Chip power supply test fixture

Abstract

The application provides a power supply test fixture for a chip, comprising a chip base, a plurality of chip limiting grooves and a chip limiting stop table are arranged on the chip base, the chip limiting grooves are connected with the chip limiting stop table, a chip is arranged in the chip limiting grooves, the chip limiting grooves and the chip limiting stop table are matched with each other to limit the chip, a circuit board is arranged on the chip, and the chip and the circuit board are detachably electrically connected to realize power supply test of the chip; thus, the chip is nondestructively limited during the power supply test of the chip, the technical problems that a probe is difficult to test and position the surface pad of the chip and the surface pad of the chip is scratched during the test are avoided, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and more specifically to a power supply test fixture for a chip. Background Technology

[0002] In existing technologies, power supply testing structures for silicon photonics chips often employ metal springs or elastic mechanisms to achieve the chip's fixing and limiting function. However, the high hardness of metal materials can easily damage the waveguides on the silicon photonics chip surface. Furthermore, due to the small size of the pads on the silicon photonics chip surface and the small spacing between adjacent pads, traditional probe testing methods for power supply testing often result in probes failing to accurately strike the corresponding pads. This not only affects production efficiency but also requires high precision in the fixtures used for positioning the auxiliary probes, increasing processing costs and hindering mass production. Even if the probe accurately strikes the corresponding pad, the small size of the pads results in near-point contact at the bottom of the probe, creating a sharp structure that can easily scratch the silicon photonics chip surface pads during operation. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a power supply testing fixture for chips. This fixture not only achieves non-destructive positioning of the chip during power supply testing but also avoids the technical problems of difficulty in positioning the probe on the chip surface pads and scratching the chip surface pads during testing. This improves production efficiency while reducing production costs.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows:

[0005] This invention provides a power supply test fixture for a chip, comprising: a chip base, wherein the chip base is provided with a plurality of chip limiting slots and chip limiting stops, the chip limiting slots are connected to the chip limiting stops, a chip is disposed in the chip limiting slots, the chip limiting slots and the chip limiting stops cooperate with each other to limit the chip, a circuit board is disposed on the chip, and the chip is detachably electrically connected to the circuit board to enable power supply testing of the chip.

[0006] This invention provides a power supply test fixture for chips, which not only achieves non-destructive positioning of the chip during the power supply test, but also avoids the technical problems of difficulty in positioning the probe on the chip surface pads and scratching the chip surface pads during the test, thereby improving production efficiency and reducing production costs.

[0007] As a preferred technical solution, the circuit board is provided with a chip cover plate, the chip base is connected to the chip cover plate through a positioning component, and a component with elastic compression is provided between the chip base and the chip cover plate.

[0008] As a preferred technical solution, the component with elastic compression includes: a plurality of first components with elastic compression, wherein the first components with elastic compression are disposed between the chip cover and the chip.

[0009] As a preferred technical solution, the chip base is provided with multiple protrusions, and the circuit board is provided with multiple clearance notches. The clearance notches and the protrusions cooperate with each other to connect the circuit board and the chip base.

[0010] As a preferred technical solution, the chip limiting groove is connected to the protrusion through the chip limiting baffle to form a stepped structure, and a groove is provided at the connection between the chip limiting baffle and the chip limiting groove.

[0011] As a preferred technical solution, the component with elastic compression includes: a second component with elastic compression, the second component with elastic compression being disposed between the chip cover and the boss portion.

[0012] As a preferred technical solution, at least four first connection holes are provided on the protrusions at both ends of the chip base, and multiple second connection holes are provided on the chip cover plate. The first connection holes and the second connection holes are arranged in a corresponding manner, and the positioning member passes through the first connection holes and the second connection holes to connect the chip base and the chip cover plate.

[0013] As a preferred technical solution, it includes: a thermoelectric cooler, wherein the chip base is connected to the thermoelectric cooler, and the thermoelectric cooler is used to regulate the temperature of the chip.

[0014] As a preferred technical solution, the thermoelectric cooler is connected to one end of the heat dissipation base through a heat-conducting layer, and the other end of the heat dissipation base is connected to the base.

