Rigid heating film for electronic products and preparation method thereof

Abstract

The present invention discloses a rigid heating film for electronic products and a preparation method thereof. A layer of high-temperature heating material is arranged on a rigid high-temperature insulating waterproof layer composed of glass fiber, quartz or refractory ceramics by spraying, brushing, rolling, pad printing, transfer printing, etc., and nano resin and volatile solvent are added. After printing, high-temperature purification and drying operations are performed to volatilize the solvent, forming a high-temperature heating material that is physically or chemically connected or bonded with the added nano inorganic resin to form a high-purity heating layer attached to the high-temperature insulating waterproof layer, and an electrode layer is adhered or printed on the heating layer and covered with a high-temperature insulating waterproof layer to prepare a rigid heating film with high radiant heat efficiency, or the electrode layer is directly attached to the product where it needs to be heated. The present invention maximizes the function of the high-temperature heating material, reduces the cost of use and the limitations of the process, and improves the wide applicability of the high-temperature heating material in a low-cost way, so as to maximize the industry's mass production.

Description

Technical Field

[0001] The present invention relates to a rigid heating film for electronic products and a preparation method thereof, and in particular to a rigid heating film prepared to have high radiant heat efficiency. Background Art

[0002] Electric stoves, electric coffee pots, water dispensers and other 3C electronic products all use electric heating elements as heating sources, while the electric heating elements of traditional 3C electronic products such as Figure 1A and Figure 1B As shown, an electric heating furnace 60 is provided with an electric heating plate 62 on its base 61, and the electric heating plate 62 provides heat source through the electric heating copper tube 63 in the base 61. In this way, not only power is consumed, but the electric heating tube 63 must be arranged in conjunction with equipment such as a cooling fan 64 and a control circuit 65, so it takes up more space, resulting in the disadvantage that the height (thickness) of the base 61 cannot be reduced.

[0003] In recent years, based on the evolution of technology, electronic components have developed in the direction of miniaturization, and the resulting thermal management issues have also received a certain amount of attention. Many high thermal conductivity materials such as silver, copper, and graphite sheets have been widely studied by scientists. Among them, the thermal conductivity of graphite sheets has attracted great attention. Due to the special two-dimensional honeycomb lattice carbon atom structure of graphite sheets, its thermal conductivity coefficient is better than that of metals, so it is widely used in electronic components.

[0004] In the traditional production process of graphite sheets, first, chemicals are used to increase the purity and density of the graphite sheets, then a pressure greater than 30Mpa is applied to press the graphite sheets together so that the graphite sheets are tightly bonded to each other, and finally a high temperature of 1800-3000℃ is applied for several hours to obtain a graphite thermal conductive substrate. Therefore, it not only consumes a lot of energy but also takes a long time to produce. Therefore, how to develop a simple process that does not require high pressure and high temperature to prepare graphite thermal conductive materials is a difficult problem that the relevant technicians in this technical field need to break through.

[0005] However, it is found that the following three problems are common in the traditional graphene film transfer process: First: Before the transfer, the graphene film is exposed to the air for a long time, causing the surface in contact with the air to be contaminated by suspended particles in the air, and the traditional transfer method uses this contaminated surface to make devices. Second: In the traditional transfer method, the graphene film is transferred to a hard substrate, and the bonding force between the graphene and the substrate is only the van der Waals force, which makes the graphene film easy to fall off. Third: The traditional transfer method requires complex steps. In the process of transferring from the metal substrate to the desired substrate, too many types of materials are used, which is easy to cause contamination on the graphene surface during the transfer process, and it is easy to cause the crystal structure of the graphene film to be destroyed. The above three defects limit the large-scale production and utilization of graphene films.

[0006] Therefore, a Chinese patent application with publication number CN102807208A discloses a graphene film transfer method to improve the problems existing in the above-mentioned graphene film transfer process. It is characterized in that: the graphene film is directly adhered to the polymer substrate so that the graphene film and the polymer substrate form a covalent bond, and the side of the graphene film contacting the growth substrate is exposed as an effective surface for making functional devices. The implementation steps of the technical solution are as follows: Step 1), melt or dissolve the polymer to make it in a fluid state; Step 2), coat the polymer in a fluid state on the substrate on which the graphene is grown, and solidify the polymer; Step 3), use ferric chloride or ferric nitrate solution to corrode the metal sheet, and wash, dry or air-dry the polymer film adhered to the graphene film to obtain a graphene film transferred to the polymer material.

