substrate is one, the substrate adjustment device adjusts the Rz direction position of the substrate according to the following strategy:

[0096] The first step: transferring the substrate to the substrate station 40;

[0097] Step 2: two of the first-type clamping systems 20 - 1 and one of the adsorption and rotation modules 10 are raised, and the adsorption and rotation module 10 supports the substrate;

[0098] Step 3: The two first-type clamping systems 20 - 1 clamp the substrate and drive the substrate to rotate around the adsorption rotation module 10 to adjust the Rz direction position of the substrate on the substrate station 40 .

[0099] Specifically, please refer to Fig.10 When a substrate is transferred to the designated station on the workpiece table 1, the substrate is loaded, the Rz direction is adjusted, and the substrate is unloaded according to the following steps:

[0100] Step 1: Workpiece table 1 moves to the handover position;

[0101] Step 2: The air flotation of the substrate station 40 is turned on;

[0102] Step 3: The substrate transfer robot carries the substrate to be loaded from the roller table 2;

[0103] Step 4: two of the first-type clamping systems 20 - 1 and one of the adsorption and rotation modules 10 are raised, the suction cup 102 of the adsorption and rotation module 10 is vacuum-opened, the substrate is adsorbed, and the suction cup 102 of the plate fork is vacuum-broken, and the plate fork is retracted to the workpiece table 1;

[0104] Step 5: The side edge of the substrate enters the field of view of the detection module 30, and the detection module 30 measures the offset of the substrate Rz and provides feedback;

[0105] Step 6: Calculate the displacement of each axis of the two first-type clamping systems 20-1 according to the feedback from the detection module 30, and send it to each axis for execution;

[0106] Step 7: The air flotation of the substrate station 40 is switched to vacuum, and the substrate is adsorbed on the upper surface of the substrate station 40;

[0107] Step 8: The two first-type clamping systems 20 - 1 and the one adsorption rotation module 10 are reset, and the workpiece stage 1 performs exposure-related processes;

[0108] Step 9: After the exposure is completed, the workpiece stage 1 moves to the handover position;

[0109] Step 10: The substrate station 40 switches to positive pressure to float the substrate;

[0110] Step 11: The substrate transfer robot moves to the substrate station 40 and adsorbs the substrate through the suction cup 102 for unloading.

[0111] For the second application scenario, please refer to Fig.11 When there are two substrates, the two substrates are respectively a first substrate and a second substrate, and the substrate adjustment device adjusts the Rz direction position of the substrate according to the following strategy:

[0112] Step 1: transferring the first substrate and the second substrate to corresponding substrate stations 40;

[0113] Step 2: two of the first-type clamping systems 20 - 1 , one of the second-type clamping systems 20 - 2 and two of the adsorption and rotation modules 10 are raised, and the two adsorption and rotation modules 10 support the first substrate and the second substrate respectively;

[0114] Step 3: One of the first type clamping systems 20-1 cooperates with a clamping module 20 in the second type clamping system 20-2 to clamp the first substrate, and drives the first substrate to rotate around the corresponding adsorption rotation module 10 to adjust the Rz direction position of the first substrate on the corresponding substrate station 40;

[0115] Step 4: Another clamping module 20 in the first type clamping system 20-1 cooperates with another clamping module 20 in the second type clamping system 20-2 to clamp the second substrate, and drives the second substrate to rotate around the corresponding adsorption rotating module 10 to adjust the Rz direction position of the second substrate on the corresponding substrate station 40.

[0116] Specifically, please refer to Fig.12 When two substrates are simultaneously transferred to the designated station on the workpiece table 1, the substrates are loaded, the Rz direction is adjusted, and the substrates are unloaded according to the following steps:

[0117] Step 1: Workpiece table 1 moves to the handover position;

[0118] Step 2: The air flotation of the substrate station 40 is turned on;

[0119] Step 3: The substrate transfer robot carries two substrates to load from the roller table 2;

[0120] Step 4: two of the first-type clamping systems 20-1, one of the second-type clamping systems 20-2 and two of the adsorption and rotation modules 10 are raised, the suction cups 102 of the adsorption and rotation modules 10 are vacuum-opened, the substrate is adsorbed and the suction cups 102 of the plate fork are vacuum-broken, and the plate fork is retracted to the workpiece table 1;

