A TO packaging module, transmitting component and optical module

Abstract

The present invention relates to a TO package module, a transmitting component and an optical module, comprising a tube seat, a semiconductor refrigerator arranged on the tube seat, a first bracket arranged on the semiconductor refrigerator and a first substrate, wherein the first substrate is fixed to the first bracket, and the first bracket is used for supporting and conducting heat; in the first substrate, a metal plating layer is arranged only on the surface away from the first bracket; in the TO package module provided by the present invention, a metal plating layer is arranged only on the surface away from the first bracket in the first substrate, thereby effectively avoiding the formation of capacitance between the metal plating layers on two mutually opposite surfaces, and further effectively preventing resonance, which is beneficial to improving the bandwidth, and is particularly beneficial to the transmission rate of the coaxial packaged optical module to smoothly reach 100Gbit / s.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a TO packaging module, a transmitting component and an optical module. Background Art

[0002] The optical module is an important device in the fiber-optic communication system. Its main function is to perform photoelectric conversion. The transmitting end converts the electrical signal into an optical signal. After being transmitted through the optical fiber, the receiving end converts the optical signal into an electrical signal. Existing optical module products are usually divided into single-transmit, single-receive, integrated transceiver and multiple-transmit and multiple-receive. The key component for realizing photoelectric conversion is called optical assembly or OSA, among which the transmitting assembly is TOSA, the receiving assembly is ROSA, and the integrated transceiver is BOSA. The key component in OSA is TO package module (or TO-CAN module), such as the transmitting TO module (laser).

[0003] TO package modules in existing optical modules, such as Figure 1 As shown, it usually includes a TO tube holder (or tube holder), a semiconductor cooler (TEC) arranged on the TO tube holder, a first bracket arranged on the semiconductor cooler, and a second bracket arranged on the TO tube holder. The first bracket is also provided with a first substrate (such as a circuit board), and the surface of the first substrate is provided with a metal coating. The first substrate is fixed to the first bracket by gel, and the required chip (such as a laser chip) is installed on the first substrate. The semiconductor cooler is used for heat dissipation, and the first bracket usually plays a supporting and heat-conducting role; the second bracket is also usually provided with a second substrate, and the two second substrates are electrically connected.

[0004] With the development of technology, the requirements for data transmission rate are getting higher and higher. The existing TO package modules (i.e. coaxial package modules) are mainly used for short-distance transmission such as 2.5Gbit / s and 10Gbit / s, and the data transmission rate is difficult to improve. The main reason is that the metal plating layer arranged on the surface of the first substrate will form a capacitor between the metal plating layers on the two opposite surfaces during the operation of the TO package module, thereby generating a capacitor-inductor resonance, which is very unfavorable for improving the bandwidth. Because it is found through experiments that with the increase of transmission power, especially when the data transmission rate reaches about 24-50Gbit / s, a serious resonance phenomenon will occur due to the presence of the capacitor, resulting in the inability to effectively improve the data transmission rate, which seriously restricts the development of coaxial package optical modules and needs to be solved urgently. Summary of the invention

[0005] The first aspect of the present invention aims to solve the problem that when the data transmission rate reaches about 24-50Gbit / s, a serious resonance phenomenon will occur due to the capacitance formed between the metal plating layers during the process of improving the transmission power of the existing coaxial packaged TO package module, which makes it impossible to further improve the data transmission rate. A TO package module that can eliminate the resonance is provided, so that the transmission rate of the coaxial packaged optical module can smoothly reach 100Gbit / s. The main concept is:

[0006] A TO package module includes a tube base, a heat sink arranged on the tube base, a first bracket arranged on the heat sink, and a first substrate, wherein:

[0007] The first substrate is fixed to the first bracket, and the first bracket is used for supporting and conducting heat;

[0008] In the first substrate, a metal coating is provided only on the surface away from the first bracket. In this solution, the metal coating is provided only on the surface of the first substrate away from the first bracket, and the laser chip or the detector chip is installed on this surface, while no metal coating is provided on the remaining surfaces of the first substrate, thereby effectively avoiding the formation of capacitance between the metal coatings on two mutually opposite surfaces, and further effectively preventing resonance, which is beneficial to improving bandwidth, and is particularly beneficial for the transmission rate of the coaxial packaged optical module to reach 100Gbit / s smoothly.

