Leveling pressurizing device and patch equipment thereof

Abstract

The present invention relates to the field of patch equipment technology, and in particular to a leveling and pressurizing device and patch equipment thereof. The leveling and pressurizing device comprises: a guide rail, a first pressurizing component, a second pressurizing component, a first slider, a driving unit and a leveling component. The present invention adopts a design in which the leveling component cooperates with the first slider, so that when in a floating connection state, the first pressurizing component can use the second working surface as a reference and force the first working surface to fit with the second working surface by pressing down, thereby establishing the position of the first pressurizing component. After the position is established, the leveling component is switched to a fixed connection state to complete the leveling operation, thereby ensuring that the first working surface and the second working surface are parallel to each other. The device has the advantages of convenient operation and good effect, is particularly suitable for small desktop devices, and only needs to be leveled once to continue working, and does not need to be leveled every time it works, saving time and effort.

Description

Technical Field

[0001] The present invention relates to the technical field of patch equipment, in particular to a leveling and pressurizing device. In addition, the present invention also relates to a patch equipment comprising the leveling and pressurizing device. Background Art

[0002] With the development of electronic products, electronic parts are becoming more and more sophisticated, and the importance of packaging technology is also increasing. At present, the placement machine used in the field of chip bonding and packaging is mainly composed of a driving unit and two pressurizing components. When working, the chip and the substrate are placed between the two pressurizing components, and then the driving unit drives the pressurizing components to press the chip to achieve sintering bonding between the chip and the substrate;

[0003] In order to prevent the common pressure deviation problem during chip bonding, the placement machine in the prior art is usually equipped with a leveling device. However, the existing leveling device mainly uses a spherical leveling structure for leveling, but it can only perform passive leveling and cannot perform active leveling operations, resulting in the problem of pressure deviation still being prone to occur during chip bonding. Summary of the invention

[0004] The technical problem to be solved by the present invention is: in order to solve the problem that the placement machine in the prior art is prone to pressure deviation during chip bonding, an adjustable leveling and pressurizing device is provided. In addition, the present invention also provides a placement equipment including the above-mentioned adjustable leveling and pressurizing device.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a leveling pressurizing device, comprising:

[0006] Guide rails, mounted on the rack;

[0007] A first pressurizing assembly having a first working surface;

[0008] A second pressurizing assembly having a second working surface arranged opposite to the first working surface, wherein the first pressurizing assembly is mounted on a frame and / or a guide rail;

[0009] A first sliding block matches the guide rail and is slidably mounted on the guide rail;

[0010] A driving unit, used for driving the first pressurizing component to move closer to or farther from the second pressurizing component;

[0011] and a first leveling assembly, used for connecting the first pressurizing assembly to the first slider, and having a floating connection state and a fixed connection state;

[0012] When the first leveling component is in a floating connection state and the first pressurizing component moves closer to the second pressurizing component, the first pressurizing component drives the first slider to move through the first leveling component, and the first leveling component allows the first pressurizing component to adaptively adjust its position as the first working surface contacts the second working surface, so as to achieve the fitting of the first working surface with the second working surface;

[0013] When the first leveling assembly is in a fixed connection state, the position of the first pressurizing assembly is fixed on the first sliding block.

[0014] In this solution, during leveling, the first leveling component is in a floating connection state, the position of the first pressurizing component is not fixed, the position of the second pressurizing component is fixed, and there is a certain parallelism deviation between the first working surface and the second working surface. Then a certain pressure is applied to the first pressurizing component, and the first pressurizing component adaptively adjusts its position as it contacts the second working surface until the first working surface and the second working surface are tightly fitted. Then the position of the first pressurizing component is fixed by using the first leveling component, thereby ensuring that the first working surface and the second working surface are parallel to each other. It has the advantages of easy operation and good effect, and is particularly suitable for small desktop devices. It only needs to be leveled once to continue working, and there is no need to level it every time, which saves time and effort.

[0015] Further, the first leveling assembly includes a first connecting member and a first fastening member;

[0016] The first connecting member is fixedly connected to the first pressurizing assembly and is provided with a first mounting hole;

[0017] The first fastener passes through the first mounting hole and is used to detachably fix the first connecting member to the first sliding block; a first gap is left between the outer peripheral wall of the portion of the first fastener located in the first mounting hole and the inner peripheral wall of the first mounting hole;

[0018] Due to the existence of the first gap, when the first fastener is not fixed, the first connecting member and the first pressure assembly thereon can move within the range constrained by the first gap, so that the first pressure assembly can fine-tune its position. After the position of the first pressure assembly is established, the first fastener is tightened to fix the position of the first pressure assembly on the first slider to ensure that the first working surface and the second working surface are parallel to each other.

[0019] In order to prevent the first pressure component from tilting again after leveling, further, first leveling components are configured on both sides of the first pressure component, and the frame has guide rails on both sides of the first pressure component, and the first sliders are slidably installed on the guide rails, and the first leveling component is connected to the first slider on its side; through the design of the double-sided first leveling components and the first slider, the forces on both sides of the first pressure component are balanced, thereby ensuring that the first pressure component will not tilt during operation.

