Sampling measurement method, system, computer equipment and storage medium

Abstract

The present application relates to a sampling measurement method, system, computer equipment and storage medium. The sampling measurement method includes: obtaining a preset measurement ratio of each process element in a process station; obtaining an actual measurement ratio of a process element in the process station associated with a batch of products to be measured that arrives at the measurement station; when the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio, controlling the measurement machine of the measurement station to measure the batch of products to be measured. The above-mentioned sampling measurement method can effectively improve the problem of insufficient or missing measurement of process elements in the process station during wafer sampling measurement.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a sampling measurement method, system, computer equipment and storage medium. Background Art

[0002] In the semiconductor wafer manufacturing process, in order to timely understand the status of the wafer process, discover problems in time, and improve and stabilize the yield, it is necessary to use a measuring machine to measure the wafer.

[0003] The measurement process is a time-consuming and expensive process. In the semiconductor manufacturing process, as the production capacity continues to expand, the utilization rate of the measurement machine also increases. However, the number of measurement machines is limited, and the labor cost of the wafer foundry is also precious. Reasonable allocation of the production capacity of the measurement machine and formulation of dispatch rules are crucial to the production cycle and cost control of the wafer foundry. In the prior art, when mass production is carried out, in order to reduce the load of the measurement machine, it is necessary to sample and measure each batch of products (lot) within a credible risk range.

[0004] There are many specific implementation algorithms for sampling measurement. Some are based on the characteristic last digit of the product number, some are based on time period sampling, some are based on the number of pieces passed by the product, and some are based on characteristic process sampling in the product manufacturing process.

[0005] However, the sampling and measuring methods in the prior art are not perfect. For example, there is a risk that the chamber of a process station tool will not be measured for a long time. Summary of the invention

[0006] Based on this, it is necessary to provide an improved sampling measurement method to address the problem that the traditional sampling measurement method is prone to insufficient or missing measurement of process elements in the process station.

[0007] A sampling and measuring method, comprising:

[0008] Obtain the preset measurement ratio for each process element in the process station;

[0009] Obtaining an actual measurement ratio of process elements in the process station associated with a batch of products to be measured that arrives at the measurement station;

[0010] When the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio, the measuring machine of the measuring station is controlled to measure the batch of products to be measured.

[0011] In one embodiment, the step of obtaining the actual measurement ratio of the process elements associated with the batch of products to be measured that arrive at the measurement station in the process station includes: determining the process elements associated with the batch of products to be measured based on the process flow information of the batch of products to be measured; obtaining a first batch number of batch products associated with the associated process elements that have passed through the measurement station and have been measured; obtaining a second batch number of batch products associated with the associated process elements that have passed through the measurement station and have not been measured; and determining the actual measurement ratio of the associated process elements based on the first batch number and the second batch number.

[0012] In one embodiment, the actual measurement ratio of the associated process element satisfies the following relationship: CR=M / (M+N); wherein CR represents the actual measurement ratio of the associated process element, M represents the first batch number, and N represents the second batch number.

[0013] In one embodiment, the method further includes: when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element, controlling the measuring machine of the measuring station not to measure the batch of products to be measured.

[0014] In one embodiment, the method further includes: when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element, obtaining the idle ratio of the measuring machine of the measuring station; when the idle ratio of the measuring machine of the measuring station is greater than 0, controlling the measuring machine of the measuring station to measure the batch of products to be measured.

[0015] In one embodiment, the method further includes: obtaining the idle ratio of the measuring machine of the measuring station; when the idle ratio of the measuring machine of the measuring station is greater than 0, determining the process element associated with the batch product whose last measurement time is farthest from the current moment, and adjusting the preset measurement ratio of the process element higher by a first preset value.

[0016] In one embodiment, the method further includes: obtaining the shortage ratio of the measuring machine of the measuring station; when the shortage ratio of the measuring machine of the measuring station is greater than 0, determining the process element associated with the batch product whose last measurement time is closest to the current moment, and adjusting the preset measurement ratio of the process element lower by a second preset value.

