Chip packaging method and device

Abstract

The present disclosure relates to a chip packaging method, device, electronic device and storage medium. The method includes: processing and manufacturing the functional layer of the chip to generate a chip to be packaged; applying a preset width of curing glue on the lower layer of the glass top cover, and fitting the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment; irradiating the curing glue with ultraviolet light based on preset parameters to cure the curing glue, and completing the packaging of the chip to be packaged. The use of curing glue in the present disclosure improves the reliability of the underwater packaging process of the device during storage and use. Through the implementation of this solution, the production cost of multiple batches of devices is shortened.

Description

Background Art

[0002] The idea of ​​manipulating microfluids based on the principle of electrowetting has been confirmed by manipulating mercury droplets in water and oil droplets in water. After a lot of research on the movement, splitting, merging, mixing and other manipulations of droplets in EWOD devices, it has been gradually applied to chip laboratories, microlenses, displays and other fields. Its physical principle is: the surface tension of the system can be changed simply by changing the type of liquid, or by changing the chemical composition of the liquid, such as adding a surfactant to water to change the surface tension. The commonly used surfactant is sodium dodecyl sulfate (SDS), which can significantly reduce the surface tension of water. Similarly, the surface tension of a solid surface can be changed by treating it. In the EWOD system, the commonly used method to change the surface tension of a solid is to introduce a fluorinated polymer. Typical polymers Cytop and Teflon have very low surface tension and excellent hydrophobicity. This study uses Cytop polymer, which has excellent properties such as good chemical resistance, heat resistance, breakdown resistance, and good optical transmittance.

[0003] When voltage is applied, the liquid, insulating dielectric and conductive solid can be regarded as a capacitor, generating an electric field across the dielectric, capacitive charging occurs at the liquid-dielectric interface, resulting in charge accumulation, and at the same time, equal and opposite charges are induced at the other interface of the dielectric. There is a large charge density near the edge of the three-phase contact. The large charge density generates an electric field in close contact, thus inducing an electrostatic force perpendicular to the liquid surface. The surface tension balance at the solid-liquid interface is broken due to the emergence of this electrostatic force, but at the same time, the electrostatic force also increases the wettability of the surface.

[0004] With the deepening of the theoretical research on electrowetting, EWOD devices have good application prospects in the fields of optical fluid lenses, biomedicine, optical displays, etc. due to their advantages such as small size, low energy consumption, and fast response speed, and have made good progress. However, there are still some problems that have not been well solved, such as contact angle saturation (small opening and closing), contact angle hysteresis, and electrolysis in electrowetting.

[0005] Drop a drop of oil with a colored dye on the surface of a hydrophobic and lipophilic medium, and then cover it with water. After stabilization, the oil will be evenly spread on the surface of the medium. After the voltage is applied, the balance is broken, and the oil film changes the contact angle between the oil and the hydrophobic interface by shrinking until the system reaches a new balance. After the oil film shrinks, the area below is exposed. By changing the voltage to manipulate the shrinkage and recovery of the oil, the "on" and "off" states of the droplet are driven.

[0006] The electrowetting effect on dielectrics (EWOD) is to add an insulating film between the metal electrode and the electrolyte. When a certain voltage is applied between the liquid and the electrode, the liquid-solid surface tension will change reversibly, which is manifested as a change in the contact angle of the droplet on the solid surface. When the contact angle of the droplet changes symmetrically and evenly, the droplet macroscopically shows a process of spreading from a spherical droplet to a liquid film. If the contact angle changes asymmetrically, a gradient of surface tension will appear at the contact line on both sides of the droplet, causing the droplet to migrate and move.