[0020] In order to improve the accuracy of pressure sensor detection, further, the second pressurizing component has a mounting surface at one end away from the second working surface, a pressure sensor is arranged between the mounting surface and the frame, the pressure sensor is fixedly mounted on the frame, and a second slider matching the pressure sensor is slidably mounted on the guide rail;

[0021] Also included is a second leveling assembly, which is used to connect the second pressurizing assembly to the second slider, and has a floating connection state and a fixed connection state;

[0022] When the second leveling component is in a floating connection state and the second pressurizing component moves closer to the pressure sensor, the second pressurizing component drives the second slider to move through the second leveling component, and the second leveling component allows the second pressurizing component to adaptively adjust its position as the mounting surface contacts the force-bearing surface of the pressure sensor, thereby achieving the fitting of the mounting surface and the force-bearing surface;

[0023] When the second leveling assembly is in a fixed connection state, the position of the second pressurizing assembly is fixed on the second sliding block;

[0024] During leveling, the second leveling component is in a floating connection state, the position of the second pressurizing component is not fixed, the position of the pressure sensor is fixed, and there is a certain parallelism deviation between the mounting surface and the force-bearing surface of the pressure sensor. Then a certain pressure is applied to the second pressurizing component, and the second pressurizing component adaptively adjusts its position as it contacts the force-bearing surface until the mounting surface and the force-bearing surface are tightly fitted. Then the second leveling component is used to fix the position of the second pressurizing component, thereby ensuring that the mounting surface and the force-bearing surface are parallel to each other, thereby improving the accuracy of pressure sensor detection.

[0025] Further, the second leveling assembly includes a second connecting member and a first fastening member;

[0026] The second connecting member is fixedly connected to the second pressurizing assembly and is provided with a second mounting hole;

[0027] The second fastener passes through the second mounting hole and is used to detachably fix the second connecting member to the second sliding block; a second gap is left between the outer peripheral wall of the portion of the second fastener located in the second mounting hole and the inner peripheral wall of the second mounting hole;

[0028] Due to the existence of the second gap, when the second fastener is not fixed, the second connecting member and the first pressure assembly thereon can move within the range constrained by the second gap, so that the second pressure assembly can fine-tune its position. After the position of the second pressure assembly is established, the second fastener is tightened to fix the position of the second pressure assembly on the second slider to ensure that the mounting surface and the force-bearing surface are parallel to each other.

[0029] In order to prevent the second pressure component from tilting again after leveling, further, second leveling components are configured on both sides of the second pressure component, and the frame has guide rails on both sides of the second pressure component, and the second sliders are slidably installed on the guide rails, and the second leveling component is connected to the second slider on its side; through the design of the double-sided second leveling components and the second sliders, the forces on both sides of the second pressure component are balanced, thereby ensuring that the second pressure component will not tilt during operation.

[0030] In order to improve the uniformity of the force applied to the first pressurizing assembly, further, the driving unit includes a driving mechanism and a balanced force application mechanism;

[0031] The balanced force-applying mechanism comprises a ball-joint assembly and an elastic buffer assembly having elasticity, the output end of the driving mechanism is transmission-connected to the ball-joint assembly through the elastic buffer assembly, and the ball-joint assembly is transmission-connected to the first pressurizing assembly;

[0032] The elastic buffer component can play a buffering role by using its own elasticity, so as to more accurately control the pressure applied to the chip; after the pressure of the driving mechanism is transmitted to the elastic buffer component, the elastic buffer component transmits the pressure to the ball assembly, and the ball assembly can concentrate the pressure dispersed by the elastic buffer component to a central point, ensuring the balance of the pressure applied to the first pressurizing component and preventing pressure unbalance problems caused by manufacturing and assembly errors of the elastic buffer component.

[0033] In order to facilitate manufacturing and assembly, further, the elastic buffer assembly includes a fixed plate, a movable plate, a guide rod and an elastic element;

[0034] The output end of the driving mechanism is fixedly connected to the fixed plate, the movable plate is fixedly connected to the ball pair assembly, one of the fixed plate and the movable plate is fixedly connected to the guide rod, and the other is slidably connected to the guide rod along the moving direction of the first slider, and the elastic element is located between the movable plate and the fixed plate.

[0035] In order to realize the transmission connection between the ball sub-assembly and the elastic buffer assembly and the first pressurizing assembly, the ball sub-assembly further comprises a ball sub-plate 1, a center ball, a ball sub-plate 2 and a limit plate, wherein the center ball is located between the ball sub-plate 1 and the ball sub-plate 2, and a reset hole is provided at one end of the limit plate, and the other end is fixedly connected to the ball sub-plate 2;

[0036] The ball auxiliary plate 1 or the movable plate is provided with a reset rod, the reset rod is inserted into the reset hole, and a third gap is left between the outer peripheral wall of the reset rod located in the reset hole and the inner peripheral wall of the reset hole;

[0037] One of the ball auxiliary plate 1 and the ball auxiliary plate 2 is fixedly connected to the movable plate, and the other is fixedly connected to the first pressurizing assembly;

[0038] The setting of the third gap, on the one hand, can realize that when the first pressurizing component is pressurized, all the pressure applied to the ball sub-plate one by the elastic buffer component can be concentratedly transmitted by the central ball to the ball sub-plate two, and then transmitted to the first pressurizing component by the ball sub-assembly two; on the other hand, when the first pressurizing component is reset, the ball sub-plate one pulls the limit plate through the reset rod, so that the ball sub-plate two and the central ball move along the reset direction with the first pressurizing component; at the same time, the setting of the limit plate and the reset rod also limits the relative position of the ball sub-plate one and the ball sub-plate two, so that the central ball can be constrained between the ball sub-plate one and the ball sub-plate two.