[0017] In one embodiment, the process elements in the process station include a process tool, a process chamber or a process type.

[0018] The invention also provides a sampling and measuring system.

[0019] A sampling and measuring system, comprising:

[0020] A first acquisition module is configured to acquire a preset measurement ratio of each process element in a process station;

[0021] A second acquisition module is configured to acquire an actual measurement ratio of a process element in the process station associated with a batch of products to be measured that arrives at the measurement station; and

[0022] The control module is connected to the first acquisition module and the second acquisition module, and is configured to control the measuring machine of the measuring station to measure the batch of products to be measured when the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio.

[0023] In one embodiment, the second acquisition module includes: an identification submodule, used to determine the process element associated with the batch product to be measured according to the process flow information of the batch product to be measured; a first acquisition submodule, connected to the identification submodule, used to obtain the first batch number of the batch product associated with the associated process element, which has passed through the measuring station and has been measured; a second acquisition submodule, connected to the identification submodule, used to obtain the second batch number of the batch product associated with the associated process element, which has passed through the measuring station and has not been measured; and an operation submodule, connected to the first acquisition submodule and the second acquisition submodule, used to determine the actual measurement ratio of the associated process element according to the first batch number and the second batch number.

[0024] In one embodiment, the control module is further configured to control the measuring machine of the measuring station not to measure the batch of products to be measured when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element.

[0025] In one of the embodiments, it also includes a third acquisition submodule, which is connected to the control module and is configured to acquire the idle ratio of the measuring machine of the measuring station when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element; the control module is also configured to control the measuring machine of the measuring station to measure the batch of products to be measured when the idle ratio of the measuring machine of the measuring station is greater than 0.

[0026] In one embodiment, it also includes a third acquisition module, which is configured to obtain the idle ratio of the measuring machine of the measuring station; and a first adjustment module, which is connected to the third acquisition module and the control module and is configured to determine the process element associated with the batch product whose previous measurement time is farthest from the current time when the idle ratio of the measuring machine of the measuring station is greater than 0, and adjust the preset measurement ratio of the process element to a first preset value.

[0027] In one embodiment, it also includes a fourth acquisition module, which is configured to obtain the shortage ratio of the measuring machine of the measuring station; and a second adjustment module, which is connected to the fourth acquisition module and the control module, and is configured to determine the process element associated with the batch product whose previous measurement time is closest to the current time when the shortage ratio of the measuring machine of the measuring station is greater than 0, and adjust the preset measurement ratio of the process element lower by a second preset value.

[0028] In one embodiment, the process elements in the process station include a process tool, a process chamber or a process type.

[0029] The invention also provides a computer device.

[0030] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the aforementioned method when executing the computer program.

[0031] The invention also provides a storage medium.

[0032] A computer-readable storage medium stores a computer program, which implements the steps of the aforementioned method when executed by a processor.

[0033] The above-mentioned sampling measurement method can make each process element in the process station independently have a preset measurement ratio, and control the measurement equipment of the measurement station to measure the batch of products to be measured when specific conditions are met, so that the actual measurement ratio of the process elements in the process station associated with the batch of products to be measured that arrive at the measurement station is close to the corresponding preset measurement ratio, thereby effectively improving the problem of insufficient or missing measurement of process elements in the process station during the wafer sampling measurement process.

[0034] The above-mentioned sampling measurement system, through the first acquisition module, enables each process element in the process station to independently have a preset measurement ratio, and controls the measurement equipment of the measurement station to measure the batch of products to be measured through the control module when specific conditions are met, so that the actual measurement ratio of the process elements in the process station associated with the batch of products to be measured that arrive at the measurement station is close to the corresponding preset measurement ratio, thereby effectively improving the problem of insufficient or missing measurement of process elements in the process station during the wafer sampling measurement process.