[0121] Step 5: The side edge of the substrate enters the field of view of the detection module 30, and the detection module 30 measures the offset of each substrate Rz and provides feedback;

[0122] Step 6: Calculate the displacement of each axis of the two first-type clamping systems 20-1 and the second-type clamping system 20-2 according to the feedback from the detection module 30, and send it to each axis for execution;

[0123] Step 7: The air flotation of the substrate station 40 is switched to vacuum, and the substrate is adsorbed on the upper surface of the substrate station 40;

[0124] Step 8: The two first-type clamping systems 20 - 1 , the one second-type clamping system 20 - 2 and the two adsorption rotating modules 10 are reset, and the workpiece stage 1 performs exposure-related processes;

[0125] Step 9: After the exposure is completed, the workpiece stage 1 moves to the handover position;

[0126] Step 10: The substrate station 40 switches to positive pressure to float the substrate;

[0127] Step 11: The substrate transfer robot moves to the substrate station 40 and adsorbs the substrate through the suction cup 102 for unloading.

[0128] For the third application scenario, please refer to Fig.13 The number of the adsorption and rotation modules 10 is three, the number of the clamping modules 20 is four, and the four clamping modules 20 include two of the first-type clamping systems 20 - 1 and two of the second-type clamping modules 20 .

[0129] The four clamping modules 20 are respectively arranged on a side of the substrate station 40 at intervals along the first direction, and the three adsorption rotation modules 10 are arranged on the part of the substrate station 40 away from the clamping module 20. The three adsorption rotation modules 10 are arranged on the substrate station 40 at intervals along the first direction, wherein two of the second-type clamping systems 20-2 are arranged between the two first-type clamping systems 20-1, and the first direction is the distribution direction of the substrate on the substrate station 40.

[0130] Please continue to refer to Fig.13 When the number of the substrates is three, the three substrates are respectively a first substrate, a second substrate and a third substrate, and the substrate adjustment device adjusts the Rz direction position of the substrate according to the following strategy:

[0131] Step 1: transferring the first substrate, the second substrate and the third substrate to corresponding substrate stations 40;

[0132] Step 2: two of the first-type clamping systems 20 - 1 , two of the second-type clamping systems 20 - 2 and three of the adsorption and rotation modules 10 are raised, and the three adsorption and rotation modules 10 support the first substrate, the second substrate and the third substrate respectively;

[0133] Step 3: One of the first-type clamping systems 20-1 cooperates with a clamping module 20 in one of the second-type clamping systems 20-2 to clamp the first substrate, and drives the first substrate to rotate around the corresponding adsorption rotation module 10 to adjust the Rz direction position of the first substrate on the corresponding substrate station 40;

[0134] Step 4: Another clamping module 20 in one of the second-type clamping systems 20-2 cooperates with a clamping module 20 in another of the second-type clamping systems 20-2 to clamp the second substrate, and drives the second substrate to rotate around the corresponding adsorption rotation module 10 to adjust the Rz direction position of the second substrate on the corresponding substrate station 40;

[0135] Step 5: Another clamping module 20 in another second-type clamping system 20-2 cooperates with another first-type clamping system 20-1 to clamp the third substrate, and drives the third substrate to rotate around the corresponding adsorption rotating module 10 to adjust the Rz direction position of the third substrate on the corresponding substrate station 40.

[0136] Specifically, please refer to Fig.14 When three substrates are simultaneously transferred to the designated station on the workpiece table 1, the substrates are loaded, the Rz direction is adjusted, and the substrates are unloaded according to the following steps:

[0137] Step 1: Workpiece table 1 moves to the handover position;

[0138] Step 2: The air flotation of the substrate station 40 is turned on;

[0139] Step 3: The substrate transfer robot carries three substrates to be loaded from the roller table 2;

[0140] Step 4: two of the first-type clamping systems 20-1, two of the second-type clamping systems 20-2 and three of the adsorption and rotation modules 10 are raised, the suction cups 102 of the adsorption and rotation modules 10 are vacuum-opened, the substrate is adsorbed and the suction cups 102 of the plate fork are vacuum-broken, and the plate fork is retracted to the workpiece table 1;