[0007] Next, a Chinese patent application with publication number CN105898907A discloses a graphene heating film and a preparation method thereof, characterized in that it comprises a first insulating waterproof layer, an electrode layer, a heating film layer and a second insulating waterproof layer, the first insulating waterproof layer, the electrode layer, the heating film layer and the second insulating waterproof layer are pasted into an integrated structure, and the heating film layer is a graphene film. The implementation steps of the technical solution are as follows: 1) making a graphene film; 2) covering the second insulating waterproof layer with adhesive; 3) bonding the second insulating waterproof layer and the graphene film into one; 4) removing the metal matrix on the graphene film; 5) pasting an electrode layer on the graphene film; 6) pasting a first insulating waterproof layer on the electrode layer; 7) connecting the electrode layer to a wire.

[0008] However, it is found that the graphene obtained by the traditional graphene preparation method has many surface defects. The graphene sheets are prone to folding and curling, which affects the performance of the graphene. In addition, the graphene surface obtained after reduction has almost no oxidized groups, so its surface is hydrophobic, making it very easy to agglomerate and precipitate in water and some common organic solvents. There are many methods for preparing graphene heating films, but it is still difficult to prepare graphene films with excellent electrical properties and no pollution. The main difficulty lies in how to better transfer the graphene film to the target substrate and prepare a complete, undamaged, process-stable and reliable graphene heating (thermal conductive) film.

[0009] Furthermore, the problems faced by the graphene industry in heat dissipation spraying include: the problem that high-purity graphene cannot be densely arranged after spraying; and the problem that general resin coatings wrap the graphene in a stirring and mixing manner, which affects the radiation emission.

[0010] In addition, the thickness of graphene heating (thermal conductive) films is not easy to reduce, and most of them are not flexible. As a result, many problems arise and it is difficult to implement their subsequent use in 3C products, which is a great concern for the industry.

[0011] Therefore, how to solve the above-mentioned problems of the conventional graphene heating (heat-conducting) film is the main subject of the present invention. Summary of the invention

[0012] The main purpose of the present invention is to provide a rigid heating film for electronic products and a preparation method thereof, which maximizes the function of heating material particles (such as graphene) to achieve high heat generation effect.

[0013] Another object of the present invention is to provide a rigid heating film for electronic products and a preparation method thereof, which has the advantages of reducing the limitations of using heating material particles, and by using a coating method, widely increasing the products in which the heating material particles can be used, thereby maximizing industry mass production.

[0014] To achieve the above effect, the method adopted by the present invention comprises the following steps:

[0015] a) Providing a first high temperature resistant insulating waterproof layer, which is selected from: a rigid body composed of any one of glass fiber, quartz or refractory ceramics or a combination thereof, and having a thickness between 0.015 and 0.2 mm;

[0016] b) On the first high temperature resistant insulating waterproof layer, a layer of high temperature resistant heating material slurry is provided, the thickness of the high temperature resistant heating material slurry is between 0.015 and 0.2 mm, and the high temperature resistant heating material slurry comprises heating material particles selected from: carbon balls, carbon fibers, graphite or its particles, graphene, nano carbon tubes, boron nitride, artificial diamonds, aluminum oxide, zirconium oxide, rare earth, thermal conductive metal particles, any one of which or a combination thereof constitutes the heating material particles, the weight ratio of which is 25 to 85%, and is mixed with a nano resin of 10 to 50% by weight, and a solvent medium of 5 to 25% by weight;

[0017] c). Purification operation: drying the high temperature resistant heating material slurry at a temperature of 120°C to 150°C for 30 to 50 minutes, volatilizing the medium and solvent at high temperature to improve the purity, and the high temperature resistant heating material slurry and the first high temperature resistant insulating waterproof layer are physically or chemically bonded or bridged by nano resin, so that the heating material particles are exposed on the first high temperature resistant insulating waterproof layer to the greatest extent, and are closely arranged and stacked without being wrapped, and the nano resin produces silicate ions through shrinkage polymerization reaction, so that the heating material particles are stably bonded to the first high temperature resistant insulating waterproof layer, forming a high purity high temperature resistant heating layer;