[0039] The present invention also provides a patch device, comprising the above-mentioned leveling and pressurizing device.

[0040] The beneficial effects of the present invention are as follows: the leveling and pressurizing device of the present invention adopts a design in which a leveling component is matched with a first slider, so that when in a floating connection state, the first pressurizing component can use the second working surface as a reference, and force the first working surface and the second working surface to fit together by pressing down, thereby establishing the position of the first pressurizing component. After the position is established, the leveling component is switched to a fixed connection state to complete the leveling operation, thereby ensuring that the first working surface and the second working surface are parallel to each other. It has the advantages of convenient operation and good effect, and is particularly suitable for small desktop devices. It only needs to be leveled once to continue working, and there is no need to level every time it works, which saves time and effort. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0042] Figure 1 is a schematic diagram of the adjustable leveling pressurizing device of the present invention;

[0043] Figure 2 yes Figure 1 AA section view;

[0044] Figure 3 yes Figure 2 A partial enlarged schematic diagram of B in the middle;

[0045] Figure 4 yes Figure 2 Schematic diagram of CC section;

[0046] Figure 5 It is an exploded schematic diagram of the first pressurizing component being connected to the first sliding block through the leveling component in the present invention;

[0047] Figure 6 It is a three-dimensional schematic diagram of the first pressurizing component in the present invention being connected to the first sliding block through the leveling component;

[0048] Figure 7 It is a three-dimensional schematic diagram of the elastic buffer component and the ball pair component when they are assembled in the present invention;

[0049] Figure 8 It is a two-dimensional schematic diagram of the elastic buffer component and the ball pair component when they are assembled in the present invention;

[0050] Fig. 9 yes Figure 8 DD section diagram;

[0051] Fig.10 yes Fig. 9 EE section view;

[0052] Fig.11 yes Fig.10 A partial enlarged schematic diagram of middle F;

[0053] Fig.12 is a schematic diagram of the installation of the second pressurizing assembly;

[0054] Fig.13 yes Fig.12 Schematic diagram of cross-section along GG direction;

[0055] Fig.14 yes Fig.13 A partial enlarged schematic diagram of H in the middle;

[0056] Fig.15 yes Fig.13 Schematic diagram of cross section in the KK direction;

[0057] In the figure: 1, first pressurizing assembly, 1-1, first working surface;

[0058] 2. second pressurizing assembly, 2-1. second working surface, 2-2. mounting surface;

[0059] 3. First leveling assembly, 3-1. First connecting member, 3-11. First mounting hole, 3-2. First fastener, 3-3. First gap;

[0060] 4. elastic buffer assembly, 4-1. fixed plate, 4-2. movable plate, 4-21. third threaded hole, 4-3. guide rod, 4-4. elastic element, 4-5. limit nut;

[0061] 5. Ball pair assembly, 5-1. Ball pair plate 1, 5-2. Center ball, 5-3. Ball pair plate 2, 5-4. Limit plate, 5-41. Reset hole, 5-5. Reset rod, 5-6. Third gap;

[0062] 6. driving mechanism, 6-1. motor, 6-2. lead screw, 6-3. transmission nut, 6-4. nut base plate, 6-5. third connecting member, 6-6. third slider;

[0063] 7, second leveling assembly, 7-1, second connecting member, 7-11, second mounting hole, 7-2, second fastening member, 7-3, second gap;

[0064] 8. Second sliding block, 8-1. Second threaded hole;

[0065] 9. Pressure sensor, 9-1. Force bearing surface;

[0066] 10. Guide rail, 11. Rack;

[0067] 12. A first sliding block. 12-1. A first threaded hole. DETAILED DESCRIPTION

[0068] The present invention will now be described in further detail in conjunction with the accompanying drawings. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, so they only show the components related to the present invention, and directions and references (e.g., up, down, left, right, etc.) may only be used to help describe the features in the drawings. Therefore, the following specific embodiments are not adopted in a restrictive sense, and the scope of the subject matter of the requested insulation is limited only by the attached claims and their equivalents.

[0069] like Figure 1-11 As shown, a leveling pressurizing device comprises:

[0070] The guide rail 10 is fixedly mounted on the frame 11;

[0071] A first pressurizing assembly 1 having a first working surface 1-1;

[0072] The second pressurizing assembly 2 has a second working surface 2-1 arranged opposite to the first working surface 1-1, and the first pressurizing assembly 1 is installed on the frame 11 and / or the guide rail 10;

[0073] The first slider 12 matches the guide rail 10 and is slidably mounted on the guide rail 10;

[0074] A driving unit, used for driving the first pressurizing component 1 to move closer to or farther from the second pressurizing component 2 along a straight line;

[0075] And a first leveling component 3 is used to connect the first pressurizing component 1 to the first slider 12, and has a floating connection state and a fixed connection state; when the first leveling component 3 is in the floating connection state and the first pressurizing component 1 moves toward the second pressurizing component 2, the first pressurizing component 1 drives the first slider 12 to move through the first leveling component 3, and the first leveling component 3 allows the first pressurizing component 1 to adaptively adjust its position as the first working surface 1-1 contacts the second working surface 2-1, thereby achieving the fitting of the first working surface 1-1 with the second working surface 2-1; when the first leveling component 3 is in the fixed connection state, the position of the first pressurizing component 1 is fixed on the first slider 12.