[0141] Step 5: The side edge of the substrate enters the field of view of the detection module 30, and the detection module 30 measures the offset of each substrate Rz and provides feedback;

[0142] Step 6: Calculate the displacement of each axis of the two first-type clamping systems 20-1 and the two second-type clamping systems 20-2 according to the feedback from the detection module 30, and send it to each axis for execution;

[0143] Step 7: The air flotation of the substrate station 40 is switched to vacuum, and the substrate is adsorbed on the upper surface of the substrate station 40;

[0144] Step 8: The two first-type clamping systems 20 - 1 , the two second-type clamping systems 20 - 2 and the three adsorption rotating modules 10 are reset, and the workpiece stage 1 performs exposure-related processes;

[0145] Step 9: After the exposure is completed, the workpiece stage 1 moves to the handover position;

[0146] Step 10: The substrate station 40 switches to positive pressure to float the substrate;

[0147] Step 11: The substrate transfer robot moves to the substrate station 40 and adsorbs the substrate through the suction cup 102 for unloading.

[0148] Optionally, refer to Fig.15 The number of the adsorption and rotation modules 10 is four, the number of the clamping modules 20 is three, and the three clamping modules 20 include two of the second type clamping systems 20 - 2 and one of the third type clamping modules 20 .

[0149] The three clamping modules 20 are respectively arranged at the middle position of the substrate station 40 along the first direction, and the four adsorption rotation modules 10 are respectively arranged on the four substrate stations 40, wherein the third type of clamping system 20-3 is arranged between two of the second type of clamping systems 20-2, and the first direction is the distribution direction of the substrate on the substrate station 40.

[0150] For the fourth application scenario, please continue to refer to Fig.15 When the number of the substrates is four, the four substrates are respectively a first substrate, a second substrate, a third substrate and a fourth substrate, and the substrate adjustment device adjusts the Rz direction position of the substrate according to the following strategy:

[0151] Step 1: transferring the first substrate, the second substrate, the third substrate and the fourth substrate to corresponding substrate stations 40;

[0152] Step 2: two of the second-type clamping systems 20 - 2 , one of the third-type clamping systems 20 - 3 and four of the adsorption and rotation modules 10 are raised, and the four adsorption and rotation modules 10 respectively support the first substrate, the second substrate, the third substrate and the fourth substrate;

[0153] Step 3: A clamping module 20 of the second type clamping system 20-2 cooperates with the first clamping module 20 of the third type clamping system 20-3 to clamp the first substrate, and drives the first substrate to rotate around the corresponding adsorption rotation module 10 to adjust the Rz direction position of the first substrate on the corresponding substrate station 40;

[0154] Step 4: Another clamping module 20 of the second type clamping system 20-2 cooperates with the second clamping module 20 of the third type clamping system 20-3 to clamp the second substrate, and drives the second substrate to rotate around the corresponding adsorption rotating module 10 to adjust the Rz direction position of the second substrate on the corresponding substrate station 40;

[0155] Step 5: Another clamping module 20 of the second type clamping system 20-2 cooperates with the third clamping module 20 of the third type clamping system 20-3 to clamp the third substrate, and drives the third substrate to rotate around the corresponding adsorption rotating module 10 to adjust the Rz direction position of the third substrate on the corresponding substrate station 40;

[0156] Step 6: Another clamping module 20 of the second type clamping system 20-2 cooperates with the fourth clamping module 20 of the third type clamping system 20-3 to clamp the fourth substrate, and drives the fourth substrate to rotate around the corresponding adsorption rotating module 10 to adjust the Rz direction position of the fourth substrate on the corresponding substrate station 40.

[0157] Specifically, please refer to Fig.16 When four substrates are simultaneously transferred to the designated station on the workpiece table 1, the substrates are loaded, the Rz direction is adjusted, and the substrates are unloaded according to the following steps:

[0158] Step 1: Workpiece table 1 moves to the handover position;

[0159] Step 2: The air flotation of the substrate station 40 is turned on;

[0160] Step 3: The substrate transfer robot carries four substrates to load from the roller table 2;

[0161] Step 4: two of the second-type clamping systems 20-2, one of the third-type clamping systems 20-3 and four of the adsorption and rotation modules 10 are raised, the suction cups 102 of the adsorption and rotation modules 10 are vacuum-opened, the substrate is adsorbed and the suction cups 102 of the plate fork are vacuum-broken, and the plate fork is retracted to the workpiece table 1;