[0018] d) An electrode layer is provided on the heating layer, and the thickness of the electrode layer is between 0.015 and 0.2 mm;

[0019] e) Covering the electrode layer with a second high temperature resistant insulating and waterproof layer, the second high temperature resistant insulating and waterproof layer is a rigid body with a thickness between 0.015 and 0.2 mm; and

[0020] f). Providing a wire electrically connected to the electrode layer to prepare a rigid heating film with a thickness of less than 0.6 mm, and its operating temperature can reach 600°C.

[0021] According to the above-mentioned features, the second high temperature resistant insulating and waterproof layer includes a portion of the electronic product that needs to be heated, and the portion of the electronic product that needs to be heated needs to be an insulator, and the electrode layer is directly attached to the portion of the electronic product that needs to be heated.

[0022] According to the above characteristics, the nano resin includes water-based or oil-based nano resin. Wherein, the water-based nano resin is selected from: any one or a combination of water-based nano epoxy modified acrylic acid or water-based nano organosilicon (silicon) modified polyurethane. Wherein, the oil-based nano resin is selected from: any one or a combination of solvent-based nano epoxy modified acrylic acid or solvent-based nano organosilicon (silicon) modified polyurethane.

[0023] According to the aforementioned features, the high temperature resistant heat conductive layer can be in a full-surface configuration or in a line configuration matching the shape of the electrode layer.

[0024] According to the above-mentioned features, the electrode layer can be made of a conductive metal material.

[0025] According to the above-mentioned features, the flexible thermally conductive film for electronic products made by the present invention comprises: a first high temperature resistant insulating waterproof layer, which is a rigid body with a thickness between 0.015 and 0.2 mm; a high temperature resistant heating layer, coated on the first high temperature resistant insulating waterproof layer, the thickness of the high temperature resistant heating layer is between 0.015 and 0.2 mm, and has heating material particles, and the heating material particles are exposed on the first high temperature resistant insulating waterproof layer, showing a tightly arranged stack without being wrapped, so that the heating material particles are stably combined with the first high temperature resistant insulating waterproof layer; an electrode layer, arranged on the high temperature resistant heating layer, the thickness of the electrode layer is between 0.015 and 0.2 mm; a second high temperature resistant insulating waterproof layer, covering the electrode layer, the thickness of the second high temperature resistant insulating waterproof layer is a rigid body between 0.015 and 0.2 mm; and a wire, electrically connected to the electrode layer, thereby forming a rigid heating film with a thickness of less than 0.6 mm, and its operating temperature can reach 600°C.

[0026] With the help of the above-mentioned technical features, the rigid heating film prepared by the present invention has a stable structure, in which the heating material particles and the nano-resin are physically or chemically bonded or connected. After spraying, the solvent of the high-purity heating material particles evaporates, and the heating material particles are exposed on the surface of the material. The molecules effectively radiate and transmit radiation to achieve uniform heat and heat exchange, and the heating effect is quickly achieved. The working temperature (heating range) can reach 600°C. Furthermore, the present invention uses "purification" technology to solve the problems of thermal conductive spraying in the industry, including: solving the problem that high-purity heating material particles cannot be closely arranged after spraying; and solving the problem that general resin coatings wrap the heating material particles in a stirring and mixing manner, which affects the radiation emission. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A It is a schematic diagram of the appearance of an existing electric heating furnace.

[0028] Figure 1B It is the internal schematic diagram of the existing electric heating furnace.

[0029] Figure 2 It is a flow chart of the preparation method of the present invention.

[0030] Figure 3A 1 is an exploded perspective view of a first feasible embodiment of the present invention.

[0031] Figure 3B It is an exploded perspective view (II) of the first feasible embodiment of the present invention.

[0032] Figure 3C It is a combined stereogram of the first feasible embodiment of the present invention.

[0033] Figure 4A It is an exploded perspective view (I) of a second feasible embodiment of the present invention.

[0034] Figure 4B It is an exploded perspective view (II) of the second feasible embodiment of the present invention.