[0076] like Figure 5 and 6 As shown, in this embodiment, the first leveling component 3 includes a first connecting member 3-1 and a first fastening member 3-2; the first connecting member 3-1 is fixedly connected to the first pressurizing component 1 and is provided with a first mounting hole 3-11; the first fastening member 3-2 passes through the first mounting hole 3-11 and is used to detachably fix the first connecting member 3-1 on the first slider 12; Figure 3 As shown, a first gap 3-3 is left between the outer peripheral wall of the portion of the first fastener 3-2 located in the first mounting hole 3-11 and the inner peripheral wall of the first mounting hole 3-11; the cross section of the first mounting hole 3-11 can be elliptical, circular, oblong or square, etc. In this embodiment, a first mounting hole 3-11 with a circular cross section is specifically adopted;

[0077] In this embodiment, the first connecting member 3-1 may be integrally formed with the first slider 12, or the first connecting member 3-1 may be fixedly connected to the first slider 12 by mechanical connection;

[0078] The specific implementation methods of the first fastener 3-2 detachably fixing the first connecting member 3-1 include but are not limited to the following forms:

[0079] One is that the first fastener 3-2 is a screw, and the first slider 12 is provided with a first threaded hole 12-1 that matches the first fastener 3-2. The first fastener 3-2 passes through the first mounting hole 3-11 and is threadedly connected to the first threaded hole 12-1. The aperture of the first mounting hole 3-11 is larger than the aperture of the first threaded hole 12-1. When the first fastener 3-2 is not tightened, the first pressurizing component 1 can move within the range constrained by the first gap 3-3 to facilitate fine-tuning of the position. After the position of the first pressurizing component 1 is established, the first fastener 3-2 is tightened again so that the nut of the first fastener 3-2 is pressed against the first connecting member 3-1, thereby fixing the position of the first pressurizing component 1 on the first slider 12.

[0080] Secondly, the first fastener 3-2 includes a stud and a nut, and the stud is fixed to the first slider 12 by welding, clamping, threaded connection and integral molding, and is threadedly connected to the nut after passing through the first mounting hole 3-11; when the nut is not tightened, the first pressure component 1 can move within the range constrained by the first gap 3-3 to facilitate fine-tuning of the position; when the nut is tightened, it presses against the first connecting piece 3-1, thereby fixing the position of the first pressure component 1 on the first slider 12.

[0081] The first pressurizing component 1 is provided with a first leveling component 3 on both sides, and the frame 11 is provided with guide rails 10 on both sides of the first pressurizing component 1, and the first sliders 12 are slidably mounted on the guide rails 10, and the first leveling component 3 is connected to the first slider 12 on the side where it is located; through the design of the double-sided first leveling component 3 and the first slider 12, the forces on both sides of the first pressurizing component 1 are balanced, thereby ensuring that the first pressurizing component 1 will not be skewed due to the lateral load during the working process;

[0082] like Figure 7-11 As shown, in this embodiment, the driving unit includes a driving mechanism 6 and a balancing force applying mechanism;

[0083] The balanced force-applying mechanism comprises a ball-joint assembly 5 and an elastic buffer assembly 4 with elasticity. The output end of the driving mechanism 6 is transmission-connected to the ball-joint assembly 5 through the elastic buffer assembly 4 . The ball-joint assembly 5 is transmission-connected to the first pressurizing assembly 1 .

[0084] The elastic buffer assembly 4 includes a fixed plate 4-1, a movable plate 4-2, a guide rod 4-3 and an elastic element 4-4; the output end of the driving mechanism 6 is fixedly connected to the fixed plate 4-1, the movable plate 4-2 is fixedly connected to the ball joint assembly 5, one end of the elastic element 4-4 abuts against the movable plate 4-2, and the other end abuts against the fixed plate 4-1. In this embodiment, the fixed plate 4-1 is fixedly connected to the guide rod 4-3, the guide rod 4-3 passes through the movable plate 4-2, and is slidably connected to the movable plate 4-2 along the moving direction of the first slider 12, and a limit nut 4-5 is threadedly connected to the guide rod 4-3, and the limit nut 4-5 abuts against one end of the movable plate 4-2 away from the fixed plate 4-1 The fixed plate 4-1, the guide rod 4-3 and the movable plate 4-2 are connected to each other in a fixed manner, so that the fixed plate 4-1, the guide rod 4-3 and the movable plate 4-2 form a whole, thereby preventing the movable plate 4-2 from falling off the guide rod 4-3. At the same time, by screwing the limit nut 4-5, the distance between the fixed plate 4-1 and the movable plate 4-2 can be changed to adjust the elastic force of the elastic element 4-4; or, in this embodiment, the movable plate 4-2 is fixedly connected to the guide rod 4-3, the guide rod 4-3 passes through the fixed plate 4-1, and is slidably connected to the fixed plate 4-1 along the moving direction of the first slider 12, and the guide rod 4-3 is threadedly connected to the limit nut 4-5, and the limit nut 4-5 presses against the end face of the fixed plate 4-1 away from the movable plate 4-2.

