Feed structure and antenna

Through the unplating feed structure and solder operation, non-ferromagnetic metal materials are used to connect electronic devices and feed networks, which solves the deformation and damage caused by electroplating, reduces costs and improves yield.

CN115064872BActive Publication Date: 2024-12-20COMBA TELECOM TECH (GUANGZHOU) CO LTD +1
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Patent Information

Application Number
CN202210824327.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-07-14
Publication Date
2024-12-20
Estimated Expiration
2042-07-14

AI Technical Summary

Technical Problem

The existing antenna feed network is prone to deformation and damage during the electroplating process, which increases process cost and reduces yield.

Method used

Adopt an unplating feed structure, electrically connects the feed network through the mounting parts, and uses non-ferromagnetic metal materials such as gold, silver, copper, etc. for soldering to realize the electrical connection between electronic devices and the feed network, avoiding Electroplating treatment.

Benefits of technology

This reduces process costs, avoids deformation and damage of the feed network caused by electroplating, improves the yield rate, and realizes a reliable electrical connection between electronic devices and the feed network.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a feeding structure and an antenna. The feeding structure includes a feeding network and a mounting part. The feeding network is not electroplated. The mounting part is fixed on the feeding network and electrically connected to the feeding network. The mounting part is used to electrically connect an electronic device so that the electronic device is electrically connected to the feeding network. The antenna includes the aforementioned feeding network. The feeding network does not need to be electroplated. Instead, the mounting part is electrically connected to the feeding network to achieve electrical connection with the electronic device through the mounting part, thereby electrically connecting the electronic device to the feeding network. Compared with the traditional method of electroplating the feeding network, it not only reduces the process cost caused by electroplating, but also solves the problem of deformation and damage of the feeding network caused by electroplating, thereby improving the yield rate.
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Description

Technical Field

[0001] The present invention relates to the technical field of communication devices, and in particular to a feeding structure and an antenna. Background Art

[0002] Generally speaking, the feed network in the antenna is made of printed circuit board or aluminum alloy. Compared with the feed network made of printed circuit board, the feed network made of aluminum alloy has lighter weight, smaller loss and lower cost, and is an ideal material for making the feed network.

[0003] The feed network needs to be electrically connected to other parts such as coaxial cables to achieve electrical functions. Soldering is usually used to electrically connect the coaxial cables to the feed network. However, there is an oxide film on the surface of aluminum alloy, which makes it impossible to tin the aluminum alloy. Therefore, the aluminum alloy has to be electroplated (tin, copper or silver, etc.). This operation method not only increases the process cost, but also easily causes deformation and damage to the feed network during the electroplating process. Summary of the invention

[0004] Based on this, it is necessary to provide a feeding structure and an antenna; the feeding structure can electrically connect the electronic device to the feeding network without electroplating. Compared with the traditional electroplating method, the cost is reduced and the feeding network will not be deformed or damaged due to electroplating.

[0005] The technical solution is as follows:

[0006] An embodiment provides a feeding structure, comprising:

[0007] a feed network, the feed network being unplated;

[0008] A mounting member is fixed to the feed network and electrically connected to the feed network, and the mounting member is used to electrically connect an electronic device so that the electronic device is electrically connected to the feed network.

[0009] In the above-mentioned feeding structure, the feeding network does not need to be electroplated. Instead, the mounting parts are electrically connected to the feeding network to achieve electrical connection with the electronic device through the mounting parts, thereby electrically connecting the electronic device to the feeding network. Compared with the traditional method of electroplating the feeding network, it not only reduces the process cost caused by electroplating, but also solves the problem of deformation and damage of the feeding network caused by electroplating, thereby improving the yield rate.

[0010] The technical solution is further described below:

[0011] In one embodiment, the material of the mounting component is a non-ferromagnetic metal material capable of being subjected to soldering operations, so as to electrically connect the electronic device to the mounting component by means of soldering.