[0009] The second aspect of the present invention aims to solve the problem that gel is usually arranged between the existing first substrate and the first bracket to form a gel layer, and the gel layer has conductive properties. When a metal coating is arranged on the surface of the first substrate away from the first bracket, a capacitor is easily formed between the metal coating and the gel layer, thereby generating resonance, which is very unfavorable for improving the bandwidth. Furthermore, a thermally conductive insulating adhesive is arranged between the first substrate and the first bracket. By arranging the thermally conductive insulating adhesive, on the one hand, the thermally conductive insulating adhesive has good thermal conductivity, so that during operation, when the device installed on the first substrate generates heat, the heat can be transferred to the heat sink through the first substrate, the thermally conductive insulating adhesive and the first bracket to achieve the purpose of efficient heat dissipation; on the other hand, the thermally conductive insulating adhesive has good insulation, that is, low conductivity, which can effectively prevent the formation of a capacitor between the metal coating and the thermally conductive insulating adhesive, thereby effectively preventing the occurrence of resonance, which is beneficial to improving the data transmission rate of the optical module, especially the transmission rate of the coaxially packaged optical module can smoothly reach 100Gbit / s.

[0010] Preferably, the thermally conductive insulating adhesive is thermally conductive silica gel.

[0011] Preferably, the heat sink is a semiconductor refrigerator. The first bracket is arranged at the cold end of the semiconductor refrigerator, and the hot end of the semiconductor refrigerator is usually connected to the tube seat. During operation, the cold end absorbs heat and the hot end releases heat, so as to cool down and dissipate heat for the internal laser chip or detector chip after TO packaging, thereby solving the internal heat dissipation problem of TO packaging.

[0012] The third aspect of the present invention is to solve the problem that the metal coating disposed on the first substrate and the first bracket are prone to form capacitance, thereby generating resonance, which is not conducive to improving the bandwidth. Furthermore, the first bracket is made of non-metallic material. In this solution, the first bracket is made of non-metallic material, which not only has good insulation properties, but also cannot store electrical energy, and will not form capacitance with the metal coating disposed on the first substrate, so that in the transmission power enhancement process of the coaxial packaged TO package module, the metal coating and the first bracket will not have resonance problems due to the formation of capacitance, thereby effectively improving the bandwidth.

[0013] The fourth aspect of the present invention is to solve the problem of efficient heat dissipation of the first substrate on the first bracket. Furthermore, the first bracket is made of an insulating and heat-conducting non-metallic material. That is, in this solution, the first bracket is made of an insulating and heat-conducting non-metallic material, which not only has good insulation properties to prevent the formation of capacitance between the first bracket and the second bracket and thus resonance, but also enables the first bracket to have good thermal conductivity, so as to ensure that the heat of the substrate can be smoothly and efficiently transferred to the radiator below, so as to dissipate heat for the substrate, especially to meet the heat dissipation requirements during high-power operation, so that the transmission rate can smoothly reach 100Gbit / s.

[0014] Preferably, the first bracket is made of AlN, Al2O3, BeO or CVD diamond material, which are non-metallic materials with high insulation and high thermal conductivity, and can better meet the requirements of insulation and heat dissipation.

[0015] Furthermore, it also includes a second bracket arranged on the tube seat and a second substrate arranged on the second bracket, a gap is provided between the first bracket and the second bracket, and the first substrate is electrically connected with the second substrate.

[0016] Preferably, the second bracket is made of non-metallic material;

[0017] Alternatively, the second bracket and the tube seat are an integral structure.

[0018] Preferably, the non-metallic material is a ceramic material, which has good insulation effect.

[0019] In order to solve the problem of signal transmission, further, it also includes a laser chip arranged on the first substrate. The laser chip is used to transmit signals to solve the problem of signal transmission.

[0020] The fifth aspect of the present invention aims to solve the problem that the existing TO package module will produce serious resonance due to the capacitance formed between the metal plating layers, which makes the transmitting component unable to further improve the data transmission rate, and provides a transmitting component including the TO package module. Since the TO package module can effectively solve the resonance problem, the transmitting component can be unaffected by the resonance, which is conducive to improving the bandwidth.