[0035] Figure 4C It is a combined stereogram of a second feasible embodiment of the present invention.

[0036] Figure 5A This is a reference diagram (1) of the use status of the rigid heating film of the present invention.

[0037] Figure 5B This is a reference diagram (2) showing the use status of the rigid heating film of the present invention.

[0038] Figure 6 It is a structural cross-sectional view of the rigid heating film of the present invention.

[0039] Fig. 7A yes Figure 6Sectional view of section 7A-7A.

[0040] Figure 7B yes Fig. 7A An enlarged schematic diagram of some structures in .

[0041] Figure 8 It is a cross-sectional view of the high temperature resistant heating layer of the present invention.

[0042] Fig. 9 It is a schematic diagram of the temperature and time of the purification operation of the high temperature resistant heating layer of the present invention.

[0043] Fig.10 It is an electron microscope image of the high temperature resistant heating layer of the present invention.

[0044] Fig.11 This is a reference diagram of the state of the rigid heating film of the present invention being used in an electric heating furnace.

[0045] Fig.12 This is a reference diagram of the state of the rigid heating film of the present invention being used on a thermal insulation pad.

[0046] Fig.13 This is a reference diagram of the state of the rigid heating film of the present invention when used in floor heating.

[0047] Explanation of symbols:

[0048] 10. The first high temperature resistant insulation waterproof layer

[0049] 20 High temperature resistant heating layer

[0050] 20a High temperature resistant heating material slurry

[0051] 21 Nano resin

[0052] 22 Heating material particles

[0053] 30 Electrode layer

[0054] 31 Wire

[0055] 40 Second high temperature resistant insulation waterproof layer

[0056] 40A Electronic products need to be heated

[0057] 50 Rigid heating film

[0058] 51 Electric heating furnace

[0059] 52 Insulation pad

[0060] 53 Floor Heating DETAILED DESCRIPTION

[0061] The following is an explanation of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0062] First, please refer to Figure 1. Fig.13 As shown, a method for preparing a rigid heating film for electronic products of the present invention comprises the following steps:

[0063] a). Provide a first high temperature resistant insulating waterproof layer 10, the first high temperature resistant insulating waterproof layer 10 is selected from: a rigid body composed of any one of glass fiber, quartz or refractory ceramics or a combination thereof, but not limited thereto; a rigid body with a thickness between 0.015 and 0.2 mm. In this embodiment, the glass fiber Fibreglass is an inorganic non-metallic material with excellent performance, and has the advantages of good insulation, strong heat resistance, good corrosion resistance, and high mechanical strength. Its softening point is 500-750°C, boiling point is 1000°C, density is 2.4-2.76g / cm3, tensile strength is 6.3-6.9g / d in standard state, 5.4-5.8g / d in wet state, density is 2.54g / cm3, heat resistance is good, and strength is not affected when the temperature reaches 300°C. It has excellent electrical insulation and is a high-grade electrical insulation material, and is also used for thermal insulation materials. Therefore, the first high temperature resistant insulating waterproof layer 10 of glass fiber is an excellent choice.

[0064] b). If Figure 3A to Figure 3C As shown, a layer of high temperature resistant heating material slurry 20a is arranged on the first high temperature resistant insulating waterproof layer 10. The "arrangement" method described below in the present invention includes: spraying, brushing, rolling, pad printing, transfer printing, etc., which will not be elaborated and is not limited to this.

[0065] The thickness of the high temperature resistant heating material slurry 20a is between 0.015 and 0.2 mm. The high temperature resistant heating material slurry 20a includes heating material particles 22 selected from: carbon balls, carbon fibers, graphite or its particles, graphene, nano carbon tubes, boron nitride, artificial diamonds, aluminum oxide, zirconium oxide, rare earth, thermal conductive metal particles, any one of which or a combination thereof, with a weight ratio of 25 to 85%, and mixed with a nano resin of 10 to 50% by weight and a solvent medium of 5 to 25% by weight; in this embodiment, the nano resin 21 can be a water-based or oily nano resin; wherein the water-based nano resin 21 is selected from: water-based nano epoxy modified acrylic acid or water-based nano organic silicon (silicon) modified polyurethane, etc., any one or a combination thereof. The oily nano resin is selected from: solvent-based nano epoxy modified acrylic acid or solvent-based nano organic silicon (silicon) modified polyurethane, any one or a combination thereof. The solvent is selected from: esters, ketones, alcohols, and the components are adjusted according to the method of setting.