[0012] In one embodiment, the material of the mounting member includes at least one of gold, silver, and copper;

[0013] Or / and, the electronic device is one or more of a radiating unit, a phase shifter, a filter, a power divider, a combiner, a coaxial cable, a soldering pin, a waveguide or a suspended strip line electrically connected to the feeding network.

[0014] In one of the embodiments, the mounting member is welded to the feeder network by ultrasonic welding; or the mounting member is welded to the feeder network by pressure welding.

[0015] In one of the embodiments, the feed network is made of an aluminum plate or an aluminum alloy plate; the mounting member is a mounting plate, and the thickness of the mounting plate is smaller than the thickness of the feed network.

[0016] In one embodiment, at least two mounting members are provided, and the mounting members are arranged at different positions of the feeding network to be electrically connected to different electronic devices.

[0017] In one of the embodiments, the feed network is arranged in a U shape, and two mounting members are provided, and the two mounting members are respectively fixed at two ends of the feed network.

[0018] In one of the embodiments, the feeding structure further includes a dielectric board, and the feeding network is arranged on the dielectric board.

[0019] In one embodiment, at least two feed networks are provided, and the feed networks are stacked on the dielectric board.

[0020] Another embodiment provides an antenna, comprising the feeding structure as described in any of the above technical solutions.

[0021] The above antenna adopts the aforementioned feeding structure, which not only eliminates the need for electroplating of the feeding network, thereby reducing the high process cost caused by electroplating, but also solves the problem of deformation and damage of the feeding network caused by electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] In addition, the drawings are not drawn in a 1:1 scale, and the relative sizes of various elements are drawn only as examples in the drawings and are not necessarily drawn in true scale.

[0025] Figure 1 Schematic diagram of the arrangement of the feeding network and the mounting parts in an embodiment of the present invention;

[0026] Figure 2 It is an assembly structure diagram of a feeding network and a dielectric plate in an embodiment of the present invention;

[0027] Figure 3 A schematic diagram of the connection between the feeding network and the electronic device in an embodiment of the present invention;

[0028] Figure 4 It is an assembly diagram of a feeding network and electronic devices stacked in an embodiment of the present invention.

[0029] Notes on the attached drawings:

[0030] 100. Feeding network; 200. Mounting parts; 300. Electronic components; 400. Dielectric board. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below with reference to the accompanying drawings:

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] Please refer to Figures 1 to 3 One embodiment provides a feeding structure, including a feeding network 100 and a mounting member 200. The feeding network 100 is not electroplated; the mounting member 200 is fixed on the feeding network 100 and electrically connected to the feeding network 100, and the mounting member 200 is used to electrically connect the electronic device 300, so that the electronic device 300 is electrically connected to the feeding network 100.

[0036] In this feeding structure, the feeding network 100 does not need to be electroplated, but the mounting member 200 is electrically connected to the feeding network 100, so as to achieve electrical connection with the electronic device 300 through the mounting member 200, thereby electrically connecting the electronic device 300 to the feeding network 100; compared with the traditional method of electroplating the feeding network 100, not only the process cost caused by electroplating is reduced, but also the problem of deformation and damage of the feeding network 100 caused by electroplating is solved, thereby improving the yield rate.

[0037] In one embodiment, the feeding structure can be used in antennas, especially base station antennas. The feeding network 100 can be electrically connected to the electronic devices 300 through the mounting member 200 without electroplating. These electronic devices 300 can be one or more of radiating units, phase shifters, filters, power dividers, combiners, coaxial cables, solder pins, waveguides or suspended strip lines that need to be electrically connected to the feeding network 100.

[0038] It is understandable that:

[0039] The feed network 100 has a position for electrically connecting the electronic device 300, and the mounting member 200 is installed at the corresponding position. For example, if the position for installing the electronic device 300 on the feed network 100 is the mounting position, the mounting member 200 is fixed at the mounting position and electrically connected to the feed network 100.