[0021] The sixth aspect of the present invention is to solve the problem that the existing TO package module will produce serious resonance due to the capacitance formed between the metal plating layers, which makes the optical module unable to further improve the data transmission rate, and provides an optical module including the transmitting component. Since the TO package module can effectively solve the resonance problem, the optical module can be unaffected by the resonance, which is conducive to improving the bandwidth.

[0022] Compared with the prior art, the TO packaging module, transmitting component and optical module provided by the present invention have a compact structure and a reasonable design. A metal coating is only provided on the surface of the first substrate facing away from the first bracket, thereby effectively avoiding the formation of capacitance between the metal coatings on two opposite surfaces, thereby effectively preventing resonance, which is beneficial to improving the bandwidth, and is particularly beneficial for the transmission rate of the coaxially packaged optical module to reach 100Gbit / s. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 This is one of the structural schematic diagrams of a TO packaging module provided in Example 1 of the present invention.

[0025] Figure 2 for Figure 1 main view.

[0026] Figure 3 This is the second structural schematic diagram of a TO packaging module provided in Example 1 of the present invention.

[0027] Figure 4 for Figure 2 An AA view of Figure 2 This is the main view of the existing TO packaging module.

[0028] Figure 5 for Figure 2 Another AA view, at this time, the Figure 2 This is the front view of the TO packaging module provided in this embodiment 1.

[0029] Figure 6 It is a comparison chart of the simulation results of the insertion loss of the optical module, wherein curve A is the simulation result of the insertion loss of the present optical module, and curve B is the simulation result of the insertion loss of the existing optical module.

[0030] Figure 7 The graph is a comparative test result of the optical module and the existing optical module, wherein curve A is a test curve of the optical module provided by the present invention, and curve B is a test curve of the existing optical module.

[0031] Description of symbols in the figure

[0032] Tube base 101, semiconductor refrigerator 102, first bracket 103, second bracket 104, first substrate 105, second substrate 106, laser chip 107, gold wire (or wire) 108, gap 109

[0033] Metal coating 201, gel layer 202

[0034] Thermally conductive insulating adhesive 301. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0036] Example 1

[0037] See also Figure 1-Figure 5 In this embodiment, a TO package module is provided, including a tube seat 101, a heat sink disposed on the tube seat 101, a first bracket 103 disposed on the heat sink, a first substrate 105, a second bracket 104 disposed on the tube seat 101, and a second substrate 106 disposed on the second bracket 104, wherein:

[0038] like Figure 1-Figure 3As shown, the first bracket 103 is not connected to the second bracket 104, and there is a gap 109 between the two, and the first substrate 105 is electrically connected to the second substrate 106, for example, Figure 1-Figure 3 As shown, the first substrate 105 and the second substrate 106 may be connected via a plurality of gold wires 108 (or conductive wires 108);

[0039] In this embodiment, the first substrate 105 may be a circuit board, and the first substrate 105 is fixed to the first bracket 103. Figure 1 As shown, the first bracket 103 is used for supporting and conducting heat;

[0040] In this embodiment, the devices required for optical communication, such as the laser chip 107 or the detector chip, are usually arranged on the first substrate 105. Therefore, it is necessary to coat the first substrate 105 with a metal coating 201. In this embodiment, in the first substrate 105, the metal coating 201 is only arranged on the surface away from the first bracket 103. Figure 5 As shown, the second substrate 106 usually does not need to be provided with a metal coating 201, so the second substrate 106 usually does not form a capacitor. In this solution, the metal coating 201 is only provided on the surface of the first substrate 105 away from the first bracket 103, and the laser chip 107 or the detector chip is installed on this surface, and the metal coating 201 is not provided on the remaining surfaces of the first substrate 105, thereby effectively avoiding the formation of a capacitor between the metal coatings 201 located on two opposite surfaces, and further effectively preventing resonance, which is beneficial to improving the bandwidth, especially beneficial to the transmission rate of the coaxial packaged optical module to reach 100Gbit / s smoothly.