[0007] For the existing underwater packaging, first complete the production of the film glass hydrophobic layer and micro-nano structures such as SU-8, and then go through a series of process flows such as RIE, annealing, and chemical treatment. Use oil filling equipment to complete the oil filling work of the film in water. After the production is completed, place it in water for standby. Select ITO glass as the top cover, where the side containing the ITO metal layer is placed downward (in contact with the water surface). Paste the prepared support layer (containing double-sided adhesive pressure-sensitive adhesive or OCA adhesive) on the side of the top glass metal surface, and complete the bonding and packaging of the substrate and the top sheet underwater. In forming the packaging structure, the support layer has two functions. One is to control the thickness of the support layer to ensure the gap height between the top and bottom glass. The gap height has a great effect on the electrical interconnection effect of the device. The second is that the upper and lower surfaces of the support layer are both sticky and have an adhesive effect. After the substrate and the top glass are pasted, a sealed environment is formed to lock the liquid water and oil inside the device to prevent liquid overflow and cause device failure.

[0008] However, this solution has two obvious disadvantages. First, the reliability of the sealed environment is very poor. It needs to be stored underwater or in a humid environment and cannot be stored indoors. It is even more impossible to store or use it in relatively harsh outdoor environments. Second, this type of adhesive layer has poor temperature resistance and cannot adapt to storage and use in high temperature (60°C) and low temperature (5°C) environments, and the process window is small.

[0009] Therefore, one or more methods are needed to solve the above problems.

[0010] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0011] The purpose of the present disclosure is to provide a chip packaging method, device, electronic device and computer-readable storage medium, thereby overcoming one or more problems caused by limitations and defects of related technologies at least to a certain extent.

[0012] According to one aspect of the present disclosure, there is provided a chip packaging method, comprising:

[0013] Process and manufacture the functional layer of the chip to generate the chip to be packaged;

[0014] Applying a preset width of curing glue on the lower layer of the glass top cover, and attaching the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment;

[0015] The curing glue is irradiated with ultraviolet light based on preset parameters to cure the curing glue, thereby completing the packaging of the chip to be packaged.

[0016] In an exemplary embodiment of the present disclosure, the method further includes:

[0017] Depositing a first conductive layer on the substrate material based on one or more processes of sputtering, evaporation, and electroplating, and patterning the first conductive layer based on one or more processes of stripping, photolithography and dry etching, or photolithography and wet etching;

[0018] Depositing a first dielectric layer on the first conductive layer that has been patterned based on one or more processes selected from chemical vapor deposition, physical vapor deposition, and spin coating, patterning the first dielectric layer based on a photolithography process, and making contact holes in the first dielectric layer that has been patterned based on one or more processes selected from wet and dry etching and photolithography;

[0019] Depositing a second conductive layer on the first dielectric layer including the contact hole based on one or more processes of sputtering, evaporation, and electroplating, and patterning the second conductive layer based on one or more processes of stripping, photolithography and dry etching, or photolithography and wet etching;

[0020] Depositing a second dielectric layer on the second conductive layer that has been patterned based on one or more processes of chemical vapor deposition, physical vapor deposition, and spin coating, and depositing a surface hydrophobic layer on the second dielectric layer based on one or more processes of spin coating, hanging coating, and thermal evaporation;

[0021] After the surface hydrophobic layer is oxidized, a hydrophilic grid is prepared on the surface hydrophobic layer based on a spin coating process, and an oil filling treatment is performed to complete the processing and manufacturing of the chip to be packaged.

[0022] In an exemplary embodiment of the present disclosure, the method further includes:

[0023] The glass top cover has the same size as the to-be-packaged area of ​​the to-be-packaged chip, and the lower layer of the glass top cover comprises a metal layer.

[0024] In an exemplary embodiment of the present disclosure, the method further includes:

[0025] The lower layer of the metal layer of the glass top cover also includes a support layer, which is used to contact the chip to be packaged and support the glass top cover when the glass top cover and the chip to be packaged are attached to each other, so that a preset distance is maintained between the glass top cover and the chip to be packaged.

[0026] In an exemplary embodiment of the present disclosure, the method further includes:

[0027] A curing glue with a preset width is applied on the inner side of the supporting layer under the metal layer of the glass top cover, and the glass top cover coated with the curing glue is attached to the chip to be packaged in an underwater environment.