[0040] Specifically, the mounting position on the feed network 100 is used to install a coaxial cable, and the mounting member 200 should be fixed to the feed network 100 at the position where the coaxial cable is electrically connected, so that the coaxial cable can be electrically connected to a specific position on the feed network 100 after being electrically connected to the mounting member 200, and will not be welded to other positions such as those for installing a power divider or a phase shifter, thereby ensuring that the installation will not be misplaced, which will not be repeated.

[0041] In one embodiment, the material of the mounting member 200 is a non-ferromagnetic metal material capable of soldering, so as to electrically connect the electronic device 300 to the mounting member 200 by soldering.

[0042] The mounting member 200 plays the role of a medium for electrically connecting the electronic device 300 to the feeding network 100. Therefore, the material of the mounting member 200 can be a non-ferromagnetic metal material that can be soldered, so that the electronic device 300 and the mounting member 200 can be electrically connected through the soldering operation, and then the electronic device 300 can be further electrically connected to the feeding network 100 through the mounting member 200.

[0043] The conventional feed network 100 is usually not directly solderable, so it usually has to be electroplated first, such as tin, copper or silver, for subsequent soldering to achieve electrical connection between the electronic device 300 and the feed network 100. However, such electroplating will inevitably increase the process cost, and the electroplating process is also prone to deformation and damage of the feed network 100.

[0044] In this embodiment, the mounting member 200 is arranged to set the material of the mounting member 200 to a material that can be soldered, and the mounting member 200 is also electrically connected to the feed network 100, so that the electronic device 300 can be directly soldered through the mounting member 200 to achieve electrical connection with the feed network 100 with the help of the mounting member 200. Since the mounting member 200 has achieved the role of an electrical connection medium between the electronic device 300 and the feed network 100, there is no need to perform electroplating on the entire feed network 100, thereby reducing the process cost and avoiding problems such as deformation and damage of the feed network 100 caused by electroplating.

[0045] In one embodiment, the material of the mounting member 200 includes at least one of gold, silver, and copper.

[0046] The mounting member 200 may be a non-ferromagnetic metal material capable of being soldered, such as gold, silver, copper, copper alloy, etc. The mounting member 200 is used to solder the electronic device 300, such as a coaxial cable, a printed circuit board, or a soldering pin, to the mounting member 200, thereby achieving electrical connection between the electronic device 300 and the feeding network 100.

[0047] like Figure 3 and Figure 4 As shown, the electronic device 300 is a coaxial cable, which is soldered to the mounting member 200 by soldering. Since the mounting member 200 is electrically connected to the feed network 100 , the electronic device 300 is also electrically connected to the feed network 100 .

[0048] In one embodiment, the mounting member 200 is welded to the feeding network 100 by ultrasonic welding.

[0049] Ultrasonic welding uses high-frequency vibration waves to transmit to the surfaces of two objects to be welded. Under pressure, the two surfaces of the objects rub against each other to form a fusion between the molecular layers. It is a fast, clean and effective welding process.

[0050] In this embodiment, the mounting member 200 is welded to the feeding network 100 by ultrasonic welding, so that the mounting member 200 made of solderable material is welded to the position of the feeding network 100 where the electronic device 300 needs to be welded, and the surface of the mounting member 200 and the surface of the feeding network 100 contact and rub against each other to form intermolecular fusion, so as to achieve the purpose of electrical and mechanical connection.

[0051] In another embodiment, the mounting member 200 is welded to the feeding network 100 by pressure welding.

[0052] Optionally, pressure welding may be performed by cold pressure welding or hot pressure welding.

[0053] For example, when cold welding is used to weld the mounting component 200 to the feed network 100, the pressure must exceed the yield strength of the mounting component 200 and the feed network 100, thereby causing plastic deformation and atomic diffusion of the mounting component 200 and the feed network 100 to achieve electrical and mechanical connection.

[0054] For another example, when the mounting component 200 is welded to the feed network 100 by hot pressure welding, the pressure must exceed the yield strength of the mounting component 200 and the yield strength of the feed network 100 at the corresponding temperature, thereby causing the mounting component 200 and the feed network 100 to undergo plastic deformation and atomic diffusion, thereby achieving electrical and mechanical connection.