[0041] In the existing TO package module, gel is usually disposed between the first substrate 105 and the first bracket 103 to form a gel layer 202. Figure 4 As shown, the gel layer 202 has a conductive property. When a metal plating layer 201 is provided on the surface of the first substrate 105 away from the first bracket 103, a capacitor is easily formed between the metal plating layer 201 and the gel layer 202, thereby generating resonance, which is very unfavorable for improving the bandwidth. To solve this problem, in a further solution provided in this embodiment, a heat-conducting insulating glue 301 is provided between the first substrate 105 and the first bracket 103, as shown in FIG. Figure 5As shown, by setting the thermally conductive insulating glue 301, on the one hand, the thermally conductive insulating glue 301 has good thermal conductivity, so that during operation, when the device installed on the first substrate 105 generates heat, the heat can be transferred to the semiconductor heat sink through the first substrate 105, the thermally conductive insulating glue 301 and the first bracket 103, so that the heat sink can be used to dissipate heat for the internal devices of the TO package, such as the first substrate 105 and the chip arranged on the first substrate, which is conducive to achieving efficient heat dissipation effect; on the other hand, the thermally conductive insulating glue 301 has good insulation, that is, low conductivity, which can effectively prevent the formation of capacitance between the metal plating layer 201 and the thermally conductive insulating glue 301, thereby effectively preventing the occurrence of resonance, which is conducive to improving the data transmission rate of the optical module, especially the transmission rate of the coaxial packaged optical module can reach 100Gbit / s smoothly.

[0042] In this embodiment, the metal plating layer 201 may be a copper plating layer, a gold plating layer, etc.

[0043] The thermally conductive insulating adhesive 301 has various implementations. Preferably, the thermally conductive insulating adhesive 301 may be thermally conductive silica gel, thermally conductive filler or thermally conductive insulating potting adhesive.

[0044] In this embodiment, the heat sink may preferably be a semiconductor cooler 102, such as Figure 1 As shown, at this time, the first bracket is arranged at the cold end of the semiconductor cooler 102, and the hot end of the semiconductor cooler 102 is connected to the tube seat 101. During operation, the cold end absorbs heat and the hot end releases heat, so as to cool down and dissipate heat for the internal laser chip or detector chip after TO packaging, thereby solving the internal heat dissipation problem of TO packaging.

[0045] In this embodiment, the first bracket 103 needs to be made of non-metallic materials. Specifically, the first bracket 103 needs to be made of insulating or low-conductivity materials. In actual use, the first bracket 103 not only has good insulation properties, but also cannot store electrical energy, and will not form a capacitor with the metal plating layer 201 disposed on the first substrate 105. Figure 5 As shown, during the transmission power enhancement process of the coaxial packaged TO package module, no resonance problem will occur between the metal plating layer 201 and the first bracket 103 due to the formation of capacitance, thereby effectively improving the bandwidth.

[0046] As an example, the first bracket 103 can be made of ceramic materials, polymer insulating materials or composite insulating materials, and in a preferred embodiment, the first bracket 103 can be made of insulating and heat-conductive non-metallic materials, which not only makes the first bracket 103 have good insulation properties, but also prevents the formation of capacitance between the first bracket 103 and the metal coating 201 and resonance, and prevents the formation of capacitance between the first bracket 103 and the second bracket 104 and resonance, and makes the first bracket 103 have good thermal conductivity to ensure that the heat of the substrate can be smoothly and efficiently transferred to the semiconductor refrigerator 102 below, so as to dissipate heat for the substrate, especially to meet the heat dissipation requirements during high-power operation, so that the transmission rate can reach 100Gbit / s smoothly.

[0047] As a preferred embodiment, the first bracket 103 can be made of materials such as AlN, Al2O3, BeO or CVD diamond materials, which are non-metallic materials with high insulation and high thermal conductivity, and can better meet the needs of insulation and heat dissipation.

[0048] In this embodiment, the second bracket 104 can be made of metal material. In this case, the second bracket 104 and the tube seat 101 can be an integrated structure and both are made of metal material. In addition, the second bracket 104 can also be made of non-metallic material. As an example, the non-metallic material can be made of ceramic material, polymer insulating material or composite insulating material to achieve a good insulation effect.