[0028] In an exemplary embodiment of the present disclosure, the method further includes:

[0029] A curing glue with a preset width is applied to the lower layer of the glass top cover, and the glass top cover coated with the curing glue is bonded to the chip to be packaged in water.

[0030] In an exemplary embodiment of the present disclosure, the method further includes:

[0031] The curing adhesive viscosity is 1500-2500cps, and the temperature resistance is -20℃~125℃;

[0032] The preset parameters of the ultraviolet light are ultraviolet light with a wavelength of 365 to 438 nm.

[0033] In one aspect of the present disclosure, a chip packaging device is provided, including:

[0034] A chip generation module to be packaged is used to process and manufacture the functional layer of the chip to generate the chip to be packaged;

[0035] A bonding and packaging module is used to apply a preset width of curing glue on the lower layer of the glass top cover, and bond the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment;

[0036] The curing and packaging module is used to irradiate the curing glue with ultraviolet light based on preset parameters to cure the curing glue and complete the packaging of the chip to be packaged.

[0037] In one aspect of the present disclosure, there is provided an electronic device, comprising:

[0038] Processor; and

[0039] A memory having computer-readable instructions stored thereon, wherein the computer-readable instructions, when executed by the processor, implement the method according to any one of the above items.

[0040] In one aspect of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method according to any one of the above items is implemented.

[0041] A chip packaging method in an exemplary embodiment of the present disclosure includes: processing and manufacturing the functional layer of the chip to generate a chip to be packaged; applying a preset width of curing glue on the lower layer of the glass top cover, and attaching the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment; irradiating the curing glue with ultraviolet light based on preset parameters to cure the curing glue, thereby completing the packaging of the chip to be packaged. The use of curing glue in the present disclosure improves the reliability of the underwater packaging process of the device during storage and use, and through the implementation of this solution, the production cost of multiple batches of devices is shortened.

[0042] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0044] Figure 1 A flow chart of a chip packaging method according to an exemplary embodiment of the present disclosure is shown;

[0045] Figures 2A-2H A schematic diagram showing steps of generating a chip to be packaged in a chip packaging method according to an exemplary embodiment of the present disclosure is shown;

[0046] Figures 3A-3C A schematic diagram of curing packaging of a chip packaging method according to an exemplary embodiment of the present disclosure is shown;

[0047] Figure 4 A schematic block diagram of a chip packaging device according to an exemplary embodiment of the present disclosure is shown;

[0048] Figure 5 A block diagram schematically shows an electronic device according to an exemplary embodiment of the present disclosure; and

[0049] Figure 6 A schematic diagram of a computer-readable storage medium according to an exemplary embodiment of the present disclosure is schematically shown. DETAILED DESCRIPTION

[0050] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0051] In addition, the described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, devices, steps, etc. may be adopted. In other cases, known structures, methods, devices, implementations, materials or operations are not shown or described in detail to avoid blurring the various aspects of the present disclosure.

[0052] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or these functional entities or parts of functional entities may be implemented in one or more software hardened modules, or these functional entities may be implemented in different networks and / or processor devices and / or microcontroller devices.

[0053] In this exemplary embodiment, a chip packaging method is first provided; Figure 1 As shown in , the chip packaging method may include the following steps:

[0054] Step S110, processing and manufacturing the functional layer of the chip to generate a chip to be packaged;

[0055] Step S120, applying a curing glue of a preset width on the lower layer of the glass top cover, and attaching the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment;

[0056] Step S130, irradiating the curing adhesive with ultraviolet light based on preset parameters to cure the curing adhesive, thereby completing the packaging of the chip to be packaged.