[0162] Step 5: The side edge of the substrate enters the field of view of the detection module 30, and the detection module 30 measures the offset of each substrate Rz and provides feedback;

[0163] Step 6: Calculate the displacement of each axis of the two second-type clamping systems 20-2 and one third-type clamping system 20-3 according to the feedback of the detection module 30, and send it to each axis for execution;

[0164] Step 7: The air flotation of the substrate station 40 is switched to vacuum, and the substrate is adsorbed on the upper surface of the substrate station 40;

[0165] Step 8: The two second-type clamping systems 20 - 2 , the one third-type clamping system 20 - 3 and the four adsorption rotating modules 10 are reset, and the workpiece stage 1 performs exposure-related processes;

[0166] Step 9: After the exposure is completed, the workpiece stage 1 moves to the handover position;

[0167] Step 10: The substrate station 40 switches to positive pressure to float the substrate;

[0168] Step 11: The substrate transfer robot moves to the substrate station 40 and adsorbs the substrate through the suction cup 102 for unloading.

[0169] By combining different numbers of adsorption rotating modules 10 and clamping modules 20, it is possible to adjust the positions of three or four substrates in the Rz direction at the same time, effectively improving the versatility of the substrate adjustment device for substrate sizes, improving the efficiency of substrate position adjustment, and saving the purchase cost of exposure equipment for panel users to a certain extent. Those skilled in the art can undoubtedly infer the specific structure of the substrate adjustment device corresponding to other similar application scenarios through the contents recorded in the embodiments of the present invention, for example, when the number of the substrates is five, six or more, which will not be described one by one here.

[0170] Optionally, the substrate adjustment device further includes a detection module 30, and the detection module 30 is configured to detect whether the substrate is offset in the Rz direction on the substrate station 40. The detection module 30 is preferably a CCD. In order to improve the accuracy of detecting the offset of the substrate in the Rz direction, two CCDs can be set corresponding to the wider side of the substrate, and one CCD can be set corresponding to the narrower side of the substrate. Of course, the specific number of CCDs can also be selected according to actual needs, which will not be described in detail here.

[0171] Optionally, the substrate station 40 has a reference edge, and the detection module 30 detects whether the substrate is offset in the Rz direction on the substrate station 40 by acquiring the angle deviation data between the substrate and the reference edge. It can be understood that the reference edge can be any side edge of the substrate station 40, which can be specifically selected according to actual application conditions and is not limited here.