[0015] As a preferred technical solution, a through hole is provided at the center of the thermoelectric cooler, and a channel is provided inside the heat dissipation base. One end of the channel is correspondingly arranged with the through hole, and the central axis of the channel is on the same straight line as the central axis of the through hole. The other end of the channel is provided on the side wall of the heat dissipation base and connected to the vacuum adsorber.

[0016] The power supply test fixture for a chip provided by this invention has the following beneficial effects:

[0017] 1) The present invention provides a power supply test fixture for a chip, wherein the chip and the circuit board are electrically connected by gold wire bonding (removable). Compared with the traditional probe test method, this invention effectively improves production efficiency and reduces production costs.

[0018] 2) The present invention provides a power supply test fixture for a chip, wherein a plurality of first components with elastic compression are provided between the chip cover and the chip, and a second component with elastic compression is provided between the chip cover and the protrusion. The first and second components with elastic compression have a certain amount of elastic compression, which can achieve soft contact between the chip cover and the chip, and can also absorb the processing tolerance of the chip base. At the same time, when the chip and the circuit board are wire bonded (temperature ≥150℃), the components with elastic compression have good high temperature resistance.

[0019] 3) The present invention provides a power supply test fixture for a chip. Since the chip is highly sensitive to temperature, a thermoelectric cooler is provided below the chip. The thermoelectric cooler can better regulate the temperature of the chip. Attached Figure Description

[0020] Figure 1 The front and side views of the power supply test fixture for the chip provided by the present invention;

[0021] Figure 2 for Figure 1 An enlarged view of part A of the power supply test fixture for the provided chip;

[0022] Figure 3 A top view of the power supply test fixture for the chip provided by the present invention;

[0023] Figure 4 A structural diagram of the circuit board in the power supply test fixture for the chip provided by this invention;

[0024] Figure 5 A structural diagram of the chip base in the power supply test fixture for the chip provided by the present invention;

[0025] Figure 6 A structural diagram of the chip cover plate in the power supply test fixture for the chip provided by the present invention;

[0026] Figure 7 A structural diagram of a component with elastic compression in the power supply test fixture for the chip provided by the present invention;

[0027] Wherein: 1-Chip base; 2-Chip limiting groove; 3-Chip limiting stop; 4-Chip; 5-Circuit board; 6-Chip cover plate; 7-Positioning component; 8-First component with elastic compression; 9-Protrusion; 10-Groove; 11-Second component with elastic compression; 12-First connecting hole; 13-Second connecting hole; 14-Thermoelectric cooler; 15-Heat dissipation base; 16-Base; 17-Avoidance notch. Detailed Implementation

[0028] It should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0029] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0030] It is understood that the present invention achieves its purpose through some embodiments.

[0031] like Figure 1-7As shown, the present invention provides a power supply test fixture for a chip, comprising: a chip base 1, wherein the chip base 1 is provided with a plurality of chip limiting slots 2 and chip limiting stops 3, the chip limiting slots 2 and the chip limiting stops 3 are connected, a chip 4 is disposed in the chip limiting slots 2, the chip limiting slots 2 and the chip limiting stops 3 cooperate to limit the chip 4, a circuit board 5 is disposed on the chip 4, and the chip 4 and the circuit board 5 are detachably electrically connected to enable power supply testing of the chip 4; a chip cover plate 6 is disposed on the circuit board 5, the chip base 1 is connected to the chip cover plate 6 through a positioning member 7, and a component with elastic compression is disposed between the chip base 1 and the chip cover plate 6; the chip 4 is disposed on the chip limiting slots 2 and 3, the chip limiting slots 2 and 3 are provided to limit the chip 4 ... The chip base 1 has multiple protrusions 9, and the circuit board 5 has multiple clearance notches 17. The clearance notches 17 cooperate with the protrusions 9 to connect the circuit board 5 to the chip base 1. Multiple first elastically compressible components 8 are provided between the chip cover plate 6 and the chip 4. The chip limiting groove 2 is connected to the protrusions 9 via a chip limiting baffle 3 to form a stepped structure. A groove 10 is provided at the connection between the chip limiting baffle 3 and the chip limiting groove 2. The thickness of the chip limiting baffle 3 is greater than the groove thickness of the chip limiting groove 2, and the thickness of the protrusions 9 is greater than the thickness of the chip limiting baffle 3. A second... A component 11 with elastic compression capacity; at least four first connecting holes 12 are provided on the protrusions 9 at both ends of the chip base 1, and a plurality of second connecting holes 13 are provided on the chip cover plate 6. The first connecting holes 12 and the second connecting holes 13 are arranged correspondingly. The positioning member 7 passes through the first connecting holes 12 and the second connecting holes 13 to connect the chip base 1 and the chip cover plate 6. A thermoelectric cooler 14 is provided between the chip base 1 and the heat dissipation base 15. The chip base 1 is connected to the thermoelectric cooler 14, and the thermoelectric cooler 14 regulates the temperature of the chip 4 by adjusting its own voltage. The thermoelectric cooler 14 is connected to one end of the heat dissipation base 15 through a thermally conductive layer. The other end is connected to the base 16; a through hole is provided at the center of the thermoelectric cooler 14, and a channel (not shown) is provided in the heat sink 15. One end of the channel (not shown) is correspondingly arranged with the through hole (not shown), and the central axis of the channel (not shown) is on the same straight line as the central axis of the through hole (not shown). The other end of the channel is set on the side wall of the heat sink 15 and connected to the vacuum suction device (not shown). This not only achieves non-destructive positioning of the chip during the power supply test of the chip, but also avoids the technical problems of difficulty in positioning the probe on the chip surface pads and scratching the chip surface pads during the test, thereby improving production efficiency and reducing production costs.