[0035] The above-mentioned computer equipment can be used to execute the aforementioned sampling measurement method, thereby realizing automatic sampling measurement of wafers at the measurement station, and improving the problem of insufficient or missing measurement of process elements at the process station during the wafer sampling measurement process.

[0036] The storage medium stores the execution program of the sampling measurement method, which can be adapted to different computer devices, thereby improving the problem of insufficient or missing measurement of process elements in the process station during wafer sampling measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the implementation methods of this specification or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0038] Figure 1 A flowchart of the steps of a method according to an embodiment of the present invention;

[0039] Figure 2 A flowchart of the steps of obtaining the actual measurement ratio of the associated process elements according to a method according to an embodiment of the present invention;

[0040] Figure 3 A flowchart of the steps of another embodiment of the method of the present invention;

[0041] Figure 4 A flowchart of the steps of another embodiment of the method of the present invention;

[0042] Figure 5 A flowchart of the steps of another embodiment of the method of the present invention;

[0043] Figure 6 A flowchart of the steps of another embodiment of the method of the present invention;

[0044] Figure 7 A connection diagram of a system according to an embodiment of the present invention;

[0045] Figure 8 This is a connection diagram of a second acquisition module of a system according to an embodiment of the present invention;

[0046] Fig. 9 A schematic diagram of system connection of another embodiment of the present invention;

[0047] Fig.10 A schematic diagram of system connection of another embodiment of the present invention;

[0048] Fig.11 A schematic diagram of system connection of another embodiment of the present invention;

[0049] Fig.12 It is a schematic diagram of the application effect of the system according to one embodiment of the present invention. DETAILED DESCRIPTION

[0050] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to understand the disclosure of the present invention more thoroughly and comprehensively.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0052] The inventor of the present invention has found that the traditional sampling measurement method for setting the measurement ratio for the measurement station is not perfect by studying the sampling measurement method of the prior art. For example, when the batch of products to be measured arrives at the measurement station, since the information of the process chamber (or other process station process elements) associated with the batch of products to be measured is not considered when deciding whether to keep the batch of products to be measured for measurement, it may cause the batch of products of a certain process or a certain process to have a higher measurement ratio, while the batch of products of another process or another process has a very low measurement ratio or even has not been measured for a long time, which makes it impossible for technicians to grasp the process status of the corresponding process chamber in time, and even if problems occur, they are not easy to be discovered, which is not conducive to the stability and improvement of wafer yield.

[0053] Based on the above research, the present invention provides an improved sampling measurement method, including: obtaining a preset measurement ratio of each process element in a process station; obtaining an actual measurement ratio of a process element in a process station associated with a batch of products to be measured that arrives at the measurement station; when the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio, controlling the measurement machine of the measurement station to measure the batch of products to be measured. The sampling measurement method of the present invention can effectively improve the problem of insufficient or missing measurement of process elements in the process station during wafer sampling measurement.

[0054] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It should be noted that the purpose of providing these drawings is to help understand the embodiments of the present invention, and should not be interpreted as an improper limitation of the present invention.

[0055] Please refer to Figure 1 , the sampling and measuring method may include the following steps:

[0056] S100, obtaining a preset measurement ratio of each process element in a process station.

[0057] In the production and manufacturing process of wafers, it is necessary to timely grasp the process status of each process element in the process station to stabilize and improve the production yield of wafers. The above steps can make each process element in the process station have a corresponding preset measurement ratio according to the actual situation, and then the preset measurement ratio can be used as a judgment basis to control the measurement action of the batch of products to be measured in the measurement station. Among them, the process elements in the process station can include process machines, process chambers or process types, etc.

[0058] S200, obtaining the actual measurement ratio of the process elements in the process station associated with the batch of products to be measured that arrive at the measurement station.