[0085] In order to improve the buffering performance, the elastic element 4-4 adopts a spring. There are multiple springs and guide rods 4-3, and they correspond one to one. The spring is sleeved outside the corresponding guide rod 4-3 to prevent the spring from being skewed. The springs between the fixed plate 4-1 and the movable plate 4-2 are circumferentially spaced around the center of the ball pair assembly 5 to improve the uniformity of pressure distribution. In this embodiment, four springs are specifically used, and the four springs are distributed at the four corners of the square. The center of the circumscribed circle of the square and the center of the central ball 5-2 coincide with the center line of the first pressurizing assembly 1.

[0086] In this embodiment, after the pressure of the driving mechanism 6 is transmitted to the spring, the spring can play a buffering role. Subsequently, the spring transmits the pressure to the ball assembly 5. The ball assembly 5 can concentrate the dispersed pressure of each spring to a central point, thereby ensuring the balance of the pressure applied to the first pressurizing component 1 and preventing the pressure unbalance problem caused by spring manufacturing and assembly errors; thereby, the first leveling component 3 and the balanced force-applying mechanism jointly ensure the uniformity of the force on the chip during bonding, and the unbiased pressure application can also prevent the first pressurizing component 1 from tilting after leveling.

[0087] In this embodiment, the ball sub-assembly 5 comprises a ball sub-plate 1 5-1, a center ball 5-2, a ball sub-plate 2 5-3 and a stop plate 5-4. The center ball 5-2 is located between the ball sub-plate 1 5-1 and the ball sub-plate 2 5-3. In order to prevent the center ball 5-2 from falling off, the ball sub-plate 1 5-1 and the ball sub-plate 2 5-3 are both provided with recessed parts. The two ends of the center ball 5-2 are respectively located in the recessed parts of the ball sub-plate 1 5-1 and the ball sub-plate 2 5-3.

[0088] One of the ball sub-plate 1 5-1 and the ball sub-plate 2 5-3 is fixedly connected to the movable plate 4-2, and the other is fixedly connected to the first pressurizing assembly 1; taking the case where the ball sub-plate 1 5-1 is fixedly connected to the movable plate 4-2 as an example, the ball sub-plate 2 5-3 is fixedly connected to the first pressurizing assembly 1. In order to improve the uniformity of the force applied by the first pressurizing assembly 1, the ball sub-plate 1 5-1 is preferably fixed at the middle position of the movable plate 4-2;

[0089] One end of the limit plate 5-4 is provided with a reset hole 5-41, and the other end is fixedly connected to the ball auxiliary plate 5-3; the ball auxiliary plate 5-1 or the movable plate 4-2 is fixed with a reset rod 5-5, and the reset rod 5-5 is inserted into the reset hole 5-41, such as Fig.11 As shown, a third gap 5-6 is left between the outer peripheral wall of the portion of the reset rod 5-5 located in the reset hole 5-41 and the inner peripheral wall of the reset hole 5-41;

[0090] The reset rod 5-5 is fixed to the ball sub-plate 5-1 or the movable plate 4-2 by means of threaded connection, clamping, welding or integral molding; the reset rod 5-5 can also be replaced by a fastener. Taking a screw as an example, a third threaded hole 4-21 matching the reset rod 5-5 is provided on the ball sub-plate 5-1 or the movable plate 4-2, and the reset rod 5-5 passes through the reset hole 5-41 and is threadedly connected in the third threaded hole 4-21.

[0091] The setting of the third gap 5-6, on the one hand, can realize that when the first pressurizing component 1 is pressurized, all the pressure applied by the elastic buffer component 4 to the ball sub-plate 1 5-1 can be concentratedly transmitted by the center ball 5-2 to the ball sub-plate 2 5-3, and then transmitted to the first pressurizing component 1 by the ball sub-plate 2 5-3; on the other hand, when the first pressurizing component 1 is reset, the ball sub-plate 1 5-1 pulls the limit plate 5-4 through the reset rod 5-5, so that the ball sub-plate 2 5-3 and the center ball 5-2 move along the reset direction with the first pressurizing component 1; at the same time, the setting of the limit plate 5-4 and the reset rod 5-5 also limits the relative positions of the ball sub-plate 1 5-1 and the ball sub-plate 2 5-3, thereby constraining the center ball 5-2; in addition, the setting of the third gap 5-6 also makes the balancing force mechanism and the first pressurizing component 1 a non-rigid connection, which will not affect the leveling of the first pressurizing component 1.