[0057] A chip packaging method in an exemplary embodiment of the present disclosure includes: processing and manufacturing the functional layer of the chip to generate a chip to be packaged; applying a preset width of curing glue on the lower layer of the glass top cover, and attaching the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment; irradiating the curing glue with ultraviolet light based on preset parameters to cure the curing glue, thereby completing the packaging of the chip to be packaged. The use of curing glue in the present disclosure improves the reliability of the underwater packaging process of the device during storage and use, and through the implementation of this solution, the production cost of multiple batches of devices is shortened.

[0058] Next, a chip packaging method in this exemplary embodiment will be further described.

[0059] In step S110, the functional layer of the chip can be processed and manufactured to generate a chip to be packaged;

[0060] In the embodiment of this example, the method further comprises:

[0061] Depositing a first conductive layer on the substrate material based on one or more processes of sputtering, evaporation, and electroplating, and patterning the first conductive layer based on one or more processes of stripping, photolithography and dry etching, or photolithography and wet etching;

[0062] Depositing a first dielectric layer on the first conductive layer that has been patterned based on one or more processes selected from chemical vapor deposition, physical vapor deposition, and spin coating, patterning the first dielectric layer based on a photolithography process, and making contact holes in the first dielectric layer that has been patterned based on one or more processes selected from wet and dry etching and photolithography;

[0063] Depositing a second conductive layer on the first dielectric layer including the contact hole based on one or more processes of sputtering, evaporation, and electroplating, and patterning the second conductive layer based on one or more processes of stripping, photolithography and dry etching, or photolithography and wet etching;

[0064] Depositing a second dielectric layer on the second conductive layer that has been patterned based on one or more processes of chemical vapor deposition, physical vapor deposition, and spin coating, and depositing a surface hydrophobic layer on the second dielectric layer based on one or more processes of spin coating, hanging coating, and thermal evaporation;

[0065] After the surface hydrophobic layer is oxidized, a hydrophilic grid is prepared on the surface hydrophobic layer based on a spin coating process, and an oil filling treatment is performed to complete the processing and manufacturing of the chip to be packaged.

[0066] In this exemplary embodiment, if Figure 2A This is a substrate preparation step, and the substrate can be a glass wafer, polyimide (PI) or a silicon wafer with an oxide layer on the surface.

[0067] In this exemplary embodiment, if Figure 2B The step of making the first metal layer is to deposit the first conductive layer and pattern it, with a thickness of 50 to 500 nm. The material can be an alloy or multilayer stack of one or more of Au, Pt, Al, Ni, Cr, and Ti, or a metal oxide conductive layer such as ITO, and a multilayer stack composed of Au, Pt, Al, Ni, Cr, and Ti. The deposition process can be, but is not limited to, sputtering, evaporation, and electroplating. The patterning method can be a stripping process, or photolithography and dry etching, or photolithography and wet etching.

[0068] In this exemplary embodiment, if Figure 2C The insulating dielectric layer deposition step uses chemical vapor deposition, physical vapor deposition or spin coating to deposit the insulating dielectric layer, and the dielectric layer thickness is not greater than 5 microns; the dielectric layer material can be, but is not limited to, a multilayer structure formed by one or more of silicon oxide, silicon nitride, aluminum oxide, hafnium oxide, zirconium oxide, polyimide, and SU8 photoresist. Among them, chemical vapor deposition can be plasma chemical vapor deposition (PECVD), atomic layer deposition (ALD), ion coupled plasma chemical vapor deposition (ICP-CVD), and physical vapor deposition can be sputtering or evaporation.

[0069] In this exemplary embodiment, if Figure 2D In order to make the contact holes, patterning is performed by photolithography, and then the contact holes are etched by wet and dry methods, or the contact holes are formed by direct photolithography.

[0070] In this exemplary embodiment, if Figure 2E The second conductive layer is patterned, with a thickness of 50 to 500 nm. The material may be an alloy or a multilayer stack of one or more of Au, Pt, Al, Ni, Cr, and Ti, or a metal oxide conductive layer such as ITO, or a multilayer stack composed of Au, Pt, Al, Ni, Cr, and Ti. The deposition process may be, but is not limited to, sputtering, evaporation, and electroplating. The patterning method may be a stripping process, photolithography and dry etching, or photolithography and wet etching.