[0059] The batches of products to be measured that arrive at the measurement station all have an associated process station process element. By obtaining the actual measurement ratio of the associated process element, it is beneficial to compare it with the preset measurement ratio of the associated process element, and then control the measurement action of the measurement station measurement machine according to the comparison result.

[0060] S300: When the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio, control the measuring machine of the measuring station to measure the batch of products to be measured.

[0061] If the comparison result is that the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio, the measuring machine of the measuring station is controlled to measure the batch of products to be measured so that the actual measurement ratio of the associated process element is close to its preset measurement ratio. After the sampling measurement is completed, the measurement ratio of each process element in the process station can be close to its preset measurement ratio, so that the technical personnel can grasp the process status of each process element in the process station in a timely manner.

[0062] The above-mentioned sampling measurement method can make each process element in the process station have an independent preset measurement ratio, and independently calculate the actual measurement ratio of each process element according to the measurement situation of the batch products, so as to control the measurement equipment of the measurement station to measure the batch products to be measured when the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio, thereby effectively improving the problem of insufficient or missing measurement of process elements in the process station during the wafer sampling measurement process.

[0063] In one embodiment, please refer to Figure 2 , step S200 may include the following steps:

[0064] S210. Determine process elements associated with the batch of products to be measured according to the process flow information of the batch of products to be measured.

[0065] The process flow information includes parameter information of each process that the wafer needs to go through during the production process. Through this parameter information, the process elements associated with the batch of products to be measured can be quickly determined.

[0066] S220, obtaining the first batch number of batch products associated with the associated process element, which have passed through the measurement station and have been measured.

[0067] S230, obtaining a second batch number of batch products associated with the associated process element, which have passed through the measurement station but have not been measured.

[0068] By recording the measurement conditions of each batch of products passing through the measuring station, the process element association associated with the batch of products to be measured that currently arrives at the measuring station, and the number of batches of products that have passed the measuring station and have been measured (i.e., the first batch number) can be obtained. In addition, the process element association associated with the batch of products to be measured that currently arrives at the measuring station, and the number of batches of products that have passed the measuring station but have not been measured (i.e., the second batch number) can be obtained.

[0069] S240: Determine the actual measurement ratio of the associated process element according to the first batch number and the second batch number.

[0070] Specifically, the actual measurement ratio of the associated process element can be calculated by the following relationship: CR=M / (M+N); wherein CR represents the actual measurement ratio of the associated process element, M represents the first batch number, and N represents the second batch number.

[0071] For example, if the process element associated with the batch product a9 to be measured that has currently arrived at the measurement station is process element A, and the preset measurement ratio of process element A in the process station is 30%, and in the previous batches recorded, there are two batches of products a1 and a6 associated with process element A that have passed through the measurement station and have been measured (that is, the first batch number is 2), and there are six batches of products a2, a3, a4, a5, a7 and a8 associated with process element A that have passed through the measurement station but have not been measured (that is, the second batch number is 6), then the actual measurement ratio of process element A can be obtained as 2 / 8=25%, and it can be further known that the actual measurement ratio of process element A is less than its preset measurement ratio, and the measurement machine of the measurement station can be controlled to measure the batch product a9 to be measured.

[0072] In one embodiment, please refer to Figure 3 , the sampling and measuring method may also include:

[0073] S400: When the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element, control the measuring machine of the measuring station not to measure the batch of products to be measured.

[0074] Through the above method, when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element, the actual measurement ratio of the associated process element can be reduced to approach its preset measurement ratio. At the same time, unnecessary measurements can be effectively reduced and the utilization efficiency of the measuring equipment in the measuring station can be improved.

[0075] In one embodiment, please refer to Figure 4 , the sampling and measuring method may also include:

[0076] S400': when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element, obtain the idle ratio of the measurement equipment of the measurement station.

[0077] Specifically, the image acquisition module or the photoelectric sensor module can quickly determine whether there is a load on the measuring machine of the measuring station, and thus the idle ratio of the measuring machine of the measuring station can be obtained.