[0055] Optionally, the electronic device is an inner conductor of a coaxial cable, that is, a core wire of the coaxial cable, and the inner conductor of the coaxial cable is welded to the feed network by ultrasonic welding or pressure welding.

[0056] The coaxial cable has an inner conductor and an outer conductor. The inner conductor is the core wire of the coaxial cable, and the outer conductor is the shielding layer of the coaxial cable. The pad of the outer conductor is usually a semicircular groove, which can only be welded by laser welding, and cannot be welded by ultrasonic welding or pressure welding; while the pad of the inner conductor is usually set in a flat shape, that is, a small plane structure. If laser welding is used, it is easy to burn all the pads. Using ultrasonic welding or pressure welding can not only improve the welding yield rate, but also reduce the cost and have high economic value.

[0057] In one embodiment, the feed network 100 is made of an aluminum plate or an aluminum alloy plate.

[0058] Aluminum alloy is an ideal material for manufacturing the feeding network 100 due to its lighter weight, smaller loss and lower cost.

[0059] The mounting piece 200 is welded to the feeding network 100 by ultrasonic welding, so that the solderable material of the mounting piece 200 and the aluminum material or aluminum alloy material of the feeding network 100 contact and rub against each other to form molecular fusion, thereby achieving electrical and mechanical connection.

[0060] In one embodiment, please refer to Figure 1 and Figure 2 The mounting member 200 is a mounting plate, and the thickness of the mounting plate is less than the thickness of the feeding network 100 .

[0061] At the position where the electronic device 300 needs to be welded on the feeding network 100 made of unplated aluminum or aluminum alloy, the thin sheet mounting member 200 is welded to the surface of the feeding network 100 by ultrasonic welding or pressure welding, and the electronic device 300 such as a coaxial cable, a printed circuit board or a soldering pin is further welded to the thin sheet mounting member 200 by soldering operation, thereby completing the electrical connection between the electronic device 300 and the feeding network 100.

[0062] This setting has the following benefits:

[0063] 1. The thin mounting piece 200 is welded only at the corresponding part of the feeding network 100 where the electronic device 300 needs to be electrically connected by ultrasonic welding or pressure welding, and then the electronic device 300 and the mounting piece 200 are fixed by soldering to complete the electrical connection between the electronic device 300 and the feeding network 100. That is, only a local process is required, and the cost is greatly reduced compared with the process of electroplating the entire feeding network 100.

[0064] Second, compared with the process of electroplating the entire feed network 100, the mounting member 200 is welded to the feed network 100 by ultrasonic welding or pressure welding, and then the electronic device 300 is fixed by soldering. The surface of the area of ​​the feed network 100 that is not used for electrically connecting the electronic device 300 is still an aluminum surface or an aluminum alloy surface, which has better anti-corrosion performance, and there is no need to worry about functional hazards caused by oxidation and shedding of the electroplating layer.

[0065] Third, since the feeding network 100 does not need to be electroplated, the problems of deformation, damage, etc. that may be caused to the feeding network 100 by the electroplating process are avoided.

[0066] like Figure 1 and Figure 2 As shown, the mounting member 200 is a mounting plate, and the thickness of the mounting plate is thinner than that of the feed network 100, so that the mounting plate forms a thin sheet, which is convenient for welding the mounting member 200 and the feed network 100. At the same time, it also avoids the existence of the mounting member 200 causing the thickness of the entire feed structure to be too large, thereby reducing the volume occupied.

[0067] like Figure 1 and Figure 2 As shown, the mounting member 200 is a substantially rectangular mounting plate and is welded to the corresponding position on the feed network 100 for mounting the electronic device 300 , so as to further weld the electronic device 300 to the mounting member 200 , thereby achieving electrical connection between the electronic device 300 and the feed network 100 .

[0068] In one embodiment, please refer to Figures 1 to 3 At least two mounting members 200 are provided, and the mounting members 200 are arranged at different positions of the feeding network 100 to be electrically connected to different electronic devices 300 .