[0071] In this exemplary embodiment, if Figure 2FThe second dielectric layer deposition step uses chemical vapor deposition, physical vapor deposition or spin coating to deposit an insulating dielectric layer, the dielectric layer thickness is not greater than 5 microns; the dielectric layer material can be but not limited to silicon oxide, silicon nitride, aluminum oxide, hafnium oxide, zirconium oxide, polyimide, SU8 photoresist, Teflon, Cytop, one or more of the multilayer structure. Among them, chemical vapor deposition can be plasma chemical vapor deposition (PECVD), atomic layer deposition (ALD), ion coupled plasma chemical vapor deposition (ICP-CVD), physical vapor deposition can be sputtering or evaporation.

[0072] In this exemplary embodiment, if Figure 2G The step of making the surface super-hydrophobic is to form a super-hydrophobic layer on the device surface by depositing a surface super-hydrophobic material or a structural super-hydrophobic material. The super-hydrophobic material can be, but is not limited to, a multilayer structure formed by one or more of Teflon and Cytop. The deposition method can be spin coating (including baking), scraping or thermal evaporation.

[0073] In the present exemplary embodiment, a surface treatment step is performed, usually using oxygen plasma reactive etching (RIE) to bombard the Cytop surface, causing an oxidation reaction on the surface to increase the adhesion between the hydrophilic grid and the hydrophobic layer.

[0074] In this exemplary embodiment, if Figure 2H The hydrophilic grid production step is to prepare the hydrophilic grid on the device surface by spin coating, the purpose of which is to create a clear boundary between oil and water when powered, so as to facilitate the driving of oily droplets.

[0075] In the embodiment of this example, in the oil filling step, a dodecane solution containing a black dye is used as the oil filling oil, and the oil filling of the film is completed using a homemade device.

[0076] In step S120, a curing glue with a preset width may be applied to the lower layer of the glass top cover, and the glass top cover coated with the curing glue may be attached to the chip to be packaged in an underwater environment;

[0077] In the embodiment of this example, based on the problem that the chip has a short storage time in a room temperature environment, the solution is: after the device is packaged underwater, it is stored in a room temperature environment, the moisture on the device surface and the packaging gap is wiped off, the device sealing edge is kept in a dry environment, and a layer of ultraviolet curing glue (viscous liquid) is applied along the device packaging edge using ultraviolet curing glue. After the application is completed, the device is placed in an ultraviolet environment to complete the curing. However, if only a layer of ultraviolet curing glue is applied along the device packaging edge using ultraviolet curing glue, there are several problems. First, the ultraviolet curing glue is a viscous liquid. During the application process, it is easy for the liquid to flow, and it is difficult to form a closed environment to prevent the moisture inside the device from being lost; second, when the device is placed in an indoor environment, it is difficult to maintain the sealing performance, and leakage may occur during the application of the ultraviolet glue, and the stability is poor. Therefore, a layer of ultraviolet curing glue is applied to the inner side of the support layer along the edge of the device packaging to prevent the ultraviolet curing glue from flowing and strengthen the curing effect of the ultraviolet curing glue.

[0078] In the embodiment of this example, the method further comprises:

[0079] The glass top cover has the same size as the to-be-packaged area of ​​the to-be-packaged chip, and the lower layer of the glass top cover comprises a metal layer.

[0080] In the embodiment of this example, the method further comprises:

[0081] The lower layer of the metal layer of the glass top cover also includes a support layer, which is used to contact the chip to be packaged and support the glass top cover when the glass top cover and the chip to be packaged are attached to each other, so that a preset distance is maintained between the glass top cover and the chip to be packaged.

[0082] In the embodiment of this example, the method further comprises:

[0083] A curing glue with a preset width is applied on the inner side of the supporting layer under the metal layer of the glass top cover, and the glass top cover coated with the curing glue is attached to the chip to be packaged in an underwater environment.