[0092] In this embodiment, the driving mechanism 6 includes a motor 6-1, a screw rod 6-2, a transmission nut 6-3 and a nut base plate 6-4, a third connecting member 6-5 is fixed on the nut base plate 6-4, a third slider 6-6 matching with it is slidably mounted on the guide rail 10, and the third connecting member 6-5 is fixedly connected to the third slider 6-6 by screws. Specifically, in this embodiment, the connection structure between the third slider 6-6 and the third connecting member 6-5 is the same as the connection structure between the first slider 12 and the first connecting member 3-1; the output end of the motor 6-1 is transmission-connected to the screw rod 6-2, and the screw rod 6-2 is threadedly transmission-connected to the transmission nut 6-3 The axial direction of the screw rod 6-2 is parallel to the sliding direction of the first slider 12, the transmission nut 6-3 is fixedly connected to the nut base plate 6-4, and the nut base plate 6-4 is fixedly connected to the fixed plate 4-1; the motor 6-1 drives the screw rod 6-2 to rotate, and the transmission nut 6-3 feeds, and the transmission nut 6-3 drives the nut base plate 6-4 and the fixed plate 4-1 to move, and then the fixed plate 4-1 transmits it to the movable plate 4-2 through the elastic element 4-4, and finally the movable plate 4-2 drives the first pressurizing component 1 to reciprocate through the ball pair component 5; it is worth noting that the driving mechanism 6 in this embodiment can also adopt a cylinder and an electric push rod, etc.

[0093] The working principle of the adjustable leveling pressurizing device in this embodiment is:

[0094] The first working surface 1-1 of the first pressurizing component 1 and the second working surface 2-1 of the second pressurizing component 2 have been machined to ensure the flatness of the first working surface 1-1 and the second working surface 2-1 before leveling;

[0095] During leveling, the first fastener 3-2 is loosened, the first leveling component 3 is in a floating connection state, the position of the first pressurizing component 1 is not fixed, the pressure sensor 9 supports the second pressurizing component 2, the position of the second pressurizing component 2 is fixed, and there is a certain parallelism deviation between the first working surface 1-1 and the second working surface 2-1. Then the motor 6-1 drives the screw rod 6-2 to feed the transmission nut 6-3 downward to apply a certain pressure to the first pressurizing component 1. The first pressurizing component 1 adaptively adjusts its position as it contacts the second working surface 2-1 until the first working surface 1-1 and the second working surface 2-1 are tightly fitted. Then, the first fastener 3-2 is tightened to fix the position of the first pressurizing component 1, thereby ensuring that the first working surface 1-1 and the second working surface 2-1 are parallel to each other. It has the advantages of easy operation and good effect, and is especially suitable for small desktop devices. It only needs to be leveled once to continue working, and there is no need to level it every time, which saves time and effort.

[0096] During operation, the motor 6-1 drives the screw rod 6-2 to feed the transmission nut 6-3 downward. After the pressure is transmitted to the spring, the spring can play a buffering role. Subsequently, the spring transmits the pressure to the ball assembly 5. The ball assembly 5 can concentrate the dispersed pressure of each spring to a central point, ensuring the balance of the pressure applied to the first pressurizing assembly 1. Therefore, the first leveling assembly 3 and the balanced force-applying mechanism jointly ensure the uniformity of the force applied to the chip during bonding.

[0097] Therefore, the first leveling component 3 ensures that the first working surface 1-1 and the second working surface 2-1 always remain parallel, and the balancing force mechanism ensures the balance of the pressure applied to the first pressurizing component 1. The two work together to achieve uniform force during chip bonding and prevent the common pressure deviation problem during chip bonding.

[0098] Example 2

[0099] like Figure 12-15 As shown, the difference between Example 2 and Example 1 is that: in order to improve the detection accuracy of the pressure sensor 9, the end of the second pressurizing component 2 away from the second working surface 2-1 has a mounting surface 2-2, and a pressure sensor 9 is arranged between the mounting surface 2-2 and the frame 11. The pressure sensor 9 is fixedly mounted on the frame 11, and a second slider 8 matching it is slidably mounted on the guide rail 10; and a second leveling component 7 is also included, which is used to connect the second pressurizing component 2 to the second slider 8, and has a floating connection state and a fixed connection state;

[0100] When the second leveling component 7 is in a floating connection state and the second pressurizing component 2 moves toward the pressure sensor 9, the second pressurizing component 2 drives the second slider 8 to move through the second leveling component 7, and the second leveling component 7 allows the second pressurizing component 2 to adaptively adjust its position as the mounting surface 2-2 contacts the force-bearing surface 9-1 of the pressure sensor 9, thereby achieving the fitting of the mounting surface 2-2 with the force-bearing surface 9-1;

[0101] When the second leveling assembly 7 is in a fixed connection state, the position of the second pressurizing assembly 2 is fixed on the second sliding block 8;

[0102] In this embodiment, the second leveling component 7 includes a second connecting member 7-1 and a first fastening member 3-2; the second connecting member 7-1 is fixedly connected to the second pressurizing component 2 and is provided with a second mounting hole 7-11; the second fastening member 7-2 passes through the second mounting hole 7-11 and is used to detachably fix the second connecting member 7-1 on the second slider 8; Fig.14 As shown, a second gap 7-3 is left between the outer peripheral wall of the portion of the second fastener 7-2 located in the second mounting hole 7-11 and the inner peripheral wall of the second mounting hole 7-11; the cross section of the second mounting hole 7-11 can be elliptical, circular, oblong or square, etc. In this embodiment, a second mounting hole 7-11 with a circular cross section is specifically adopted;

[0103] In this embodiment, the second connecting member 7 - 1 may be integrally formed with the second slider 8 , or the second connecting member 7 - 1 may be fixedly connected to the second slider 8 by mechanical connection;