[0172] In order to facilitate understanding of the technical solution of the present application, a more specific solution for the substrate adjustment device is provided below: An embodiment of the present invention provides a substrate adjustment device that is compatible with the adjustment of a full-size whole board and a half board; please refer to Figure 1 The A1 adsorption and rotation module is driven by the voice coil motor 101 to move the four suction cups 102 up and down. The voice coil motor 101 moves up under the guidance of the guide rail 103 so that the substrate is adsorbed on the four suction cups 102. Under the air flotation effect of the substrate station 40, the substrate can freely rotate around the axis of the voice coil motor 101 by an angle. For the structure of the A1 adsorption and rotation module, please refer to Figure 5 and Figure 6 The A2 clamping module 20 is composed of a cylinder 203 and a set of linear motors 202. The assembly can be lifted and lowered by the cylinder 203, and can make way for the substrate when loading. The linear motors 202 drive the clamp 201 to clamp in the direction of the substrate. For the structure of the A3 and B3 clamping modules, please refer to Figure 7 and Figure 8 The vertical and horizontal movements of the A3 and B3 clamping modules are provided by the cylinder 203 and two sets of linear motors 202. The components can be raised and lowered by the cylinder 203 under the guidance of two sets of vertical guide rails 205, and can make way for the substrate when loading. The two chucks 201 are driven by two sets of linear motors 202 and the feedback of two sets of grating rulers 204 to control the clamping position. Figure 1 Since the feeding direction of the clamping module B2 is from the clamping module A2 to the clamping module B2, the clamping module B2 does not need to be raised or lowered to make way for the feeding. The linear motor 202 drives the clamp 201 to clamp and adjust the Rz direction position in the direction of the substrate. The structure and function of the adsorption and rotation module B1 are consistent with those of the adsorption and rotation module A1, and is used to adsorb another substrate and provide a reference for the substrate to rotate around the axis. The substrate station 40 is used to float the substrate when the substrate adjusts the Rz direction position and to adsorb the substrate during exposure. In the embodiment of the present invention, the substrate station 40 is prepared using a porous ceramic suction cup, which is limited by the current processing technology level of the porous ceramic suction cup. The substrate station 40 can be composed of 3 small porous ceramic suction cup plates or 2 small porous ceramic suction cup plates. In the foreseeable future technology, the substrate station 40 can also be prepared by a whole porous ceramic suction cup or other materials, which is not limited here. Figure 2 and Figure 3 The layout of the suction cup 102 and the clamp 201 is shown in FIG. 4. Since the clamping of the half-board needs to be compatible, four slots need to be opened on the substrate station 40 to facilitate the entry of the A2 clamping module, the B2 clamping module, and the A3 and B3 clamping modules. Since the A3 and B3 clamping modules occupy the Y-direction dimension of the substrate station 40, in order to prevent the entire edge of the substrate from being exposed, the total Y-direction dimension of the substrate station 40 needs to be increased. Figure 3For example, the Y dimension of the substrate station 40 is increased from 1850mm to 1870mm. When clamping the whole board, since the Y dimension of the substrate is smaller than the Y dimension of the substrate station 40, the Y front end of the substrate is flush with the substrate station 40 after the whole board is loaded. In order to enable the B2 clamping module in the Y direction to clamp the substrate, the groove depth of the B2 clamping module on the corresponding substrate station 40 is increased by 20mm. Please refer to Figure 2 , when putting on HalfA board, use A1 adsorption and rotation module, A2 clamping module and A3 clamping module 20. When putting on HalfB board, use B1 adsorption and rotation module, B2 clamping module and B3 clamping module. When putting on a full board, use A1 adsorption and rotation module, A2 clamping module and B2 clamping module. A substrate adjustment device proposed in an embodiment of the present invention is compatible with the adjustment of full-size substrates and half boards, has a simple structure, does not require a large clearance space on the substrate station 40, and has no effect on the modal and surface accuracy of the substrate station 40; when clamping is required, the clamping module 20 is raised in the Z direction, and then the air flotation of the substrate station 40 is opened to make the substrate rise in the Z direction first, and then the chuck 201 moves in the Y direction. With the trend of further expansion of substrate size in the future, the Rz direction position of three or four boards can be adjusted simultaneously by adding components. Compared with the existing solutions, the versatility of the equipment for substrate size is improved, the efficiency of substrate position adjustment is improved, and the exposure equipment procurement cost of panel users is saved.

[0173] Based on the same inventive concept, another embodiment of the present invention further provides a substrate adjustment method for a lithography device, which is used to adjust the Rz direction position of the substrate on the substrate station 40. The substrate adjustment device is used, please refer to Fig.17 , the substrate adjustment method comprises the following steps:

[0174] S1: transferring a plurality of substrates to the adsorption rotation module 10 on the substrate station 40;

[0175] S2: When the substrate deviates in the Rz direction on the substrate station 40 , the clamping module 20 clamps the corresponding substrate and drives the corresponding substrate to rotate around the adsorption rotation module 10 to adjust the Rz direction position of the substrate on the substrate station 40 .

[0176] Specifically, the substrate includes a whole plate and a half plate, wherein the size of the whole plate is larger than that of the half plate, the whole plate occupies at least two of the substrate stations, and the half plate occupies one of the substrate stations.

[0177] Further, when the substrate is a half plate, the substrate adjustment method comprises the following steps:

[0178] Step 1: transferring the half plate to the corresponding substrate station;

[0179] Step 2: The clamping modules located on both sides of the base station are raised to the clamping station, and the adsorption rotating module supports the half plate;

[0180] Step 3: The clamping modules located on both sides of the substrate station cooperate to clamp the half plate and drive the half plate to rotate around the adsorption rotation module to adjust the Rz direction position of the half plate on the substrate station.