[0049] According to the different functions of the TO package module, the chip disposed on the first substrate 105 may be different. As an embodiment, when the TO package module is used to transmit a signal, the first substrate 105 is further provided with a laser chip 107, such as Figure 1 and Figure 2 As shown, the laser chip 107 can be used to transmit signals. During the operation of the laser chip 107, the heat generated by the laser chip 107 can be transferred to the semiconductor refrigerator 102 through the first substrate 105 and the first bracket 103, so that the semiconductor refrigerator 102 can be used to dissipate heat efficiently.

[0050] In this embodiment, the first bracket 103 may be a conventional L-shaped plate or block structure, but in the preferred solution provided in this embodiment, the first bracket 103 may preferably be a rectangular plate or block structure, such as Figure 3 As shown, the first bracket 103 with such a structure is easy to process and shape, which is conducive to reducing costs and solving the problem of economy. On the other hand, it has a larger contact area with the first substrate 105, which is more conducive to heat transfer and can solve the problem of efficient heat dissipation. In this embodiment, the second bracket 104 can be a plate-like structure or a columnar structure, such as Figure 1-Figure 3 shown.

[0051] The TO packaging module can prevent the formation of capacitance between the metal plating 201 and the metal plating 201, between the metal plating 201 and the thermally conductive insulating adhesive 301, between the metal plating 201 and the first bracket 103, and between the first bracket 103 and the second, thereby effectively preventing resonance problems from occurring during operation, which is conducive to the smooth realization of a data transmission rate of 100 Gbit / s.

[0052] Example 2

[0053] This embodiment provides a transmitting component, including the TO packaging module described in Example 1, and the laser chip 107 is installed on the first substrate 105; because the TO packaging module can effectively solve the problem of resonance, the transmitting component is not affected by the resonance, which is beneficial to improve the bandwidth.

[0054] Example 3

[0055] This embodiment provides an optical module, including the transmitting component described in Embodiment 2; because the TO packaging module can effectively solve the problem of resonance, the optical module is not affected by the resonance, which is beneficial to improve the bandwidth.

[0056] In a specific experiment, the optical module includes the transmitting component described in Example 2, and a single-channel communication with a data transmission rate of 100 Gbit / s based on a TO package module of coaxial packaging is achieved through the experiment, and the TDECQ is about 1.7 dB.

[0057] like Figure 6 As shown, curve A is the simulation result of the insertion loss of the optical module, and curve B is the simulation result of the insertion loss of the existing optical module. Figure 6 It can be seen that the resonance point of the insertion loss of this optical module has disappeared, indicating that the energy can be transmitted, thus solving the resonance problem well and helping to improve the bandwidth.

[0058] like Figure 7 As shown, curve A is the test curve of the optical module provided by the present invention, and curve B is the test curve of the existing optical module. Figure 7 It can be shown that the optical module can solve the resonance problem well and is more conducive to improving the bandwidth.

[0059] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A TO package module, characterized in that: It includes a tube base, a heat sink arranged on the tube base, a first bracket arranged on the heat sink, and a first substrate, wherein: The first substrate is fixed to the first bracket; the first bracket is made of insulating and heat-conductive non-metallic material; a heat-conductive insulating glue is arranged between the first substrate and the first bracket; In the first substrate, the metal coating is provided only on the surface facing away from the first support, while the metal coating is not provided on the remaining surfaces of the first substrate.

2. The TO packaging module according to claim 1, characterized in that: The thermally conductive insulating adhesive is thermally conductive silica gel.

3. The TO packaging module according to claim 1, characterized in that: The radiator is a semiconductor refrigerator.

4. The TO packaging module according to claim 1, characterized in that: It also includes a second bracket arranged on the tube seat and a second substrate arranged on the second bracket, a gap is provided between the first bracket and the second bracket, and the first substrate is electrically connected with the second substrate.

5. The TO packaging module according to claim 4, characterized in that: The second bracket is made of non-metallic material.

6. The TO packaging module according to claim 4, characterized in that: The second bracket and the tube seat are an integrated structure.

7. The TO packaging module according to any one of claims 1 to 6, characterized in that: It also includes a laser chip disposed on the first substrate.

8. A launching assembly, characterized in that: Includes the TO packaging module described in claim 7.

9. An optical module, characterized in that: Comprising the launching assembly as claimed in claim 8.

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