[0032] like Figure 1-7As shown, the chip power supply test fixture provided by the present invention includes: a base 16, on which a heat sink 15, a thermoelectric cooler 14, a chip base 1, a circuit board 5, a component with elastic compression, and a chip cover plate 6 are sequentially arranged. The component with elastic compression includes: a first component with elastic compression 8 and a second component with elastic compression 11. The thermoelectric cooler 14 is fixed to the surface of the heat sink 15 through a heat-conducting layer. A through hole (not shown) is provided at the center of the thermoelectric cooler 14. A channel (not shown) is provided inside the heat sink 15, and the channel (not shown) passes through a horizontal channel. (Not shown) is connected to a vertical channel (not shown), one end of which is correspondingly arranged with the through hole (not shown), and the central axis of the channel (not shown) and the central axis of the through hole (not shown) are on the same straight line. The other end of the channel (not shown) is arranged on the side wall of the heat sink base 15 and connected to the vacuum nozzle of the vacuum suction device so that the chip base 1, circuit board 5, first component with elastic compression 8, second component with elastic compression 11 and chip cover plate 6 assembled together can be fixed to the surface of the thermoelectric cooler 14 by vacuum suction.

[0033] The chip base 1 has linearly arranged protrusions 9, and the circuit board 5 has linearly arranged clearance notches 17. The circuit board 5 is mounted on the chip base 1, and the clearance notches 17 and protrusions 9 cooperate to engage the circuit board 5 with the chip base 1. A chip limiting groove 2 is provided on one side of the chip base 1, and the chip 4 is disposed in the chip limiting groove 2. The chip limiting groove 2 and the chip limiting stop 3 cooperate to limit the chip 4. Four linearly arranged first connecting holes 12 are provided on the protrusions 9 at both ends of the chip base 1. Four positioning elements 7 are provided within each first connecting hole 12 and are tightly fitted therewith. Four linearly arranged second connecting holes 13 are provided on the chip cover plate 6, corresponding to the positions of the first connecting holes 12. The diameter of the second connecting holes 13 is slightly larger than the diameter of the positioning elements 7. The positioning elements 7 slide with the second connecting holes 13 on the chip cover plate 6, and the positioning elements 7 pass through the first connecting holes 12 and the second connecting holes 13 to connect the chip base 1 and the chip cover plate 6. A plurality of first elastic compression components 8 are provided between the chip cover plate 6 and the chip 4, and a second elastic compression component 11 is provided between the chip cover plate 6 and the boss portion 9. The first elastic compression component 8 and the second elastic compression component 11 make the chip cover plate 6 and the chip 4 in soft contact, while also absorbing the processing tolerance of the chip base 1.

[0034] The power supply test fixture for chips provided by this invention reduces the possibility of damage to silicon photonic chips during power supply testing, and has a simple processing technology, low cost, and good mass production feasibility.