[0084] In the embodiment of this example, the method further comprises:

[0085] A curing glue with a preset width is applied to the lower layer of the glass top cover, and the glass top cover coated with the curing glue is bonded to the chip to be packaged in water.

[0086] In step S130, the curing adhesive may be irradiated with ultraviolet light based on preset parameters to cure the curing adhesive, thereby completing the packaging of the chip to be packaged.

[0087] In the embodiment of this example, ITO-containing glass is used as the top cover. After the support layer is bonded, the ITO side is the adhesive surface. A layer of curing glue with a width of 1 to 2 mm is applied on the inner side of the support layer using a glue dispenser. The top cover is immersed in water to complete the bonding of the top cover and the bottom film underwater. The glue is cured under ultraviolet light.

[0088] During the product packaging process, after the original support layer is attached, use a dispensing machine to glue the inside of the support layer. Figure 3B As shown, apply a layer of curing glue with a width of 1 to 2 mm. The nature of the glue is a high molecular polymer with good temperature resistance and hydrophobicity. After applying a circle of curing glue, Figure 3A As shown, the upper cover is immersed in water to complete underwater bonding, and the glue is cured under ultraviolet light, so that the water and oil in the package are solidified inside the device by the glue layer, forming a closed environment, thereby improving the reliability of the device.

[0089] In this exemplary embodiment, if Figure 3C As shown in the figure, the cover plate and substrate are packaged underwater, and the device is stored in the indoor environment (25°C) for a long time without water and oil leakage. At the same time, when the device is stored in the natural environment at high temperature (60°C) and low temperature (5°C), the cured glue is intact and there is no leakage.

[0090] In the embodiment of this example, the method further comprises:

[0091] The curing adhesive viscosity is 1500-2500cps, and the temperature resistance is -20℃~125℃;

[0092] The preset parameters of the ultraviolet light are ultraviolet light with a wavelength of 365 to 438 nm.

[0093] In the embodiment of this example, the method utilizes the temperature resistance and macromolecular structure characteristics of the curing adhesive and after light curing or heat curing, it seals water, oil and other materials, while improving the bonding strength of the chip.

[0094] It should be noted that, although the steps of the method in the present disclosure are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps, etc.

[0095] In addition, in this exemplary embodiment, a chip packaging device is also provided. Figure 4As shown, the chip packaging device 400 may include: a chip to be packaged generating module 410, a bonding packaging module 420 and a curing packaging module 430. Among them:

[0096] The chip to be packaged generation module 410 is used to process and manufacture the functional layer of the chip to generate the chip to be packaged;

[0097] The bonding and packaging module 420 is used to apply a curing glue of a preset width on the lower layer of the glass top cover, and bond the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment;

[0098] The curing and packaging module 430 is used to irradiate the curing adhesive with ultraviolet light based on preset parameters to cure the curing adhesive and complete the packaging of the chip to be packaged.

[0099] The specific details of each of the above-mentioned chip packaging device modules have been described in detail in a corresponding chip packaging method, and thus will not be repeated here.

[0100] It should be noted that, although several modules or units of a chip packaging device 400 are mentioned in the above detailed description, such division is not mandatory. In fact, according to the embodiments of the present disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided into multiple modules or units for embodiment.

[0101] In addition, in an exemplary embodiment of the present disclosure, an electronic device capable of implementing the above method is also provided.

[0102] It will be appreciated by those skilled in the art that various aspects of the present invention may be implemented as systems, methods or program products. Therefore, various aspects of the present invention may be specifically implemented in the following forms, namely: complete hardware embodiments, complete software embodiments (including firmware, microcode, etc.), or embodiments combining hardware and software aspects, which may be collectively referred to herein as "circuits", "modules" or "systems".