[0181] Optionally, when the substrate includes one whole plate, the substrate adjustment method includes the following steps:

[0182] Step 1: The clamping module covered by the entire plate is lowered to the avoidance position;

[0183] Step 2: transferring the entire board to the corresponding substrate station;

[0184] Step 3: The clamping modules on both sides of the whole plate are raised to the clamping station, and the adsorption rotating module supports the whole plate;

[0185] Step 4: The clamping modules located on both sides of the whole plate cooperate to clamp the whole plate, and drive the whole plate to rotate around the adsorption rotation module to adjust the Rz direction position of the whole plate on the substrate station.

[0186] Optionally, when the substrate includes a plurality of half plates, the substrate adjustment method includes the following steps:

[0187] The first step: transferring a plurality of the half panels to corresponding substrate stations;

[0188] Step 2: The clamping modules located on both sides of the plurality of half-plates are all raised to the clamping positions, and the plurality of adsorption and rotation modules respectively support the corresponding half-plates;

[0189] Step 3: The clamping modules located on both sides of the multiple half-plates cooperate to clamp the corresponding half-plates respectively, and drive the multiple half-plates to rotate around the adsorption rotation module to respectively adjust the Rz direction positions of the multiple half-plates on the substrate station.

[0190] Optionally, when the substrate includes a plurality of the whole plates, the substrate adjustment method includes the following steps:

[0191] The clamping modules covered by the plurality of said whole panels are lowered to the avoidance position;

[0192] transferring the plurality of said whole plates to corresponding substrate stations;

[0193] The clamping modules located on both sides of the plurality of whole plates are all raised to the clamping positions, and the plurality of adsorption and rotation modules respectively support the corresponding whole plates;

[0194] The clamping modules located on both sides of the plurality of whole boards cooperate to clamp the corresponding whole boards respectively, and drive the whole boards to rotate around the adsorption rotation module to adjust the Rz direction position of the whole boards on the substrate station.

[0195] Optionally, when the substrate includes a plurality of the half panels and a plurality of the whole panels, the substrate adjustment method includes the following steps:

[0196] The clamping modules covered by the plurality of said whole panels are lowered to the avoidance position;

[0197] Transferring the plurality of half panels and the plurality of whole panels to corresponding substrate stations;

[0198] The clamping modules located on both sides of the plurality of half plates and on both sides of the plurality of whole plates are all raised to the clamping stations, and the plurality of adsorption and rotation modules respectively support the corresponding half plates and the whole plates;

[0199] The clamping modules located on the plurality of half-plates cooperate to clamp the corresponding half-plates respectively, and drive the plurality of half-plates to rotate around the adsorption rotation module to respectively adjust the Rz direction positions of the plurality of half-plates on the substrate station;

[0200] The clamping modules located on both sides of the plurality of whole boards cooperate to clamp the corresponding whole boards respectively, and drive the whole boards to rotate around the adsorption rotation module to adjust the Rz direction position of the whole boards on the substrate station.

[0201] In summary, the present invention has the following beneficial effects:

[0202] 1. The photolithography device proposed in the present invention comprises a workpiece table and a roller table, wherein the roller table is used to transfer a substrate to the workpiece table, the workpiece table comprises a substrate adjustment device, the substrate adjustment device is used to adjust the Rz direction position of the substrate on the substrate station, and the substrate adjustment device comprises a plurality of adsorption and rotation modules, a plurality of clamping modules and a plurality of driving modules. When the substrate deviates in the Rz direction, the adsorption and rotation module supports a plurality of substrates, the clamping module clamps the substrate, and drives the substrate to rotate around the adsorption and rotation module, so that the Rz direction position of the substrate on the substrate station can be adjusted. The technical solution of the present application solves the problem of inconsistent adjustment of the Rz of two substrates relative to the workpiece table after being loaded at the same time. At the same time, the present solution does not need to measure the outer dimensions of the substrate to convert the reference reference position, and can only measure the angle deviation data between the substrate and the reference edge of the workpiece table through CCD, and compensate for the angle deviation by independently adjusting the angle of each substrate. The utilization rate of the substrate is improved to a certain extent, and the productivity of the equipment is improved. In addition, the technical solution of the present application has a simple structure, does not need to leave a large space on the substrate station, and has no effect on the modal and surface accuracy of the substrate station.