[0104] The specific implementation methods of the second fastener 7-2 detachably fixing the second connecting member 7-1 include but are not limited to the following forms:

[0105] First, the second fastener 7-2 is a screw, and the second slider 8 is provided with a second threaded hole 8-1 matching the screw. The second fastener 7-2 passes through the second mounting hole 7-11 and is threadedly connected to the second threaded hole 8-1. The aperture of the second mounting hole 7-11 is larger than the aperture of the second threaded hole 8-1. When the second fastener 7-2 is not tightened, the second pressurizing component 2 can move within the range constrained by the first gap 3-3 to facilitate fine adjustment of the position. After the position of the second pressurizing component 2 is established, the second fastener 7-2 is tightened so that the nut of the second fastener 7-2 is pressed against the second connecting member 7-1, thereby fixing the position of the second pressurizing component 2 on the second slider 8.

[0106] Secondly, the second fastener 7-2 includes a stud and a nut. The stud is fixed to the second slider 8 by welding, clamping, threaded connection and integral molding, and is threadedly connected to the nut after passing through the second mounting hole 7-11. When the nut is not tightened, the second pressurizing component 2 can move within the range constrained by the second gap 7-3 to facilitate fine adjustment of the position. When the nut is tightened, it abuts against the second connecting member 7-1, thereby fixing the position of the second pressurizing component 2 on the second slider 8.

[0107] In order to prevent the second pressurizing component 2 from tilting again after leveling, in this embodiment, the second pressurizing component 2 is provided with a second leveling component 7 and a second slider 8 on both sides, the second slider 8 is slidably connected to the guide rail 10 on its side, and the second leveling component 7 is connected to the second slider 8 on its side; through the design of the double-sided second leveling component 7 and the second slider 8, the forces on both sides of the second pressurizing component 2 are balanced, thereby ensuring that the second pressurizing component 2 will not tilt during operation.

[0108] In this embodiment, the first slider 12, the second slider 8 and the third slider 6-6 on the same side are all arranged on the same guide rail 10, which can reduce the complexity of the structure and secondly avoid the jamming problem that may be caused by installation errors.

[0109] In this embodiment, the first pressurizing component 1 and the second pressurizing component 2 are arranged in an upper and lower manner, that is, the first pressurizing component 1 is located above the second pressurizing component 2, and the second pressurizing component 2 is located above the pressure sensor 9. After the second pressurizing component 2 is leveled, the mounting surface 2-2 of the second pressurizing component 2 can directly resist the force-bearing surface 9-1 of the pressure sensor 9.

[0110] The leveling principle of the second pressurizing component 2 in this embodiment is:

[0111] Before leveling, the flatness of the mounting surface 2-2 of the second pressurizing assembly 2 is ensured by machining;

[0112] During leveling, the second fastener 7-2 is loosened, the second leveling assembly 7 is in a floating connection state, the position of the second pressurizing assembly 2 is not fixed, the position of the pressure sensor 9 is fixed, and there is a certain parallelism deviation between the mounting surface 2-2 and the force-bearing surface 9-1 of the pressure sensor 9. Then the driving mechanism 6 applies a certain downward pressure to the second pressurizing assembly 2 manually or in other ways. The second pressurizing assembly 2 adaptively adjusts its position as it contacts the force-bearing surface 9-1 until the mounting surface 2-2 and the force-bearing surface 9-1 are tightly fitted. Then, the second fastener 7-2 is tightened to fix the position of the second pressurizing assembly 2, thereby ensuring that the mounting surface 2-2 and the force-bearing surface 9-1 are parallel to each other, thereby improving the detection accuracy of the pressure sensor 9.

[0113] During chip bonding, the chip is placed between the first pressurizing component 1 and the second pressurizing component 2. The driving unit drives the first pressurizing component 1 to pressurize the chip downward to achieve sintering bonding between the chip and the substrate. The pressure sensor 9 performs pressure detection during this process.

[0114] Example 3

[0115] A patch device includes the adjustable leveling and pressurizing device in the above-mentioned embodiment 1 or embodiment 2.

[0116] The above-mentioned ideal embodiments of the present invention are for inspiration. Through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of ​​the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A leveling pressurizing device, characterized in that: include: A guide rail (10) mounted on a frame (11); A first pressurizing component (1) having a first working surface (1-1); A second pressurizing assembly (2) having a second working surface (2-1) arranged opposite to the first working surface (1-1), wherein the first pressurizing assembly (1) is mounted on a frame (11) and / or a guide rail (10); A first sliding block (12) matches the guide rail (10) and is slidably mounted on the guide rail (10); A driving unit, used for driving the first pressurizing component (1) to move closer to or farther from the second pressurizing component (2); and a first leveling component (3), used for connecting the first pressurizing component (1) to the first sliding block (12), and having a floating connection state and a fixed connection state; When the first leveling component (3) is in a floating connection state and the first pressurizing component (1) moves toward the second pressurizing component (2), the first pressurizing component (1) drives the first slider (12) to move via the first leveling component (3), and the first leveling component (3) allows the first pressurizing component (1) to adjust its position adaptively as the first working surface (1-1) contacts the second working surface (2-1), thereby achieving the fit between the first working surface (1-1) and the second working surface (2-1); When the first leveling component (3) is in a fixed connection state, the position of the first pressurizing component (1) is fixed on the first sliding block (12); The first leveling component (3) comprises a first connecting member (3-1) and a first fastening member (3-2); The first connecting member (3-1) is fixedly connected to the first pressurizing assembly (1) and is provided with a first mounting hole (3-11); The first fastener (3-2) passes through the first mounting hole (3-11) and is used to detachably fix the first connecting member (3-1) to the first sliding block (12); a first gap (3-3) is left between the outer peripheral wall of the portion of the first fastener (3-2) located in the first mounting hole (3-11) and the inner peripheral wall of the first mounting hole (3-11).