[0069] like Figure 1 and Figure 2 As shown, the feed network 100 has two mounting positions for electrically connecting the electronic device 300 , and the two mounting members 200 are welded to the corresponding mounting positions by ultrasonic welding or pressure welding.

[0070] like Figure 3 As shown, two electronic devices 300 are respectively welded together with corresponding mounting parts 200 by soldering, thereby realizing electrical connection between the electronic devices 300 and the feeding network 100 .

[0071] like Figure 3 In the illustrated embodiment, both electronic devices 300 are coaxial cables, and the two coaxial cables are respectively welded to the corresponding mounting members 200 , thereby making the coaxial cables conductive to the two welding positions of the feed network 100 .

[0072] It is understandable that:

[0073] Figure 3 In the illustrated embodiment, the electronic devices 300 welded to the two mounting parts 200 are both coaxial cables, while in other embodiments, the different electronic devices 300 may be the same type of electronic devices 300, such as two coaxial cables, or different types of electronic devices 300, such as a coaxial cable and a filter, etc., which will not be elaborated herein.

[0074] In one embodiment, please refer to Figure 1 and Figure 3 The feeding network 100 is arranged in a U shape, and two mounting members 200 are provided. The two mounting members 200 are respectively fixed at two ends of the feeding network 100 .

[0075] like Figure 1 and Figure 3 As shown, the feed network 100 is arranged in an inverted U shape, and a mounting member 200 is arranged at each of the two lower ends of the feed network 100 . The mounting member 200 is an aluminum sheet and is welded to the surface of the feed network 100 .

[0076] like Figure 3 As shown, the mounting members 200 are disposed at two ends of the feed network 100 , and the electronic device 300 is a coaxial cable and is provided with two. The two coaxial cables are respectively welded to the corresponding mounting members 200 to achieve electrical connection between the coaxial cables and the feed network 100 .

[0077] In one embodiment, please refer to Figure 2 and Figure 4 The feeding structure further includes a dielectric plate 400 , and the feeding network 100 is arranged on the dielectric plate 400 .

[0078] like Figure 2 and Figure 4 As shown, the feeding network 100 further includes a dielectric board 400 , and the dielectric board 400 is used to carry the feeding network 100 .

[0079] For example, the dielectric plate 400 may be a plate-shaped structure having a cavity, and the feeding network 100 is arranged in the cavity of the dielectric plate 400 .

[0080] like Figure 2 As shown, the feed network 100 is disposed in the cavity of the dielectric plate 400 , a portion of the feed network 100 is exposed, a mounting member 200 is disposed on the exposed portion, and the electronic device 300 is welded through the mounting member 200 .

[0081] Figure 2 In the perspective shown, the ends of the coaxial cables are respectively welded and fixed to the corresponding mounting members 200, and the coaxial cables are all arranged horizontally.

[0082] In one embodiment, please refer to Figure 4 At least two feeding networks 100 are provided, and the feeding networks 100 are stacked on the dielectric plate 400 .

[0083] like Figure 4 In the illustrated embodiment, the dielectric plate 400 generally has two cavities, and the two cavities are arranged at intervals along the thickness direction of the dielectric plate 400 to arrange two feeding networks 100. The two feeding networks 100 are arranged in an upper and lower stack on the dielectric plate 400. The two feeding networks 100 are electrically connected to two corresponding electronic devices 300, and the electronic devices 300 are also stacked with the feeding networks 100.

[0084] For example, Figure 4 The four electronic devices 300 in the viewing angle are all coaxial cables. The two upper coaxial cables are electrically connected to one of the feeding networks 100, and the two lower coaxial cables are electrically connected to another feeding network 100. The two coaxial cables on the left are stacked up and down, and the two coaxial cables on the right are stacked up and down, which will not be repeated.

[0085] like Figure 4 From the perspective shown, the ends of the four coaxial cables are respectively welded and fixed to the corresponding mounting members 200, and the extension directions of the four coaxial cables are all the same, roughly along the length direction of the dielectric plate 400, so as to save space and make the structure more compact.