[0103] Refer to the following Figure 5 An electronic device 500 according to such an embodiment of the present invention is described. Figure 5 The electronic device 500 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0104] like Figure 5As shown, the electronic device 500 is in the form of a general computing device. The components of the electronic device 500 may include but are not limited to: at least one processing unit 510, at least one storage unit 520, a bus 530 connecting different system components (including the storage unit 520 and the processing unit 510), and a display unit 540.

[0105] The storage unit stores program codes, which can be executed by the processing unit 510, so that the processing unit 510 performs the steps according to various exemplary embodiments of the present invention described in the above “Exemplary Method” section of this specification. For example, the processing unit 510 can perform the following steps: Figure 1 Steps S110 to S130 shown in FIG.

[0106] The storage unit 520 may include a readable medium in the form of a volatile storage unit, such as a random access storage unit (RAM) 5201 and / or a cache storage unit 5202 , and may further include a read-only storage unit (ROM) 5203 .

[0107] The storage unit 520 may also include a program / utility 5204 having a set (at least one) of program modules 5203, such program modules 5205 including but not limited to: an operating system, one or more application programs, other program modules and program data, each of which or some combination may include the implementation of a network environment.

[0108] Bus 550 may represent one or more of several types of bus structures, including a memory unit bus or memory unit controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

[0109] The electronic device 500 may also communicate with one or more external devices 570 (e.g., keyboards, pointing devices, Bluetooth devices, etc.), may also communicate with one or more devices that enable a user to interact with the electronic device 500, and / or communicate with any device that enables the electronic device 500 to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed via an input / output (I / O) interface 550. Furthermore, the electronic device 500 may also communicate with one or more networks (e.g., local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) via a network adapter 560. As shown, the network adapter 560 communicates with other modules of the electronic device 500 via a bus 550. It should be understood that, although not shown in the figure, other hardware and / or software modules may be used in conjunction with the electronic device 500, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0110] Through the description of the above embodiments, it is easy for those skilled in the art to understand that the example embodiments described here can be implemented by software, or by software combined with necessary hardware. Therefore, the technical solution according to the embodiment of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which can be a personal computer, a server, a terminal device, or a network device, etc.) to execute the method according to the embodiment of the present disclosure.

[0111] In an exemplary embodiment of the present disclosure, a computer-readable storage medium is also provided, on which a program product capable of implementing the above method of the present specification is stored. In some possible embodiments, various aspects of the present invention can also be implemented in the form of a program product, which includes a program code, and when the program product is run on a terminal device, the program code is used to enable the terminal device to perform the steps according to various exemplary embodiments of the present invention described in the above "Exemplary Method" section of the present specification.

[0112] refer to Figure 6 As shown, a program product 600 for implementing the above method according to an embodiment of the present invention is described, which can adopt a portable compact disk read-only memory (CD-ROM) and include program code, and can be run on a terminal device, such as a personal computer. However, the program product of the present invention is not limited thereto. In this document, a readable storage medium can be any tangible medium containing or storing a program, which can be used by or in combination with an instruction execution system, an apparatus or a device.

[0113] The program product may use any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0114] Computer readable signal media may include data signals propagated in baseband or as part of a carrier wave, in which readable program code is carried. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Readable signal media may also be any readable medium other than a readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0115] The program code embodied on the readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wired, optical cable, RF, etc., or any suitable combination of the foregoing.

[0116] Program code for performing the operations of the present invention may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving a remote computing device, the remote computing device may be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computing device (e.g., through the Internet using an Internet service provider).

[0117] In addition, the above-mentioned figures are only schematic illustrations of the processes included in the method according to an exemplary embodiment of the present invention, and are not intended to be limiting. It is easy to understand that the processes shown in the above-mentioned figures do not indicate or limit the time sequence of these processes. In addition, it is also easy to understand that these processes can be performed synchronously or asynchronously, for example, in multiple modules.

[0118] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The specification and examples are to be considered as exemplary only, and the true scope and spirit of the present disclosure are indicated by the claims.