[0066] c) Purification operation: drying the high temperature resistant heating material slurry 20a at a temperature of 120°C to 150°C for 30 to 50 minutes, volatilizing the solvent and other media at high temperature to improve the purity, and the high temperature resistant heating material slurry 20a and the first high temperature resistant insulation waterproof layer 10 are physically or chemically bonded or bridged by the nano resin 21, so that the heating material particles 22 are exposed on the first high temperature resistant insulation waterproof layer 10 to the greatest extent, and are closely arranged and stacked without being wrapped, and the nano resin 21 produces silicate ions through shrinkage polymerization (as shown in the following chemical reaction formula):

[0067]

[0068] Thus, the thermal material particles 22 are stably bonded to the first high temperature resistant insulating waterproof layer 10. Figure 3B As shown, a high-purity high-temperature resistant heating layer 20 is formed; in this embodiment, the high-temperature resistant heating layer 20 is formed by drying and purifying the high-temperature resistant heating material slurry 20a.

[0069] The above-mentioned "purification" operation is the most important technical feature of the present invention. The so-called "purification" refers to separating impurities in a mixture to improve its purity. Fig. 9It is a schematic diagram of the temperature and time of the purification operation of the high temperature resistant heating layer of the present invention; since the heat-generating material particles 22 are originally 100% pure, but because they need to be attached to the first high temperature resistant insulating waterproof layer 10, nano resin 21, solvent, additives, etc. must be added to attach them by spraying or printing. After attachment, the high temperature resistant heating material slurry 20a is dried at a high temperature of 120°C to 150°C for 30 to 50 minutes, so that the purification operation of the present invention can volatilize the medium and solvent, so that the purity of the heat-generating material particles 22 reaches more than 95%. If the temperature and time are not properly controlled, the effect of the purification operation will be affected, and the heat-generating material particles 22 and the nano resin 21 cannot be bridged by chemical reaction to achieve a stable structure.

[0070] Furthermore, if Figure 8 As shown, after the high-purity graphene 22 is sprayed, the solvent and other media evaporate, the graphene 22 is exposed and attached to the surface of the first high-temperature resistant insulating waterproof layer 10 (material) through the nano resin 21, and the heat-generating material particles 22 molecules are effectively radiated and transmitted, and heat is evenly distributed, and heat exchange is performed to quickly achieve the heating effect. Therefore, the most important "purification" technical means of the present invention can solve the industry's heat dissipation spraying problems, including: First, solving the problem that the high-purity heat-generating material particles 22 cannot be closely arranged after spraying. Second, solving the problem that the general resin coating wraps the heat-generating material particles 22 in a stirring and mixing manner, which affects the radiation emission.

[0071] d) An electrode layer 30 is pasted or printed on the high temperature resistant heating layer 20, and the thickness of the electrode layer is between 0.015 and 0.2 mm. In this embodiment, the electrode layer 30 is made of a conductive metal material, which may include pasting copper foil or printing silver paste, but is not limited to this.

[0072] In the first embodiment, if Figure 3A to Figure 3C As shown in FIG. 1 , the high temperature resistant heating layer 20 is completely covered, but is not limited thereto. Figure 4A to Figure 4C As shown, the high temperature resistant heating layer 20 can be in a line shape that matches the shape of the electrode layer 30. This is because the high temperature resistant heating layer 20 has excellent thermal conductivity and can radiate heat energy, so the line shape can also perform effective radiation emission.

[0073] e) A second high temperature resistant insulating waterproof layer 40 is covered on the electrode layer 30, and the second high temperature resistant insulating waterproof layer 40 is selected from: a rigid body composed of any one of glass fiber, quartz or ceramic or a combination thereof, and the thickness of the rigid body is between 0.015 and 0.2 mm; in this embodiment, but not limited to this. That is, the second high temperature resistant insulating waterproof layer 40, such as Figure 5A , Figure 5BAs shown, it includes a part 40A of a product that needs to be heated, and the part 40A of the electronic product that needs to be heated needs to be an insulator, such as ceramic, glass fiber or quartz, and the electrode layer 30 is directly attached to the part 40A of the product that needs to be heated.