[0035] The first component 8 with elastic compression and the second component 11 with elastic compression are preferably silicone pads.

[0036] The contact surface between the thermoelectric cooler 14 and the chip base 1 is the cold surface, and the contact surface between the thermoelectric cooler 14 and the heat sink 15 is the hot surface. The chip 4 is placed on the chip base 1, and the chip base 1 is placed on the thermoelectric cooler 14. The thermoelectric cooler 14 regulates the temperature of the chip 4 by adjusting its own voltage.

[0037] Circuit board 5 is preferably a PCB circuit board.

[0038] The power supply test fixture for a chip provided by this invention has the following beneficial effects:

[0039] 1) The present invention provides a power supply test fixture for a chip, wherein the chip and the circuit board are electrically connected by gold wire bonding (removable). Compared with the traditional probe test method, this invention effectively improves production efficiency and reduces production costs.

[0040] 2) The present invention provides a power supply test fixture for a chip, wherein a plurality of first components with elastic compression are provided between the chip cover and the chip, and a second component with elastic compression is provided between the chip cover and the protrusion. The first and second components with elastic compression have a certain amount of elastic compression, which can achieve soft contact between the chip cover and the chip, and can also absorb the processing tolerance of the chip base. At the same time, when the chip and the circuit board are wire bonded (temperature ≥150℃), the components with elastic compression have good high temperature resistance.

[0041] 3) The present invention provides a power supply test fixture for a chip. Since the chip is highly sensitive to temperature, a thermoelectric cooler is provided below the chip. The thermoelectric cooler can better regulate the chip temperature by adjusting its own voltage.

[0042] It is understood that this invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this invention. Furthermore, under the teachings of this invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this invention. Therefore, this invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are protected by this invention. Furthermore, under the teachings of this invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this invention. Therefore, this invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of this invention.

Claims

1. A power supply test fixture for a chip, the fixture comprising: include: A chip base is provided with multiple chip limiting slots and chip limiting stops. The chip limiting slots are connected to the chip limiting stops. A chip is placed in the chip limiting slot. The chip limiting slots and the chip limiting stops cooperate to limit the chip. A circuit board is provided on the chip. The chip and the circuit board are detachably electrically connected to enable power supply testing of the chip. A chip cover is provided on the circuit board. A component with elastic compression is provided between the chip base and the chip cover. The chip base is provided with multiple protrusions, and the chip limiting groove is connected to the protrusions through the chip limiting baffle to form a stepped structure. A groove is provided at the connection between the chip limiting baffle and the chip limiting groove. The component with elastic compression includes a plurality of first components with elastic compression, and the first components with elastic compression are disposed between the chip cover and the chip; The circuit board is provided with multiple clearance notches, which cooperate with the protrusion to connect the circuit board to the chip base; the component with elastic compression includes: a second component with elastic compression, which is disposed between the chip cover and the protrusion.

2. The power supply test fixture for the chip according to claim 1, characterized in that, The chip base is connected to the chip cover plate via a positioning component.

3. The power supply test fixture for the chip according to claim 2, characterized in that, At least four first connection holes are provided on the protrusions at both ends of the chip base, and multiple second connection holes are provided on the chip cover plate. The first connection holes and the second connection holes are arranged in a corresponding manner. The positioning member passes through the first connection holes and the second connection holes to connect the chip base and the chip cover plate.

4. The power supply test fixture for the chip according to claim 1, characterized in that, include: A thermoelectric cooler is provided, and the chip base is connected to the thermoelectric cooler, which is used to regulate the temperature of the chip.

5. The power supply test fixture for the chip according to claim 4, characterized in that, The thermoelectric cooler is connected to one end of the heat sink base via a heat-conducting layer, and the other end of the heat sink base is connected to the base. The thermoelectric cooler is disposed between the chip base and the heat sink base.

6. The power supply test fixture for the chip according to claim 5, characterized in that, A through hole is provided at the center of the thermoelectric cooler, and a channel is provided inside the heat dissipation base. One end of the channel is correspondingly arranged with the through hole, and the central axis of the channel is on the same straight line as the central axis of the through hole. The other end of the channel is provided on the side wall of the heat dissipation base and connected to the vacuum adsorber.

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