[0086] like Figure 4 As shown, when the electronic devices 300 are stacked, the sheet mounting piece 200 and the feed network 100 are fixed by ultrasonic welding or pressure welding. Compared with laser welding, laser welding can only weld at the edges where the two electronic devices 300 intersect and form a line weld, while ultrasonic welding or pressure welding can weld on the entire surface where the two electronic devices 300 are in contact and form a surface fusion. Compared with the line weld formed by laser welding, the surface fusion formed by ultrasonic welding or pressure welding is more solid and reliable. At the same time, compared with laser welding, if the first welding is not good, ultrasonic welding or pressure welding can be used to directly perform secondary welding at the original welding position without adding solder, and the process is simpler.

[0087] Of course, in other embodiments, mounting members 200 are arranged on both the front and back sides of the feeding network 100 so that the electronic devices 300 on different sides of the feeding network 100 are stacked, which will not be described in detail.

[0088] Another embodiment provides an antenna, comprising the feeding structure as described in any one of the above embodiments.

[0089] The antenna adopts the aforementioned feeding structure, which not only eliminates the need for electroplating of the feeding network 100, thereby reducing the high process cost caused by electroplating, but also solves the problem of deformation and damage of the feeding network 100 caused by electroplating.

[0090] The antenna may be a base station antenna for use in technical fields such as mobile communications. The electrical devices in the feeding structure may be one or more of a radiating unit, a phase shifter, a filter, a power divider, a combiner, a waveguide or a suspended strip line. The number and type of the electronic devices 300 are determined based on the functions to be implemented on the feeding network 100 and the devices actually arranged.

[0091] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0092] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0093] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0094] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0095] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0096] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A feeding structure, characterized in that: include: a feed network, the feed network being unplated; A mounting member, wherein the mounting member is fixed on the feed network and electrically connected to the feed network, and the mounting member is used to electrically connect electronic devices so that the electronic devices are electrically connected to the feed network; the mounting member is welded to the feed network by ultrasonic welding; or the mounting member is welded to the feed network by pressure welding; the feed network is made of an aluminum plate or an aluminum alloy plate; the mounting member is a mounting plate, and the thickness of the mounting plate is less than the thickness of the feed network; the material of the mounting member is a non-ferromagnetic metal material that can be subjected to soldering operation, so as to electrically connect the electronic devices to the mounting member by soldering.

2. The feeding structure according to claim 1, characterized in that: The material of the mounting piece includes at least one of gold, silver and copper; Or / and, the electronic device is one or more of a radiating unit, a phase shifter, a filter, a power divider, a combiner, a coaxial cable, a soldering pin, a waveguide or a suspended strip line electrically connected to the feeding network.

3. The feeding structure according to claim 1, characterized in that: The mounting piece is a rectangular mounting plate.

4. The feeding structure according to claim 1, characterized in that: The mounting piece is an aluminum sheet and is welded to the surface of the feed network.

5. The feeding structure according to claim 1, characterized in that: At least two mounting members are provided, and the mounting members are arranged at different positions of the feed network to be electrically connected to different electronic devices.

6. The feeding structure according to claim 5, characterized in that: The feed network is arranged in a U shape, and two mounting members are provided. The two mounting members are respectively fixed to two ends of the feed network.

7. The feeding structure according to any one of claims 1 to 6, characterized in that: The feeding structure further comprises a dielectric plate, and the feeding network is arranged on the dielectric plate.

8. The feeding structure according to claim 7, characterized in that: There are at least two feed networks, and the feed networks are stacked on the dielectric board.

9. The feeding structure according to claim 8, characterized in that: The dielectric plate is a plate-shaped structure having a cavity, and the feeding network is arranged in the cavity of the dielectric plate.

10. An antenna, characterized in that: Comprising the feeding structure as described in any one of claims 1 to 9.

Citation Information

Patent Citations

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