[0078] S410', when the idle ratio of the measuring machines of the measuring station is greater than 0, the measuring machines of the measuring station are controlled to measure the products of the batch to be measured.

[0079] If the idle ratio of the measuring machine of the measuring station is greater than 0, even if the actual measurement ratio of the current batch of products to be measured is greater than its preset measurement ratio, the batch of products to be measured can still be measured. On the one hand, the idle ratio of the measuring machine can be reduced and the utilization efficiency of the measuring machine can be improved. On the other hand, more process status information of the associated process elements can be obtained, thereby improving the accuracy of the technical personnel's judgment on the process status of the associated process elements.

[0080] In one embodiment, please refer to Figure 5 , the sampling and measuring method may also include:

[0081] S500: Obtain the idle ratio of the measuring machines of the measuring station.

[0082] S510, when the idle ratio of the measuring machines of the measuring station is greater than 0, determine the process element associated with the batch product whose last measurement time is farthest from the current time, and increase the preset measurement ratio of the process element by a first preset value.

[0083] The load of the measuring machine can be monitored in real time through the image acquisition module or the photoelectric sensor module, and the idle ratio of the measuring machine of the measuring station can be obtained. If there is no load on some measuring machines, it means that the idle ratio of the measuring machine of the measuring station is greater than 0, and the process element associated with the batch product whose previous measurement time is farthest from the current time can be determined, and the preset measurement ratio of the process element is increased by the first preset value, so as to improve the actual measurement ratio of the associated process element while making full use of the idle measuring machines, thereby improving the use efficiency of the measuring machine and ensuring that the batch products associated with each process element can be fully measured.

[0084] For example, if the idle ratio of the measuring machine of the measuring station is greater than 0, the process element associated with the batch product whose last measurement time is farthest from the current time is process element A, and the preset measurement ratio of process element A is 25%, then the preset measurement ratio of process element A can be increased by 5% to improve the utilization efficiency of the measuring machine, while ensuring that the batch products associated with process element A can be fully measured.

[0085] In one embodiment, please refer to Figure 6 , the sampling and measuring method may also include:

[0086] S600: Obtain the shortage ratio of the measuring machines of the measuring station.

[0087] S610: When the shortage ratio of the measuring machines of the measuring station is greater than 0, determine the process element associated with the batch product whose last measurement time is closest to the current time, and adjust the preset measurement ratio of the process element lower by a second preset value.

[0088] The image acquisition module or the photoelectric sensor module can monitor the load of the measuring machine in real time, and then obtain the insufficient ratio of the measuring machine of the measuring station. If there are batches of products to be measured in the measuring station, it means that the insufficient ratio of the measuring machine of the measuring station is greater than 0, and the process element associated with the batch product whose previous measurement time is closest to the current time can be determined, and the preset measurement ratio of the process element is lowered by a second preset value to appropriately reduce the actual measurement ratio of the associated process element, thereby alleviating the use load of the measuring machine and ensuring that the batch products associated with each process element can be fully measured.

[0089] For example, if the insufficient ratio of the measuring machine of the measuring station is greater than 0, the process element associated with the batch product whose last measurement time is closest to the current time is process element B, and the preset measurement ratio of process element B is 30%, then the preset measurement ratio of process element A can be reduced by 5% to alleviate the usage load of the measuring machine and ensure that the batch products associated with other process elements can also be fully measured.

[0090] Based on the description of the sampling and measurement method embodiment described above, the present invention also provides a sampling and measurement system. The system may include software (applications), modules, components, servers, clients, etc. that use the method described in the embodiments of this specification and are combined with necessary implementation hardware. Based on the same innovative concept, the system in one or more embodiments provided by the embodiments of the present disclosure is as described in the following embodiments. Since the implementation scheme and method for solving the problem of the system are similar, the implementation of the specific system of the embodiments of this specification can refer to the implementation of the aforementioned method, and the repetitions will not be repeated. As used below, the term "unit" or "module" is a combination of software and / or hardware that can implement a predetermined function. Although the device system described in the following embodiments is preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceived.