2. The leveling pressurizing device according to claim 1, characterized in that: The first pressurizing component (1) is provided with a first leveling component (3) on both sides thereof; the frame (11) is provided with guide rails (10) on both sides of the first pressurizing component (1); the first sliding block (12) is slidably mounted on the guide rails (10); and the first leveling component (3) is connected to the first sliding block (12) on the side thereof.

3. The leveling and pressurizing device according to claim 1, characterized in that: The second pressurizing component (2) has a mounting surface (2-2) at one end away from the second working surface (2-1), a pressure sensor (9) is arranged between the mounting surface (2-2) and the frame (11), the pressure sensor (9) is fixedly mounted on the frame (11), and a second sliding block (8) matching the pressure sensor (9) is slidably mounted on the guide rail (10); It also includes a second leveling component (7) used to connect the second pressurizing component (2) to the second slider (8), and has a floating connection state and a fixed connection state; When the second leveling component (7) is in a floating connection state and the second pressurizing component (2) moves toward the pressure sensor (9), the second pressurizing component (2) drives the second slider (8) to move via the second leveling component (7), and the second leveling component (7) allows the second pressurizing component (2) to adjust its position adaptively as the mounting surface (2-2) contacts the force-bearing surface (9-1) of the pressure sensor (9), thereby achieving the fitting of the mounting surface (2-2) and the force-bearing surface (9-1); When the second leveling component (7) is in a fixed connection state, the position of the second pressurizing component (2) is fixed on the second sliding block (8).

4. The leveling and pressurizing device according to claim 3, characterized in that: The second leveling assembly (7) comprises a second connecting member (7-1) and a first fastening member (3-2); The second connecting member (7-1) is fixedly connected to the second pressurizing assembly (2) and is provided with a second mounting hole (7-11); The second fastener (7-2) passes through the second mounting hole (7-11) and is used to detachably fix the second connecting member (7-1) to the second sliding block (8); a second gap (7-3) is left between the outer peripheral wall of the portion of the second fastener (7-2) located in the second mounting hole (7-11) and the inner peripheral wall of the second mounting hole (7-11).

5. The leveling and pressurizing device according to claim 3, characterized in that: Second leveling assemblies (7) are arranged on both sides of the second pressurizing assembly (2); guide rails (10) are arranged on both sides of the second pressurizing assembly (2) on the frame (11); the second sliders (8) are slidably mounted on the guide rails (10); and the second leveling assembly (7) is connected to the second sliders (8) on the side where the second leveling assembly (7) is located.

6. The leveling pressurizing device according to claim 1, characterized in that: The driving unit comprises a driving mechanism (6) and a balancing force application mechanism; The balanced force-applying mechanism comprises a ball-pair assembly (5) and an elastic buffer assembly (4) having elasticity, the output end of the driving mechanism (6) being transmission-connected to the ball-pair assembly (5) via the elastic buffer assembly (4), and the ball-pair assembly (5) being transmission-connected to the first pressurizing assembly (1).

7. The leveling and pressurizing device according to claim 6, characterized in that: The elastic buffer assembly (4) comprises a fixed plate (4-1), a movable plate (4-2), a guide rod (4-3) and an elastic element (4-4); The output end of the driving mechanism (6) is fixedly connected to the fixed plate (4-1), the movable plate (4-2) is fixedly connected to the ball pair assembly (5), one of the fixed plate (4-1) and the movable plate (4-2) is fixedly connected to the guide rod (4-3), and the other is slidably connected to the guide rod (4-3) along the moving direction of the first sliding block (12), and the elastic element (4-4) is located between the movable plate (4-2) and the fixed plate (4-1).

8. The leveling and pressurizing device according to claim 6, characterized in that: The ball pair assembly (5) comprises a ball pair plate 1 (5-1), a center ball (5-2), a ball pair plate 2 (5-3) and a limit plate (5-4); the center ball (5-2) is located between the ball pair plate 1 (5-1) and the ball pair plate 2 (5-3); one end of the limit plate (5-4) is provided with a reset hole (5-41), and the other end is fixedly connected to the ball pair plate 2 (5-3); The ball sub-plate 1 (5-1) or the movable plate (4-2) is installed with a reset rod (5-5), the reset rod (5-5) is inserted into the reset hole (5-41), and a third gap (5-6) is left between the outer peripheral wall of the reset rod (5-5) located in the reset hole (5-41) and the inner peripheral wall of the reset hole (5-41); One of the ball sub-plate 1 (5-1) and the ball sub-plate 2 (5-3) is fixedly connected to the movable plate (4-2), and the other is fixedly connected to the first pressurizing component (1).

9. A patch device, characterized in that: It comprises the leveling pressurizing device as described in any one of claims 1-8.

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