[0203] 2. By setting different types of clamping modules, different application scenarios can be met, for example, it can be applied to scenarios with only one substrate, or it can be applied to scenarios with two, three, four or even more substrates, or it can be applied to scenarios with four or more substrates. Through the structural design of multiple clamping modules, it can be compatible with the clamping of full-size substrates and half-plates without adjusting the layout of the clamping modules, avoiding the need to continuously increase the number of clamping modules when adjusting the positions of multiple substrates, thereby occupying too much volume on the workpiece table. The integration of the clamping module structure is improved and the cost of the device is reduced.

[0204] 3. Through the combination of different numbers of adsorption rotation modules and clamping modules, the Rz direction positions of three or four substrates can be adjusted simultaneously, which effectively improves the versatility of the substrate adjustment device for substrate sizes, improves the efficiency of substrate position adjustment, and saves the procurement cost of exposure equipment to a certain extent.

[0205] The present invention also provides a substrate adjustment method for a photolithography device, which belongs to the same inventive concept as the photolithography device and thus has the same beneficial effects.

[0206] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0207] The above is only a preferred embodiment of the present invention and does not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, makes any form of equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which does not depart from the content of the technical solution of the present invention and still falls within the protection scope of the present invention.

Claims

1. A lithography apparatus, characterized in that: The invention comprises a workpiece stage and a roller stage, wherein the roller stage is used to transfer a substrate to the workpiece stage, the workpiece stage comprises a substrate adjustment device, and the substrate adjustment device is used to adjust the Rz direction position of substrates of the same size or different sizes on the substrate station, and the substrate adjustment device comprises: A plurality of adsorption and rotation modules are configured to adsorb a plurality of substrates when the substrates are offset in the Rz direction, so that the substrates rotate only around the rotation center of the adsorption and rotation modules when being clamped; A plurality of clamping modules, which are configured to clamp the substrate when the substrate is deflected in the Rz direction; A plurality of driving modules are configured to drive the adsorption and rotation modules and / or the clamping modules to perform lifting movements, and drive the clamping modules to perform horizontal movements to drive the corresponding substrates to rotate around the adsorption and rotation modules.

2. The lithography apparatus according to claim 1, wherein: The driving module includes a first lifting unit, a second lifting unit and a horizontal motion unit; The first lifting unit is used to drive the adsorption and rotation module to perform lifting movement; The horizontal motion unit is used to drive the clamping module to perform horizontal motion so as to drive the corresponding substrate to rotate around the adsorption rotation module; The second lifting unit is used to drive the horizontal motion unit to perform lifting motion so that the clamping module is located at a clamping position and an avoidance position. The clamping position is used to adjust the position of the substrate in the Rz direction, and the avoidance position is used to make the clamping module located below the plane where the surface of the substrate position is located.

3. The lithography apparatus according to claim 2, wherein: One of the second lifting units drives one or at least two of the horizontal motion units to perform lifting motion, and each of the horizontal motion units drives one of the clamping modules to perform horizontal motion to drive the corresponding substrate to rotate around the adsorption rotation module.

4. The lithography apparatus according to claim 2, wherein: One of the first lifting units drives one of the adsorption rotating modules to perform lifting motion.

5. The lithography apparatus according to claim 1, wherein: The number of the adsorption and rotation modules is one or at least two, and the number of the clamping modules is at least two; One of the adsorption and rotation modules is used to support one of the substrates; Each of the clamping modules is used for clamping one of the substrates.

6. The lithography apparatus according to claim 1, wherein: The substrate adjustment device also includes a clamping position monitoring module; The clamping position monitoring module is used to feed back the clamping position of the clamping module.

7. The lithography apparatus according to claim 1, wherein: The substrate adjustment device further comprises: A detection module, configured to detect whether the substrate is offset in the Rz direction on the substrate station; The substrate station has a reference edge, and the detection module detects whether the substrate is offset in the Rz direction on the substrate station by acquiring angle deviation data between the substrate and the reference edge.

8. The lithography apparatus according to claim 1, wherein: The substrate station is used to float the substrate when adjusting the position of the substrate in the Rz direction, and to adsorb the substrate during exposure; The base station is provided with a groove for accommodating the clamping module, and the base station is also provided with a through hole for accommodating the adsorption rotation module.