[0091] For details, please refer to Figure 7 The sampling measurement system 100 includes: a first acquisition module 110, configured to acquire a preset measurement ratio of each process element in a process station; a second acquisition module 120, configured to acquire an actual measurement ratio of a process element in the process station associated with a batch of products to be measured that arrives at the measurement station; and a control module 130, connected to the first acquisition module 110 and the second acquisition module 120, configured to control the measurement machine of the measurement station to measure the batch of products to be measured when the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio. The process elements in the process station include process machines, process chambers, or process types, etc.

[0092] The sampling measurement system 100, through the first acquisition module 110, enables each process element in the process station to independently have a preset measurement ratio, and controls the measurement equipment of the measurement station to measure the batch of products to be measured through the control module 130 when specific conditions are met, so that the actual measurement ratio of the process elements in the process station associated with the batch of products to be measured that arrive at the measurement station is close to the corresponding preset measurement ratio, thereby effectively improving the problem of insufficient or missing measurement of process elements in the process station during the wafer sampling measurement process.

[0093] In one embodiment, please refer to Figure 8The second acquisition module 120 includes: an identification submodule 121, which is used to determine the process element associated with the batch product to be measured according to the process flow information of the batch product to be measured; a first acquisition submodule 122, which is connected to the identification submodule 121, and is used to obtain the first batch number of the batch product associated with the associated process element, which has passed through the measurement station and has been measured; a second acquisition submodule 123, which is connected to the identification submodule, and is used to obtain the second batch number of the batch product associated with the associated process element, which has passed through the measurement station and has not been measured; an operation submodule 124, which is connected to the first acquisition submodule 122 and the second acquisition submodule 123, and is used to determine the actual measurement ratio of the associated process element according to the first batch number and the second batch number. Specifically, the actual measurement ratio of the associated process element satisfies the following relationship: CR = M / (M+N); wherein CR represents the actual measurement ratio of the associated process element, M represents the first batch number, and N represents the second batch number.

[0094] In one embodiment, the control module is further configured to control the measuring machine of the measuring station not to measure the batch of products to be measured when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element. Through the above method, the actual measurement ratio of the associated process element can be reduced to be close to its preset measurement ratio, and at the same time, unnecessary measurements can be effectively reduced, thereby improving the use efficiency of the measuring machine of the measuring station.

[0095] In one embodiment, please refer to Fig. 9 The system further includes: a third acquisition submodule 131, connected to the control module 130, configured to acquire the idle ratio of the measuring machine of the measuring station when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element; the control module 130 is also configured to control the measuring machine of the measuring station to measure the batch of products to be measured when the idle ratio of the measuring machine of the measuring station is greater than 0. In this way, the idle ratio of the measuring machine can be reduced, the utilization efficiency of the measuring machine can be improved, and more process status information of the associated process element can be obtained, so as to improve the accuracy of the judgment of the technicians on the process status of the associated process element.

[0096] In one embodiment, please refer to Fig.10The system further includes: a third acquisition module 140, configured to acquire the idle ratio of the measuring machine of the measuring station; and a first adjustment module 150, connected to the third acquisition module 140 and the control module 130, configured to determine the process element associated with the batch product whose last measurement time is farthest from the current time when the idle ratio of the measuring machine of the measuring station is greater than 0, and increase the preset measurement ratio of the process element by a first preset value. This is conducive to improving the actual measurement ratio of the associated process element while making full use of the idle measuring machines, thereby improving the use efficiency of the measuring machines while ensuring that the batch products associated with each process element can be fully measured.