[0074] f) Providing a wire 31 electrically connected to the electrode layer 30, the wire 31 connects the anode and the cathode, conducts electricity and short-circuits to generate heat, and prepares a rigid thermally conductive film 50 with a thickness of less than 0.6 mm, and its operating temperature can reach 600°C.

[0075] like Figure 6 As shown, the rigid heating film 50 for electronic products made according to the above-mentioned features of the present invention comprises: a first high temperature resistant insulating waterproof layer 10, the thickness of which is a rigid body between 0.015 and 0.2 mm; a high temperature resistant heating layer 20, coated on the first high temperature resistant insulating waterproof layer 10, the thickness of which is between 0.015 and 0.2 mm, and the heating material particles 22 are exposed on the first high temperature resistant insulating waterproof layer 10, presenting a closely arranged stack without being wrapped, so that the heating material particles 22 are stably combined in The first high temperature resistant insulating waterproof layer 10; an electrode layer 30, pasted or printed on the high temperature resistant heating layer 20, the thickness of the electrode layer is between 0.015 and 0.2 mm; a second high temperature resistant insulating waterproof layer 40, covering the electrode layer 30, the second high temperature resistant insulating waterproof layer 40 is a rigid body with a thickness between 0.015 and 0.2 mm; and a wire 31, electrically connected to the electrode layer 30, thereby forming a rigid heating film 50 with a thickness of less than 0.6 mm, and its operating temperature (heating range) can reach 600°C, so it is an excellent heating material.

[0076] Based on the above preparation method, the rigid heating film 50 prepared by the present invention has the following effects:

[0077] 1. The rigid heating film 50 of the present invention is physically or chemically bonded or connected to the heating material particles 22 and the nano resin 21, so the structure is stable; the high-purity graphene, after spraying, the solvent evaporates, the heating material particles 22 are exposed on the surface of the material, the molecules are effectively radiated and transmitted, the heat is evenly distributed, and the heat exchange is performed to achieve an excellent heating effect, and its working temperature (heating range) can reach 600°C. Therefore, the present invention uses "purification" technology to solve the problems of thermal spraying in the industry, including: solving the problem that the traditional high-purity heating material particles 22 cannot be closely arranged after coating; and solving the problem that the heating material particles 22 are wrapped by the general resin coating in a stirring and mixing manner, which affects the radiation emission.

[0078] Second, the rigid heat-conductive film 50 of the present invention can have a thickness of less than 0.6 mm, which is thin and rigid. Therefore, the product applicability of the rigid heat-conductive film 50 of the present invention can be widely expanded. For example: Fig.11 As disclosed, the rigid heating film 50 is used in the electric heating furnace 51; or Fig.12 As disclosed, the rigid heating film 50 is used in the state of the heat preservation pad 52; or as shown in FIG. Fig.13 The rigid heating film 50 is disclosed as a reference figure for the state of being used in the floor heating 53. Therefore, the rigid heating film 50 of the present invention can replace the traditional copper tube or olefin earth heating method, which is more convenient to use and has lower cost and improved efficacy.

[0079] However, the above disclosed drawings and descriptions are only preferred embodiments of the present invention. Any modification or equivalent changes made by those skilled in the art according to the spirit and scope of the present invention should still be included in the scope of the patent application of the present invention.