[0119] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A chip packaging method, characterized in that: The method comprises: Process and manufacture the functional layer of the chip to generate the chip to be packaged; Apply a preset width of curing glue on the lower layer of the glass top cover, and fit the glass top cover with the curing glue to the chip to be packaged in an underwater environment; the glass top cover and the to-be-packaged area of ​​the chip to be packaged have the same size, and the lower layer of the glass top cover comprises a metal layer; the lower layer of the metal layer of the glass top cover also comprises a supporting layer, and the supporting layer is used to contact the chip to be packaged and support the glass top cover when the glass top cover and the chip to be packaged are attached, so that a preset distance is maintained between the glass top cover and the chip to be packaged; apply a preset width of curing glue on the inner side of the supporting layer of the lower layer of the metal layer of the glass top cover, and fit the glass top cover with the curing glue to the chip to be packaged in an underwater environment; The curing glue is irradiated with ultraviolet light based on preset parameters to cure the curing glue and complete the packaging of the chip to be packaged; the viscosity of the curing glue is 1500~2500cps, and the temperature resistance is: -20℃~125℃; the preset parameters of the ultraviolet light are ultraviolet light with a wavelength of 365~438nm.

2. The method according to claim 1, characterized in that The method further comprises: Depositing a first conductive layer on the substrate material based on one or more processes of sputtering, evaporation, and electroplating, and patterning the first conductive layer based on one or more processes of stripping, photolithography and dry etching, or photolithography and wet etching; Depositing a first dielectric layer on the first conductive layer that has been patterned based on one or more processes selected from chemical vapor deposition, physical vapor deposition, and spin coating, patterning the first dielectric layer based on a photolithography process, and making contact holes in the first dielectric layer that has been patterned based on one or more processes selected from wet and dry etching and photolithography; Depositing a second conductive layer on the first dielectric layer including the contact hole based on one or more processes of sputtering, evaporation, and electroplating, and patterning the second conductive layer based on one or more processes of stripping, photolithography and dry etching, or photolithography and wet etching; Depositing a second dielectric layer on the second conductive layer that has been patterned based on one or more processes of chemical vapor deposition, physical vapor deposition, and spin coating, and depositing a surface hydrophobic layer on the second dielectric layer based on one or more processes of spin coating, hanging coating, and thermal evaporation; After the surface hydrophobic layer is oxidized, a hydrophilic grid is prepared on the surface hydrophobic layer based on a spin coating process, and an oil filling treatment is performed to complete the processing and manufacturing of the chip to be packaged.

3. A chip packaging device, characterized in that: The device comprises: A chip generation module to be packaged is used to process and manufacture the functional layer of the chip to generate the chip to be packaged; A bonding and packaging module, used for applying a preset width of curing glue on the lower layer of the glass top cover, and bonding the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment; the glass top cover and the to-be-packaged area of ​​the chip to be packaged have the same size, and the lower layer of the glass top cover comprises a metal layer; the lower layer of the metal layer of the glass top cover also comprises a supporting layer, and the supporting layer is used for contacting with the chip to be packaged to support the glass top cover when the glass top cover and the chip to be packaged are bonded, so that a preset distance is maintained between the glass top cover and the chip to be packaged; applying a preset width of curing glue on the inner side of the supporting layer of the lower layer of the metal layer of the glass top cover, and bonding the glass top cover coated with the curing glue to the chip to be packaged in an underwater environment; The curing and packaging module is used to irradiate the curing glue with ultraviolet light based on preset parameters to cure the curing glue and complete the packaging of the chip to be packaged; the viscosity of the curing glue is 1500~2500cps, and the temperature resistance is: -20℃~125℃; the preset parameters of the ultraviolet light are ultraviolet light with a wavelength of 365~438nm.

4. An electronic device, characterized in that: include Processor; and A memory having computer-readable instructions stored thereon, wherein the computer-readable instructions, when executed by the processor, implement the method according to any one of claims 1 to 2.

5. A computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the method according to any one of claims 1 to 2 when executed by a processor.

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