[0097] In one embodiment, please refer to Fig.11 The system further includes: a fourth acquisition module 160, configured to acquire the insufficient ratio of the measuring machine of the measuring station; and a second adjustment module 170, connected to the fourth acquisition module and the control module 130, configured to determine the process element associated with the batch product whose last measurement time is closest to the current time when the insufficient ratio of the measuring machine of the measuring station is greater than 0, and adjust the preset measurement ratio of the process element to a lower second preset value. This is conducive to appropriately reducing the actual measurement ratio of the associated process element, thereby alleviating the use load of the measuring machine and ensuring that the batch products associated with each process element can be fully measured.

[0098] The effect of the present invention will be demonstrated below through the specific application of the method of the present invention.

[0099] Please refer to Fig.12, the process station has process chamber B, process chamber C, process chamber D, process chamber E, and process chamber F, and each process chamber represents a process element. Wherein (a) shows the sampling and measurement interval time of each process chamber when the sampling and measurement method of the present invention is not applied. It can be seen that the sampling and measurement interval time of each process chamber is mainly concentrated within 15 hours (the rectangular length of each figure in the figure), and the maximum sampling and measurement interval time will not exceed 30 hours on average (the difference between the upper and lower limits of each figure in the figure); (b) shows the sampling and measurement interval time of each process chamber after the sampling and measurement method of the present invention is applied, wherein the preset measurement ratio of each process chamber is set to 25%. It can be seen that the sampling and measurement time interval of each process chamber is mainly concentrated within 6 hours, and the maximum sampling measurement interval will not exceed 10 hours on average, which shows that the method of the present invention can greatly shorten the measurement time interval of the process chamber; (c) shows the sampling measurement interval of each process chamber when the sampling measurement method of the present invention is applied and the preset measurement ratio of each process chamber is reduced to 18%. It can be seen that although the sampling measurement interval of some chambers is increased compared to the sampling measurement interval when the preset measurement ratio is set to 25%, the overall sampling measurement time interval is still shorter than the sampling measurement time interval of each process chamber shown in (a). By changing the preset measurement ratio, the sampling measurement time interval of the batch products corresponding to each process chamber can be more accurately controlled to avoid the risk of the batch products corresponding to the process chamber not being measured for a long time.

[0100] The present application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the aforementioned method when executing the computer program.

[0101] The above-mentioned computer equipment can be used to execute the aforementioned sampling measurement method, thereby realizing automatic sampling measurement of wafers at the measurement station, and improving the problem of insufficient or missing measurement of process elements at the process station during the wafer sampling measurement process.

[0102] The present application also provides a storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the aforementioned method are implemented.

[0103] The storage medium stores the execution program of the sampling measurement method, which can be adapted to different computer devices, thereby improving the problem of insufficient or missing measurement of process elements in the process station during wafer sampling measurement.

[0104] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0105] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A sampling measurement method, characterized in that: include: Obtain the preset measurement ratio for each process element in the process station; Obtaining an actual measurement ratio of process elements in the process station associated with a batch of products to be measured that arrives at the measurement station; When the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio, controlling the measuring machine of the measuring station to measure the batch of products to be measured; Wherein, the method further comprises: Obtaining a shortage ratio of measuring machines of the measuring station; When the shortage ratio of the measuring machines of the measuring station is greater than 0, the process element associated with the batch product whose last measurement time is closest to the current time is determined, and the preset measurement ratio of the process element is adjusted down by a second preset value.

2. The sampling and measuring method according to claim 1, characterized in that: The step of obtaining the actual measurement ratio of the process elements in the process station associated with the batch of products to be measured that arrive at the measurement station includes: Determining process elements associated with the batch of products to be measured according to process flow information of the batch of products to be measured; Obtaining the first batch number of batch products associated with the associated process element, which have passed through the measurement station and have been measured; Acquire a second batch number of the batch product associated with the associated process element, which has passed through the measurement station but has not been measured; An actual measurement ratio of the associated process element is determined according to the first batch number and the second batch number.

3. The sampling and measuring method according to claim 2, characterized in that: The actual measurement ratio of the associated process element satisfies the following relationship: CR = M / (M+N); Wherein, CR represents the actual measurement ratio of the associated process element, M represents the first batch number, and N represents the second batch number.