Claims

1. A method for preparing a rigid heating film for electronic products, characterized in that: It includes the following steps: a) Providing a first high temperature resistant insulating waterproof layer, which is selected from: a rigid body composed of any one of glass fiber, quartz or refractory ceramics or a combination thereof, and having a thickness between 0.015 and 0.2 mm; b) On the first high temperature resistant insulating waterproof layer, a layer of high temperature resistant heating material slurry is provided, the thickness of the high temperature resistant heating material slurry is between 0.015 and 0.2 mm, and the high temperature resistant heating material slurry comprises heating material particles selected from: carbon balls, carbon fibers, graphite or its particles, graphene, nano carbon tubes, boron nitride, artificial diamonds, aluminum oxide, zirconium oxide, rare earth, thermal conductive metal particles, or any combination thereof, with a weight ratio of 25 to 85%, and mixed with a weight ratio of 10 to 50% of nano resin, and a weight ratio of 5 to 25% of solvent medium; c). Purification operation: drying the high temperature resistant heating material slurry at a temperature of 120°C to 150°C for 30 to 50 minutes, volatilizing the medium and solvent at high temperature to improve the purity, and the high temperature resistant heating material slurry and the first high temperature resistant insulating waterproof layer are physically or chemically bonded or bridged by nano resin, so that the heating material particles are exposed on the first high temperature resistant insulating waterproof layer to the greatest extent, and are closely arranged and stacked without being wrapped, and the nano resin produces silicate ions through shrinkage polymerization reaction, so that the heating material particles are stably bonded to the first high temperature resistant insulating waterproof layer, forming a high purity high temperature resistant heating layer; d) An electrode layer is provided on the heating layer, and the thickness of the electrode layer is between 0.015 and 0.2 mm; e) Covering the electrode layer with a second high temperature resistant insulating and waterproof layer, the second high temperature resistant insulating and waterproof layer is a rigid body with a thickness between 0.015 and 0.2 mm; and f). Providing a wire electrically connected to the electrode layer to prepare a rigid heating film with a thickness of less than 0.6 mm, and its operating temperature can reach 600°C.

2. The method for preparing a rigid heating film for electronic products according to claim 1, characterized in that: In step e), the second high temperature resistant insulating and waterproof layer includes a portion of the electronic product to be heated, and the portion of the electronic product to be heated needs to be an insulator, and the electrode layer is directly attached to the portion of the product to be heated.

3. The method for preparing a rigid heating film for electronic products according to claim 1, characterized in that: In step b), the nano resin includes aqueous or oily nano resin.

4. The method for preparing a rigid heating film for electronic products according to claim 3, characterized in that: The water-based nano resin is selected from: any one of water-based nano epoxy modified acrylic acid or water-based nano silicone modified polyurethane or a combination thereof.

5. The method for preparing a rigid heating film for electronic products according to claim 3, characterized in that: The oily nano resin is selected from: any one of solvent-based nano epoxy modified acrylic acid or solvent-based nano silicone modified polyurethane or a combination thereof.

6. The method for preparing a rigid heating film for electronic products according to claim 1, characterized in that: In step c), the high temperature resistant heating layer is in a full-surface shape or in a line shape matching the shape of the electrode layer. In step d), the electrode layer is made of a conductive metal material.

7. A rigid heating film for electronic products made by the preparation method according to any one of claims 1 to 6, characterized in that: Contains: A first high temperature resistant insulating and waterproof layer, wherein the first high temperature resistant insulating and waterproof layer is a rigid body with a thickness between 0.015 and 0.2 mm; A high temperature resistant heating layer is coated on the first high temperature resistant insulating waterproof layer, the thickness of the high temperature resistant heating layer is between 0.015 and 0.2 mm, and the heating material particles are exposed on the first high temperature resistant insulating waterproof layer, and are closely arranged and stacked without being wrapped, so that the heating material particles are stably combined with the first high temperature resistant insulating waterproof layer; An electrode layer is disposed on the high temperature resistant heating layer, and the thickness of the electrode layer is between 0.015 and 0.2 mm; a second high temperature resistant insulating and waterproof layer, covering the electrode layer, wherein the second high temperature resistant insulating and waterproof layer is a rigid body with a thickness between 0.015 and 0.2 mm; as well as A conductor is electrically connected to the electrode layer to form a rigid heating film with a thickness of less than 0.6 mm, and its operating temperature can reach 600°C.

8. The rigid heating film for electronic products as claimed in claim 7, characterized in that: The second high temperature resistant insulating and waterproof layer includes a portion of the electronic product that needs to be heated, and the electrode layer is directly attached to the portion of the electronic product that needs to be heated.

9. The rigid heating film for electronic products according to claim 7, characterized in that: The high temperature resistant heating layer is in a full-surface configuration or in a line configuration matching the shape of the electrode layer.

10. The rigid heating film for electronic products according to claim 7, characterized in that: The electrode layer is made of conductive metal material.

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