9. A method for adjusting a substrate of a photolithography device, characterized in that: The method is used to adjust the Rz direction position of substrates of the same size or different sizes on a substrate station, and the substrate adjustment method comprises the following steps: Transferring a plurality of substrates to an adsorption rotating module on a substrate station; When the substrate deviates in the Rz direction on the substrate station, the clamping module clamps the corresponding substrate and drives the corresponding substrate to rotate around the adsorption rotation module to adjust the Rz direction position of the substrate on the substrate station.

10. The substrate adjustment method of the photolithography apparatus according to claim 9, characterized in that: The substrate includes a whole plate and a half plate, wherein the size of the whole plate is larger than that of the half plate, the whole plate occupies at least two of the substrate workstations, and the half plate occupies one of the substrate workstations.

11. The substrate adjustment method of the photolithography apparatus according to claim 10, characterized in that: When the substrate is a half plate, the substrate adjustment method comprises the following steps: transferring the half-plate to the corresponding substrate station; The clamping modules located on both sides of the base station are raised to the clamping station, and the adsorption rotation module supports the half plate; The clamping modules located at both sides of the substrate station cooperate to clamp the half plate and drive the half plate to rotate around the adsorption rotation module to adjust the Rz direction position of the half plate on the substrate station.

12. The substrate adjustment method of the photolithography apparatus according to claim 10, characterized in that: When the substrate comprises a whole plate, the substrate adjustment method comprises the following steps: The clamping module covered by the whole plate is lowered to the avoidance position; Transferring the entire plate to a corresponding substrate station; The clamping modules located on both sides of the whole plate are raised to the clamping station, and the adsorption rotating module supports the whole plate; The clamping modules located on both sides of the whole plate cooperate to clamp the whole plate and drive the whole plate to rotate around the adsorption rotation module to adjust the Rz direction position of the whole plate on the substrate station.

13. The substrate adjustment method of a lithography apparatus according to claim 10, characterized in that: When the substrate includes a plurality of half plates, the substrate adjustment method includes the following steps: transferring a plurality of the half panels to corresponding substrate stations; The clamping modules located on both sides of the plurality of half plates are all raised to the clamping positions, and the plurality of adsorption and rotation modules respectively support the corresponding half plates; The clamping modules located on both sides of the plurality of half plates cooperate to clamp the corresponding half plates respectively, and drive the plurality of half plates to rotate around the adsorption rotation module to respectively adjust the Rz direction positions of the plurality of half plates on the substrate station.

14. The substrate adjustment method of a lithography apparatus according to claim 10, wherein: When the substrate includes a plurality of the whole plates, the substrate adjustment method includes the following steps: The clamping modules covered by the plurality of said whole panels are lowered to the avoidance position; transferring the plurality of said whole plates to corresponding substrate stations; The clamping modules located on both sides of the plurality of whole plates are all raised to the clamping positions, and the plurality of adsorption and rotation modules respectively support the corresponding whole plates; The clamping modules located on both sides of the plurality of whole boards cooperate to clamp the corresponding whole boards respectively, and drive the whole boards to rotate around the adsorption rotation module to adjust the Rz direction position of the whole boards on the substrate station.

15. The substrate adjustment method of a lithography apparatus according to claim 10, wherein: When the substrate includes a plurality of the half panels and a plurality of the whole panels, the substrate adjustment method includes the following steps: The clamping modules covered by the plurality of said whole panels are lowered to the avoidance position; Transferring the plurality of half panels and the plurality of whole panels to corresponding substrate stations; The clamping modules located on both sides of the plurality of half plates and on both sides of the plurality of whole plates are all raised to the clamping stations, and the plurality of adsorption and rotation modules respectively support the corresponding half plates and the whole plates; The clamping modules located on the plurality of half-plates cooperate to clamp the corresponding half-plates respectively, and drive the plurality of half-plates to rotate around the adsorption rotation module to respectively adjust the Rz direction positions of the plurality of half-plates on the substrate station; The clamping modules located on both sides of the plurality of whole boards cooperate to clamp the corresponding whole boards respectively, and drive the whole boards to rotate around the adsorption rotation module to adjust the Rz direction position of the whole boards on the substrate station.

Images