4. The sampling and measuring method according to claim 1, characterized in that: The method further comprises: When the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element, the measuring machine of the measuring station is controlled not to measure the batch of products to be measured.

5. The sampling and measuring method according to claim 1, characterized in that: The method further comprises: When the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element, obtaining the idle ratio of the measurement equipment of the measurement station; When the idle ratio of the measuring machines of the measuring station is greater than 0, the measuring machines of the measuring station are controlled to measure the batch of products to be measured.

6. The sampling and measuring method according to claim 1, characterized in that: The method further comprises: Obtaining an idle ratio of a measuring machine of the measuring station; When the idle ratio of the measuring machines of the measuring station is greater than 0, the process element associated with the batch product whose last measurement time is farthest from the current time is determined, and the preset measurement ratio of the process element is increased by a first preset value.

7. The sampling and measuring method according to any one of claims 1 to 6, characterized in that: The process elements in the process station include a process tool, a process chamber or a process type.

8. A sampling and measuring system, characterized in that: include: A first acquisition module is configured to acquire a preset measurement ratio of each process element in a process station; A second acquisition module is configured to acquire an actual measurement ratio of a process element in the process station associated with a batch of products to be measured that arrives at the measurement station; A control module connected to the first acquisition module and the second acquisition module, and configured to control the measuring machine of the measuring station to measure the batch of products to be measured when the actual measurement ratio of the associated process element is less than the corresponding preset measurement ratio; A fourth acquisition module is configured to acquire a shortage ratio of the measurement equipment of the measurement station; as well as, The second adjustment module is connected to the fourth acquisition module and the control module, and is configured to determine the process element associated with the batch product whose previous measurement time is closest to the current moment when the shortage ratio of the measuring machine of the measuring station is greater than 0, and adjust the preset measurement ratio of the process element lower by a second preset value.

9. The sampling and measuring system according to claim 8, characterized in that: The second acquisition module includes: An identification submodule, configured to determine the process elements associated with the batch of products to be measured according to the process flow information of the batch of products to be measured; A first acquisition submodule, connected to the identification submodule, for acquiring the first batch number of batch products associated with the associated process element, which have passed through the measurement station and have been measured; A second acquisition submodule, connected to the identification submodule, for acquiring a second batch number of a batch of products associated with the associated process element, which has passed through the measurement station but has not been measured; The operation submodule is connected to the first acquisition submodule and the second acquisition submodule, and is used to determine the actual measurement ratio of the associated process element according to the first batch number and the second batch number.

10. The sampling and measuring system according to claim 8, characterized in that: The control module is further configured to control the measuring machine of the measuring station not to measure the batch of products to be measured when the actual measurement ratio of the associated process element is greater than or equal to the preset measurement ratio of the associated process element.

11. The sampling and measuring system according to claim 8, characterized in that: Also includes: a third acquisition submodule, connected to the control module, configured to acquire an idle ratio of a measurement machine of a measurement station when the actual measurement ratio of the associated process element is greater than or equal to a preset measurement ratio of the associated process element; The control module is further configured to control the measuring machine of the measuring station to measure the batch of products to be measured when the idle ratio of the measuring machine of the measuring station is greater than 0.

12. The sampling and measuring system according to claim 8, characterized in that: Also includes: A third acquisition module is configured to acquire an idle ratio of a measurement machine of the measurement station; as well as, The first adjustment module is connected to the third acquisition module and the control module, and is configured to determine the process element associated with the batch product whose previous measurement time is farthest from the current time when the idle ratio of the measuring machine of the measuring station is greater than 0, and increase the preset measurement ratio of the process element by a first preset value.

13. The sampling and measuring system according to any one of claims 8 to 12, characterized in that: The process elements in the process station include a process tool, a process chamber or a process type.

14. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

15. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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